WO2020203683A1 - 窒化ケイ素焼結体及びその製造方法、並びに積層体及びパワーモジュール - Google Patents

窒化ケイ素焼結体及びその製造方法、並びに積層体及びパワーモジュール Download PDF

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WO2020203683A1
WO2020203683A1 PCT/JP2020/013787 JP2020013787W WO2020203683A1 WO 2020203683 A1 WO2020203683 A1 WO 2020203683A1 JP 2020013787 W JP2020013787 W JP 2020013787W WO 2020203683 A1 WO2020203683 A1 WO 2020203683A1
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Prior art keywords
silicon nitride
sintered body
nitride sintered
thermal conductivity
metal layer
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PCT/JP2020/013787
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English (en)
French (fr)
Japanese (ja)
Inventor
翔二 岩切
武田　真
真一 高田
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Denka Co Ltd
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Denka Co Ltd
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Priority to US17/441,772 priority Critical patent/US20220177376A1/en
Priority to CN202080022624.7A priority patent/CN113614910A/zh
Priority to KR1020217033670A priority patent/KR20210139409A/ko
Priority to EP20782084.6A priority patent/EP3951857B1/en
Priority to JP2021511943A priority patent/JP7611816B2/ja
Publication of WO2020203683A1 publication Critical patent/WO2020203683A1/ja
Anticipated expiration legal-status Critical
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    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present disclosure relates to a silicon nitride sintered body, a method for producing the same, a laminate, and a power module.
  • Patent Document 1 proposes a ceramic substrate made of a material containing aluminum nitride, alumina, silicon nitride or silicon carbide as a main component.
  • Patent Document 2 a rare earth element and Mg are added as components of a sintering aid, and heat treatment is performed under predetermined conditions to perform silicon nitride baking having a thermal conductivity of 100 W / (m ⁇ K) or more at room temperature. Techniques for manufacturing the body have been proposed.
  • the power module Since the power module is an important component that controls various devices, it is required to function stably. In order to improve the stability, it is necessary to suppress not only the reliability of each member constituting the power module but also the heat generation due to the large current. In order to satisfy such a requirement, it is considered to be useful to use a ceramic substrate which is excellent in heat dissipation and does not easily break even if the thermal cycle increases. However, with conventional ceramic substrates, it has been difficult to achieve both excellent heat dissipation and high reliability.
  • the present disclosure provides a silicon nitride sintered body having both excellent heat dissipation and high reliability, and a method for producing the same. Further, the present disclosure provides a laminated body including such a silicon nitride sintered body. Further, in the present disclosure, a laminated body including the above-mentioned laminated body is provided.
  • the method for producing a silicon nitride sintered body includes a step of molding and firing a raw material powder containing silicon nitride, and the pregelatinization rate of silicon nitride contained in the raw material powder is 30% by mass or less. Is.
  • a raw material powder having a silicon nitride pregelatinization rate of 30% by mass or less is used.
  • the pregelatinization rate of silicon nitride in the raw material powder is high, the grain growth rate tends to be high in the firing step. In this case, although sintering is promoted, it is considered that the number of defects remaining in the obtained sintered body increases.
  • the pregelatinization rate of silicon nitride in the raw material powder is low, the ⁇ conversion rate in the raw material powder is high, and the grain growth rate in the firing step tends to be slow. In this case, although it takes time for sintering, it is considered that defects contained in the obtained sintered body are reduced and thermal conductivity and fracture toughness are improved.
  • the silicon nitride sintered body obtained by the above manufacturing method can produce a silicon nitride sintered body having both excellent heat dissipation and high reliability by such an action.
  • the thermal conductivity (20 ° C.) of the silicon nitride sintered body obtained by the above-mentioned production method may exceed 100 W / m ⁇ K, and the fracture toughness (K IC ) may be 7.4 MPa ⁇ m 1/2 or more. Further, the bending strength of the silicon nitride sintered body obtained by the above-mentioned production method may exceed 600 MPa. By having such characteristics, heat dissipation and reliability are further improved, and for example, it can be more preferably used for a substrate of a power module.
  • the thermal conductivity (20 ° C.) is greater than 100W / m ⁇ K
  • fracture toughness (K IC) is 7.4 MPa ⁇ m 1/2 or more. Since this silicon nitride sintered body has high thermal conductivity and fracture toughness, it has both excellent heat dissipation and high reliability. Therefore, for example, it can be suitably used for a substrate of a power module.
  • the silicon nitride sintered body may have a bending strength of more than 600 MPa. By having such characteristics, reliability is further improved, and for example, it can be more preferably used for a substrate of a power module.
  • the thermal conductivity of the silicon nitride sintered body at 150 to 200 ° C. may exceed 60 W / m ⁇ K. As a result, it can be more preferably used as a substrate for a power module used under particularly harsh conditions.
  • the laminate according to one aspect of the present disclosure includes a metal layer made of a first metal, a heat radiating portion made of a second metal having a higher thermal conductivity than that of the first metal, and a metal layer.
  • a substrate provided between the heat radiating portions and made of any of the above-mentioned silicon nitride sintered bodies is provided.
  • the substrate of this laminated body is composed of a silicon nitride sintered body having both excellent heat dissipation and high reliability. Then, this substrate is provided between the metal layer and the heat radiating portion. Therefore, the heat generated on the metal layer side can be efficiently dissipated from the heat radiating portion side. Therefore, for example, it can be suitably used as a laminate for a power module.
  • the power module according to one aspect of the present disclosure includes the above-mentioned laminate and a semiconductor element electrically connected to a metal layer. Since such a power module includes the above-mentioned substrate, it is excellent in heat dissipation and reliability.
  • the present disclosure it is possible to provide a silicon nitride sintered body having both excellent heat dissipation and high reliability, and a method for producing the same. Further, according to the present disclosure, it is possible to provide a laminated body including such a silicon nitride sintered body. Further, according to the present disclosure, it is possible to provide a laminated body including the above-mentioned laminated body.
  • FIG. 1 is a schematic cross-sectional view of an embodiment of a power module.
  • FIG. 2 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in one embodiment of the method for producing a silicon nitride sintered body.
  • FIG. 3 is a graph showing the relationship between the firing temperature and the relative density.
  • FIG. 4 is a graph showing the temperature change of the thermal conductivity of the silicon nitride sintered body of Example 1 and Comparative Example 1.
  • FIG. 5 is an electron micrograph of a fracture surface of the silicon nitride sintered body of Example 1.
  • FIG. 6 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in the conventional method of the silicon nitride sintered body.
  • FIG. 7 is an electron micrograph of a fracture surface of the silicon nitride sintered body of Comparative Example 1.
  • the silicon nitride sintered body has a thermal conductivity of more than 100 W / m ⁇ K at 20 ° C.
  • the thermal conductivity (20 ° C.) in the present disclosure can be measured in accordance with JIS R 1611: 2010. This thermal conductivity (20 ° C.) is A ⁇ B ⁇ from the values of thermal diffusivity A [m 2 / sec], density B [kg / m 3 ], and specific heat C [J / (kg ⁇ K)]. It is calculated by the formula of C.
  • A 0.1388 ⁇ (thickness [mm]) 2 / t 1/2 .
  • t 1/2 is the time [seconds] required for the temperature rise to half of ⁇ T, where ⁇ T is the total temperature rise width.
  • Density B is determined by Archimedes' method.
  • the specific heat C is determined by differential thermal analysis.
  • the thermal conductivity (20 ° C.) of the silicon nitride sintered body may exceed 110 W / m ⁇ K, may exceed 120 W / m ⁇ K, or 140 W / m ⁇ K, for example, from the viewpoint of further improving heat dissipation. It may exceed m ⁇ K.
  • the upper limit of the thermal conductivity (20 ° C.) may be, for example, 200 W / m ⁇ K from the viewpoint of ease of manufacture.
  • the thermal conductivity of the silicon nitride sintered body at 150 to 200 ° C. may exceed 60 W / m ⁇ K, and is 65 W / m ⁇ K. It may exceed K.
  • the upper limit of the thermal conductivity at 150 to 200 ° C. may be, for example, 150 W / m ⁇ K from the viewpoint of ease of manufacture.
  • the thermal conductivity in such a temperature range can also be obtained by the formula of A ⁇ B ⁇ C as described above.
  • the thermal diffusivity A is a measured value obtained by performing the above-mentioned measurement at the temperature, and the specific heat C may be a literature value.
  • the density B the value of 20 ° C. can be used as it is.
  • Silicon nitride sintered body has a fracture toughness is 7.4 MPa ⁇ m 1/2 or more (K IC).
  • Fracture toughness (K IC) is a value measured by the SEPB method, JIS R1607: measured according to 2015.
  • Fracture toughness of sintered silicon nitride (K IC) from the viewpoint of further improving the reliability, may be greater than 7.5 MPa ⁇ m 1/2, may be greater than 8 MPa ⁇ m 1/2.
  • the upper limit of the fracture toughness (K IC), from the viewpoint of ease of production for example, be a 15 MPa ⁇ m 1/2.
  • the silicon nitride sintered body may have a bending strength exceeding 600 MPa from the viewpoint of further improving reliability.
  • the bending strength is a three-point bending strength, and can be measured using a commercially available bending strength meter in accordance with JIS R 1601: 2008.
  • the bending strength of the silicon nitride sintered body may exceed 620 MPa or 650 MPa from the viewpoint of further improving reliability.
  • the upper limit of the bending strength may be, for example, 800 MPa from the viewpoint of ease of production.
  • the silicon nitride sintered body may be substantially composed of silicon nitride only, or may contain a component derived from a sintering aid and an unavoidable component derived from a raw material, a manufacturing process, or the like.
  • the content of silicon nitride in the silicon nitride sintered body may be, for example, 90 mol% or more, or 95 mol% or more, from the viewpoint of achieving both high thermal conductivity and excellent insulating properties at a high level. , 98 mol% or more.
  • the silicon nitride sintered body can be produced by reducing the amount of the sintering aid used, the total content ratio of rare earth elements in the silicon nitride sintered body can be sufficiently lowered.
  • the total content ratio of rare earth elements in the silicon nitride sintered body may be 6.0% by mass or less, and may be 3.0% by mass or less.
  • rare earth elements a total of 17 elements including two elements of Sc (scandium) and Y (yttrium) and 15 elements of lanthanoids from La (lanthanum) to Lu (lutetium) correspond.
  • the silicon nitride sintered body may have a dielectric breakdown strength of 10 [kV / 0.32 mm] or more.
  • Dielectric breakdown strength can be measured in accordance with JIS C-2110: 2016.
  • the dielectric breakdown strength may be, for example, 11 [kV / 0.32 mm] or more.
  • the upper limit of the dielectric breakdown strength may be, for example, 15 [kV / 0.32 mm] from the viewpoint of ease of manufacture.
  • FIG. 1 is a schematic cross-sectional view of a power module according to an embodiment.
  • the power module 100 includes a metal layer 11, a substrate 10 (silicon nitride sintered body 10), a metal layer 12, a solder layer 32, a base plate 20, and cooling fins 22 in this order.
  • the metal layer 11 constitutes a metal circuit by, for example, etching or the like.
  • a semiconductor element 60 is attached to the metal layer 11 via a solder layer 31.
  • the semiconductor element 60 is connected to a predetermined portion of the metal layer 11 by a metal wire 34 such as an aluminum wire (aluminum wire).
  • the substrate 10 is made of a silicon nitride sintered body. As a result, the metal layer 11 and the metal layer 12 are electrically insulated. The metal layer 12 may or may not form an electric circuit. The materials of the metal layer 11 and the metal layer 12 may be the same or different. The metal layer 11 and the metal layer 12 may be made of copper corresponding to the first metal. However, the material is not limited to copper.
  • the metal layer 12 is joined to the base plate 20 via a solder layer 32.
  • a screw 23 for fixing the cooling fin 22 forming a heat radiating member to the base plate is provided at the end of the base plate 20, a screw 23 for fixing the cooling fin 22 forming a heat radiating member to the base plate is provided.
  • the base plate 20 may be made of aluminum corresponding to the second metal.
  • the base plate 20 is joined to the cooling fins 22 via grease 24 on the side opposite to the metal layer 12 side.
  • the base plate 20 and the cooling fins 22 function as heat radiating parts by being composed of a second metal having a higher thermal conductivity than the metal layer 11. Since the substrate 10 has a high thermal conductivity, the semiconductor element 60, the metal layer 11, and the metal layer 12 are efficiently cooled by the heat radiating portion.
  • a resin housing 36 is attached to one side of the base plate 20 (the side on which the semiconductor element 60 is installed) so as to accommodate the above-mentioned members (semiconductor element 60, metal layers 11, 12 and substrate 10).
  • Each of the above members is housed in the space formed by one surface of the base plate 20 and the housing 36, and a filler 30 such as silicone gel is filled so as to fill the gap in the space.
  • a filler 30 such as silicone gel is filled so as to fill the gap in the space.
  • a predetermined portion of the metal layer 11 is connected to an electrode 33 provided through the housing 36 via a solder layer 35.
  • the power module 100 includes a laminate 50 composed of a metal layer 11, a substrate 10, a metal layer 12, a base plate 20, and cooling fins 22.
  • the substrate 10 is made of a silicon nitride sintered body having both high thermal conductivity and high fracture toughness. Since the substrate 10 has high thermal conductivity, heat can be smoothly dissipated from the semiconductor element 60 and the metal layer 11 toward the substrate 10 and the cooling fins 22. Further, the silicon nitride sintered body is not easily broken even if it receives an impact. Therefore, the power module 100 can exhibit stable performance and is excellent in reliability. As described above, the silicon nitride sintered body is suitably used for the substrate of the power module 100. However, the use of the silicon nitride sintered body 10 is not limited to the power module.
  • the material of the base plate 20 is not limited to aluminum.
  • the base plate 20 may be made of a first metal (such as copper) and only the cooling fins may be made of a second metal (such as aluminum).
  • only the cooling fins 22 function as heat radiating portions.
  • the cooling fins 22 may not be provided and only the base plate 20 may function as a heat radiating portion.
  • the base plate 20 and the substrate 10 may be joined without the metal layer 12.
  • the manufacturing method of the silicon nitride sintered body will be described below.
  • the method for producing a silicon nitride sintered body according to one embodiment includes a step of molding and firing a raw material powder containing silicon nitride.
  • the pregelatinization rate of silicon nitride contained in the raw material powder used is 30% by mass or less. As a result, the rate of grain growth of silicon nitride in the firing step can be slowed down. Therefore, although it takes time for sintering, defects remaining in the obtained silicon nitride sintered body can be reduced.
  • the pregelatinization rate of silicon nitride contained in the raw material powder may be 20% by mass or less or 15% by mass or less from the viewpoint of further increasing the thermal conductivity.
  • the pregelatinization rate of silicon nitride contained in the raw material powder may be 5% by mass or more from the viewpoint of increasing the bending strength of the silicon nitride sintered body.
  • the raw material powder may contain a sintering aid in addition to silicon nitride.
  • An oxide-based sintering aid can be used as the sintering aid.
  • the oxide-based sintering aid include Y 2 O 3, Mg O and Al 2 O 3 .
  • the content of the oxide-based sintering aid in the raw material powder is, for example, 4.0 to 8.0% by mass from the viewpoint of obtaining a silicon carbide sintered body capable of achieving both high thermal conductivity and excellent insulating properties at a high level. It may be 4.0 to 5.0% by mass.
  • the above-mentioned raw material powder is pressed with a molding pressure of, for example, 3.0 to 10.0 MPa to obtain a molded product.
  • the molded product may be produced by uniaxial pressure or by CIP. Alternatively, it may be fired while being molded by hot pressing.
  • the molded product may be fired in an atmosphere of an inert gas such as nitrogen gas or argon gas.
  • the pressure at the time of firing may be 0.7 to 0.9 MPa.
  • the firing temperature may be 1860 to 2100 ° C. and may be 1880 to 2000 ° C.
  • the firing time at the firing temperature may be 6 to 20 hours and may be 8 to 16 hours.
  • the rate of temperature rise to the firing temperature may be, for example, 1.0 to 10.0 ° C./hour.
  • FIG. 2 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in the production method of the present embodiment.
  • ⁇ -SiN has a higher melting point and slower grain growth than ⁇ -SiN. Therefore, when the pregelatinization rate of silicon nitride contained in the raw material powder is low, the grain growth proceeds more slowly than when the pregelatinization rate is high. Therefore, in the process of grain growth of silicon nitride, it is suppressed that defects remain in the grains, and as shown in FIG. 2, a silicon nitride sintered body having few defects can be obtained as a result. Such a silicon nitride sintered body has high thermal conductivity and high fracture toughness.
  • FIG. 6 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in the conventional manufacturing method.
  • the pregelatinization rate of silicon nitride in the raw material powder is higher than that in FIG. Therefore, in the process of grain growth of silicon nitride, ⁇ -SiN proceeds so as to complement the grain growth of ⁇ -SiN, so that the grain growth rate of silicon nitride increases.
  • the number of defects remaining in the grains in the finally obtained silicon nitride sintered body is larger than that in the case of FIG.
  • Such a silicon nitride sintered body has lower thermal conductivity and fracture toughness than the silicon nitride sintered body obtained in FIG.
  • the porosity of the silicon nitride sintered body of the present embodiment may be, for example, 1.0% by volume or less, or 0.5% by volume or less.
  • FIG. 3 is a graph showing an example of a change in the relative density of the silicon nitride sintered body depending on the firing temperature.
  • curve 1 shows the change in relative density when a raw material powder containing silicon nitride having an pregelatinization rate of 15% by mass is used.
  • curve 2 shows the change in relative density when the raw material powder containing silicon nitride having an pregelatinization rate of 93% by mass is used.
  • the relative density increases slowly. This indicates that the grain growth rate of silicon nitride is slow.
  • the silicon nitride sintered body thus obtained has a sufficiently reduced number of defects. Further, due to the crystal shape of ⁇ -SiN, it is composed of columnar crystal grains having a large size. Due to these factors, it is considered to have high thermal conductivity and high fracture toughness.
  • the silicon nitride sintered body of the present embodiment has excellent heat dissipation because it has high thermal conductivity. Further, since it has high fracture toughness, it can be used stably for a long period of time without breaking even in a usage environment subject to a so-called thermal cycle in which high temperature and low temperature are repeated. Therefore, it is excellent in reliability. As described above, since it has both excellent heat dissipation and excellent reliability, it can be suitably used as a substrate for a power module.
  • This molded product was placed in an electric furnace equipped with a carbon heater, and the temperature was raised to 1900 ° C. at a heating rate of 2.1 ° C./hour under an atmosphere of nitrogen gas (pressure: 0.88 MPa). After firing at a firing temperature of 1900 ° C. for 12 hours, the mixture was cooled at a cooling rate of about 5.0 ° C./hour to obtain a silicon nitride sintered body.
  • the silicon nitride content in the silicon nitride sintered body was 92 mol%.
  • the thermal conductivity at 50 to 200 ° C. was measured in the same manner as the thermal conductivity at 20 ° C. except that the thermal diffusivity A was measured at each temperature and the literature value was used as the specific heat C. These results are plotted in FIG. In FIG. 4, the thermal conductivity at 20 ° C. is also plotted. As shown in FIG. 4, it was confirmed that the thermal conductivity decreased as the temperature increased. However, it was confirmed that the thermal conductivity of the silicon nitride sintered body of Example 1 was higher than that of Comparative Example 1 at any temperature.
  • K IC Fracture toughness
  • the bending strength is the 3-point bending strength, and was measured using a commercially available bending strength meter (manufactured by Shimadzu Corporation, device name: AG-2000) in accordance with JIS R 1601: 2008. The results are shown in Table 1.
  • the dielectric breakdown strength was measured in accordance with JIS C-2110: 2016 using a commercially available measuring device (manufactured by Measurement Technology Laboratory, device name: 7474 type). The results are shown in Table 1.
  • FIG. 5 is a photograph of an observation image by SEM (magnification: 3000 times). The proportion of columnar crystals was high.
  • Example 1 A silicon nitride sintered body was obtained in the same manner as in Example 1 except that silicon nitride powder having an pregelatinization rate of 93% by mass was used and the material was fired at a firing temperature of 1850 ° C. for 4 hours. The obtained silicon nitride sintered body was evaluated in the same manner as in Example 1. The evaluation results are as shown in Table 1 and FIG.
  • FIG. 7 is a photograph of an observation image by SEM (magnification: 3000 times). The proportion of columnar crystals was smaller than in FIG. 5, and the size of the crystal grains was also smaller than in FIG.
  • Example 2 As shown in Table 2, a silicon nitride sintered body was obtained in the same manner as in Example 1 except that silicon nitride powder having an pregelatinization rate of 10 to 25% by mass was used. The obtained silicon nitride sintered body was evaluated in the same manner as in Example 1. The evaluation results are as shown in Table 2.
  • the thermal conductivity can be increased by lowering the pregelatinization rate of the silicon nitride powder used as the raw material powder.
  • the present disclosure it is possible to provide a silicon nitride sintered body having both excellent heat dissipation and high reliability, and a method for producing the same. Further, according to the present disclosure, it is possible to provide a laminated body including such a silicon nitride sintered body. Further, according to the present disclosure, it is possible to provide a laminated body including the above-mentioned laminated body.

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US17/441,772 US20220177376A1 (en) 2019-03-29 2020-03-26 Silicon nitride sintered body, method for producing same, multilayer body and power module
CN202080022624.7A CN113614910A (zh) 2019-03-29 2020-03-26 氮化硅烧结体及其制造方法、以及层叠体及电力模组
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113735595A (zh) * 2021-09-27 2021-12-03 哈尔滨新辉特种陶瓷有限公司 一种高热导率高品质氮化硅陶瓷基板及其制备方法
WO2025047685A1 (ja) * 2023-08-30 2025-03-06 株式会社トクヤマ 窒化ケイ素基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07149588A (ja) * 1993-11-26 1995-06-13 Toshiba Corp 高熱伝導性窒化けい素メタライズ基板，その製造方法および窒化けい素モジュール
JPH11100273A (ja) * 1997-09-26 1999-04-13 Denki Kagaku Kogyo Kk 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板
JPH11130543A (ja) * 1997-10-22 1999-05-18 Nissan Motor Co Ltd β型窒化ケイ素結晶およびその製造方法ならびに窒化ケイ素質焼結体の製造方法
JP2002293641A (ja) * 2001-03-29 2002-10-09 Hitachi Metals Ltd 窒化ケイ素質焼結体
JP2006096661A (ja) 2005-12-26 2006-04-13 Hitachi Metals Ltd 窒化ケイ素質焼結体およびそれを用いた回路基板。
JP2017212316A (ja) 2016-05-25 2017-11-30 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255573A (ja) * 1989-03-29 1990-10-16 Natl Inst For Res In Inorg Mater 高靭性窒化珪素焼結体の製造法
JPH0829923B2 (ja) * 1989-12-07 1996-03-27 電気化学工業株式会社 窒化ケイ素粉末
JPH06263410A (ja) * 1993-03-16 1994-09-20 Denki Kagaku Kogyo Kk 窒化けい素粉末のβ分率向上法
JP3002642B2 (ja) * 1996-05-31 2000-01-24 電気化学工業株式会社 窒化珪素粉末、窒化珪素焼結体及びそれを用いた回路基板
JPH11100274A (ja) * 1997-09-26 1999-04-13 Denki Kagaku Kogyo Kk 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板
JP4129104B2 (ja) * 1999-10-13 2008-08-06 京セラ株式会社 窒化珪素質焼結体とこれを用いた耐摩耗性部材
JP2002265276A (ja) * 2001-03-07 2002-09-18 Hitachi Metals Ltd 窒化ケイ素粉末および窒化ケイ素焼結体
JP4997431B2 (ja) * 2006-01-24 2012-08-08 独立行政法人産業技術総合研究所 高熱伝導窒化ケイ素基板の製造方法
CN108774066A (zh) * 2018-06-19 2018-11-09 威海麒达特种陶瓷科技有限公司 高导热氮化硅基片的制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07149588A (ja) * 1993-11-26 1995-06-13 Toshiba Corp 高熱伝導性窒化けい素メタライズ基板，その製造方法および窒化けい素モジュール
JPH11100273A (ja) * 1997-09-26 1999-04-13 Denki Kagaku Kogyo Kk 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板
JPH11130543A (ja) * 1997-10-22 1999-05-18 Nissan Motor Co Ltd β型窒化ケイ素結晶およびその製造方法ならびに窒化ケイ素質焼結体の製造方法
JP2002293641A (ja) * 2001-03-29 2002-10-09 Hitachi Metals Ltd 窒化ケイ素質焼結体
JP2006096661A (ja) 2005-12-26 2006-04-13 Hitachi Metals Ltd 窒化ケイ素質焼結体およびそれを用いた回路基板。
JP2017212316A (ja) 2016-05-25 2017-11-30 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3951857A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113735595A (zh) * 2021-09-27 2021-12-03 哈尔滨新辉特种陶瓷有限公司 一种高热导率高品质氮化硅陶瓷基板及其制备方法
WO2025047685A1 (ja) * 2023-08-30 2025-03-06 株式会社トクヤマ 窒化ケイ素基板

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KR20210139409A (ko) 2021-11-22

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