WO2020203683A1 - 窒化ケイ素焼結体及びその製造方法、並びに積層体及びパワーモジュール - Google Patents
窒化ケイ素焼結体及びその製造方法、並びに積層体及びパワーモジュール Download PDFInfo
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- WO2020203683A1 WO2020203683A1 PCT/JP2020/013787 JP2020013787W WO2020203683A1 WO 2020203683 A1 WO2020203683 A1 WO 2020203683A1 JP 2020013787 W JP2020013787 W JP 2020013787W WO 2020203683 A1 WO2020203683 A1 WO 2020203683A1
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- Prior art keywords
- silicon nitride
- sintered body
- nitride sintered
- thermal conductivity
- metal layer
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- 229910052581 Si3N4 Inorganic materials 0.000 title claims abstract description 119
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims abstract description 119
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 31
- 238000010304 firing Methods 0.000 claims abstract description 17
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 27
- 239000002994 raw material Substances 0.000 claims description 24
- 238000005452 bending Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000007858 starting material Substances 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 15
- 238000005245 sintering Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- 230000007547 defect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 101100371219 Pseudomonas putida (strain DOT-T1E) ttgE gene Proteins 0.000 description 2
- 238000004455 differential thermal analysis Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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Definitions
- the present disclosure relates to a silicon nitride sintered body, a method for producing the same, a laminate, and a power module.
- Patent Document 1 proposes a ceramic substrate made of a material containing aluminum nitride, alumina, silicon nitride or silicon carbide as a main component.
- Patent Document 2 a rare earth element and Mg are added as components of a sintering aid, and heat treatment is performed under predetermined conditions to perform silicon nitride baking having a thermal conductivity of 100 W / (m ⁇ K) or more at room temperature. Techniques for manufacturing the body have been proposed.
- the power module Since the power module is an important component that controls various devices, it is required to function stably. In order to improve the stability, it is necessary to suppress not only the reliability of each member constituting the power module but also the heat generation due to the large current. In order to satisfy such a requirement, it is considered to be useful to use a ceramic substrate which is excellent in heat dissipation and does not easily break even if the thermal cycle increases. However, with conventional ceramic substrates, it has been difficult to achieve both excellent heat dissipation and high reliability.
- the present disclosure provides a silicon nitride sintered body having both excellent heat dissipation and high reliability, and a method for producing the same. Further, the present disclosure provides a laminated body including such a silicon nitride sintered body. Further, in the present disclosure, a laminated body including the above-mentioned laminated body is provided.
- the method for producing a silicon nitride sintered body includes a step of molding and firing a raw material powder containing silicon nitride, and the pregelatinization rate of silicon nitride contained in the raw material powder is 30% by mass or less. Is.
- a raw material powder having a silicon nitride pregelatinization rate of 30% by mass or less is used.
- the pregelatinization rate of silicon nitride in the raw material powder is high, the grain growth rate tends to be high in the firing step. In this case, although sintering is promoted, it is considered that the number of defects remaining in the obtained sintered body increases.
- the pregelatinization rate of silicon nitride in the raw material powder is low, the ⁇ conversion rate in the raw material powder is high, and the grain growth rate in the firing step tends to be slow. In this case, although it takes time for sintering, it is considered that defects contained in the obtained sintered body are reduced and thermal conductivity and fracture toughness are improved.
- the silicon nitride sintered body obtained by the above manufacturing method can produce a silicon nitride sintered body having both excellent heat dissipation and high reliability by such an action.
- the thermal conductivity (20 ° C.) of the silicon nitride sintered body obtained by the above-mentioned production method may exceed 100 W / m ⁇ K, and the fracture toughness (K IC ) may be 7.4 MPa ⁇ m 1/2 or more. Further, the bending strength of the silicon nitride sintered body obtained by the above-mentioned production method may exceed 600 MPa. By having such characteristics, heat dissipation and reliability are further improved, and for example, it can be more preferably used for a substrate of a power module.
- the thermal conductivity (20 ° C.) is greater than 100W / m ⁇ K
- fracture toughness (K IC) is 7.4 MPa ⁇ m 1/2 or more. Since this silicon nitride sintered body has high thermal conductivity and fracture toughness, it has both excellent heat dissipation and high reliability. Therefore, for example, it can be suitably used for a substrate of a power module.
- the silicon nitride sintered body may have a bending strength of more than 600 MPa. By having such characteristics, reliability is further improved, and for example, it can be more preferably used for a substrate of a power module.
- the thermal conductivity of the silicon nitride sintered body at 150 to 200 ° C. may exceed 60 W / m ⁇ K. As a result, it can be more preferably used as a substrate for a power module used under particularly harsh conditions.
- the laminate according to one aspect of the present disclosure includes a metal layer made of a first metal, a heat radiating portion made of a second metal having a higher thermal conductivity than that of the first metal, and a metal layer.
- a substrate provided between the heat radiating portions and made of any of the above-mentioned silicon nitride sintered bodies is provided.
- the substrate of this laminated body is composed of a silicon nitride sintered body having both excellent heat dissipation and high reliability. Then, this substrate is provided between the metal layer and the heat radiating portion. Therefore, the heat generated on the metal layer side can be efficiently dissipated from the heat radiating portion side. Therefore, for example, it can be suitably used as a laminate for a power module.
- the power module according to one aspect of the present disclosure includes the above-mentioned laminate and a semiconductor element electrically connected to a metal layer. Since such a power module includes the above-mentioned substrate, it is excellent in heat dissipation and reliability.
- the present disclosure it is possible to provide a silicon nitride sintered body having both excellent heat dissipation and high reliability, and a method for producing the same. Further, according to the present disclosure, it is possible to provide a laminated body including such a silicon nitride sintered body. Further, according to the present disclosure, it is possible to provide a laminated body including the above-mentioned laminated body.
- FIG. 1 is a schematic cross-sectional view of an embodiment of a power module.
- FIG. 2 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in one embodiment of the method for producing a silicon nitride sintered body.
- FIG. 3 is a graph showing the relationship between the firing temperature and the relative density.
- FIG. 4 is a graph showing the temperature change of the thermal conductivity of the silicon nitride sintered body of Example 1 and Comparative Example 1.
- FIG. 5 is an electron micrograph of a fracture surface of the silicon nitride sintered body of Example 1.
- FIG. 6 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in the conventional method of the silicon nitride sintered body.
- FIG. 7 is an electron micrograph of a fracture surface of the silicon nitride sintered body of Comparative Example 1.
- the silicon nitride sintered body has a thermal conductivity of more than 100 W / m ⁇ K at 20 ° C.
- the thermal conductivity (20 ° C.) in the present disclosure can be measured in accordance with JIS R 1611: 2010. This thermal conductivity (20 ° C.) is A ⁇ B ⁇ from the values of thermal diffusivity A [m 2 / sec], density B [kg / m 3 ], and specific heat C [J / (kg ⁇ K)]. It is calculated by the formula of C.
- A 0.1388 ⁇ (thickness [mm]) 2 / t 1/2 .
- t 1/2 is the time [seconds] required for the temperature rise to half of ⁇ T, where ⁇ T is the total temperature rise width.
- Density B is determined by Archimedes' method.
- the specific heat C is determined by differential thermal analysis.
- the thermal conductivity (20 ° C.) of the silicon nitride sintered body may exceed 110 W / m ⁇ K, may exceed 120 W / m ⁇ K, or 140 W / m ⁇ K, for example, from the viewpoint of further improving heat dissipation. It may exceed m ⁇ K.
- the upper limit of the thermal conductivity (20 ° C.) may be, for example, 200 W / m ⁇ K from the viewpoint of ease of manufacture.
- the thermal conductivity of the silicon nitride sintered body at 150 to 200 ° C. may exceed 60 W / m ⁇ K, and is 65 W / m ⁇ K. It may exceed K.
- the upper limit of the thermal conductivity at 150 to 200 ° C. may be, for example, 150 W / m ⁇ K from the viewpoint of ease of manufacture.
- the thermal conductivity in such a temperature range can also be obtained by the formula of A ⁇ B ⁇ C as described above.
- the thermal diffusivity A is a measured value obtained by performing the above-mentioned measurement at the temperature, and the specific heat C may be a literature value.
- the density B the value of 20 ° C. can be used as it is.
- Silicon nitride sintered body has a fracture toughness is 7.4 MPa ⁇ m 1/2 or more (K IC).
- Fracture toughness (K IC) is a value measured by the SEPB method, JIS R1607: measured according to 2015.
- Fracture toughness of sintered silicon nitride (K IC) from the viewpoint of further improving the reliability, may be greater than 7.5 MPa ⁇ m 1/2, may be greater than 8 MPa ⁇ m 1/2.
- the upper limit of the fracture toughness (K IC), from the viewpoint of ease of production for example, be a 15 MPa ⁇ m 1/2.
- the silicon nitride sintered body may have a bending strength exceeding 600 MPa from the viewpoint of further improving reliability.
- the bending strength is a three-point bending strength, and can be measured using a commercially available bending strength meter in accordance with JIS R 1601: 2008.
- the bending strength of the silicon nitride sintered body may exceed 620 MPa or 650 MPa from the viewpoint of further improving reliability.
- the upper limit of the bending strength may be, for example, 800 MPa from the viewpoint of ease of production.
- the silicon nitride sintered body may be substantially composed of silicon nitride only, or may contain a component derived from a sintering aid and an unavoidable component derived from a raw material, a manufacturing process, or the like.
- the content of silicon nitride in the silicon nitride sintered body may be, for example, 90 mol% or more, or 95 mol% or more, from the viewpoint of achieving both high thermal conductivity and excellent insulating properties at a high level. , 98 mol% or more.
- the silicon nitride sintered body can be produced by reducing the amount of the sintering aid used, the total content ratio of rare earth elements in the silicon nitride sintered body can be sufficiently lowered.
- the total content ratio of rare earth elements in the silicon nitride sintered body may be 6.0% by mass or less, and may be 3.0% by mass or less.
- rare earth elements a total of 17 elements including two elements of Sc (scandium) and Y (yttrium) and 15 elements of lanthanoids from La (lanthanum) to Lu (lutetium) correspond.
- the silicon nitride sintered body may have a dielectric breakdown strength of 10 [kV / 0.32 mm] or more.
- Dielectric breakdown strength can be measured in accordance with JIS C-2110: 2016.
- the dielectric breakdown strength may be, for example, 11 [kV / 0.32 mm] or more.
- the upper limit of the dielectric breakdown strength may be, for example, 15 [kV / 0.32 mm] from the viewpoint of ease of manufacture.
- FIG. 1 is a schematic cross-sectional view of a power module according to an embodiment.
- the power module 100 includes a metal layer 11, a substrate 10 (silicon nitride sintered body 10), a metal layer 12, a solder layer 32, a base plate 20, and cooling fins 22 in this order.
- the metal layer 11 constitutes a metal circuit by, for example, etching or the like.
- a semiconductor element 60 is attached to the metal layer 11 via a solder layer 31.
- the semiconductor element 60 is connected to a predetermined portion of the metal layer 11 by a metal wire 34 such as an aluminum wire (aluminum wire).
- the substrate 10 is made of a silicon nitride sintered body. As a result, the metal layer 11 and the metal layer 12 are electrically insulated. The metal layer 12 may or may not form an electric circuit. The materials of the metal layer 11 and the metal layer 12 may be the same or different. The metal layer 11 and the metal layer 12 may be made of copper corresponding to the first metal. However, the material is not limited to copper.
- the metal layer 12 is joined to the base plate 20 via a solder layer 32.
- a screw 23 for fixing the cooling fin 22 forming a heat radiating member to the base plate is provided at the end of the base plate 20, a screw 23 for fixing the cooling fin 22 forming a heat radiating member to the base plate is provided.
- the base plate 20 may be made of aluminum corresponding to the second metal.
- the base plate 20 is joined to the cooling fins 22 via grease 24 on the side opposite to the metal layer 12 side.
- the base plate 20 and the cooling fins 22 function as heat radiating parts by being composed of a second metal having a higher thermal conductivity than the metal layer 11. Since the substrate 10 has a high thermal conductivity, the semiconductor element 60, the metal layer 11, and the metal layer 12 are efficiently cooled by the heat radiating portion.
- a resin housing 36 is attached to one side of the base plate 20 (the side on which the semiconductor element 60 is installed) so as to accommodate the above-mentioned members (semiconductor element 60, metal layers 11, 12 and substrate 10).
- Each of the above members is housed in the space formed by one surface of the base plate 20 and the housing 36, and a filler 30 such as silicone gel is filled so as to fill the gap in the space.
- a filler 30 such as silicone gel is filled so as to fill the gap in the space.
- a predetermined portion of the metal layer 11 is connected to an electrode 33 provided through the housing 36 via a solder layer 35.
- the power module 100 includes a laminate 50 composed of a metal layer 11, a substrate 10, a metal layer 12, a base plate 20, and cooling fins 22.
- the substrate 10 is made of a silicon nitride sintered body having both high thermal conductivity and high fracture toughness. Since the substrate 10 has high thermal conductivity, heat can be smoothly dissipated from the semiconductor element 60 and the metal layer 11 toward the substrate 10 and the cooling fins 22. Further, the silicon nitride sintered body is not easily broken even if it receives an impact. Therefore, the power module 100 can exhibit stable performance and is excellent in reliability. As described above, the silicon nitride sintered body is suitably used for the substrate of the power module 100. However, the use of the silicon nitride sintered body 10 is not limited to the power module.
- the material of the base plate 20 is not limited to aluminum.
- the base plate 20 may be made of a first metal (such as copper) and only the cooling fins may be made of a second metal (such as aluminum).
- only the cooling fins 22 function as heat radiating portions.
- the cooling fins 22 may not be provided and only the base plate 20 may function as a heat radiating portion.
- the base plate 20 and the substrate 10 may be joined without the metal layer 12.
- the manufacturing method of the silicon nitride sintered body will be described below.
- the method for producing a silicon nitride sintered body according to one embodiment includes a step of molding and firing a raw material powder containing silicon nitride.
- the pregelatinization rate of silicon nitride contained in the raw material powder used is 30% by mass or less. As a result, the rate of grain growth of silicon nitride in the firing step can be slowed down. Therefore, although it takes time for sintering, defects remaining in the obtained silicon nitride sintered body can be reduced.
- the pregelatinization rate of silicon nitride contained in the raw material powder may be 20% by mass or less or 15% by mass or less from the viewpoint of further increasing the thermal conductivity.
- the pregelatinization rate of silicon nitride contained in the raw material powder may be 5% by mass or more from the viewpoint of increasing the bending strength of the silicon nitride sintered body.
- the raw material powder may contain a sintering aid in addition to silicon nitride.
- An oxide-based sintering aid can be used as the sintering aid.
- the oxide-based sintering aid include Y 2 O 3, Mg O and Al 2 O 3 .
- the content of the oxide-based sintering aid in the raw material powder is, for example, 4.0 to 8.0% by mass from the viewpoint of obtaining a silicon carbide sintered body capable of achieving both high thermal conductivity and excellent insulating properties at a high level. It may be 4.0 to 5.0% by mass.
- the above-mentioned raw material powder is pressed with a molding pressure of, for example, 3.0 to 10.0 MPa to obtain a molded product.
- the molded product may be produced by uniaxial pressure or by CIP. Alternatively, it may be fired while being molded by hot pressing.
- the molded product may be fired in an atmosphere of an inert gas such as nitrogen gas or argon gas.
- the pressure at the time of firing may be 0.7 to 0.9 MPa.
- the firing temperature may be 1860 to 2100 ° C. and may be 1880 to 2000 ° C.
- the firing time at the firing temperature may be 6 to 20 hours and may be 8 to 16 hours.
- the rate of temperature rise to the firing temperature may be, for example, 1.0 to 10.0 ° C./hour.
- FIG. 2 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in the production method of the present embodiment.
- ⁇ -SiN has a higher melting point and slower grain growth than ⁇ -SiN. Therefore, when the pregelatinization rate of silicon nitride contained in the raw material powder is low, the grain growth proceeds more slowly than when the pregelatinization rate is high. Therefore, in the process of grain growth of silicon nitride, it is suppressed that defects remain in the grains, and as shown in FIG. 2, a silicon nitride sintered body having few defects can be obtained as a result. Such a silicon nitride sintered body has high thermal conductivity and high fracture toughness.
- FIG. 6 is a diagram schematically showing the state of grain growth when the silicon nitride particles are sintered in the conventional manufacturing method.
- the pregelatinization rate of silicon nitride in the raw material powder is higher than that in FIG. Therefore, in the process of grain growth of silicon nitride, ⁇ -SiN proceeds so as to complement the grain growth of ⁇ -SiN, so that the grain growth rate of silicon nitride increases.
- the number of defects remaining in the grains in the finally obtained silicon nitride sintered body is larger than that in the case of FIG.
- Such a silicon nitride sintered body has lower thermal conductivity and fracture toughness than the silicon nitride sintered body obtained in FIG.
- the porosity of the silicon nitride sintered body of the present embodiment may be, for example, 1.0% by volume or less, or 0.5% by volume or less.
- FIG. 3 is a graph showing an example of a change in the relative density of the silicon nitride sintered body depending on the firing temperature.
- curve 1 shows the change in relative density when a raw material powder containing silicon nitride having an pregelatinization rate of 15% by mass is used.
- curve 2 shows the change in relative density when the raw material powder containing silicon nitride having an pregelatinization rate of 93% by mass is used.
- the relative density increases slowly. This indicates that the grain growth rate of silicon nitride is slow.
- the silicon nitride sintered body thus obtained has a sufficiently reduced number of defects. Further, due to the crystal shape of ⁇ -SiN, it is composed of columnar crystal grains having a large size. Due to these factors, it is considered to have high thermal conductivity and high fracture toughness.
- the silicon nitride sintered body of the present embodiment has excellent heat dissipation because it has high thermal conductivity. Further, since it has high fracture toughness, it can be used stably for a long period of time without breaking even in a usage environment subject to a so-called thermal cycle in which high temperature and low temperature are repeated. Therefore, it is excellent in reliability. As described above, since it has both excellent heat dissipation and excellent reliability, it can be suitably used as a substrate for a power module.
- This molded product was placed in an electric furnace equipped with a carbon heater, and the temperature was raised to 1900 ° C. at a heating rate of 2.1 ° C./hour under an atmosphere of nitrogen gas (pressure: 0.88 MPa). After firing at a firing temperature of 1900 ° C. for 12 hours, the mixture was cooled at a cooling rate of about 5.0 ° C./hour to obtain a silicon nitride sintered body.
- the silicon nitride content in the silicon nitride sintered body was 92 mol%.
- the thermal conductivity at 50 to 200 ° C. was measured in the same manner as the thermal conductivity at 20 ° C. except that the thermal diffusivity A was measured at each temperature and the literature value was used as the specific heat C. These results are plotted in FIG. In FIG. 4, the thermal conductivity at 20 ° C. is also plotted. As shown in FIG. 4, it was confirmed that the thermal conductivity decreased as the temperature increased. However, it was confirmed that the thermal conductivity of the silicon nitride sintered body of Example 1 was higher than that of Comparative Example 1 at any temperature.
- K IC Fracture toughness
- the bending strength is the 3-point bending strength, and was measured using a commercially available bending strength meter (manufactured by Shimadzu Corporation, device name: AG-2000) in accordance with JIS R 1601: 2008. The results are shown in Table 1.
- the dielectric breakdown strength was measured in accordance with JIS C-2110: 2016 using a commercially available measuring device (manufactured by Measurement Technology Laboratory, device name: 7474 type). The results are shown in Table 1.
- FIG. 5 is a photograph of an observation image by SEM (magnification: 3000 times). The proportion of columnar crystals was high.
- Example 1 A silicon nitride sintered body was obtained in the same manner as in Example 1 except that silicon nitride powder having an pregelatinization rate of 93% by mass was used and the material was fired at a firing temperature of 1850 ° C. for 4 hours. The obtained silicon nitride sintered body was evaluated in the same manner as in Example 1. The evaluation results are as shown in Table 1 and FIG.
- FIG. 7 is a photograph of an observation image by SEM (magnification: 3000 times). The proportion of columnar crystals was smaller than in FIG. 5, and the size of the crystal grains was also smaller than in FIG.
- Example 2 As shown in Table 2, a silicon nitride sintered body was obtained in the same manner as in Example 1 except that silicon nitride powder having an pregelatinization rate of 10 to 25% by mass was used. The obtained silicon nitride sintered body was evaluated in the same manner as in Example 1. The evaluation results are as shown in Table 2.
- the thermal conductivity can be increased by lowering the pregelatinization rate of the silicon nitride powder used as the raw material powder.
- the present disclosure it is possible to provide a silicon nitride sintered body having both excellent heat dissipation and high reliability, and a method for producing the same. Further, according to the present disclosure, it is possible to provide a laminated body including such a silicon nitride sintered body. Further, according to the present disclosure, it is possible to provide a laminated body including the above-mentioned laminated body.
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Abstract
Description
<窒化ケイ素焼結体の作製>
α化率が15質量%である窒化ケイ素粉末(Starck社製)を準備した。この窒化ケイ素粉末と焼結助剤であるMgO、Y2O3を、Si3N4:MgO:Y2O3=95.2:1.5:3.3(質量比)で配合して原料粉末を得た。この原料粉末を、6.0MPaの圧力で一軸加圧成形し、円柱形状の成形体を作製した。
窒化ケイ素焼結体の熱伝導率(20℃)は、JIS R 1611:2010に準拠して測定した。熱拡散率A[m2/秒]は、縦×横×厚さ=10mm×10mm×2mmのサイズの試料を用い、レーザーフラッシュ法によって求めた。測定装置としては、Netzch製(装置名:LFA447)を用いた。密度Bはアルキメデス法によって測定し、比熱Cは示差熱分析によって求めた。A×B×Cの計算式で熱伝導率を算出した。その結果は表1に示すとおりであった。
α化率が93質量%である窒化ケイ素粉末を用いたこと、及び、1850℃の焼成温度で4時間焼成したこと以外は、実施例1と同様にして窒化ケイ素焼結体を得た。得られた窒化ケイ素焼結体を実施例1と同様にして評価した。評価結果は表1及び図4に示すとおりであった。
表2に示すとおり、α化率が10~25質量%である窒化ケイ素粉末をそれぞれ用いたこと以外は、実施例1と同様にして窒化ケイ素焼結体を得た。得られた窒化ケイ素焼結体を実施例1と同様にして評価した。評価結果は表2に示すとおりであった。
表3に示すとおり、α化率が46~90質量%である窒化ケイ素粉末をそれぞれ用いたこと以外は、実施例1と同様にして窒化ケイ素焼結体を得た。得られた窒化ケイ素焼結体を実施例と同様にして評価した。評価結果は表3に示すとおりであった。
Claims (8)
- 窒化ケイ素を含む原料粉末を成形して焼成する工程を有し、
前記原料粉末に含まれる前記窒化ケイ素のα化率が30質量%以下である、窒化ケイ素焼結体の製造方法。 - 前記窒化ケイ素焼結体の熱伝導率(20℃)は100W/m・Kを超え、破壊靭性(KIC)は7.4MPa・m1/2以上である、請求項1に記載の製造方法。
- 前記窒化ケイ素焼結体の抗折強度は600MPaを超える、請求項1又は2に記載の製造方法。
- 熱伝導率(20℃)が100W/m・Kを超え、破壊靭性(KIC)が7.4MPa・m1/2以上である、窒化ケイ素焼結体。
- 抗折強度が600MPaを超える、請求項4に記載の窒化ケイ素焼結体。
- 150~200℃における熱伝導率が60W/m・Kを超える、請求項4又は5に記載の窒化ケイ素焼結体。
- 第1の金属で構成される金属層と、
第1の金属よりも高い熱伝導率を有する第2の金属で構成される放熱部と、
前記金属層と前記放熱部の間に設けられ、請求項4~6のいずれか一項に記載の窒化ケイ素焼結体で構成される基板と、を有する、積層体。 - 請求項7に記載の積層体と、
前記金属層と電気的に接続される半導体素子と、を備えるパワーモジュール。
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EP20782084.6A EP3951857A4 (en) | 2019-03-29 | 2020-03-26 | SILICON NITRIDE SINTERED BODY, METHOD OF PRODUCTION, MULTILAYER BODY AND POWER MODULE |
JP2021511943A JPWO2020203683A1 (ja) | 2019-03-29 | 2020-03-26 | |
CN202080022624.7A CN113614910A (zh) | 2019-03-29 | 2020-03-26 | 氮化硅烧结体及其制造方法、以及层叠体及电力模组 |
US17/441,772 US20220177376A1 (en) | 2019-03-29 | 2020-03-26 | Silicon nitride sintered body, method for producing same, multilayer body and power module |
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JPH11100274A (ja) * | 1997-09-26 | 1999-04-13 | Denki Kagaku Kogyo Kk | 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板 |
JP2002265276A (ja) * | 2001-03-07 | 2002-09-18 | Hitachi Metals Ltd | 窒化ケイ素粉末および窒化ケイ素焼結体 |
JP4997431B2 (ja) * | 2006-01-24 | 2012-08-08 | 独立行政法人産業技術総合研究所 | 高熱伝導窒化ケイ素基板の製造方法 |
CN108774066A (zh) * | 2018-06-19 | 2018-11-09 | 威海麒达特种陶瓷科技有限公司 | 高导热氮化硅基片的制造方法 |
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- 2020-03-26 US US17/441,772 patent/US20220177376A1/en active Pending
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