CN207724097U - Protection structure on chemical-mechanical grinding device - Google Patents
Protection structure on chemical-mechanical grinding device Download PDFInfo
- Publication number
- CN207724097U CN207724097U CN201721685924.5U CN201721685924U CN207724097U CN 207724097 U CN207724097 U CN 207724097U CN 201721685924 U CN201721685924 U CN 201721685924U CN 207724097 U CN207724097 U CN 207724097U
- Authority
- CN
- China
- Prior art keywords
- chemical
- mechanical grinding
- rubber bellows
- grinding device
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a kind of protection structures on chemical-mechanical grinding device; it is cased with rubber bellows outside lifting gear in the chemical-mechanical grinding device; the protection structure is the protective cover outside rubber bellows, and the protective cover is structure as a whole or separate structure.The protective cover of the utility model can prevent acid lapping liquid to be in direct contact with rubber bellows, and to improve the service life of rubber bellows, the liquid leakage being also prevented from rubber corrugated tracheal rupture post-chemical mechanical grinding technics leads to electrical component damage.
Description
Technical field
The utility model is related to semiconductor integrated circuit manufacturing fields, particularly belong to a kind of for chemical-mechanical grinding device
On protection structure.
Background technology
With the rapid development of semi-conductor industry, the size of electronic device is smaller and smaller, for wafer surface flatness
It is required that having reached nanoscale.Chemical mechanical grinding (Chemical Mechanical Polishing, the letter that the nineties rises
Claim CMP, also referred to as chemically-mechanicapolish polish) technology from processing performance and speed simultaneously meet silicon slice pattern processing requirement, and
The currently the only technology that global planarizartion may be implemented.CMP process is one of the critical process of semiconductor wafer surface processing, and
Each stage for ic manufacturing process is surface flattening.
In chemical mechanical grinding process, silicon chip is fixed on to the bottom of rubbing head, polishing pad is placed on abrasive disk
On, when polishing, the rubbing head of rotation is pressed in certain pressure on the polishing pad of rotation, and lapping liquid is in silicon chip surface and polishing pad
Between flow, then lapping liquid is uniformly distributed thereon, under the action of the transmission of polishing pad and centrifugal force in silicon chip and polishing pad
Between formed one layer of lapping liquid fluid film.Chemical composition in lapping liquid generates chemical reaction with silicon chip surface material, will not
Molten substance is converted into readily soluble substance or softens substance with high hardness, then passes through the micromechanics rubbing action of abrasive grain
These chemical reactants are removed from silicon chip surface, dissolves in the liquid of flowing and takes away, i.e., in chemical striping and mechanical striping
The purpose of planarization is realized in alternation procedure.
Currently, the lifting gear of abrasive disk outer cover has rubber bellows in chemical-mechanical grinding device, in lifting gear
Portion's cylinder control lifting, and the rubber bellows outside cylinder are exposed to outside, as shown in Figure 1, its Long Term Contact lapping liquid, especially
It is acid lapping liquid, aging rupture easily occurs for rubber bellows under the influence of Telescopic-cylinder moves herein, and then causes
Lapping liquid leaks into the electrical position below abrasive disk with water, causes the electric/electronic devices short circuit such as motor, sensor that event occurs
Barrier.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of protection structure on chemical-mechanical grinding device,
Lapping liquid is drained to water in electric component after can solving current rubber bellows aging rupture and damage.
In order to solve the above technical problems, the protection structure provided by the utility model on chemical-mechanical grinding device,
Rubber bellows are cased with outside lifting gear in the chemical-mechanical grinding device, the protection structure is mounted on rubber corrugated
A protective cover outside pipe.
A kind of structure is that the protective cover is structure as a whole.
Wherein, there is the protective cover head cover and side shield, wherein head cover to be provided with screw hole and the upper end with rubber bellows
It is fixedly connected, side shield is located at rubber bellows towards the side of lapping liquid injection direction.Alternatively, the protective cover has head cover
And cylindrical baffle, wherein head cover are provided with screw hole and are fixedly connected with the upper end of rubber bellows, rubber bellows are fully located at cylinder
In shape baffle.
Or another structure is, the protective cover is separate structure.
Further, the protective cover includes upper outlet body and lower baffle plate, and the lateral dimension of upper outlet body is more than lower baffle plate
Lateral dimension.Wherein, there is the upper outlet body head cover and side shield, wherein head cover to be provided with screw hole and the upper end with rubber bellows
It is fixedly connected, the lower baffle plate has bottom plate and side shield, and the side shield of upper outlet body and the side shield of lower baffle plate are respectively positioned on rubber
Bellows is towards the side of lapping liquid injection direction.Alternatively, there is the upper outlet body head cover and cylindrical baffle, wherein head cover to be provided with
Screw hole is simultaneously fixedly connected with the upper end of rubber bellows, and there is the lower baffle plate bottom plate and cylindrical baffle, the tubular of upper outlet body to keep off
The radius of plate is more than the radius of the cylindrical baffle of lower baffle plate.
The beneficial effects of the utility model are:
1) protective cover of the utility model can prevent acid lapping liquid to be in direct contact with rubber bellows, to improve
The service life of rubber bellows;
2) protective cover of the utility model can prevent the liquid in rubber corrugated tracheal rupture post-chemical mechanical grinding technics
Leakage leads to electrical component damage.
Description of the drawings
Fig. 1 is the service condition of current rubber bellows;
Fig. 2 is the schematic diagram before the first embodiment of the utility model is not installed;
Fig. 3 is the schematic diagram after the first embodiment installation of the utility model;
Fig. 4 is the structural schematic diagram of the second embodiment of the utility model.
Wherein the reference numerals are as follows:
1 is rubber bellows;2 be protective cover;3 be upper outlet body;4 be lower baffle plate.
Specific implementation mode
The utility model is described in further detail with specific implementation mode below in conjunction with the accompanying drawings.
The utility model is a protective cover, is ground in chemical machinery for the protection structure on chemical-mechanical grinding device
It grinds in equipment, rubber bellows 1 is cased with outside lifting gear, the protective cover is just mounted on outside rubber bellows 1.
First embodiment
As shown in Fig. 2, the protective cover 2 of the present embodiment is structure as a whole.
There is protective cover 2 head cover and side shield, wherein head cover to be provided with screw hole, positions and dimensions and the rubber wave of the screw hole
The positions and dimensions of 1 top screw for fixing of line pipe are consistent, fixed protective cover 2 and rubber bellows 1 using screw
Together, and side shield then be located at rubber bellows 1 towards the side of lapping liquid injection direction, as shown in Figure 3.
In the present embodiment, although being protected to rubber bellows using semi-open side shield, the present embodiment
It is not limited thereto, protects rubber bellows completely it is obvious to a person skilled in the art that ground is contemplated that
Come, that is, utilizes cylindrical baffle to replace side shield, therefore this will not be repeated here.
Second embodiment
When lifting gear is when rising and falling that height is insufficient to cause the protective cover bottom of integral structure to be easy to block, may be used point
The protective cover of body structure, as shown in Figure 4.
Split type protective cover includes upper outlet body 3 and lower baffle plate 4, and the lateral dimension of upper outlet body 3 is more than the cross of lower baffle plate 4
To size, lower baffle plate 4 is wrapped in interior by upper outlet body 3 when can ensure to fall in this way.
Wherein, there is upper outlet body 3 head cover and side shield, lower baffle plate 4 there is bottom plate and side shield, head cover to be provided with screw hole and spiral shell
The positions and dimensions in hole are consistent with the 1 top positions and dimensions of screw for fixing of rubber bellows, will be upper using screw
Cover body 3 is fixed together with rubber bellows 1, and the side shield of the side shield of upper outlet body 3 and lower baffle plate 4 is respectively positioned on rubber corrugated
Pipe 1 is towards the side of lapping liquid injection direction.
Likewise, in the present embodiment, although being protected to rubber bellows using semi-open side shield, this
Embodiment is not limited thereto, it is obvious to a person skilled in the art that ground be contemplated that rubber bellows are complete
It protects, that is, utilizes cylindrical baffle to replace the side shield of the side shield and lower baffle plate 4 of upper outlet body 3, as long as the tubular of upper outlet body 3
Baffle radius is more than the cylindrical baffle radius of lower baffle plate 4, therefore this will not be repeated here.Certainly, split type protective cover may be used also
To use upper outlet body as cylindrical baffle, and the structure type that lower baffle plate is side shield, those skilled in the art can be according to reality
Situation combines.
The protective cover of the utility model can prevent acid lapping liquid to be in direct contact with rubber bellows, to improve rubber
The service life of glue bellows;The liquid leakage being also prevented from simultaneously in rubber corrugated tracheal rupture post-chemical mechanical grinding technics
Lead to electrical component damage.
The utility model is described in detail above by specific embodiment, which is only that this practicality is new
The preferred embodiment of type, the utility model are not limited to the above embodiment.The case where not departing from the utility model principle
Under, the equivalent replacement and improvement that those skilled in the art makes the structure type and shape of protective cover are regarded as at this
In the technology scope that utility model is protected.
Claims (8)
1. a kind of protection structure on chemical-mechanical grinding device, outside the lifting gear in the chemical-mechanical grinding device
It is cased with rubber bellows, which is characterized in that the protection structure is the protective cover outside rubber bellows.
2. the protection structure according to claim 1 on chemical-mechanical grinding device, which is characterized in that the protection
Cover is structure as a whole.
3. the protection structure according to claim 2 on chemical-mechanical grinding device, which is characterized in that the protection
There is cover head cover and side shield, wherein head cover to be provided with screw hole and are fixedly connected with the upper end of rubber bellows, and side shield is located at rubber
Glue bellows is towards the side of lapping liquid injection direction.
4. the protection structure according to claim 2 on chemical-mechanical grinding device, which is characterized in that the protection
There is cover head cover and cylindrical baffle, wherein head cover to be provided with screw hole and are fixedly connected with the upper end of rubber bellows, rubber bellows
It is fully located in cylindrical baffle.
5. the protection structure according to claim 1 on chemical-mechanical grinding device, which is characterized in that the protection
Cover is separate structure.
6. the protection structure according to claim 5 on chemical-mechanical grinding device, which is characterized in that the protection
Cover includes upper outlet body and lower baffle plate, and the lateral dimension of upper outlet body is more than the lateral dimension of lower baffle plate.
7. the protection structure according to claim 6 on chemical-mechanical grinding device, which is characterized in that the upper cover
There is body head cover and side shield, wherein head cover to be provided with screw hole and are fixedly connected with the upper end of rubber bellows, the lower baffle plate tool
There are bottom plate and side shield, the side shield of upper outlet body and the side shield of lower baffle plate to be respectively positioned on rubber bellows towards lapping liquid injection side
To side.
8. the protection structure according to claim 6 on chemical-mechanical grinding device, which is characterized in that the upper cover
There is body head cover and cylindrical baffle, wherein head cover to be provided with screw hole and are fixedly connected with the upper end of rubber bellows, the lower baffle plate
With bottom plate and cylindrical baffle, the radius of the cylindrical baffle of upper outlet body is more than the radius of the cylindrical baffle of lower baffle plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721685924.5U CN207724097U (en) | 2017-12-07 | 2017-12-07 | Protection structure on chemical-mechanical grinding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721685924.5U CN207724097U (en) | 2017-12-07 | 2017-12-07 | Protection structure on chemical-mechanical grinding device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207724097U true CN207724097U (en) | 2018-08-14 |
Family
ID=63097806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721685924.5U Active CN207724097U (en) | 2017-12-07 | 2017-12-07 | Protection structure on chemical-mechanical grinding device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207724097U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113084708A (en) * | 2021-04-19 | 2021-07-09 | 长鑫存储技术有限公司 | Pneumatic cylinder protection architecture and chemical mechanical polishing device |
-
2017
- 2017-12-07 CN CN201721685924.5U patent/CN207724097U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113084708A (en) * | 2021-04-19 | 2021-07-09 | 长鑫存储技术有限公司 | Pneumatic cylinder protection architecture and chemical mechanical polishing device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104854680B (en) | Three region carrier heads and flexible membrane | |
US20110272819A1 (en) | Wafer level package and methods of fabricating the same | |
CN103413798B (en) | Chip structure, chip-packaging structure | |
CN201856158U (en) | Wafer polishing locating ring and chemical mechanical polishing device | |
CN207724097U (en) | Protection structure on chemical-mechanical grinding device | |
CN103273414A (en) | Chemical-mechanical polishing device and method thereof | |
US8823079B2 (en) | Semiconductor device and method for manufacturing same | |
CN102054683B (en) | Rework method of chemically mechanical polishing in copper interconnection process | |
US20120080138A1 (en) | Method of processing plate-shaped body having rugged surface | |
CN203792155U (en) | Silicon wafer aligner capable of adjusting pressure | |
CN101847588B (en) | Semiconductor process | |
US8858300B2 (en) | Applying different pressures through sub-pad to fixed abrasive CMP pad | |
CN207326710U (en) | Grinding head and chemical mechanical polishing device | |
CN207788624U (en) | Polishing pad and its burnishing device | |
US20200055160A1 (en) | Chemical mechanical polishing method and apparatus | |
CN208246598U (en) | Liquid-supplying bucket detects switching device | |
CN107611015A (en) | A kind of preparation method of high brightness acid corrosion silicon chip | |
CN103862364A (en) | Grinding pad, grinding machine table and grinding method | |
CN113001391A (en) | Grinding device and method | |
CN202200170U (en) | Grinding head and chemical mechanical grinding equipment | |
US20060063326A1 (en) | Chemical mechanical polishing method | |
CN201136124Y (en) | Locating ring for grinding semiconductor chip | |
KR20070087965A (en) | Flexible membrane | |
CN202185817U (en) | Polishing head capable of increasing evenness of silicon wafer | |
CN106783586B (en) | Method for improving memory unit word line chemical mechanical polishing process window |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |