WO2020143262A1

WO2020143262A1 - Chemical mechanical polishing operation platform and chemical mechanical polishing apparatus

Info

Publication number: WO2020143262A1
Application number: PCT/CN2019/111089
Authority: WO
Inventors: 尹影; 李婷; 刘福强; 白琨; 费玖海
Original assignee: 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所）
Priority date: 2019-01-11
Filing date: 2019-10-14
Publication date: 2020-07-16
Also published as: CN109500724A; TW202026099A

Abstract

A chemical mechanical polishing operation platform and a chemical mechanical polishing apparatus comprising a polishing head support (1). The polishing head support (1) comprises multiple branch supports (111). The multiple branch supports (111) are distributed around a pre-configured center (4). A sliding rail (112) extending towards the pre-configured center (4) is provided on each branch support (111). The sliding rail (112) is configured to slidably connect a polishing head movable module (51) to the branch support (111). Each operation platform (2) corresponds to one branch support (111), and is located below each corresponding branch support (111). The chemical mechanical polishing operation platform further comprises multiple partition plates (3) respectively provided between two adjacent branch supports (111) of the multiple branch supports (111). The partition plates (3) are vertically provided, extend towards the pre-configured center (4), and shield two adjacent operation platforms (2) from each other. On the chemical mechanical polishing operation platform and the chemical mechanical polishing apparatus, each polishing head module (52) corresponds to one operation platform (2), thereby preventing the polishing head modules from interfering with and contaminating each other. The polishing head module (52) can move easily on the sliding rail (112), and the invention is easy to operate. The chemical mechanical polishing apparatus employing the chemical mechanical polishing operation platform improves the quality of polishing.

Description

Chemical mechanical polishing table and chemical mechanical polishing equipment

Cross-reference of related applications

This application requires the priority of the Chinese patent application with the application number 201910027868.3 and the name "Chemical Mechanical Polishing Workbench and Chemical Mechanical Polishing Equipment" submitted to the Chinese Patent Office on January 11, 2019, the entire contents of which are incorporated herein by reference Applying.

Technical field

This application relates to the technical field of polishing equipment, in particular, to a chemical mechanical polishing table and chemical mechanical polishing equipment.

Background technique

In the production process of large-scale integrated circuits, planarizing the deposits on the wafer is a necessary and frequent process. At present, the chemical mechanical polishing (CMP) process is mainly used to complete this process, and the chemical mechanical polishing machine is the main equipment to complete this process.

In the technical solution of the prior art, there are 4 polishing head modules and 4 Sweep modules that implement the Sweep (lateral movement) process on the working table. The four polishing head modules can rotate 270° along with the rotary table, so that the upper and lower pieces of each polishing head module can be switched between the three polishing disk stations.

The existing chemical mechanical polishing machine has the following shortcomings: 1. Due to the uneven force of the work table during normal operation, the life of the rotating work table is greatly reduced, and at the same time the vibration and instability of the work table leads to the polishing of the wafer The quality is greatly reduced. 2. As multiple polishing head modules rotate with the rotary table, the structure of the rotary table is complicated, the volume is huge, the design difficulty is increased, and the maintenance difficulty and cost are increased. 3. Since each polishing head module can realize the upper and lower wafers and the switching between the polishing stations leads to cross contamination between the polishing discs, WTWNU% (non-uniformity between wafers: describes the film between multiple silicon wafers The change in layer thickness) is difficult to control.

Application content

In view of the above problems, this application provides a chemical mechanical polishing table. The polishing head modules correspond to the table one by one. The polishing head modules can move linearly and have a large travel distance. The two adjacent working tables are separated by a partition. Open to prevent it from interfering with each other and staining, simple structure and convenient operation, so that at least one of the above problems can be improved.

This application also proposes a chemical mechanical polishing device.

A chemical mechanical polishing working platform according to an embodiment of the present application includes a polishing head bracket configured to be installed at a preset center of the working platform, the polishing head bracket includes a plurality of sub-brackets, and the plurality of sub-brackets Around the preset center, each of the sub-brackets is provided with a sliding track toward the preset center, the sliding track is configured to slidably connect the polishing head moving module and the sub-bracket; A plurality of worktables matched with the polishing head module, each of the worktables corresponds to one of the sub-brackets, the worktable is located under the sub-brackets; and a plurality of partitions, each of the partitions It is disposed between two adjacent sub-brackets in the plurality of sub-brackets, the partition is vertically disposed and extends toward the preset center, and the partition is configured to shield the two adjacent worktables .

According to the chemical mechanical polishing working platform of the embodiment of the present application, there is no need to rotate the polishing head bracket, which avoids the reduction of the life of the rotating polishing head bracket due to the uneven force of different sub-brackets; the working platform has a simple structure, small size, and low design difficulty , Low maintenance difficulty and low cost; Since the polishing head bracket does not need to rotate, the length of the sliding track provided on the sub-bracket can be lengthened accordingly, so that the linear travel of the polishing head module increases; the setting of the separator ensures that The two adjacent worktables are relatively independent, which avoids cross contamination of the two adjacent worktables during work and improves the cleanliness of the product.

In addition, the chemical mechanical polishing work platform according to the embodiment of the present application also has the following additional technical features:

Optionally, an area between two adjacent partitions is set as a polishing work area, and the worktable is located in the polishing work area.

Optionally, the space in the polishing work area formed between any two of the partitions is the same.

Optionally, the polishing head bracket further includes a center pillar, the polishing head bracket further includes a center pillar, the plurality of sub-brackets meet at the center of the polishing head bracket and form a polishing head bracket body, the center pillar Located at the center of the polishing head bracket and detachably connected to the body of the polishing head bracket, the center pillar is configured to be installed at a preset center of the working platform, and each of the partitions is connected to the center pillar The distance is equal. Multiple sub-brackets form the polishing head bracket body. The polishing head bracket body can be either integrally formed or spliced from multiple sub-brackets; the center pillar is installed at the preset center of the working platform to ensure that the polishing head bracket is placed smoothly; each The distance between the partitions and the central column is equal, which is convenient for the setting of the partitions; at the same time, the partitions can block the corresponding worktables on both sides to a greater extent, which facilitates the cooperation of the partitions and different worktables.

Optionally, the plurality of sub-brackets are rotationally symmetrically arranged along the preset center. The setting of multiple sub-brackets ensures that the geometric center of the polishing head bracket is balanced, and at the same time ensures that the distance between the partition and the adjacent two partitions is the same, and is suitable for being configured as a workbench of various specifications.

Optionally, the number of the sub-brackets is greater than or equal to three.

Optionally, the number of the sub-brackets is four, and the four sub-brackets form a cross structure. The cross structure can reasonably use the installation space under the condition of ensuring the process requirements, so that there is a large working space between the two adjacent partitions, which is convenient for the user to operate.

Optionally, the distance between the partition and the preset center is greater than or equal to the distance from the worktable to the preset center. The distance between the partition and the preset center is greater than or equal to the distance from the worktable to the preset center, which can make the two ends of the partition better cover the worktable, ensure the isolation of the adjacent two worktables, and avoid cross contamination.

Optionally, the center of each worktable is located on a preset circle, and the center of the circle of the preset circle is concentric with the preset center. The center of all the worktables is located on the preset circumference, which is convenient for the positioning of the worktable, and at the same time, it can better match the setting of the partition.

Optionally, the center line of each of the partitions is located on a preset circumference. The centerlines of all the partitions are on the preset circumference, and the centerline of the partition and the center of the worktable are on the same circumference. When the partition is rotated along the preset circumference until the centerline of the partition coincides with the center of the worktable, The distance between the two ends of the partition and the two ends of the corresponding worktable is equal, and the partition can effectively isolate the two adjacent worktables.

Optionally, the partition includes a partition body and a base mounted on the partition body. The base is configured to be mounted on the working platform and support the partition body. The partition body is installed on the working platform through a base, and the base supports the partition body to prevent the partition body from tilting.

Optionally, the partition body is detachably connected to the base.

Optionally, the partition is a transparent plate. The transparent partition makes it easy to observe the work of the adjacent workbench.

Optionally, multiple sub-brackets are integrally formed.

Optionally, a plurality of the sub-brackets are sequentially spliced to form the polishing head bracket.

Optionally, the length of the sub-bracket is greater than the diameter of the worktable.

The chemical mechanical polishing apparatus according to the embodiment of the present application includes the chemical mechanical polishing workbench according to the embodiment of the present application.

Optionally, it also includes a polishing head moving module and a polishing head module;

The polishing head module is connected to the sub-bracket through the polishing head moving module, the polishing head moving module is slidably connected to the sliding track, and the polishing head moving module is configured to drive the The polishing head module moves relative to the sub-bracket.

Optionally, the polishing head moving module includes a plurality of sliders and connecting parts;

Each of the sub-brackets has at least two slide rails arranged in parallel, each of the slide rails is provided with the slider, and a plurality of the sliders are all connected to the connection part, and the connection The part can be connected to the polishing head module through the sub-bracket, and each polishing head module is configured to be connected to at least two sliders.

Optionally, it also includes a linear drive mechanism;

The linear drive mechanism is provided in a one-to-one correspondence with the sub-brackets, each linear drive mechanism is connected to any one of the sliders on the corresponding sub-brackets, and the linear drive device is configured to The block drives the polishing head module to move relative to the sub-bracket.

According to the chemical mechanical polishing equipment of the embodiment of the present application, the chemical mechanical polishing workbench as described above has a simple structure and convenient operation, prevents cross contamination of two adjacent workbenches, and improves the cleanliness of the working environment.

Additional aspects and advantages of the present application will be partially given in the following description, and some will become apparent from the following description, or be learned through practice of the present application.

BRIEF DESCRIPTION

In order to more clearly explain the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so they are not It should be regarded as a limitation on the scope. For those of ordinary skill in the art, without paying any creative labor, other related drawings can also be obtained based on these drawings.

FIG. 1 is a schematic structural diagram of a chemical mechanical polishing work platform according to an embodiment of the present application from a first perspective;

2 is a schematic structural view of a chemical mechanical polishing work platform according to an embodiment of the present application from a second perspective;

3 is a schematic structural view of a chemical mechanical polishing work platform according to an embodiment of the present application from a third perspective;

4 is a schematic diagram of the structure of the separator of FIG. 1;

5 is a schematic structural diagram of a chemical mechanical polishing device according to an embodiment of the present application.

Icon: 100-Chemical Mechanical Polishing Work Platform; 200-Chemical Mechanical Polishing Equipment; 1-Polishing Head Bracket; 11-Polishing Head Bracket Body; 111-Sub Bracket; 112-Sliding Track; 12-Center Pillar; 2-Workbench; 21- preset circle; 3- separator; 31- polishing work area; 32- separator body; 33- base; 4- preset center; 51- polishing head moving module; 52- polishing head module.

detailed description

To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein can be arranged and designed in various configurations.

Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, therefore, once an item is defined in one drawing, there is no need to further define and explain it in subsequent drawings.

In the description of this application, it should be noted that the orientation or positional relationship indicated by the terms "inner" and "outer" is based on the orientation or positional relationship shown in the drawings, or is usually placed when the product of this application is used The orientation or position relationship is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the application. In addition, the terms "first", "second", etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms “setup” and “connection” should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

The chemical mechanical polishing work platform 100 according to an embodiment of the present application is described below with reference to the drawings.

As shown in FIGS. 1-4, the chemical mechanical polishing work platform 100 according to an embodiment of the present application includes a polishing head holder 1, a plurality of workbenches 2, and a plurality of partition plates 3.

Specifically, the polishing head bracket 1 is a frame structure, and serves to support the polishing head module. The polishing head bracket 1 is configured to be installed on a preset center 4 of the working platform, and the preset center 4 can be understood as Configured as a point of positioning. The polishing head bracket 1 is relatively fixed to the working platform. The polishing head bracket 1 includes a polishing head bracket body 11. The polishing head bracket body 11 includes a plurality of sub-brackets 111. The plurality of sub-brackets 111 are distributed around the preset center 4. The plurality of sub-brackets 111 intersects with the center of the polishing head holder body 11, a plurality of sub-brackets 111 can share the force of the central part of the polishing head holder 1; the length direction of the sub-brackets 111 points to the preset center 4, each sub-bracket 111 is provided with a A sliding rail 112 extending from the center 4 is provided. The sliding rail 112 is configured to slidably connect the polishing head moving module and the sub-bracket 111. When the polishing head moving module works, it can drive the polishing head module to slide relative to the sub-bracket 111 on the sliding track 112.

Each workbench 2 corresponds to a sub-bracket 111. The workbench 2 is located below the sub-bracket 111 and is configured to cooperate with the polishing head module connected to the sub-bracket 111.

Each partition 3 is disposed between two adjacent sub-branches 111 of the plurality of sub-brackets 111, and the partition 3 is vertically disposed and extends toward the preset center 4 to ensure that the partition 3 can block the work of the adjacent two Taiwan 2. The area between two adjacent partitions 3 is a polishing work area 31, and the workbench 2 is located in the polishing work area 31. During work, the debris generated by the polishing operation is blocked by the partition 3, so that the two adjacent workbenches 2 will not cross-contaminate.

According to the chemical mechanical polishing working platform 100 of the embodiment of the present application, the polishing head bracket 1 is fixed relative to the working platform, and the sub-bracket 111 sets a long-stroke sliding rail 112 to increase the service life of the polishing head bracket 1 and ensure the polishing quality; A partition 3 is provided on the brackets of two adjacent worktables 2, so as to ensure that the two adjacent workbenches 2 are shielded, prevent cross contamination of the two, and improve the polishing quality.

Optionally, the polishing head holder body 11 is a structural form in which a plurality of sub-brackets 111 are integrally formed. It should be pointed out that the polishing head holder body 11 can be formed by integrally forming a plurality of sub-brackets 111, and can also be formed by splicing a plurality of sub-brackets 111. The user can select different polishing head bracket bodies 11 according to the actual situation Structural form.

Optionally, as shown in FIG. 2, the polishing head holder 1 further includes a center pillar 12, which is located at the center of the body 11 of the polishing head holder, and the center pillar 12 is configured to be installed on the preset center 4 of the working platform, and the center pillar 12 It plays the role of supporting the polishing head holder body 11. The distance between each partition 3 and the center pillar 12 (the distance between the end of the partition 3 close to the center pillar 12 and the center pillar 12) is equal, which facilitates the positioning and setting of the partition 3. At the same time, when different workbenches 2 are used, the partition plate 3 can shield the corresponding workbenches 2 on both sides to a greater extent in its extending direction, so as to realize the cooperation between the partition plate 3 and different workbenches 2.

It should be noted that, in the embodiment of the present application, the polishing head holder 1 is in a static state and does not change displacement with the polishing head holder 1, which solves the problem of reduced service life caused by rotation in the prior art. The length of the sub-bracket 111 is greater than the diameter of the table 2 to ensure that the polishing head module completes the polishing operation within the contour of the table 2 when the polishing head module moves on the slide rail 112. The connection method between the center pillar 12 and the polishing head holder body 11 may be a fixed connection (for example, welding) or a detachable connection (for example, a plug connection, a snap connection, a screw connection, etc.); as an optional method of the present application, the center The pillar 12 and the polishing head holder body 11 are connected by threads, which is not only convenient for assembly, but also can achieve a firm connection.

Optionally, the plurality of sub-brackets 111 are rotationally symmetrically distributed along the preset center 4. It can be understood that the plurality of sub-brackets 111 are rotationally symmetrical about the center pillar 12. The distribution of the multiple sub-brackets 111 ensures that the geometric center of the polishing head bracket 1 (center pillar 12) is balanced. At the same time, it is ensured that the distance between the partition 3 and the two adjacent partitions 3 is the same, that is, the space between the two adjacent polishing work areas 31 is the same, so as to be suitably configured as a workbench 2 of various specifications.

Optionally, the number of the sub-brackets 111 is four, and the four sub-brackets 111 form a cross structure. The four sub-brackets 111 can meet the four working tables 2 working at the same time to ensure the processing requirements; in addition, each polishing work area 31 has a space similar to a quarter circle, and the installation space is reasonably used to facilitate the user in the polishing work area 31内操作。 Internal operation.

It should be pointed out that the number of sub-brackets 111 can be in various forms, and the user can select according to the actual situation. In order to ensure the stability of the polishing head bracket 1, the number of sub-brackets 111 is preferably greater than or equal to three, which is convenient for ensuring the center The supporting effect of the pillar 12.

Optionally, the distance between the partition 3 and the preset center 4 is greater than or equal to the distance from the workbench 2 to the preset center 4. Equivalently, on the projection surface of the working platform, the projection of the partition plate 3 is closer to the center of the working platform than the projection of the working table 2. The position of the partition 3 is set to surround the workbench 2 in the polishing work zone 31, which can effectively shield the workbench 2, prevent interference and contamination between two adjacent workbenches 2, and guarantee the polishing quality.

Optionally, as shown in FIG. 3, the center of each workbench 2 is located on the preset circumference 21, and the center of the preset circumference 21 is concentric with the preset center 4, so that multiple workbenches 2 are distributed around the preset center 4. The centers of the multiple worktables 2 are located on the same circumference (preset circumference 21), which ensures the uniform positioning of the multiple worktables 2, which facilitates the barrier 3 to the worktable 2 and ensures the independent work space of the worktable 2.

Optionally, the center line of each partition 3 is located on the preset circumference 21, where the center line refers to the geometric center line of the partition 3, that is, when the partition 3 is placed on the working platform, the partition 3 and the working platform Vertical centerline. The center lines of all the partitions 3 are located on the same circumference (preset circumference 21), which ensures the accurate positioning of the partition 3, and facilitates the assembly of the partition 3 with the workbench 2 and the polishing head bracket 1. The center line of the partition 3 and the center of the table 2 are located on the same circumference. When the center line of the partition 3 rotates along the preset circumference 21 until the center line of the partition 3 coincides with the center of the table 2, the two sides of the partition 3 The distance from the end to the two ends of the corresponding workbench 2 is equal, the partition 3 can effectively isolate the two adjacent workbenches 2, prevent the cross-contamination of the adjacent two workbenches 2, and improve the polishing quality.

Optionally, as shown in FIG. 4, the partition 3 includes a partition body 32 and a base 33 installed on the partition body 32. The base 33 functions to support the partition body 32, and the base 33 is configured to be installed on the working platform. The partition body 32 is installed on the working platform through the base 33, which facilitates positioning and support of the partition body 32 and prevents the partition body 32 from tilting. In order to ensure the placement of the partition 3, the partition body 32 has a certain thickness and can stand upright on the working platform; the partition body 32 and the base 33 are detachably connected to facilitate replacement of the partition body 32. The detachable connection method of the partition plate 3 and the base 33 can be in various forms, such as snap connection, plug connection, or screw connection, etc., and the user can select according to the actual situation.

Optionally, the partition 3 is a transparent plate. The transparent setting of the partition plate 3 is convenient for the user to observe the polishing condition in the adjacent polishing work area 31. The use of the transparent plate to facilitate the penetration of light improves the display effect and facilitates the observation of the polishing condition on the workbench 2.

The following describes the chemical mechanical polishing work platform 100 according to an embodiment of the present application with reference to the drawings

working principle:

As shown in FIG. 2, the center pillar 12 of the polishing head bracket 1 is installed at the preset center 4 position of the working platform, and the working table 2 is provided below each sub-bracket 111 between two adjacent sub-brackets 111 A partition 3 is provided to isolate the two adjacent workbenches 2; the polishing head module is slidably connected to the sliding rail 112 of the sub-bracket 111. The polishing head module can be separated under the driving of the polishing head moving module The bracket 111 moves up. When the polishing head module is polishing, the polishing of the two adjacent working tables 2 does not affect each other, which can ensure the polishing quality and prevent cross contamination.

The chemical mechanical polishing table 2 according to the embodiment of the present application has a simple structure and convenient operation, and cooperates with the polishing head module, so that each polishing head module corresponds to a working table 2 to prevent the two adjacent working tables 2 from interfering with each other Defiled to ensure the cleanliness of polishing.

The chemical mechanical polishing apparatus 200 according to the embodiment of the present application includes the chemical mechanical polishing table 2 of the above embodiment.

As shown in FIG. 5, the chemical mechanical polishing apparatus 200 according to the embodiment of the present application further includes a polishing head moving module 51 and a polishing head module 52. The polishing head module 52 is connected to the sub-bracket 111 through the polishing head moving module 51, and the polishing head moving module 51 is slidably connected to the sliding rail 112. The polishing head moving module 51 can drive the polishing head module 52 relative to the sub The support 111 moves, so that the polishing head module 52 is configured to different positions of the working table 2. The above-mentioned chemical mechanical polishing workbench 2 has a simple structure and convenient operation, prevents cross contamination of two adjacent workbenches 2, improves the cleanliness of the working environment, and improves the polishing quality.

Optionally, the polishing head moving module 51 includes a plurality of sliders and a connecting portion; each sub-bracket 111 has at least two slide rails 112 arranged in parallel, and each slide rail 112 is provided with a slider and a plurality of slides The blocks are all connected to the connecting part, and the connecting part can be connected to the polishing head module 52 through the sub-bracket 111, and each polishing head module 52 is configured to be connected to at least two sliders.

It should be noted that the polishing head moving module 51 provided in this embodiment utilizes the sliding manner of the slider and the sliding rail 112. After the polishing head module 52 is connected to a plurality of sliders through the connecting portion, when the slider is along When the sliding rail 112 slides, it also drives the polishing head module 52 to move along the sub-bracket 111.

In order to ensure the stability of the connecting portion and the polishing head module 52, each polishing head module 52 is configured to be connected to at least two sliders, and the two sliders are respectively disposed on two parallel sliding rails 112 to enable It is ensured that when the polishing head module 52 moves, there will be support in multiple directions, which ensures the stability of the polishing head module 52 when moving.

Optionally, a linear drive mechanism is also included; the linear drive mechanism is provided in one-to-one correspondence with the sub-brackets 111, each linear drive mechanism is connected to any slider on the corresponding sub-bracket 111, and the linear drive device is configured to be driven by the slider The polishing head module 52 moves relative to the sub-bracket 111.

Alternatively, the linear drive mechanism may use a hydraulic cylinder, air cylinder, etc., by using the linear drive mode of the hydraulic cylinder to push the corresponding slider to move along the slide rail 112, because a plurality of sliders are connected into an integrated structure through the connecting portion, and When a hydraulic cylinder pushes a slider to slide, it also causes multiple sliders to move synchronously.

In addition, the linear driving mechanism may also use a linear stepping motor, which will not be repeated here.

It should be noted that, in the case of no conflict, the features in the embodiments in this application may be combined with each other.

The above are only preferred embodiments of the present application, and are not configured to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of this application shall be included in the scope of protection of this application.

Industrial applicability

A chemical mechanical polishing work platform provided by an embodiment of the present application has a simple structure and convenient operation, and cooperates with a polishing head module, so that each polishing head module corresponds to a worktable, preventing adjacent two worktables from interfering with each other and staining , To ensure the cleanliness of polishing.

Claims

A chemical mechanical polishing work platform, characterized by including:

A polishing head bracket configured to be mounted on a preset center of a working platform, the polishing head bracket includes a plurality of sub-brackets, the plurality of sub-brackets are distributed around the preset center, and each of the The sub-bracket is provided with a sliding track extending toward the preset center, and the sliding track is configured to slidably connect the polishing head moving module and the sub-bracket;

A plurality of worktables configured to cooperate with the polishing head module, each worktable corresponds to one of the sub-brackets, and the worktable is located under the sub-brackets; and

A plurality of baffles, each of the baffles is disposed between two adjacent sub-brackets in the plurality of sub-brackets, the baffles are arranged vertically and extend toward the preset center, the baffles It is configured to shield the two adjacent worktables.
The chemical mechanical polishing work platform according to claim 1, wherein the area between two adjacent partitions is set as a polishing work area, and the work table is located in the polishing work area.
The chemical mechanical polishing work platform according to claim 2, wherein the space in the polishing work area formed between any two of the partitions is the same.
The chemical mechanical polishing work platform according to any one of claims 1 to 3, characterized in that the polishing head bracket further comprises a center pillar, and the plurality of sub-brackets meet at the center of the polishing head bracket to form a polishing A head support body, the center post is located at the center of the polishing head support and is detachably connected to the polishing head support body, the center post is configured to be installed at a preset center of the working platform, each of the The distance between the partition and the central pillar is equal.
The chemical mechanical polishing work platform according to any one of claims 1 to 4, wherein the plurality of sub-brackets are rotationally symmetrically arranged along the preset center.
The chemical mechanical polishing work platform according to claim 5, wherein the number of the sub-brackets is greater than or equal to three.
The chemical mechanical polishing work platform according to claim 5 or 6, wherein the number of the sub-brackets is four, and the four sub-brackets form a cross structure.
The chemical mechanical polishing work platform according to any one of claims 1-7, wherein the distance between the partition plate and the preset center is greater than or equal to the distance from the worktable to the preset center.
The chemical mechanical polishing work platform according to any one of claims 1-8, wherein the center of each work table is located on a preset circumference, and the center of the preset circumference is concentric with the preset center .
The chemical mechanical polishing work platform according to claim 9, wherein the center line of each partition plate is located on the predetermined circumference.
The chemical mechanical polishing work platform according to any one of claims 1-10, wherein the partition plate includes a partition body and a base mounted on the partition body, the base is configured to be mounted on the Work platform and support the bulkhead body.
The chemical mechanical polishing work platform according to claim 11, wherein the partition body is detachably connected to the base.
The chemical mechanical polishing work platform according to any one of claims 1-12, wherein the partition plate is a transparent plate.
The chemical mechanical polishing work platform according to any one of claims 1-13, wherein a plurality of the sub-brackets are integrally formed.
The chemical mechanical polishing work platform according to any one of claims 1-14, wherein a plurality of the sub-brackets are sequentially spliced to form the polishing head bracket.
The chemical mechanical polishing work platform according to any one of claims 1-15, wherein the length of the sub-bracket is larger than the diameter of the work table.
A chemical mechanical polishing device, characterized by comprising the chemical mechanical polishing table according to any one of claims 1-16.
The chemical mechanical polishing device according to claim 17, further comprising a polishing head moving module and a polishing head module;

The polishing head module is connected to the sub-bracket through the polishing head moving module, the polishing head moving module is slidably connected to the sliding track, and the polishing head moving module is configured to drive the The polishing head module moves relative to the sub-bracket.
The chemical mechanical polishing apparatus according to claim 18, wherein the polishing head moving module includes a plurality of sliders and connecting parts;

Each of the sub-brackets has at least two slide rails arranged in parallel, each of the slide rails is provided with the slider, and a plurality of the sliders are all connected to the connecting part, the connection The part can be connected to the polishing head module through the sub-bracket, and each polishing head module is configured to be connected to at least two sliders.
The chemical mechanical polishing apparatus according to claim 19, further comprising a linear drive mechanism;

The linear drive mechanism is provided in one-to-one correspondence with the sub-brackets, each linear drive mechanism is connected to any one of the sliders on the corresponding sub-brackets, and the linear drive device is configured to The block drives the polishing head module to move relative to the sub-bracket.