WO2020189882A1 - 대전방지 실리콘 이형필름 - Google Patents

대전방지 실리콘 이형필름 Download PDF

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WO2020189882A1
WO2020189882A1 PCT/KR2019/018281 KR2019018281W WO2020189882A1 WO 2020189882 A1 WO2020189882 A1 WO 2020189882A1 KR 2019018281 W KR2019018281 W KR 2019018281W WO 2020189882 A1 WO2020189882 A1 WO 2020189882A1
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Prior art keywords
silicone release
antistatic
weight
film
cured layer
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English (en)
French (fr)
Korean (ko)
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이정환
안병철
김길중
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Toray Advanced Materials Korea Inc
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Toray Advanced Materials Korea Inc
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Priority to JP2021556630A priority Critical patent/JP2022529574A/ja
Publication of WO2020189882A1 publication Critical patent/WO2020189882A1/ko
Anticipated expiration legal-status Critical
Priority to JP2024000199A priority patent/JP2024038254A/ja
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    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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Definitions

  • the present invention relates to an antistatic silicone release film, and more particularly, with an excellent antistatic function, there is no side effect due to static electricity when peeling from an adhesive, and the adhesion of the cured layer to the substrate is excellent, and the degree of crosslinking of the cured layer is high. It relates to an antistatic silicone release film having stable release characteristics.
  • the release properties required for the release film for use in the field of precision materials include a peeling force in an appropriate range according to the type and use of the adhesive, and a high residual adhesive rate so that the release layer is transferred to the adhesive layer and does not degrade the function of the adhesive layer. Solvent resistance so that the release layer is not damaged by the organic solvent used in the pressure-sensitive adhesive, and high adhesion between the release layer and the substrate are required so that the release layer is not removed due to friction in the processing process.
  • the release film is also used for the pressure-sensitive adhesive carrier film due to the thinning of the pressure-sensitive adhesive layer, stable release properties with little change with temperature and time must be secured.
  • conventional antistatic technologies include an internal addition method using an anionic compound, a method of depositing a metal compound, a method of applying conductive inorganic particles, a method of applying a low molecular weight ionic compound, and a method of applying a conductive polymer.
  • a method of manufacturing an antistatic release film by including a metal in a silicone composition by applying such antistatic technology has been used.
  • an antistatic silicone release film can be prepared in a single coating process by mixing a conductive polymer resin having excellent compatibility and a binder compound having excellent reactivity in a silicone release coating composition for producing a release film.
  • the present invention has been completed.
  • Patent Document 1 Korean Patent Application Publication No. 10-2015-0104477
  • the present invention has been devised to solve the above problems and meet conventional requirements, and an object of the present invention is to have excellent antistatic properties through an in-line manufacturing process, so that a release film for semiconductors, electric and electronic applications, and displays When used as, it is intended to provide an antistatic silicone release film that can reduce side effects such as product contamination and poor peeling due to static electricity when peeling from the adhesive.
  • Another object of the present invention is that it has excellent peel strength and a high level of residual adhesion, so that it can be appropriately used for a purpose without deteriorating the performance of the pressure-sensitive adhesive layer, and by configuring a dense cured layer, the durability of the cured layer and It is intended to provide an antistatic silicone release film having excellent solvent resistance, high adhesion between the cured layer and the substrate, and less change in physical properties with temperature and time, and thus has stable release properties.
  • the above object includes a base film and a cured layer of an antistatic silicone release composition positioned on at least one surface of the base film, wherein the cured layer includes an intensity ratio of silicon ions exhibiting silicone release properties and sulfur ions exhibiting antistatic properties ( Si - / S -) it is containing less than one antistatic region 10 and greater than the silicone release area, is achieved by the antistatic silicone release film.
  • the intensity ratio of the cured layer (Si - / S -) is at the boundary with the remotest top of the base film 10 to 10,000, characterized in that 0.001 to 1 at the boundary between the bottom of the base film.
  • the thickness ratio of the antistatic region and the silicon release region satisfies Equation 1 below,
  • AV is the thickness of the antistatic region
  • RV is the thickness of the silicon release region
  • the antistatic silicone release composition is characterized in that it comprises alkenylpolysiloxane, hydroelectric polysiloxane, a conductive polymer resin, a binder compound, and a platinum chelate catalyst.
  • the antistatic silicone release composition is 2.5 to 7.5 parts by weight of hydroelectric polysiloxane, 1 to 10 parts by weight of a conductive polymer resin, 5 to 20 parts by weight of a binder compound, and 10 ppm to 1,000 of a platinum chelate catalyst based on 100 parts by weight of alkenylpolysiloxane. It is characterized by containing ppm.
  • the antistatic silicone release composition further comprises an ionic surfactant having both a cation and an anion, wherein the ionic surfactant is an ionic surfactant having an anionic group selected from sulfo-, phosphor-, or carboxyl- groups. It is characterized by being.
  • the ionic surfactant is characterized by containing 0.01 parts by weight to 5 parts by weight based on 100 parts by weight of alkenylpolysiloxane.
  • the binder compound is characterized in that it contains a silane-based compound and a non-silane-based polyfunctional compound.
  • the silane-based compound is at least one of epoxy silane-based, amino silane-based, vinyl silane-based, methacryloxy silane-based, and isocyanate silane-based compound
  • the non-silane-based polyfunctional compound is an epoxy-based polyfunctional compound having an epoxy functional group. It is characterized in that it is a compound.
  • the epoxy-based polyfunctional compound has at least one functional group selected from the group consisting of amino, hydroxy, aldehyde, ester, vinyl, acrylic, imide, cyano and isocyanate, and one molecule It is characterized by having three or more functional groups within.
  • the weight ratio of the non-silane-based polyfunctional compound to the silane-based compound is 2 to 20.
  • the conductive polymer resin has an average particle diameter of 10 to 90 nm, and is characterized in that it is an aqueous dispersion containing polyanions and polythiophene or an aqueous dispersion containing polyanions and polythiophene derivatives.
  • the antistatic silicone release composition is characterized in that it contains 0.5 to 15% by weight of solids.
  • the surface tension of the base film compared to the cured layer is characterized in that 1.0 to 1.5 times.
  • the thickness of the base film is 15 to 300 ⁇ m, and the thickness of the cured layer is 0.01 to 10 ⁇ m.
  • the cured layer satisfies the following conditions 1 to 3 at the same time,
  • RF is the peel force (g/inch) of the cured layer
  • SA is the residual adhesion rate (%) of the cured layer
  • SR is the surface resistance ( ⁇ /sq) of the cured layer.
  • the above object includes a base film, a cured layer of an antistatic silicone release composition located on one side of the base film, and a silicone release layer located on the other side of the base film, wherein the cured layer is silicone exhibiting silicone release characteristics. and ion intensity ratio of sulfur ion that indicates the antistatic property (Si - / S -) is containing less than one antistatic region 10 and greater than the silicone release area, is achieved by the antistatic silicone release film.
  • the present invention since it has antistatic performance, it is possible to solve problems such as contamination due to static electricity generated when the release film is separated from the pressure-sensitive adhesive layer and poor peeling.
  • the durability of the cured layer is excellent, so that it has solvent resistance to organic solvents. It has a high adhesion to and has the effect of less dropping of the hardened layer due to friction.
  • FIG. 1 is a cross-sectional view of an antistatic silicone release film according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of an antistatic silicone release film according to another embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of an antistatic silicone release film according to another embodiment of the present invention.
  • copolymer is used to refer to a polymer formed by copolymerization of two or more monomers. Such copolymers include binary copolymers, terpolymers or higher order copolymers.
  • FIG. 1 is a cross-sectional view of an antistatic silicone release film according to a preferred embodiment of the present invention.
  • the antistatic silicone release film according to an embodiment of the present invention, the antistatic silicone release film 100 according to an aspect of the present invention is located on at least one side of the base film 110 and the base film. It includes a cured layer 120 of the antistatic silicone release composition.
  • the cured layer 120 has antistatic properties and silicone release properties at the same time, and these antistatic properties and silicone release properties are realized at the same time by inline coating the antistatic silicone release composition on the base film once in the manufacture of the release film. It is characterized.
  • the antistatic silicone release composition forming the cured layer 120 of the antistatic silicone release film may include an alkenylpolysiloxane, a hydroelectric polysiloxane, a conductive polymer resin, a binder compound, and a platinum chelate catalyst. have.
  • the antistatic silicone release composition may further include an ionic surfactant having both a cation and an anion.
  • the alkenylpolysiloxane may have a structure represented by Formula 1 below.
  • n and n are each independently an integer of 10 to 500.
  • m and n do not mean block bonds, but they only mean that the sum of each unit is m and n.
  • each unit in Formula 1 is a random bond or a block bond.
  • the group may be present in any part of the molecule, but it is preferred that at least two groups are present.
  • the hydroelectric polysiloxane may have a structure represented by Formula 2 below.
  • a is an integer of 1 to 200
  • b is an integer of 1 to 400.
  • a and b do not mean a block combination, they just mean that the sum of each unit is a and b. Therefore, in Formula 2, each unit is a random bond or a block bond.
  • the alkenyl polysiloxane represented by Formula 1 and the hydroelectric polysiloxane represented by Formula 2 may be linear, branched, radial, or cyclic, and mixtures thereof may be used.
  • the mixing ratio of alkenylpolysiloxane and hydropre-polysiloxane is preferably 2.5 to 7.5 parts by weight of hydropre-polysiloxane based on 100 parts by weight of alkenylpolysiloxane.
  • the amount of hydropre-polysiloxane is less than 2.5 parts by weight, the amount of unreacted alkenylpolysiloxane cannot be sufficiently cured and thus stable release properties cannot be realized. If it exceeds 7.5 parts by weight, the amount of unreacted hydropolysiloxane increases. This is because the peeling characteristics may deteriorate.
  • the antistatic silicone release composition is a conductive polymer resin to impart antistatic performance
  • the conductive polymer resin contains a polyanion and a polythiophene-containing water dispersion or a polyanion and a polythiophene derivative. It is preferable that it is an aqueous dispersion.
  • Polyanions are acidic polymers, such as high molecular carboxylic acid, high molecular weight sulfonic acid, and polyvinyl sulfonic acid.
  • examples of the polymeric carboxylic acid include polyacrylic acid, polymethacrylic acid, and polymaleic acid, and examples of the polymeric sulfonic acid include polystyrenesulfonic acid, but are not limited thereto.
  • the polyanion has an excessive weight ratio of the solid content of the polythiophene or polythiophene derivative.
  • an aqueous dispersion containing 0.5% by weight of poly(3,4-ethylenedioxythiophene) and 0.8% by weight of polystyrenesulfonic acid is used, but is not limited thereto.
  • the weight ratio of the polythiophene or polythiophene derivative to the polyanion exceeds 1 and is less than 5, and more preferably exceeds 1 and less than 3.
  • the conductive polymer resin exhibits stable antistatic performance by using an aqueous dispersion having an average particle diameter of 10 to 90 nm.
  • the average particle diameter of the conductive polymer resin exceeds 90 nm, it is not uniformly distributed inside the cured layer, so that the deviation of the surface resistance becomes very large, and the antistatic performance cannot be properly implemented.
  • the average particle diameter of the conductive polymer resin is less than 10 nm, as the molecular weight decreases, the antistatic performance cannot be realized when the molecular weight is increased by more than a specific distance between molecules, and the smaller the average particle diameter during in-line stretching, the smaller the average particle diameter, the lower the antistatic performance.
  • the conductive polymer resin preferably contains 1 to 10 parts by weight based on 100 parts by weight of alkenylpolysiloxane. This is because when the content of the conductive polymer resin is less than 1 part by weight compared to 100 parts by weight of alkenylpolysiloxane, the surface resistance properties are deteriorated due to insufficient antistatic properties, and when the content of the conductive polymer resin exceeds 10 parts by weight, the release properties due to the curing disturbance of the silicone decrease .
  • the antistatic silicone release composition derives stable release properties and antistatic properties by controlling the crosslinking density, improves the compatibility of the conductive polymer resin to realize uniform antistatic properties, and improves the solvent resistance of the cured layer and A binder compound may be included to improve durability and increase adhesion between the cured layer and the substrate.
  • the binder compound may include a silane-based compound and a non-silane-based polyfunctional compound. More specifically, it is preferable that the binder compound has a weight ratio of 2 to 20 of the non-silane-based polyfunctional compound to the silane-based compound.
  • the silane-based compound is at least one of an epoxy silane-based, amino silane-based, vinyl silane-based, methacryloxy silane-based, and isocyanate silane-based compound
  • the non-silane-based polyfunctional compound may be an epoxy-based polyfunctional compound having an epoxy functional group. .
  • the epoxy-based polyfunctional compound is preferable because the epoxy-based compound is excellent in compatibility and stretchability with a conductive polymer.
  • the compatibility differs according to the content of N, C, and O, and the alkenyl group is attached to the functional group of the conductive polymer, resulting in improved stretchability due to the swelling effect.
  • the epoxy-based polyfunctional compound has at least one functional group selected from the group consisting of amino, hydroxy, aldehyde, ester, vinyl, acrylic, imide, cyano, and isocyanate, and 3 or more It is preferable to have a functional group.
  • the binder compound contains 5 to 20 parts by weight of the binder compound based on 100 parts by weight of the alkenylpolysiloxane. If the content of the binder compound is less than 5 parts by weight, the cured layer has a low adhesion to the substrate, and the cured layer is peeled off, or the compatibility of the conductive polymer resin is poor, resulting in a problem of uneven antistatic performance. This is because when it exceeds 20 parts by weight, it affects the peeling force and residual adhesion, resulting in a problem of deteriorating release properties.
  • the antistatic silicone release composition includes a platinum chelate catalyst, which performs a function of helping the addition reaction of Formulas 1 and 2, and the platinum chelate catalyst in the antistatic silicone release composition contains 1 ppm to 1,000 ppm. It is desirable.
  • the antistatic silicone release composition may further include an ionic surfactant having both a cation (cationic group) and an anion (anion group) as a surfactant.
  • an ionic surfactant may be, for example, an ionic surfactant composed of an ester compound having a dissociable cation and containing an anionic group.
  • the surfactant according to the present invention is an ionic surfactant having an anionic group selected from sulfo-, phosphor-, or carboxyl- groups among ionic surfactants containing anionic groups, that is, anionic groups derived from sulfonic acid, phosphorous acid or carboxylic acid.
  • anionic groups that is, anionic groups derived from sulfonic acid, phosphorous acid or carboxylic acid.
  • the ionic surfactant may include 0.01 parts by weight to 5 parts by weight based on 100 parts by weight of alkenylpolysiloxane, and preferably 0.05 to 1 part by weight. This is because when the content of the ionic surfactant is less than 0.01 parts by weight, the content is not sufficient to serve as a surfactant, so the effect of improving the appearance of the antistatic silicone release film does not appear, and the content of the ionic surfactant exceeds 5 parts by weight. In this case, there is a problem that the interaction with the pressure-sensitive adhesive is promoted, resulting in an increase in peeling force, which exhibits unstable release properties.
  • the antistatic silicone release composition is preferably diluted to contain 0.5 to 15% by weight of solid content, and then coated on a polyester base film.
  • the solid content of the antistatic silicone release composition is less than 0.5% by weight, a uniform cured layer cannot be obtained, so stable release properties and antistatic properties cannot be obtained, and when it exceeds 15% by weight, blocking between films occurs.
  • adhesion to the substrate of the coating composition is deteriorated, causing a problem of silicone transfer, and poor coating appearance.
  • the solvent of the antistatic silicone release composition is not limited in type as long as it can be applied on the polyester base film by dispersing the solid content of the present invention, but is preferably coated in the state of an aqueous coating solution containing water as the main medium.
  • the cured layer 120 of the antistatic silicone release film according to an embodiment of the present invention is known as a bar coating method, a reverse roll coating method, a gravure roll coating method, etc. of the above-described antistatic silicone release composition on the base film 110 It can be formed by applying one or more times through the method of.
  • the antistatic silicone release film according to an embodiment of the present invention preferably has a surface tension of 1.0 to 1.5 times the surface tension of the base film compared to the cured layer. At this time, if the surface tension of the base film compared to the cured layer is less than 1.0 times, the wettability of the coating solution is deteriorated, and when it exceeds 1.5 times, the coating solution is agglomerated, causing appearance defects.
  • the antistatic silicone release composition used in the present invention may further contain a suitable organic solvent to a degree that does not impair the effects of the present invention, and the preferred organic solvent is Isopropyl alcohol, butyl cellosolve, ethyl cellosolve, acetone, methanol, ethanol, and the like can be used.
  • the content of the organic solvent is 10% by weight or less in the coating composition, more preferably It is preferable to limit it to 5% by weight or less.
  • the base film 110 is preferably a polyester base film, and preferably has a thickness of 15 to 300 ⁇ m.
  • the thickness of the base film is less than 15 ⁇ m, the degree of deformation due to external force increases, and thus the use as a carrier film is not satisfied, and when the thickness of the film exceeds 300 ⁇ m, there is a problem of inferior economy.
  • the thickness of the cured layer 120 is preferably 0.01 to 10 ⁇ m. This means that when the thickness of the cured layer is less than 0.01 ⁇ m, a uniform cured layer may not be formed, and when the thickness of the cured layer exceeds 10 ⁇ m, blocking between one surface and the rear surface of the polyester base film 110 on which the cured layer 120 is located. Because it can occur.
  • compatibility with the conductive polymer resin and silicone is achieved through the application of an ionic surfactant. It is possible to achieve the technical goal by securing excellent wettability and distinguishing between the antistatic area and the silicon release area (peelable area).
  • a hardened layer, according to one embodiment of the present invention are silicon ions representing a silicone release characteristic is intensity (Intensity or counts) the ratio of (Si - - / S) - - sulfur ion (S) representing the antistatic (Si)
  • An antistatic region less than 1 and a silicon release region greater than 10 may be included.
  • This intensity ratio can be measured by TOF-SIMS, and is a relative ratio value of silicon ions and sulfur ions in a single cured layer.
  • the intensity ratio of the cured layer is at the boundary with the remotest top of the base film 10 to 10,000, preferably from 0.001 to 1 at the boundary between the bottom of the base film. Due to this, excellent antistatic properties and silicone release properties can be simultaneously implemented in a single cured layer.
  • the intensity ratio at the top may be 100 to 5,000, which is realized in a stacked form of silicon ions exhibiting silicon release characteristics and sulfur ions exhibiting antistatic characteristics, such as a phase-separated structure. I can.
  • the thickness ratio of the antistatic region and the silicone release region of the cured layer satisfies Equation 1 below, where AV is the thickness of the antistatic region, and RV is the thickness of the silicone release region.
  • Equation 1 is 1/10 or less, the surface resistance property decreases, and when it is 1/3 or more, the release property decreases.
  • the cured layer according to an embodiment of the present invention satisfies the following conditions 1 to 3 at the same time, but RF is the peel force (g/inch) of the cured layer, SA is the residual adhesion rate (%) of the cured layer, and SR Is preferably the surface resistance ( ⁇ /sq) of the cured layer.
  • the antistatic silicone release film 200 is located on one side of the base film 210 and the base film.
  • the cured layer 230 of the above-described antistatic silicone release composition may be positioned on the other side from the cured layer 220 of the above-described antistatic silicone release composition.
  • the coating composition for constituting the cured layer 230 may not include a peel force control agent.
  • an antistatic silicone release film 300 includes a base film 310 and one side of the base film.
  • a silicone release layer 330 may be positioned on one side different from the cured layer 320 of the above-described antistatic silicone release composition positioned at.
  • the coating composition for configuring the silicone release layer 330 may not include a conductive polymer resin.
  • the prepared antistatic silicone release composition was diluted with water so that the solid content was 5% by weight, and applied to one side of a polyester base film. After coating, it was dried at 180° C. for 50 seconds to prepare an antistatic silicone release film.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 10 parts by weight of a conductive polymer resin were mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 2 parts by weight of a conductive polymer resin were mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 7 parts by weight of a conductive polymer resin was mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 5 parts by weight of a conductive polymer resin were mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 1 part by weight of the conductive polymer resin was mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared through the same procedure as in Example 1, except that dioctyl phospho succinate sodium salt was used as the ionic surfactant.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 0.2 parts by weight of dioctyl sulfosuccinate sodium salt and 0.2 parts by weight of dioctyl phospho succinate sodium salt were mixed as an ionic surfactant.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except for mixing 15 parts by weight of an epoxy-based binder compound.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 20 parts by weight of the epoxy-based binder compound were mixed.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except for diluting in water so that the solid content of the prepared antistatic silicone release composition was 2.5% by weight.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 0.5 parts by weight of a conductive polymer resin was mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that 15 parts by weight of a conductive polymer resin was mixed with respect to 100 parts by weight of alkenylpolysiloxane.
  • An antistatic silicone release film was prepared through the same procedure as in Example 1, except that 0.2 parts by weight of a silicone-based surfactant (manufactured by Dow Corning) was used as a surfactant.
  • a silicone-based surfactant manufactured by Dow Corning
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that the binder mixture was not mixed.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except that the conductive polymer resin was not mixed.
  • An antistatic silicone release film was prepared in the same manner as in Example 1, except for mixing 25 parts by weight of the epoxy-based binder compound.
  • the total thickness of the cured layer is measured using an ellipsometer (Elli-SE).
  • the thickness of the silicone coating layer is measured using XRF (Panalytical, Minipal 4), and this is taken as the peeling area value.
  • the thickness of the antistatic region was calculated according to Equation 2 below.
  • Antistatic area Total thickness of cured layer (Elipsometer measurement)-Silicone coating layer thickness (XRF measurement)
  • Flight type secondary ion mass spectrometry It was measured by TOF-SIMS (Time of Flight Secondary Ion Mass Spectrometry; ION-TOF, Germany).
  • Measurement conditions were conducted in negative mode with the energy intensity of Ar-cluster 5KeV.
  • the surface resistance of the cured layer was measured according to JIS K7194.
  • Peel force was measured using AR-1000 (Chem-Instrument) at a peel angle of 180° and a peel rate of 0.3 mpm, and the average value (g/inch) was calculated by measuring five times, and rounded to the first decimal place.
  • An adhesive tape (Nitto 31B) was placed on the cured layer, pressed with a 2 kg compression roller, left at room temperature for 30 minutes, and then peeled off the adhesive tape from the cured layer, and then attached to the cold-rolled stainless steel plate, and the peel force was measured.
  • Peel force was measured using AR-1000 (Chem-Instrument) at a peel angle of 180° and a peel rate of 0.3 mpm, and the average value was calculated by measuring five times.
  • the residual adhesion rate was calculated according to Equation 3 below.
  • Residual adhesion rate Peeling force of the adhesive tape peeled from the cured layer / Peeling force of the adhesive tape that has not been used x 100 (%)
  • the area of the foaming defect was measured relative to the area of the release film sample of 5cm X 5cm.
  • the longest length of the foamy defects in the 5cm X 5cm release film sample was measured and the area was calculated with a circle, and then the area (cm 2 ) of the foamable defects was calculated by summing the whole.
  • the degree of foaming defects was evaluated by calculating the area ratio of foaming defects according to Equation 4 below, and the following criteria.
  • Foaming defect area ratio (%) Foaming defect area/ 25cm 2 X 100(%)
  • ⁇ 0% or more and less than 1%
  • ⁇ 1% or more and less than 2%
  • the resistance of the film surface to a solvent was measured.
  • the cured layer was reciprocated 10 times with a load of 100 g, and the solvent resistance state of the coated surface was evaluated based on the following criteria.
  • ⁇ The hardened layer is smeared as if oil is pushed.
  • Example 1 15:80 1,250 ⁇ 0.01 1 x 10 7 16 97 ⁇ ⁇ ⁇ Example 2 26:80 800 ⁇ 0.2 1 x 10 4 10 85 ⁇ ⁇ ⁇ Example 3 12:80 900 ⁇ 0.5 1 x 10 8 14 97 ⁇ ⁇ ⁇ Example 4 23:80 950 ⁇ 0.1 1 x 10 5 11 88 ⁇ ⁇ ⁇ Example 5 25:80 1,000 ⁇ 0.1 1 x 10 6 15 96 ⁇ ⁇ Example 6 10:80 9,000 ⁇ 0.001 1 x 10 9 18 98 ⁇ ⁇ ⁇ Example 7 15:80 1,250 ⁇ 0.05 1 x 10 7 16 95 ⁇ ⁇ ⁇ Example 8 15:80 1,250 ⁇ 0.01 1 x 10 7 14 96 ⁇ ⁇ ⁇ Example 9 20:80 1,100 ⁇ 0.2 1 x 10 6
  • the antistatic silicone release film according to Examples 1 to 11 of the present invention has almost no defects, so the coating appearance is excellent, the cured layer has excellent sliding properties, and the surface resistance and peeling force are in an appropriate range. It can be seen that it has a value of and is also excellent in residual adhesion rate. In the case of the antistatic silicone release film according to Example 8 of the present invention, it can be seen that the appearance and physical properties are the most excellent.
  • the thickness ratio of the antistatic region and the silicon release region in the cured layer layer and the uppermost and lowermost silicon ions and sulfur Depending on the ratio of ions, it can be seen that the surface resistance value, which is the antistatic property, and the peel force, the residual adhesion rate, and the appearance, which are release properties, have a correlation and change.
  • Comparative Example 6 when there are too many binder compounds, it can be confirmed that the surface resistance properties are improved, but the release properties are fatally deteriorated.
  • the antistatic silicone release film according to the present invention may be appropriately applied for a desired purpose, but is not limited thereto.
  • the present invention can provide an excellent quality antistatic silicone release film for use in the field of precision materials, which has an appropriate range of peeling force and a high level of residual adhesion, so that the function of the pressure-sensitive adhesive layer is not reduced. It can be appropriately used according to the purpose without the need.
  • the antistatic silicone release film according to the present invention has excellent durability of the cured layer, excellent solvent resistance to organic solvents, high adhesion to the substrate, and less detachment of the cured layer due to friction.

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JP2024511405A (ja) * 2021-04-16 2024-03-13 東レ先端素材株式会社 両面帯電防止シリコーン離型フィルム

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