WO2020143262A1 - Plateforme d'opération de polissage chimico-mécanique et appareil de polissage chimico-mécanique - Google Patents

Plateforme d'opération de polissage chimico-mécanique et appareil de polissage chimico-mécanique Download PDF

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Publication number
WO2020143262A1
WO2020143262A1 PCT/CN2019/111089 CN2019111089W WO2020143262A1 WO 2020143262 A1 WO2020143262 A1 WO 2020143262A1 CN 2019111089 W CN2019111089 W CN 2019111089W WO 2020143262 A1 WO2020143262 A1 WO 2020143262A1
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WO
WIPO (PCT)
Prior art keywords
chemical mechanical
sub
polishing head
mechanical polishing
polishing
Prior art date
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PCT/CN2019/111089
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English (en)
Chinese (zh)
Inventor
尹影
李婷
刘福强
白琨
费玖海
Original Assignee
北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所）
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Application filed by 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） filed Critical 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所）
Publication of WO2020143262A1 publication Critical patent/WO2020143262A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages

Definitions

  • This application relates to the technical field of polishing equipment, in particular, to a chemical mechanical polishing table and chemical mechanical polishing equipment.
  • CMP chemical mechanical polishing
  • polishing head modules there are 4 polishing head modules and 4 Sweep modules that implement the Sweep (lateral movement) process on the working table.
  • the four polishing head modules can rotate 270° along with the rotary table, so that the upper and lower pieces of each polishing head module can be switched between the three polishing disk stations.
  • the existing chemical mechanical polishing machine has the following shortcomings: 1. Due to the uneven force of the work table during normal operation, the life of the rotating work table is greatly reduced, and at the same time the vibration and instability of the work table leads to the polishing of the wafer The quality is greatly reduced. 2. As multiple polishing head modules rotate with the rotary table, the structure of the rotary table is complicated, the volume is huge, the design difficulty is increased, and the maintenance difficulty and cost are increased. 3. Since each polishing head module can realize the upper and lower wafers and the switching between the polishing stations leads to cross contamination between the polishing discs, WTWNU% (non-uniformity between wafers: describes the film between multiple silicon wafers The change in layer thickness) is difficult to control.
  • this application provides a chemical mechanical polishing table.
  • the polishing head modules correspond to the table one by one.
  • the polishing head modules can move linearly and have a large travel distance.
  • the two adjacent working tables are separated by a partition. Open to prevent it from interfering with each other and staining, simple structure and convenient operation, so that at least one of the above problems can be improved.
  • This application also proposes a chemical mechanical polishing device.
  • a chemical mechanical polishing working platform includes a polishing head bracket configured to be installed at a preset center of the working platform, the polishing head bracket includes a plurality of sub-brackets, and the plurality of sub-brackets Around the preset center, each of the sub-brackets is provided with a sliding track toward the preset center, the sliding track is configured to slidably connect the polishing head moving module and the sub-bracket;
  • the chemical mechanical polishing working platform of the embodiment of the present application there is no need to rotate the polishing head bracket, which avoids the reduction of the life of the rotating polishing head bracket due to the uneven force of different sub-brackets; the working platform has a simple structure, small size, and low design difficulty , Low maintenance difficulty and low cost; Since the polishing head bracket does not need to rotate, the length of the sliding track provided on the sub-bracket can be lengthened accordingly, so that the linear travel of the polishing head module increases; the setting of the separator ensures that The two adjacent worktables are relatively independent, which avoids cross contamination of the two adjacent worktables during work and improves the cleanliness of the product.
  • the chemical mechanical polishing work platform according to the embodiment of the present application also has the following additional technical features:
  • an area between two adjacent partitions is set as a polishing work area, and the worktable is located in the polishing work area.
  • the space in the polishing work area formed between any two of the partitions is the same.
  • the polishing head bracket further includes a center pillar
  • the polishing head bracket further includes a center pillar
  • the plurality of sub-brackets meet at the center of the polishing head bracket and form a polishing head bracket body
  • the center pillar Located at the center of the polishing head bracket and detachably connected to the body of the polishing head bracket, the center pillar is configured to be installed at a preset center of the working platform, and each of the partitions is connected to the center pillar The distance is equal.
  • Multiple sub-brackets form the polishing head bracket body.
  • the polishing head bracket body can be either integrally formed or spliced from multiple sub-brackets; the center pillar is installed at the preset center of the working platform to ensure that the polishing head bracket is placed smoothly; each The distance between the partitions and the central column is equal, which is convenient for the setting of the partitions; at the same time, the partitions can block the corresponding worktables on both sides to a greater extent, which facilitates the cooperation of the partitions and different worktables.
  • the plurality of sub-brackets are rotationally symmetrically arranged along the preset center.
  • the setting of multiple sub-brackets ensures that the geometric center of the polishing head bracket is balanced, and at the same time ensures that the distance between the partition and the adjacent two partitions is the same, and is suitable for being configured as a workbench of various specifications.
  • the number of the sub-brackets is greater than or equal to three.
  • the number of the sub-brackets is four, and the four sub-brackets form a cross structure.
  • the cross structure can reasonably use the installation space under the condition of ensuring the process requirements, so that there is a large working space between the two adjacent partitions, which is convenient for the user to operate.
  • the distance between the partition and the preset center is greater than or equal to the distance from the worktable to the preset center.
  • the distance between the partition and the preset center is greater than or equal to the distance from the worktable to the preset center, which can make the two ends of the partition better cover the worktable, ensure the isolation of the adjacent two worktables, and avoid cross contamination.
  • the center of each worktable is located on a preset circle, and the center of the circle of the preset circle is concentric with the preset center.
  • the center of all the worktables is located on the preset circumference, which is convenient for the positioning of the worktable, and at the same time, it can better match the setting of the partition.
  • the center line of each of the partitions is located on a preset circumference.
  • the centerlines of all the partitions are on the preset circumference, and the centerline of the partition and the center of the worktable are on the same circumference.
  • the partition includes a partition body and a base mounted on the partition body.
  • the base is configured to be mounted on the working platform and support the partition body.
  • the partition body is installed on the working platform through a base, and the base supports the partition body to prevent the partition body from tilting.
  • the partition body is detachably connected to the base.
  • the partition is a transparent plate.
  • the transparent partition makes it easy to observe the work of the adjacent workbench.
  • multiple sub-brackets are integrally formed.
  • a plurality of the sub-brackets are sequentially spliced to form the polishing head bracket.
  • the length of the sub-bracket is greater than the diameter of the worktable.
  • the chemical mechanical polishing apparatus includes the chemical mechanical polishing workbench according to the embodiment of the present application.
  • it also includes a polishing head moving module and a polishing head module;
  • the polishing head module is connected to the sub-bracket through the polishing head moving module, the polishing head moving module is slidably connected to the sliding track, and the polishing head moving module is configured to drive the The polishing head module moves relative to the sub-bracket.
  • the polishing head moving module includes a plurality of sliders and connecting parts
  • Each of the sub-brackets has at least two slide rails arranged in parallel, each of the slide rails is provided with the slider, and a plurality of the sliders are all connected to the connection part, and the connection The part can be connected to the polishing head module through the sub-bracket, and each polishing head module is configured to be connected to at least two sliders.
  • it also includes a linear drive mechanism
  • the linear drive mechanism is provided in a one-to-one correspondence with the sub-brackets, each linear drive mechanism is connected to any one of the sliders on the corresponding sub-brackets, and the linear drive device is configured to The block drives the polishing head module to move relative to the sub-bracket.
  • the chemical mechanical polishing workbench as described above has a simple structure and convenient operation, prevents cross contamination of two adjacent workbenches, and improves the cleanliness of the working environment.
  • FIG. 1 is a schematic structural diagram of a chemical mechanical polishing work platform according to an embodiment of the present application from a first perspective;
  • FIG. 2 is a schematic structural view of a chemical mechanical polishing work platform according to an embodiment of the present application from a second perspective;
  • FIG. 3 is a schematic structural view of a chemical mechanical polishing work platform according to an embodiment of the present application from a third perspective;
  • FIG. 4 is a schematic diagram of the structure of the separator of FIG. 1;
  • FIG. 5 is a schematic structural diagram of a chemical mechanical polishing device according to an embodiment of the present application.
  • Icon 100-Chemical Mechanical Polishing Work Platform; 200-Chemical Mechanical Polishing Equipment; 1-Polishing Head Bracket; 11-Polishing Head Bracket Body; 111-Sub Bracket; 112-Sliding Track; 12-Center Pillar; 2-Workbench; 21- preset circle; 3- separator; 31- polishing work area; 32- separator body; 33- base; 4- preset center; 51- polishing head moving module; 52- polishing head module.
  • orientation or positional relationship indicated by the terms “inner” and “outer” is based on the orientation or positional relationship shown in the drawings, or is usually placed when the product of this application is used
  • the orientation or position relationship is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the application.
  • first”, “second”, etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two components.
  • setup and “connection” should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two components.
  • the chemical mechanical polishing work platform 100 according to an embodiment of the present application is described below with reference to the drawings.
  • the chemical mechanical polishing work platform 100 includes a polishing head holder 1, a plurality of workbenches 2, and a plurality of partition plates 3.
  • the polishing head bracket 1 is a frame structure, and serves to support the polishing head module.
  • the polishing head bracket 1 is configured to be installed on a preset center 4 of the working platform, and the preset center 4 can be understood as Configured as a point of positioning.
  • the polishing head bracket 1 is relatively fixed to the working platform.
  • the polishing head bracket 1 includes a polishing head bracket body 11.
  • the polishing head bracket body 11 includes a plurality of sub-brackets 111.
  • the plurality of sub-brackets 111 are distributed around the preset center 4.
  • the plurality of sub-brackets 111 intersects with the center of the polishing head holder body 11, a plurality of sub-brackets 111 can share the force of the central part of the polishing head holder 1; the length direction of the sub-brackets 111 points to the preset center 4, each sub-bracket 111 is provided with a A sliding rail 112 extending from the center 4 is provided.
  • the sliding rail 112 is configured to slidably connect the polishing head moving module and the sub-bracket 111. When the polishing head moving module works, it can drive the polishing head module to slide relative to the sub-bracket 111 on the sliding track 112.
  • Each workbench 2 corresponds to a sub-bracket 111.
  • the workbench 2 is located below the sub-bracket 111 and is configured to cooperate with the polishing head module connected to the sub-bracket 111.
  • Each partition 3 is disposed between two adjacent sub-branches 111 of the plurality of sub-brackets 111, and the partition 3 is vertically disposed and extends toward the preset center 4 to ensure that the partition 3 can block the work of the adjacent two Taiwan 2.
  • the area between two adjacent partitions 3 is a polishing work area 31, and the workbench 2 is located in the polishing work area 31. During work, the debris generated by the polishing operation is blocked by the partition 3, so that the two adjacent workbenches 2 will not cross-contaminate.
  • the polishing head bracket 1 is fixed relative to the working platform, and the sub-bracket 111 sets a long-stroke sliding rail 112 to increase the service life of the polishing head bracket 1 and ensure the polishing quality;
  • a partition 3 is provided on the brackets of two adjacent worktables 2, so as to ensure that the two adjacent workbenches 2 are shielded, prevent cross contamination of the two, and improve the polishing quality.
  • the polishing head holder body 11 is a structural form in which a plurality of sub-brackets 111 are integrally formed. It should be pointed out that the polishing head holder body 11 can be formed by integrally forming a plurality of sub-brackets 111, and can also be formed by splicing a plurality of sub-brackets 111. The user can select different polishing head bracket bodies 11 according to the actual situation Structural form.
  • the polishing head holder 1 further includes a center pillar 12, which is located at the center of the body 11 of the polishing head holder, and the center pillar 12 is configured to be installed on the preset center 4 of the working platform, and the center pillar 12 It plays the role of supporting the polishing head holder body 11.
  • the distance between each partition 3 and the center pillar 12 (the distance between the end of the partition 3 close to the center pillar 12 and the center pillar 12) is equal, which facilitates the positioning and setting of the partition 3.
  • the partition plate 3 can shield the corresponding workbenches 2 on both sides to a greater extent in its extending direction, so as to realize the cooperation between the partition plate 3 and different workbenches 2.
  • the polishing head holder 1 is in a static state and does not change displacement with the polishing head holder 1, which solves the problem of reduced service life caused by rotation in the prior art.
  • the length of the sub-bracket 111 is greater than the diameter of the table 2 to ensure that the polishing head module completes the polishing operation within the contour of the table 2 when the polishing head module moves on the slide rail 112.
  • the connection method between the center pillar 12 and the polishing head holder body 11 may be a fixed connection (for example, welding) or a detachable connection (for example, a plug connection, a snap connection, a screw connection, etc.); as an optional method of the present application, the center The pillar 12 and the polishing head holder body 11 are connected by threads, which is not only convenient for assembly, but also can achieve a firm connection.
  • the plurality of sub-brackets 111 are rotationally symmetrically distributed along the preset center 4. It can be understood that the plurality of sub-brackets 111 are rotationally symmetrical about the center pillar 12.
  • the distribution of the multiple sub-brackets 111 ensures that the geometric center of the polishing head bracket 1 (center pillar 12) is balanced. At the same time, it is ensured that the distance between the partition 3 and the two adjacent partitions 3 is the same, that is, the space between the two adjacent polishing work areas 31 is the same, so as to be suitably configured as a workbench 2 of various specifications.
  • the number of the sub-brackets 111 is four, and the four sub-brackets 111 form a cross structure.
  • the four sub-brackets 111 can meet the four working tables 2 working at the same time to ensure the processing requirements; in addition, each polishing work area 31 has a space similar to a quarter circle, and the installation space is reasonably used to facilitate the user in the polishing work area 31 ⁇ Internal operation.
  • the number of sub-brackets 111 can be in various forms, and the user can select according to the actual situation. In order to ensure the stability of the polishing head bracket 1, the number of sub-brackets 111 is preferably greater than or equal to three, which is convenient for ensuring the center The supporting effect of the pillar 12.
  • the distance between the partition 3 and the preset center 4 is greater than or equal to the distance from the workbench 2 to the preset center 4.
  • the projection of the partition plate 3 is closer to the center of the working platform than the projection of the working table 2.
  • the position of the partition 3 is set to surround the workbench 2 in the polishing work zone 31, which can effectively shield the workbench 2, prevent interference and contamination between two adjacent workbenches 2, and guarantee the polishing quality.
  • the center of each workbench 2 is located on the preset circumference 21, and the center of the preset circumference 21 is concentric with the preset center 4, so that multiple workbenches 2 are distributed around the preset center 4.
  • the centers of the multiple worktables 2 are located on the same circumference (preset circumference 21), which ensures the uniform positioning of the multiple worktables 2, which facilitates the barrier 3 to the worktable 2 and ensures the independent work space of the worktable 2.
  • the center line of each partition 3 is located on the preset circumference 21, where the center line refers to the geometric center line of the partition 3, that is, when the partition 3 is placed on the working platform, the partition 3 and the working platform Vertical centerline.
  • the center lines of all the partitions 3 are located on the same circumference (preset circumference 21), which ensures the accurate positioning of the partition 3, and facilitates the assembly of the partition 3 with the workbench 2 and the polishing head bracket 1.
  • the center line of the partition 3 and the center of the table 2 are located on the same circumference.
  • the partition 3 can effectively isolate the two adjacent workbenches 2, prevent the cross-contamination of the adjacent two workbenches 2, and improve the polishing quality.
  • the partition 3 includes a partition body 32 and a base 33 installed on the partition body 32.
  • the base 33 functions to support the partition body 32, and the base 33 is configured to be installed on the working platform.
  • the partition body 32 is installed on the working platform through the base 33, which facilitates positioning and support of the partition body 32 and prevents the partition body 32 from tilting.
  • the partition body 32 has a certain thickness and can stand upright on the working platform; the partition body 32 and the base 33 are detachably connected to facilitate replacement of the partition body 32.
  • the detachable connection method of the partition plate 3 and the base 33 can be in various forms, such as snap connection, plug connection, or screw connection, etc., and the user can select according to the actual situation.
  • the partition 3 is a transparent plate.
  • the transparent setting of the partition plate 3 is convenient for the user to observe the polishing condition in the adjacent polishing work area 31.
  • the use of the transparent plate to facilitate the penetration of light improves the display effect and facilitates the observation of the polishing condition on the workbench 2.
  • the center pillar 12 of the polishing head bracket 1 is installed at the preset center 4 position of the working platform, and the working table 2 is provided below each sub-bracket 111 between two adjacent sub-brackets 111
  • a partition 3 is provided to isolate the two adjacent workbenches 2; the polishing head module is slidably connected to the sliding rail 112 of the sub-bracket 111.
  • the polishing head module can be separated under the driving of the polishing head moving module
  • the bracket 111 moves up.
  • the chemical mechanical polishing table 2 has a simple structure and convenient operation, and cooperates with the polishing head module, so that each polishing head module corresponds to a working table 2 to prevent the two adjacent working tables 2 from interfering with each other Defiled to ensure the cleanliness of polishing.
  • the chemical mechanical polishing apparatus 200 includes the chemical mechanical polishing table 2 of the above embodiment.
  • the chemical mechanical polishing apparatus 200 further includes a polishing head moving module 51 and a polishing head module 52.
  • the polishing head module 52 is connected to the sub-bracket 111 through the polishing head moving module 51, and the polishing head moving module 51 is slidably connected to the sliding rail 112.
  • the polishing head moving module 51 can drive the polishing head module 52 relative to the sub The support 111 moves, so that the polishing head module 52 is configured to different positions of the working table 2.
  • the above-mentioned chemical mechanical polishing workbench 2 has a simple structure and convenient operation, prevents cross contamination of two adjacent workbenches 2, improves the cleanliness of the working environment, and improves the polishing quality.
  • the polishing head moving module 51 includes a plurality of sliders and a connecting portion; each sub-bracket 111 has at least two slide rails 112 arranged in parallel, and each slide rail 112 is provided with a slider and a plurality of slides
  • the blocks are all connected to the connecting part, and the connecting part can be connected to the polishing head module 52 through the sub-bracket 111, and each polishing head module 52 is configured to be connected to at least two sliders.
  • the polishing head moving module 51 utilizes the sliding manner of the slider and the sliding rail 112. After the polishing head module 52 is connected to a plurality of sliders through the connecting portion, when the slider is along When the sliding rail 112 slides, it also drives the polishing head module 52 to move along the sub-bracket 111.
  • each polishing head module 52 is configured to be connected to at least two sliders, and the two sliders are respectively disposed on two parallel sliding rails 112 to enable It is ensured that when the polishing head module 52 moves, there will be support in multiple directions, which ensures the stability of the polishing head module 52 when moving.
  • a linear drive mechanism is also included; the linear drive mechanism is provided in one-to-one correspondence with the sub-brackets 111, each linear drive mechanism is connected to any slider on the corresponding sub-bracket 111, and the linear drive device is configured to be driven by the slider
  • the polishing head module 52 moves relative to the sub-bracket 111.
  • the linear drive mechanism may use a hydraulic cylinder, air cylinder, etc., by using the linear drive mode of the hydraulic cylinder to push the corresponding slider to move along the slide rail 112, because a plurality of sliders are connected into an integrated structure through the connecting portion, and When a hydraulic cylinder pushes a slider to slide, it also causes multiple sliders to move synchronously.
  • linear driving mechanism may also use a linear stepping motor, which will not be repeated here.
  • a chemical mechanical polishing work platform provided by an embodiment of the present application has a simple structure and convenient operation, and cooperates with a polishing head module, so that each polishing head module corresponds to a worktable, preventing adjacent two worktables from interfering with each other and staining , To ensure the cleanliness of polishing.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

La présente invention concerne une plateforme d'opération de polissage chimico-mécanique et un appareil de polissage chimico-mécanique comprenant un support de tête de polissage (1). Le support de tête de polissage (1) comprend de multiples supports de branche (111). Les multiples supports de branche (111) sont répartis autour d'un centre préconçu (4). Un rail de coulissement (112) s'étendant vers le centre préconçu (4) est disposé sur chaque support de branche (111). Le rail de coulissement (112) est conçu pour raccorder de manière coulissante un module mobile de tête de polissage (51) au support de branche (111). Chaque plateforme d'opération (2) correspond à un support de branche (111), et est située au-dessous de chaque support de branche (111) correspondant. La plateforme d'opération de polissage chimico-mécanique comprend en outre de multiples plaques de séparation (3) disposées respectivement entre deux supports de branche (111) adjacents des multiples supports de branche (111). Les plaques de séparation (3) sont disposées verticalement, s'étendent vers le centre préconçu (4), et protègent l'une de l'autre deux plateformes d'opération (2) adjacentes. Sur la plateforme d'opération de polissage chimico-mécanique et l'appareil de polissage chimico-mécanique, chaque module de tête de polissage (52) correspond à une plateforme d'opération (2), empêchant ainsi les modules de tête de polissage de se gêner et de se contaminer mutuellement. Le module de tête de polissage (52) peut se déplacer facilement sur le rail de coulissement (112), et l'invention est facile à utiliser. L'appareil de polissage chimico-mécanique utilisant la plateforme d'opération de polissage chimico-mécanique améliore la qualité de polissage.
PCT/CN2019/111089 2019-01-11 2019-10-14 Plateforme d'opération de polissage chimico-mécanique et appareil de polissage chimico-mécanique WO2020143262A1 (fr)

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CN201910027868.3A CN109500724A (zh) 2019-01-11 2019-01-11 化学机械抛光工作台及化学机械抛光设备
CN201910027868.3 2019-01-11

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CN112405330B (zh) * 2020-12-08 2021-09-07 杭州众硅电子科技有限公司 一种抛光装置
CN113385978A (zh) * 2021-05-31 2021-09-14 王娟 一种可对加工废屑处理的汽车机械部件加工装置

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