CN115106928A - Planetary high-temperature plane grinding machine - Google Patents

Planetary high-temperature plane grinding machine Download PDF

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Publication number
CN115106928A
CN115106928A CN202210831149.9A CN202210831149A CN115106928A CN 115106928 A CN115106928 A CN 115106928A CN 202210831149 A CN202210831149 A CN 202210831149A CN 115106928 A CN115106928 A CN 115106928A
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CN
China
Prior art keywords
grinding
planetary
wheel
driving
outer ring
Prior art date
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Granted
Application number
CN202210831149.9A
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Chinese (zh)
Other versions
CN115106928B (en
Inventor
彭伟才
彭钰淇
彭伟国
彭卫锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changsha Mitr Instrument Equipment Co ltd
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Changsha Mitr Instrument Equipment Co ltd
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Publication date
Application filed by Changsha Mitr Instrument Equipment Co ltd filed Critical Changsha Mitr Instrument Equipment Co ltd
Priority to CN202210831149.9A priority Critical patent/CN115106928B/en
Publication of CN115106928A publication Critical patent/CN115106928A/en
Application granted granted Critical
Publication of CN115106928B publication Critical patent/CN115106928B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/02—Bench grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a planetary high-temperature plane grinder, which belongs to the technical field of grinding and comprises: the device comprises a rack, wherein an opening is formed in an operation table of the rack; the driving device is arranged corresponding to the opening, is arranged on the rack and is positioned at the lower end of the operating platform; the planetary mechanism is positioned in the opening and comprises a driving wheel, an outer ring and a planetary wheel, the outer ring is fixedly arranged on the operating platform, and the driving wheel is in driving connection with the driving end of the driving device; the planet wheel is positioned between the driving wheel and the outer ring and is meshed with the driving wheel and the outer ring; the planet wheel is provided with at least one placing hole for placing a workpiece; the grinding disc is fixedly arranged on the rack and is positioned at the lower end of the planetary mechanism; the planet wheel drives the workpiece to move relative to the grinding disc. By adopting the planetary grinding mechanism, the grinding position is continuously changed in the grinding process, the local abrasion of the grinding disc is avoided, the service life and the service efficiency of the grinding disc are improved, and the grinding precision is also improved.

Description

Planetary high-temperature plane grinding machine
Technical Field
The invention belongs to the technical field of grinding, and particularly relates to a planetary high-temperature plane grinding machine.
Background
Lapping is a precision machining process in which an extremely thin layer of material is ground from a workpiece using a lapping tool and an abrasive material on a fine machining basis.
The surface grinder is a grinder for grinding the surface of a workpiece, and is mainly applied to grinding high-precision surfaces of workpieces.
The plane grinding machine in the prior art places the work piece openly on the abrasive disc through anchor clamps, and in the grinding process, the grinding position can not change, leads to the abrasive disc local wear aggravation easily, influences the life and the availability factor of abrasive disc, has also influenced the grinding precision simultaneously. In addition, the number of grinding workpieces is small every time, the clamps need to be frequently installed and taken out, the workpiece taking and placing efficiency is low, and the working efficiency of the plane grinding machine is low.
Disclosure of Invention
In order to solve the problems, the invention adopts the following technical scheme:
a planetary high temperature flat grinder comprising:
the device comprises a rack, wherein an opening is formed in an operation table of the rack;
the driving device is arranged corresponding to the opening, is arranged on the rack and is positioned at the lower end of the operating platform;
the planetary mechanism is positioned in the opening and comprises a driving wheel, an outer ring and a planetary wheel, the outer ring is fixedly arranged on the operating platform, and the driving wheel is in driving connection with the driving end of the driving device; the planet wheel is positioned between the driving wheel and the outer ring and meshed with the driving wheel and the outer ring so as to drive the planet wheel to rotate relative to the outer ring by the driving wheel; the planet wheel is provided with at least one placing hole for placing a workpiece;
the grinding disc is fixedly arranged on the rack and is positioned at the lower end of the planetary mechanism; the planet wheel drives the workpiece to move relative to the grinding disc so as to grind the workpiece placed on the planet wheel.
Furthermore, a heating wire is arranged in the grinding disc and used for high-temperature grinding of the workpiece.
Furthermore, the driving wheel and the outer ring are circumferentially and annularly provided with a plurality of uniformly distributed cylinders, the circumference of the planet wheel is provided with wheel teeth, and the wheel teeth are meshed with the cylinders.
Furthermore, the driving wheel, the outer ring and the planet wheel are all provided with a plurality of gear teeth which are uniformly distributed and engaged and matched in the circumferential direction.
Further, the number of the planet wheels is at least 3.
The planetary gear press further comprises a pressing assembly, wherein the pressing assembly comprises a fixing shaft, a pressure plate, a spring and a force adjusting nut, and the fixing shaft is vertically and fixedly arranged on the planetary gear; the pressure plate is sleeved on the outer side of the fixed shaft and is connected with the fixed shaft in a sliding manner; the upper end of the fixed shaft is provided with an external thread, and the force adjusting nut is matched with the external thread of the fixed shaft; the spring is sleeved on the outer side of the fixed shaft and is positioned between the force adjusting nut and the pressure plate.
Further, the driving device comprises a driving motor and a gearbox which are sequentially installed on the rack from bottom to top, wherein the output end of the driving motor is fixedly connected with the input end of the gearbox, and the output end of the gearbox is fixedly connected with the driving wheel.
Further, the device also comprises a control box installed on the rack, and the control box is electrically connected with the driving motor.
Further, the grinding device also comprises a collecting box which is positioned at the lower end of the grinding disc and is used for collecting grinding dust or grinding cooling liquid generated in the grinding process.
Furthermore, the bottom of the collection box is provided with a dust removal port connected with a dust suction device or a liquid discharge port connected with a liquid discharge pipe.
Has the advantages that:
according to the planetary high-temperature plane grinder provided by the invention, the planetary grinding mechanism is adopted, the grinding position is continuously changed in the grinding process, the local abrasion of the grinding disc is avoided, the service life and the use efficiency of the grinding disc are improved, and the grinding precision is also improved.
In addition, the number of the workpieces placed into the planet wheel at each time is greatly increased, frequent loading and unloading of the clamps are not needed, the workpiece taking and placing efficiency is high, and the working efficiency of the plane grinding machine is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is another perspective of the overall structure of the present invention;
FIG. 3 is a front view of the overall structure of the present invention;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
FIG. 5 is a top view of the overall structure of the present invention;
wherein, 1, a frame; 2. an outer ring; 3. a grinding disk; 4. placing holes; 5. a spring; 6. a fixed shaft; 7. force adjusting nuts; 8. a platen; 9. a planet wheel; 10. a collection box; 11. a control box; 12. a liquid discharge pipe; 13. a gearbox; 14. a drive motor; 15. and a driving wheel.
Detailed Description
Example 1
Referring to fig. 1 to 5, a planetary high temperature plane grinder includes:
the device comprises a rack 1, wherein an opening is formed in an operation table of the rack 1;
the driving device is arranged corresponding to the opening, is arranged on the rack 1 and is positioned at the lower end of the operating platform;
the planetary mechanism is positioned in the opening and comprises a driving wheel 15, an outer ring 2 and a planetary wheel 9, the outer ring 2 is fixedly arranged on the operating platform, and the driving wheel 15 is in driving connection with the driving end of the driving device; planet wheel 9 is positioned between driving wheel 15 and outer ring 2, and is meshed with driving wheel 15 and outer ring 2, so that driving wheel 15 drives planet wheel 9 to rotate relative to outer ring 2; the planet wheel 9 is provided with 3 placing holes 4 for placing workpieces;
the grinding disc 3 is fixedly arranged on the rack 1 and is positioned at the lower end of the planetary mechanism; planet wheel 9 drives the relative motion of taking place for abrasive disc 3 of work piece to the realization is ground placing the work piece on planet wheel 9.
Example 2
In order to solve the problem that the workpiece to be ground needs high-temperature plane grinding, the present embodiment is further configured on the basis of embodiment 1.
In the present embodiment, a heating wire is provided in the grinding disk 3 for high-temperature grinding of the workpiece.
Wherein, the heating wire adopts resistance wire. The worktable of the frame is also provided with a thermocouple and a temperature controller electrically connected with the thermocouple, and the temperature controller is used for adjusting the heating temperature of the resistance wire in real time according to the collected temperature of the thermocouple.
Example 3
In order to better solve the problem of plane grinding, the present embodiment is further configured based on embodiment 1.
In this embodiment, the driving wheel 15 and the outer ring 2 are both circumferentially provided with a plurality of uniformly distributed cylinders in a surrounding manner, and the planet wheel 9 is circumferentially provided with gear teeth engaged with the cylinders.
Wherein, planet wheel 9's quantity is 3, and the number of teeth of a cogwheel carries out the global design according to the cylinder quantity that drive wheel 15 circumference set up and the cylinder quantity that outer loop 2 circumference set up on planet wheel 9.
In this embodiment, preferably 3 evenly distributed placing holes are provided on each planet wheel 9, wherein the shape and size of the placing holes can be set according to the size and shape of the workpiece.
In this embodiment, the grinding disc 3 is located below the planet wheel 9, and the two are arranged oppositely and are not in contact with each other.
Wherein the outer ring 2 and the side of the drive wheel 15 close to the planet wheels 9 are provided with a support edge to prevent the planet wheels 9 from falling.
Example 4
In order to better solve the problem of plane grinding, the present embodiment is further configured based on embodiment 1.
In the present embodiment, the driving wheel 15, the outer ring 2 and the planet wheel 9 are all provided with a plurality of uniformly distributed gear teeth which are meshed and matched in the circumferential direction.
The drive wheel 15, the outer ring 2 (gear ring) and the planet wheel 9 have the same tooth form angle and module, and the tooth number of the drive wheel 15, the outer ring 2 and the planet wheel 9 is designed according to the actual situation.
In the present embodiment, the number of the planetary wheels 9 is 3.
In this embodiment, the grinding disc 3 is located below the planet wheel 9, and the two are arranged oppositely and are not in contact with each other.
Wherein, outer loop 2 and drive wheel 15 are all provided with the support edge near the one side of planet wheel 9, and the teeth of a cogwheel setting is on supporting the protruding of edge upper end to prevent that planet wheel 9 from dropping.
Example 5
In order to further improve the grinding efficiency, the present embodiment is further configured based on embodiment 3 or 4.
The planetary high-temperature plane grinder provided by the embodiment further comprises a pressing assembly, wherein the pressing assembly comprises a fixing shaft 6, a pressure plate 8, a spring 5 and a force adjusting nut 7, and the fixing shaft 6 is vertically and fixedly arranged on a planetary wheel 9; the pressure plate 8 is sleeved on the outer side of the fixed shaft 6 and is connected with the fixed shaft 6 in a sliding manner; the upper end of the fixed shaft 6 is provided with an external thread, and the force adjusting nut 7 is matched with the external thread of the fixed shaft 6; the spring 5 is sleeved on the outer side of the fixed shaft 6 and is positioned between the force adjusting nut 7 and the pressure plate 8.
Wherein, the outer contour of the pressure plate 8 is larger than the contour of the workpiece in the planet wheel 9 placing hole.
In this embodiment, the driving device includes a driving motor 14 and a gearbox 13 sequentially installed on the frame 1 from bottom to top, wherein an output end of the driving motor 14 is fixedly connected with an input end of the gearbox 13, and an output end of the gearbox 13 is fixedly connected with the driving wheel 15.
The planetary high-temperature plane grinder provided by the embodiment further comprises a control box 11 mounted on the frame 1, and the control box 11 is electrically connected with a driving motor 14.
Wherein, the gearbox 13 can select a reduction gear box and a speed-up gear box according to the use condition and the condition of a workpiece.
Example 6
In order to further improve the environmental performance of the surface grinder, this embodiment is further configured based on embodiment 5.
The planetary high-temperature plane grinder provided by the present embodiment further comprises a collecting box 10, and the collecting box 10 is located at the lower end of the grinding pan 3.
When abrasive grinding using a grinding disc, a collection box 10 for collecting grinding dust generated during grinding is provided at the bottom of the collection box 10 with a dust removal port to which a dust suction device, preferably a dust collector, is connected.
When the grinding fluid grinding device is used for grinding the grinding fluid, a collecting box 10 is used for collecting the grinding fluid and cooling fluid generated in the grinding process, and a liquid discharge port connected with a liquid discharge pipe 12 is arranged at the bottom of the collecting box 10.
The using method of the invention comprises the following steps:
s10, rotating the force adjusting nut upwards to reserve a space for placing a workpiece;
s20, placing the workpiece in the placing hole of the planet wheel, releasing the pressure plate, placing the pressure plate at the upper end of the workpiece, rotating the force-adjusting nut downwards, and adjusting the pressure of the pressure plate according to a preset condition; if the self weight of the workpiece can meet the use requirement, a pressure applying component is not needed;
and S30, starting the driving motor through the control box.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention will still fall within the technical scope of the present invention.

Claims (10)

1. A planetary high temperature flat grinder, characterized in that it comprises:
the device comprises a rack, wherein an opening is formed in an operation table of the rack;
the driving device is arranged corresponding to the opening, is arranged on the rack and is positioned at the lower end of the operating platform;
the planetary mechanism is positioned in the opening and comprises a driving wheel, an outer ring and a planetary wheel, the outer ring is fixedly arranged on the operating platform, and the driving wheel is in driving connection with the driving end of the driving device; the planet wheel is positioned between the driving wheel and the outer ring and meshed with the driving wheel and the outer ring so as to drive the planet wheel to rotate relative to the outer ring by the driving wheel; the planet wheel is provided with at least one placing hole for placing a workpiece;
the grinding disc is fixedly arranged on the rack and is positioned at the lower end of the planetary mechanism; the planet wheel drives the workpiece to move relative to the grinding disc so as to grind the workpiece placed on the planet wheel.
2. Planetary high-temperature flat grinder according to claim 1, characterized in that heating wires are provided inside the grinding disc for high-temperature grinding of the work pieces.
3. The planetary high-temperature surface grinder according to claim 1, wherein the driving wheel and the outer ring are circumferentially provided with a plurality of uniformly distributed cylinders, and the planetary wheel is circumferentially provided with gear teeth, and the gear teeth are engaged with the cylinders.
4. Planetary high-temperature flat grinder according to claim 1, characterised in that the driving wheel, the outer ring and the planet wheels are all provided with a number of evenly distributed, meshing gear teeth in the circumferential direction.
5. Planetary high-temperature plane grinder according to any of claims 3 or 4, characterised in that the number of planet wheels is at least 3.
6. The planetary high temperature flat grinder according to claim 1, further comprising a pressing assembly including a fixed shaft vertically fixed on the planetary wheel, a pressure plate, a spring and a force adjusting nut; the pressure plate is sleeved on the outer side of the fixed shaft and is connected with the fixed shaft in a sliding manner; the upper end of the fixed shaft is provided with an external thread, and the force adjusting nut is matched with the external thread of the fixed shaft; the spring is sleeved on the outer side of the fixed shaft and is positioned between the force adjusting nut and the pressure plate.
7. The planetary high-temperature plane grinder according to claim 1, wherein the driving device comprises a driving motor and a gearbox mounted on the frame in sequence from bottom to top, wherein an output end of the driving motor is fixedly connected with an input end of the gearbox, and an output end of the gearbox is fixedly connected with the driving wheels.
8. The planetary high temperature plane grinder of claim 7, further comprising a control box mounted on the frame, the control box being electrically connected to the driving motor.
9. The planetary high-temperature plane grinder of claim 1, further comprising a collection tank at a lower end of the grinding disk for collecting grinding dust or grinding coolant generated during grinding.
10. Planetary high-temperature flat grinder according to claim 9, characterised in that the bottom of the collecting box is provided with a dust removal opening connected to a dust suction device or a liquid discharge opening connected to a liquid discharge pipe.
CN202210831149.9A 2022-07-15 2022-07-15 Planetary high-temperature plane grinding machine Active CN115106928B (en)

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Application Number Priority Date Filing Date Title
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CN115106928B CN115106928B (en) 2023-10-24

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Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1534389A (en) * 1977-08-24 1978-12-06 Mo Yysshee Tekh Uchilis Im Ne Method and planetary-type lapping machine for lapping a group of workpieces
JPH11138419A (en) * 1997-10-31 1999-05-25 Kashiwara Machine Mfg Co Ltd Wafer polishing device and wafer pressuring method
JP2004167675A (en) * 2002-10-28 2004-06-17 Nippon Telegr & Teleph Corp <Ntt> Working device of optical connector end surface and optical connector end surface working method
CN201711851U (en) * 2010-07-12 2011-01-19 北京有色金属研究总院 Silicon chip polishing device
CN203245720U (en) * 2013-05-09 2013-10-23 陈纪军 Portable fiber end face grinding machine
CN104209862A (en) * 2014-08-26 2014-12-17 广东工业大学 Ultra-smooth plane grinding polishing device and method for online trimming flexible polishing pad
CN106956211A (en) * 2017-03-09 2017-07-18 东莞市中镓半导体科技有限公司 A kind of single-sided polishing device
CN207206154U (en) * 2017-08-25 2018-04-10 天津三安光电有限公司 A kind of new grinding disk
CN207267193U (en) * 2017-11-07 2018-04-24 江南大学 A kind of planetary finishing machine for valve clack
CN208601323U (en) * 2018-07-09 2019-03-15 苏州赛万玉山智能科技有限公司 More universal grinding and polishing devices of size
CN110202433A (en) * 2019-05-31 2019-09-06 泊头市金键模具有限责任公司 A kind of die insert grinding device
CN209936648U (en) * 2019-04-30 2020-01-14 新乡市斯凯夫机械有限公司 Special fixture for grinding special-shaped parts
CN111266991A (en) * 2020-03-30 2020-06-12 昂士特科技(深圳)有限公司 Electric heating temperature control type chemical mechanical polishing platform
CN212471068U (en) * 2020-07-10 2021-02-05 大庆市三星机械制造有限公司 Plane grinder
CN212601161U (en) * 2020-07-06 2021-02-26 郑州智匠精密工具有限公司 Carbide tool bit rake face grinds processing frock
CN213673238U (en) * 2020-10-24 2021-07-13 新乡市斯凯夫机械有限公司 Precise numerical control double-end-face grinding machine
CN213673438U (en) * 2020-10-22 2021-07-13 新乡市斯凯夫机械有限公司 Double-end-face grinding machine lower grinding disc control mechanism
CN216178973U (en) * 2021-10-27 2022-04-05 辽宁科技大学 Planetary gear train magnetic grinding machine
CN114454089A (en) * 2022-01-13 2022-05-10 浙江森永光电设备有限公司 Single-side grinding and polishing device
CN216542677U (en) * 2021-12-31 2022-05-17 武汉锐晶激光芯片技术有限公司 Wafer grinding clamp and device

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1534389A (en) * 1977-08-24 1978-12-06 Mo Yysshee Tekh Uchilis Im Ne Method and planetary-type lapping machine for lapping a group of workpieces
JPH11138419A (en) * 1997-10-31 1999-05-25 Kashiwara Machine Mfg Co Ltd Wafer polishing device and wafer pressuring method
JP2004167675A (en) * 2002-10-28 2004-06-17 Nippon Telegr & Teleph Corp <Ntt> Working device of optical connector end surface and optical connector end surface working method
CN201711851U (en) * 2010-07-12 2011-01-19 北京有色金属研究总院 Silicon chip polishing device
CN203245720U (en) * 2013-05-09 2013-10-23 陈纪军 Portable fiber end face grinding machine
CN104209862A (en) * 2014-08-26 2014-12-17 广东工业大学 Ultra-smooth plane grinding polishing device and method for online trimming flexible polishing pad
CN106956211A (en) * 2017-03-09 2017-07-18 东莞市中镓半导体科技有限公司 A kind of single-sided polishing device
CN207206154U (en) * 2017-08-25 2018-04-10 天津三安光电有限公司 A kind of new grinding disk
CN207267193U (en) * 2017-11-07 2018-04-24 江南大学 A kind of planetary finishing machine for valve clack
CN208601323U (en) * 2018-07-09 2019-03-15 苏州赛万玉山智能科技有限公司 More universal grinding and polishing devices of size
CN209936648U (en) * 2019-04-30 2020-01-14 新乡市斯凯夫机械有限公司 Special fixture for grinding special-shaped parts
CN110202433A (en) * 2019-05-31 2019-09-06 泊头市金键模具有限责任公司 A kind of die insert grinding device
CN111266991A (en) * 2020-03-30 2020-06-12 昂士特科技(深圳)有限公司 Electric heating temperature control type chemical mechanical polishing platform
CN212601161U (en) * 2020-07-06 2021-02-26 郑州智匠精密工具有限公司 Carbide tool bit rake face grinds processing frock
CN212471068U (en) * 2020-07-10 2021-02-05 大庆市三星机械制造有限公司 Plane grinder
CN213673438U (en) * 2020-10-22 2021-07-13 新乡市斯凯夫机械有限公司 Double-end-face grinding machine lower grinding disc control mechanism
CN213673238U (en) * 2020-10-24 2021-07-13 新乡市斯凯夫机械有限公司 Precise numerical control double-end-face grinding machine
CN216178973U (en) * 2021-10-27 2022-04-05 辽宁科技大学 Planetary gear train magnetic grinding machine
CN216542677U (en) * 2021-12-31 2022-05-17 武汉锐晶激光芯片技术有限公司 Wafer grinding clamp and device
CN114454089A (en) * 2022-01-13 2022-05-10 浙江森永光电设备有限公司 Single-side grinding and polishing device

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