CN202053157U - Grinding head, grinding pad trimmer and grinding device - Google Patents
Grinding head, grinding pad trimmer and grinding device Download PDFInfo
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- CN202053157U CN202053157U CN2011200925413U CN201120092541U CN202053157U CN 202053157 U CN202053157 U CN 202053157U CN 2011200925413 U CN2011200925413 U CN 2011200925413U CN 201120092541 U CN201120092541 U CN 201120092541U CN 202053157 U CN202053157 U CN 202053157U
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- grinding
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- grinding pad
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Abstract
The utility model relates to a grinding head, a grinding pad trimmer and a grinding device. The grinding head comprises a body, and a positioning ring and a blocking ring which are arranged on one end of the body close to a grinding pad; and the blocking ring is arranged on an outside wall of the body. The grinding pad trimmer comprises a rotating base, a middle connecting rod, a grinding tray and a fixing base; one end of the middle connecting rod is connected with one end of the rotating base close to the grinding pad through a connecting unit; the grinding tray is arranged on the other end of the middle connecting rod; the fixing base is arranged on a periphery of the rotating base and is connected with the rotating base through a rotating bearing; and the grinding pad trimmer further comprises a blocking ring which is arranged on an outside wall of the fixing base. According to the grinding head, the grinding pad trimmer and the grinding device which are related to the utility model, grinding fluid is effectively prevented from sputtering on a surface of the grinding device, therefore the scuffing to wafers is reduced, and the yield for producing the wafers is enhanced.
Description
Technical field
The utility model relates to semiconductor fabrication, relates in particular to a kind of grinding head, grinding mat trimmer and lapping device.
Background technology
(chemical mechanical polish, CMP) technology is a planarization commonly used in the semiconductor manufacturing industry to chemical-mechanical planarization.As shown in Figure 1, the employed chemical mechanical polishing device of chemical-mechanical planarization technology comprises grinding plate (platen), adheres to grinding pad (pad) 11, grinding head (polishing head) 12, lapping liquid nozzle (slurry nozzle) 13 and grinding mat trimmer (dresser) 14 on the described grinding plate.When carrying out cmp, described grinding plate rotation, drive described grinding pad 11 and rotate (shown in the arrow among Fig. 1) together, described lapping liquid nozzle 13 is to described grinding pad 11 jet grinding liquid, and the centrifugal force that produces by described grinding pad 11 rotations is evenly distributed on the described grinding pad 11 described lapping liquid, described grinding head 12 adsorbs the wafer (not shown) that will grind, and the face to be ground of described wafer is pressed on the lapped face of described grinding pad 11, described grinding head 12 drives described wafer and rotates together, and the relative motion between the lapped face of by described wafer to be ground and described grinding pad 11 is with to be ground planarization of described wafer.In process of lapping, can pile up wafer on the lapped face of described grinding pad 11 by worn material and the abrasive grains in the lapping liquid, these particulates will fill up, stop up the micropore hole on the lapped face, make described grinding pad 11 lose grainding capacity, described grinding mat trimmer 14 is pressed on the lapped face of described grinding pad 11 and rotation, on the lapped face of described grinding pad 11, produce cutting and remove the atomic ability of filling, removal remains in the particulate on the lapped face, makes the lapped face of described grinding pad 11 be returned to comparatively ideal state again.
Figure 2 shows that the structural representation of described grinding head 12, described grinding head 12 has body 120, described body 120 is provided with film (membrane) 121 near an end of described grinding pad 11, described film 121 is used to adsorb the wafer 20 that will grind, the edge of described wafer 20 is positioned and encircles 122 encirclements, described locating ring 122 is fixed on the end of described body 120 near described grinding pad 11, be used to limit the position of described wafer 20, described body 120 is provided with connecting rod 123 away from an end of described grinding pad 11, described connecting rod 123 rotations drive described body 120, locating ring 122 and wafer 20 rotate (shown in the arrow among Fig. 2) together.
Figure 3 shows that the structural representation of described grinding mat trimmer 14, described grinding mat trimmer 14 comprises rotating basis 141, be arranged on the rubber seal ring 142 of described rotating basis 141 near described grinding pad 11 1 ends, one end of intermediate connecting rod 143 is connected with the end of described rotating basis 141 near described grinding pad 11 by attaching parts 144, grind the other end that pallet 145 is arranged on described intermediate connecting rod 143, fixed pedestal 146 is arranged on the periphery of described rotating basis 141, and this fixed pedestal 146 is connected with described rotating basis 141 by swivel bearing 147.Described grinding pallet 145 is generally diamond disk, described diamond disk is pressed on the lapped face of described grinding pad 11, described rotating basis 141 drives described fixed pedestal 146 and diamond disk rotates together, on the lapped face of described grinding pad 11, produce cutting and remove the atomic ability of filling, remove the particulate that remains on the lapped face.
In process of lapping, described grinding head 12 and grinding mat trimmer 14 all are in the high speed rotation status, the centrifugal force of the grinding head 12 of rotation and grinding mat trimmer 14 generations makes outwards sputter everywhere of lapping liquid at a high speed, for example be splashed to described grinding head 12, grinding mat trimmer 14, on the surface of the miscellaneous part of lapping liquid nozzle 13 and lapping device, as shown in Figure 1, become the lapping liquid particle 131 of hard after the lapping liquid drying of sputter, the lapping liquid particle 131 of these hard can split away off from the surface of lapping device, fall on the lapped face of described grinding pad 11, become the deleterious particle source that scratches described wafer 20, thereby reduce the wafer production yield.
The utility model content
The purpose of this utility model is to provide a kind of grinding head, grinding mat trimmer and lapping device, can prevent effectively that lapping liquid is splashed to the surface of lapping device, thereby reduces the scuffing to wafer, improves the yield of wafer production.
To achieve the above object, the utility model provides a kind of grinding head, comprises body and is arranged on described body near the locating ring of grinding pad one end with block ring, and the described ring that blocks is arranged on the lateral wall of described body.
Above-mentioned grinding head, wherein, the described ring that blocks adopts the seamless gluing of single face to be attached on the lateral wall of described body.
Above-mentioned grinding head wherein, describedly blocks the outer radius of ring and the difference of its inside radius is 2～6cm.
Above-mentioned grinding head, wherein, when described locating ring was pressed on the described grinding pad, described spacing of blocking between ring and the described grinding pad was 1～5cm.
Another technical scheme provided by the invention is a kind of grinding mat trimmer, comprise rotating basis, intermediate connecting rod, grinding pallet and fixed pedestal, one end of described intermediate connecting rod is connected with the end of described rotating basis near described grinding pad by attaching parts, described grinding pallet is arranged on the other end of described intermediate connecting rod, described fixed pedestal is arranged on the periphery of described rotating basis, and be connected with described rotating basis by swivel bearing, and blocking ring, the described ring that blocks is arranged on the lateral wall of described fixed pedestal.
Above-mentioned grinding mat trimmer, wherein, the described ring that blocks adopts the seamless gluing of single face to be attached on the lateral wall of described fixed pedestal.
Above-mentioned grinding mat trimmer wherein, describedly blocks the outer radius of ring and the difference of its inside radius is 2～6cm.
Above-mentioned grinding mat trimmer, wherein, when described grinding pallet was pressed on the described grinding pad, described spacing of blocking between ring and the described grinding pad was 1～5cm.
Another technical scheme provided by the invention is a kind of lapping device, comprise grinding table, adhere to the grinding pad on the described grinding plate, above-mentioned grinding head, and above-mentioned grinding mat trimmer, described grinding head is used to adsorb wafer to be ground, and described grinding mat trimmer is used to repair the lapped face of described grinding pad.
Above-mentioned lapping device, wherein, the ring that blocks that blocks ring and described grinding mat trimmer of described grinding head all adopts stainless steel material or plastics to make.
Grinding head of the present utility model, grinding mat trimmer and lapping device, on grinding head and grinding mat trimmer, be provided with and block ring, the lapping liquid that is thrown out of is because described no longer outwards sputter everywhere of the effect of blocking of blocking ring, can effectively prevent lapping liquid sputter everywhere, can prevent effectively that lapping liquid is splashed on the surface of miscellaneous part of described grinding head, grinding mat trimmer and lapping device, thereby significantly reduce the sources of particles that scratches wafer, can improve the yield of wafer production.
Description of drawings
Grinding head of the present utility model, grinding mat trimmer and lapping device are provided by following embodiment and accompanying drawing.
Fig. 1 is the schematic diagram of the lapping device of prior art.
Fig. 2 is the structural representation of the grinding head of prior art.
Fig. 3 is the structural representation of the grinding mat trimmer of prior art.
Fig. 4 is the structural representation of the utility model grinding head embodiment one.
Fig. 5 is the structural representation of the utility model grinding mat trimmer embodiment one.
Fig. 6 is the structural representation of the utility model grinding head embodiment two.
Fig. 7 is the structural representation of the utility model grinding mat trimmer embodiment two.
Fig. 8 is the schematic diagram of the utility model lapping device.
The specific embodiment
Below with reference to Fig. 4～Fig. 8 grinding head of the present utility model, grinding mat trimmer and lapping device are described in further detail.
Embodiment one:
Referring to Fig. 4, the grinding head 30 of present embodiment comprises body 31, locating ring 32, film 33, connecting rod 34 and blocks ring 35a;
Described film 33 is arranged on the end of described body 31 near grinding pad 50, and described film 33 is used to adsorb the wafer 20 that will grind;
Described locating ring 32 is arranged on the end of described body 31 near described grinding pad 50, and the madial wall of described locating ring 32 surrounds the edge of described wafer 20;
Described connecting rod 34 is arranged on the other end of described body 31;
The described ring 35a that blocks is arranged on the lateral wall of described body 31, and the promptly described ring 35a that blocks is looped around on the lateral wall of described body 31.
In the present embodiment, the described ring 35a that blocks is fixedly installed on the lateral wall of described body 31.
Described connecting rod 34 rotations, drive described body 31, locating ring 32 and wafer 20 rotate together, the centrifugal force of grinding head 30 generations of rotation throws away grinding head 30 with lapping liquid at a high speed, the lapping liquid that is thrown out of is because described no longer outwards sputter everywhere of the effect of blocking of blocking ring 35a, therefore, the grinding head 30 of present embodiment can effectively prevent lapping liquid sputter everywhere, can prevent effectively that lapping liquid is splashed on the surface of miscellaneous part of described grinding head 30 and lapping device, thereby significantly reduce the sources of particles that scratches wafer, can improve the yield of wafer production, between the defects liability period of lapping device, to clean the described ring 35a that blocks, dispose and remain in the described lip-deep lapping liquid of ring 35a that blocks.
Preferably, when described grinding head 30 adsorbs described wafer 20, when described wafer 20 being pressed on the lapped face of described grinding pad 50, the space D 1 between the described lapped face that blocks ring 35a and described grinding pad 50 is 1～5cm, as shown in Figure 4, experimental results show that this spacing occlusion effect is best;
Preferably, described outer radius and the inside radius that blocks ring 35a poor, promptly described width D 2 of blocking ring 35a is 2～6cm, as shown in Figure 4, this width neither hinders the normal operation of grinding processing procedure, can effectively block lapping liquid sputter everywhere again;
Preferably, described other hard materials that encircle 35a employing stainless steel material, plastics or scribble stainless steel coating that block are made.
Referring to Fig. 5, the grinding mat trimmer 40 of present embodiment comprises rotating basis 41, rubber seal ring 42, intermediate connecting rod 43, attaching parts 44, grinds pallet 45, fixed pedestal 46, swivel bearing 47 and block ring 48a;
Described rubber seal ring 42 is arranged on the end of described rotating basis 41 near described grinding pad 50;
One end of described intermediate connecting rod 43 is connected with the end of described rotating basis 41 near described grinding pad 50 by described attaching parts 44;
Described grinding pallet 45 is arranged on the other end of described intermediate connecting rod 43;
Described fixed pedestal 46 is arranged on the periphery of described rotating basis 41, and described fixed pedestal 46 is connected with described rotating basis 41 by described swivel bearing 47;
The described ring 48a that blocks is arranged on the lateral wall of described fixed pedestal 46, and the promptly described ring 48a that blocks is looped around on the lateral wall of described fixed pedestal 46.
In the present embodiment, the described ring 48a that blocks is fixedly installed on the lateral wall of fixed pedestal 46.
Described rotating basis 41 rotations, driving described grinding pallet 45 and fixed pedestal 46 rotates together, the centrifugal force of grinding mat trimmer 40 generations of rotation throws away grinding mat trimmer 40 with lapping liquid at a high speed, the lapping liquid that is thrown out of is because described no longer outwards sputter everywhere of the effect of blocking of blocking ring 48a, therefore, the grinding mat trimmer 40 of present embodiment can effectively prevent lapping liquid sputter everywhere, can prevent effectively that lapping liquid is splashed on the surface of miscellaneous part of described grinding mat trimmer 40 and lapping device, thereby significantly reduce the sources of particles that scratches wafer, can improve the yield of wafer production, between the defects liability period of lapping device, to clean the described ring 48a that blocks, remain in the described lip-deep lapping liquid of ring 48a that blocks to dispose.
Preferably, when the grinding pallet 45 of described grinding mat trimmer 40 is pressed on the lapped face of described grinding pad 50, described space D 3 of blocking between the lapped face that encircles 48a and described grinding pad 50 is 1～5cm, and as shown in Figure 5, this spacing occlusion effect is best;
Preferably, described outer radius and described inside radius poor of blocking ring 48a of blocking ring 48a, promptly described to block the width D 4 of encircling 48a be 2～6cm, as shown in Figure 5, this width neither hinders the normal operation of grinding processing procedure, can effectively block lapping liquid sputter everywhere again;
Preferably, describedly block other hard materials that ring 48a can adopt stainless steel material, plastics or scribble stainless steel coating and make.
Embodiment two:
Embodiment two is with the difference of embodiment one:
For grinding head, the described ring 35b that blocks is removably disposed on the lateral wall of described body 31, as shown in Figure 6;
The for example described ring 35b that blocks adopts the seamless glue 36 of single face to paste on the lateral wall of described body 31, and at this moment, the described ring 35b that blocks can also adopt the hard waterproof board to make;
Between the defects liability period of lapping device, the described ring 35b that blocks can be disassembled and cleans, remain in the described lip-deep lapping liquid of ring 35b that blocks to dispose, if the described ring 35b that blocks adopts the hard waterproof board to make, then this block the ring 35b be the disposable ring that blocks, promptly between the defects liability period of lapping device, this papery is blocked ring and disassemble, change new papery and block ring.
For grinding mat trimmer, the described ring 48b that blocks is removably disposed on the lateral wall of fixed pedestal 46, as shown in Figure 7;
The for example described ring 48b that blocks adopts the seamless glue 49 of single face to paste on the lateral wall of described fixed pedestal 46, and at this moment, the described ring 48b that blocks can also adopt the hard waterproof board to make;
Between the defects liability period of lapping device, the described ring 48b that blocks can be disassembled and cleans, remain in the described lip-deep lapping liquid of ring 48b that blocks to dispose, if the described ring 48b that blocks adopts the hard waterproof board to make, then this block the ring 48b be the disposable ring that blocks, promptly between the defects liability period of lapping device, this papery is blocked ring and disassemble, change new papery and block ring.
Referring to Fig. 8, lapping device of the present utility model comprises grinding table (not shown), adheres to grinding pad 50, above-mentioned grinding head 30, lapping liquid nozzle 60 and above-mentioned grinding mat trimmer 40 on the described grinding plate, described grinding head 30 is used to adsorb wafer 20, described lapping liquid nozzle 60 is used for to described grinding pad 50 jet grinding liquid, and described grinding mat trimmer 40 is used to repair the lapped face of described grinding pad 50.In grinding processing procedure, described grinding table drives described grinding pad 50 rotations (shown in arrow among Fig. 8), described lapping liquid nozzle 60 is to described grinding pad 50 jet grinding liquid, under the centrifugal action that described grinding pad 50 rotations produce, described lapping liquid is evenly distributed on the described grinding pad 50, described grinding head 30 adsorbs wafer 20, and described wafer 20 is pressed on the lapped face of described grinding pad 50, relative motion between the lapped face of by described wafer 20 to be ground and described grinding pad 50 is with to be ground planarization of described wafer 20, described grinding mat trimmer 40 is pressed on the lapped face of described grinding pad 50, on the lapped face of described grinding pad 50, produce cutting and remove the atomic ability of filling, remove the particulate that remains on the lapped face.
Because grinding head in the lapping device of the present utility model and grinding mat trimmer are provided with and block ring, can effectively prevent to grind in the processing procedure lapping liquid sputter everywhere (as shown in Figure 8, there is not lapping liquid on the surface of grinding head, grinding mat trimmer and lapping liquid nozzle), thereby significantly reduce the sources of particles that scratches wafer, improve the yield of wafer production.
Claims (10)
1. a grinding head comprises body and is arranged on the locating ring of described body near grinding pad one end, it is characterized in that, also comprises and blocks ring, and the described ring that blocks is arranged on the lateral wall of described body.
2. grinding head as claimed in claim 1 is characterized in that, the described ring that blocks adopts the seamless gluing of single face to be attached on the lateral wall of described body.
3. grinding head as claimed in claim 1 or 2 is characterized in that, describedly blocks the outer radius of ring and the difference of its inside radius is 2～6cm.
4. grinding head as claimed in claim 1 or 2 is characterized in that, when described locating ring was pressed on the described grinding pad, described spacing of blocking between ring and the described grinding pad was 1～5cm.
5. grinding mat trimmer, comprise rotating basis, intermediate connecting rod, grinding pallet and fixed pedestal, one end of described intermediate connecting rod is connected with the end of described rotating basis near described grinding pad by attaching parts, described grinding pallet is arranged on the other end of described intermediate connecting rod, described fixed pedestal is arranged on the periphery of described rotating basis, and be connected with described rotating basis by swivel bearing, it is characterized in that, comprise also and block ring that the described ring that blocks is arranged on the lateral wall of described fixed pedestal.
6. grinding mat trimmer as claimed in claim 5 is characterized in that, the described ring that blocks adopts the seamless gluing of single face to be attached on the lateral wall of described fixed pedestal.
7. as claim 5 or 6 described grinding mat trimmers, it is characterized in that, describedly block the outer radius of ring and the difference of its inside radius is 2～6cm.
8. as claim 5 or 6 described grinding mat trimmers, it is characterized in that when described grinding pallet was pressed on the described grinding pad, described spacing of blocking between ring and the described grinding pad was 1～5cm.
9. lapping device, comprise grinding table, adhere to the grinding pad on the described grinding plate, it is characterized in that, also comprise as the described grinding head of arbitrary claim in the claim 1～4, and as the described grinding mat trimmer of arbitrary claim in the claim 5～8, described grinding head is used to adsorb wafer to be ground, and described grinding mat trimmer is used to repair the lapped face of described grinding pad.
10. lapping device as claimed in claim 9 is characterized in that, the ring that blocks that blocks ring and described grinding mat trimmer of described grinding head all adopts stainless steel material or plastics to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200925413U CN202053157U (en) | 2011-03-31 | 2011-03-31 | Grinding head, grinding pad trimmer and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200925413U CN202053157U (en) | 2011-03-31 | 2011-03-31 | Grinding head, grinding pad trimmer and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202053157U true CN202053157U (en) | 2011-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200925413U Expired - Lifetime CN202053157U (en) | 2011-03-31 | 2011-03-31 | Grinding head, grinding pad trimmer and grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202053157U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107671725A (en) * | 2017-10-20 | 2018-02-09 | 德淮半导体有限公司 | Repair disc system, chemical mechanical polishing device and Ginding process |
| CN107932296A (en) * | 2017-12-04 | 2018-04-20 | 中电科技集团重庆声光电有限公司 | Semiconductor wafer back burnishing device |
| CN115464558A (en) * | 2022-07-28 | 2022-12-13 | 上海华力集成电路制造有限公司 | Device for preventing cleaning liquid from splashing back and use method thereof |
-
2011
- 2011-03-31 CN CN2011200925413U patent/CN202053157U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107671725A (en) * | 2017-10-20 | 2018-02-09 | 德淮半导体有限公司 | Repair disc system, chemical mechanical polishing device and Ginding process |
| CN107932296A (en) * | 2017-12-04 | 2018-04-20 | 中电科技集团重庆声光电有限公司 | Semiconductor wafer back burnishing device |
| CN107932296B (en) * | 2017-12-04 | 2019-07-30 | 中电科技集团重庆声光电有限公司 | Semiconductor wafer back burnishing device |
| CN115464558A (en) * | 2022-07-28 | 2022-12-13 | 上海华力集成电路制造有限公司 | Device for preventing cleaning liquid from splashing back and use method thereof |
| CN115464558B (en) * | 2022-07-28 | 2024-01-19 | 上海华力集成电路制造有限公司 | Device for preventing cleaning liquid from splashing back and use method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130426 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130426 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111130 |