WO2020170722A1 - Module d'antenne, dispositif de communication sur lequel un module d'antenne est monté, et procédé de fabrication de module d'antenne - Google Patents

Module d'antenne, dispositif de communication sur lequel un module d'antenne est monté, et procédé de fabrication de module d'antenne Download PDF

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Publication number
WO2020170722A1
WO2020170722A1 PCT/JP2020/002731 JP2020002731W WO2020170722A1 WO 2020170722 A1 WO2020170722 A1 WO 2020170722A1 JP 2020002731 W JP2020002731 W JP 2020002731W WO 2020170722 A1 WO2020170722 A1 WO 2020170722A1
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WO
WIPO (PCT)
Prior art keywords
flat portion
antenna module
flat
bent
dielectric substrate
Prior art date
Application number
PCT/JP2020/002731
Other languages
English (en)
Japanese (ja)
Inventor
良樹 山田
通春 横山
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to KR1020207023503A priority Critical patent/KR102197563B1/ko
Priority to JP2020530548A priority patent/JP6773259B1/ja
Priority to KR1020207036807A priority patent/KR102241159B1/ko
Priority to CN202080002614.7A priority patent/CN112106250B/zh
Priority to KR1020217010743A priority patent/KR102599495B1/ko
Publication of WO2020170722A1 publication Critical patent/WO2020170722A1/fr
Priority to US17/021,069 priority patent/US11108157B2/en
Priority to US17/389,592 priority patent/US11611147B2/en
Priority to US18/169,435 priority patent/US12009608B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/20—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path
    • H01Q21/205—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path providing an omnidirectional coverage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/321—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors within a radiating element or between connected radiating elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching
    • H04B1/48—Transmit/receive switching in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H04B2001/0408—Circuits with power amplifiers

Definitions

  • the present disclosure relates to an antenna module, a communication device including the antenna module, and a method for manufacturing the antenna module, and more specifically, to a technique for downsizing the antenna module.
  • a flat patch antenna may be used as an antenna element (radiating element) of a mobile terminal (communication device) such as a smartphone.
  • the radio waves radiated by this patch antenna have high directivity (straightness), so it is necessary to arrange the antennas along each side of the housing of the mobile terminal in order to radiate radio waves in many directions. Become.
  • Patent Document 1 discloses an antenna module including a multilayer substrate including a rigid portion in which a radiating element is arranged and a flexible portion in which a transmission line is formed and which has flexibility. A configuration that is bent with respect to the extending direction of the line is disclosed. By adopting the antenna module in which the radiating element is arranged on such a flexible multilayer substrate, the antenna module can be easily incorporated into the limited space in the housing.
  • Mobile terminals are required to be even smaller and thinner, and for this reason, antenna modules used in mobile terminals are also required to be further miniaturized.
  • the present disclosure has been made in order to solve such a problem, and an object thereof is to miniaturize an antenna that can be arranged in a limited space in a communication device while suppressing reduction in antenna characteristics. To provide a module.
  • An antenna module includes a dielectric substrate and a first radiating element arranged on the dielectric substrate.
  • the dielectric substrate includes a first flat portion and a second flat portion whose normal directions are different from each other, and a first bent portion connecting the first flat portion and the second flat portion.
  • the first flat portion has a first protruding portion that partially protrudes from the boundary portion between the first bent portion and the first flat portion toward the second flat portion along the first flat portion.
  • the first flat portion and the first bent portion are connected to each other at a position on the first flat portion where there is no first protruding portion. At least a part of the first radiating element is arranged on the first protrusion.
  • a method of manufacturing an antenna module includes a first step of forming a substantially C-shaped slit that penetrates in the thickness direction of the dielectric substrate.
  • the slit has a first portion and a second portion facing each other, and a third portion connecting the end portion of the first portion and the end portion of the second portion.
  • the first flat portion, the second flat portion, and the first flat portion and the second flat portion are formed on the dielectric substrate by bending the dielectric substrate at the first portion and the second portion of the slit.
  • a second step of forming a connecting bent portion is a first step of forming a substantially C-shaped slit that penetrates in the thickness direction of the dielectric substrate.
  • the slit has a first portion and a second portion facing each other, and a third portion connecting the end portion of the first portion and the end portion of the second portion.
  • the first flat portion is partially moved from the boundary portion between the bent portion and the first flat portion toward the second flat portion along the first flat portion.
  • a protruding portion is formed, and at least a part of the radiating element is arranged on the protruding portion.
  • the antenna module of the present disclosure at least a part of the radiating element is arranged on the protruding portion of the first flat portion formed by bending the dielectric substrate.
  • the radiating element can be arranged in the dead space portion generated in the communication device.
  • the first flat portion and the second flat portion of the dielectric substrate are connected by the bent portion in the portion where the protrusion is not formed, the thickness of the dielectric substrate at the protrusion is the same as the original dielectric substrate. The thickness is maintained. As a result, it is possible to suppress the deterioration of the antenna characteristics due to the reduction of the thickness of the dielectric layer. Therefore, according to the antenna module of the present disclosure, it is possible to provide a miniaturized antenna module that can be arranged in a limited space in a communication device while suppressing a decrease in antenna characteristics.
  • FIG. 3 is a block diagram of a communication device to which the antenna module according to the first embodiment is applied.
  • FIG. 3 is a perspective view of the antenna module according to the first embodiment.
  • FIG. 3 is a cross-sectional view of the antenna module according to the first embodiment.
  • FIG. 4 is a cross-sectional view when the antenna module of FIG. 3 is incorporated in a housing. It is sectional drawing of the antenna module of a comparative example.
  • FIG. 6 is a diagram for explaining a path of a power supply wiring in the antenna module according to the first embodiment.
  • FIG. 7 is a diagram schematically showing an antenna module manufacturing method according to the first embodiment. It is a figure which shows the 1st example of a slit shape.
  • FIG. 9 is a perspective view of an antenna module of Modification 1. It is a perspective view of the antenna module of the modification 2. It is sectional drawing of the antenna module of the modification 3.
  • FIG. 11 is a cross-sectional view of an antenna module of Modification 4; FIG. 11 is a perspective view of an antenna module of Modification 5; It is a perspective view of the antenna module of the modification 6.
  • FIG. 7 is a perspective view of an antenna module according to the second embodiment. It is a figure for demonstrating the slit shape formed in the manufacturing process of the antenna module of FIG.
  • FIG. 9 is a perspective view of an antenna module according to a third embodiment. It is a figure for demonstrating the slit shape formed in the manufacturing process of the antenna module of FIG.
  • FIG. 16 is a perspective view of an antenna module according to the fourth embodiment. It is a figure for demonstrating the slit shape formed in the manufacturing process of the antenna module of FIG.
  • FIG. 16 is a perspective view of an antenna module according to a fifth embodiment. It is a figure for demonstrating the radiation direction of the electric wave when the antenna module of FIG. 24 is mounted in a housing
  • FIG. 16 is a perspective view of a modified example of the antenna module according to the fifth embodiment. It is a perspective view of the antenna module according to the sixth embodiment.
  • FIG. 27 is a cross sectional view of a first example of the antenna module according to the seventh embodiment. It is sectional drawing of the 2nd example of the antenna module according to Embodiment 7. It is sectional drawing of the antenna module according to Embodiment 8. It is sectional drawing of the antenna module according to Embodiment 9. It is a perspective view of the antenna module according to the tenth embodiment. It is sectional drawing of the antenna module of FIG. FIG. 33 is a cross-sectional view of a first modified example of the antenna module of FIG. 32. FIG. 33 is a cross-sectional view of a second modified example of the antenna module of FIG. 32. It is a perspective view of the antenna module according to the eleventh embodiment. FIG.
  • FIG. 33 is a cross sectional view of a first example of the antenna module according to the twelfth embodiment.
  • FIG. 27 is a cross sectional view of a second example of the antenna module according to the twelfth embodiment.
  • FIG. 35 is a cross sectional view of a first example of the antenna module according to the thirteenth embodiment.
  • FIG. 33 is a cross sectional view of a second example of the antenna module according to the thirteenth embodiment. It is sectional drawing of the 1st example of the antenna module according to Embodiment 14. It is sectional drawing of the 2nd example of the antenna module according to Embodiment 14. It is a perspective view of the antenna module according to the fifteenth embodiment.
  • FIG. 1 is an example of a block diagram of a communication device 10 to which the antenna module 100 according to the first embodiment is applied.
  • the communication device 10 is, for example, a mobile terminal such as a mobile phone, a smartphone or a tablet, or a personal computer having a communication function.
  • An example of a frequency band of a radio wave used in the antenna module 100 according to the present embodiment is a millimeter wave radio wave having a center frequency of 28 GHz, 39 GHz and 60 GHz, for example, but radio waves in frequency bands other than the above are also applicable. Applicable.
  • the communication device 10 includes an antenna module 100 and a BBIC 200 forming a baseband signal processing circuit.
  • the antenna module 100 includes an RFIC 110, which is an example of a power feeding circuit, and an antenna device 120.
  • the communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and down-converts the high-frequency signal received by the antenna device 120 to process the signal in the BBIC 200. To do.
  • FIG. 1 shows an example in which the antenna device 120 is formed of a plurality of feeding elements 121 arranged in a two-dimensional array, the feeding elements 121 do not necessarily have to be plural and one
  • the antenna device 120 may be formed by the power feeding element 121. Further, it may be a one-dimensional array in which a plurality of feeding elements 121 are arranged in a line.
  • feeding element 121 is a patch antenna having a substantially square flat plate shape.
  • the RFIC 110 includes switches 111A to 111D, 113A to 113D and 117, power amplifiers 112AT to 112DT, low noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, and signal combiners/demultiplexers. 116, a mixer 118, and an amplifier circuit 119.
  • the switches 111A to 111D and 113A to 113D are switched to the power amplifiers 112AT to 112DT side, and the switch 117 is connected to the transmission side amplifier of the amplifier circuit 119.
  • the switches 111A to 111D and 113A to 113D are switched to the low noise amplifiers 112AR to 112DR side, and the switch 117 is connected to the receiving side amplifier of the amplifier circuit 119.
  • the signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118.
  • the up-converted transmission signal which is a high-frequency signal, is divided into four by the signal combiner/demultiplexer 116, passes through four signal paths, and is fed to different feed elements 121.
  • the directivity of the antenna device 120 can be adjusted by individually adjusting the degree of phase shift of the phase shifters 115A to 115D arranged in each signal path.
  • the received signals which are high-frequency signals received by each power feeding element 121, pass through four different signal paths and are combined by the signal combiner/splitter 116.
  • the received signals thus combined are down-converted by mixer 118, amplified by amplifier circuit 119, and transmitted to BBIC 200.
  • the RFIC 110 is formed, for example, as a one-chip integrated circuit component including the above circuit configuration.
  • the devices switching, power amplifiers, low noise amplifiers, attenuators, phase shifters
  • the RFIC 110 may be formed as a one-chip integrated circuit component for each corresponding power feeding element 121. ..
  • FIG. 2 is a perspective view of the antenna module 100.
  • 3 is a cross-sectional view of the antenna module 100 mounted on the mounting board 20.
  • antenna module 100 includes a dielectric substrate 105, power supply wirings 170 and 171, and a ground electrode GND in addition to power supply element 121 and RFIC 110.
  • the positive direction of the Z axis in each drawing may be referred to as the upper surface side and the negative direction may be referred to as the lower surface side.
  • the dielectric substrate 105 is, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating a plurality of resin layers made of a resin such as epoxy or polyimide.
  • the dielectric substrate 105 does not necessarily have a multi-layer structure, and may be a single-layer substrate.
  • the dielectric substrate 105 has a substantially L-shaped cross section, and a flat plate-shaped flat portion 130 whose normal direction is the Z-axis direction in FIGS. 2 and 3. It includes a flat portion 131 in the form of a flat plate whose normal direction is the X-axis direction in FIGS. 2 and 3, and a bent portion 135 connecting the two flat portions 130, 131.
  • the flat portion 131 corresponds to the “first flat portion” of the present disclosure
  • the flat portion 130 corresponds to the “second flat portion” of the present disclosure.
  • the antenna module 100 four feeding elements 121 are arranged in a line in the Y-axis direction on each of the two flat portions 130 and 131.
  • the power feeding element 121 is arranged so as to be exposed on the surface of the flat portions 130 and 131 will be described. It may be arranged inside the body substrate.
  • the flat portion 130 has a substantially rectangular shape, and the four feeding elements 121 are arranged in a line on the surface thereof.
  • the RFIC 110 is connected to the lower surface side (the surface in the negative direction of the Z axis) of the flat portion 130.
  • the RFIC 110 is mounted on the front surface 21 of the mounting board 20 via the solder bumps 140.
  • the RFIC 110 may be mounted on the mounting board 20 using a multipolar connector instead of solder connection.
  • the flat portion 131 is connected to the bent portion 135 that is bent from the flat portion 130, and is arranged such that the inner surface (the surface in the negative direction of the X axis) faces the side surface 22 of the mounting board 20.
  • the flat portion 131 has a configuration in which a plurality of cutouts 136 are formed on a substantially rectangular dielectric substrate, and the bent portions 135 are connected to the cutouts 136. In other words, in a portion of the flat portion 131 where the notch 136 is not formed, a direction from the boundary portion 134 connecting the bent portion 135 and the flat portion 131 toward the flat portion 130 along the flat portion 131 ( That is, the protrusion 133 that protrudes in the positive direction of the Z axis) is formed.
  • the position of the projecting end of the projecting portion 133 is located in the positive direction of the Z axis with respect to the surface of the flat portion 130 on the lower surface side (the side facing the mounting substrate 20).
  • the upper surface (the surface located outside) of the flat portion 130 corresponds to the “first surface” of the present disclosure
  • the lower surface of the flat portion 130 (which faces the mounting substrate 20).
  • the surface) corresponds to the “second surface” of the present disclosure.
  • the bent portion 135 corresponds to the “first bent portion” of the present disclosure.
  • each projecting portion 133 is formed corresponding to the four feeding elements 121 arranged on the flat portion 130. Then, one feeding element 121 is arranged for each of the protrusions 133. Each of the power feeding elements 121 in the flat portion 131 is arranged so that at least a part thereof overlaps with the protruding portion 133.
  • one of the protrusions 133 formed on the flat portion 131 corresponds to the “first protrusion” of the present disclosure, and the other protrusion 133 is the “second protrusion” of the present disclosure.
  • one of the feeding elements 121 arranged in the flat portion 131 corresponds to the “first radiating element” of the present disclosure, and the other feeding elements 121 arranged in the flat portion 131 are arranged.
  • each of the power feeding elements 121 arranged on the flat portion 130 corresponds to the “third radiating element” of the present disclosure.
  • the ground electrode GND is arranged on the surface facing the mounting substrate 20 or the inner layer.
  • the high frequency signal from the RFIC 110 is transmitted to the power feeding element 121 of the flat portion 130 via the power feeding wiring 170. Further, the high frequency signal from the RFIC 110 is transmitted to the power feeding element 121 of the flat portion 131 via the power feeding wiring 171.
  • the power supply wiring 171 passes from the RFIC 110 to the inside of each dielectric substrate of the flat portions 130 and 131 and the inside (or the surface) of the dielectric substrate of the bent portion 135, and the power feeding element 121 disposed on the flat portion 131. Connected to.
  • the flat portions 130 and 131 and the bent portion 135 are formed by partially processing and bending the flat dielectric substrate 105.
  • the thickness of the flat portion 131 is the same as the thickness of the flat portion 130 including the protruding portion 133.
  • the feeding element 121 of the flat portion 131 it is possible to suppress the deterioration of the antenna characteristics due to the reduction of the thickness of the dielectric substrate.
  • FIG. 4 is a cross-sectional view showing a state where the antenna module 100 is incorporated inside the housing 30 of the communication device 10.
  • the antenna module 100 is arranged so as to face the inside of two adjacent surfaces of the housing 30.
  • the housing 30 is made of a dielectric material such as resin or glass, and the power feeding element 121 is arranged so as to be in contact with the housing 30.
  • the dielectric substrate flat portions 130 and 131
  • the housing 30 itself acts as a shield for blocking radio waves, so that the portion facing the power feeding element 121 is partially provided with a dielectric material.
  • FIG. 5 is a cross-sectional view showing a state where the antenna module 100# of the comparative example is incorporated inside the housing 30.
  • the flat portion 131# in the antenna module 100# of the comparative example does not protrude from the bent portion 135# unlike the flat portion 131 of the antenna module 100, and is arranged so as to further extend from the end of the bent portion 135#. There is.
  • the area AR1 inside the corner portion of the housing 30 shown in FIG. 5 cannot be effectively utilized, and the dimension of the antenna module 100# in the Z-axis direction is small.
  • the size is larger than the dimension of the antenna module 100 of the first embodiment in the Z-axis direction.
  • the demand for smaller and thinner communication devices has increased, but in a structure such as the antenna module 100# of the comparative example, when the dimension in the Z-axis direction is shortened, the communication device is arranged in the flat portion 131#. It is necessary to reduce the size of the power feeding element 121, and there is a possibility that desired antenna characteristics cannot be obtained.
  • the feeding element 121 can be arranged in the area AR1 shown in FIG. It will be possible. As a result, the size of the entire antenna module in the Z-axis direction can be reduced while maintaining the size of the feeding element 121. Therefore, it is possible to provide a miniaturized antenna module that can be arranged in a limited space in the communication device while suppressing reduction in antenna characteristics.
  • the thickness of the dielectric substrate of the protruding portion 133 is the same as that of the other dielectric substrate of the flat portion 131. Therefore, it is possible to suppress the deterioration of the antenna characteristics due to the decrease in the thickness of the dielectric substrate.
  • FIG. 6 is a diagram for explaining a path of the power feeding wiring 171 that transmits a high frequency signal to the power feeding element 121 of the flat portion 131.
  • power supply wiring 171 passes from RFIC 110 through the dielectric substrate of flat portion 130, passes through bent portion 135, and reaches flat portion 131.
  • the power supply wiring 171 extends to a position in the negative Z-axis direction further than the boundary portion 134 between the bent portion 135 and the flat portion 131, and is bent in the Y-axis direction from the boundary portion 134 to the power supply element 121. Connected.
  • the boundary portion 134 when the boundary portion 134 is located in the negative direction of the Z-axis with respect to the power feeding point SP of the power feeding element 121, the length of the power feeding wiring 171 from the RFIC 110 to the power feeding element 121 becomes long, and the power feeding wiring 171 has a long length.
  • the loss is slightly increased, since the radius of curvature of the bent portion 135 can be increased, the stress applied to the bent portion 135 can be reduced and the damage of the bent portion 135 can be suppressed.
  • the amount of protrusion of the protrusion 133 can be increased, the position of the protrusion end of the protrusion 133 can be arranged at a higher position, and the degree of freedom of arrangement within the housing 30 can be increased.
  • the boundary portion 134 when the boundary portion 134 is located in the positive direction of the Z axis with respect to the feeding point SP of the feeding element 121, the length of the feeding wire 171 can be shortened, so that the loss due to the feeding wire 171 can be suppressed. Therefore, it becomes difficult to bend the flat portion 131.
  • the position of the boundary portion 134, that is, the protrusion amount of the protrusion 133 is appropriately set according to the allowable loss and the arrangement of the power feeding element 121 of the flat portion 131.
  • FIG. 7 the process proceeds from FIG. 7A to FIG. 7D.
  • a plan view when viewed from the normal direction (that is, the Z-axis direction) of the dielectric substrate 105 is shown in the upper stage, and a cross-sectional view including a portion where the bent portion 135 is formed in the lower stage. It is shown.
  • the ground electrode, the power supply wiring, and the wiring pattern in the dielectric substrate are omitted for ease of explanation.
  • the dielectric substrate 105 is formed by laminating a plurality of dielectric layers in which a dielectric and a metal film formed into a desired pattern are bonded.
  • the metal film of each dielectric layer forms the ground electrode, the power feeding element 121, and the like.
  • an electrode 190 having the same shape as the bent portion 135 is formed on the inner layer of the portion of the dielectric substrate 105 that will be the flat portion 131.
  • the dielectric in the portion forming the bent portion 135 is removed by laser processing, and the recess 195 is formed in the dielectric substrate 105.
  • the electrode 190 functions as a guard electrode for cutting off the laser during laser processing.
  • the electrodes 190 are exposed when the dielectric substrate 105 is viewed in a plan view.
  • the electrode 190 ensures the desired thickness of the bent portion 135.
  • the power supply wiring 171 reaching the flat portion 131 is formed in a layer on the lower surface side of the electrode 190.
  • a slit 150 penetrating the dielectric substrate 105 in the thickness direction is formed by laser processing at the boundary between the portion that becomes the protruding portion 133 and the portion that becomes the bent portion 135.
  • the electrode 190 is not formed in the portion where the slit 150 is formed.
  • the order of the step of forming the slit 150 and the step of forming the recess 195 is not particularly limited. That is, the recess 195 may be formed before forming the slit 150, or the recess may be formed after forming the slit 150.
  • the recess 195 may be formed before forming the slit 150, or the recess may be formed after forming the slit 150.
  • stains may be attached to the surrounding dielectric due to smear generated during the processing. Therefore, by forming the recesses 195 after forming the slits 150, it is possible to remove the dirt-attached dielectric when forming the recesses 195, and suppress appearance defects in the final product.
  • the exposed electrode 190 is removed by performing an etching process.
  • a mask process is performed on the portion of the power feeding element 121 with a resist or the like prior to the etching process.
  • the dielectric substrate 105 is bent along the Y-axis at the bent portion 135.
  • the normal line of the flat portion 131 is directed in the X-axis direction.
  • the slit 150 is formed, a part of the dielectric substrate rises from the surface of the bent portion 135 to form the protrusion 133, and at least a part of the power feeding element 121 is arranged on the protrusion 133.
  • the antenna device 120 is formed.
  • the RFIC 110 is connected to the lower surface side of the flat portion 130 to form the antenna module 100.
  • the dielectric may be removed by a processing method other than laser processing (for example, router processing).
  • the electrode 190 which functions as a guard electrode is unnecessary.
  • the slit 150 In the bending step of FIG. 7D, it is desirable to bend the dielectric substrate 105 linearly along the Y axis over the entire dielectric substrate 105. If the slit 150 has a portion where stress concentration occurs (stress concentration point) when the dielectric substrate 105 is bent, the dielectric substrate 105 is likely to bend at the stress concentration point. Therefore, it is preferable that the slit 150 has a shape in which stress concentration occurs as much as possible in a portion to be bent and, conversely, stress concentration does not occur in a portion not to be bent.
  • FIG. 8 is a diagram showing a first example of a slit shape.
  • the slit 150 has an angular C-shape as a whole.
  • stress tends to concentrate on the angular portion. Therefore, a corner 155 where two slits (first portion and second portion) extending in the X-axis direction and facing each other and a slit (third portion) extending in the Y-axis direction intersect each other has a predetermined radius of curvature.
  • the stress concentration at the corner portion 155 is reduced. This suppresses bending at the third portion of the slit 150 along the Y axis.
  • the inside of the slit 150 that is, the convex corner of the end of the protrusion 133 in which the power feeding element 121 is arranged is in an angular state in order to secure the area of the ground electrode GND as much as possible.
  • the slit 150 is formed by laser processing, as shown in FIG. 9A, when the laser is irradiated along the boundary from the starting point ST to the starting point ST along the boundary between the slit 150 and the dielectric substrate, the protrusion is formed.
  • the convex corner of the end of 133 has a curved line with a considerable curvature. Further, when the processing end point does not coincide with the starting point ST, the dielectric in the slit 150 portion may not be removed and processing failure may occur.
  • the slit and 150 by two steps.
  • processing is started from a start point ST1 on the extension of the end portion of the protrusion 133 along the Y axis, laser is irradiated along the boundary between the slit 150 and the dielectric substrate, and the protrusion 133 is formed.
  • the laser irradiation is once terminated at the end point ED1 on the extension line of the other end along the Y axis.
  • the laser irradiation is restarted from the start point ST2 on the extension of the end of the protrusion 133 along the X-axis, and the extension of the other end of the protrusion 133 on the X-axis is resumed.
  • Laser is irradiated along the X axis until the end point ED2 of.
  • the concave corners of the substrate are arcuate to reduce stress concentration, and the convex corners are angular to secure the area of the ground electrode GND. You can Further, by making the start point and the end point of laser irradiation different, it is possible to prevent processing defects in which the dielectric is not removed.
  • FIG. 10 and 11 show another example of the slit shape.
  • FIG. 10 and the third example shown in FIG. 11 an example of a slit shape for bending the dielectric substrate 105 at a desired position is shown.
  • the shape of the outer side of each of the slits (first portion 150A1, second portion 150A2) formed along the X-axis direction is formed in an arc shape, and The slit opening width is gradually widened toward the central portion in the X-axis direction of the first portion 150A1 and the second portion 150A2.
  • a portion (width) of the bent portion 135 in the Y-axis direction becomes narrower than the slit end portion.
  • the width W2 of the bent portion 135 in the portion along the imaginary line CL1 is the minimum width of the bent portion 135. Therefore, when the dielectric substrate 105 is bent, stress is likely to be concentrated on the portion where the width of the bent portion 135 is minimum, and as a result, the bent portion 135 bends along the virtual line CL1.
  • each of the slits (first portion 150B1, second portion 150B2) formed along the X-axis direction is along the imaginary line CL2, and is more than the both ends of the slit.
  • a recess 152 is formed so that the slit opening is wide.
  • the width of the bent portion 135 in the portion where the concave portion 152 is formed is minimized, so that when the dielectric substrate 105 is bent, stress is likely to be concentrated in the portion where the concave portion 152 is formed, and the bent portion 135 is formed. Bends along an imaginary line CL2.
  • the bending position can be adjusted by devising the slit shape.
  • FIG. 12 is a perspective view showing an antenna module 100A of the first modification.
  • the cutout 136 is provided only between the two power supply elements 121 in the center of the four power supply elements 121, and the bent portion 135 has the cutout 136. And are formed at the positions of both ends of the flat portion 131 in the Y-axis direction. That is, in the antenna module 100A, the two feeding elements 121 are formed on each of the two protruding portions 133A.
  • the notch 136 includes between the first and second feeding elements 121 of the four feeding elements 121, and the third feeding element 121.
  • the bent portion 135 is formed between the fourth feeding elements 121, and the bent portion 135 is formed at the position of the cutout portion 136. That is, in the antenna module 100B, one feeding element 121 is arranged on the protruding portions 133B at both ends of the flat portion 131, and two feeding elements 121 are arranged on the protruding portion 133C in the central portion. ..
  • the antenna module 100A of the modification 1 and the antenna module 100B of the modification 2 are different in size of the dielectric substrate 105 and the ground electrode GND in the flat part 131 from the antenna module 100 due to the difference in the formation position of the notch 136.
  • the shapes are different. As described above, when the size and the shape of the dielectric substrate 105 and the ground electrode GND are different, the distribution of the current flowing through the ground electrode GND changes, and the directivity of the antenna array formed by the feeding elements 121 arranged in the flat portion 131 is changed. Can change. Therefore, by changing the position where the notch 136 is formed, the degree of freedom in designing the directivity is increased, and the desired antenna characteristic can be realized.
  • one of the protrusions 133A corresponds to the “first protrusion” of the present disclosure
  • the other of the protrusions 133A corresponds to the “second protrusion” of the present disclosure
  • one of the protrusions 133B and 133C corresponds to the “first protrusion” of the present disclosure
  • the other of the protrusions 133B and 133C is the “second protrusion” of the present disclosure.
  • the thickness of the dielectric substrate is thinner than the flat portion 131 and the flat portion 130 along the inner surfaces of the flat portion 131 and the flat portion 130 (that is, the surface facing the mounting substrate 20).
  • the shape and arrangement of the bent portion may be other configurations.
  • the bent portion 135A is formed along the outer surface (that is, the surface not facing the mounting substrate 20) of the flat portion 131 and the flat portion 130. .. Note that the bent portion 135A also has a thinner dielectric substrate than the flat portion 131 and the flat portion 130.
  • the radius of curvature of the bent portion can be increased, so that the stress applied to the bent portion can be reduced and damage to the bent portion can be suppressed. be able to. Further, since the space between the bent portion and the mounting board can be widened, damage to the bent portion due to contact with the mounting board can be suppressed.
  • a bent portion may be formed so that intermediate positions in the thickness direction of the flat portion 131 and the flat portion 130 are connected to each other.
  • each flat portion and the bent portion has sufficient flexibility, it is not always necessary to make the thickness of the bent portion thinner than that of the flat portion 130 and the flat portion 131. ..
  • the thickness of the bent portion 135B is the same as that of the flat portion 130 and the flat portion 131.
  • the step of shaving the dielectric substrate in the portion corresponding to the bent portion can be omitted, so that the manufacturing process can be simplified and the cost can be reduced. Further, it becomes possible to secure the durability of the bent portion 135B.
  • Embodiment 1 Modifications of Single Antenna: Modifications 5 and 6
  • Embodiment 1 and Modifications 1 to 4 all have been described for the case of an antenna array in which a plurality of feeding elements are arranged. However, the features disclosed in Embodiment 1 are that only one feeding element is provided. It is also applicable to the arranged antenna modules.
  • FIG. 16 is a perspective view of an antenna module 100E of the fifth modification.
  • one feeding element 121 is arranged on the flat portion 131.
  • Only one protruding portion 133 is formed on the flat portion 131, and at least a part of the power feeding element 121 is arranged on the protruding portion 133.
  • the flat portion 131 and the flat portion 130 are connected by the bent portions 135 formed at both ends of the flat portion 131 in the Y-axis direction.
  • connection strength between the flat portion 131 and the flat portion 130 can be secured, as in the antenna device 120F of the antenna module 100F of the modification 6 of FIG. It may be formed at one end of the portion 131 in the Y-axis direction.
  • FIGS. 16 and 17 an example of a configuration in which the feeding element 121 is not formed in the flat portion 130 is shown, but as shown by the broken lines in FIGS.
  • the feeding element 121 may be provided in the unit 130 as well.
  • FIG. 18 is a perspective view of antenna module 100G according to the second embodiment.
  • the antenna module 100G includes an antenna device 120G and an RFIC 110.
  • the antenna device 120G includes flat portions 130 and 131 and a bent portion 135 that form the dielectric substrate 105, similarly to the antenna device 120 of the first embodiment.
  • the dielectric substrate 105 has a substantially L-shaped cross section.
  • the flat portion 130 having the Z-axis direction as the normal direction and the flat portion 131 having the X-axis direction as the normal direction are connected by the bent portion 135.
  • the flat portion 131 has a substantially rectangular shape, and the four feeding elements 121 are arranged in a line on the surface thereof.
  • the flat portion 130 has a structure in which a plurality of cutouts 137 are formed on a substantially rectangular dielectric substrate, and the bent portions 135 are connected to the cutouts 137.
  • a direction from the boundary portion 134A where the bent portion 135 and the flat portion 130 are connected to the flat portion 131 along the flat portion 130 that is, X A protrusion 133D that protrudes in the positive direction of the shaft
  • the position of the projecting end of the projecting portion 133D is located in the positive direction of the X axis with respect to the inner surface side of the flat portion 131 (the side facing the mounting substrate 20).
  • each projecting portion 133D is formed corresponding to the four feeding elements 121 arranged on the flat portion 131. Then, one feeding element 121 is arranged for each of the protrusions 133D. Each power feeding element 121 in the flat portion 131 is arranged so that at least a part thereof overlaps the protruding portion 133D.
  • the feeding element 121 of the flat portion 130 can be arranged in the area AR1 of the corner portion of the housing in the comparative example shown in FIG. Therefore, it is possible to effectively utilize the limited space in the communication device.
  • the dimension in the X-axis direction is shorter than that in the antenna device 120 of the first embodiment, but the dimension in the Z-axis direction is longer.
  • the configuration such as the antenna module 100G is effective when there are relatively few restrictions on the dimension of the communication device 10 in the thickness direction, but there are restrictions on the mounting position on the mounting board 20.
  • the area of the bezel portion around the display screen has tended to be narrowed in order to increase the screen size of smartphones. In such a case, with the configuration like the antenna module 100G, it becomes possible to arrange the feeding element 121 on the side of the flat portion 130 as close to the end portion of the housing as possible.
  • the flat portion 130 corresponds to the “first flat portion” of the present disclosure
  • the flat portion 131 corresponds to the “second flat portion” of the present disclosure
  • the surface located outside the flat portion 131 corresponds to the “first surface” of the present disclosure
  • the surface located inside the flat portion 131 corresponds to the “second surface” of the present disclosure.
  • one of the protrusions 133D corresponds to the “first protrusion” of the present disclosure
  • the other protrusions 133D correspond to the “second protrusion” of the present disclosure.
  • one of the protrusions 133D formed on the flat portion 130 corresponds to the “first protrusion” of the present disclosure
  • the other protrusion 133D corresponds to the “second protrusion” of the present disclosure.
  • one of the feeding elements 121 arranged in the flat portion 130 corresponds to the “first radiating element” of the present disclosure
  • the other feeding elements 121 arranged in the flat portion 130 are Corresponds to the “second radiating element” of the present disclosure.
  • each of the power feeding elements 121 arranged on the flat portion 131 corresponds to the “third radiating element” of the present disclosure.
  • FIG. 19 is a diagram for explaining the slit shape formed in the manufacturing process of the antenna module 100G of FIG.
  • a concave portion is formed by laser processing or the like in a portion where the bent portion 135 is formed.
  • a slit 150 penetrating in the thickness direction of the dielectric substrate 105 is formed at a boundary portion between the protruding portion 133D and the bent portion 135 in the flat portion 130.
  • the shape as shown in FIG. 18 can be realized.
  • variations of the shape shown in FIGS. 8 to 11 may be applied.
  • FIG. 20 is a perspective view of antenna module 100H according to the third embodiment.
  • the protrusions 133 and 133D are formed on the two flat portions 130 and 131, respectively.
  • the protrusion 133D is formed at a position corresponding to the protrusion 133, and the bent portion 135 is formed between the notch 137 of the flat portion 130 and the notch 136 of the flat portion 131. ..
  • the power feeding element 121 is arranged at a position where at least a part of the flat portion overlaps the protruding portion.
  • the antenna device can be placed in the limited space inside the communication device. Further, since the dimensions of the antenna device in the X-axis direction and the Z-axis direction can be shortened, it is possible to contribute to downsizing of the antenna module and the communication device.
  • the flat portion 131 corresponds to the “first flat portion” of the present disclosure
  • the flat portion 130 corresponds to the “second flat portion” of the present disclosure.
  • one of the protrusions 133 corresponds to the “first protrusion” of the present disclosure
  • the protrusion 133D corresponds to the “third protrusion” of the present disclosure.
  • FIG. 21 is a diagram for explaining the slit shape formed in the manufacturing process of the antenna module 100H in FIG.
  • the protruding portion 133D of the flat portion 130 and the protruding portion 133 of the flat portion 131 are formed to face each other.
  • a slit 150 penetrating in the thickness direction of the dielectric substrate 105 is formed at the boundary between the bent portion 135 and each protruding portion.
  • both protrusions are formed so as to face each other, as described with reference to FIG.
  • the position of the protruding end of one protruding portion does not reach the surface of the other protruding portion when the dielectric substrate is bent. Therefore, when the antenna module is incorporated in the housing, a small but unutilized space may remain in the corner portion of the housing.
  • FIG. 22 is a perspective view of antenna module 100I according to the fourth embodiment.
  • the flat portions 130 and 131 are provided with the protrusions 133E and 133F, respectively.
  • each projecting portion is formed at a position such that the projecting end thereof enters into the notch of the other flat portion.
  • the protrusions are formed so that the protrusions 133E and the protrusions 133F are alternately arranged.
  • the bent portion 135 is formed between the protruding portion 133E and the protruding portion 133F.
  • the power feeding element 121 is arranged at a position where at least a part of the flat portion overlaps the protruding portion. That is, the feeding element 121 of the flat portion 130 and the feeding element 121 of the flat portion 131 are arranged in a zigzag shape.
  • the dimensions of the antenna module in the Y-axis direction become slightly longer, but the dimensions in the X-axis direction and the Z-axis direction can be shortened. Further, it is possible to incorporate the device in the housing without leaving an extra space in the corner portion of the housing. Therefore, it is possible to effectively utilize the limited space in the communication device and contribute to downsizing of the antenna module and the communication device.
  • the flat portion 131 corresponds to the “first flat portion” of the present disclosure
  • the flat portion 130 corresponds to the “second flat portion” of the present disclosure
  • the protrusion 133E corresponds to the “first protrusion” of the present disclosure
  • the protrusion 133F corresponds to the “third protrusion” of the present disclosure.
  • FIG. 23 is a diagram for explaining the slit shape formed in the manufacturing process of the antenna module 100I of FIG.
  • the protrusions 133E of the flat portion 130 and the protrusions 133F of the flat portion 131 are formed so as to be alternately arranged.
  • the position of the protruding end of the protruding portion 133E is offset from the position of the protruding end of the protruding portion 133F in the positive direction of the X axis.
  • a slit 150 penetrating in the thickness direction of the dielectric substrate 105 is formed at the boundary between the bent portion 135 and each protruding portion.
  • the protrusion 133E when the dielectric substrate 105 is bent, the protrusion 133E can be arranged between the two protrusions 133F, and the shape of the antenna device 120I as shown in FIG. Can be realized.
  • the shape of the slit variations of the shape shown in FIGS. 8 to 11 may be applied.
  • Embodiments 1 to 4 the example of the antenna module capable of radiating radio waves in two directions has been described.
  • an example of an antenna module that can radiate radio waves in three directions will be described.
  • FIG. 24 is a perspective view of antenna module 100J according to the fifth embodiment.
  • the flat portion 130 having the Z-axis direction as the normal direction is in the shape of a substantially square flat plate, and is formed on the side along the Y-axis.
  • a flat portion 131A is also formed on the side along the X axis.
  • the flat portion 131A has the same shape as the flat portion 131, and has a plurality of protruding portions 133G.
  • the flat portion 131A is connected to the flat portion 130 by the bent portion 135C.
  • the power feeding element 121 is arranged so that at least a part thereof overlaps the protruding portion 133G.
  • the flat portion 131A corresponds to the “third flat portion” in the present disclosure.
  • the bent portion 135C corresponds to the “second bent portion” of the present disclosure
  • the protruding portion 133G corresponds to the “fourth protruding portion” of the present disclosure.
  • each of the power feeding elements 121 arranged on the flat portion 131A corresponds to the “fourth radiating element” of the present disclosure.
  • FIG. 25 is a diagram for explaining the radiation direction of radio waves when the antenna module 100J of FIG. 24 is mounted in the housing 30.
  • the antenna module shown in FIG. 24 is arranged at each of the diagonal corners of the substantially rectangular parallelepiped housing 30.
  • the two antenna modules 100J1 and 100J2 are arranged such that the flat portions 130 face opposite directions.
  • radio waves are radiated from the antenna module 100J1 in the positive directions of the X-axis, Y-axis, and Z-axis (that is, the X1, Y1, and Z1 directions), and from the antenna module 100J2, the X-axis, Y-axis, and Z-axis.
  • the radio waves are radiated in the negative direction of (i.e., X2, Y2, and Z2 directions). Therefore, in such a communication device, it is possible to radiate radio waves in all directions.
  • the antenna device 120J3 may be configured to radiate radio waves in three directions: the positive direction of the X axis, the negative direction of the X axis, and the Z axis direction.
  • the flat portion 131J is formed on the side of the flat portion 130 opposite to the side on which the flat portion 131 is formed.
  • the flat portion 131J has the same shape as the flat portion 131, and has a plurality of protruding portions 133J.
  • the flat portion 131J is connected to the flat portion 130 by the bent portion 135J.
  • the feeding element is arranged so that at least a part thereof overlaps the protrusion 133J. Radio waves are radiated in the negative direction of the X axis from the power feeding element arranged in the flat portion 131J.
  • each feeding element radiates radio waves in one frequency band
  • a so-called single band type antenna device and one feeding element for each feeding element.
  • An example of a single polarization type antenna device to which a high frequency signal is supplied has been described.
  • the features of the present disclosure include a dual-band type antenna device capable of radiating radio waves in two frequency bands from a radiating element, and a dual-polarization type antenna device capable of radiating radio waves in two polarization directions from a radiating element. It can also be applied to an antenna device.
  • FIG. 27 is a perspective view of antenna module 100K according to the sixth embodiment.
  • the shape of the dielectric substrate 105 is the same as that of the first embodiment, but the radiating element arranged on each flat portion is the feeding element 121. It is composed of a parasitic element 122.
  • the parasitic element 122 has a size larger than that of the feeding element 121. Then, when viewed from the normal direction of each flat portion, the parasitic element 122 is arranged on the inner layer side of the dielectric substrate 105 with respect to the feeder element 121 so as to overlap the feeder element 121. Then, the power supply wiring (not shown) penetrates the parasitic element 122 and is connected to the power supply element 121. With such a configuration of the radiating element, it is possible to radiate radio waves in different frequency bands from the feeding element 121 and the parasitic element 122.
  • each feeding element 121 by connecting the feeding wiring from the RFIC 110 to the two feeding points SP1 and SP2, two electric waves having different polarization directions are radiated from each of the feeding element 121 and the parasitic element 122. can do.
  • the radiating element of the flat portion 130 radiates a radio wave having the X-axis direction as the polarization direction and a radio wave having the Y-axis direction as the polarization direction in the Z-axis direction.
  • the radiating element of the flat portion 131 radiates a radio wave having a Y-axis direction as a polarization direction and a radio wave having a Z-axis direction as a polarization direction in the X-axis direction.
  • the example of the dual-band and dual-polarization type antenna module is described, but the dual-band and single-polarization type antenna module may be used, or the single-band and dual-polarization type antenna module may be used. It may be an antenna module. Further, the form of the radiating element arranged on the flat part 130 and the form of the radiating element arranged on the flat part 131 may be different.
  • a protrusion is formed on at least one flat portion, and at least a part of the protrusion overlaps the protrusion.
  • FIG. 28 is a sectional view of a first example antenna module 100L1 according to the seventh embodiment.
  • the antenna device 120L of the antenna module 100L1 is directly connected to the mounting board 20 via the solder bumps 145.
  • the RFIC 110A is arranged on the inner surface of the flat portion 131 of the dielectric substrate 105 (that is, the surface facing the mounting substrate 20).
  • at least a part of the RFIC 110A is arranged in the protruding portion 133 protruding from the flat portion 131.
  • the RFIC does not necessarily have to be arranged in the protruding portion 133, but is configured to be arranged in a portion other than the protruding portion 133 in the flat portion 131 like the RFIC 110B of the antenna module 100L2 shown in FIG. May be.
  • a high-frequency signal is supplied from the RFIC 110A (or RFIC 110B) to the power supply element 121 on the flat portion 130 side through the power supply wiring 170A. Further, a high frequency signal is supplied to the power feeding element 121 on the flat portion 131 side through the power feeding wiring 170B. Although not shown, a signal is transmitted from the mounting board 20 to the RFICs 110A and 110B via the bent portion 135.
  • the antenna module can be made thin when the size in the thickness direction (Z-axis direction) of the device housing the antenna module is limited. It becomes possible to do.
  • FIG. 30 is a sectional view of antenna module 100M according to the eighth embodiment.
  • the feeding element 121 arranged on the flat portion 131 side is arranged at a position other than the protruding portion 133 on the flat portion 131.
  • the protrusion is not formed as shown in FIG. 5, since the ground electrode GND is bent, the radiation direction of the radio wave from the power feeding element 121 at the connection portion between the flat portion 131# and the bent portion 135# is changed. There is a possibility that the antenna characteristics are degraded because the antenna is tilted toward the positive direction of the Z axis rather than the positive direction of the X axis.
  • the protruding portion 133 as in the antenna module 100M of FIG. 30, it is possible to secure the flatness of the ground electrode GND in the portion where the power feeding element 121 is arranged, and therefore, the radio wave from the power feeding element 121 is secured.
  • FIG. 31 is a cross-sectional view of antenna module 100N according to the ninth embodiment.
  • the antenna device 120N in the antenna module 100N includes a base substrate 210, a first antenna substrate 220, and a second antenna substrate 230.
  • the base substrate 210 includes a dielectric 211 and a ground electrode GND.
  • the base substrate 210 has a substantially L-shaped cross-section, and includes a flat plate-shaped flat portion 130N whose normal direction is the Z-axis direction and a flat-plate-shaped flat portion 131N whose normal line direction is the X-axis direction. , And a bent portion 135N connecting the flat portion 130N and the flat portion 131N.
  • the flat portion 131N is formed with the protruding portion 210A protruding in the Z-axis direction from the boundary portion between the flat portion 131N and the bent portion 135N. ..
  • the ground electrode GND is also formed on the protrusion 210A.
  • the RFIC 110 is connected to the lower surface side (the surface in the negative direction of the Z axis) of the flat portion 130N.
  • the RFIC 110 is mounted on the front surface 21 of the mounting board 20 via the solder bumps 140.
  • the first antenna substrate 220 is mounted on the flat portion 130N via the solder bumps 145.
  • the second antenna substrate 230 is mounted on the flat portion 131N via the solder bumps 146.
  • the feeding element 121 is arranged on the flat plate-shaped dielectric body 221.
  • a high-frequency signal from the RFIC 110 is supplied to the power feeding element 121 of the first antenna substrate 220 via the power feeding wiring 170B, and thereby radio waves are radiated in the Z-axis direction.
  • the power supply wiring 170B extends from the RFIC 110 through the flat portion 130N of the base substrate 210, after passing through the solder bump 145, and further through the dielectric 221 to reach the power feeding element 121 of the first antenna substrate 220.
  • the feeding element 121 is arranged on the flat plate-shaped dielectric body 231.
  • a high-frequency signal from the RFIC 110 is supplied to the power feeding element 121 of the second antenna substrate 230 via the power feeding wiring 171B, and thereby a radio wave is radiated in the X axis direction.
  • the power supply wiring 171B extends from the RFIC 110 inside or on the surface of the flat portion 130N and the bent portion 135N of the base substrate 210 to reach the flat portion 131N. Further, the power feeding wiring 171B passes through the solder bump 146, penetrates the dielectric 231 and reaches the power feeding element 121 of the second antenna substrate 230. At least a part of the feeding element 121 of the second antenna substrate 230 is arranged at a position facing the protruding portion 210A of the base substrate 210.
  • the bent portion is also formed in the antenna module having the configuration in which the base substrate 210 having the bent portion 135N and the first antenna substrate 220 and the second antenna substrate 230 on which the feeding elements 121 are arranged are individually formed.
  • the power feeding element 121 can be arranged in a region inside the corner portion of the housing (region AR1 in FIG. 5).
  • the size of the antenna module as a whole in the Z-axis direction can be reduced while maintaining the size of the feeding element 121. Therefore, it is possible to arrange the antenna module in a limited space in the communication device while suppressing a decrease in antenna characteristics. It is possible to provide a miniaturized antenna module.
  • FIG. 32 is a perspective view of antenna module 100P according to the tenth embodiment.
  • 33 is a cross-sectional view of the antenna module 100P.
  • the antenna module 100P has a configuration obtained by further modifying the antenna module 100B of the second modification shown in FIG. Specifically, in the antenna device 120P of the antenna module 100P, the cutout portion 180 is formed at the end of the flat portion 130 of the dielectric substrate 105, and the protruding portion 133P of the flat portion 131 corresponding to the cutout portion 180.
  • the dimension (length in the Z-axis direction) is longer than that in the second modification.
  • a part of the slit 150 is formed so as to project to the region of the flat portion 130.
  • the amount of protrusion of the protrusion 133P of the flat portion 131 can be secured, and the tip of the protrusion 133P can be made higher than the upper surface of the dielectric of the flat portion 130, as shown in FIG.
  • the position of the tip of the protruding portion does not necessarily have to be above the flat portion 130. That is, as in the antenna module 100P1 of FIG. 34, the tip of the protruding portion 133P1 may be positioned lower than the upper surface of the flat portion 130, or as in the antenna module 100P2 of FIG. It may be aligned with the upper surface of the flat portion 130.
  • connection portion between the flat portion 130 and the bent portion 135 is formed into an arc shape to suppress the decrease in bendability.
  • FIG. 36 is a perspective view of antenna module 100Q according to the eleventh embodiment.
  • the connection portion between the flat portion 130 and the bent portion 135 in the flat portion 130 of the substantially L-shaped antenna module is cut into an arc shape to form a recess 181.
  • the bending portion 135 is formed by reducing the thickness of the dielectric, or when the laser processing for forming the slit 150 is performed, the bending portion 135 side is caused by a position shift or the like. In some cases, unprocessed parts may occur and the dielectric may become thicker than the desired thickness. When such a processing residue is generated, the flexibility of the portion is deteriorated, and the stress concentration caused thereby may lead to disconnection of the power supply wiring.
  • the arc-shaped recess 181 is formed in the connecting portion between the flat portion 130 and the bent portion 135, so that the unprocessed portion on the bent portion 135 side can be suppressed.
  • laser processing may be used when forming the flat portions 130 and 131 of the dielectric substrate 105.
  • the dielectric is also removed by the laser from the peripheral portion of the desired opening position in order to surely form the opening on the upper surface side.
  • the processing is finished when the opening portion penetrates to the lower surface, and as a result, the size of the upper surface side opening tends to be larger than the size of the lower surface side opening. .. That is, the end surface from which the dielectric material has been removed is not perpendicular to the main surface of the dielectric substrate, and may have a taper shape to some extent.
  • the removal width of the surface of the dielectric substrate on the side closer to the laser irradiation source tends to be wider than the removal width of the surface on the side far from the irradiation source. Therefore, the taper shape of the end face is different between when the laser is applied from the front side of the dielectric substrate and when the laser is applied from the back side of the dielectric substrate.
  • FIG. 37 is a sectional view of a first example antenna module 100R according to the twelfth embodiment.
  • the antenna module 100R is an example in which the laser is irradiated from the surface (that is, the surface on which the power feeding element 121 is arranged) side when forming the dielectric substrate 105. Therefore, in the antenna module 100R, the dimension of the surface on which the power feeding element 121 is arranged is smaller than the dimension of the surface on which the ground electrode GND is arranged.
  • the antenna module 100S of the second example shown in FIG. 38 is an example in which the laser is irradiated from the back surface (that is, the surface on which the ground electrode GND is arranged) side when the dielectric substrate 105 is formed. .. Therefore, in the antenna module 100S, the dimension of the surface on which the power feeding element 121 is arranged is larger than the dimension of the surface on which the ground electrode GND is arranged.
  • the antenna module 100T has a configuration in which the bent portion 135T is bent from the flat portion 130 in the positive direction of the Z axis, and the flat portion 131 is connected to the bent portion 135T. That is, the flat portion 131 has a shape projecting in the positive Z-axis direction from the flat portion 130. A protruding portion 133 is formed in the negative direction of the Z axis from the connecting portion between the bent portion 135T and the flat portion 131. With such a configuration, when the space above the flat portion 130 (in the positive direction of the Z axis) has a margin, the power feeding element 121 can be arranged in the region of the corner portion of the housing.
  • the bent portion 135U is formed on the surface side of the flat portion 130 where the power feeding element is arranged, the bent portion 135U is bent on the side opposite to the mounting substrate 20. It may be configured to.
  • the bent portion 135V may be bent about 180° from the flat portion 130 in the positive direction of the Z axis.
  • the bent portion 135W may be bent from the flat portion 130 in the negative direction of the Z axis by about 180°.
  • bent portion is bent by about 180°
  • bent angle of the bent portion can be appropriately selected between 90° and 180°.
  • FIG. 43 is a perspective view of antenna device 120X of antenna module 100X according to the fifteenth embodiment.
  • the dielectric substrate 105X includes a flat portion 131X1 whose normal direction is the X-axis direction, a flat portion 131X2 whose normal direction is the Y-axis direction, and a bent portion 135X.
  • the flat portion 131X2 is connected to the flat portion 131X2 by the bent portion 135X.
  • a protrusion 133X is formed in the positive direction of the X-axis from the connecting portion between the flat portion 131X2 and the bent portion 135X.
  • Such an antenna device 120X is arranged, for example, at a corner of the side surface of the mounting board.
  • a plurality of feeding elements 121 are arranged in each of the flat portions 131X1 and 131X2. Therefore, radio waves are radiated from the antenna module 100X in two directions, the positive direction of the X axis and the positive direction of the Y axis. Then, in the flat portion 131X2, at least a part of the power feeding element 121 arranged at the position closest to the flat portion 131X1 is arranged so as to overlap the protruding portion 133X. With such a configuration, it is possible to utilize the space of the corner formed by the adjacent side surfaces of the housing.
  • the configuration in which the radiating element is arranged in the flat portion has been described, but in addition to this, another radiating element may be formed on the front surface and/or the back surface of the bent portion.
  • another radiating element may be formed on the front surface and/or the back surface of the bent portion.
  • a flat patch antenna but also a linear antenna such as a monopole antenna and a dipole antenna may be formed as the radiating element.
  • the features of the above-described embodiments can be appropriately combined within a range where no contradiction occurs.
  • 10 communication device 20 mounting board, 21 surface, 22 side surface, 30 housing, 100, 100A-100N, 100P-100X antenna module, 105, 105X dielectric board, 110, 110A, 110B RFIC, 111A-111D, 113A- 113D, 117 switch, 112AR to 112DR low noise amplifier, 112AT to 112DT power amplifier, 114A to 114D attenuator, 115A to 115D phase shifter, 116 signal combiner/splitter, 118 mixer, 119 amplification circuit, 120, 120A to 120N , 120P to 120X antenna device, 121 feeding element, 122 parasitic element, 130, 130N, 131, 131A, 131J, 131N, 131X flat portion, 133, 133A to 133G, 133J, 133P to 133S, 133X protruding portion, 134, 134A boundary part, 135, 135A to 135C, 135J, 135N, 135

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

L'invention concerne un module d'antenne (100) qui comprend un substrat diélectrique (105) et des éléments rayonnants (121) disposés sur le substrat diélectrique (105). Le substrat diélectrique (105) comprend une partie plate (131) et une partie plate (130) ayant des directions normales différentes l'une de l'autre, et une partie incurvée (135) reliant la partie plate (131) et la partie plate (130). La partie plate (131) présente des parties saillantes (133) qui font partiellement saillie vers la partie plate (130), le long de la partie plate (131), à partir d'une partie frontière (134) entre la partie incurvée (135) et la partie plate (131). La partie plate (131) et la partie incurvée (135) sont reliées en des positions, dans la partie plate (131), au niveau desquelles il n'y a pas de partie saillante (133). Au moins une partie de chaque élément rayonnant (121) est disposée sur une partie saillante (133).
PCT/JP2020/002731 2019-02-20 2020-01-27 Module d'antenne, dispositif de communication sur lequel un module d'antenne est monté, et procédé de fabrication de module d'antenne WO2020170722A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020207023503A KR102197563B1 (ko) 2019-02-20 2020-01-27 안테나 모듈, 및 그것을 탑재한 통신 장치, 그리고 안테나 모듈의 제조 방법
JP2020530548A JP6773259B1 (ja) 2019-02-20 2020-01-27 アンテナモジュールおよびそれを搭載した通信装置、ならびにアンテナモジュールの製造方法
KR1020207036807A KR102241159B1 (ko) 2019-02-20 2020-01-27 안테나 모듈, 및 그것을 탑재한 통신 장치, 그리고 안테나 모듈의 제조 방법
CN202080002614.7A CN112106250B (zh) 2019-02-20 2020-01-27 天线模块和搭载该天线模块的通信装置以及天线模块的制造方法
KR1020217010743A KR102599495B1 (ko) 2019-02-20 2020-01-27 안테나 모듈, 및 그것을 탑재한 통신 장치, 그리고 안테나 모듈의 제조 방법
US17/021,069 US11108157B2 (en) 2019-02-20 2020-09-15 Antenna module, communication device equipped with the same, and manufacturing method of antenna module
US17/389,592 US11611147B2 (en) 2019-02-20 2021-07-30 Antenna module, communication device equipped with the same, and manufacturing method of antenna module
US18/169,435 US12009608B2 (en) 2019-02-20 2023-02-15 Antenna module, communication device equipped with the same, and manufacturing method of antenna module

Applications Claiming Priority (4)

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JP2019-027976 2019-02-20
JP2019027976 2019-02-20
JP2019-190354 2019-10-17
JP2019190354 2019-10-17

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US (2) US11108157B2 (fr)
JP (2) JP6773259B1 (fr)
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US20230198152A1 (en) 2023-06-22
KR102241159B1 (ko) 2021-04-16
CN113540776A (zh) 2021-10-22
US20210359416A1 (en) 2021-11-18
KR20210118053A (ko) 2021-09-29
CN112106250A (zh) 2020-12-18
US20210028546A1 (en) 2021-01-28
KR102197563B1 (ko) 2020-12-31
JP2021069109A (ja) 2021-04-30
KR102599495B1 (ko) 2023-11-08
CN112106250B (zh) 2021-07-09
KR20200145853A (ko) 2020-12-30
JP6947272B2 (ja) 2021-10-13
US11611147B2 (en) 2023-03-21
JP6773259B1 (ja) 2020-10-21
KR20200103844A (ko) 2020-09-02
US11108157B2 (en) 2021-08-31

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