CN115106928B - Planetary high-temperature plane grinding machine - Google Patents
Planetary high-temperature plane grinding machine Download PDFInfo
- Publication number
- CN115106928B CN115106928B CN202210831149.9A CN202210831149A CN115106928B CN 115106928 B CN115106928 B CN 115106928B CN 202210831149 A CN202210831149 A CN 202210831149A CN 115106928 B CN115106928 B CN 115106928B
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- Prior art keywords
- planetary
- grinding
- driving
- outer ring
- wheel
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Links
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000000428 dust Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims 1
- 238000005299 abrasion Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/02—Bench grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a planetary high-temperature plane grinding machine, which belongs to the technical field of grinding, and comprises: the operating platform of the stand is provided with an opening; the driving device is arranged on the frame and is positioned at the lower end of the operating platform; the planetary mechanism is positioned in the opening and comprises a driving wheel, an outer ring and a planetary wheel, the outer ring is fixedly arranged on the operating platform, and the driving wheel is in driving connection with the driving end of the driving device; the planet wheel is positioned between the driving wheel and the outer ring and meshed with the driving wheel and the outer ring; the planet wheel is provided with at least one placing hole for placing a workpiece; the grinding disc is fixedly arranged on the frame and positioned at the lower end of the planetary mechanism; the planetary gear drives the workpiece to move relatively to the grinding disc. According to the invention, the planetary grinding mechanism is adopted, so that the grinding position is continuously changed in the grinding process, the local abrasion of the grinding disc is avoided, the service life and the service efficiency of the grinding disc are improved, and the grinding precision is also improved.
Description
Technical Field
The invention belongs to the technical field of grinding, and particularly relates to a planetary high-temperature plane grinding machine.
Background
Grinding is a precision machining method in which an extremely thin layer of material is ground from a workpiece with a grinding tool and an abrasive on the basis of finish machining.
The surface grinder is a grinder for grinding the surface of a workpiece, and is mainly applied to grinding the high-precision surface of the workpiece.
The plane grinds machine among the prior art openly places the work piece on the grinding disc through anchor clamps, and the grinding position can not change in the grinding process, leads to the local wearing and tearing of grinding disc to aggravate easily, influences the life and the availability factor of grinding disc, has also influenced the grinding precision simultaneously. In addition, the number of the ground workpieces is small each time, the clamps are required to be frequently put in and taken out, the workpiece taking and placing efficiency is low, and the working efficiency of the plane grinding machine is low.
Disclosure of Invention
In order to solve the problems, the invention adopts the following technical scheme:
a planetary high temperature face grinder comprising:
the device comprises a rack, wherein an opening is formed in an operating platform of the rack;
the driving device is arranged corresponding to the opening, is arranged on the rack and is positioned at the lower end of the operating platform;
the planetary mechanism is positioned in the opening and comprises a driving wheel, an outer ring and a planetary wheel, the outer ring is fixedly arranged on the operating platform, and the driving wheel is in driving connection with the driving end of the driving device; the planet wheel is positioned between the driving wheel and the outer ring and meshed with the driving wheel and the outer ring so as to realize that the driving wheel drives the planet wheel to rotate relative to the outer ring; the planet wheel is provided with at least one placing hole for placing a workpiece;
the grinding disc is fixedly arranged on the frame and is positioned at the lower end of the planetary mechanism; the planetary gear drives the workpiece to move relatively to the grinding disc, so that the workpiece placed on the planetary gear is ground.
Further, a heating wire is arranged in the grinding disc and used for high-temperature grinding of the workpiece.
Further, the driving wheel and the outer ring are circumferentially and circumferentially provided with a plurality of evenly distributed cylinders, the circumference of the planet wheel is provided with gear teeth, and the gear teeth are meshed with the cylinders.
Further, the driving wheel, the outer ring and the planet wheel are all provided with a plurality of evenly distributed gear teeth which are engaged and matched in the circumferential direction.
Further, the number of the planetary gears is at least 3.
Further, the planetary gear transmission mechanism further comprises a pressing assembly, wherein the pressing assembly comprises a fixed shaft, a pressure plate, a spring and a force adjusting nut, and the fixed shaft is vertically and fixedly arranged on the planetary gear; the pressure plate is sleeved on the outer side of the fixed shaft and is in sliding connection with the fixed shaft; the upper end of the fixed shaft is provided with external threads, and the force adjusting nut is matched with the external threads of the fixed shaft; the spring is sleeved on the outer side of the fixed shaft and is positioned between the force adjusting nut and the pressure plate.
Further, the driving device comprises a driving motor and a gearbox which are sequentially arranged on the frame from bottom to top, wherein the output end of the driving motor is fixedly connected with the input end of the gearbox, and the output end of the gearbox is fixedly connected with the driving wheel.
Further, the device also comprises a control box arranged on the frame, and the control box is electrically connected with the driving motor.
Further, the grinding disc grinding device further comprises a collecting box, wherein the collecting box is positioned at the lower end of the grinding disc and is used for collecting grinding dust or grinding cooling liquid generated in the grinding process.
Further, a dust removing port connected with a dust collecting device or a liquid draining port connected with a liquid draining pipe is arranged at the bottom of the collecting box.
The beneficial effects are that:
according to the planetary high-temperature plane grinding machine, the planetary grinding mechanism is adopted, so that the grinding position is continuously changed in the grinding process, the local abrasion of the grinding disc is avoided, the service life and the service efficiency of the grinding disc are improved, and meanwhile, the grinding precision is also improved.
In addition, the number of workpieces placed in the planetary gear at each time is greatly improved, a clamp does not need to be frequently placed in or taken out, the workpiece taking and placing efficiency is high, and the working efficiency of the plane grinding machine is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is another view of the overall structure of the present invention;
FIG. 3 is a front view of the overall structure of the present invention;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
FIG. 5 is a top view of the overall structure of the present invention;
wherein, 1, the frame; 2. an outer ring; 3. a grinding disc; 4. placing the hole; 5. a spring; 6. a fixed shaft; 7. a force adjusting nut; 8. a pressure plate; 9. a planet wheel; 10. a collection box; 11. a control box; 12. a liquid discharge pipe; 13. a gearbox; 14. a driving motor; 15. and (3) driving wheels.
Detailed Description
Example 1
Referring to fig. 1-5, a planetary high temperature face grinder comprising:
the device comprises a frame 1, wherein an opening is formed in an operation table of the frame 1;
the driving device is arranged corresponding to the opening, is arranged on the frame 1 and is positioned at the lower end of the operating platform;
the planetary mechanism is positioned in the opening and comprises a driving wheel 15, an outer ring 2 and a planetary wheel 9, the outer ring 2 is fixedly arranged on the operating platform, and the driving wheel 15 is in driving connection with the driving end of the driving device; the planet wheel 9 is positioned between the driving wheel 15 and the outer ring 2 and meshed with the driving wheel 15 and the outer ring 2 so as to realize that the driving wheel 15 drives the planet wheel 9 to rotate relative to the outer ring 2; the planet wheel 9 is provided with 3 placing holes 4 for placing workpieces;
the grinding disc 3 is fixedly arranged on the frame 1 and positioned at the lower end of the planetary mechanism; the planetary gears 9 drive the workpiece to move relatively to the grinding disc 3 so as to grind the workpiece placed on the planetary gears 9.
Example 2
In order to solve the problem that the workpiece to be polished requires high-temperature planar polishing, this embodiment is further configured on the basis of embodiment 1.
In the present embodiment, a heating wire is provided in the grinding pan 3 for high-temperature grinding of the workpiece.
Wherein, the heater strip adopts the resistance wire. The workbench of the rack is also provided with a thermocouple and a temperature controller electrically connected with the thermocouple, and the temperature controller is used for adjusting the heating temperature of the resistance wire in real time according to the acquisition temperature of the thermocouple.
Example 3
In order to better solve the plane grinding problem, this embodiment is further configured on the basis of embodiment 1.
In this embodiment, the driving wheel 15 and the outer ring 2 are circumferentially and circumferentially provided with a plurality of evenly distributed cylinders, and the planetary gears 9 are circumferentially provided with gear teeth engaged with the cylinders.
The number of the planetary gears 9 is 3, and the number of teeth of the gear teeth on the planetary gears 9 is integrally designed according to the number of cylinders circumferentially arranged on the driving wheel 15 and the number of cylinders circumferentially arranged on the outer ring 2.
In this embodiment, 3 uniformly distributed placement holes are preferably provided on each planet wheel 9, wherein the shape and size of the placement holes can be set according to the size and shape of the workpiece.
In this embodiment, the grinding disc 3 is located below the planet wheel 9, opposite to each other, and not in contact with each other.
Wherein the outer ring 2 and the side of the driving wheel 15 close to the planet wheels 9 are provided with supporting edges to prevent the planet wheels 9 from falling off.
Example 4
In order to better solve the plane grinding problem, this embodiment is further configured on the basis of embodiment 1.
In this embodiment, the driving wheel 15, the outer ring 2 and the planet wheels 9 are provided with a plurality of evenly distributed, meshing gear teeth in the circumferential direction.
The tooth angles and moduli of the driving wheel 15, the outer ring 2 (gear ring) and the planetary gears 9 are equal, and the tooth numbers of the driving wheel 15, the outer ring 2 and the planetary gears 9 are designed according to actual conditions.
In the present embodiment, the number of the planetary gears 9 is 3.
In this embodiment, the grinding disc 3 is located below the planet wheel 9, opposite to each other, and not in contact with each other.
Wherein, outer loop 2 and the one side that the drive wheel 15 is close to planet wheel 9 all are provided with the supporting edge, and the teeth of a cogwheel setting is on the arch of supporting edge upper end to prevent that planet wheel 9 from dropping.
Example 5
In order to further improve the polishing efficiency, this embodiment is further configured on the basis of embodiment 3 or 4.
The planetary high-temperature plane grinding machine provided by the embodiment further comprises a pressing assembly, wherein the pressing assembly comprises a fixed shaft 6, a pressure plate 8, a spring 5 and a force adjusting nut 7, and the fixed shaft 6 is vertically and fixedly arranged on a planet wheel 9; the pressure plate 8 is sleeved on the outer side of the fixed shaft 6 and is in sliding connection with the fixed shaft 6; the upper end of the fixed shaft 6 is provided with external threads, and the force adjusting nut 7 is matched with the external threads of the fixed shaft 6; the spring 5 is sleeved outside the fixed shaft 6 and is positioned between the force adjusting nut 7 and the pressure plate 8.
Wherein the outer contour of the pressure plate 8 should be larger than the contour of the workpiece in the placement hole of the planet wheel 9.
In this embodiment, the driving device includes a driving motor 14 and a gearbox 13 sequentially installed on the frame 1 from bottom to top, where an output end of the driving motor 14 is fixedly connected with an input end of the gearbox 13, and an output end of the gearbox 13 is fixedly connected with the driving wheel 15.
The planetary high-temperature plane grinding machine provided by the embodiment further comprises a control box 11 arranged on the frame 1, and the control box 11 is electrically connected with the driving motor 14.
Wherein the gearbox 13 can select a reduction gearbox and a speed increasing gearbox according to the use condition and the condition of the workpiece.
Example 6
In order to further improve the environmental performance of the flat grinder, this embodiment is further configured on the basis of embodiment 5.
The planetary high-temperature plane grinding machine provided by the embodiment further comprises a collecting box 10, wherein the collecting box 10 is positioned at the lower end of the grinding disc 3.
When the abrasive is used for grinding, the collecting box 10 is used for collecting grinding dust generated in the grinding process, and a dust removing opening connected with a dust collecting device, preferably a dust collector, is arranged at the bottom of the collecting box 10.
When used for grinding liquid, the collecting box 10 is used for collecting grinding liquid and cooling liquid generated in the grinding process, and a liquid drain port connected with the liquid drain pipe 12 is arranged at the bottom of the collecting box 10.
The application method of the invention comprises the following steps:
s10, rotating the force adjusting nut upwards to leave a space for placing workpieces;
s20, placing a workpiece in a placing hole of the planet, releasing a pressure plate, placing the pressure plate at the upper end of the workpiece, rotating a force adjusting nut downwards, and adjusting the pressure of the pressure plate according to a preset condition; if the dead weight of the workpiece can meet the use requirement, a pressing assembly is not needed;
s30, starting the driving motor through the control box.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention still fall within the scope of the technical solutions of the present invention.
Claims (5)
1. A planetary face grinder, comprising:
the device comprises a rack, wherein an opening is formed in an operating platform of the rack;
the driving device is arranged corresponding to the opening, is arranged on the rack and is positioned at the lower end of the operating platform;
the planetary mechanism is positioned in the opening and comprises a driving wheel, an outer ring and a planetary wheel, the outer ring is fixedly arranged on the operating platform, and the driving wheel is in driving connection with the driving end of the driving device; the planet wheel is positioned between the driving wheel and the outer ring and meshed with the driving wheel and the outer ring so as to realize that the driving wheel drives the planet wheel to rotate relative to the outer ring; the planet wheel is provided with at least one placing hole for placing a workpiece;
the grinding disc is internally provided with a heating wire, is fixedly arranged on the frame and is positioned at the lower end of the planetary mechanism; the planetary gear drives the workpiece to move relatively to the grinding disc so as to grind the workpiece placed on the planetary gear;
the driving wheel and the outer ring are circumferentially and circumferentially provided with a plurality of uniformly distributed cylinders, the circumference of the planet wheel is provided with gear teeth, and the gear teeth are meshed and matched with the cylinders;
the device also comprises a pressing component, wherein the pressing component comprises a fixed shaft, a pressure plate, a spring and a force adjusting nut, the fixed shaft is vertically and fixedly arranged on the planet wheel; the pressure plate is sleeved on the outer side of the fixed shaft and is in sliding connection with the fixed shaft; the upper end of the fixed shaft is provided with external threads, and the force adjusting nut is matched with the external threads of the fixed shaft; the spring is sleeved on the outer side of the fixed shaft and is positioned between the force adjusting nut and the pressure plate;
the driving device comprises a driving motor and a gearbox which are sequentially arranged on the frame from bottom to top, wherein the output end of the driving motor is fixedly connected with the input end of the gearbox, and the output end of the gearbox is fixedly connected with the driving wheel.
2. The planetary face grinder of claim 1, wherein the number of planet wheels is at least 3.
3. The planetary face grinder of claim 1, further comprising a control box mounted on the frame, the control box being electrically connected to the drive motor.
4. The planetary type plane grinder as claimed in claim 1, further comprising a collecting tank at a lower end of the grinding pan for collecting grinding dust or grinding coolant generated during the grinding process.
5. The planetary type plane grinder as set forth in claim 4, wherein a dust removal port connected to a dust suction device or a liquid discharge port connected to a liquid discharge pipe is provided at a bottom of the collection tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210831149.9A CN115106928B (en) | 2022-07-15 | 2022-07-15 | Planetary high-temperature plane grinding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210831149.9A CN115106928B (en) | 2022-07-15 | 2022-07-15 | Planetary high-temperature plane grinding machine |
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Publication Number | Publication Date |
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CN115106928A CN115106928A (en) | 2022-09-27 |
CN115106928B true CN115106928B (en) | 2023-10-24 |
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CN202210831149.9A Active CN115106928B (en) | 2022-07-15 | 2022-07-15 | Planetary high-temperature plane grinding machine |
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Citations (20)
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GB1534389A (en) * | 1977-08-24 | 1978-12-06 | Mo Yysshee Tekh Uchilis Im Ne | Method and planetary-type lapping machine for lapping a group of workpieces |
JPH11138419A (en) * | 1997-10-31 | 1999-05-25 | Kashiwara Machine Mfg Co Ltd | Wafer polishing device and wafer pressuring method |
JP2004167675A (en) * | 2002-10-28 | 2004-06-17 | Nippon Telegr & Teleph Corp <Ntt> | Working device of optical connector end surface and optical connector end surface working method |
CN201711851U (en) * | 2010-07-12 | 2011-01-19 | 北京有色金属研究总院 | Silicon chip polishing device |
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CN104209862A (en) * | 2014-08-26 | 2014-12-17 | 广东工业大学 | Ultra-smooth plane grinding polishing device and method for online trimming flexible polishing pad |
CN106956211A (en) * | 2017-03-09 | 2017-07-18 | 东莞市中镓半导体科技有限公司 | A kind of single-sided polishing device |
CN207206154U (en) * | 2017-08-25 | 2018-04-10 | 天津三安光电有限公司 | A kind of new grinding disk |
CN207267193U (en) * | 2017-11-07 | 2018-04-24 | 江南大学 | A kind of planetary finishing machine for valve clack |
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CN110202433A (en) * | 2019-05-31 | 2019-09-06 | 泊头市金键模具有限责任公司 | A kind of die insert grinding device |
CN209936648U (en) * | 2019-04-30 | 2020-01-14 | 新乡市斯凯夫机械有限公司 | Special fixture for grinding special-shaped parts |
CN111266991A (en) * | 2020-03-30 | 2020-06-12 | 昂士特科技(深圳)有限公司 | Electric heating temperature control type chemical mechanical polishing platform |
CN212471068U (en) * | 2020-07-10 | 2021-02-05 | 大庆市三星机械制造有限公司 | Plane grinder |
CN212601161U (en) * | 2020-07-06 | 2021-02-26 | 郑州智匠精密工具有限公司 | Carbide tool bit rake face grinds processing frock |
CN213673238U (en) * | 2020-10-24 | 2021-07-13 | 新乡市斯凯夫机械有限公司 | Precise numerical control double-end-face grinding machine |
CN213673438U (en) * | 2020-10-22 | 2021-07-13 | 新乡市斯凯夫机械有限公司 | Double-end-face grinding machine lower grinding disc control mechanism |
CN216178973U (en) * | 2021-10-27 | 2022-04-05 | 辽宁科技大学 | Planetary gear train magnetic grinding machine |
CN114454089A (en) * | 2022-01-13 | 2022-05-10 | 浙江森永光电设备有限公司 | Single-side grinding and polishing device |
CN216542677U (en) * | 2021-12-31 | 2022-05-17 | 武汉锐晶激光芯片技术有限公司 | Wafer grinding clamp and device |
-
2022
- 2022-07-15 CN CN202210831149.9A patent/CN115106928B/en active Active
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GB1534389A (en) * | 1977-08-24 | 1978-12-06 | Mo Yysshee Tekh Uchilis Im Ne | Method and planetary-type lapping machine for lapping a group of workpieces |
JPH11138419A (en) * | 1997-10-31 | 1999-05-25 | Kashiwara Machine Mfg Co Ltd | Wafer polishing device and wafer pressuring method |
JP2004167675A (en) * | 2002-10-28 | 2004-06-17 | Nippon Telegr & Teleph Corp <Ntt> | Working device of optical connector end surface and optical connector end surface working method |
CN201711851U (en) * | 2010-07-12 | 2011-01-19 | 北京有色金属研究总院 | Silicon chip polishing device |
CN203245720U (en) * | 2013-05-09 | 2013-10-23 | 陈纪军 | Portable fiber end face grinding machine |
CN104209862A (en) * | 2014-08-26 | 2014-12-17 | 广东工业大学 | Ultra-smooth plane grinding polishing device and method for online trimming flexible polishing pad |
CN106956211A (en) * | 2017-03-09 | 2017-07-18 | 东莞市中镓半导体科技有限公司 | A kind of single-sided polishing device |
CN207206154U (en) * | 2017-08-25 | 2018-04-10 | 天津三安光电有限公司 | A kind of new grinding disk |
CN207267193U (en) * | 2017-11-07 | 2018-04-24 | 江南大学 | A kind of planetary finishing machine for valve clack |
CN208601323U (en) * | 2018-07-09 | 2019-03-15 | 苏州赛万玉山智能科技有限公司 | More universal grinding and polishing devices of size |
CN209936648U (en) * | 2019-04-30 | 2020-01-14 | 新乡市斯凯夫机械有限公司 | Special fixture for grinding special-shaped parts |
CN110202433A (en) * | 2019-05-31 | 2019-09-06 | 泊头市金键模具有限责任公司 | A kind of die insert grinding device |
CN111266991A (en) * | 2020-03-30 | 2020-06-12 | 昂士特科技(深圳)有限公司 | Electric heating temperature control type chemical mechanical polishing platform |
CN212601161U (en) * | 2020-07-06 | 2021-02-26 | 郑州智匠精密工具有限公司 | Carbide tool bit rake face grinds processing frock |
CN212471068U (en) * | 2020-07-10 | 2021-02-05 | 大庆市三星机械制造有限公司 | Plane grinder |
CN213673438U (en) * | 2020-10-22 | 2021-07-13 | 新乡市斯凯夫机械有限公司 | Double-end-face grinding machine lower grinding disc control mechanism |
CN213673238U (en) * | 2020-10-24 | 2021-07-13 | 新乡市斯凯夫机械有限公司 | Precise numerical control double-end-face grinding machine |
CN216178973U (en) * | 2021-10-27 | 2022-04-05 | 辽宁科技大学 | Planetary gear train magnetic grinding machine |
CN216542677U (en) * | 2021-12-31 | 2022-05-17 | 武汉锐晶激光芯片技术有限公司 | Wafer grinding clamp and device |
CN114454089A (en) * | 2022-01-13 | 2022-05-10 | 浙江森永光电设备有限公司 | Single-side grinding and polishing device |
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