TWI697044B - Support structure of chemical mechanical polishing equipment and chemical mechanical polishing equipment - Google Patents

Abstract

Provided is a support structure of chemical mechanical polishing equipment and chemical mechanical polishing equipment. The polishing head frame body includes a plurality of brackets that intersect at the center of the polishing head frame body. The center column is located at the center of the polishing head frame body and is connected to the polishing head frame body. The end of the bracket away from the center of the polishing head frame body is connected with an edge support. The edge support is used to cooperate with the center column to support the polishing head frame body. A working area for placing a polishing table is formed between the edge support and the center column, and a moving track extending toward the center of the polishing head frame body is provided on the bracket In the extending direction of the moving rail, there is a gap between the end of the moving rail near the end of the central column and the central column to form a polishing head module replacement area. The invention has a simple structure, disperses the bearing of the center pillar, and improves the service life.

Description

Support structure of chemical mechanical polishing equipment and chemical mechanical polishing equipment

The invention relates to the technical field of polishing equipment, in particular, to a support structure of chemical mechanical polishing equipment and chemical mechanical polishing equipment.

In the production process of large-scale integrated circuits, planarizing the deposits on the wafer is a necessary and frequent process. At present, the chemical mechanical polishing (CMP) process is mainly used to complete this process. The chemical mechanical polishing machine is the main equipment to complete this process.

The existing chemical mechanical polishing machine has the following shortcomings: 1. Due to the uneven force of the work table during normal operation, the life of the rotating work table is greatly reduced, and at the same time the vibration and instability of the work table leads to the polishing quality of the wafer Great discount. 2. As multiple polishing head modules rotate with the rotary table, the structure of the rotary table is complicated, the volume is huge, the design difficulty is increased, and the maintenance difficulty and cost are increased. 3. Due to the limitation of the overall structure and stability, the stroke of the lateral movement (Sweep) during the polishing process is small, resulting in a large number of lateral reciprocations of the polishing head, which greatly reduces the polishing efficiency. The cross-shaped polishing head bracket of the traditional polishing machine has a large weight, a complicated structure, uneven stress, and inconvenient maintenance.

The purpose of the present invention is to provide a support structure for chemical mechanical polishing equipment in view of the above problems, which has a simple structure, disperses the load of the center pillar, the polishing head frame body is relatively fixed to the working platform, and no displacement change occurs, which solves the prior art polishing head frame The problem of reduced service life due to body rotation increases the service life and improves the above problems.

Another object of the present invention is to provide a chemical mechanical polishing device.

A support structure for a chemical mechanical polishing device according to an embodiment of the first aspect of the present invention includes a polishing head frame body and a central column for supporting the polishing head frame body, the polishing head frame body includes a junction with the polishing head frame body A plurality of brackets in the center, the central column is located at the center of the polishing head frame body and is connected to the polishing head frame body, an end of the central column away from the polishing head frame body is used for installation on a working platform, An end of each of the brackets away from the center of the polishing head frame body is connected with an edge support, the edge support is used to cooperate with the center post to support the polishing head frame body, the edge support A working area for placing a polishing table is formed between the center post and each of the brackets is provided with a moving rail extending toward the center of the polishing head frame body, the moving rail is used for a polishing head moving mold The group is slidably connected to the bracket, and along the extending direction of the moving rail, there is a gap between the end of the moving rail near the end of the central post and the central post to form a polishing head module replacement Area, when the polishing head moving module moves to the end of the moving track close to the end of the central column, the polishing head module connected to the polishing head moving module is located in the polishing head module Replacement area.

According to the supporting structure of the chemical mechanical polishing equipment of the embodiment of the present invention, the polishing head frame body is relatively fixed to the working platform without displacement change, which solves the problem of reduced service life caused by the rotation of the polishing head frame body of the prior art; Placed on the working platform to support the polishing head frame body, combined with the setting of the edge support, to share the force of the center column, so that the polishing head frame body is placed smoothly; the moving track provided on each bracket enables the polishing head movement module to drive The polishing head module moves relative to the bracket, and a polishing head module replacement area is reserved between the polishing table and the center column, which is convenient for the polishing head module to perform upper and lower wafers in the polishing head module replacement area (wafer replacement on the polishing head) .

In addition, the support structure of the chemical mechanical polishing device according to the embodiment of the present invention also has the following additional technical features.

According to some embodiments of the present invention, the center of the polishing head frame body has a groove matching with the center post, the center post is inserted into the groove and the end surface of the center post abuts on The bottom wall of the groove of the groove, the central column and the polishing head frame body are detachably connected. The center column is inserted in the groove, which is convenient for positioning the center column; the detachable connection of the center column and the polishing head frame body is convenient for assembling and disassembling the center column and the polishing head frame body, and the working efficiency is improved.

According to some embodiments of the invention, the edge support is detachably connected to the bracket. By facilitating the detachable connection of the support member and the bracket, the assembly and replacement of the edge support member is facilitated, and the maintenance efficiency is improved.

According to some embodiments of the present invention, the edge support and the center post are located on the same side of the polishing head frame body. The edge support is located at the bottom of the polishing head frame body, and one end of the edge support supports the polishing head frame body, which increases the connection area between the edge support and the polishing head frame body, so as to better support the polishing head frame body.

Further, the edge support member is a plate-shaped structure, and the edge support member includes a support surface for supporting the bracket, and the support surface is provided with a connection portion for connecting with the bracket, and the bracket is opened There is a positioning hole for cooperating with the connecting portion, and the connecting portion is inserted into the positioning hole. The edge support supports the support through the support surface to ensure that the edge support and the support have a certain contact area, which improves the support effect of the edge support; the edge support and the support realize the positioning connection through the connection part and the positioning hole, which improves the accuracy of the connection It is convenient for quick assembly.

Optionally, the connection part and the bracket are connected by a threaded locking member. The use of threaded locking parts facilitates the assembly and disassembly of the connecting part and the bracket, and improves the maintenance efficiency.

According to some embodiments of the present invention, the bracket is provided with an opening slot for the polishing head module to pass through, and the opening slot extends from the end of the bracket toward the center of the polishing head frame body. The arrangement of the opening groove enables the polishing head module to slide in the opening groove, which facilitates the assembly of the bracket and the polishing head module and the movement of the polishing head module.

According to some embodiments of the present invention, the plurality of brackets are rotationally symmetrically distributed along the center of the polishing head frame body. The bracket is rotationally symmetrical along the center of the polishing head frame body, so that the center column is balanced in force, which is convenient for maintaining the stability of the polishing head frame body.

According to some embodiments of the present invention, the number of brackets is four, and the four brackets form a cross structure. The setting of four brackets makes reasonable use of the installation space. At the same time, there is sufficient operating space between the two adjacent polishing tables to facilitate operation on the corresponding polishing table.

A chemical mechanical polishing device according to an embodiment of the second aspect of the present invention includes a polishing head moving module, a polishing head module, and a support structure of the chemical mechanical polishing device according to an embodiment of the first aspect of the present invention. The movable track is slidably connected, the polishing head module and the polishing head moving module are detachably connected, and the polishing head moving module works to drive the polishing head module to move along the moving track .

According to the chemical mechanical polishing device of the embodiment of the present invention, the structure is simple, the operation is convenient, the service life of the polishing head frame body is improved, and the wafer replacement of the polishing head module is facilitated.

Additional aspects and advantages of the present invention will be partially given in the following description, and some will become apparent from the following description, or be learned through the practice of the present invention.

To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all the embodiments. The elements of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in various different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, so once an item is defined in a drawing, there is no need to further define and explain it in subsequent drawings.

In the description of the present invention, it should be noted that the terms "inner", "outer", etc. indicate the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or is usually placed when the product of the invention is used The orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as limiting the present invention. In addition, the terms "first", "second", etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms “setup” and “connection” should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two components. For those of ordinary skill in the art, the specific meaning of the above terms in the present invention can be understood in specific situations.

The chemical mechanical polishing apparatus supporting structure 100 according to the embodiment of the first aspect of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 to 5, the chemical mechanical polishing device support structure 100 according to an embodiment of the present invention includes a polishing head frame body 1 and a center column 2.

Specifically, as shown in FIGS. 1 and 2, the polishing head frame body 1 includes a plurality of brackets 11 converging at the center of the polishing head frame body 1, and an end of each bracket 11 away from the center of the polishing head frame body 1 is connected to For the edge support 3, each bracket 11 is provided with a moving rail 12 extending toward the center of the polishing head frame body 1. The moving rail 12 is used for a slidable connection between the polishing head moving module and the bracket 11. The center column 2 is located at the center of the polishing head frame body 1 and is connected to the polishing head frame body 1. The end of the center column 2 away from the polishing head frame body 1 is used for installation on a working platform (refers to a platform for placing chemical mechanical polishing equipment ) To position the polishing head frame body 1. A working area for placing a polishing table is formed between the center column 2 and the edge support 3 (a polishing table, that is, a polishing disc is placed in the working area during work). The polishing table is located below the corresponding support 11 to facilitate The polishing head module connected to the bracket 11 cooperates with the polishing table. Along the extending direction of the moving rail 12, the end of the moving rail 12 near the end of the central column 2 has a gap with the bracket 11 of the central column 2 to form a polishing head module replacement area 5.

Since the polishing head frame 1 and the center column 2 are relatively fixed, saving installation space, the moving rail 12 on the bracket 11 can be set for a longer stroke, and at the same time, there is a larger space between the work table and the center column 2, so it is formed Polishing head module replacement area 5.

According to the chemical mechanical polishing equipment support structure 100 of the embodiment of the present invention, the polishing head frame body 1 is supported by the central column 2 and installed on the working platform; the edge support 3 is located at the end of the polishing head frame body 1 (bracket 11), It cooperates with the central column 2 to jointly support the polishing head frame body 1, which improves the stability of the polishing head frame body 1. The polishing head frame body 1 is fixedly arranged relative to the working platform. The moving rail 12 provided on the bracket 11 facilitates the movement of the polishing head module relative to the bracket 11 and improves the movement stroke of the polishing head module. At the same time, a polishing head mold is reserved between the end of the moving rail 12 and the central column 2 Group replacement area 5, when the polishing head moving module moves to the end of the moving rail 12 near the end of the central column 2, the polishing head module connected to the polishing head moving module is located in the polishing head module replacement area 5, The wafer on the polishing head can be replaced.

According to some embodiments of the present invention, as shown in FIG. 3, the center of the polishing head frame body 1 is provided with a groove 13 that cooperates with the center column 2, the center column 2 is inserted into the groove 13, and the end surface of the center column 2 Abutting against the bottom wall of the groove 13, the central post 2 is detachably connected to the polishing head frame body 1. The opening of the groove 13 facilitates the positioning of the center column 2; the connection mode of the center column 2 and the polishing head frame body 1 facilitates the assembly and disassembly of the center column 2 and the polishing head frame body 1, and improves the work efficiency.

Optionally, a plurality of connecting holes 131 are formed in the bottom wall of the groove 13, the connecting holes 131 penetrate the polishing head frame body 1 in a direction perpendicular to the thickness of the polishing head frame body 1, and the central column 2 is provided with corresponding connection holes 131 The plurality of threaded holes 21, the central column 2 and the polishing head frame body 1 are locked by bolts 41 inserted into the connecting holes 131 and the corresponding threaded holes 21. In other embodiments of the present invention, the connection between the center post 2 and the polishing head frame body 1 may also be in other forms, for example, the outer periphery of the center post 2 is provided with external threads, the groove wall of the groove 13 is provided with internal threads, and the center post 2 Threadedly cooperate with the polishing head frame body 1; or the center post 2 and the polishing head frame body 1 are interference fit; In addition, the center column 2 and the polishing head frame body 1 are clipped or snap-fitted.

According to some embodiments of the invention, the edge support 3 is detachably connected to the bracket 11. In order to facilitate the cooperation between the edge support 3 and the bracket 11, a detachable connection is adopted, which improves the assembly efficiency and facilitates the replacement of the edge support 3.

According to some embodiments of the present invention, the edge support 3 and the center post 2 are located on the same side of the polishing head frame body 1. As shown in FIG. 4, the edge support 3 is located at the bottom of the polishing head frame body 1, and one end of the edge support 3 supports the polishing head frame body 1, which increases the connection area between the edge support 3 and the polishing head frame body 1 to facilitate more Support the polishing head frame body 1 well. In other embodiments of the present invention, the edge support 3 may also be located at the end of the bracket 11. The side of the edge support 3 near the center post 2 is connected to the end surface of the bracket 11. This connection method requires the edge support 3 and The bracket 11 is firmly connected, and the edge support 3 has a limited support effect on the bracket 11.

Further, the edge support 3 is a plate-shaped structure. The edge support 3 includes a support surface 31 for supporting the bracket 11. The ground of the bracket 11 overlaps the support surface 31. The support surface 31 bears the weight of the bracket 11. Enhanced support effect. The support surface 31 is provided with a connecting portion 32 for connecting with the bracket 11. The bracket 11 is provided with a positioning hole 111 for cooperating with the connecting portion 32. The connecting portion 32 is inserted into the positioning hole 111. The edge support 3 supports the support 11 through the support surface 31 to ensure that the edge support 3 and the support 11 have a certain contact area, which improves the support effect of the edge support 3; the edge support 3 and the support 11 pass through the connecting portion 32 and the positioning hole 111 cooperates to realize positioning connection, which improves connection accuracy and facilitates quick assembly. In other embodiments of the present invention, the edge support 3 may also have a columnar structure to increase the area of the support surface 31 of the edge support 3 to facilitate stable support of the bracket 11.

Optionally, the connection portion 32 and the bracket 11 are connected by a screw lock 42. The thread locking member 42 may be a nut, and the outer peripheral surface of the connecting portion 32 is provided with a thread, and the connecting portion 32 and the bracket 11 are locked by the nut, which facilitates assembly and disassembly of the connecting portion 32 and the bracket 11. In other embodiments of the present invention, the threaded locking member 42 may also be a bolt, a screw, etc. The connecting portion 32 defines a threaded hole, and the threaded locking member 42 locks the connecting portion 32 and the bracket 11. Use requirements, using different thread locking member 42.

According to some embodiments of the present invention, the bracket 11 is provided with an opening groove 112 for the polishing head module to pass through. The opening groove 112 extends from the end of the bracket 11 toward the center of the polishing head frame body 1. As shown in FIG. 1, the opening groove 112 is provided along the extending direction of the moving rail 12, which is equivalent to the opening groove 112 extending along the length direction of the bracket 11, so that the polishing head module can slide in the opening groove 112 to facilitate the bracket 11 and the polishing head The assembly of the module and the movement of the polishing head module are flexible.

According to some embodiments of the present invention, the plurality of brackets 11 are rotationally symmetrically distributed along the center of the polishing head frame body 1. In order to distribute the brackets 11 reasonably, it is convenient for the center column 2 to be balanced in force to stabilize the polishing head frame body 1. The multiple brackets 11 adopt a rotationally symmetrical distribution method, and also facilitate the processing and manufacturing of the polishing head frame body 1.

According to some specific embodiments of the present invention, as shown in FIG. 5, the number of the brackets 11 is four, and the four brackets 11 form a cross structure. The setting of the four brackets 11, the angle between the two adjacent brackets is 90 °, reasonable use of the installation space, at the same time, there is sufficient operating space between the two adjacent polishing tables to facilitate the corresponding polishing Workbench operation. In other embodiments of the present invention, the number of the brackets 11 may be multiple. Based on the weight of the polishing head module, the number of the brackets 11 is preferably greater than two, which facilitates the stability of the central column 2 to the polishing head frame body 1 support.

The working principle of the chemical mechanical polishing device support structure 100 according to the embodiment of the first aspect of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the central column 2 is fitted with the groove 13 of the polishing head frame body 1, and the central column 2 and the polishing head frame body 1 are locked by bolts 41, and the edge support 3 is placed on the polishing head frame body 1 and assembled with the corresponding bracket 11 to complete the installation of the chemical mechanical polishing equipment support structure 100.

According to the support structure 100 of the chemical mechanical polishing apparatus according to the embodiment of the first aspect of the present invention, the polishing head frame body 1 is relatively fixed to the working platform without displacement change, which solves the reduction in the service life caused by the rotation of the polishing head frame body 1 of the prior art Problem; the center column 2 is placed on the working platform to support the polishing head frame body 1, combined with the setting of the edge support 3, to share the force of the center column 2, so that the polishing head frame body 1 is placed smoothly; each bracket 11 is set The moving rail 12 of the polishing head enables the polishing head moving module to drive the polishing head module to move relative to the support 11. The polishing head module replacement area 5 is reserved between the polishing table and the center column 2 to facilitate polishing of the polishing head module during polishing. The upper and lower films are carried out in the head module replacement area 5 (the wafer is replaced on the polishing head).

The chemical mechanical polishing apparatus 200 according to the embodiment of the second aspect of the present invention will be described below with reference to the drawings.

As shown in FIG. 6, a chemical mechanical polishing apparatus 200 according to an embodiment of the second aspect of the present invention includes a polishing head moving module 6, a polishing head module 7, and a chemical mechanical polishing apparatus support structure 100 according to an embodiment of the first aspect of the present invention .

The polishing head moving module 6 is slidably connected to the moving rail 12 on the corresponding bracket 11, the polishing head module 7 is detachably connected to the polishing head moving module 6, the polishing head moving module 6 works to drive the polishing head module 7 Move relative to the carriage 11 along the moving rail 12. When the polishing head module 7 moves to the end of the moving rail 12, the polishing head module 7 is located in the polishing head module replacement area 5, where the wafer on the polishing head can be replaced.

According to the chemical mechanical polishing device 200 of the embodiment of the second aspect of the present invention, the structure is simple and the operation is convenient, the service life of the polishing head frame body 1 is improved, the wafer replacement of the polishing head module 7 is facilitated, and the polishing efficiency and quality are improved.

It should be noted that, in the case of no conflict, the features in the embodiments of the present invention may be combined with each other.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

1: Polishing head frame body 2: Center column 3: edge support 5: Polishing head module replacement area 6: Polishing head moving module 7: Polishing head module 11: Bracket 12: moving track 13: groove 21: Threaded hole 31: Support surface 32: Connection 41: Bolt 42: Threaded lock 100: Support structure of chemical mechanical polishing equipment 111: positioning hole 112: open slot 131: connection hole 200: chemical mechanical polishing equipment

In order to more clearly explain the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation on the scope. For those of ordinary skill in the art, without paying any creative labor, other related drawings can also be obtained according to these drawings.

FIG. 1 is a schematic view from a first perspective of a support structure of a chemical mechanical polishing apparatus according to an embodiment of the first aspect of the present invention.

FIG. 2 is a schematic view from a second perspective of a supporting structure of a chemical mechanical polishing apparatus according to an embodiment of the first aspect of the present invention.

FIG. 3 is a schematic diagram of the connection between the center column of FIG. 1 and the polishing head frame body.

4 is a schematic diagram of the connection between the edge support of FIG. 1 and the bracket.

5 is a schematic view from a third perspective of a support structure of a chemical mechanical polishing apparatus according to an embodiment of the first aspect of the present invention.

6 is a schematic structural view of a chemical mechanical polishing device according to an embodiment of the second aspect of the present invention.

1: Polishing head frame body

2: Center column

3: edge support

5: Polishing head module replacement area

11: Bracket

12: moving track

100: Support structure of chemical mechanical polishing equipment

112: open slot

Claims (10)

A support structure for chemical mechanical polishing equipment includes a polishing head frame body and a central column for supporting the polishing head frame body, the polishing head frame body includes a plurality of brackets converging at the center of the polishing head frame body, The center column is located at the center of the polishing head frame body and is connected to the polishing head frame body. The end of the center column away from the polishing head frame body is used to be installed on a working platform. An end of the center of the polishing head frame body is connected with an edge support, the edge support is used to cooperate with the center post to support the polishing head frame body, and the edge support is formed between the center post A working area for placing a polishing table, each of the brackets is provided with a moving rail extending toward the center of the polishing head frame body, the moving rail is used for the polishing head moving module and the bracket to be slidable Connection, along the extending direction of the moving rail, the end of the moving rail near the end of the central column and the central column have a gap between them to form a polishing head module replacement area, when the polishing head moves When the module moves to the end of the moving track close to the end of the central column, the polishing head module connected to the polishing head moving module is located in the polishing head module replacement area. The supporting structure of the chemical mechanical polishing equipment according to claim 1, wherein the center of the polishing head frame body has a groove matching with the center column, the center column is inserted into the groove and is The end surface of the central column abuts against the groove bottom wall of the groove, and the central column is detachably connected to the polishing head frame body. The chemical mechanical polishing equipment support structure according to claim 1, wherein the edge support is detachably connected to the bracket. The chemical mechanical polishing equipment support structure according to claim 1, wherein the edge support and the center post are located on the same side of the polishing head frame body. The chemical mechanical polishing equipment support structure according to claim 4, wherein the edge support is a plate-like structure, and the edge support includes a support surface for supporting the bracket, and the support surface is provided with A connecting portion connected to the bracket is provided with a positioning hole for cooperating with the connecting portion, and the connecting portion is inserted into the positioning hole. The chemical mechanical polishing equipment support structure according to claim 5, wherein the connection portion and the bracket are connected by a screw lock. The chemical mechanical polishing equipment supporting structure according to claim 1, wherein the bracket is provided with an opening groove for the polishing head module to pass through, and the opening groove is directed from the end of the bracket toward the polishing head The center of the frame extends. The chemical mechanical polishing equipment support structure according to claim 1, wherein a plurality of the brackets are rotationally symmetrically distributed along the center of the polishing head frame body. The chemical mechanical polishing equipment supporting structure according to claim 8, wherein the number of the brackets is four, and four of the brackets form a cross structure. A chemical mechanical polishing device, including a polishing head moving module, a polishing head module, and a chemical mechanical polishing device support structure according to any one of claims 1 to 9, the polishing head moving module and the moving track may be Sliding connection, the polishing head module is detachably connected to the polishing head moving module, the polishing head moving module works to drive the polishing head module to move along the moving track.

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