TW202026099A - Chemical mechanical polishing working table and chemical mechanical polishing equipment - Google Patents

Abstract

The invention relates to a chemical mechanical polishing working table and chemical mechanical polishing equipment. The chemical mechanical polishing working table comprises a polishing head bracket, working table bodies, and a plurality of partition plates; the polishing head bracket includes a plurality of branch brackets, wherein the branch brackets are distributed around a preset center, each branch bracket is provided with a sliding track towards the preset center, and the sliding tracks are used for slid ably connecting polishing head moving modules with the branch brackets; each working table body corresponds to the corresponding branch bracket, and the working table bodies are located on the lower parts of the branch brackets; and each partition plate is arranged between every two adjacent branch brackets, and the partition plates are arranged vertically, extend towards the preset center, and are used for shielding everytwo adjacent working table bodies. According to the chemical mechanical polishing working table and the chemical mechanical polishing equipment, each polishing head corresponds to the corresponding working table body to prevent the polishing head and the working table body from interfering and staining with each other, the polishing heads can move along a linear track, movement is simple, and operation is convenient; and according to the chemical mechanical polishing equipment applying polishing assemblies, the polishing quality is improved.

Description

Chemical mechanical polishing work platform and chemical mechanical polishing equipment

The present invention relates to the technical field of polishing equipment, specifically, to a chemical mechanical polishing work platform and chemical mechanical polishing equipment.

In the process of large-scale integrated circuit production, planarizing the deposits on the wafer is a necessary and frequent process. At present, the chemical mechanical polishing (CMP) process is mainly used to complete this process, and the chemical mechanical polishing machine is the main equipment to complete this process.

In the technical solution of the prior art, there are four polishing head modules and four Sweep modules that realize the horizontal movement (Sweep) process on the workbench. The four polishing head modules can rotate 270° along with the rotating worktable to realize the upper and lower parts of each polishing head module and the switching between the three polishing disk stations.

The prior art chemical mechanical polishing machine has the following shortcomings: 1. Due to the uneven force of the worktable during normal operation, the life of the rotating worktable is greatly reduced, and the vibration and instability of the worktable at the same time cause the polishing of the wafer The quality is greatly reduced. 2. As multiple polishing head modules rotate with the rotating worktable, the structure of the rotating worktable is complicated, the volume is huge, the design difficulty increases, the maintenance difficulty and the cost increase. 3. Since each polishing head module can realize the upper and lower wafers and the switching between the polishing stations, the cross contamination between the polishing disks is caused, WTWNU% (non-uniformity between wafers: describes the film between multiple wafers Layer thickness changes) are difficult to control.

The purpose of the present invention is to solve the above problems and provide a chemical mechanical polishing work platform. The polishing head module corresponds to the work platform one to one. The polishing head module can move linearly and has a large moving stroke. The plates are separated to prevent mutual interference and contamination, simple structure and convenient operation, so that the above problems are improved.

The invention also provides a chemical mechanical polishing equipment.

The chemical mechanical polishing work platform according to the embodiment of the first aspect of the present invention includes a polishing head support, the polishing head support is configured to be installed at a preset center of the work platform, the polishing head support includes a plurality of sub-supports, the multiple The sub-brackets are distributed around the predetermined center, and each of the sub-brackets is provided with a sliding track toward the predetermined center, and the sliding rail is used for slidably connecting the polishing head moving module and the sub-bracket Multiple workbenches for cooperating with the polishing head module, each of the workbenches corresponds to one of the sub-supports, the workbench is located below the sub-supports; and multiple partitions, each The partition is disposed between two adjacent sub-brackets of the plurality of sub-brackets, the partition is arranged vertically and extends toward the preset center, and the partition is used to shield the two adjacent sub-brackets. Workbench.

According to the chemical mechanical polishing work platform of the embodiment of the present invention, there is no need to rotate the polishing head support, which avoids the reduction in the life of the rotating polishing head support due to the uneven force of different sub-supports; the work platform has a simple structure, small volume and low design difficulty , Maintenance difficulty and low cost; because the polishing head support does not need to be rotated, the length of the sliding track set on the sub-support can be correspondingly extended, so that the linear movement of the polishing head module increases; the installation of partitions ensures The two adjacent workbenches are relatively independent, avoiding cross contamination of the two adjacent workbenches during work, and improving the cleanliness of the product.

In addition, the chemical mechanical polishing work platform according to the embodiment of the present invention also has the following additional technical features.

According to some embodiments of the present invention, the polishing head support further includes a center pillar, the polishing head support further includes a center support, and the plurality of sub-supports converge at the center of the polishing head support to form a polishing head support body, The center pillar is located at the center of the polishing head support and is detachably connected to the polishing head support body. The center pillar is used to be installed at the preset center of the working platform. The distances of the central pillars are equal. Multiple sub-brackets form the polishing head support body. The polishing head support body can be integrally formed or spliced by multiple sub-brackets; it is installed at the preset center of the working platform through the central pillar to ensure the stable placement of the polishing head support; The distance between the two partitions and the center column is equal, which is convenient for the setting of the partitions; at the same time, the partitions can shield the corresponding work tables on both sides of the partitions to a greater extent, which facilitates the coordination of the partitions with different work tables.

According to some embodiments of the present invention, the plurality of sub-brackets are arranged rotationally symmetrically along the preset center. The setting of multiple sub-supports ensures that the geometric center of the polishing head support is balanced in force, and at the same time, it ensures that the distance between the partition and the adjacent two partitions is the same, which is suitable for workbenches of various specifications.

In some specific embodiments of the present invention, the number of the sub-supports is four, and the four sub-supports form a cross structure. The cross structure can make reasonable use of the installation space under the condition of ensuring the process requirements, so that there is a larger working space between two adjacent partitions, which is convenient for users to operate.

According to some embodiments of the present invention, the distance between the partition and the preset center is greater than or equal to the distance from the workbench to the preset center. The distance between the partition and the preset center is greater than or equal to the distance between the workbench and the preset center, so that both ends of the partition can better shield the workbench, ensure the isolation of two adjacent workbenches, and avoid cross-contamination.

In some specific embodiments of the present invention, the center of each of the worktables is located on a preset circle, and the center of the preset circle is concentric with the preset center. The center of all worktables is located on the preset circumference, which facilitates the positioning of the worktables, and at the same time, can better match the setting of the partitions.

Further, the center line of each partition is located on a preset circumference. The center lines of all partitions are located on the preset circle, and the center line of the partition is on the same circle as the center of the worktable. When the partition is rotated along the preset circle until the center line of the partition coincides with the center of the worktable, The distance between the two ends of the partition and the two ends of the corresponding workbench is equal, and the partition can effectively isolate two adjacent workbenches.

According to some embodiments of the present invention, the partition includes a partition body and a base installed on the partition body, and the base is configured to be installed on the working platform and support the partition body. The partition body is installed on the working platform through the base, and the base supports the partition body to prevent the partition body from tilting.

According to some embodiments of the present invention, the partition is a transparent plate. Transparent partitions make it easy to observe the working conditions of adjacent workbenches.

The chemical mechanical polishing apparatus according to the embodiment of the second aspect of the present invention includes the chemical mechanical polishing work platform according to the embodiment of the first aspect of the present invention.

The chemical mechanical polishing equipment according to the embodiment of the present invention utilizes the above-mentioned chemical mechanical polishing working platform, which has simple structure and convenient operation, prevents cross contamination of two adjacent working platforms, and improves the cleanliness of the working environment.

The additional aspects and advantages of the present invention will be partly given in the following description, and part of them will become obvious from the following description, or be understood through the practice of the present invention.

In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that similar numbers and letters indicate similar items in the following diagrams. Therefore, once an item is defined in a diagram, there is no need to further define and explain it in the subsequent diagrams.

In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "inner" and "outer" is based on the orientation or positional relationship shown in the diagram, or is usually placed when the product of the invention is used. The orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for distinguishing description, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "set" and "connection" should be interpreted broadly, for example, it may be a fixed connection or a detachable connection, or Integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present invention can be understood in specific situations.

The chemical mechanical polishing work platform 100 according to an embodiment of the first aspect of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 to 4, the chemical mechanical polishing work platform 100 according to the embodiment of the present invention includes a polishing head support 1, a plurality of work tables 2 and a plurality of partitions 3.

Specifically, the polishing head support 1 is a frame structure that supports the polishing head module. The polishing head support 1 is used to install on the preset center 4 of the working platform. The preset center 4 can be understood as A point used for positioning. The polishing head support 1 is relatively fixed to the working platform. The polishing head support 1 includes a polishing head support body 11, and the polishing head support body 11 includes a plurality of sub-supports 111, which are distributed around the preset center 4, and a plurality of sub-supports 111 intersects at the center of the polishing head support body 11, a plurality of sub-supports 111 can share the force of the central part of the polishing head support 1; the length of the sub-support 111 points to the preset center 4, and each sub-support 111 is provided with a front A sliding track 112 extending from the center 4 is provided, and the sliding track 112 is used to slidably connect the polishing head moving module and the sub-support 111. When the polishing head moving module works, it can drive the polishing head module to slide on the sliding rail 112 relative to the sub-support 111.

Each workbench 2 corresponds to a sub-support 111, and the workbench 2 is located under the sub-support 111 and is used to cooperate with the polishing head module connected to the sub-support 111.

Each partition 3 is arranged between two adjacent sub-supports 111 among the plurality of sub-supports 111, and the partition 3 is arranged vertically and extends toward the preset center 4 to ensure that the partition 3 can shield two adjacent work Taiwan 2. The area between two adjacent partitions 3 is a polishing work area 31, and the workbench 2 is located in the polishing work area 31. During work, the debris generated by the polishing operation is blocked by the partition 3, so that the two adjacent workbenches 2 will not be cross-contaminated.

According to the chemical mechanical polishing work platform 100 of the embodiment of the present invention, the polishing head support 1 is fixed relative to the work platform, and the sub-support 111 is provided with a longer-stroke sliding track 112, which increases the service life of the polishing head support 1 and ensures the polishing quality; The partitions 3 are arranged on the brackets of the two adjacent workbenches 2 to ensure that the two adjacent workbenches 2 are shielded, prevent cross contamination between the two, and improve the polishing quality.

Optionally, the polishing head support body 11 has a structure in which a plurality of sub-supports 111 are integrally formed. It should be pointed out that the polishing head holder body 11 may not only be a structure in which multiple sub-brackets 111 are integrally formed, but also can be formed by splicing multiple sub-brackets 111. The user can select different polishing head holder bodies 11 according to the actual situation. The structural form.

According to some embodiments of the present invention, as shown in FIG. 2, the polishing head support 1 further includes a center pillar 12, which is located at the center of the polishing head support body 11, and the center pillar 12 is used to install at the preset center 4 of the work platform. , The central pillar 12 functions to support the body 11 of the polishing head support. The distance between each partition 3 and the center pillar 12 (the distance between the end of the partition 3 close to the center pillar 12 and the center pillar 12) is equal, which facilitates the positioning and setting of the partition 3. At the same time, when different workbenches 2 are used, the partition 3 can shield the workbenches 2 on both sides of the partition to a greater extent in the extending direction, so as to realize the cooperation between the partition 3 and the different workbenches 2.

It should be pointed out that, in the embodiment of the present invention, the polishing head support 1 is in a static state, and does not change displacement with the polishing head support 1, which solves the problem of reduced life caused by rotation in the prior art. The length of the sub-bracket 111 is greater than the diameter of the worktable 2, which can ensure that when the polishing head module moves on the sliding rail 112, the polishing head module completes the polishing operation within the contour of the worktable 2. The connection between the center pillar 12 and the polishing head support body 11 can be a fixed connection (for example, welding) or a detachable connection (for example, plug-in connection, clamping connection, threaded connection, etc.); as an alternative method of the present invention, the center The pillar 12 and the polishing head support body 11 are connected by threads, which is convenient for assembly and can achieve a firm connection.

According to some embodiments of the present invention, the multiple sub-supports 111 are distributed rotationally symmetrically along the preset center 4. It can be understood that the multiple sub-supports 111 are rotationally symmetric around the central pillar 12. The distribution of the multiple sub-supports 111 ensures that the geometric center (center pillar 12) of the polishing head support 1 is balanced in force. At the same time, it is ensured that the spacing between the partition 3 and the two adjacent partitions 3 is the same, that is, the space of the two adjacent polishing work areas 31 is the same, so as to be suitable for workbenches 2 of various specifications.

Optionally, the number of sub-brackets 111 is four, and the four sub-brackets 111 form a cross structure. The four sub-brackets 111 can meet the requirements of the four workbenches 2 to work at the same time to ensure the processing requirements; in addition, each polishing work area 31 has a space similar to a quarter circle, and the installation space is reasonably used to facilitate users in the polishing work area 31内 Operation.

It should be pointed out that the number of sub-brackets 111 can be in various forms, and the user can choose according to the actual situation. In order to ensure the stability of the polishing head support 1, the number of sub-brackets 111 is preferably greater than or equal to three, so as to ensure the central pillar. The supporting role of 12.

According to some embodiments of the present invention, the distance between the partition 3 and the preset center 4 is greater than or equal to the distance from the workbench 2 to the preset center 4. It is equivalent to that on the projection surface of the working platform, the projection of the partition 3 is closer to the center of the working platform than the projection of the working platform 2. The position of the partition 3 is arranged to surround the workbench 2 in the polishing work area 31, which can effectively shield the workbench 2 to prevent interference and contamination between two adjacent workbenches 2 and ensure the polishing quality.

In some specific embodiments of the present invention, as shown in FIG. 3, the center of each workbench 2 is located on a preset circumference 21, and the center of the preset circumference 21 is concentric with the preset center 4, so that multiple workbenches 2 surround Preset center 4 distribution. The centers of the multiple workbenches 2 are located on the same circumference (the preset circumference 21) to ensure the uniform positioning of the multiple workbenches 2 to facilitate the barrier 3 to block the workbenches 2 and ensure the independent working space of the workbenches 2.

Further, the centerline of each partition 3 is located on the preset circumference 21, where the centerline refers to the geometric centerline of the partition 3, that is, when the partition 3 is placed on the working platform, the partition 3 is perpendicular to the working platform的中心线. The center lines of all partitions 3 are located on the same circumference (the preset circumference 21), which ensures accurate positioning of the partitions 3 and facilitates the assembly of the partitions 3 with the worktable 2 and the polishing head support 1. The center line of the partition 3 and the center of the workbench 2 are located on the same circumference. When the partition 3 is rotated along the preset circumference 21 until the center line of the partition 3 coincides with the center of the workbench 2, the two sides of the partition 3 The distance from the end to the two ends of the corresponding workbench 2 is equal, and the partition 3 can effectively isolate the two adjacent workbenches 2 to prevent cross contamination of the two adjacent workbenches 2 and improve the polishing quality.

According to some embodiments of the present invention, as shown in FIG. 4, the partition 3 includes a partition body 32 and a base 33 mounted on the partition body 32. The base 33 functions to support the partition body 32, and the base 33 is used for installation. On the work platform. The partition body 32 is installed on the working platform through the base 33, which facilitates the positioning and support of the partition body 32 and prevents the partition body 32 from tilting. In order to ensure the placement of the partition 3, the partition body 32 has a certain thickness and can be erected on the work platform; the partition body 32 and the base 33 are detachably connected to facilitate the replacement of the partition body 32. The detachable connection mode of the partition 3 and the base 33 can be in various forms, such as snap connection, plug connection, or screw connection, etc., which can be selected by the user according to actual conditions.

According to some embodiments of the present invention, the partition 3 is a transparent plate. The transparent arrangement of the partition 3 facilitates the user to observe the polishing conditions in the adjacent polishing work area 31. The use of the transparent plate's light penetration characteristics improves the display effect and facilitates the observation of the polishing condition on the workbench 2.

The working principle of the chemical mechanical polishing work platform 100 according to the embodiment of the first aspect of the present invention will be described below with reference to the drawings.

As shown in Figure 2, the center pillar 12 of the polishing head support 1 is installed at the preset center 4 position of the work platform, and the work platform 2 is set under each sub-support 111 corresponding to between two adjacent sub-supports 111 A partition 3 is set to isolate the two adjacent workbenches 2; the polishing head module is slidably connected with the sliding rail 112 of the sub-bracket 111, and the polishing head module can be moved in the sub-bracket under the driving of the polishing head moving module. The bracket 111 moves. During the polishing of the polishing head module, the polishing of the two adjacent workbenches 2 does not affect each other, which can ensure the polishing quality and prevent cross contamination.

The chemical mechanical polishing work platform according to the embodiment of the first aspect of the present invention has simple structure and convenient operation. It cooperates with the polishing head module so that each polishing head module corresponds to a work table 2 and prevents two adjacent work tables 2 Mutual interference and contamination ensure the cleanliness of polishing.

The chemical mechanical polishing apparatus 200 according to the embodiment of the second aspect of the present invention includes the chemical mechanical polishing work platform of the embodiment of the first aspect.

As shown in FIG. 5, the chemical mechanical polishing apparatus 200 according to the embodiment of the present invention further includes a polishing head moving module 51 and a polishing head module 52. The polishing head module 52 is connected to the sub-bracket 111 through the polishing head moving module 51, and the polishing head moving module 51 is slidably connected to the sliding rail 112. The polishing head moving module 51 can drive the polishing head module 52 relative to the sub-bracket. The bracket 111 moves, so that the polishing head module 52 acts on different positions of the worktable 2. The use of the above-mentioned chemical mechanical polishing work platform has simple structure and convenient operation, prevents cross contamination of two adjacent workbenches 2, improves the cleanliness of the working environment, and improves the polishing quality.

It should be noted that, in the case of no conflict, the features in the embodiments of the present invention can be combined with each other.

The foregoing descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc., made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

1: Polishing head bracket 2: (Chemical Mechanical Polishing) Workbench 3: partition 4: preset center 11: Polishing head bracket body 12: Center pillar 21: preset circle 31: Polishing work area 32: bulkhead body 33: Base 51: Polishing head moving module 52: Polishing head module 100: Chemical mechanical polishing work platform 111: Sub-bracket 112: Sliding track 200: Chemical mechanical polishing equipment

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope. For those of ordinary skill in the art, they can also obtain other related schemas based on these schemas without creative work.

FIG. 1 is a schematic structural diagram of a chemical mechanical polishing working platform according to an embodiment of the first aspect of the present invention from a first perspective.

2 is a schematic view of the structure of the chemical mechanical polishing working platform according to the first aspect of the present invention from a second perspective.

3 is a schematic view of the structure of the chemical mechanical polishing working platform according to the first aspect of the present invention from a third perspective.

Fig. 4 is a schematic diagram of the structure of the separator of Fig. 1.

Fig. 5 is a schematic structural diagram of a chemical mechanical polishing apparatus according to an embodiment of the second aspect of the present invention.

1: Polishing head bracket

2: workbench

3: partition

31: Polishing work area

100: Chemical mechanical polishing work platform

Claims (10)

A chemical mechanical polishing work platform, including: Polishing head support, the polishing head support is used to install on the preset center of the work platform, the polishing head support includes a plurality of sub-brackets, a plurality of the sub-brackets are distributed around the preset center, each The sub-bracket is provided with a sliding rail extending toward the preset center, and the sliding rail is used for slidably connecting the polishing head moving module and the sub-bracket; A plurality of workbenches for cooperating with the polishing head module, each of the workbenches corresponds to one of the sub-supports, and the workbench is located below the sub-supports; and A plurality of partitions, each of the partitions is arranged between two adjacent sub-brackets of the plurality of sub-brackets, the partitions are arranged in a vertical direction and extend toward the preset center, the partitions Used to shield the two adjacent workbenches. The chemical mechanical polishing work platform according to claim 1, wherein the polishing head support further includes a center pillar, a plurality of the sub-supports intersect at the center of the polishing head support and form a polishing head support body, and the center The pillar is located at the center of the polishing head support and is detachably connected to the polishing head support body. The center pillar is used to install on the preset center of the working platform, and each partition is connected to the The distance between the center pillars is equal. The chemical mechanical polishing work platform according to claim 1, wherein a plurality of the sub-supports are arranged rotationally symmetrically along the preset center. The chemical mechanical polishing work platform according to claim 3, wherein the number of the sub-supports is four, and the four sub-supports form a cross structure. The chemical mechanical polishing work platform according to claim 1, wherein the distance between the partition and the preset center is greater than or equal to the distance from the workbench to the preset center. The chemical mechanical polishing work platform according to claim 1, wherein the center of each work platform is located on a preset circle, and the center of the preset circle is concentric with the preset center. The chemical mechanical polishing work platform according to claim 6, wherein the center line of each partition is located on the predetermined circumference. The chemical mechanical polishing work platform according to claim 1, wherein the partition includes a partition body and a base installed on the partition body, and the base is used to install on the work platform and support the partition Board body. The chemical mechanical polishing work platform according to any one of claims 1 to 8, wherein the partition is a transparent plate. A chemical mechanical polishing equipment, comprising the chemical mechanical polishing work platform described in any one of claims 1 to 9.

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