WO2020156486A1 - 光学传感器组装体 - Google Patents

光学传感器组装体 Download PDF

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Publication number
WO2020156486A1
WO2020156486A1 PCT/CN2020/074012 CN2020074012W WO2020156486A1 WO 2020156486 A1 WO2020156486 A1 WO 2020156486A1 CN 2020074012 W CN2020074012 W CN 2020074012W WO 2020156486 A1 WO2020156486 A1 WO 2020156486A1
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WO
WIPO (PCT)
Prior art keywords
optical sensor
optical
sensor assembly
light
optical fibers
Prior art date
Application number
PCT/CN2020/074012
Other languages
English (en)
French (fr)
Inventor
闵丙日
Original Assignee
虹软科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 虹软科技股份有限公司 filed Critical 虹软科技股份有限公司
Priority to CN202080011174.1A priority Critical patent/CN113348393B/zh
Priority to US17/426,088 priority patent/US11768104B2/en
Priority to JP2021544226A priority patent/JP7222105B2/ja
Publication of WO2020156486A1 publication Critical patent/WO2020156486A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4204—Photometry, e.g. photographic exposure meter using electric radiation detectors with determination of ambient light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0425—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using optical fibers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3664—2D cross sectional arrangements of the fibres
    • G02B6/3668—2D cross sectional arrangements of the fibres with conversion in geometry of the cross section
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/40—Mechanical coupling means having fibre bundle mating means
    • G02B6/403—Mechanical coupling means having fibre bundle mating means of the ferrule type, connecting a pair of ferrules

Definitions

  • the invention relates to an optical sensor.
  • Optical sensors are used not only in portable electronic devices such as mobile phones or tablets, but also in video electronic devices such as TVs or displays.
  • the optical sensor includes, for example, an illuminance sensor, a proximity sensor, and a proximity illuminance sensor.
  • the proximity sensor is an optical sensor that measures the distance between the user and the electronic device
  • the illuminance sensor is an optical sensor that senses the brightness around the electronic device.
  • a proximity illuminance sensor that combines an optical proximity sensor and an illuminance sensor has two sensors in a single package.
  • the object of the present invention is to provide an optical sensor assembly, which can be applied to an electronic device having a design in which the display occupies the entire front surface.
  • an optical sensor assembly is provided.
  • a plurality of optical fibers here, one end of the plurality of optical fibers is arranged in a row, and the other end of the plurality of optical fibers is laminated in two or more rows, so that all the optical fibers are
  • the width of the first surface formed by the one end is greater than the width of the second surface formed by the other end of the plurality of optical fibers, and includes a sensor connector optically combined with the second surface, the first The surface receives light incident to the inside of the electronic device, the light received by the first surface is transmitted through the second surface to the sensor connector, and the sensor connector can be separated from the first surface and is disposed in Inside the electronic device.
  • the plurality of optical fibers may be plastic optical fibers (POF, Plastic optical fibers).
  • the plurality of optical fibers may include: a horizontal arrangement section, which makes one end of the plurality of optical fibers arranged in a row; a vertical arrangement section, which makes the other end of the plurality of optical fibers according to two or more Column configuration; and a deformation section, which connects the horizontal arrangement section and the vertical arrangement section, and makes the plurality of optical fibers bend.
  • the second surface may be formed such that the other end of the optical fiber is stacked in the same number in each column.
  • the second surface is formed such that the other end of the optical fiber is stacked in more than three rows, and at least the number of the other end stacked in any one column can be the same as the number of the other end stacked in the remaining columns different.
  • the first surface may be configured in the space between the frame of the electronic device and the display panel.
  • the sensor connector may include: a male interface that allows the other ends of the plurality of optical fibers to be inserted and fixed inside; a female interface that houses the male interface inside; and an optical sensor It is combined with the female interface in a direction toward the male interface.
  • the optical sensor may include: a substrate, which allows a plurality of truncated through holes to be arranged on the side; an optical sensor chip, which is arranged on the substrate and is electrically connected to the plurality of truncated through holes. Connection; and light-emitting diodes, which are arranged separately from the optical sensor chip on the upper surface of the substrate, and are electrically connected to the plurality of cut-off through holes.
  • the female interface may further include a separation wall that optically separates the optical sensor chip and the light emitting diode.
  • the male interface may further include a separation wall that optically separates the optical sensor chip and the light emitting diode.
  • the optical sensor may further include a translucent mirror for the optical sensor disposed on the upper part of the optical sensor chip.
  • it further includes a flat connector that accommodates the one end of the plurality of optical fibers inside, and the flat connector may provide an optical path that makes the optical path incident into the electronic device The light travels toward the end.
  • the flat connector may include: a cover having a hemispherical groove formed therein, the hemispherical groove receiving at least a part of the optical fiber; and a support body configured with the plurality of optical fibers, and It is fastened to the cover to fix the plurality of optical fibers.
  • a mirror is further included, and the mirrors are respectively arranged obliquely with respect to the plurality of optical fibers and the optical path.
  • one end of the plurality of optical fibers may be an inclined surface.
  • it may further include a vertical light guide plate, the vertical light guide plate is disposed on the optical path so as to be optically coupled to one end of the plurality of optical fibers, and the opposite side of the coupling area is an inclined surface.
  • it may further include a heat insulation component, which protects the plurality of optical fibers.
  • the plurality of optical fibers includes: an optical fiber for emitting light, which transmits detection light to the outside; and an optical fiber for light receiving, which transmits reflected detection light incident from the outside, the optical fiber for emitting light
  • the optical fiber for light receiving can be configured separately.
  • the optical sensor assembly according to the embodiment of the present invention may be applied to an electronic device having a design in which the display occupies the entire front surface.
  • the optical sensor assembly is arranged inside the electronic device, it can transmit external light to the optical sensor, so that the degree of freedom in design of the electronic device can be enhanced.
  • the optical sensor assembly may not be affected by the light emitted from the inside of the electronic device.
  • FIG. 1 is a diagram exemplarily showing an optical sensor assembly provided in an electronic device.
  • Fig. 2 is a diagram exemplarily illustrating the operating principle of the optical sensor assembly.
  • FIG. 3 is a diagram exemplarily illustrating an embodiment of an optical sensor assembly that realizes the operation principle of FIG. 2.
  • Fig. 4 is an exploded perspective view of the optical sensor assembly of Fig. 3.
  • Fig. 5 is a diagram exemplarily showing an embodiment of a sensor connector of the optical sensor assembly.
  • FIG. 6 is a diagram exemplarily showing the manufacturing and installation process of the sensor connector of the optical sensor assembly.
  • FIG. 7 is a diagram exemplarily showing another embodiment of the sensor connector of the optical sensor assembly.
  • FIG. 8 is a diagram exemplarily showing still another embodiment of the sensor connector of the optical sensor assembly.
  • FIG. 9 is a diagram exemplarily showing the optical sensor structure of the optical sensor assembly.
  • Fig. 10 is a diagram exemplarily showing one embodiment of a flat connector.
  • FIG. 11 is a diagram exemplarily showing various embodiments of the flat connector.
  • FIG. 12 is a diagram exemplarily showing another embodiment of the optical sensor assembly.
  • FIG. 13 is a diagram exemplarily showing still another embodiment of the optical sensor assembly.
  • FIG. 14 is a diagram exemplarily showing still another embodiment of the optical sensor assembly.
  • FIG. 1 is a diagram exemplarily showing an optical sensor assembly provided in an electronic device.
  • the optical sensor assembly 100 can eliminate the design limitation of the optical sensor that must be installed on the front of the electronic device 10 such as a smart phone.
  • the optical sensor assembly 100 may be disposed inside the electronic device 10, and the optical sensor included in the optical sensor assembly 100 may not be affected due to the light-emitting components inside the electronic device 10, for example, the display panel 13. Even if it is not exposed to the outside, the optical sensor may perform its original function through the optical sensor assembly 100. In other words, due to the optical sensor assembly 100, there is no need to dispose the optical sensor in a part of the front surface of the electronic device 10, so the display panel 13 can be disposed in the entire front surface.
  • the optical sensor provided in the electronic device 10 has a light receiving part such as a photodiode, and the light receiving part is provided under an optically transparent cover glass 12.
  • the light transmitted through the cover glass 12 reaches the light receiving part through the opening formed on the upper surface of the optical sensor, and is detected by the light receiving part.
  • the optical sensor also has a very small size.
  • a space is required between the frame 11 of the electronic device 10 and the display 13. This results in a reduction in the area that the display 13 can occupy.
  • Fig. 1 (a) is an electronic device mounted with a front display, and (b) is a cross-sectional view along "I-I".
  • a gap When observed with the naked eye, although it looks as if the display 13 is in close contact with the frame 11, there may be a gap of tens or even hundreds of um between the display 13 and the frame 11.
  • a groove is formed on a part of the side surface of the display 13, or a part of the side surface may be formed recessed.
  • Light may be incident through a gap or space 14 that occurs due to a design with tolerances in mind, and the space occurs due to the side structure of the display 13. However, the space 14 is too narrow to accommodate an optical sensor of a general structure.
  • FIG. 1(c) shows the optical sensor assembly 100 arranged in the space 14 between the frame 11 and the display 13.
  • One end of the optical sensor assembly 100 is so thin that it can be disposed in the space 14, and the other end may have an area covering at least a part of the upper surface of the optical sensor.
  • the optical sensor assembly 100 transmits through the cover glass 12 so that the light incident on the space 14 is transmitted to the optical sensor.
  • the optical sensor uses the transmitted light to detect the brightness around the electronic device, the distance between the electronic device and surrounding objects, and/or whether there are objects around the electronic device, etc.
  • the side surface of the display panel 13 may also transmit light. In particular, the light emitted from the display panel 13 can affect the optical sensor assembly 100.
  • the side surface of the display panel 13 may be formed or configured with a light-shielding structure 13'.
  • the light-shielding structure 13' may be a light-shielding substance laminated on the side surface of the display panel 13, for example.
  • the light-shielding structure 13' may be formed on the entire side surface where the optical sensor assembly 100 is arranged, or only on a part of the side surface.
  • the light shielding structure formed on the side surface can be extended along the screen of the display panel.
  • FIG. 2 is a diagram exemplarily illustrating the operating principle of the optical sensor assembly. For comparison, the operating principle of a general optical sensor 301 is also shown.
  • the optical sensor assembly 100 includes a light guide plate 25 having a first surface 20 on which light 24 enters and a second surface 21 on which light 26 exits.
  • the first face 20 and the second face 21 have different shapes. As shown, the first face 20 may be a thin and long rectangle, and the second face 21 may be a square. However, although a detailed description will be given below, the shapes of the first surface 20 and the second surface 21 are not limited to the exemplary rectangle or square. In addition, the area of the first surface 20 and the area of the second surface 21 may actually be the same. In other words, if the light loss caused by the light guide plate 25 is minimal, the brightness of the light 24 received by the first surface 20 and the brightness of the light 26 reaching the optical sensor 300 through the second surface 21 may actually be the same.
  • the lateral length (or width) of the first face 20 may be greater than the lateral length of the second face 21, and the longitudinal length (or thickness) of the first face 20 may be smaller than the longitudinal length of the second face 21.
  • the first surface 20 can receive light 24 incident in a predetermined angle range. Therefore, the detection range 23 corresponding to the first surface 20 expands as the distance D from the first surface 20 increases, and the shape of the detection area 23 can be kept almost similar to that of the first surface 20.
  • the detection range 29 is expanded.
  • the shape of the detection range 29 of the optical sensor 301 is determined according to the optical structure of the optical sensor 301, for example, the shape of a lens and/or an opening for light transmission, etc., and may actually be a circle or an ellipse shape. Because the lateral length of the first surface 20 is relatively larger than the width of the optical structure of the optical sensor 301, the width W 1d of the detection area 23 of the first surface 20 may be relatively larger than the width W 2d of the detection area 29 of the optical sensor 401.
  • the light guide plate 25 transmits light in two directions.
  • the second surface 21 may receive the light 27 generated by the optical sensor 300.
  • the light 28 emitted from the outside of the light guide plate 25 through the first surface 20 can be reflected by the object and return to the first surface 20 again.
  • the light path through which the light 24 received by the first surface 20 passes and the light path through which the light 27 received by the second surface 21 passes may be separated.
  • the light 27 received by the second surface 21 may be, for example, similar to near-infrared rays, light of a specific wavelength and/or pulse form of a predetermined frequency.
  • the light guide plate 25 can be implemented in various ways. Although the following description focuses on the embodiment of using multiple plastic optical fibers (POF, Plastic optical fiber) to realize the light guide plate 25, the light guide plate 25 can also be manufactured in the following manner: using a core similar to POF The properties of the material and the mold are injection molded. In addition, the light guide plate 25 can also be implemented by using a glass optical fiber (GOF) or a material having properties similar to the core of GOF. However, in the case of GOF, the shape of the optical fiber should be formed according to the shape of the light guide plate 25 by heat treatment or the like.
  • POF plastic optical fiber
  • FIG. 3 is a diagram exemplarily illustrating an optical sensor assembly that implements the operating principle of FIG. 2, and FIG. 4 is an exploded perspective view of the optical sensor assembly of FIG. 3.
  • the optical sensor assembly 100 includes a sensor connector 150 and a light guide plate 200. And optionally, the optical sensor assembly 100 may further include a flat connector 110.
  • the flat connector 110 may be combined with one end of the light guide plate 200 and the sensor connector 150 is combined with the other end of the light guide plate 200.
  • the light guide plate 200 may be composed of a plurality of optical fibers 210.
  • the optical fiber 210 includes a core that can transmit light through the inside, and a coating that protects the core, and the diameter of the core and the thickness of the coating can be various.
  • the optical fiber 210 has appropriate flexibility, and at least a portion of the light guide plate 200, for example, the horizontal arrangement section 220, can be bent.
  • the optical fiber 210 may be a POF, for example.
  • the light guide plate 200 includes a horizontal arrangement section 220, a deformation section 230, and a vertical arrangement section 240.
  • the horizontal arrangement section 220, the deformation section 230, and the vertical arrangement section 240 are used to distinguish the arrangement state of the optical fiber 210 (for example, the horizontal arrangement section 220 and the vertical arrangement section 240) and/or the area where the arrangement state is changed (for example, the deformation section 230). ), the sections 220, 230, and 240 are consecutive in order.
  • the length of each section 220, 230, 240 may be the same or different.
  • the width of each section 220, 230, and 240 decreases in order.
  • a plurality of optical fibers 210 may be arranged in a row.
  • a row when viewed in the longitudinal direction, it means that the plurality of optical fibers 210 are arranged on the same plane.
  • the one ends 211 of the plurality of optical fibers 210 are actually arranged on the same plane when viewed in the cross-sectional direction, so that the first surface 20 shown in FIG. 2 is formed.
  • the optical fiber 210 is actually a straight line in the longitudinal direction, at least a part of it may be curved or bent by external force because of its appropriate flexibility.
  • the general optical sensor 301 should directly contact the cover glass 12 or at least be located below the cover glass 12.
  • the optical sensor 300 included in the optical sensor assembly 100 is located in a position where light cannot reach, it can receive light through the light guide plate 200.
  • the bendable horizontal arrangement section 220 can determine the installation position of the optical sensor 300 more freely.
  • the plurality of optical fibers 210 may be arranged in more than two rows. In other words, when viewed in the length direction, it means that at least a part of the plurality of optical fibers 210 are arranged on a plane different from the plane where the remaining optical fibers 210 are arranged. However, even in this structure, the ends 211 of the plurality of optical fibers 210 can be arranged on the substantially same plane.
  • the deformation section 230 is located between the point where the horizontal arrangement section 220 ends and the section where the vertical arrangement section 240 starts, and is actually a section where the optical fiber 210 as a straight line is curved or bent.
  • the deformation section 230 is, for example, a section in which a plurality of optical fibers 210 arranged in a row are stacked in two or more rows to deform the optical fibers 210. Due to the deformation interval 230, the respective shapes of the multiple optical fibers may all be different or symmetrical.
  • the vertical arrangement section 240 is extended from the deformation section 230 and the plurality of optical fibers 210 are stacked in two or more rows.
  • the number of optical fibers 210 included in each column of the vertical arrangement section 240 may be the same or different.
  • the light guide plate 200 is composed of 16 optical fibers 210, eight in two rows per row, four in four rows per row, or two and eight rows per row can be stacked.
  • the 16 optical fibers 210 may also be stacked into three rows of 5-6-5 (upper row-middle row-lower row).
  • the number of optical fibers 210 included in any one row may be the same as the number of optical fibers 210 included in other rows. The number is different. Regardless of the number of optical fibers 210 stacked in each column, the other end 212 of the optical fiber 210 is actually arranged on the same plane when viewed in the cross-sectional direction, so that the second surface 21 shown in FIG. 2 can be formed.
  • the optical fiber 210 may actually be a straight line. The end of the vertical arrangement section 240, that is, the second surface 21 may actually be vertically optically combined with the optical sensor 300.
  • optical coupling refers to a state in which two constituent elements can transmit light to each other, and is not limited to a state in which two constituent parts are in physical contact.
  • optical separation refers to a state where two components cannot transmit light to each other.
  • the length of the horizontal arrangement section 220 may be longer than the length of the remaining sections 230 and 240.
  • the horizontal arrangement section 220 makes the multiple optical fibers 210 arranged in a row, which can be more flexible than the other sections 230 and 240.
  • the cross-sectional thickness of the horizontal arrangement section 220 is thinner than the thickness of the remaining sections 230 and 240, and therefore, it can be inserted into the narrow section 14 of the frame 11 and the display 13, for example. If the horizontal arrangement section 220 is sufficiently long, even if a part of the horizontal arrangement section 220 is inserted into the narrow section 14, the remaining sections may be bent, so that it is easy to arrange the optical sensor 300 in an appropriate position.
  • the length of the vertical arrangement section 240 may be longer than the length of the other sections 220 and 230.
  • the first heat insulation member 120 that maintains and/or protects the arrangement state of the plurality of optical fibers 210 can be formed in at least a part of the horizontal arrangement section 220.
  • the first heat insulation member 120 can be formed by coating the plurality of optical fibers 210 with a substance with low thermal conductivity.
  • the first heat insulation member 120 may be a protective film attached to at least a part of the horizontal arrangement section 220 so as to maintain the arrangement state of the plurality of optical fibers 210.
  • the horizontal arrangement section 220 is curved, in order to maintain its state, at least a part of the material that can be coated in the horizontal arrangement section 220 maintains a certain shape and has a low thermal conductivity even after curing.
  • constituent parts other than the plurality of optical fibers 210 for example, the funnel 130, the sensor connector 150, and the like, can also be formed of a material with low thermal conductivity.
  • a funnel 130 that protects the plurality of optical fibers 210 can be arranged in the deformation section 230.
  • the hopper 130 has a horizontal arrangement section side entrance and a horizontal arrangement section side entrance.
  • the funnel 130 has a shape from the entrance of the horizontal arrangement section to the entrance of the vertical arrangement section, the left and right widths are reduced, and the height is increased.
  • the left and right width of the side entrance of the horizontal arrangement section may be substantially equal to or greater than the sum of the diameters of the plurality of optical fibers 210, and the height may be substantially equal to or greater than the diameter of the optical fibers 210.
  • the shape of the side entrance of the vertical arrangement section may be determined by the cross-sectional shape of the plurality of optical fibers 210 located in the vertical arrangement section 240.
  • the funnel 130 may be in the shape of a flat funnel with the entrance (ie, the entrance at the side of the vertical arrangement section).
  • the entrance ie, the entrance at the side of the vertical arrangement section.
  • the plurality of optical fibers 210 arranged horizontally may be drawn to the outside through the entrance of the vertical arrangement section while being vertically arranged.
  • the plurality of optical fibers 210 arranged vertically may also be arranged horizontally while being drawn to the outside through the entrance of the horizontal arrangement section.
  • the funnel 130 may be formed of synthetic resin or the like.
  • the second heat insulation member 140 that maintains and/or protects the arrangement state of the plurality of optical fibers 210 can be formed in at least a part of the vertical arrangement interval 240.
  • the second heat insulation member 140 can be formed by coating the plurality of optical fibers 210 with a substance with low thermal conductivity.
  • the cross-sectional shape of the second heat insulating member 140 may be determined by the cross-sectional shape of the plurality of optical fibers 210 located in the vertical arrangement section 240.
  • the second heat insulation member 140 may be formed by coating at least a part of the vertical arrangement section 240 with a synthetic resin.
  • the second heat insulation member 140 may be a pipe formed of synthetic resin.
  • the second heat insulation member 140 may be integrally formed with the funnel 130. In other words, the second heat insulation member 140 may extend from the entrance of the vertical arrangement section side of the funnel 130 toward the length direction of the optical fiber 210.
  • the sensor connector 150 includes a male connector (male connector) 150a and a female connector (female connector) 150b.
  • the male port 150a is combined with the vertical arrangement section 240.
  • the other ends 212 of the plurality of optical fibers 210 are inserted into the inside of the male interface 150a.
  • the female interface 150b is attached to the inside of the electronic device 10, such as a substrate, and the male interface 150a is accommodated in the internal space.
  • the optical sensor 300 is combined with the female interface 150b.
  • the male interface 150a is inserted into the female interface 150b, so that the other end 212 of the plurality of optical fibers 210 and the optical sensor 300 are optically combined.
  • the optical sensor assembly 100 may further include a flat connector 110.
  • the flat connector 110 is coupled to the horizontal arrangement section 220. In other words, one end 211 of the plurality of optical fibers 210 is disposed in the flat connector 110.
  • the flat connector 110 may include a cover 110a and a support 110b.
  • the flat connector 110 may further include a mirror 110c. In other words, a part of the plurality of optical fibers 210 is arranged on the support 110b, and the cover 110a coupled by the support 110b can be fixed. One end 211 of the plurality of optical fibers 210 may be arranged toward the mirror 110c.
  • the flat connector 110 may be disposed in the space 14 between the frame 11 and the display 13.
  • FIG. 5 is a diagram exemplarily showing an embodiment of the sensor connector of the optical sensor assembly
  • FIG. 5 (a) shows the front, side, back and top of the male interface 150a
  • (b) shows the front of the female interface 150b
  • Side and back (c) represents the top and side of the optical sensor 300.
  • the male interface 150a includes a male interface main body 151a which is formed with a plurality of insertion ports 152a for the optical fibers 210 at the rear and an exposure port 153a at the front.
  • the opening 154a through which at least a part of the plurality of optical fibers 210 inserted inside the male interface 150a is exposed to the outside is formed on the upper surface of the male interface main body 151a.
  • the fastening protrusion 155a fastened to the female interface 150b is formed on one or all of the left and right side surfaces of the male interface main body 151a.
  • the insertion port 152a of the male interface body 151a may be formed to be relatively larger than the exposure port 153a.
  • the left and right width of the insertion opening 152a is greater than the left and right width of the exposure opening 153a, and/or the height of the insertion opening 152a may be greater than the height of the exposure opening 153a.
  • the area of the insertion port 152a may be larger than the area of the exposure port 153a. If the insertion port 152a is formed in a form larger than the cross section of the vertical arrangement section 240 of the plurality of optical fibers 210, the plurality of optical fibers 210 can be easily inserted into the male port 150a.
  • the shape of the exposure port 153a may be substantially the same as the cross-sectional shape of the vertical arrangement section 240, the shape of the insertion port 152a may not be limited by the cross-sectional shape of the vertical arrangement section 240.
  • the female interface 150b includes a female interface main body 151b formed with an insertion port 152b for inserting the male port 150a at the back and an exposing port 153b for fastening the optical sensor 300 on the front.
  • a fastening groove 155b for receiving a fastening protrusion 155a is formed on the side surface of the female interface main body 151b.
  • horizontal grooves 156b and 157b extending horizontally from the insertion port 152b to the fastening groove 155b are respectively formed at the upper and lower parts of the fastening groove 155b.
  • the optical sensor 300 includes a substrate 310 and an optical sensor chip (chip die) 320, and optionally, may also include a light emitting diode 330.
  • the optical sensor chip 320 may be an illuminance sensor chip, a proximity sensor chip, or a proximity illuminance sensor chip.
  • the light emitting diode 330 may irradiate detection light in the visible light, near infrared or ultraviolet wavelength band.
  • the proximity sensor chip or the proximity illuminance sensor chip receives the detection light reflected by the object, thereby being able to generate a detection signal, which is necessary for judging whether any object is close to the electronic device.
  • the optical sensor 300 makes the chip-attached surface of the two sides of the substrate face the exposure port 153b, thereby being combined with the female interface 150b.
  • FIG. 6 is a diagram exemplarily showing the manufacturing and installation process of the sensor connector of the optical sensor assembly.
  • the sensor connector 150 optically combines a plurality of optical fibers 210 with the optical sensor 300.
  • the female interface 150b is surface-mounted on the substrate 15 inside the electronic device 10, and the optical sensor 300 can be electrically connected to the substrate 15 in a state of being coupled to the female connector 150b.
  • the male connector 150a is inserted and fastened into the female interface 150b in a state of being coupled to the plurality of optical fibers 210, so that the other end 212 of the optical fiber 210 faces the optical sensor 300.
  • the light passing through the other end of the optical fiber 210 is directed toward the optical sensor 300, and the light generated by the optical sensor 300 is transmitted to the optical fiber 210 through the other end 212.
  • the optical sensor 300 can be manufactured by electrically combining the optical sensor chip 320 and/or the reflective diode 330 on the substrate 310' printed with the conductive path 313 or the substrate 310 obtained by transferring it.
  • the conductive path 313 is printed on either or both of the two sides of the substrate 310', and can be connected to a plurality of conductive vias 314 penetrating the substrate 310'.
  • the conductive path 313 is formed with one end near the location where the optical sensor chip 320 and/or the light emitting diode 330 are attached, and the other end may be electrically connected to the conductive via 314.
  • one end of the conductive path 313 is located at a position that can be electrically connected to the contact pad of the optical sensor chip 320 and/or the light-emitting diode 330 through wiring.
  • the substrate 310 of the optical sensor 300 is manufactured by cutting the substrate 310' along a plurality of conductive vias 314.
  • the plurality of conductive vias 314 may actually be formed to be arranged on the same straight line.
  • the optical sensor 300 is combined with the exposure port 153b of the female interface 150b, and then attached to the substrate 15.
  • Conductive contacts are arranged on the substrate 15 at positions corresponding to the conductive through holes 314.
  • the conductive via 314 can be electrically connected to the conductive contact, for example, by welding.
  • the other end 212 of the plurality of optical fibers 210 is inserted into the differential inlet 152a of the male port 150a, so that at least a part of it can be exposed to the outside of the male port 150a through the exposure port 153a.
  • the optical fiber 210 exposing the other end 212 is cut in the vertical direction, so that the other ends 212 of the plurality of optical fibers 21 can be located on the substantially same plane.
  • synthetic resin such as light-curing epoxy resin
  • the male port 150a is inserted into the female port 150b.
  • the fastening protrusion 155a of the male socket 150a is received in the fastening groove 155b of the female interface 150b, so that the optical sensor 300 can be optically combined with the plurality of optical fibers 210.
  • FIG. 7 is a diagram exemplarily showing another embodiment of the sensor connector of the optical sensor assembly.
  • the optical sensor chip 320 included in the optical sensor 300 includes: a light receiving part 321 that detects light transmitted to the optical fiber 210 to generate an electric signal; and an electric circuit formed around the light receiving part.
  • the light emitting diode 330 may also include a light emitting part that generates light and a circuit formed around the light emitting part.
  • the light receiving portion 321 of the optical sensor chip 320 receives ambient light incident on the inside of the electronic device 10 and reflected detection light.
  • the position of the light receiving section 321, and/or the distance between the light receiving section 321 and the light emitting section the position of the other end 212 of the plurality of optical fibers 210 may be arranged different.
  • the right area of the light receiving unit 321 receives reflected detection light
  • the left area receives ambient light.
  • the vertical arrangement section 240 makes 16 optical fibers 210 stacked in three rows (5-6-5).
  • FIG. 7 show a structure in which the exposure ports 153a1, 153a3 for the optical sensor chip and the exposure ports 153a2, 153a4 for the light emitting diode are separated.
  • the shapes of the exposure ports 153a1, 153a3 for the optical sensor chip and the exposure ports 153a2, 153a4 for the light-emitting diodes are only exemplary, and various modifications can be implemented.
  • 15 other ends 212a, 212c may be disposed at the exposure port 153a1 for the optical sensor chip, and one other end 212b may be disposed at the exposure port 153a2 for the light emitting diode.
  • the other end 212a emitting ambient light may be arranged on the left side of the exposure port 153a1 for the optical sensor chip, and the other end 212c emitting reflected detection light may be arranged on the right side.
  • the other end 212b disposed at the position corresponding to the light emitting diode 330 receives the detection light.
  • the optical fiber 210 having the other end 212b may be arranged on the leftmost side of the middle column, and the optical fiber 210 having the other end 212c may be arranged on the rightmost side of each column.
  • the 13 other ends 212a, 212c may be disposed at the exposure port 153a3 for the optical sensor chip, and the three other ends 212b may be disposed at the exposure port 153a4 for the light emitting diode.
  • the other end 212a that emits ambient light may be arranged on the left side of the exposure port 153a3 for the optical sensor chip, and the other end 212c that emits reflected detection light may be arranged on the right side.
  • the optical fiber 210 with the other end 212b may be arranged on the leftmost side of each column, and the optical fiber 210 with the other end 212c may be arranged on the rightmost side of each column.
  • FIG. 8 is a diagram exemplarily showing still another embodiment of the sensor connector of the optical sensor assembly.
  • the optical sensor chip 320 and the light emitting diode 330 of the optical sensor 300 can be optically separated.
  • the optical sensor chip 320 and the light emitting diode 330 exemplarily show an optically separated structure
  • (b) exemplarily show the male interface 150a and the female interface 150b Section in the tightened state.
  • the separating wall 158b is disposed at the exposing outlet 153b of the female interface 150b.
  • the separating wall receiving groove 158a may be formed on the front surface of the male port 150a.
  • the separation wall accommodating groove 158a In the structure in which the separation wall accommodating groove 158a is formed, at least a part of the separation wall 158b can be accommodated in the separation wall accommodating groove 158a.
  • the height h1 of the separation wall 158b may be greater than the thickness of the thicker one of the optical sensor chip 320 and the light emitting diode 33.
  • a separating wall 159 a for optically separating the optical sensor chip 320 and the light emitting diode 330 may be formed on the front surface of the male port 150 a.
  • the height h2 of the separation wall 159a may be equal to or less than the distance between the front surface of the male port 150a and the substrate 310 of the optical sensor 300 in a state where the male port 150a and the female port 150b are fastened.
  • FIG. 9 is a diagram exemplarily showing an embodiment of an optical sensor.
  • the optical sensor 300' shown in FIG. 9 further includes a light transmitting mirror 341 formed on the upper portion of the optical sensor chip 320.
  • the transparent mirror 341 for the optical sensor and the transparent mirror 342 for the light emitting diode are formed by the same process.
  • the light-emitting diode 330 can be attached to the substrate 310 in a state including a collimating lens. Therefore, it can be understood that it is not necessary to form the transparent mirror 342 for the light-emitting diode.
  • the transparent mirror 341 for the optical sensor and the transparent mirror 342 for the light-emitting diode are formed on the optical sensor chip 320 and the light-emitting diode 330 respectively.
  • Figure 9 (a) exemplarily shows an optical sensor 300' including a translucent mirror
  • (b) exemplarily shows a simplified cross-section of the optical sensor 300' in a state where the male interface 150a and the female interface 150b are fastened .
  • the function of the transparent mirror 341 for the optical sensor is to increase the receiving effect of the peripheral light emitted from the other end 212 and the reflected detection light.
  • the function of the transparent mirror 342 for the light emitting diode is to improve the flatness of the detection light generated by the light emitting diode 330.
  • the translucent mirror 341 for the optical sensor and the translucent mirror 342 for the light emitting diode are formed on the optically transparent translucent lens support 340.
  • the light-transmitting lens support 340 can be formed by laminating a photocurable epoxy resin to a predetermined thickness on the substrate 310 or 310', for example.
  • the light-transmitting mirror 341 for the optical sensor and the light-transmitting mirror 342 for the light-emitting diode can be formed by pressing a light-curing epoxy resin to the light-transmitting mirror mold.
  • the lens support 340 on which the transparent mirror 341 for the optical sensor and the transparent mirror 342 for the light emitting diode are formed can be photocured by, for example, ultraviolet rays.
  • the light shielding shell 350 is formed to wrap the cured light transmitting lens support body 340.
  • the light-shielding shell 350 is formed with an opening 351 for the optical sensor transparent mirror and an opening 352 for the light-emitting diode transparent mirror, so as to make the transparent mirror 341 for the optical sensor and the transparent mirror 342 for the light-emitting diode Exposed.
  • the light shielding shell 350 may further include a separation wall 353 that optically separates the optical sensor chip 320 and the light emitting diode 330.
  • Fig. 10 is a diagram exemplarily showing an embodiment of a flat connector.
  • Fig. 10 (a) shows the front, side, and upper surface of the cover 110a, and (b) shows the front, side, and upper surface of the support 110b.
  • the left and right sides of the cover 110a, the upper plate 111a, and the upper plate 111a include side walls 113a each extending downward.
  • a plurality of hemispherical grooves may be formed on the bottom surface 112a of the upper plate 111a, and the plurality of hemispherical grooves at least partially receive the optical fiber 210.
  • An opening 114a that exposes at least a part of the plurality of optical fibers 210 arranged between the cover 110a and the support 110b to the outside is formed in the upper plate 111a.
  • a photocurable epoxy resin or the like can be injected into the male port 150a through the opening 154a.
  • the fastening protrusion 115a for fixing the plurality of cover bodies 110a to the support body 110b may be formed on the side wall 113a.
  • the support body 110b includes: a lower plate 111b; an upper side wall 112b, which is combined on the left and right sides of the lower plate 111b and extends horizontally across the lower plate 111b; and a lower side wall 113b, which The extension part of the upper side wall 112b is extended to the lower part; the vertical wall 114b is extended from the lower plate 111b to the lower part, and is connected between the lower side walls 113b.
  • a plurality of optical fibers 210 are arranged on the upper part of the lower plate 111b.
  • a fastening groove 115b is formed at a position corresponding to the fastening protrusion 115a.
  • the cover 110a is inserted between the opposing upper side walls 112b so that the fastening protrusion 115a is received in the fastening groove 115b, the cover 110a and the support 110b are fastened.
  • the extended portion of the upper side wall 112b may be formed with an insertion groove 114b for inserting the mirror 110c.
  • FIG. 11 is a diagram exemplarily showing various embodiments of the flat connector.
  • the flat connector 110 arranges one end 211 of a plurality of optical fibers 210, and in order to receive light incident to the inside of the electronic device 10, for example, at least a part of the support 110b is arranged between the display panel 13 and the frame 11.
  • the space 110 d defined by the lower side wall 113 b and the vertical wall 114 b provides a light path through which the light entering the flat connector 110 is incident on the plurality of optical fibers 210.
  • the traveling direction of the light passing through the space 110d is substantially perpendicular to the length direction of the optical fiber 210. Therefore, the configuration for changing the traveling direction of the light is illustrated in (a), (b), and (c) of FIG. 11.
  • a mirror 110c is shown, and the mirror 110c is arranged obliquely at approximately 45 degrees with respect to the length direction of the optical fiber 210 and the traveling direction of light passing through the space 110.
  • the mirror 110c bends the detection light 331 emitted from the end 211 of the optical fiber 210 by approximately 90 degrees to face the space 110d.
  • the mirror 110c makes the reflected detection light 332 and the ambient light 321 that enter the space 110d bend approximately 90 degrees, and thereby face the end 211 of the optical fiber 210.
  • the mirror 110c can be replaced with a prism.
  • one end 211' of the optical fiber 210 is formed to be inclined approximately 45 degrees, and the one end 211' is arranged to face the cover 111a side.
  • the inclined end 211' is the interface between the optical fiber 210 and the air, so that the light emitted from the optical fiber 210 is bent toward the space 110d.
  • the one end 211' bends the reflection detection light 332 and the ambient light 321 entering the space 110d, so that they enter the optical fiber 210.
  • the vertical light guide plate 110e may be optically combined on one end 211 of the optical fiber 210.
  • One end of the vertical light guide plate 110e is an inclined surface 111e inclined at approximately 45 degrees, and the inclined surface 111e is arranged opposite to the end 211 of the optical fiber 210.
  • the inclined surface 111e is the interface between the vertical light guide plate 110e and the air, which can bend the light and change the traveling direction.
  • the detection light 331 emitted from the optical fiber 210 is bent by the inclined surface 111e after passing through the interface between the optically combined optical fiber 210 and the vertical light guide plate 110, and faces the other end of the vertical light guide plate 110d.
  • the reflected detection light 332 and the ambient light 321 incident on the other end of the vertical light guide plate 110 e are bent by the inclined surface 111 e and face the optical fiber 210.
  • FIG. 12 is a diagram exemplarily showing another embodiment of the optical sensor assembly, showing the optical sensor assembly 100 in the horizontal arrangement section that is curved.
  • the horizontal arrangement section 220 may include a first straight section 221, a curved section 222, and a second straight section 223.
  • the curved section 222 is set between the first straight section 221 and the second straight section 222.
  • the curved section 222 enables one end 211 of the plurality of optical fibers 210 to be directly optically coupled to the underside of the cover glass 12, and the second straight section 222 is separated from the frame 11 of the electronic device 10 by a distance d.
  • the optical sensor package 100 can directly optically bond one end 211 of the plurality of optical fibers 210 to the underside of the cover glass 12.
  • the sensor connector 150 should be arranged in a form close to the frame 11, so the internal structure design of the electronic device 10 may become a new restriction factor. Therefore, in order to allow the plurality of optical fibers 210 to be directly bonded under the cover glass 12 while ensuring a proper distance d from the frame 11, a curved section 222 may be required.
  • the first straight line section 221 and the second straight line section 223 may actually be parallel.
  • the distance d is the horizontal separation distance between the first straight section 221 and the second straight section 223. Therefore, the sensor connector 150 can be separated from the frame 11 through the curved section 222, and thus is disposed on the substrate 15 inside the electronic device 10.
  • the first straight line section 221 and the second straight line section 223' may be substantially perpendicular.
  • the sensor connector 150 is separated from the frame 11 by at least a distance d or more through the curved section 222 and can be arranged on the substrate 15 inside the electronic device 10.
  • Fig. 13 is a diagram exemplarily showing still another embodiment of the optical sensor assembly.
  • the sensor connector 150' is integrally formed with the optical fiber.
  • the plurality of optical fibers 210 and the optical sensor 300 may be optically combined and integrated.
  • the bonding member 340' is formed by laminating an optically transparent material, such as a photocurable epoxy resin, to a predetermined thickness on the substrate 310 or 310', and if cured, the other end of the optical fiber 210 is fixed. If at least a part of the optical fiber 210 is inserted into the cured photocurable epoxy resin and then cured by ultraviolet rays or the like, it is integrated with the optical sensor 300 through the bonding member 340'.
  • the coupling member 340' transmits ambient light and/or reflected detection light emitted from the other end 212 of the optical fiber 210 to the optical sensor chip 320, and can transmit the detection light emitted from the light emitting diode 330 to the other end 212.
  • the light shielding shell 350 is formed to wrap the cured bonding member 340'.
  • the light shielding shell 350 may further include a separation wall 353 that optically separates the optical sensor chip 320 and the light emitting diode 330.
  • FIG. 14 is a diagram exemplarily showing still another embodiment of the optical sensor assembly.
  • the plurality of optical fibers 210 include: an optical fiber 210a for light reception, which transmits ambient light to the optical sensor; an optical fiber 210c for light reception, which transmits reflected detection light to the optical sensor 300; and an optical fiber 210b for light emission , Which transmits detection light to the outside.
  • the optical fiber 210c for light reception and the optical fiber 210b for light emission may be arranged at a prescribed interval.
  • the optical fibers 210a and 210c for light reception and the optical fiber 210b for light emission can be separated by a prescribed distance dc.
  • the optical fiber 210c for light reception and the optical fiber 210b for light emission can actually follow the prescribed distance through a plurality of optical fibers 210a arranged between the two for light reception. Separation.
  • the optical fibers 210a and 210c for light reception and the optical fiber 210b for light emission may be coated with a heat insulating member 120' formed of a material with lower thermal conductivity.

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Abstract

本发明涉及一种光学传感器组装体。根据本发明的一个侧面的实施例提供光学传感器组装体。光学传感器组装体中，多个光纤，在此，所述多个光纤的一端配置为一列，而所述多个光纤的另一端按照两个以上的列层叠，从而由所述多个光纤的所述一端所形成的第一面的宽度大于由所述多个光纤的所述另一端所形成的第二面的宽度，且包括与所述第二面光学结合的传感器连接器，所述第一面接收向电子装置的内部入射的光，所述第一面所接收的光通过所述第二面向所述传感器连接器传递，所述传感器连接器能够与所述第一面分离，且配置于所述电子装置内部。

Description

光学传感器组装体
相关申请
本申请要求2019年1月28日申请的，申请号为10-2019-0010548，名称为“光学传感器组装体”的韩国专利申请的优先权，在此将其原文引入作为参考。
技术领域
本发明涉及一种光学传感器。
背景技术
光学传感器不仅用于手机或平板等便携式电子装置，而且用于TV或显示器等影像电子装置。就光学传感器而言，例如，包括照度传感器、接近传感器、接近照度传感器等。接近传感器是对使用者与电子装置之间的距离进行测量的光学传感器，照度传感器是对电子装置周围亮度进行感应的光学传感器。结合光学方式的接近传感器和照度传感器的接近照度传感器在单一封装内设置两个传感器。
最近，显示器占据几乎整个电子装置正面的设计正在增加。根据需要大屏幕的要求，虽然显示器的尺寸在变大，但是为了配置相机(camera)，尤其为了配置接近照度传感器，正面至少一部分的区域仍然应得到保证。利用超声波等的接近传感器即使在正面被显示器覆盖的结构中也能够使用，但是照度感应功能难以统合。另外，照度传感器虽然也能够设置于正面之外的区域，但是因为用于保护电子装置的壳体(case)而无法感应周 围的光。因此，能够设置有接近照度传感器的最为理性的位置虽然是电子装置的正面，但是在显示器占据整个正面的设计中，难以确保配置常用的接近照度传感器的位置。
发明内容
本发明的目的在于提供一种光学传感器组装体，所述光学传感器组装体可以应用于具有如下设计的电子装置：显示器占据整个正面。
根据本发明的一个侧面的实施例提供一种光学传感器组装体。光学传感器组装体中，多个光纤，在此，所述多个光纤的一端配置为一列，而所述多个光纤的另一端按照两个以上的列层叠，从而由所述多个光纤的所述一端所形成的第一面的宽度大于由所述多个光纤的所述另一端所形成的第二面的宽度，且包括与所述第二面光学结合的传感器连接器，所述第一面接收向电子装置的内部入射的光，所述第一面所接收的光通过所述第二面向所述传感器连接器传递，所述传感器连接器能够与所述第一面分离，且配置于所述电子装置内部。
作为一个实施例，所述多个光纤可以是塑料光纤(POF，Plastic optical fiber)。
作为一个实施例，所述多个光纤可以包括：水平排列区间，其使得所述多个光纤的一端配置为一列；竖直排列区间，其使得所述多个光纤的另一端按照两个以上的列配置；以及变形区间，其连接所述水平排列区间和所述竖直排列区间，并且使得所述多个光纤弯曲。
作为一个实施例，所述第二面可以形成为，使得所述光纤的另一端在各个列按照相同的个数层叠。
作为一个实施例，所述第二面形成为，所述光纤的另一端层叠为三个以上的列，至少任意一列所层叠的另一端的个数可以与其余列所层叠的另一端的个数不同。
作为一个实施例，所述第二面可以是多个。
作为一个实施例，所述第一面可以配置于所述电子装置的框架和显示面板之间的空间。
作为一个实施例，所述传感器连接器可以包括：公接口，其使得所述多个光纤的另一端向内部插入并固定；母接口，其在内部收纳所述公接口；以及光学传感器，其在朝向所述公接口的方向上与所述母接口结合。
作为一个实施例，所述光学传感器可以包括：基板，其使得多个截断的通孔在侧面排列；光学传感器芯片，其配置于所述基板的上面，并与所述多个截断的通孔电连接；以及发光二极管，其在所述基板的上面与所述光学传感器芯片分离配置，并与所述多个截断的通孔电连接。
作为一个实施例，所述母接口还可以包括对所述光学传感器芯片和所述发光二极管进行光学分离的分离壁。
作为一个实施例，所述公接口还可以包括对所述光学传感器芯片和所述发光二极管进行光学分离的分离壁。
作为一个实施例，所述光学传感器还可以包括设置于所述光学传感器芯片上部的用于光学传感器的透光镜。
作为一个实施例，还包括扁平连接器，所述扁平连接器将所述多个光纤的所述一端收纳于内部，所述扁平连接器可以提供光路，所述光路使得向所述电子装置内部入射的光朝向所述一端行进。
作为一个实施例，所述扁平连接器可以包括：盖体，其在内部形成有半球形槽，所述半球形槽收纳光纤的至少一部分；以及支撑体，其配置有所述多个光纤，并与所述盖体紧固，从而固定所述多个光纤。
作为一个实施例，还包括镜子，所述镜子分别相对于所述多个光纤及所述光路倾斜配置。
作为一个实施例，所述多个光纤的一端可以是倾斜面。
作为一个实施例，还可以包括竖直导光板，所述竖直导光板配置于所述光路，以便光学结合于所述多个光纤的一端，并且结合区域的对面是倾斜面。
作为一个实施例，还可以包括隔热部件，所述隔热部件对所述多个光纤进行保护。
作为一个实施例，所述多个光纤包括：用于发光的光纤，其向外部传递检测光；以及用于光接收的光纤，其传递从外部入射的反射检测光，所述用于发光的光纤和所述用于光接收的光纤可以分离配置。
根据本发明的实施例的光学传感器组装体可以应用于具有如下设计的电子装置：显示器占据整个正面。光学传感器组装体虽然配置于电子装置内部，但是能够将外部的光传递至光学传感器，因此能够增强电子装置的外观设计自由度。此外，光学传感器组装体可以不受电子装置内部发出的光的影响。
附图说明
以下，参照附图所示的实施例对本发明进行说明。为了有助于理解，在所附的全部附图中，相同的构成要素配置相同的附图标号。附图中所示出的结构只是为了说明本发明而示例性实现的，本发明的范围并非限定于此。尤其，为了有助于发明的理解，附图以些许夸张的形式示出部分构成要素。附图是用于理解发明的途径，因此应理解，附图中所表现的构成要素的宽度或厚度等与实际实现时可能不同。
图1是示例性示出设置于电子装置的光学传感器组装体的图。
图2是示例性说明光学传感器组装体的操作原理的图。
图3是示例性说明实现图2的操作原理的光学传感器组装体的一个实施例的图。
图4是图3的光学传感器组装体的分解立体图。
图5是示例性示出光学传感器组装体的传感器连接器(connector)的一个实施例的图。
图6是示例性示出光学传感器组装体的传感器连接器的制造及设置过程的图。
图7是示例性示出光学传感器组装体的传感器连接器的另一个实施例的图。
图8是示例性示出光学传感器组装体的传感器连接器的又另一个实施例的图。
图9是示例性示出光学传感器组装体的光学传感器结构的图。
图10是示例性示出扁平连接器的一个实施例的图。
图11是示例性示出扁平连接器的多种实施例的图。
图12是示例性示出光学传感器组装体的另一个实施例的图。
图13是示例性示出光学传感器组装体的又另一个实施例的图。
图14是示例性示出光学传感器组装体的又另一个实施例的图。
具体实施方式
本发明能够施加多种变更，且能够具有多种实施例，特定实施例示出于附图中，意在通过对其的详细说明进行详细说明。但是，这应理解为，并非意在将本发明限定于特定实施形态，而是包括本发明的思想及技术范围所包括的全部变更、均等物乃至替换物。尤其，以下参照附图所说明的功能、特征、实施例能够单独或结合其他实施例得以实现。由此，应注意，本发明的范围并非限定于附图所示的形态。
另外，在本说明书中所使用的术语中类似于“实际上”、“几乎”、“大约”等的表达是考虑到实际实现时所应用的盈余或可能出现的误差。例如，“实际上90度”应理解为如下意义：包括的角度是与90度时效果等同的角度。作为另一个例子，“几乎不存在的”应理解为如下意义：即使某物微乎其微地存在，包括可以忽略的程度。
另外，只要没有特别提及，则“侧面”，或“水平”是指附图的左右方向，“竖直”是指附图的上下方向。此外，只要没有特别定义，则角度、入射角等是以垂直于附图所示的水平面的虚拟直线为基准。
整体附图中，相同或类似的要素使用并引用相同的附图标号。
图1是示例性示出设置于电子装置的光学传感器组装体的图。
光学传感器组装体100可以消除必须设置在例如智能手机的电子装置10的正面的光学传感器的设计限制。光学传感器组装体100可以设置于电子装置10的内部，并且包含于光学传感器组装体100的光学传感器由于电子装置10内部的发光部件，例如，显示面板13而可能不受影响。即使不向外部露出，光学传感器通过光学传感器组装体100而可能执行原来的功能。换句话说，由于光学传感器组装体100，从而无需将光学传感器配置于电子装置10的正面中的一部分区域，因此显示面板13可以设置于整体正面区域。
设置于电子装置10的光学传感器，具有例如光导二极管的光接收部，并且光接收部设置于光学上透明的覆盖玻璃(cover glass)12下部。透过覆盖玻璃12的光通过光学传感器的上面所形成的开口到达光接收部，从而通过光接收部检测。与大部分的其他电子部件相同，光学传感器也具有非常小的尺寸。但是，为了将光学传感器配置于覆盖玻璃12下部，电子装置10的框架11和显示器13之间需要空间。这导致显示器13可占据的面积减小。
图1的(a)是安装有正面显示器的电子装置，(b)是沿着“I-I”的截面图。用肉眼观察时，虽然看上去好像显示器13紧贴于框架11，但是显示器13和框架11之间可以存在数十乃至数百um的游隙。此外，在显示器13的一部分侧面形成有槽，或者使得一部分侧面可以凹陷地形成。光可以通过游隙或者空间14入射，所述游隙是因考虑到公差的设计而出现的，所述空间是因显示器13的侧面结构而出现的。但是，空间14过窄而难以收纳一般结构的光学传感器。
图1的(c)表示配置于框架11和显示器13之间空间14的光学传感器组装体100。光学传感器组装体100的一端薄以致能够设置于空间14，并且另一端可以具有覆盖光学传感器上面至少一部分的面积。光学传感器组装体100透过覆盖玻璃12，从而使得向空间14入射的光向光学传感器传递。光学传感器利用所传递的光能够检测电子装置周围亮度、电子装置与周围物体间的距离、和/或电子装置周围是否存在物体等。另外，显示面板13的侧面也可以透过光。尤其，从显示面板13发出的光能够影响光学传感器组装体100。因此，显示面板13的侧面可以形成或配置有遮光结构13’。遮光结构13’例如可以是层叠于显示面板13的侧面的遮光物质。遮光结构13’可以形成于光学传感器组装体100所配置的整体侧面，或者仅形成于其侧面的一部分。并且，形成于侧面的遮光结构可以沿着显示面板的屏幕延长。
图2是示例性说明光学传感器组装体的操作原理的图，为了比较，同时示出一般的光学传感器301的操作原理。
光学传感器组装体100包括导光板25，所述导光板25具有光24入射的第一面20，以及光26射出的第二面21。第一面20和第二面21具有不同的形状。如所示，第一面20可以为薄且长的矩形，第二面21可以为正方形。但是，虽然以下将要进行详细说明，但是第一面20及第二面21的形状并非限定于示例的矩形或正方形。另外，第一面20的面积与第二面21的面积实际上可以相同。换句话说，如果导光板25所致的光损失是微乎其微的小，则第一面20进行光接收的光24的光亮与通过第二面21到达光学传感器300的光26的光亮实际可以相同。
第一面20的横向长度(或宽度)可以大于第二面21的横向长度，并且第一面20的纵向长度(或厚度)可以小于第二面21的纵向长度。第一面20可以对以规定角度范围入射的光24进行接收。因此，与第一面20 相对应的检测范围23随着与第一面20的距离D的增加而扩大，并且检测区域23的形状可以保持与第一面20的形状几乎类似。
与第一面20相类似地，就光学传感器301而言，与上面的距离D越增加，则检测范围29越扩大。光学传感器301的检测范围29的形状根据光学传感器301的光学结构，例如，透光镜(lens)和/或用于光透过的开口的形状等来决定，并且实际上可以是圆形或椭圆形。因为第一面20的横向长度相对大于光学传感器301的光学结构的宽度，所以第一面20的检测区域23的宽度W 1d可以相对大于光学传感器401的检测区域29的宽度W 2d。
另外，导光板25向两个方向传递光。第二面21可以接收光学传感器300生成的光27。通过第一面20向导光板25的外部射出的光28能够被物体反射而重新返回第一面20。为了减小光之间的干扰，第一面20接收的光24所通过的光路与第二面21接收的光27所通过光路可以分离。在此，第二面21接收的光27，可以是例如类似于近红外线，特定波长的光和/或规定频率的脉冲形态。
导光板25可以多样地实现。以下虽然以利用多个塑料光纤(POF，Plastic optical fiber)实现导光板25的实施例为主进行了说明，但是导光板25也可以通过如下方式制造：利用具有与POF的纤芯(core)类似的属性的物质、模具进行注塑成型。此外，导光板25也可以利用玻璃光纤(GOF，Glass optical fiber)或具有与GOF的纤芯(core)类似的属性的物质来实现。但是，就GOF而言，光纤(optical fiber)的形状应通过热处理等与导光板25的形态相应地形成。
图3是示例性说明实现图2的操作原理的光学传感器组装体的图，图4是图3的光学传感器组装体的分解立体图。
同时参照图3和图4，光学传感器组装体100包括传感器连接器150及导光板200。并且选择性地，光学传感器组装体100还可以进一步包括扁平连接器110。扁平连接器110可以与导光板200的一端结合，并且传感器连接器150与导光板200的另一端结合。作为一个实施例，导光板200可以由多个光纤210构成。光纤210包括通过内部可以传递光的纤芯，以及对纤芯进行保护的覆层，并且纤芯的直径及覆层的厚度可以多样。另外，光纤210具有适当的柔软性，导光板200的至少一部分区间，例如水平排列区间220可以弯曲。光纤210例如可以是POF。
导光板200包括水平排列区间220、变形区间230及竖直排列区间240。水平排列区间220、变形区间230及竖直排列区间240用于区分光纤210的排列状态(例如，水平排列区间220及竖直排列区间240)和/或排列状态变更的区域(例如，变形区间230)，各个区间220、230、240按顺序连续。各个区间220、230、240的长度可以相同或不同。另外，各个区间220、230、240的宽度按顺序减小。
作为一个实施例，在水平排列区间220，多个光纤210可以配置为一列。在此，就一列而言，沿长度方向观察时，意味着多个光纤210在相同平面上排列。另外，就多个光纤210的一端211而言，沿截面方向观察时，实际上在相同的平面上排列，因此形成图2所示的第一面20。在水平排列区间220，光纤210虽然在长度方向上实际上是直线，但是因为具有适当的柔软性，所以至少一部分可以为曲线，或者被外力弯曲。一般的光学传感器301，例如应直接接触覆盖玻璃12或者至少位于覆盖玻璃12下部。与此相反地，光学传感器组装体100所包括的光学传感器300虽然位于光无法到达的位置，但是通过导光板200可以接收光。尤其，可以弯曲的水平排列区间220能够更加自由地决定光学传感器300的设置位置。作为另一个实施例，在水平排列区间220，多个光纤210可以配置为两个以上的列。换句话说，沿长度方向观察时，意味着使得多个光纤210的至少一部 分在不同于排列有其余光纤210的平面上排列。但是，即使在此结构中，多个光纤210的一端211能够在实际上相同的平面上排列。
变形区间230位于从水平排列区间220结束的地点至竖直排列区间240开始的区间之间，并且实际上是作为直线的光纤210曲线化或弯曲的区间。变形区间230，例如是为了将排列为一列的多个光纤210按照两个以上的列进行层叠(stack)，从而用于对光纤210进行变形的区间。由于变形区间230，多个光纤各自的形状可以全部不同或对称。
竖直排列区间240是从变形区间230延长，且多个光纤210按照两个以上的列层叠的区间。竖直排列区间240的各个列所包括的光纤210的个数可以相同或不同。例如，由16个光纤210构成导光板200的情况下，可以每列八个两列、每列四个四列、或每列两个八列层叠。16个光纤210也可以层叠为5-6-5三列(上部列-中间列-下部列)。另外，例如，由15个光纤210构成导光板200的情况下，类似于1-2-3-4-5，也可以任意一列所包括的光纤210的个数与其他列所包括的光纤210的数量不同。与各个列所层叠的光纤210的个数无关，光纤210的另一端212沿截面方向观察时，实际上在相同平面上排列，从而能够形成图2所示的第二面21。另外，在竖直排列区间240，光纤210实际上可以为直线。竖直排列区间240的端部，即第二面21实际上可以垂直光学结合于光学传感器300。在此，光学结合是指两个构成要素能够彼此传递光的状态，并且并非仅限定于两个构成部物理接触的状态。相反地，光学分离是指两个构成要素彼此无法传递光的状态。
作为一个实施例，水平排列区间220的长度可以比其余区间230、240的长度长。水平排列区间220使得多个光纤210排列为一列，可以比其余区间230、240更加柔软。尤其，水平排列区间220的截面厚度相比其余区间230、240的厚度较薄，因此例如在框架11和显示器13的较窄区间 14也能够插入。如果水平排列区间220足够的长，则水平排列区间220的一部分即使插入较窄的区间14，也可能弯曲其余的区间，因此易于将光学传感器300配置于适当的位置。作为其他实施例，竖直排列区间240的长度相比其余区间220、230的长度可以较长。
作为一个实施例，对多个光纤210的排列状态进行保持和/或保护的第一隔热部件120能够在水平排列区间220的至少一部分形成。第一隔热部件120能够将导热率较低的物质涂覆于多个光纤210来形成。作为另一个实施例，第一隔热部件120可以是保护膜，所述保护膜附着于水平排列区间220的至少一部分，从而保持多个光纤210的排列状态。作为又另一个实施例，水平排列区间220弯曲的情况下，为了保持其状态，水平排列区间220的至少一部分可以涂覆的物质即使在固化后也保持一定形状且导热率较低。另外，多个光纤210之外的构成部，例如，漏斗(funnel)130、传感器连接器150等也能够由导热率较低的物质形成。
作为一个实施例，对多个光纤210进行保护的漏斗(funnel)130能够配置于变形区间230。漏斗130具有水平排列区间侧入口和水平排列区间侧入口。漏斗130具有如下形状：从水平排列区间侧入口向竖直排列区间侧入口，左右宽度减小，且高度增加。水平排列区间侧入口的左右宽度可以实际上等于或大于多个光纤210的直径的和，高度可以实际上等于或大于光纤210的直径。竖直排列区间侧入口的形状可以由位于竖直排列区间240的多个光纤210的截面形状来决定。例如，漏斗130可以是入口(即，竖直排列区间侧入口)扁扁的漏斗形状。由此，如果水平排列的多个光纤210通过水平排列区间侧入口插入，则多个光纤210可以通过竖直排列区间侧入口向外部引出的同时竖直排列。相反地，如果竖直排列的多个光纤210通过竖直排列区间侧入口插入，则多个光纤210也可以通过水平排列区间侧入口向外部引出的同时水平排列。漏斗130可以由合成树脂等形成。
作为一个实施例，对多个光纤210的排列状态进行保持和/或保护的第二隔热部件140能够在竖直排列区间240的至少一部分形成。第二隔热部件140能够将导热率较低的物质涂覆于多个光纤210来形成。第二隔热部件140的截面形状可以由位于竖直排列区间240的多个光纤210的截面形状来决定。作为一个实施例，第二隔热部件140可以通过合成树脂涂覆竖直排列区间240的至少一部分来形成。作为另一个实施例，第二隔热部件140可以是由合成树脂形成的管(pipe)。作为又另一个实施例，第二隔热部件140可以与漏斗130一体形成。换句话说，第二隔热部件140可以从漏斗130的竖直排列区间侧入口向光纤210的长度方向延长。
传感器连接器150包括公接口(male connector)150a及母接口(female connector)150b。公接口150a与竖直排列区间240结合。换句话说，多个光纤210的另一端212向公接口150a的内部插入。母接口150b附着于电子装置10内部，例如基板等，且在内部空间收纳公接口150a。光学传感器300与母接口150b结合。公接口150a向母接口150b的内部插入，从而对多个光纤210的另一端212和光学传感器300进行光学结合。
并且，光学传感器组装体100还可以包括扁平连接器110。扁平连接器110结合于水平排列区间220。换句话说，多个光纤210的一端211配置于扁平连接器110。扁平连接器110可以包括盖体(cover)110a及支撑体110b。并且，扁平连接器110还可以包括镜子(mirror)110c。换句话说，多个光纤210的一部分配置于支撑体110b，并且通过支撑体110b所结合的盖体110a可以固定。多个光纤210的一端211可以朝向镜子110c配置。扁平连接器110可以配置于框架11和显示器13之间的空间14。
图5是示例性示出光学传感器组装体的传感器连接器的一个实施例的图，图5的(a)表示公接口150a的正面、侧面、背面及上面，(b)表示 母接口150b的正面、侧面及后面，(c)表示光学传感器300的上面及侧面。
公接口150a包括公接口主体151a，所述公接口主体151a在后面形成有多个光纤210的插入口152a并在正面形成有露出口153a。使得公接口150a内部所插入的多个光纤210的至少一部分向外部露出的开口154a，其形成于公接口主体151a的上面。紧固于母接口150b的紧固凸起155a在公接口主体151a的左右侧面中之一或全部形成。
公接口主体151a的插入口152a可以形成为相对大于露出口153a。插入口152a的左右宽度大于露出口153a的左右宽度，且/或插入口152a的高度可以大于露出口153a的高度。换句话说，插入口152a的面积可以大于露出口153a的面积。如果以大于多个光纤210的竖直排列区间240的截面的形式形成插入口152a，则能够易于将多个光纤210向公接口150a内部插入。露出口153a的形状虽然可以与竖直排列区间240的截面形状实际上相同，但是插入口152a的形状可以不受竖直排列区间240的截面形状限制。
母接口150b包括母接口主体151b，所述母接口主体151b在后面形成有用于插入公接口150a的插入口152b，并在正面形成有用于紧固光学传感器300的露出口153b。在母接口主体151b的侧面形成有用于收纳紧固凸起155a的紧固槽155b。在母接口主体151b的侧面154b，从插入口152b到越过紧固槽155b水平延长的水平槽156b、157b分别形成于紧固槽155b的上部及下部。水平槽156b、157b在公接口150a插入时，使得母接口主体151b的侧面15b4向外侧弯曲，从而能够实现公接口150a与母接口150b的紧固。
光学传感器300包括基板310及光学传感器芯片(chip die)320，并且选择性地，还可以包括发光二极管330。光学传感器芯片320可以是照度传感器芯片、接近传感器芯片或接近照度传感器芯片。发光二极管330可以照射可视光、近红外线或紫外线波段的检测光。接近传感器芯片或接近照度传感器芯片接收物体反射的检测光，从而能够生成检测信号，所述检测信号是判断任意物体是否接近电子装置所必需的。光学传感器300使得基板的两面中附着有芯片的面朝向露出口153b，从而与母接口150b结合。
图6是示例性示出光学传感器组装体的传感器连接器的制造及设置过程的图。
传感器连接器150使得多个光纤210与光学传感器300光学结合。母接口150b表面贴装于电子装置10内部的基板15，并且光学传感器300能够以结合于雌性连接器150b的状态与基板15电连接。雄性连接器150a以结合于多个光纤210的状态向母接口150b内部插入紧固，从而使得光纤210的另一端212朝向光学传感器300。通过光纤210的另一端的光朝向光学传感器300，并且光学传感器300所生成的光通过另一端212向光纤210传递。
光学传感器300能够通过在印有导电路径313的基板310’或对其进行传递所获得的基板310上电结合光学传感器芯片320和/或反光二极管330来制造。导电路径313印制在基板310’的两面中的任意一面或两面上，并且可以与贯通基板310’的多个导电通孔314连接。导电路径313在附着有光学传感器芯片320和/或发光二极管330的位置附近形成有一端，并且另一端可以与导电通孔314电连接。在此，导电路径313的一端位于通过接线(wiring)能够与光学传感器芯片320和/或发光二极管330的接触垫电连接的位置。
光学传感器300的基板310通过沿着多个导电通孔314截断基板310’来制造。多个导电通孔314实际上可以形成为在相同的直线上排列。导电通孔314在内部的至少一部分，例如，在内侧面上还蒸镀导电物质，例如金属镀金。如果以使得导电通孔314的一部分剩余的形式截断，则可以利用截断的通孔314使得光学传感器300与电子装置10的基板15垂直结合。
光学传感器300与母接口150b的露出口153b结合，之后附着于基板15。在基板15上与导电通孔314相对应的位置配置有导电触头。导电通孔314，例如通过焊接能够与导电触头电连接。
另外，多个光纤210的另一端212插入公接口150a的差入口152a，从而使得至少一部分通过露出口153a能够向公接口150a外部露出。露出另一端212的光纤210沿竖直方向截断，从而多个光纤21的另一端212能够位于实际相同的平面上。
多个光纤210配置于公接口150a内部后，或者将露出的光纤210竖直截断后，为了使得多个光纤210固定，通过开口154a将合成树脂，例如光固化环氧树脂等注入公接口150a内部。在使得合成树脂固化后，将公接口150a插入母接口150b。雄性插口150a的紧固凸起155a在母接口150b的紧固槽155b中收纳，从而能够使得光学传感器300与多个光纤210光学结合。
图7是示例性示出光学传感器组装体的传感器连接器的另一个实施例的图。
光学传感器300所包括的光学传感器芯片320包括：光接收部321，其对传递至光纤210的光进行检测，从而生成电信号；电路，其在光接收部周围形成。类似地，发光二极管330也可以包括生成光的发光部及在发光部周围形成的电路。光学传感器芯片320的光接收部321接收向电子装 置10内部入射的周围光及反射的检测光。根据光接收部321在光学传感器芯片320的上面占据的面积、光接收部321的位置、和/或光接收部321-发光部之间的距离，配置多个光纤210的另一端212的位置可能不同。以下，假设光接收部321的右侧区域对反射的检测光进行接收，左侧区域对周围光进行接收。此外，假设竖直排列区间240使得16个光纤210按照三列(5-6-5)层叠。
图7的(a)及(b)示出了用于光学传感器芯片的露出口153a1、153a3和用于发光二极管的露出口153a2、153a4分离的结构。在此，用于光学传感器芯片的露出口153a1、153a3和用于发光二极管的露出口153a2、153a4的形状仅是示例性的，可以实施多种变更。
在图7的(a)中，15个另一端212a、212c可以在用于光学传感器芯片的露出口153a1配置，一个另一端212b可以在用于发光二极管的露出口153a2配置。发出周围光的另一端212a可以在用于光学传感器芯片的露出口153a1的左侧配置，发出反射的检测光的另一端212c可以在右侧配置。配置于发光二极管330所对应的位置的另一端212b接收检测光。例如，具有另一端212b的光纤210可以在中间列的最左侧配置，并且具有另一端212c的光纤210可以在各个列的最右侧配置。
在图7的(b)中，13个另一端212a、212c可以在用于光学传感器芯片的露出口153a3配置，三个另一端212b可以在用于发光二极管的露出口153a4配置。发出周围光的另一端212a可以在用于光学传感器芯片的露出口153a3的左侧配置，发出反射的检测光的另一端212c可以在右侧配置。例如，具有另一端212b的光纤210可以在各个列的最左侧配置，具有另一端212c的光纤210可以在各个列的最右侧配置。
图8是示例性示出光学传感器组装体的传感器连接器的又另一个实施例的图。
同时参照图81的(a)及(b)，光学传感器300的光学传感器芯片320与发光二极管330可以光学分离。图8的(a)如果使得公接口150a与母接口150b紧固，则光学传感器芯片320与发光二极管330示例性示出光学分离的结构，(b)示例性示出公接口150a与母接口150b紧固状态的截面。分离壁158b配置于母接口150b的露出口153b。并且，分离壁收纳槽158a可以形成于公接口150a的正面。在形成有分离壁收纳槽158a的结构中，分离壁158b的至少一部分可以收纳至分离壁收纳槽158a中。分离壁158b的高度h1可以大于光学传感器芯片320和发光二极管33中更厚的芯片的厚度。
参照图8的(c)，光学传感器芯片320和发光二极管330光学分离的分离壁159a可以形成于公接口150a的正面。分离壁159a的高度h2在公接口150a与母接口150b紧固的状态下，可以等于或小于公接口150a的正面和光学传感器300的基板310之间的距离。
图9是示例性示出光学传感器的实施例的图。与图4至图8所示的光学传感器300相比时，图9所示的光学传感器300’还包括在光学传感器芯片320上部形成的透光镜341。以下说明中，用于光学传感器的透光镜341及用于发光二极管的透光镜342通过相同的工艺形成。但是发光二极管330能够以包括准直透镜(collimating lens)的状态附着于基板310，因此可以理解为，并非务必形成用于发光二极管的透光镜342。
同时参照图9的(a)及(b)，用于光学传感器的透光镜341及用于发光二极管的透光镜342分别形成于光学传感器芯片320和发光二极管330上部。图9的(a)示例性示出了包括透光镜的光学传感器300’，(b) 示例性地简略示出了在公接口150a和母接口150b紧固的状态下的光学传感器300’截面。用于光学传感器的透光镜341的功能在于增加从另一端212射出的周边光及反射的检测光的接收效果。用于发光二极管的透光镜342的功能在于提高发光二极管330生成的检测光的平直度。用于光学传感器的透光镜341及用于发光二极管的透光镜342形成于光学透明的透光镜支撑体340的上面。透光镜支撑体340可以例如将光固化环氧树脂在基板310或310’上按照规定厚度层叠来形成。用于光学传感器的透光镜341及用于发光二极管的透光镜342可以向透光镜模具按压光固化环氧树脂来形成。使得用于光学传感器的透光镜341及用于发光二极管的透光镜342形成于上面的透镜支撑体340可以通过例如紫外线等得以光固化。遮光壳350形成为包裹被固化的透光镜支撑体340。遮光壳350在其上面形成有用于光学传感器透光镜的开口351和用于发光二极管透光镜的开口352，以便使得用于光学传感器的透光镜341及用于发光二极管的透光镜342露出。并且，遮光壳350还可以包括对光学传感器芯片320和发光二极管330进行光学分离的分离壁353。
图10是示例性示出扁平连接器的一个实施例的图，图10的(a)表示盖体110a的正面、侧面及上面，(b)表示支撑体110b的正面、侧面及上面。
在图10的(a)中，在盖体110a、上板111a及上板111a的左右侧包括分别向下部延长的侧壁113a。在上板111a的底面112a可以形成多个半球形槽，所述多个半球形槽至少部分收纳光纤210。使得盖体110a和支撑体110b之间所配置的多个光纤210的至少一部分向外部露出的开口114a形成于上板111a。为了使得多个光纤210固定，能够通过开口154a将光固化环氧树脂等向公接口150a内部注入。使得多个盖体110a固定于支撑体110b的紧固凸起115a可以形成于侧壁113a。
在图10的(b)中，支撑体110b包括：下板111b；上部侧壁112b，其在下板111b的左右侧结合，并在水平方向上跨过下板111b延长；下部侧壁113b，其从上部侧壁112b的延长部分向下部延长；竖直壁114b，其从下板111b向下部延长，并在下部侧壁113b之间连接。在下板111b的上部配置有多个光纤210。在上部侧壁112b上，紧固槽115b在与紧固凸起115a相对应的位置上形成。盖体110a如果向相对的上部侧壁112b之间插入，从而紧固凸起115a收纳于紧固槽115b中，则盖体110a与支撑体110b得到紧固。上部侧壁112b的延长部分可以形成有用于插入镜子110c的插入槽114b。
图11是示例性示出扁平连接器的多种实施例的图。
扁平连接器110使得多个光纤210的一端211配置，并且为了接收向电子装置10内部入射的光，例如，在显示面板13和框架11之间配置支撑体110b的至少一部分。由下部侧壁113b及竖直壁114b所定义的空间110d为了使得进入扁平连接器110内部的光向多个光纤210入射，提供通过的光路。通过空间110d的光的行进方向和光纤210的长度方向实际上垂直，因此对光的行进方向进行变更的结构在图11的(a)、(b)及(c)中示例。
参照图11的(a)，示出了镜子110c，所述镜子110c以相对于光纤210的长度方向及通过空间110的光的行进方向大约成45度的形式倾斜配置。镜子110c使得从光纤210的一端211射出的检测光331大约弯折90度，从而朝向空间110d。另外，镜子110c使得进入空间110d的反射检测光332及周围光321大约弯折90度，从而朝向光纤210的一端211。在此，镜子110c可以用棱镜替代。
参照图11的(b)，光纤210的一端211’形成为大约倾斜45度，并且一端211’配置为朝向盖体111a侧。倾斜形成的一端211’是光纤210与空气之间的界面，使得从光纤210射出的光朝向空间110d弯折。另外，一端211’使得进入空间110d的反射检测光332及周围光321弯折，从而使其向光纤210的内部入射。
参照图11的(c)，可以使得竖直导光板110e在光纤210的一端211上光学结合。竖直导光板110e的一端是大约45度倾斜的倾斜面111e，并且倾斜面111e配置于朝向光纤210的一端211的对面。倾斜面111e是竖直导光板110e和空气之间的界面，可以使得光弯折并变更行进方向。从光纤210射出的检测光331在通过光学结合的光纤210和竖直导光板110之间界面后，被倾斜面111e弯折，并朝向竖直导光板110d的另一端。另外，向竖直导光板110e的另一端入射的反射检测光332及周围光321被倾斜面111e弯折，并朝向光纤210。
图12是示例性示出光学传感器组装体的另一个实施例的图，示出被曲线化的水平排列区间的光学传感器组装体100。
同时参照图12的(a)及(b)，水平排列区间220的至少一部分可以被曲线化。水平排列区间220可以包括第一直线区间221、曲线区间222及第二直线区间223。曲线区间222设置于第一直线区间221和第二直线区间222之间。曲线区间222能够使得多个光纤210的一端211直接光学结合于覆盖玻璃12的下面，并且第二直线区间222从电子装置10的框架11按照距离d分离。即使不存在曲线区间222，光学传感器封装100也能够使得多个光纤210的一端211直接光学结合于覆盖玻璃12的下面。此时，传感器连接器150应以近乎与框架11紧贴的形式配置，因此在电子装置10的内部结构设计上可能成为新的制约要素。因此，为了使得多个 光纤210直接结合于覆盖玻璃12下面的同时确保与框架11分离适当的距离d，可能需要曲线区间222。
在图12的(a)中，第一直线区间221与第二直线区间223实际上可以平行。距离d是第一直线区间221和第二直线区间223之间水平分离的距离，因此，传感器连接器150能够通过曲线区间222与框架11分离，从而配置于电子装置10内部的基板15。
另外，在图12的(b)中，第一直线区间221和第二直线区间223’可以实际上垂直。传感器连接器150通过曲线区间222与框架11分离至少距离d以上，从而能够配置于电子装置10内部的基板15。
图13是示例性示出光学传感器组装体的又另一个实施例的图，图12的(a)所示的结构中，传感器连接器150’一体形成于光纤。
多个光纤210和光学传感器300可以光学结合并一体化。结合部件340’通过在基板310或310’上部按照规定厚度层叠光学上透明的材质，例如光固化环氧树脂来形成，并且如果固化，则固定光纤210的另一端。如果光纤210的至少一部分插入固化的光固化环氧树脂，之后通过紫外线等固化，则通过结合部件340’与光学传感器300一体化。结合部件340’向光学传感器芯片320传递从光纤210的另一端212射出的周围光和/或反射的检测光，并能够向另一端212传递从发光二极管330射出的检测光。遮光壳350形成为包裹固化的结合部件340’。并且，遮光壳350还可包括对光学传感器芯片320和发光二极管330进行光学分离的分离壁353。
图14是示例性示出光学传感器组装体的又另一个实施例的图。
多个光纤210包括：用于光接收的光纤210a，其将周围光传递至光学传感器；用于光接收的光纤210c，其将反射的检测光传递至光学传感器 300；以及用于发光的光纤210b，其向外部传递检测光。为了减小或防止在检测光和反射的检测光之间可能发生的干扰(crosstalk)，用于光接收的光纤210c和用于发光的光纤210b可以按照规定的间隔配置。作为一个实施例，如图14所示，用于光接收的光纤210a、210c与用于发光的光纤210b可以按照规定的距离dc分离。作为另一个实施例，虽然示出了，但是用于光接收的光纤210c和用于发光的光纤210b能够通过配置于两者之间的多个用于光接收的光纤210a而实际按照规定的距离分离。另外，用于光接收的光纤210a、210c与用于发光的光纤210b可以被导热率较低的物质所形成的隔热部件120’涂覆。
以上本发明的说明是用于示例的，应理解，本发明所属技术领域内具有通常知识的人员在不变更本发明的技术思想或必要特征的前提下能够轻易变形为其他具体的形态。因此以上记述的实施例应理解为不是全面的示例且并非限定性的。尤其，参照附图所说明的本发明特征并非限定于特定附图所示的结构，并且可以独立或者与其他特征结合实现。
相比所述详细说明，本发明的范围在后述的权利要求范围中体现，并且根据权利要求范围的意义、范围以及其的均等概念所推导的全部变更或变形的形态所属于本发明的范围。

Claims (19)

  1. 一种光学传感器组装体，其特征在于，
    多个光纤，其中，所述多个光纤的一端配置为一列，而所述多个光纤的另一端按照两个以上的列层叠，从而由所述多个光纤的所述一端所形成的第一面的宽度大于由所述多个光纤的所述另一端所形成的第二面的宽度；
    传感器连接器，与所述第二面光学结合，
    其中，所述第一面接收向电子装置的内部入射的光，所述第一面所接收的光通过所述第二面向所述传感器连接器传递，
    所述传感器连接器能够与所述第一面分离，且配置于所述电子装置内部。
  2. 根据权利要求1所述的光学传感器组装体，其特征在于，
    所述多个光纤是塑料光纤(POF，Plastic optical fiber)。
  3. 根据权利要求2所述的光学传感器组装体，其特征在于，所述多个光纤包括：
    水平排列区间，其使得所述多个光纤的一端配置为一列；
    竖直排列区间，其使得所述多个光纤的另一端按照两个以上的列配置；以及
    变形区间，其连接所述水平排列区间和所述竖直排列区间，并且使得所述多个光纤弯曲。
  4. 根据权利要求3所述的光学传感器组装体，其特征在于，
    所述第二面形成为，使得所述光纤的另一端在各个列按照相同的个数层叠。
  5. 根据权利要求3所述的光学传感器组装体，其特征在于，
    所述第二面形成为，所述光纤的另一端层叠为三个以上的列，至少任意一列所层叠的个数与其余列所层叠的个数不同。
  6. 根据权利要求3所述的光学传感器组装体，其特征在于，
    所述第二面是多个。
  7. 根据权利要求1所述的光学传感器组装体，其特征在于，
    所述第一面配置于所述电子装置的框架和显示面板之间的空间。
  8. 根据权利要求1所述的光学传感器组装体，其特征在于，所述传感器连接器包括：
    公接口，其使得所述多个光纤的另一端向内部插入并固定；
    母接口，其在内部收纳所述公接口；以及
    光学传感器，其在朝向所述公接口的方向上与所述母接口结合。
  9. 根据权利要求8所述的光学传感器组装体，其特征在于，所述光学传感器包括：
    基板，其使得多个截断的通孔在侧面排列；
    光学传感器芯片，其配置于所述基板的上面，并与所述多个截断的通孔电连接；以及
    发光二极管，其在所述基板的上面与所述光学传感器芯片分离配置，并与所述多个截断的通孔电连接。
  10. 根据权利要求9所述的光学传感器组装体，其特征在于，
    所述母接口还包括对所述光学传感器芯片和所述发光二极管进行光学分离的分离壁。
  11. 根据权利要求9所述的光学传感器组装体，其特征在于，
    所述公接口还包括对所述光学传感器芯片和所述发光二极管进行光学分离的分离壁。
  12. 根据权利要求9所述的光学传感器组装体，其特征在于，
    所述光学传感器还包括设置于所述光学传感器芯片上部的光学传感器透光镜。
  13. 根据权利要求1所述的光学传感器组装体，其特征在于，
    所述光学传感器组装体还包括扁平连接器，所述扁平连接器将所述多个光纤的所述一端收纳于内部，
    所述扁平连接器能够提供光路，所述光路使得向所述电子装置内部入射的光朝向所述一端行进。
  14. 根据权利要求13所述的光学传感器组装体，其特征在于，所述扁平连接器包括：
    盖体，其在内部形成有半球形槽，所述半球形槽收纳所述光纤的至少一部分；以及
    支撑体，其配置有所述多个光纤，并与所述盖体紧固，从而固定所述多个光纤。
  15. 根据权利要求13所述的光学传感器组装体，其特征在于，
    所述光学传感器组装体还包括镜子，所述镜子分别相对于所述多个光纤及所述光路倾斜配置。
  16. 根据权利要求13所述的光学传感器组装体，其特征在于，
    所述多个光纤的一端是倾斜面。
  17. 根据权利要求13所述的光学传感器组装体，其特征在于，
    所述光学传感器组装体还包括竖直导光板，所述竖直导光板配置于所述光路，以便光学结合于所述多个光纤的一端，并且结合区域的对面是倾斜面。
  18. 根据权利要求1所述的光学传感器组装体，其特征在于，
    所述光学传感器组装体还包括隔热部件，所述隔热部件对所述多个光纤进行保护。
  19. 根据权利要求1所述的光学传感器组装体，其特征在于，所述多个光纤包括：
    用于发光的光纤，其向外部传递检测光；以及
    用于光接收的光纤，其传递从外部入射的反射检测光，所述用于发光的光纤和所述用于光接收的光纤分离配置。
PCT/CN2020/074012 2019-01-28 2020-01-23 光学传感器组装体 WO2020156486A1 (zh)

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