CN203245737U - Multifunctional grinding liquid supply structure and grinding device - Google Patents
Multifunctional grinding liquid supply structure and grinding device Download PDFInfo
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- CN203245737U CN203245737U CN 201320260006 CN201320260006U CN203245737U CN 203245737 U CN203245737 U CN 203245737U CN 201320260006 CN201320260006 CN 201320260006 CN 201320260006 U CN201320260006 U CN 201320260006U CN 203245737 U CN203245737 U CN 203245737U
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- lapping liquid
- pipe
- grinding
- supply structure
- guide rail
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a multifunctional grinding liquid supply structure, and further discloses a grinding device. The multifunctional grinding liquid supply structure comprises a transversely-arranged arm rod, a grinding liquid pipe and a cleaning pipe, and further comprises an annular guide rail, wherein the grinding liquid pipe and the cleaning pipe are arranged in the arm rod in a penetrating mode, the annular guide rail is arranged on the outer periphery of a grinding platform in a surrounding mode, one end of the arm rod is connected with the annular guide rail in a sliding mode, the arm rod can rotate along the annular guide rail, and a cleaning liquid spraying opening spraying cleaning liquid upwards is formed in the cleaning pipe. The multifunctional grinding liquid supply structure and the grinding device can achieve supply and cleaning of grinding liquid, and can achieve cleaning of wafers when the wafers do not make contact with a grinding cushion.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of multi-functional lapping liquid Supply Structure and lapping device.
Background technology
In semi-conductive production technology, often need to carry out cmp (Chemical Mechanical Polishing, CMP) technique, cmp are also referred to as chemical-mechanical planarization (Chemical Mechanical Planarization).Chemical mechanical milling tech is the technical process of a complexity, it is that crystal column surface is contacted with the lapped face of grinding pad, then, by the relative motion between crystal column surface and the lapped face with flattening wafer surface, the common chemical-mechanical grinding device that adopts is also referred to as grinder station or polishing machine platform carries out chemical mechanical milling tech.
See also Fig. 1, it is the structural representation of grinder station, and existing grinder station generally comprises a plurality of lapping devices, each lapping device comprises grinding plate, grinding head 2 and the cleaning device 8 of laying grinding pad 1 above one, and namely a wafer is ground through several grinding plates usually.
See also Fig. 2, it is the structural representation of existing lapping device, existing lapping device, comprise and lay grinding pad 1(pad above one) grinding plate (platen), grinding head 2(head) and the lapping liquid Supply Structure, when carrying out grinding technics, the wafer that will grind is attached on the grinding head 2, this wafer to be ground faces down and contacts counterrotating grinding pad 1, the downforce that grinding head provides is pressed onto this wafer on the grinding pad 1, described grinding pad 1 is to be pasted on the grinding plate, when rotating under the drive of this grinding plate at motor, grinding head 2 also carries out corresponding sports; Simultaneously, lapping liquid (slurry) is transported on the grinding pad 1 by the lapping liquid Supply Structure, and is evenly distributed on the grinding pad 1 by centrifugal force.
Because every wafer usually needs to carry out follow-up grinding to next grinding plate after a grinding plate grinding is finished, and the pH value of the lapping liquid of the employing of different grinding plates usually is different.Therefore, if wafer is not thoroughly cleaned, on the one hand, the lapping liquid that adheres on the wafer and lapping liquid accessory substance can be brought on the next grinding plate, so, can cause follow-up grinding technics pH value dilution problem to occur; On the other hand, the lapping liquid that adheres on the wafer and lapping liquid accessory substance corrode the metal structure on the wafer easily, thereby, cause product yield to reduce.
In addition, please continue to consult Fig. 2, existing lapping liquid Supply Structure comprises arm 3 and the lapping liquid pipe 31 and the deionization water pipe 32(DIW that are arranged in described armed lever inside).Lapping liquid pipe 31 is used for providing lapping liquid when wafer grinds.Deionization water pipe 32 is used for realizing the cleaning of grinding pad 1 and the cleaning of wafer after grinding wafer is finished.Existing wafer can only be pressed in wafer on mobile the grinding pad 1 of deionized water by grinding head and clean.But because wafer is pressed on the grinding pad 1 and cleans, the abrasive grains on the grinding pad 1 and grinding accessory substance scratch wafer easily, cause product yield to descend.
Therefore, how providing a kind of multi-functional lapping liquid Supply Structure and the lapping device that can address the above problem is the technical problem that those skilled in the art need to be resolved hurrily.
The utility model content
The purpose of this utility model is to provide a kind of multi-functional lapping liquid Supply Structure and lapping device, not only can realize the supply of lapping liquid and the cleaning of grinding pad, and can in wafer and the discontiguous situation of grinding pad, realize the cleaning to wafer.
To achieve the above object, the utility model adopts following technical scheme:
A kind of multi-functional lapping liquid Supply Structure, comprise the armed lever of horizontally set and be arranged in described armed lever interior lapping liquid pipe and scavenge pipe, also comprise ring-shaped guide rail, described ring-shaped guide rail is around the periphery outside that is arranged at grinding plate, one end and the described ring-shaped guide rail of described armed lever are slidingly connected, described armed lever can rotate along described ring-shaped guide rail, and described scavenge pipe is provided with the spout of the cleaning fluid that upwards sprays.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, also comprise bracing frame, support frame as described above is arranged at the below of described ring-shaped guide rail.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, the upside of described scavenge pipe is provided with some spouts that upwards spray along the axially spaced-apart of described scavenge pipe.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, the downside of described scavenge pipe is provided with the spout of some Jet with downward flow directions along the axially spaced-apart of scavenge pipe.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, the end away from described ring-shaped guide rail on the described scavenge pipe is provided with the adjustable spout of an angle.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, described scavenge pipe comprises water pipe and chemical cleaning solution pipe.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, the quantity of described water pipe is more than one, and the quantity of described chemical cleaning solution pipe is more than two.
Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, end away from ring-shaped guide rail on the described lapping liquid pipe is provided with the adjustable spout of an angle, the upside of described lapping liquid pipe is provided with some spouts that upwards spray along the axially spaced-apart of lapping liquid pipe, and the downside of described lapping liquid pipe is provided with the spout of some Jet with downward flow directions along the axially spaced-apart of lapping liquid pipe.
The invention also discloses a kind of lapping device, comprise grinding head, grinding plate and grinding pad, described grinding pad is layed on the described grinding plate, and described grinding head is arranged on the described grinding pad, also comprises aforesaid multi-functional lapping liquid Supply Structure.
Multi-functional lapping liquid Supply Structure and lapping device that the utility model provides, by being arranged in lapping liquid pipe and the scavenge pipe of armed lever, realized the supply of lapping liquid and to the cleaning of grinding pad, and, by ring-shaped guide rail is set, described scavenge pipe is arranged in the described armed lever, described scavenge pipe is provided with the spout of the cleaning fluid that upwards sprays, described ring-shaped guide rail is around the periphery outside that is arranged at grinding plate, one end and the described ring-shaped guide rail of described armed lever are slidingly connected, described armed lever can rotate along described ring-shaped guide rail, so that this multi-functional lapping liquid Supply Structure not only can be used in the supply lapping liquid and is used for cleaning grinding pad, but also can be in wafer and the discontiguous situation of grinding pad, realization is to the cleaning of wafer, so, on the one hand, can prevent that the lapping liquid and the lapping liquid accessory substance that adhere on the wafer are brought on the next grinding plate; On the other hand, can avoid the metal structure on the lapping liquid that adheres on the wafer and the lapping liquid accessory substance corrosion wafer, so that product yield reduces; Again on the one hand, do not need wafer is pressed on the grinding pad during owing to cleaning wafer, the risk that wafer is polished particle and the scuffing of lapping liquid accessory substance therefore can not occur.
Description of drawings
Multi-functional lapping liquid Supply Structure of the present utility model and lapping device are provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of lapping device;
Fig. 2 is the structural representation of existing grinder station;
Fig. 3 is the schematic top plan view of the grinder station of the utility model one embodiment;
Fig. 4 is the schematic side view of the grinder station of the utility model one embodiment;
Fig. 5 is the schematic side view of the armed lever of the utility model one embodiment;
Fig. 6 is the schematic top plan view of the armed lever of the utility model one embodiment.
Among the figure, 1-grinding plate, 2-grinding head 2,3-armed lever, 31-lapping liquid pipe, 311-the 4th spout, 312-the 5th spout, 313-the 6th spout, 32-scavenge pipe, 321-the first spout, 322-the second spout, 323-the 3rd spout, 4-grinding pad, 5-ring-shaped guide rail, 6-bracing frame, 7-wafer, 8-cleaning device.
The specific embodiment
Below will be described in further detail multi-functional lapping liquid Supply Structure of the present utility model and lapping device.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize the beneficial effects of the utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, the confusion because they can make the utility model owing to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example according to relevant system or relevant commercial restriction, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose of this utility model, feature are become apparent, below in conjunction with accompanying drawing the specific embodiment of the present utility model is further described.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-accurately ratio, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 3 and Fig. 4, the multi-functional lapping liquid Supply Structure that present embodiment provides, comprise the armed lever 3 of horizontally set and be arranged in described armed lever interior lapping liquid pipe 31 and scavenge pipe 32, also comprise ring-shaped guide rail 5, described ring-shaped guide rail 5 is around the periphery outside that is arranged at grinding plate 3, and an end and the described ring-shaped guide rail 5 of described armed lever 3 are slidingly connected, and described armed lever 3 can rotate along described ring-shaped guide rail 5, described scavenge pipe 32 is provided with the spout of the cleaning fluid that upwards sprays, i.e. the first spout 321.By lapping liquid pipe 31 and the scavenge pipe 32 that is arranged in armed lever 3, can realize the supply of lapping liquid and to the cleaning of grinding pad 1, and, by ring-shaped guide rail 5 is set, and described scavenge pipe 32 is provided with the spout 321 of the cleaning fluid that upwards sprays, described ring-shaped guide rail 5 is around the periphery outside that is arranged at grinding plate 3, one end and the described ring-shaped guide rail 5 of described armed lever 3 are slidingly connected, described armed lever 3 can rotate along described ring-shaped guide rail 5, so that this multi-functional lapping liquid Supply Structure not only can be used in the supply lapping liquid and is used for cleaning grinding pad, but also can be in wafer 7 and the discontiguous situation of grinding pad, realization is to the cleaning of wafer 7, so, on the one hand, can prevent that the lapping liquid and the lapping liquid accessory substance that adhere on the wafer 7 are brought on the next grinding plate; On the other hand, can avoid the lapping liquid of adhesion on the wafer 7 and the metal structure on the lapping liquid accessory substance corrosion wafer 7, so that product yield reduces; Again on the one hand, do not need wafer 7 is pressed on the grinding pad 1 during owing to cleaning wafer 7, the risk that wafer 7 is polished particle and the scuffing of lapping liquid accessory substance therefore can not occur.
Better, in the multi-functional lapping liquid Supply Structure of present embodiment, also comprising bracing frame 6, support frame as described above 6 is arranged at the below of described ring-shaped guide rail 5, is used for supporting and fixing described ring-shaped guide rail 5.
See also Fig. 5 and Fig. 6, wherein, Fig. 5 is the schematic side view of the armed lever of the utility model one embodiment, Fig. 6 is the schematic top plan view of the armed lever of the utility model one embodiment, and please in conjunction with Fig. 3 and Fig. 4, better, the upside of described scavenge pipe 32 is provided with some spouts that upwards spray, i.e. the first spout 321 along the axially spaced-apart of described scavenge pipe 32.The downside of described scavenge pipe 32 is provided with the spout of some Jet with downward flow directions, i.e. the second spout 322 along the axially spaced-apart of scavenge pipe 32.End away from described ring-shaped guide rail on the described scavenge pipe is provided with the adjustable spout of an angle, i.e. the 3rd spout 323.
Better; in the multi-functional lapping liquid Supply Structure of present embodiment; described scavenge pipe 31 comprises water pipe and chemical cleaning solution pipe; as shown in Figure 6; described water pipe is used for supplying deionized water; described chemical cleaning solution pipe is used for the supplying chemical cleaning fluid, generally selects the chemical cleaning solution that can protect the metal structure on the wafer 7.Preferably, in above-mentioned multi-functional lapping liquid Supply Structure, the quantity of described water pipe is more than one, and the quantity of described chemical cleaning solution pipe is more than two.By two above chemical cleaning solution pipes are set, can be so that the chemical cleaning solution of supply different cultivars.
Please continue to consult Fig. 3 to Fig. 6, in the multi-functional lapping liquid Supply Structure of present embodiment, the upside of described lapping liquid pipe 31 is provided with some spouts that upwards spray, i.e. the 4th spout 311 along the axially spaced-apart of lapping liquid pipe 31; The downside of described lapping liquid pipe is provided with the spout of some Jet with downward flow directions along the axially spaced-apart of lapping liquid pipe, i.e. the 5th spout 312, and the end away from ring-shaped guide rail 5 on the described lapping liquid pipe 31 is provided with the adjustable spout of an angle, i.e. the 6th spout 313.Preferably, the quantity of described lapping liquid pipe 32 is more than two, by two above chemical cleaning solution pipes are set, and can be so that the lapping liquid of supply different cultivars.In the present embodiment, the structure of scavenge pipe 32 and lapping liquid pipe 31 is identical, thereby can realize between the two general.
Please continue to consult Fig. 3 and Fig. 4, present embodiment also provides a kind of lapping device, comprise grinding head 2, grinding plate 4 and grinding pad 1, described grinding pad 1 is layed on the described grinding plate 4, described grinding head 2 is arranged on the described grinding pad 1, also comprises aforesaid multi-functional lapping liquid Supply Structure.
The using method of present embodiment is exemplified below:
Step 4, by the deionization water pipe in the scavenge pipe 32 to grinding pad 1 supplying deionized water, with the chemical cleaning solution on the cleaning grinding pad 1.In this step, can select as required the downward spout of this scavenge pipe 32, generally select the second spout 322 or the 3rd spout 323, and can adjust by adjusting armed lever 3 position of the relative wafer 7 of this spout in the position of relative ring-shaped guide rail 5.
Step 6 is by mobile armed lever 3, so that mobile armed lever 3 is positioned at the below of described grinding head 2, so that armed lever 3 is relative with wafer 7.
Step 9, by the deionization water pipe in the scavenge pipe 32 to grinding pad 1 supplying deionized water, with the chemical cleaning solution on direct cleaning wafer 7 surfaces.In this step, can select as required the spout that makes progress of this scavenge pipe 32, i.e. the first spout 312.
In sum, multi-functional lapping liquid Supply Structure and lapping device that the utility model provides, by being arranged in lapping liquid pipe and the scavenge pipe of armed lever, realized the supply of lapping liquid and to the cleaning of grinding pad, and, by ring-shaped guide rail is set, described scavenge pipe is arranged in the described armed lever, described scavenge pipe is provided with the spout of the cleaning fluid that upwards sprays, described ring-shaped guide rail is around the periphery outside that is arranged at grinding plate, one end and the described ring-shaped guide rail of described armed lever are slidingly connected, described armed lever can rotate along described ring-shaped guide rail, so that this multi-functional lapping liquid Supply Structure not only can be used in the supply lapping liquid and is used for cleaning grinding pad, but also can realize the cleaning to wafer in wafer and the discontiguous situation of grinding pad, so, on the one hand, can prevent that the lapping liquid and the lapping liquid accessory substance that adhere on the wafer are brought on the next grinding plate; On the other hand, can avoid the metal structure on the lapping liquid that adheres on the wafer and the lapping liquid accessory substance corrosion wafer, so that product yield reduces; Again on the one hand, do not need wafer is pressed on the grinding pad during owing to cleaning wafer, the risk that wafer is polished particle and the scuffing of lapping liquid accessory substance therefore can not occur.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (9)
1. multi-functional lapping liquid Supply Structure, comprise the armed lever of horizontally set and be arranged in described armed lever interior lapping liquid pipe and scavenge pipe, it is characterized in that, also comprise ring-shaped guide rail, described ring-shaped guide rail is around the periphery outside that is arranged at grinding plate, one end and the described ring-shaped guide rail of described armed lever are slidingly connected, and described armed lever can rotate along described ring-shaped guide rail, and described scavenge pipe is provided with the spout of the cleaning fluid that upwards sprays.
2. multi-functional lapping liquid Supply Structure according to claim 1 is characterized in that, comprises that also bracing frame, support frame as described above are arranged at the below of described ring-shaped guide rail.
3. multi-functional lapping liquid Supply Structure according to claim 1 is characterized in that, the upside of described scavenge pipe is provided with some spouts that upwards spray along the axially spaced-apart of described scavenge pipe.
4. multi-functional lapping liquid Supply Structure according to claim 1 is characterized in that, the downside of described scavenge pipe is provided with the spout of some Jet with downward flow directions along the axially spaced-apart of scavenge pipe.
5. multi-functional lapping liquid Supply Structure according to claim 1 is characterized in that, the end away from described ring-shaped guide rail on the described scavenge pipe is provided with the adjustable spout of an angle.
6. multi-functional lapping liquid Supply Structure according to claim 1 is characterized in that, described scavenge pipe comprises water pipe and chemical cleaning solution pipe.
7. multi-functional lapping liquid Supply Structure according to claim 1 is characterized in that, the quantity of described water pipe is more than one, and the quantity of described chemical cleaning solution pipe is more than two.
8. multi-functional lapping liquid Supply Structure according to claim 1, it is characterized in that, end away from described ring-shaped guide rail on the described lapping liquid pipe is provided with the adjustable spout of an angle, the upside of described lapping liquid pipe is provided with some spouts that upwards spray along the axially spaced-apart of lapping liquid pipe, and the downside of described lapping liquid pipe is provided with the spout of some Jet with downward flow directions along the axially spaced-apart of lapping liquid pipe.
9. lapping device, comprise grinding head, grinding plate and grinding pad, described grinding pad is layed on the described grinding plate, and described grinding head is arranged on the described grinding pad, it is characterized in that, also comprise such as the described multi-functional lapping liquid Supply Structure of any one in the claim 1～8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320260006 CN203245737U (en) | 2013-05-14 | 2013-05-14 | Multifunctional grinding liquid supply structure and grinding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320260006 CN203245737U (en) | 2013-05-14 | 2013-05-14 | Multifunctional grinding liquid supply structure and grinding device |
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| CN203245737U true CN203245737U (en) | 2013-10-23 |
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| CN 201320260006 Expired - Fee Related CN203245737U (en) | 2013-05-14 | 2013-05-14 | Multifunctional grinding liquid supply structure and grinding device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625941A (en) * | 2013-11-14 | 2015-05-20 | 盛美半导体设备（上海）有限公司 | Wafer processing device |
| CN109159020A (en) * | 2018-10-26 | 2019-01-08 | 长江存储科技有限责任公司 | Grinding device |
| CN112677033A (en) * | 2020-12-03 | 2021-04-20 | 上海新昇半导体科技有限公司 | Polishing head, chemical mechanical polishing device and chemical mechanical polishing method |
| CN114536224A (en) * | 2022-04-11 | 2022-05-27 | 北京烁科精微电子装备有限公司 | Grinding fluid output arm and method for stabilizing grinding rate |
| US20220396897A1 (en) * | 2020-12-22 | 2022-12-15 | Ebara Corporation | Plating apparatus, pre-wet process method, and cleaning process method |
-
2013
- 2013-05-14 CN CN 201320260006 patent/CN203245737U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625941A (en) * | 2013-11-14 | 2015-05-20 | 盛美半导体设备（上海）有限公司 | Wafer processing device |
| CN109159020A (en) * | 2018-10-26 | 2019-01-08 | 长江存储科技有限责任公司 | Grinding device |
| CN112677033A (en) * | 2020-12-03 | 2021-04-20 | 上海新昇半导体科技有限公司 | Polishing head, chemical mechanical polishing device and chemical mechanical polishing method |
| CN112677033B (en) * | 2020-12-03 | 2021-12-17 | 上海新昇半导体科技有限公司 | Polishing head, chemical mechanical polishing device and chemical mechanical polishing method |
| US20220396897A1 (en) * | 2020-12-22 | 2022-12-15 | Ebara Corporation | Plating apparatus, pre-wet process method, and cleaning process method |
| CN114536224A (en) * | 2022-04-11 | 2022-05-27 | 北京烁科精微电子装备有限公司 | Grinding fluid output arm and method for stabilizing grinding rate |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20190514 |