CN202592202U - Grinding head with grinding fluid supply function and grinding device - Google Patents
Grinding head with grinding fluid supply function and grinding device Download PDFInfo
- Publication number
- CN202592202U CN202592202U CN 201220208336 CN201220208336U CN202592202U CN 202592202 U CN202592202 U CN 202592202U CN 201220208336 CN201220208336 CN 201220208336 CN 201220208336 U CN201220208336 U CN 201220208336U CN 202592202 U CN202592202 U CN 202592202U
- Authority
- CN
- China
- Prior art keywords
- grinding
- grinding head
- lapping liquid
- spacing ring
- head body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a grinding head with a grinding fluid supply function and a grinding device. The grinding head comprises a grinding head body, a drive shaft and a limiting ring, wherein the drive shaft is fixedly connected with the grinding head body; and the limiting ring is arranged on the periphery at the lower part of the grinding head body. The grinding head further comprises a grinding fluid supply tube and at least two spouts; the at least two spouts are uniformly formed under the inner side of the limiting ring; the drive shaft is provided with a through hole for the grinding fluid supply tube to pass through in the axial direction; and a grinding fluid pipeline for connecting the grinding fluid supply tube and the at least two spouts is arranged in the grinding head body and the limiting ring. The grinding head has the beneficial effect that as the grinding fluid supply tube is arranged in a manner of passing through the drive shaft, grinding fluid can be supplied to the neighboring part of a wafer as much as possible, so that a large quantity of grinding fluid is prevented from being thrown out by a grinding pad to be wasted. Therefore, the product on cost is saved, and the production rate is improved.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of grinding head and lapping device that has the lapping liquid supplying functional.
Background technology
In semi-conductive production technology, often need carry out chemical mechanical milling tech (CMP, Chemical Mechanical Polishing).CMP is also referred to as chemical-mechanical planarization (Chemical Mechanical Planarization).Chemical mechanical milling tech is the technical process of a complicacy; It is that crystal column surface is contacted with the lapped face of grinding pad; Then; With flattening wafer surface, adopt chemical-mechanical grinding device through the relative motion between crystal column surface and the lapped face usually, be also referred to as grinder station or polishing machine platform and carry out chemical mechanical milling tech.Said lapping device comprises a grinding head; When carrying out grinding technics, the wafer that will grind is attached on the grinding head, and this wafer to be ground faces down and contact counterrotating grinding pad; The downforce that grinding head provides is pressed onto this wafer on the grinding pad; Said grinding pad is to be pasted on the grinding plate, and when rotating under the drive of this grinding plate at motor, grinding head also carries out corresponding sports; Simultaneously, lapping liquid is transported on the grinding pad through the lapping liquid feeding unit, and is evenly distributed on the grinding pad through centrifugal force.The purpose of grinding is that dielectric layer on the wafer and metal level (metal layer) are polished; Make its global planarization, and then carry out solid wiring or multilayer wiring, promote distribution density (pattern density); Reduce defect concentration (defect density) simultaneously, promote process rate.At present, utilizing the CMP of nanometer technology is the method that the most effectively realizes flattening wafer surface.
See also Fig. 1; Shown in Figure 1 is the structural representation of existing lapping device, visible by Fig. 1, existing lapping device; Comprise grinding head 110, grinding plate 120, lapping liquid supply pipe 130 and grinding pad 140; Said grinding pad 140 is layed on the said grinding plate 120, and said grinding head 110 has driving shaft 150, and said grinding head 110 independently is arranged at respectively on the said grinding pad 140 with said grinding head supply pipe 130.Because it is moving that lapping liquid supply pipe 130 is arranged at the outside and the grinding pad 140 not stalls of said grinding head 110; A big chunk of the lapping liquid of lapping liquid supply pipe 130 supplies is thrown out by grinding pad 140; Have only sub-fraction to obtain utilizing; Therefore, the serious waste that causes has improved production cost.
Therefore, how a kind of grinding head that has the lapping liquid supplying functional and lapping device that can less lapping liquid consumption being provided is the technical problem that those skilled in the art need to be resolved hurrily.
The utility model content
The purpose of the utility model is to provide a kind of grinding head and lapping device that has the lapping liquid supplying functional, can effective less lapping liquid consumption, reduce production costs.
In order to reach above-mentioned purpose, the utility model adopts following technical scheme:
A kind of grinding head that has the lapping liquid supplying functional; Comprise grinding head body, driving shaft and spacing ring; Said driving shaft is connected with said grinding head body-fixed; Said spacing ring is arranged at around the below of said grinding head body, also comprises lapping liquid supply pipe and at least two spouts, and said at least two spouts evenly are arranged at the interior side-lower of said spacing ring; Said driving shaft is provided with the through hole that supplies said lapping liquid supply pipe to pass through vertically, is provided with the lapping liquid pipeline that is used to be connected said lapping liquid supply pipe and said at least two spouts in said grinding head body and the said spacing ring.
Preferably, at the above-mentioned grinding head that has the lapping liquid supplying functional, the quantity of said spout is two, is relatively arranged on the interior side-lower of said spacing ring.
Preferably, at the above-mentioned grinding head that has the lapping liquid supplying functional, the quantity of said spout is three to five, and evenly is arranged at the interior side-lower of said spacing ring
Preferably, at the above-mentioned grinding head that has the lapping liquid supplying functional, below said grinding head body, be provided with the adsorbed film that is used to adsorb wafer, said adsorbed film is positioned at the inboard of said spacing ring.
Preferably, at the above-mentioned grinding head that has the lapping liquid supplying functional, said driving shaft is connected in the middle part of said grinding head body.
The invention also discloses a kind of lapping device; Comprise grinding head, grinding plate and grinding pad; Said grinding pad is layed on the said grinding plate, and said grinding head is arranged on the said grinding pad, and said grinding head adopts the aforesaid grinding head that has the lapping liquid supplying functional.
Grinding head that has the lapping liquid supplying functional and lapping device that the utility model provides; Through the lapping liquid supply pipe being passed said driving shaft setting; And at least two spouts evenly are arranged at the interior side-lower of said spacing ring; Be provided with the lapping liquid pipeline that is used to be connected said lapping liquid supply pipe and said at least two spouts in said grinding head body and the said spacing ring, thus can with lapping liquid supply to be fed to as much as possible wafer near, avoid lapping liquid to be thrown away in a large number and waste by grinding pad; Practice thrift production cost, improved productivity ratio.
Description of drawings
The grinding head that has the lapping liquid supplying functional and the lapping device of the utility model are provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of existing lapping device;
Fig. 2 is the structural representation of the lapping device of the utility model one embodiment;
Fig. 3 is the structural representation of the grinding head that has the lapping liquid supplying functional of the utility model one embodiment.
Among the figure, 110,210-grinding head, 120,220-grinding plate, 130,230-lapping liquid supply pipe, 140,240-grinding pad, 150,250-driving shaft, 211-grinding head body, 212-spacing ring, 213-spout, 214-lapping liquid pipeline, 215-adsorbed film, 200-wafer.
The specific embodiment
Below will do further to describe in detail to the grinding head that has the lapping liquid supplying functional of the utility model.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented the preferred embodiment of the utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize the advantageous effects of the utility model.Therefore, following description is appreciated that extensively knowing to those skilled in the art, and not as the restriction to the utility model.
For clear, whole characteristics of practical embodiments are not described.In following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development possibly be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose, the characteristic that make the utility model is more obviously understandable, be further described below in conjunction with the specific embodiment of accompanying drawing to the utility model.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 2; The utility model discloses a kind of lapping device; Comprise grinding head 210, grinding plate 220 and grinding pad 240; Said grinding pad 240 is layed on the said grinding plate 220, and said grinding head 210 is arranged on the said grinding pad 240, and said grinding head 210 adopts the grinding head 210 that has the lapping liquid supplying functional.
See also Fig. 3; And please combine Fig. 2; The said grinding head 210 that has the lapping liquid supplying functional; Comprise grinding head body 211, driving shaft 250, spacing ring 212, lapping liquid supply pipe 230 and at least two spouts 213; Said driving shaft 250 is fixedly connected with said grinding head body 211, and said spacing ring 212 is arranged at around the below of said grinding head body 211, and said at least two spouts 213 evenly are arranged at the interior side-lower of said spacing ring 212; Said driving shaft 250 is provided with the through hole that supplies said lapping liquid supply pipe 230 to pass through vertically, is provided with the lapping liquid pipeline 214 that is used to be connected said lapping liquid supply pipe 230 and said at least two spouts 213 in said grinding head body 211 and the said spacing ring 212.Be provided with through lapping liquid supply pipe 230 being passed said driving shaft 250; And said at least two spouts 213 evenly are arranged at the interior side-lower of said spacing ring 212; Be provided with the lapping liquid pipeline 214 that is used to be connected said lapping liquid supply pipe 230 and said at least two spouts 213 in said grinding head body 211 and the said spacing ring 212; Thereby can with lapping liquid supply to be fed to as much as possible wafer 200 near; Avoid lapping liquid to be thrown away in a large number and waste, practiced thrift production cost, improved productivity ratio by grinding pad 240.
Preferably, at the above-mentioned grinding head that has the lapping liquid supplying functional 210, the quantity of said spout 213 is two, is relatively arranged on the interior side-lower of said spacing ring 212, and this design makes that the project organization of lapping liquid pipeline 214 is simple relatively.Spout 213 is oppositely arranged and can improves the grinding effect of wafer 200 more equably to wafer 200 supply lapping liquids.
Certainly, the quantity of said at least two spouts 213 also can be three to five, and evenly is arranged at the interior side-lower of said spacing ring 212.So be provided with, can further evenly supply lapping liquid, further improve the grinding effect of wafer 200 to wafer 200.
Preferably, in the above-mentioned grinding head that has the lapping liquid supplying functional 210, below said grinding head body 211, be provided with and have adsorbed film 215, said adsorbed film 215 is positioned at the inboard of said spacing ring 212, is used to adsorb wafer 200.
Preferably, in the above-mentioned grinding head that has the lapping liquid supplying functional 210, said driving shaft 250 is connected in the middle part of said grinding head body 211.Through driving shaft 250 being arranged at the middle part of said grinding head body 211, can realize 250 pairs of grinding head body 211 stabilized driving of driving shaft, guarantee the grinding effect of wafer 200.
In sum; Grinding head that has the lapping liquid supplying functional and lapping device that the utility model provides; Through the lapping liquid supply pipe being passed said driving shaft setting, and at least two spouts evenly are arranged at the interior side-lower of said spacing ring, are provided with the lapping liquid pipeline that is used to be connected said lapping liquid supply pipe and said at least two spouts in said grinding head body and the said spacing ring; Thereby can with lapping liquid supply to be fed to as much as possible wafer near; Avoid lapping liquid to be thrown away in a large number and waste, practiced thrift production cost, improved productivity ratio by grinding pad.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.
Claims (6)
1. grinding head that has the lapping liquid supplying functional; Comprise grinding head body, driving shaft and spacing ring; Said driving shaft is connected with said grinding head body-fixed, and said spacing ring is arranged at around the below of said grinding head body, it is characterized in that; Also comprise lapping liquid supply pipe and at least two spouts; Said at least two spouts evenly are arranged at the interior side-lower of said spacing ring, and said driving shaft is provided with the through hole that supplies said lapping liquid supply pipe to pass through vertically, are provided with the lapping liquid pipeline that is used to be connected said lapping liquid supply pipe and said at least two spouts in said grinding head body and the said spacing ring.
2. the grinding head that has the lapping liquid supplying functional according to claim 1 is characterized in that the quantity of said spout is two, is relatively arranged on the interior side-lower of said spacing ring.
3. the grinding head that has the lapping liquid supplying functional according to claim 1 is characterized in that, the quantity of said spout is three to five, and evenly is arranged at the interior side-lower of said spacing ring.
4. the grinding head that has the lapping liquid supplying functional according to claim 1 is characterized in that, below said grinding head body, is provided with the adsorbed film that is used to adsorb wafer, and said adsorbed film is positioned at the inboard of said spacing ring.
5. the grinding head that has the lapping liquid supplying functional according to claim 1 is characterized in that said driving shaft is connected in the middle part of said grinding head body.
6. lapping device; Comprise grinding head, grinding plate and grinding pad; Said grinding pad is layed on the said grinding plate; Said grinding head is arranged on the said grinding pad, it is characterized in that, said grinding head adopts like any described grinding head that has the lapping liquid supplying functional in the claim 1～5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220208336 CN202592202U (en) | 2012-05-09 | 2012-05-09 | Grinding head with grinding fluid supply function and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220208336 CN202592202U (en) | 2012-05-09 | 2012-05-09 | Grinding head with grinding fluid supply function and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202592202U true CN202592202U (en) | 2012-12-12 |
Family
ID=47309786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220208336 Expired - Fee Related CN202592202U (en) | 2012-05-09 | 2012-05-09 | Grinding head with grinding fluid supply function and grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202592202U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128888A (en) * | 2014-07-25 | 2014-11-05 | 浙江博海金属制品科技有限公司 | Plane polishing machine |
| CN104440509A (en) * | 2014-11-29 | 2015-03-25 | 河南省广天铸件有限公司 | Grinding miller for pot |
| CN108857659A (en) * | 2018-08-07 | 2018-11-23 | 王聪 | A kind of polishing machine |
| CN111531464A (en) * | 2020-05-08 | 2020-08-14 | 西安奕斯伟硅片技术有限公司 | Grinding head and grinding equipment |
| CN114178980A (en) * | 2021-11-02 | 2022-03-15 | 北京子牛亦东科技有限公司 | Grinding head for chemical mechanical grinding equipment |
| CN114833660A (en) * | 2022-05-20 | 2022-08-02 | 江苏爱矽半导体科技有限公司 | Wafer thinning equipment and use method thereof |
-
2012
- 2012-05-09 CN CN 201220208336 patent/CN202592202U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128888A (en) * | 2014-07-25 | 2014-11-05 | 浙江博海金属制品科技有限公司 | Plane polishing machine |
| CN104440509A (en) * | 2014-11-29 | 2015-03-25 | 河南省广天铸件有限公司 | Grinding miller for pot |
| CN108857659A (en) * | 2018-08-07 | 2018-11-23 | 王聪 | A kind of polishing machine |
| CN108857659B (en) * | 2018-08-07 | 2020-06-30 | 佛山市开拓者陶瓷有限公司 | Polishing machine |
| CN111531464A (en) * | 2020-05-08 | 2020-08-14 | 西安奕斯伟硅片技术有限公司 | Grinding head and grinding equipment |
| CN111531464B (en) * | 2020-05-08 | 2022-04-08 | 西安奕斯伟材料科技有限公司 | Grinding head and grinding equipment |
| CN114178980A (en) * | 2021-11-02 | 2022-03-15 | 北京子牛亦东科技有限公司 | Grinding head for chemical mechanical grinding equipment |
| CN114833660A (en) * | 2022-05-20 | 2022-08-02 | 江苏爱矽半导体科技有限公司 | Wafer thinning equipment and use method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202592202U (en) | Grinding head with grinding fluid supply function and grinding device | |
| CN205021392U (en) | A device for base plate polishing | |
| CN201960447U (en) | Chemical mechanical polishing equipment | |
| CN201856158U (en) | Wafer polishing locating ring and chemical mechanical polishing device | |
| CN203622170U (en) | Chemical mechanical grinding component | |
| CN202491166U (en) | Grinding head and grinding device capable of enhancing wafer grinding uniformity | |
| CN105234823B (en) | Lapping liquid is supplied and grinding pad collating unit, grinder station | |
| CN103878687B (en) | A kind of system preventing grinding pad scratch wafer | |
| CN103522188A (en) | Method for arranging grinding pad, grinding pad arranging device and grinder table | |
| CN206357051U (en) | Abrasive disk, grinding pad conditioners and lapping device | |
| CN203317219U (en) | Finisher of grinding pad and grinding device | |
| CN202702035U (en) | Porous encircling type grinding lubricant supplying system and grinding device | |
| CN203245737U (en) | Multifunctional grinding liquid supply structure and grinding device | |
| CN202462207U (en) | Grinding pad and grinding device | |
| CN102950536B (en) | Chemical mechanical polishing device and chemical and mechanical grinding method | |
| CN107030589A (en) | A kind of chemical-mechanical grinding device | |
| CN207326710U (en) | Grinding head and chemical mechanical polishing device | |
| CN202428311U (en) | Grinding head and grinding device | |
| CN203887685U (en) | Conditioning plate, grinding pad conditioner and grinding device | |
| CN203426856U (en) | Polishing pad arranging device and polishing device | |
| CN203993559U (en) | Lapping liquid supply system and lapping device | |
| CN202200182U (en) | Polishing pad arrangement device and polishing table | |
| CN202053157U (en) | Grinding head, grinding pad trimmer and grinding device | |
| CN202825549U (en) | Grinding pad collator and grinding device | |
| CN203125323U (en) | Grinding pad finishing machine and grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130424 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130424 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 Termination date: 20180509 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |