CN107030589A - A kind of chemical-mechanical grinding device - Google Patents
A kind of chemical-mechanical grinding device Download PDFInfo
- Publication number
- CN107030589A CN107030589A CN201710151179.4A CN201710151179A CN107030589A CN 107030589 A CN107030589 A CN 107030589A CN 201710151179 A CN201710151179 A CN 201710151179A CN 107030589 A CN107030589 A CN 107030589A
- Authority
- CN
- China
- Prior art keywords
- chemical
- support base
- column
- lapping
- mechanical grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The invention belongs to semiconductor mechanical milling apparatus technical field, especially a kind of chemical-mechanical grinding device, it is relatively simple for the lapping liquid supply pipe position of existing lapping liquid supply pipe pipe, depending merely on the centrifugal force of turntable rotation can not ensure that the lapping liquid on the grinding pad below grinding head can be uniformly distributed, and the skewness of lapping liquid will directly influence the grinding effect of grinding head, cause substrate grind result it is uneven the shortcomings of, now propose following scheme, a kind of chemical-mechanical grinding device, including support base, the support base is in hollow structure, the inner chamber of support base is fixed with first driving means by support, the output shaft of first driving means is connected through the upside side wall of support base with rotating disk by ring flange, the circular in cross-section of rotating disk, vertical section is rectangular.It enables to object to be ground to be ground liquid full penetration to the chemical-mechanical grinding device, and then make it that it is uniformly ground, and improves uniformity and flatness.
Description
Technical field
The present invention relates to semiconductor mechanical milling apparatus technical field, more particularly to a kind of chemical-mechanical grinding device.
Background technology
With developing rapidly for super large-scale integration, integrated circuit fabrication process becomes to become increasingly complex and finely.
In order to improve integrated level, manufacturing cost is reduced, the characteristic size of element constantly diminishes, and the number of elements in chip unit area is not
Disconnected increase, plane routing has been difficult to the requirement for meeting the distribution of element high density, can only utilize chip using polylaminate wiring technique
Vertical space, further improves the integration density of device.But the application of polylaminate wiring technique can cause substrate surface uneven,
It is extremely disadvantageous to graphic making, therefore, often needing to carry out surface planarisation processing to substrate.
At present, chemical mechanical milling method is the best approach for reaching global planarizartion, is especially entered in semiconductor fabrication process
Enter after submicrometer field, it turns into an indispensable Manufacturing Techniques.
Chemically mechanical polishing is that occur to chemically react with finished surface using the chemical solution for being mixed with minimum abrasive particle to change
The valence bond on its surface, the product that generation is easily mechanically removed, then surpassed through mechanical friction removal chemical reactant
Smooth undamaged planarization surface.
It is single but the lapping liquid supply pipe position of lapping liquid supply pipe pipe is relatively simple on the chemical-mechanical grinding device of prior art
The centrifugal force rotated by turntable can not ensure that the lapping liquid on the grinding pad below grinding head can be uniformly distributed, and lapping liquid
Skewness will directly influence the grinding effect of grinding head, cause substrate to grind the uneven of result, and market now
Present on many table structures of equipment it is complex, it is bulky, it is extremely inconvenient when being moved to it.
Notification number is a kind of Chemical mechanical equipment milling apparatus of CN201960447U propositions thereon by setting up sensor
And set up multichannel lapping liquid playpipe and solve the above problems, it causes the structure of equipment becomes unavoidably increasingly complex, is allowed to make
Valency is uprised.
Therefore, we are badly in need of designing a kind of chemical-mechanical grinding device solving the above problems.
The content of the invention
The invention aims to solve present in prior art lapping liquid supply pipe pipe on chemical-mechanical grinding device
Lapping liquid supply pipe position it is relatively simple, depend merely on turntable rotation centrifugal force can not ensure on the grinding pad below grinding head
Lapping liquid can be uniformly distributed, and the skewness of lapping liquid will directly influence the grinding effect of grinding head, cause substrate
Grind result it is uneven the shortcomings of, and propose a kind of chemical-mechanical grinding device.
To achieve these goals, present invention employs following technical scheme：
A kind of chemical-mechanical grinding device, including support base, the support base be in hollow structure, support base it is interior
Chamber is fixed with first driving means by support, and the output shaft of first driving means passes through the upside side wall and rotating disk of support base
Connected by ring flange, the circular in cross-section of rotating disk, vertical section is rectangular, and be welded with the first rotary shaft on the upside of rotating disk,
The one end of first rotary shaft away from rotating disk is connected by ring flange with lapping device, and cylinder, cylinder are welded with the upside of rotating disk
Upper to be provided with fluid hole on a side wall of rotating disk, the first rotary shaft and lapping device are respectively positioned on the interior intracavitary of cylinder.
It is fixed with the upside of the first column, the other end and is fixed with by screw by screw on the upside of one end of the support base
It is welded with second column, the side wall of the first column in retainer ring, retainer ring and is fixed with lapping liquid storage tank, lapping liquid storage tank
Outlet end be provided with snakelike liquid discharging tube, snakelike liquid discharging tube and be provided with liquid flow regulating valve, and snakelike liquid discharging tube goes out liquid
End is extended in the surface of the liquid feeding end of cylinder, and the top of the second column is welded with crossbeam, the one end of crossbeam away from the second column
Second drive device is fixed with by screw, the output shaft of the second drive device is connected by one end of ring flange and the second rotary shaft
Connect, the other end of the second rotary shaft is connected by ring flange with grinding head, grinding head is located at the surface of lapping device, and waits to grind
Object is ground to be located between grinding head and lapping device.
The lapping device includes current-limiting apparatus, chassis, taphole and grinding pad, and wherein grinding pad is attached at the upper of chassis
Side, current-limiting apparatus is welded on vertical section on the chassis outer ring side wall of isosceles trapezoid, and wherein the cross section of current-limiting apparatus is in annulus
Shape, taphole is opened on current-limiting apparatus.
It is preferred that, the cross section of the support base and vertical section are rectangular, and the bottom corner of support base leads to
Cross screw and be fixed with the groove for being stamped with supplying lapping liquid trickling in shifting roller, and the upside lateral wall of support base.
It is preferred that, the first driving means and the second drive device use motor, and first driving means and second
Be provided with decelerator in drive device, and first driving means and the second drive device signal input part with PLC controls
Device is connected, and the steering of two drive devices is identical.
It is preferred that, second column and the first column are parallel to each other, and the second column and crossbeam are orthogonal, and second
Lowering or hoisting gear is provided with column, lowering or hoisting gear uses hydraulic cylinder, and signal input part and the PLC of lowering or hoisting gear connect
Connect.
It is preferred that, the diameter of the cylinder is equal to the circumscribed diameter of a circle of current-limiting apparatus, and close to one end of rotating disk on cylinder
5-10 fluid hole is provided with the wall of side, axial direction of the fluid hole along cylinder is uniformly arranged.
It is preferred that, first rotary shaft, the second rotary shaft, the axis of grinding head and lapping device are located at same straight line
On.
It is preferred that, the vertical section of the current-limiting apparatus is in isosceles trapezoid, and its height is equal to the two of the height of object to be ground
/ mono-.
It is preferred that, the upper side wall on the chassis and the bottom of current-limiting apparatus are in same level.
It is preferred that, the circular in cross-section of the grinding head, vertical section is rectangular, and the diameter of grinding head is less than chassis
Diameter.
It is preferred that, 2-3 retainer ring is welded with the side wall of first column, and the madial wall of retainer ring is provided with rubber
Glue ring.
Beneficial effect of the present invention：
1. the chemical-mechanical grinding device is provided with by portions such as cylinder, current-limiting apparatus, chassis, taphole and grinding pads thereon
The lapping device that part is constituted, it enables to object to be ground to be ground liquid full penetration, and then make it that it is uniformly ground, and carries
High uniformity and flatness.
2. it is in tower structure to the chemical-mechanical grinding device, conveniently moving, and its is simple in construction, it is to avoid sensing
The addition of the electronic components such as device so that whole equipment low cost, use it is also more convenient, safeguard get up it is more simple.
Brief description of the drawings
Fig. 1 is a kind of structural representation of chemical-mechanical grinding device proposed by the present invention；
Fig. 2 is a kind of internal structure schematic diagram of the support base of chemical-mechanical grinding device proposed by the present invention；
Fig. 3 is a kind of structural representation of the lapping device of chemical-mechanical grinding device proposed by the present invention；
Fig. 4 is a kind of top view of the lapping device of chemical-mechanical grinding device proposed by the present invention；
Fig. 5 is a kind of top view of the cylinder of chemical-mechanical grinding device proposed by the present invention.
In figure：1 crossbeam, 2 second columns, 3 lowering or hoisting gears, 4 support bases, 5 rotating disks, 6 first columns, the storage of 7 lapping liquids
Tank, 8 retainer rings, 9 snakelike liquid discharging tubes, 10 liquid flow regulating valves, 11 second drive devices, 12 second rotary shafts, 13 grinding heads,
14 lapping devices, 15 first rotary shafts, 16 cylinders, 17 objects to be ground, 18 first driving means, 19 fluid holes, 141 current limlitings dress
Put, 142 chassis, 143 tapholes, 144 grinding pads.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.
Reference picture 1, Fig. 2 and Fig. 5, a kind of chemical-mechanical grinding device, including support base 4, support base 4 are in hollow knot
Structure, the inner chamber of support base 4 is fixed with first driving means 18 by support, and the output shaft of first driving means 18 passes through support
The upside side wall of base 4 is connected with rotating disk 5 by ring flange, and the circular in cross-section of rotating disk 5, vertical section is rectangular, and rotating disk 5
Upside be welded with the first rotary shaft 15, first one end of rotary shaft 15 away from rotating disk 5 is connected by ring flange with lapping device 14
Connect, and rotating disk 5 upside be welded with cylinder 16, cylinder 16 close to rotating disk 5 a side wall on be provided with fluid hole 19, first turn
Moving axis 15 and lapping device 14 are respectively positioned on the interior intracavitary of cylinder 16.
It is fixed with the upside of one end of support base 4 by screw on the upside of the first column 6, the other end and is fixed with the by screw
It is welded with two columns 2, the side wall of the first column 6 in retainer ring 8, retainer ring 8 and is fixed with lapping liquid storage tank 7, lapping liquid is deposited
The outlet end of storage tank 7 is provided with snakelike liquid discharging tube 9, snakelike liquid discharging tube 9 and is provided with liquid flow regulating valve 10, and snakelike tapping
The outlet end of pipe 9 is extended in the surface of the liquid feeding end of cylinder 16, and the top of the second column 2 is welded with crossbeam 1, and crossbeam 1 is remote
One end of second column 2 is fixed with the second drive device 11 by screw, and the output shaft of the second drive device 11 passes through ring flange
It is connected with one end of the second rotary shaft 12, the other end of the second rotary shaft 12 is connected by ring flange with grinding head 13, grinding head
13 are located at the surface of lapping device 14, and object to be ground 17 is located between grinding head 13 and lapping device 14.
The cross section of support base 4 and vertical section are rectangular, and the bottom corner of support base 4 is fixed by screw
There are the groove for being stamped with supplying lapping liquid trickling in shifting roller, and the upside lateral wall of support base 4, first driving means 18
Used on motor, and the drive device 11 of first driving means 18 and second with the second drive device 11 and be provided with decelerator,
And the signal input part of the drive device 11 of first driving means 18 and second is connected with PLC, and two drive devices
Turn to identical.
Second column 2 and the first column 6 are parallel to each other, and the second column 2 and crossbeam 1 are orthogonal, and on the second column 2
Lowering or hoisting gear 3 is provided with, lowering or hoisting gear 3 uses hydraulic cylinder, and the signal input part of lowering or hoisting gear 3 is connected with PLC, circle
The diameter of cylinder 16 is equal to the circumscribed diameter of a circle of current-limiting apparatus 141, and is provided with 5-10 on a side wall of rotating disk 5 on cylinder 16
Individual fluid hole 19, axial direction of the fluid hole 19 along cylinder 16 is uniformly arranged, the first rotary shaft 15, the second rotary shaft 12, grinding
First 13 and the axis of lapping device 14 be located along the same line, the vertical section of current-limiting apparatus 141 is in isosceles trapezoid, its height etc.
In 1/2nd of the height of object 17 to be ground, the upper side wall on chassis 142 is in same level with the bottom of current-limiting apparatus 141
On face, the circular in cross-section of grinding head 13, vertical section is rectangular, and diameter of the diameter less than chassis 142 of grinding head 13, the
2-3 retainer ring 8 is welded with the side wall of one column 6, and the madial wall of retainer ring 8 is provided with rubber ring.
Reference picture 3-4, lapping device 14 includes current-limiting apparatus 141, chassis 142, taphole 143 and grinding pad 144, wherein
Grinding pad 144 is attached at the upside on chassis 142, and current-limiting apparatus 141 is welded on outer ring of the vertical section in the chassis 142 of isosceles trapezoid
On the wall of side, the wherein cross section of current-limiting apparatus 141 is in annular shape, and taphole 143 is opened on current-limiting apparatus 141.
Operation principle：Reference picture 1-5, in use, by controlling lowering or hoisting gear 3 so that grinding head 13 and lapping device 14
The distance between become big, then object 17 to be ground is placed on lapping device 14 again, lowering or hoisting gear 3 is then controlled again, is made
Obtain grinding head 13 to be pressed on object 17 to be ground, restart the drive device 11 of first driving means 18 and second, then pass through and adjust
Whole liquid flow regulating valve 10 so that lapping liquid flows out out of lapping liquid storage tank 7, and flows to cylinder along snakelike liquid discharging tube 9
In 16, flow to the lapping liquid in cylinder 16 and flood object 17 to be ground in the presence of current-limiting apparatus 141, current-limiting apparatus 141
On be provided with taphole 143, and then cause additional lapping liquid to flow to the bottom of cylinder 16, then go out liquid in bottom of cylinder from opening
Flow out in hole 19.
During grinding, first the to be ground of object 17 to be ground is attached on grinding head 13 downwards, by grinding head 13
Pressure under upper application, makes substrate be pressed onto on the grinding pad 144 of lapping device 14；Then, the rotation of rotating disk 5 causes lapping device
14 are rotated, and grinding head 13 is also rotate in same direction, and realizes mechanical lapping；Meanwhile, lapping liquid is stored on lapping device 14, is utilized
The centrifugal force of turntable rotation is distributed on grinding pad 144, one layer of liquid is formed between object 17 to be ground and grinding pad 14 thin
Film, the surface of the film and object 17 to be ground chemically reacts, and generates the product easily removed, and this process combines machinery and made
The material of substrate surface is removed with chemical reaction.
More than, it is only the present invention preferably embodiment, but protection scope of the present invention is not limited thereto, and it is any
Those familiar with the art the invention discloses technical scope in, technique according to the invention scheme and its invention
Design is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (10)
1. a kind of chemical-mechanical grinding device, including support base (4), it is characterised in that：The support base (4) is in hollow knot
Structure, the inner chamber of support base (4) is fixed with first driving means (18) by support, and the output shaft of first driving means (18) is worn
The upside side wall for crossing support base (4) is connected with rotating disk (5) by ring flange, the circular in cross-section of rotating disk (5), and vertical section is in
The first rotary shaft (15) is welded with the upside of rectangle, and rotating disk (5), the one end of the first rotary shaft (15) away from rotating disk (5) passes through
Ring flange is connected with lapping device (14), and is welded with the upside of rotating disk (5) on cylinder (16), cylinder (16) close to rotating disk (5)
A side wall on be provided with fluid hole (19), the first rotary shaft (15) and lapping device (14) are respectively positioned on the inner chamber of cylinder (16)
It is interior；
It is fixed with the upside of the first column (6), the other end and is fixed by screw by screw on the upside of one end of the support base (4)
Have and retainer ring (8) is welded with the second column (2), the side wall of the first column (6), lapping liquid storage is fixed with retainer ring (8)
Tank (7), the outlet end of lapping liquid storage tank (7), which is provided with snakelike liquid discharging tube (9), snakelike liquid discharging tube (9), is provided with liquid flow
Adjustable valve (10), and the outlet end of snakelike liquid discharging tube (9) extended in the surface of the liquid feeding end of cylinder (16), the second column
(2) top is welded with crossbeam (1), and the one end of crossbeam (1) away from the second column (2) is fixed with the second drive device by screw
(11), the output shaft of the second drive device (11) is connected by ring flange with one end of the second rotary shaft (12), the second rotary shaft
(12) the other end is connected by ring flange with grinding head (13), and grinding head (13) is located at the surface of lapping device (14), and
Object (17) to be ground is located between grinding head (13) and lapping device (14)；
The lapping device (14) includes current-limiting apparatus (141), chassis (142), taphole (143) and grinding pad (144), wherein
Grinding pad (144) is attached at the upside of chassis (142), and current-limiting apparatus (141) is welded on the chassis that vertical section is in isosceles trapezoid
(142) on outer ring side wall, the wherein cross section of current-limiting apparatus (141) is in annular shape, and taphole (143) is opened in current-limiting apparatus
(141) on.
2. chemical-mechanical grinding device according to claim 1, it is characterised in that the cross section of the support base (4)
It is rectangular with vertical section, and the bottom corner of support base (4) is fixed with shifting roller, and support base by screw
(4) it is stamped with supplying the groove of lapping liquid trickling on upside lateral wall.
3. chemical-mechanical grinding device according to claim 1, it is characterised in that the first driving means (18) and
Two drive devices (11) use on motor, and first driving means (18) and the second drive device (11) and are provided with deceleration
Device, and the signal input part of first driving means (18) and the second drive device (11) is connected with PLC, and two drivings
The steering of device is identical.
4. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that second column (2) and the
One column (6) is parallel to each other, and the second column (2) and crossbeam (1) are orthogonal, and lifting dress is provided with the second column (2)
Put (3), lowering or hoisting gear (3) uses hydraulic cylinder, the signal input part of lowering or hoisting gear (3) is connected with PLC.
5. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that diameter of the cylinder (16) etc.
In current-limiting apparatus (141) circumscribed diameter of a circle, and it is provided with 5-10 on a side wall of rotating disk (5) on cylinder (16) and goes out liquid
Hole (19), axial direction of the fluid hole (19) along cylinder (16) is uniformly arranged.
6. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that first rotary shaft (15),
The axis of second rotary shaft (12), grinding head (13) and lapping device (14) is located along the same line.
7. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that the current-limiting apparatus (141)
Vertical section is in isosceles trapezoid, and its height is equal to 1/2nd of the height of object to be ground (17).
8. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that the upside of the chassis (142)
The bottom of wall and current-limiting apparatus (141) is in same level.
9. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that the grinding head (13) it is transversal
Face is rounded, and vertical section is rectangular, and diameter of the diameter less than chassis (142) of grinding head (13).
10. a kind of chemical-mechanical grinding device according to claim 1, it is characterised in that the side of first column (6)
2-3 retainer ring (8) is welded with wall, and the madial wall of retainer ring (8) is provided with rubber ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710151179.4A CN107030589A (en) | 2017-03-14 | 2017-03-14 | A kind of chemical-mechanical grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710151179.4A CN107030589A (en) | 2017-03-14 | 2017-03-14 | A kind of chemical-mechanical grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107030589A true CN107030589A (en) | 2017-08-11 |
Family
ID=59534076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710151179.4A Pending CN107030589A (en) | 2017-03-14 | 2017-03-14 | A kind of chemical-mechanical grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107030589A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108406574A (en) * | 2018-05-16 | 2018-08-17 | 贵州大学 | A kind of chemical mechanical polishing device |
| CN111185831A (en) * | 2020-01-09 | 2020-05-22 | 杨老又 | Chemical mechanical polishing equipment |
| CN111251174A (en) * | 2018-11-30 | 2020-06-09 | 台湾积体电路制造股份有限公司 | Wafer cleaning and polishing pad, wafer cleaning and polishing chamber, and method of cleaning and polishing wafer |
| CN113814887A (en) * | 2021-10-25 | 2021-12-21 | 广东省大湾区集成电路与系统应用研究院 | Chemical mechanical polishing equipment and method |
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| US4910155A (en) * | 1988-10-28 | 1990-03-20 | International Business Machines Corporation | Wafer flood polishing |
| US5722875A (en) * | 1995-05-30 | 1998-03-03 | Tokyo Electron Limited | Method and apparatus for polishing |
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| CN103100966A (en) * | 2011-11-11 | 2013-05-15 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical lapping device and system |
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| CN204725333U (en) * | 2015-02-11 | 2015-10-28 | 德清晶生光电科技有限公司 | The grinder of the uniform conveying such as a kind of lapping liquid |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4910155A (en) * | 1988-10-28 | 1990-03-20 | International Business Machines Corporation | Wafer flood polishing |
| US5722875A (en) * | 1995-05-30 | 1998-03-03 | Tokyo Electron Limited | Method and apparatus for polishing |
| CN201394760Y (en) * | 2009-05-06 | 2010-02-03 | 湖南城市学院 | Grinding fluid injection device of surface grinding machine |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108406574A (en) * | 2018-05-16 | 2018-08-17 | 贵州大学 | A kind of chemical mechanical polishing device |
| CN111251174A (en) * | 2018-11-30 | 2020-06-09 | 台湾积体电路制造股份有限公司 | Wafer cleaning and polishing pad, wafer cleaning and polishing chamber, and method of cleaning and polishing wafer |
| CN111251174B (en) * | 2018-11-30 | 2021-12-14 | 台湾积体电路制造股份有限公司 | Wafer cleaning and polishing pad, wafer cleaning and polishing chamber, and method of cleaning and polishing wafer |
| CN111185831A (en) * | 2020-01-09 | 2020-05-22 | 杨老又 | Chemical mechanical polishing equipment |
| CN113814887A (en) * | 2021-10-25 | 2021-12-21 | 广东省大湾区集成电路与系统应用研究院 | Chemical mechanical polishing equipment and method |
| CN113814887B (en) * | 2021-10-25 | 2023-01-24 | 广东省大湾区集成电路与系统应用研究院 | Chemical mechanical polishing equipment and method |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170811 |