CN201833275U - Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same - Google Patents
Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same Download PDFInfo
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- CN201833275U CN201833275U CN2010202834556U CN201020283455U CN201833275U CN 201833275 U CN201833275 U CN 201833275U CN 2010202834556 U CN2010202834556 U CN 2010202834556U CN 201020283455 U CN201020283455 U CN 201020283455U CN 201833275 U CN201833275 U CN 201833275U
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- mechanical polishing
- rubbing head
- polishing
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Abstract
The utility model discloses a chemical-mechanical polishing machine, which comprises a work platform, a polishing disc, a finisher, a polishing liquid delivery device, an assembling and disassembling platform, a polishing head, a manipulator and a polishing head support. The polishing head support is mounted on the upper surface of the work platform and comprises a horizontal substrate and supporting side plates, a groove which is through in the thickness direction of the horizontal substrate is formed on the horizontal substrate, is opened at one longitudinal end of the horizontal substrate and extends towards the other longitudinal end horizontally, the supporting side plates are respectively connected with the horizontal substrate, respectively located on two transverse sides of the groove and used for supporting the horizontal substrate, wherein the longitudinal end of the horizontal substrate longitudinally extends out of the supporting side plates so as to form a cantilever end, and the cantilever end extends to a position above the polishing disc. The chemical-mechanical polishing machine is simple in structure, convenient in processing and high in production efficiency. The utility model further provides chemical-mechanical polishing equipment with the chemical-mechanical polishing machine.
Description
Technical field
The utility model relates to the chemical-mechanical polisher field, especially relates to a kind of chemical-mechanical polishing mathing and has its chemical-mechanical polisher.
Background technology
In the large scale integrated circuit production process, it is essential together and frequent operation that the deposit on the wafer is carried out planarization.At present, finish this procedure and mainly adopt chemically mechanical polishing (CMP) technology.Chemical-mechanical polishing mathing is a capital equipment of finishing this procedure.
Traditional chemical-mechanical polishing mathing generally includes workbench, is installed in three polishing disks on the workbench, loading/unloading platform, four rubbing heads and cross rubbing head support.Four cantilevers of cross rubbing head support adjacent two orthogonal and can adsorb a rubbing head respectively.The wafer of each rubbing head absorption needs to polish on three polishing disks successively.The rubbing head of loading/unloading platform top adsorbs pending polishings such as polished wafer.After a wafer was finished polishing, the rubbing head support revolved and turn 90 degrees, and the rubbing head that adsorbs this wafer forwards to above the loading/unloading platform, and other three rubbing heads absorption wafer separately forwards the top of next polishing disk to, begins following one polishing process.Conventional polisher in use, each rubbing head loading and unloading wafer all will move to the loading/unloading platform top from polishing disk top.When wafer loaded and unloaded, the center of each rubbing head and the center of loading/unloading platform needed alignment, and three rubbing heads that polish need respectively and mulberry lattice polishing disk center-aligned; therefore control accuracy requires height, and the cross rubbing head weight support frame of conventional polisher is big, complex structure; the precision prescribed height; make difficulty, the cost height, and the rubbing head on four cantilevers influences each other; for example; if a rubbing head or its wafer that carries go wrong, must shut down, so efficient is low.The cantilever of cross rubbing head support has amplification to the position of rotation error of rubbing head support, so the wafer loading and unloading are very high to the control accuracy requirement of rubbing head support.The error that causes of the each rotation of rubbing head support all can be different, and this makes the difficulty of adjusting the rubbing head position increase again.
The utility model content
The utility model is intended to solve at least one of technical problem that exists in the prior art.For this reason, a purpose of the present utility model is to propose a kind of simple in structure, processing is simple, control accuracy requires to reduce, production efficiency is high chemical-mechanical polishing mathing.Another purpose of the present utility model is to propose a kind of chemical-mechanical polisher with above-mentioned chemical-mechanical polishing mathing.
Comprise according to chemical-mechanical polishing mathing of the present utility model: workbench; Polishing disk, described polishing disk are installed on the described workbench upper surface; Trimmer and polishing fluid conveying device, described trimmer and polishing fluid conveying device are installed on the upper surface of workbench respectively and are positioned near the polishing disk; The rubbing head support, described rubbing head support is installed on the workbench upper surface and comprises horizontal base plate and support side plate, described horizontal base plate is formed with the groove that connects on its thickness direction, described groove opens wide and extends towards the vertical other end of level at vertical end of horizontal base plate, described support side plate links to each other with horizontal base plate respectively and the both lateral sides that lays respectively at described groove is used for the support level substrate, described vertical end of wherein said horizontal base plate extends beyond described support side plate in the vertical to constitute cantilever end, and described cantilever end reaches the top of described polishing disk;
Loading/unloading platform, described loading/unloading platform are installed on the described workbench and are positioned at described horizontal base plate below and relative with described polishing disk, and wherein the longitudinal centre line of the groove of rubbing head support is by the center of polishing disk and loading/unloading platform; Rubbing head, described rubbing head are arranged on the described rubbing head support rotatable and movable along the longitudinally and pass described groove and stretch out downwards; And manipulator, described manipulator is arranged on to be used near the workbench wafer is placed on the loading/unloading platform and from loading/unloading platform takes wafer away.
According to chemical-mechanical polishing mathing of the present utility model, simple in structure, processing is simple, control accuracy requires to reduce, the production efficiency height.
In addition, can also have following additional technical characterictic according to chemical-mechanical polishing mathing of the present utility model:
Both lateral sides at described groove on the upper surface of rubbing head support is respectively equipped with guide rail, and described rubbing head is arranged on the guide rail movably by bolster.
Both lateral sides on the lower surface of described bolster is respectively equipped with slide block, and described bolster is arranged on the described guide rail by slide block.
On bolster, be provided with the drive motors that is used to drive the rubbing head rotation.
On described rubbing head support, be provided with and be used to drive hydraulic cylinder or the servomotor that rubbing head is along the longitudinal movement.
Described horizontal base plate is a U-shaped, and described support side plate is connected on the described horizontal base plate by welding or bolt.
Described support side plate comprises upper plate portion and is connected the lower board unit of upper plate portion lower end, outward-dipping respectively and described lower board unit extends from the lower end of described upper plate portion described upper plate portion straight down from the bottom surface of described horizontal base plate, and wherein said upper plate portion is integrally formed with lower board unit or is connected continuous by welding or bolt.
Of the present utility modelly propose a kind of chemical-mechanical polisher on the other hand, comprise a plurality of chemical-mechanical polishing mathings that are arranged in together, wherein said chemical-mechanical polishing mathing is above-mentioned chemical-mechanical polishing mathing.
The shared manipulator of described a plurality of chemical-mechanical polishing mathing and/or a workbench.
Described a plurality of chemical-mechanical polishing mathing is arranged in many rows, and adjacent two rows with back-to-back or aspectant mode make up.
Additional aspect of the present utility model and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Description of drawings
Above-mentioned and/or additional aspect of the present utility model and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the schematic perspective view according to the chemical-mechanical polishing mathing of the utility model embodiment;
Fig. 2 is the schematic perspective view of the diving tower formula rubbing head support of chemical-mechanical polishing mathing shown in Figure 1;
Fig. 3 is the schematic perspective view according to the chemical-mechanical polisher of an embodiment of the utility model;
Fig. 4 is the floor map according to the chemical-mechanical polisher of another embodiment of the utility model;
Fig. 5 is according to the utility model floor map of the chemical-mechanical polisher of an embodiment again.
The specific embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, term " vertically ", " laterally ", " on ", close the orientation of indications such as D score, " left side ", " right side ", " vertically ", " level ", " top ", " end " or position is based on orientation shown in the drawings or position relation, it only is the utility model rather than require the utility model therefore can not be interpreted as for convenience of description with specific orientation structure and operation to restriction of the present utility model.
Below with reference to the chemical-mechanical polishing mathing 100 of accompanying drawing description according to the utility model embodiment.
As shown in Figure 1, comprise workbench 1, polishing disk 2, trimmer 3, polishing fluid conveying device 4, loading/unloading platform 5, rubbing head 6, a rubbing head support 9 and a manipulator 13 according to the chemical-mechanical polishing mathing 100 of the utility model embodiment.
In embodiment of the utility model, as illustrated in fig. 1 and 2, rubbing head support 9 comprises horizontal base plate 91 and support side plate 92.Be formed with groove 910 on the horizontal base plate 91, groove 910 connects horizontal base plate 91 on the thickness direction of horizontal base plate 91, and groove 910 opens wide and extends towards vertical other end of horizontal base plate 91 at vertical end of horizontal base plate 91.In other words, an end of groove 910 opens wide and other end sealing.
Two support side plate 92 link to each other with horizontal base plate 91 respectively, and in a concrete example of the present utility model, the upper end of support side plate 92 links to each other with the bottom surface of horizontal base plate 91 respectively.Two support side plate 92 lay respectively at the both sides of groove 910 in the horizontal, and the left end of horizontal base plate 91 extends longitudinally the left side that exceeds support side plate 92, thereby the left end of horizontal base plate 91 constitutes cantilever end.The right-hand member of horizontal base plate 91 can extend support side plate 92, also can be concordant with them.Be similar to the form of diving tower according to the rubbing head support of the utility model embodiment, so also can become diving tower formula rubbing head support.The basal surface of support side plate 92 is positioned on the same horizontal plane, is installed to the workbench 1 of chemical-mechanical polishing mathing 100 thus when support side plate 92, can guarantee horizontal base plate 91 levels.
According to the rubbing head support 9 of the utility model embodiment, simple in structure, easy to manufacture, and use the control accuracy of the polishing machine of rubbing head support 9 to require to reduce, reduced cost, the polishing efficiency height.
In an embodiment of the present utility model, horizontal base plate 91 is a U-shaped, and the blind end of groove 910 is an arc.Support side plate 92 comprises upper plate portion 921 and is connected the lower board unit 922 of upper plate portion 921 lower ends.The upper plate portion 921 of two support side plate 92 is outward-dipping from the bottom surface of horizontal base plate 91 respectively, and lower board unit 922 extends straight down from the lower end of upper plate portion 921.Lower board unit 922 can be integrally formed with upper plate portion 921.Alternatively, after lower board unit 922 can be made separately, be connected with upper plate portion 921 welding or bolt then.
In embodiment more of the present utility model, support side plate 92 can be connected on the bottom surface of horizontal base plate 91 by welding or bolt.Alternatively, support side plate 92 also can be welded or bolt is connected on the both lateral sides face of horizontal base plate 91.
Workbench 1 for example is the general rectangular framework.Polishing disk 2 is installed in the left side of workbench 1 upper surface.Loading/unloading platform 5 is installed in the right side of workbench 1 upper surface and relative with polishing disk 2.Trimmer 3 and polishing fluid conveying device 4 are installed on the appropriate location on next door of polishing disk 2, and the free end of trimmer 3 and polishing fluid conveying device 4 extend into polishing disk 2 tops, trimmer 3 is used for wafer is repaired, and polishing fluid conveying device 4 is used for carrying polishing fluid to polishing disk 2 tops.
On the upper surface of horizontal base plate 9, be provided with two parallel guide rails 7 in the both lateral sides of groove 910, rubbing head 6 is supported on the guide rail 7 by bolster 11.Preferably, be provided with slide block 8 below bolster 11, slide block 8 can be supported on the guide rail 7 movably.Be provided with drive motors 12 on bolster 11, the output shaft of drive motors 12 can link to each other by the rubbing head 6 of decelerator with bolster 11 belows, so that drive rubbing head 6 rotations.
Bolster 11 is driven by servomotor 10 and longitudinally moves on guide rail 7 and swing, and in an embodiment of the present utility model, servomotor 10 can drive bolster 11 by leading screw and move.Alternatively, servomotor 10 can substitute with hydraulic cylinder, thereby hydraulic-driven bolster 11 is along the longitudinal movement, thereby drive rubbing head 6 is along the longitudinal movement and swings, and the vertical pivot 61 that wherein rubbing head 6 is connected on the decelerator moves in groove 910.Therefore, rubbing head 6 can move to polishing disk 2 tops and loading/unloading platform 5 tops respectively.
Manipulator 13 is arranged on to be used near the workbench 1 wafer is placed on the loading/unloading platform 5 and from loading/unloading platform 5 takes wafer away, and the concrete setting of manipulator 13 and control are known for the ordinary skill in the art, are not described in detail here.
Operation according to the chemical-mechanical polishing mathing 100 of the utility model embodiment is described below.
At first, manipulator 13 is placed into polished wafer on the loading/unloading platform 5, servomotor 10 drives rubbing head 6 and moves to loading/unloading platform 5 tops then, loading/unloading platform 5 rises, thereby polished wafer is gone up in rubbing head 6 absorption, and servomotor 10 drives rubbing head 6 and moves to above the polishing disk 26 rotations of drive motors 12 driving rubbing heads then, servomotor 10 driving rubbing heads 6 are swung in the vertical simultaneously, so that wafer is polished.There is an oscillating stroke in rubbing head 6 in swing process, two extreme positions of this trip are: rubbing head 6 carries the lucky respectively position that arrives polishing disk 2 center and peripherals, edge of wafer.
Then, wafer polishing finishes, and rubbing head 6 carries wafer moves to loading/unloading platform 5 from polishing disk 2 tops top.There is a translation stroke in rubbing head 6 in this process, two extreme positions of this trip are respectively: Waffer edge arrives the position at polishing disk 2 edges just; The center of rubbing head 6 and loading/unloading platform 5 Centered positions.The peaceful Cheng Jun of dividing a word with a hyphen at the end of a line of the swing of rubbing head 6 finishes on guide rail 7, and only relies on servomotor 10 to drive.Be understandable that the length of the length of the straight line portion of U-lag and guide rail 7 must be greater than the oscillating stroke and the translation stroke sum of rubbing head 6.
After the center-aligned of rubbing head 6 and loading/unloading platform 5, loading/unloading platform 5 rises, and the wafer that rubbing head 6 will be finished polishing is unloaded on the loading/unloading platform 5.Loading/unloading platform 5 descends, and manipulator 13 moves to loading/unloading platform 5 tops and grasps the wafer of finishing polishing, is transported to assigned address.
Then, manipulator 13 carries polished wafer, moves to loading/unloading platform 5 tops, and puts it on the loading/unloading platform 5.Loading/unloading platform 5 rises, and rubbing head 6 absorption wafers are finished the wafer loading and unloading.Then rubbing head 6 moves to polishing disk 2 tops, longitudinally swings and driving rotation by drive motors 12 by the driving of servomotor 10, so that wafer is polished.
Because rubbing head 6 is supported on the diving tower formula rubbing head support 9 and along the guide rail 7 that is arranged on the rubbing head support 9 and moves, therefore the chemical-mechanical polishing mathing 100 according to the utility model embodiment also can be called diving tower formula chemical-mechanical polishing mathing 100.
Chemical-mechanical polisher according to the utility model embodiment is described below.
As shown in Figure 3, chemical-mechanical polisher according to an embodiment of the utility model comprises two chemical-mechanical polishing mathings 100 of next-door neighbour's setting side by side, two chemical-mechanical polishing mathing 100 shared manipulators 13, alternatively, two chemical-mechanical polishing mathings 100 also can a shared workbench 1, thereby reduced the number of spare parts of chemical-mechanical polisher, reduced cost.Chemical-mechanical polishing mathing 100 works alone, and is independent of each other, thereby has improved operating efficiency.
Fig. 4 shows the chemical-mechanical polisher according to another embodiment of the utility model, comprising four chemical-mechanical polishing mathings 100 and be set to compact arranged two rows, the 100 back-to-back settings of two row's chemical-mechanical polishing mathings, and two manipulators 13 have been used, two chemical-mechanical polishing mathings, the 100 shared manipulators 13 among the wherein same row.Certainly, four chemical-mechanical polishing mathings 100 can a shared workbench 1.
Fig. 5 shows according to the utility model chemical-mechanical polisher of an embodiment again, comprising four chemical-mechanical polishing mathings 100, and be arranged in two rows, the spaced apart preset distance of two rows, promptly two row's chemical-mechanical polishing mathings 100 are arranged in aspectant mode, four chemical-mechanical polishing mathing 100 shared manipulators 13, certainly, two chemical-mechanical polishing mathings 100 among the same row can a shared workbench 1.
In Fig. 4 and embodiment shown in Figure 5, four chemical-mechanical polishing mathings 100 work alone, and do not interact each other, have improved operating efficiency, have reduced number of spare parts simultaneously, have simplified control.
Certainly, it will be appreciated that, be not limited to above-mentioned arrangement mode and chemical-mechanical polishing mathing quantity, as required, can make up easily, improved practicality according to the chemical-mechanical polisher of the utility model embodiment.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present utility model or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiment of the present utility model, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present utility model and aim, scope of the present utility model is limited by claim and equivalent thereof.
Claims (10)
1. a chemical-mechanical polishing mathing is characterized in that, comprising:
Workbench;
Polishing disk, described polishing disk are installed on the described workbench upper surface;
Trimmer and polishing fluid conveying device, described trimmer and polishing fluid conveying device are installed on the upper surface of workbench respectively and are positioned near the polishing disk;
The rubbing head support, described rubbing head support is installed on the workbench upper surface and comprises horizontal base plate and support side plate, described horizontal base plate is formed with the groove that connects on its thickness direction, described groove opens wide and extends towards the vertical other end of level at vertical end of horizontal base plate, described support side plate links to each other with horizontal base plate respectively and the both lateral sides that lays respectively at described groove is used for the support level substrate, described vertical end of wherein said horizontal base plate extends beyond described support side plate in the vertical to constitute cantilever end, and described cantilever end reaches the top of described polishing disk;
Loading/unloading platform, described loading/unloading platform are installed on the described workbench and are positioned at described horizontal base plate below and relative with described polishing disk, and wherein the longitudinal centre line of the groove of rubbing head support is by the center of polishing disk and loading/unloading platform;
Rubbing head, described rubbing head are arranged on the described rubbing head support rotatable and movable along the longitudinally and pass described groove and stretch out downwards; With
Manipulator, described manipulator are arranged on to be used near the workbench wafer is placed on the loading/unloading platform and from loading/unloading platform takes wafer away.
2. chemical-mechanical polishing mathing according to claim 1 is characterized in that the both lateral sides at described groove on the upper surface of rubbing head support is respectively equipped with guide rail, and described rubbing head is arranged on the guide rail movably by bolster.
3. chemical-mechanical polishing mathing according to claim 2 is characterized in that the both lateral sides on the lower surface of described bolster is respectively equipped with slide block, and described bolster is arranged on the described guide rail by slide block.
4. chemical-mechanical polishing mathing according to claim 2 is characterized in that, is provided with the drive motors that is used to drive the rubbing head rotation on bolster.
5. chemical-mechanical polishing mathing according to claim 1 is characterized in that, is provided with to be used to drive hydraulic cylinder or the servomotor that rubbing head is along the longitudinal movement on described rubbing head support.
6. chemical-mechanical polishing mathing according to claim 1 is characterized in that, described horizontal base plate is a U-shaped, and described support side plate is connected on the described horizontal base plate by welding or bolt.
7. chemical-mechanical polishing mathing according to claim 1, it is characterized in that, described support side plate comprises upper plate portion and is connected the lower board unit of upper plate portion lower end, outward-dipping respectively and described lower board unit extends from the lower end of described upper plate portion described upper plate portion straight down from the bottom surface of described horizontal base plate, and wherein said upper plate portion is integrally formed with lower board unit or is connected continuous by welding or bolt.
8. a chemical-mechanical polisher is characterized in that, comprises a plurality of chemical-mechanical polishing mathings that are arranged in together, and wherein said chemical-mechanical polishing mathing is according to each described chemical-mechanical polishing mathing among the claim 1-7.
9. chemical-mechanical polisher according to claim 8 is characterized in that, the shared manipulator of described a plurality of chemical-mechanical polishing mathings and/or a workbench.
10. chemical-mechanical polisher according to claim 8 is characterized in that, described a plurality of chemical-mechanical polishing mathings are arranged in many rows, and adjacent two rows with back-to-back or aspectant mode make up.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202834556U CN201833275U (en) | 2010-08-05 | 2010-08-05 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
| US13/384,627 US9138857B2 (en) | 2010-08-05 | 2011-06-08 | Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same |
| PCT/CN2011/075452 WO2012016477A1 (en) | 2010-08-05 | 2011-06-08 | Chemical mechanical polisher and chemical mechanical polishing equipment with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202834556U CN201833275U (en) | 2010-08-05 | 2010-08-05 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
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| Publication Number | Publication Date |
|---|---|
| CN201833275U true CN201833275U (en) | 2011-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202834556U Expired - Lifetime CN201833275U (en) | 2010-08-05 | 2010-08-05 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
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| CN (1) | CN201833275U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102240927A (en) * | 2011-05-30 | 2011-11-16 | 清华大学 | Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment |
| CN102335866A (en) * | 2011-09-28 | 2012-02-01 | 清华大学 | Anti-splash device used for chemical machinery polishing machine and chemical machinery polishing machine thereof |
| WO2012016477A1 (en) * | 2010-08-05 | 2012-02-09 | 清华大学 | Chemical mechanical polisher and chemical mechanical polishing equipment with same |
| CN102744674A (en) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | Chemical-mechanical polishing device |
| CN103264394A (en) * | 2013-01-11 | 2013-08-28 | 清华大学 | Wafer catching adaptive control method and device for chemically mechanical polishing transmission robot |
| CN103481173A (en) * | 2013-08-29 | 2014-01-01 | 蚌埠市国恒机械设备有限公司 | Automatic turnover device on polishing unit |
| CN105598827A (en) * | 2016-01-05 | 2016-05-25 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing machine |
| CN110877286A (en) * | 2019-12-02 | 2020-03-13 | 深圳市安达工业设计有限公司 | Chemical mechanical polishing equipment convenient to clearance |
| WO2020143262A1 (en) * | 2019-01-11 | 2020-07-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chemical mechanical polishing operation platform and chemical mechanical polishing apparatus |
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- 2010-08-05 CN CN2010202834556U patent/CN201833275U/en not_active Expired - Lifetime
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012016477A1 (en) * | 2010-08-05 | 2012-02-09 | 清华大学 | Chemical mechanical polisher and chemical mechanical polishing equipment with same |
| US9138857B2 (en) | 2010-08-05 | 2015-09-22 | Hwatsing Technology Co., Ltd. | Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same |
| CN102240927B (en) * | 2011-05-30 | 2014-01-08 | 清华大学 | Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment |
| CN102240927A (en) * | 2011-05-30 | 2011-11-16 | 清华大学 | Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment |
| CN102335866A (en) * | 2011-09-28 | 2012-02-01 | 清华大学 | Anti-splash device used for chemical machinery polishing machine and chemical machinery polishing machine thereof |
| CN102744674B (en) * | 2012-07-26 | 2016-10-26 | 上海华虹宏力半导体制造有限公司 | Chemical-mechanical grinding device |
| CN102744674A (en) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | Chemical-mechanical polishing device |
| CN103264394A (en) * | 2013-01-11 | 2013-08-28 | 清华大学 | Wafer catching adaptive control method and device for chemically mechanical polishing transmission robot |
| CN103481173A (en) * | 2013-08-29 | 2014-01-01 | 蚌埠市国恒机械设备有限公司 | Automatic turnover device on polishing unit |
| CN105598827A (en) * | 2016-01-05 | 2016-05-25 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing machine |
| CN105598827B (en) * | 2016-01-05 | 2018-05-22 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing mathing |
| US10857646B2 (en) | 2016-01-05 | 2020-12-08 | Tsinghua University | Apparatus for chemical-mechanical polishing |
| WO2020143262A1 (en) * | 2019-01-11 | 2020-07-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chemical mechanical polishing operation platform and chemical mechanical polishing apparatus |
| CN110877286A (en) * | 2019-12-02 | 2020-03-13 | 深圳市安达工业设计有限公司 | Chemical mechanical polishing equipment convenient to clearance |
| CN110877286B (en) * | 2019-12-02 | 2021-01-15 | 盐城恒远投资发展有限公司 | Chemical mechanical polishing equipment convenient to clearance |
| CN112338795A (en) * | 2019-12-02 | 2021-02-09 | 深圳市安达工业设计有限公司 | Polishing method of chemical mechanical polishing equipment convenient to clean |
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| C14 | Grant of patent or utility model | ||
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| AV01 | Patent right actively abandoned |
Granted publication date: 20110518 Effective date of abandoning: 20120502 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20110518 Effective date of abandoning: 20120502 |