CN208601323U - More universal grinding and polishing devices of size - Google Patents

More universal grinding and polishing devices of size Download PDF

Info

Publication number
CN208601323U
CN208601323U CN201821078752.XU CN201821078752U CN208601323U CN 208601323 U CN208601323 U CN 208601323U CN 201821078752 U CN201821078752 U CN 201821078752U CN 208601323 U CN208601323 U CN 208601323U
Authority
CN
China
Prior art keywords
charging tray
workpiece
grinding
polishing device
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821078752.XU
Other languages
Chinese (zh)
Inventor
万明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Wan Wan Yushan Intelligent Technology Co Ltd
Original Assignee
Suzhou Wan Wan Yushan Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Wan Wan Yushan Intelligent Technology Co Ltd filed Critical Suzhou Wan Wan Yushan Intelligent Technology Co Ltd
Priority to CN201821078752.XU priority Critical patent/CN208601323U/en
Application granted granted Critical
Publication of CN208601323U publication Critical patent/CN208601323U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The utility model discloses the universal grinding and polishing device of more sizes, including one group of charging tray, and there is each charging tray at least one to be used to limit the space of workpiece, and the outer diameter of each charging tray is not less than 320mm, and the space on one group of charging tray has different sizes;Driving mechanism can drive an at least charging tray to rotate around central shaft rotation and around the axis parallel with central shaft;Abrasive disk, can the upper surface of workpiece on charging tray apply pressure.This programme deft design, structure is simple, by the way that multiple charging trays are arranged, and make space of the charging tray with different sizes, to when carrying out the grinding of various sizes of workpiece, the material containing disk with additional space can be selected, so as to effectively adapt to the grinding needs of various sizes of workpiece, improves the flexibility of applicability and application.

Description

More universal grinding and polishing devices of size
Technical field
The utility model relates to grinding device, especially more universal grinding and polishing devices of size.
Background technique
With the fast development of crystal technique, the production and use of large-size crystals become mesh common in industry Mark, this is because producing the wafer of identical size, since limit influences, large-sized chip can have bigger utilization rate, institute Become new trend with the use of large-size crystals.
The silicon wafer that semicon industry uses is from 8 inches to 12 inch or larger size silicon wafer marches;LED industry makes Sapphire substrate sheet also changes from 2 inches, 4 inches to 6 inches and 8 inches and larger size sapphire sheet.
The update of large-size crystals growing technology certainly will drive the update of crystal-cut, grinding, equipment. Meanwhile more stringent requirements are proposed for precision to equipment and efficiency.
By taking the grinding of sapphire substrate sheet as an example, the use of current country's sapphire substrate sheet mistake from 2,4 inches to 6 inches It crosses, and most milling apparatus have no the ability of 6 inches of grinding or larger sized sapphire sheet, and the precision ground is difficult to be equal to External micron-sized level.
In addition, existing milling apparatus, once can only often carry out the single side grinding of a piece of crystal, low efficiency, power consumption Greatly, it and needs to cooperate grinding using lapping liquid, environment friendly is poor.
Utility model content
The purpose of this utility model is exactly that it is logical to provide a kind of more sizes in order to solve the above-mentioned problems in the prior art With type grinding and polishing device.
The purpose of this utility model is achieved through the following technical solutions:
More universal grinding and polishing devices of size, including
There is at least one to be used to limit the space of workpiece for one group of charging tray, each charging tray, and the outer diameter of each charging tray is not Less than 320mm, and the space on one group of charging tray has different sizes;
Driving mechanism can drive an at least charging tray to turn around central shaft rotation and around the axis parallel with central shaft It is dynamic;
Abrasive disk, can the upper surface of workpiece on charging tray apply pressure.
Preferably, in the universal grinding and polishing device of more sizes, the space is hole or slot.
Preferably, in the universal grinding and polishing device of more sizes, the thickness of the charging tray is less than the thickness of workpiece.
Preferably, in the universal grinding and polishing device of more sizes, the driving mechanism includes and the charging tray structure At the sun gear and planet carrier of planetary gear train;Further include
Power device, for driving the sun gear rotation;
Carrier, for placing an at least charging tray.
Preferably, in the universal grinding and polishing device of more sizes, the carrier is abrasive disk.
Preferably, in the universal grinding and polishing device of more sizes, the carrier can rotation, and rotation direction with The rotation of the charging tray is reversely opposite.
Preferably, in the universal grinding and polishing device of more sizes, the abrasive disk is annular, inner circle and outer circle Between region it is suitable with the outer diameter of charging tray.
Preferably, in the universal grinding and polishing device of more sizes, the abrasive disk can rotation, and sense of rotation with The rotation direction of the charging tray is opposite.
Preferably, the revolving speed in the universal grinding and polishing device of more sizes is between 0-400rpm.
The advantages of technical solutions of the utility model, is mainly reflected in:
This programme deft design, structure is simple, by the way that multiple charging trays are arranged, and makes sky of the charging tray with different sizes Between, so that when carrying out the grinding of various sizes of workpiece the material containing disk with additional space can be selected, so as to effective The grinding needs for adapting to various sizes of workpiece, improve the flexibility of applicability and application.
In the present solution, multiple charging trays can be ground simultaneously, therefore can be greatly improved in such a way that batch is ground Grinding efficiency;In addition, multiple small spaces can be set on a charging tray, to be conducive to when carrying out small size workpiece grinding Further increase grinding efficiency.
This programme can grind the two-sided progress of the workpiece on multiple charging trays by upper and lower two abrasive disks simultaneously, Substantially increase grinding efficiency.
The milling apparatus of this programme is not needed using lapping liquid cooperation grinding, it is only necessary to grinding dish cart is cooled down using water Face is not needed using traditional lapping liquid, and environment friendly is good.
Detailed description of the invention
Fig. 1 be the utility model partial perspective view (be not shown in the figure the mobile structure of driving abrasive disk, planet carrier, Power device, sun gear);
Fig. 2 is that the utility model conceals the top view of abrasive disk and (just shows on sun gear and planet carrier in figure Local column).
Specific embodiment
The purpose of this utility model, advantage and feature will carry out figure by the non-limitative illustration of preferred embodiment below Show and explains.These embodiments are only the prominent examples using technical solutions of the utility model, all to take equivalent replacement or wait Effect transformation and formed technical solution, all fall within the requires of the utility model protection within the scope of.
In the description of scheme, it should be noted that term " center ", "upper", "lower", "left", "right", "front", "rear", The orientation or positional relationship of the instructions such as "vertical", "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, It is merely for convenience of description and simplification description, rather than the device or element of indication or suggestion meaning there must be specific side Position is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " first ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.Also, in retouching for scheme It is proximal end by the direction of proximal operator using operator as reference, the direction far from operator is distal end in stating.
The universal grinding and polishing device of more sizes disclosed with reference to the accompanying drawing to the utility model is illustrated, such as attached drawing 1, shown in attached drawing 2 comprising one group of charging tray 1, driving mechanism 2 and abrasive disk 3, wherein
As shown in Fig. 2, one group of charging tray 1 for placing workpiece, and is projected into at least upper surface of workpiece outside charging tray 1, The outer diameter of each charging tray 1 is not less than 320mm, and specifically between 320-340mm, and each charging tray 1 is at least one use In the space 11 of limit workpiece, the quantity in specific space 11 is configured according to the size of the workpiece to be placed, for example, when being used for When 2 inches of workpiece, the space 11 there are three distribution triangular in shape can be set on a charging tray 1, and work as and be used for 12 inches Workpiece when, a space 11 is only set on a charging tray 1, meanwhile, the space 11 is the structure of hole or slot, preferably round The structure in hole, the thickness of the charging tray 1 are less than the thickness of workpiece, so as to so that the upper and lower surface of workpiece all expose outside so as to Carry out two-sided simultaneous grinding polishing.
In addition, as shown in Fig. 2, the space 11 on one group of charging tray 1 has hole in different sizes, such as a charging tray 1 Size and 2 inches of work piece match, the size in hole is the work piece match with 4 inches on another charging tray 1, for another example on a charging tray 1 The size in hole be work piece match etc. with 6 inches, alternatively, can have simultaneously and 2 inches and 4 inches on a charging tray 1 Work piece match hole.
As shown in Fig. 2, the driving mechanism 2 can drive an at least charging tray 1 around central shaft rotation and around with its Central axis it is parallel axis rotation, specifically from the point of view of, the driving mechanism 2 include with the charging tray 1 constitute planetary gear train sun gear 21 and planet carrier 22, the sun gear 21 includes turntable 211, and the top edge position of the turntable 211 is arranged to one group in circle The column 212 of shape distribution, the gap of adjacent columns 212 is equal, and engages with the dentalation 12 of the periphery of the charging tray 1; The planet carrier 22 is similarly the column 221 of rounded distribution, and the gap of adjacent columns 221 is identical, and the circle with the charging tray 1 The dentalation 12 of circumferential surface engages, can be convenient in certain a part appearance using the structure of this sun gear 21 and planet carrier 22 When abrasion, damage, carry out the replacement and maintenance of local column, relative to traditional gear structure once damage just needs entirety more It changes, can preferably reduce cost of parts.
The driving mechanism 2 further includes power device (not shown), can for driving 21 rotation of sun gear To be known various equipment or structure, such as motor, details are not described herein.
As shown in Fig. 2, the driving mechanism 2 further includes carrier 23, for carrying charging tray 1, can place thereon to A few charging tray 1 can preferably place multiple charging trays 1 simultaneously, and the carrier 23 is annular shape, between inner circle and outer circle Region is suitable with the outer diameter of charging tray 1, and the sun gear 21 is located in the inner circle of the carrier 23, and the planet carrier 22 is disposed around The periphery of the carrier 23.
Also, in order to which the bottom to workpiece is ground simultaneously, the preferably described carrier 23 is abrasive disk, also, described Carrier 23 can drive rotation by various feasible driving structures, and rotation direction and the rotation of the charging tray 1 are reversely opposite.
The abrasive disk 3 at least can it is lower mobile vertically and can workpiece on charging tray 1 upper surface application pressure, The abrasive disk 3 is annular, and the region between inner circle and outer ring is described to grind between the sun gear 21 and planet carrier 22 Mill 3 can rotation, and sense of rotation is opposite with the rotation direction of the charging tray 1.
The universal grinding and polishing device of more sizes, revolving speed, can be with while grinding between 0-400rpm Adjust different revolving speeds by PLC, under low velocity, such as 15rpm, lower 200-400rpm at high speed, so as to meet practical life To the requirement of friction speed in production, the flexibility and production efficiency of application are greatly improved.
In actual use, according to the size of the workpiece to be processed, at least one charging tray 1 with corresponding aperture is placed in and is held It on load plate 23 and engages it with sun gear 21 and planet carrier 22, is then placed in workpiece in the hole of charging tray 1, it is then described dynamic Power device starting driving sun gear 21 rotates, to rotate around sun gear 21, the then grinding while making 1 rotation of charging tray Disk 3, which is moved down into, contacts with the upper surface of workpiece 1 and applies pressure, and the lower surface of workpiece is close to carrier 23 at this time, described to hold Load plate 23 and abrasive disk 3 rotate, and realize that grinding is thrown by the relative motion friction between workpiece and abrasive disk 3 and carrier 23 Light.
Still there are many embodiment, all technologies formed using equivalents or equivalent transformation for the utility model Scheme is all fallen within the protection scope of the utility model.

Claims (9)

  1. The universal grinding and polishing device of size more than 1., it is characterised in that: including
    There is at least one to be used to limit the space (11) of workpiece, each charging tray (1) for one group of charging tray (1), each charging tray (1) Outer diameter be not less than 320mm, and the space (11) on one group of charging tray (1) have different sizes;
    Driving mechanism (2) can drive an at least charging tray (1) to turn around central shaft rotation and around the axis parallel with central shaft It is dynamic;
    Abrasive disk (3), can the upper surface of workpiece on charging tray (1) apply pressure.
  2. 2. the universal grinding and polishing device of more sizes according to claim 1, it is characterised in that: the space (11) is hole Or slot.
  3. 3. the universal grinding and polishing device of more sizes according to claim 1, it is characterised in that: the thickness of the charging tray (1) Degree is less than the thickness of workpiece.
  4. 4. the universal grinding and polishing device of more sizes according to claim 1, it is characterised in that: the driving mechanism (2) Sun gear (21) and planet carrier (22) including constituting planetary gear train with the charging tray (1);Further include
    Power device, for driving the sun gear (21) rotation;
    Carrier (23), for placing an at least charging tray (1).
  5. 5. the universal grinding and polishing device of more sizes according to claim 4, it is characterised in that: the carrier (23) is Abrasive disk.
  6. 6. the universal grinding and polishing device of more sizes according to claim 5, it is characterised in that: the carrier (23) can Rotation, and rotation direction and the rotation of the charging tray (1) are reversely opposite.
  7. 7. the universal grinding and polishing device of more sizes according to claim 1, it is characterised in that: the abrasive disk (3) is Annular, the region between inner circle and outer circle are suitable with the outer diameter of charging tray (1).
  8. 8. the universal grinding and polishing device of more sizes according to claim 1, it is characterised in that: the abrasive disk (3) can Rotation, and sense of rotation is opposite with the rotation direction of the charging tray (1).
  9. 9. the universal grinding and polishing device of more sizes according to claim 1, it is characterised in that: its revolving speed is in 0-400rpm Between.
CN201821078752.XU 2018-07-09 2018-07-09 More universal grinding and polishing devices of size Active CN208601323U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821078752.XU CN208601323U (en) 2018-07-09 2018-07-09 More universal grinding and polishing devices of size

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821078752.XU CN208601323U (en) 2018-07-09 2018-07-09 More universal grinding and polishing devices of size

Publications (1)

Publication Number Publication Date
CN208601323U true CN208601323U (en) 2019-03-15

Family

ID=65668000

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821078752.XU Active CN208601323U (en) 2018-07-09 2018-07-09 More universal grinding and polishing devices of size

Country Status (1)

Country Link
CN (1) CN208601323U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110948359A (en) * 2019-12-12 2020-04-03 大连工业大学 Metal working electrode polishing device and polishing method thereof
CN113102557A (en) * 2021-04-16 2021-07-13 刘赐辰 Shaping equipment suitable for processing of aluminum profiles
CN115106928A (en) * 2022-07-15 2022-09-27 长沙米淇仪器设备有限公司 Planetary high-temperature plane grinding machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110948359A (en) * 2019-12-12 2020-04-03 大连工业大学 Metal working electrode polishing device and polishing method thereof
CN110948359B (en) * 2019-12-12 2021-05-14 大连工业大学 Metal working electrode polishing device and polishing method thereof
CN113102557A (en) * 2021-04-16 2021-07-13 刘赐辰 Shaping equipment suitable for processing of aluminum profiles
CN113102557B (en) * 2021-04-16 2024-02-20 重庆中昆新材料科技有限公司 Shaping equipment suitable for aluminium alloy processing
CN115106928A (en) * 2022-07-15 2022-09-27 长沙米淇仪器设备有限公司 Planetary high-temperature plane grinding machine
CN115106928B (en) * 2022-07-15 2023-10-24 长沙米淇仪器设备有限公司 Planetary high-temperature plane grinding machine

Similar Documents

Publication Publication Date Title
CN208601323U (en) More universal grinding and polishing devices of size
CN102049728B (en) Laser gyro lens excircle grinding and polishing method
JP2008042081A (en) Wafer grinding device
WO2019127910A1 (en) Thinning machine
CN203696759U (en) Grinding pad adjuster
CN212553359U (en) Automatic oilstone correcting device for silicon wafer grinding equipment consolidation grinding disc
TWI813466B (en) Grinding device and grinding method
CN102172885B (en) Substrate polishing device and polished substrate thereof
CN110695803A (en) Edging device is used in glass cup processing
CN110871385A (en) Double-side polishing machine and polishing method
CN203317219U (en) Finisher of grinding pad and grinding device
WO2015025469A1 (en) Two-side polishing method for wafer
CN210499749U (en) Chemical mechanical polishing device
CN102862121B (en) Chemical mechanical polishing (CMP) grinding pad finishing structure
CN202428311U (en) Grinding head and grinding device
CN201736114U (en) Planetary piece
CN203125323U (en) Grinding pad finishing machine and grinding device
CN208854392U (en) Twp-sided polishing machine
CN111002216B (en) Grinding equipment
CN206084668U (en) Automatic attenuate machine
CN203426856U (en) Polishing pad arranging device and polishing device
CN208304750U (en) A kind of thin silicon monocrystal polished silicon wafer twin grinding equipment
CN103522167B (en) Grinding head and lapping device
CN202622547U (en) Grinding disc, grinding pad finisher and grinding device
CN101856804A (en) Full-automatic grinding device of semiconductor chip with four main shafts

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant