CN102744674B - Chemical-mechanical grinding device - Google Patents
Chemical-mechanical grinding device Download PDFInfo
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- CN102744674B CN102744674B CN201210260755.6A CN201210260755A CN102744674B CN 102744674 B CN102744674 B CN 102744674B CN 201210260755 A CN201210260755 A CN 201210260755A CN 102744674 B CN102744674 B CN 102744674B
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- mechanical arm
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- mounting hole
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Chemical-mechanical grinding device includes: the mechanical arm sensor be arranged in the reverse sensor mounting hole in mechanical arm holding part, being arranged in reverse sensor mounting hole and the detection object being arranged in mechanical arm part.Owing to mechanical arm part keeps rotation partly relative to mechanical arm, when the fan-shaped opening portion that the detection object arranged in mechanical arm part is formed is corresponding to the mechanical arm sensor of reverse sensor mounting hole position, mechanical arm sensor at installing hole senses mechanical arm, thus mechanical arm sensor sends reset notification signal；And, processing unit just starts the chemical grinding to pending wafer after receiving reset notification signal from mechanical arm sensor and processes.So, this Curve guide impeller solves a defect of original board design: when sensor failure, if mechanical arm also will not stop grinding at position board.Only when working sensor is normal and mechanical arm position is correct time, board just can start milled processed.
Description
Technical field
The present invention relates to field of semiconductor manufacture, it is more particularly related to a kind of cmp
Equipment.
Background technology
Cmp (CMP, chemical mechanical polishing, also referred to as chemical machinery
Polishing) the surface planarisation PROCESS FOR TREATMENT that is currently widely used in semiconductor fabrication.Chemical machinery grinds
The process of mill is that wafer is placed on the grinding pad of rotation, then adds certain pressure, grinds with chemical grinding liquid
Mill wafer is so that wafer planarization.During silicon chip is ground by chemical-mechanical grinding device, grind
Agent (polishing fluid) by pipeline stream, is played lubrication in process of lapping, and is ground on grinding pad
Agent also can play suitable chemical reaction with the silicon chip ground, and improves to grind and removes speed.
The chemical-mechanical grinding device of the Mirra Mesa that such as company of Applied Materials produces etc passes through
Grinding agent transmission mechanical arm transmits grinding agent.In order to prevent forgetting after employing grinding agent transmission mechanical arm
Note makes grinding agent transmission mechanical arm reset, and devises closely switch and detects the reality of grinding agent transmission mechanical arm
Position, border.
Fig. 1 schematically shows the schematic diagram of grinding agent transmission mechanical arm.This grinding agent transmission mechanical arm bag
Include: rotatable mechanical arm part 1, non-rotatable mechanical arm keep part 2, are arranged in mechanical arm holding
Sensor mounting hole 3 in part 2 and the mechanical arm sensor that is arranged in sensor mounting hole 3 are (not
Illustrate).Wherein, sensor mounting hole 3 is corresponding to the reset position of mechanical arm part 1.
Mechanical arm sensor the most closely switchs, a kind of passive element.Wherein, mechanical arm sensor is used
Corresponding in sending when sensing mechanical arm part 1 and not resetting before proceeding by mechanical lapping process
Signal.Such as, when sensing mechanical arm part 1 and having resetted, mechanical arm sensor sends signal " 0 "；
Otherwise, when sensing mechanical arm part 1 and not resetting, mechanical arm sensor sends signal " 1 ".
Specifically, Fig. 2 schematically shows when the grinding agent transmission mechanical arm shown in Fig. 1 does not resets
Schematic diagram.As in figure 2 it is shown, owing to rotatable mechanical arm part 1 is protected relative to non-rotatable mechanical arm
Hold the rotation of part 2, when the detection object arranged in mechanical arm part 1 (as represented by black semicircle, is examined
Survey object and cover the hemicycle of mechanical arm holding part 2) not up to corresponding to the reset position of mechanical arm part 1
During the sensor mounting hole 3 put, the mechanical arm sensor 4 at sensor mounting hole 3 senses less than mechanical arm
Part 1, thus judge that mechanical arm part 1 does not resets.
Fig. 3 schematically shows the schematic diagram when grinding agent transmission mechanical arm shown in Fig. 1 resets.Such as figure
Shown in 2, owing to rotatable mechanical arm part 1 is relative to the rotation of non-rotatable mechanical arm holding part 2
Turning, when the detection object arranged in mechanical arm part 1, (as represented by black semicircle, detection object covers machine
Mechanical arm keeps the hemicycle of part 2) sensor that reaches reset position corresponding to mechanical arm part 1 installs
During hole 3, the mechanical arm sensor 4 at sensor mounting hole 3 senses mechanical arm part 1, thus judges
Mechanical arm part 1 has resetted.
But, if the cable connecting mechanical arm sensor breaks down, then will not sense from mechanical arm
The device signal that pager you receives that gives a warning is " 0 ", and board thinks that mechanical arm has resetted.So,
At this moment, not resetting even if sensing mechanical arm part 1, cannot correctly send caution signals yet；Thus change
Learn mechanical grinding device will not stop processing.Like this, owing to mechanical arm part 1 does not resets, thus not
Can transmit grinding agent, thus chemical machinery will be carried out in the case of not having grinding agent, thus damage wafer.
The solution whether mechanical arm part resets can be effectively sensed accordingly, it is desirable to provide a kind of.
Summary of the invention
The technical problem to be solved is for there is drawbacks described above in prior art, former not changing
There is sensor logic, adjusted by physical location and realize logic inversion, it is provided that one can sense machine effectively
The chemical-mechanical grinding device whether mechanical arm part resets.
According to the present invention, it is provided that a kind of chemical-mechanical grinding device, comprising: rotatable machinery arm
Point, non-rotatable mechanical arm holding part, the reverse sensor that is arranged in mechanical arm holding part install
Hole, the mechanical arm sensor being arranged in reverse sensor mounting hole, the detection that is arranged in mechanical arm part
Object and processing unit；Wherein, reverse sensor mounting hole and the reset position corresponding to mechanical arm part
Put relatively；Wherein, mechanical arm sensor is for sensing machine before proceeding by mechanical lapping process
The reset notification signal representing mechanical arm partial reset is sent during mechanical arm partial reset, and, mechanical arm senses
Device does not send any signal when sensing mechanical arm part and not resetting；Wherein, described detection object covers
The sector portion more than 180 degree in cross section；And, on the one hand, due to rotatable mechanical arm part phase
Non-rotatable mechanical arm is kept to the rotation of part, when the detection object institute shape arranged in mechanical arm part
When the fan-shaped opening portion become does not corresponds to the mechanical arm sensor of reverse sensor mounting hole position, pass
Mechanical arm sensor at sensor installing hole senses less than mechanical arm part, and thus mechanical arm sensor does not sends
Any signal；On the other hand, keep relative to non-rotatable mechanical arm due to rotatable mechanical arm part
The rotation of part, the fan-shaped opening portion formed when the detection object arranged in mechanical arm part corresponds to
During the mechanical arm sensor of reverse sensor mounting hole position, the mechanical arm sensor at sensor mounting hole
Sense mechanical arm part, thus mechanical arm sensor sends reset notification signal；And, chemical grinding sets
Standby processing unit just starts pending wafer after receiving reset notification signal from mechanical arm sensor
Chemical grinding process.
Preferably, described mechanical arm keeps the cross section of part not by the arch section of described detection object covering
Size is corresponding to the size of the mechanical arm sensor in reverse sensor mounting hole.
Preferably, described detection object covers 340 degree to 355 degree of cross section of mechanical arm holding part
Sector portion.
Preferably, described detection object 6 covers the sector that mechanical arm keeps 350 degree of cross section of part 2
Part.
Preferably, described mechanical arm sensor is closely to switch.
Preferably, described reset notification signal is signal " 1 "
According to embodiments of the present invention, do not send out when sensing mechanical arm part and not resetting due to mechanical arm sensor
Go out any signal, and only when mechanical arm sensor senses mechanical arm partial reset and now only pass
Just can send reset notification signal when sense device working is normal, thus chemical grinding equipment could start pending
The chemical grinding of wafer processes.Thus, only there is no fault at the cable connecting mechanical arm sensor, and
When mechanical arm part has resetted such that it is able to provide grinding agent, just can start the chemistry to pending wafer
Milled processed.In other words, this Curve guide impeller solves a defect of original board design: work as sensor
During inefficacy, if mechanical arm also will not stop grinding at position board.Only when working sensor is normal
And mechanical arm position correct time board just can start milled processed.
So, do not have owing to chemical machinery will not have grinding agent according to the chemical grinding equipment of the present invention
In the case of carry out thus the problem of damaging wafer.Thus, the present invention provides one can effectively sense machine
The chemical grinding equipment whether mechanical arm part resets.
Accompanying drawing explanation
In conjunction with accompanying drawing, and by with reference to detailed description below, it will more easily the present invention is had more complete
Understand and its adjoint advantage and feature is more easily understood, wherein:
Fig. 1 schematically shows the schematic diagram of grinding agent transmission mechanical arm.
Fig. 2 schematically shows the schematic diagram when grinding agent transmission mechanical arm shown in Fig. 1 does not resets.
Fig. 3 schematically shows the schematic diagram when grinding agent transmission mechanical arm shown in Fig. 1 resets.
Fig. 4 schematically shows showing when grinding agent transmission mechanical arm according to embodiments of the present invention does not resets
It is intended to.
Fig. 5 schematically shows signal when grinding agent transmission mechanical arm according to embodiments of the present invention resets
Figure.
It should be noted that accompanying drawing is used for illustrating the present invention, and the unrestricted present invention.Note, represent structure
Accompanying drawing may be not necessarily drawn to scale.Further, in accompanying drawing, same or like element indicate identical or
The label that person is similar to.
Detailed description of the invention
In order to make present disclosure more clear and understandable, below in conjunction with specific embodiments and the drawings to this
Bright content is described in detail.
Chemical-mechanical grinding device according to embodiments of the present invention includes: rotatable mechanical arm part 1, can not
The mechanical arm rotated keep part 2, be arranged in mechanical arm keep the reverse sensor mounting hole in part 2,
And the mechanical arm sensor 4 being arranged in reverse sensor mounting hole.
Wherein, reverse sensor mounting hole is relative with the reset position corresponding to mechanical arm part 1.
Mechanical arm sensor 4 the most closely switchs, a kind of passive element.
Wherein, mechanical arm sensor 4 is for sensing machinery before proceeding by mechanical lapping process
Arm section 1 sends the reset notification signal representing that mechanical arm part 1 resets, the notice that such as resets letter when resetting
Number being signal " 1 ", certainly, reset notification signal can also be signal " 0 ".Further, with prior art not
With, mechanical arm sensor 4 does not send any signal when sensing mechanical arm part 1 and not resetting.
Chemical-mechanical grinding device according to embodiments of the present invention also includes the detection being arranged in mechanical arm part
Object 6.
Further, such as Fig. 4 and Fig. 5, the detection object that mechanical arm part 1 is arranged, unlike the prior art
, described detection object 6 the most only covers half of 180 degree of the cross section of mechanical arm holding part 2
Circular portion, but the sector portion more than 180 degree in covered cross section.
For instance, it is preferred that described detection object 6 covers 340 degree that mechanical arm keeps the cross section of part 2
To the sector portion of 355 degree.It is highly preferred that described detection object 6 covers mechanical arm keeps part 2
The sector portion of 350 degree of cross section.
Moreover it is preferred that in particular preferred embodiment, the cross section of mechanical arm holding part 2 is the most described
The size of the arch section that detection object 6 covers is corresponding to the mechanical arm sensor in reverse sensor mounting hole
The size of 4.
Correspondingly, the grinding agent transmission mechanical arm that Fig. 4 schematically shows according to embodiments of the present invention is not multiple
Schematic diagram during position.
As shown in Figure 4, owing to rotatable mechanical arm part 1 is relative to non-rotatable mechanical arm maintaining part
The rotation of points 2, when the fan-shaped opening portion that the detection object 6 arranged in mechanical arm part 1 is formed not
During corresponding to the mechanical arm sensor 4 of reverse sensor mounting hole position, the machine at sensor mounting hole 3
Mechanical arm sensor 4 senses less than mechanical arm part 1, thus judges that mechanical arm part 1 does not resets.Further,
Unlike the prior art, when sensing mechanical arm part 1 and not resetting, mechanical arm sensor does not sends
Any signal.
During additionally, Fig. 5 schematically shows grinding agent transmission mechanical arm reset according to embodiments of the present invention
Schematic diagram.The reset state of the mechanical arm part 1 shown in Fig. 5 is equal to the mechanical arm part shown in Fig. 3
The reset state of 1.
As it is shown in figure 5, owing to rotatable mechanical arm part 1 is relative to non-rotatable mechanical arm maintaining part
Divide the rotation of 2, when the fan-shaped opening portion pair that the detection object 6 arranged in mechanical arm part 1 is formed
Should be when the mechanical arm sensor 4 of reverse sensor mounting hole position, the machinery at sensor mounting hole 3
Arm sensor 4 senses mechanical arm part 1, thus judges that mechanical arm part 1 has resetted.Further, exist
Sensing mechanical arm part 1 when not resetting, mechanical arm sensor 4 sends reset notification signal, such as signal
“1”。
Further, unlike the prior art, the processing unit (not shown) of chemical grinding equipment is from machine
Mechanical arm sensor 4 just starts the chemical grinding to pending wafer and processes after receiving reset notification signal.
Thus, it is possible to find out, according to embodiments of the present invention, machinery is being sensed due to mechanical arm sensor 4
Do not send any signal when arm section 1 does not resets, and only sense machinery arm at mechanical arm sensor 4
Just send reset notification signal when dividing 1 reset, thus chemical grinding equipment could start pending wafer
Chemical grinding processes.Thus, only there is no fault, and mechanical arm at the cable connecting mechanical arm sensor
When part 1 has resetted such that it is able to provide grinding agent (polishing fluid), just can start pending wafer
Chemical grinding process.
It can be seen that this Curve guide impeller of the embodiment of the present invention solve original board design a defect:
When sensor failure, if mechanical arm also will not stop grinding at position board.Only when sensor work
Make normal and also time mechanical arm position is correct board just can start milled processed.So, according to the present invention
The chemical grinding equipment of embodiment do not have due to chemical machinery will carry out in the case of there is no grinding agent from
And the problem damaging wafer.Thus, it is provided that a kind of can effectively sense the change whether mechanical arm part resets
Learn milling apparatus.
Although it is understood that the present invention discloses as above with preferred embodiment, but above-described embodiment is also
It is not used to limit the present invention.For any those of ordinary skill in the art, without departing from skill of the present invention
In the case of art aspects, technical solution of the present invention is made many by the technology contents that all may utilize the disclosure above
Possible variation and modification, or it is revised as the Equivalent embodiments of equivalent variations.Therefore, every without departing from this
The content of bright technical scheme, according to the present invention technical spirit to any simple modification made for any of the above embodiments,
Equivalent variations and modification, all still fall within the range of technical solution of the present invention protection.
Claims (6)
1. a chemical-mechanical grinding device, it is characterised in that including: rotatable mechanical arm part, non-rotatable
Mechanical arm holding part, the reverse sensor mounting hole being arranged in mechanical arm holding part, be arranged in anti-
Mechanical arm sensor in sensor mounting hole, the detection object being arranged in mechanical arm part and place
Reason unit；
Wherein, reverse sensor mounting hole is relative with the reset position corresponding to mechanical arm part；
Wherein, mechanical arm sensor is for sensing mechanical arm again before proceeding by cmp process
Position also sends the reset notification signal representing mechanical arm partial reset, and, mechanical arm sensor is sensing
Any signal is not sent when mechanical arm part does not resets；
Wherein, described detection object covers the sector portion more than 180 degree in cross section of mechanical arm holding part；
And, on the one hand, owing to rotatable mechanical arm part keeps part relative to non-rotatable mechanical arm
Rotating, the fan-shaped opening portion formed when the detection object arranged in mechanical arm part does not corresponds to reversely
Mechanical arm sensor sensing during the mechanical arm sensor of sensor mounting hole position, at sensor mounting hole
Less than mechanical arm part, thus mechanical arm sensor does not send any signal；
On the other hand, owing to rotatable mechanical arm part keeps rotation partly relative to non-rotatable mechanical arm,
The fan-shaped opening portion formed when the detection object arranged in mechanical arm part is pacified corresponding to reverse sensor
When filling the mechanical arm sensor of hole location, the mechanical arm sensor at sensor mounting hole senses mechanical arm
Part, thus mechanical arm sensor sends reset notification signal；
And, the processing unit of chemical grinding equipment after receiving reset notification signal from mechanical arm sensor
Start the chemical grinding to pending wafer to process.
Chemical-mechanical grinding device the most according to claim 1, it is characterised in that described mechanical arm maintaining part
The size of the arch section that the cross section divided is not covered by described detection object is corresponding in reverse sensor mounting hole
The size of mechanical arm sensor.
Chemical-mechanical grinding device the most according to claim 1 and 2, it is characterised in that described detection object
Cover the sector portion of 340 degree to 355 degree of cross section of mechanical arm holding part.
Chemical-mechanical grinding device the most according to claim 3, it is characterised in that described detection object (6)
Cover the sector portion of 350 degree of cross section of mechanical arm holding part (2).
Chemical-mechanical grinding device the most according to claim 1 and 2, it is characterised in that described mechanical arm passes
Sensor is closely to switch.
Chemical-mechanical grinding device the most according to claim 1 and 2, it is characterised in that described reset notifies
Signal is signal " 1 ".
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260755.6A CN102744674B (en) | 2012-07-26 | 2012-07-26 | Chemical-mechanical grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260755.6A CN102744674B (en) | 2012-07-26 | 2012-07-26 | Chemical-mechanical grinding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102744674A CN102744674A (en) | 2012-10-24 |
| CN102744674B true CN102744674B (en) | 2016-10-26 |
Family
ID=47025356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210260755.6A Active CN102744674B (en) | 2012-07-26 | 2012-07-26 | Chemical-mechanical grinding device |
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| Country | Link |
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| CN (1) | CN102744674B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113305818A (en) * | 2021-05-28 | 2021-08-27 | 高彦波 | Mechanical arm self-checking reset and protection method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1618538A1 (en) * | 1988-09-13 | 1991-01-07 | Предприятие П/Я А-1067 | Arrangement for electromechanical polishing and bringing parts to specified size |
| US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
| US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
| CN1531747A (en) * | 2001-03-14 | 2004-09-22 | 美商・应用材料股份有限公司 | Planarization of substrates using electrochemical mechanical polishing |
| CN201833275U (en) * | 2010-08-05 | 2011-05-18 | 清华大学 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7160739B2 (en) * | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
-
2012
- 2012-07-26 CN CN201210260755.6A patent/CN102744674B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1618538A1 (en) * | 1988-09-13 | 1991-01-07 | Предприятие П/Я А-1067 | Arrangement for electromechanical polishing and bringing parts to specified size |
| US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
| US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
| CN1531747A (en) * | 2001-03-14 | 2004-09-22 | 美商・应用材料股份有限公司 | Planarization of substrates using electrochemical mechanical polishing |
| CN201833275U (en) * | 2010-08-05 | 2011-05-18 | 清华大学 | Chemical-mechanical polishing machine and chemical-mechanical polishing equipment with same |
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| Publication number | Publication date |
|---|---|
| CN102744674A (en) | 2012-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140430 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140430 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |