CN103846777A - Chemical mechanical grinding device and method - Google Patents
Chemical mechanical grinding device and method Download PDFInfo
- Publication number
- CN103846777A CN103846777A CN201210500821.2A CN201210500821A CN103846777A CN 103846777 A CN103846777 A CN 103846777A CN 201210500821 A CN201210500821 A CN 201210500821A CN 103846777 A CN103846777 A CN 103846777A
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- China
- Prior art keywords
- lapping liquid
- liquid supply
- grinding
- grinding pad
- supply line
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a chemical mechanical grinding device. The chemical mechanical grinding device comprises a turntable, a grinding pad, a grinding head and a grinding fluid supply arm, wherein the inside of the grinding fluid supply arm is provided with a grinding fluid supply pipe, and one end of the grinding fluid supply pipe is connected with a grinding fluid supply pipe head, which is arranged at one end of the grinding fluid supply arm and above the grinding pad and used for conveying grinding fluid to the grinding pad. The chemical mechanical grinding device also comprises a driving device which is connected with the other end of the grinding fluid supply arm, and the driving device is used for driving the grinding fluid supply arm to rotate and according driving the grinding fluid supply pipe inside the grinding fluid supply arm and the grinding fluid supply pipe head connected with the grinding fluid supply pipe to rotate. During grinding, the driving device drives the grinding fluid supply pipe and the grinding fluid supply pipe head to rotate, so that the grinding fluid can be distributed on the grinding pad more uniformly, and the flatness of wafers can be better. The invention also discloses a chemical mechanical grinding method.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of chemical mechanical polishing device and Ginding process.
Background technology
Along with the fast development of semiconductor technology, the integrated level of semiconductor devices is more and more higher, and the characteristic size of semiconductor devices is more and more less, the manufacture difficulty of semiconductor devices is constantly increased, in order to improve the yield of semiconductor devices, crystal column surface is carried out to planarization and become of crucial importance.At present, cmp is still flattening wafer surface and processes the method the most often adopting.
Existing chemical mechanical polishing device, as shown in Figure 5, comprise turntable (not shown), be attached to grinding pad 201, grinding head 202, the lapping liquid supply arm 203 of turntable surface, wherein, in lapping liquid supply arm 203, be provided with lapping liquid supply pipe 204 and cleaning fluid supply pipe 205, lapping liquid supply pipe 204 is for supplying lapping liquid 206 to grinding pad 201, and cleaning fluid supply pipe 205 is for supplying cleaning fluid to grinding pad 201.When grinding, first to be ground the facing down of wafer to be ground is attached on grinding head 202, then apply downward pressure to grinding head 202, the face to be ground of wafer is pressed on grinding pad 201, then the surperficial turntable that posts grinding pad 201 rotates under the driving of motor, simultaneously, grinding head 202 also carries out rotating in same direction, in grinding head 202 and turntable rotation, lapping liquid 206 is fed on grinding pad 201 by lapping liquid supply pipe 204, and be distributed on grinding pad 201 under the effect of the centrifugal force producing in turntable rotation, realize the grinding to wafer.After grinding finishes, cleaning fluid is fed on grinding pad 201 by cleaning fluid supply pipe 205, and grinding pad 201 is cleaned.
But, the lapping liquid supply arm 203 of above-mentioned chemical mechanical polishing device is installed in a side of turntable conventionally, and many employing single tubes supply, thereby, the drop point of lapping liquid 206 on grinding pad 201 fixed, only depend on centrifugal force deficiency that turntable rotation produces so that lapping liquid 206 is evenly distributed on grinding pad 201, in the time there is relative motion with grinding pad 201 in wafer under the drive of grinding head 202, the concentration difference of the lapping liquid that the different parts of wafer touches, can cause like this clearance difference of crystal column surface, and then cause the flatness of crystal column surface to decline, affect the yield of semiconductor devices.In addition, also fix for the supply of the cleaning fluid of cleaning grinding pad 201, adopt the cleaning performance of this kind of mode cleaning grinding pad 201 poor, and cleaning efficiency is lower.
Summary of the invention
The object of this invention is to provide one and can make lapping liquid be more evenly distributed on grinding pad, thereby make the better chemical mechanical polishing device of flatness of wafer surface.
For achieving the above object, a kind of chemical mechanical polishing device provided by the invention, comprise turntable, grinding pad, grinding head and lapping liquid supply arm, wherein, in lapping liquid supply arm, be laid with lapping liquid supply line, one end of lapping liquid supply line is connected with lapping liquid supply tube head, lapping liquid supply tube head is arranged on one end of lapping liquid supply arm and is positioned at the top of grinding pad, for carrying lapping liquid to grinding pad, this device also comprises the drive unit being connected with the other end of lapping liquid supply arm, in order to drive lapping liquid supply arm to rotate, thereby drive the lapping liquid supply tube head that is laid in the lapping liquid supply line in lapping liquid supply arm and be connected with lapping liquid supply line to rotate.
Another object of the present invention is to provide a kind of chemical and mechanical grinding method, to improve flatness of wafer surface.
For achieving the above object, a kind of chemical and mechanical grinding method provided by the invention, comprise when rotating table and grinding head grind, within the scope of certain angle, supply arm with certain rotational speed lapping liquid, make the lapping liquid that is laid in the lapping liquid supply line in lapping liquid supply arm and is connected with lapping liquid supply line supply tube head rotation simultaneously to grinding pad conveying lapping liquid.
In sum, while adopting chemical mechanical polishing device of the present invention and Ginding process to grind, drive lapping liquid supply line and lapping liquid supply tube head to rotate by drive unit, lapping liquid is more evenly distributed on grinding pad, wafer planarization degree is better.
Brief description of the drawings
Fig. 1 is the structural representation of an embodiment of chemical mechanical polishing device of the present invention.
Fig. 2 (a) is the structural representation of an embodiment of lapping liquid supply tube head of the present invention.
Fig. 2 (b) is the structural representation of the another embodiment of lapping liquid supply tube head of the present invention.
Fig. 3 (a) is for adopting the experiment effect figure after existing chemical mechanical polishing device and Ginding process grind.
Fig. 3 (b) is for adopting the experiment effect figure after chemical mechanical polishing device of the present invention and Ginding process grind.
Fig. 4 is the experiment effect comparison diagram adopting after existing chemical mechanical polishing device and Ginding process and employing chemical mechanical polishing device of the present invention and Ginding process grinding.
Fig. 5 is the structural representation of existing chemical mechanical polishing device.
Detailed description of the invention
By describing technology contents of the present invention, structural feature in detail, being reached object and effect, below in conjunction with embodiment and coordinate graphic detailed description in detail.
Refer to Fig. 1 and Fig. 2, a kind of chemical mechanical polishing device provided by the invention comprises turntable (not shown), is attached to the grinding pad 101 of turntable top surface, grinding head 102 and lapping liquid supply arm 103.The top of turntable is located in 103 activities of lapping liquid supply arm.In lapping liquid supply arm 103, be laid with lapping liquid supply line 104 and cleaning fluid supply line 105, wherein, one end of lapping liquid supply line 104 is connected with lapping liquid supply tube head 107, lapping liquid supply tube head 107 be arranged on lapping liquid supply arm 103 one end sidewall and be positioned at the top of grinding pad 101, for carrying lapping liquid 106 to grinding pad 101, thereby on cleaning fluid supply line 105, offer several jets 1051 for grinding pad 101 being cleaned to grinding pad 101 jet cleaning liquid.The bottom of lapping liquid supply arm 103 offers the opening (not shown) of strip, and the cleaning fluid spraying from the jet 1051 of cleaning fluid supply line 105 is ejected into grinding pad 101 via this opening.
On lapping liquid supply arm 103, the bottom of the other end relative with one end that lapping liquid supply tube head 107 is set is connected with servomotor 108, and servomotor 108 is for driving lapping liquid supply arm 103 to rotate.Particularly, servomotor 108 is connected with encoder 109 and servo-driver 110 respectively.In servo-driver 110, be provided with control panel 1101 and drive plate 1102.Encoder 109 is electrically connected with control panel 1101, control panel 1101 is electrically connected with drive plate 1102, drive plate 1102 is electrically connected with servomotor 108, specific works principle is as follows: the first default rotating speed of servomotor 108 and the angular range of rotation in control panel 1101, control panel 1101 by the angular range electric signal transmission of default rotating speed and rotation to drive plate 1102, drive plate 1102 drives servomotor 108 to rotate according to the angular range signal of telecommunication of default rotating speed and rotation, the rotation of servomotor 108 can drive lapping liquid supply arm 103 to rotate, encoder 109 detects the rotating speed of servomotor 108 and the angular range of rotation, and by the angular range electric signal transmission of the rotating speed recording and rotation the control panel 1101 to servo-driver 110, control panel 1101 is by the angular range signal of telecommunication of the rotating speed of the servomotor of receiving 108 and rotation and default rotating speed and the angular range signal of telecommunication comparison of rotation, if the two is consistent, the rotating speed that servomotor 108 continues to preset rotates in default angular range, if the two is inconsistent, control panel 1101 produces correction signal according to comparative result, and correction signal is transferred to drive plate 1102, drive plate 1102 drives servomotor 108 forward or reverse according to correction signal, the speed that servomotor 108 is rotated is consistent with preset value with angular range, thereby reach the object of the angular range of speed that accurate control lapping liquid supply arm 103 rotates above grinding pad 101 and rotation.
As shown in Figure 2 (a) shows, lapping liquid supply tube head 107 is inverted T-shaped shape, there is the first tube connector portion 1071 and the second tube connector portion 1072 that are vertically connected to one another, one end of the first tube connector portion 1071 is connected with lapping liquid supply line 104, and the other end of the first tube connector portion 1071 is with second tube connector portion 1072 is vertical is connected.In the second tube connector portion 1072, offer several lapping liquid delivery outlets 1073, these several lapping liquid delivery outlets 1073 are uniformly distributed in the second tube connector portion 1072, the shape of lapping liquid delivery outlet 1073 can be circular, and the shape that lapping liquid 106 is exported from lapping liquid delivery outlet 1073 is wire.The second tube connector portion 1072 can be flat, correspondingly, the shape of lapping liquid delivery outlet 1073 can be oval, as shown in Fig. 2 (b), the shape that lapping liquid 106 is exported from lapping liquid delivery outlet 1073 is curtain shape, can make lapping liquid 106 be more evenly distributed on grinding pad 101.
While using chemical mechanical polishing device of the present invention to grind wafer, wafer is attached on grinding head 102, to be ground of wafer contacts with grinding pad 101, apply downward pressure to grinding head 102, the face to be ground of wafer is pressed on grinding pad 101, rotating in same direction turntable and grinding head 102, and on grinding pad 101, carry lapping liquid 106 by lapping liquid supply line 104 and lapping liquid supply tube head 107, in carrying lapping liquid 106 to grinding pad 101, servo-driver 110 drives servomotor 108 to rotate in default angular range with the rotating speed of presetting, thereby drive lapping liquid supply arm 103 to rotate in certain angular range with constant rotating speed, lapping liquid supply line 104 and lapping liquid supply tube head 107 rotate with lapping liquid supply arm 103, increase the region that lapping liquid supply tube head 107 sprays lapping liquid 106, and the several lapping liquid delivery outlets 1073 on lapping liquid supply tube head 107 are carried lapping liquid 106 to grinding pad 101 simultaneously, lapping liquid 106 is evenly distributed on grinding pad 101 more, the concentration of the lapping liquid 106 that the different parts of wafer touches is basic identical, thereby the clearance of the different parts of wafer is identical, improve flatness of wafer surface.
After grinding finishes, cleaning fluid is injected on grinding pad 101 so that grinding pad 101 is cleaned by the jet 1051 of cleaning fluid supply line 105, in this process, servo-driver 110 drives servomotor 108 to rotate in default angular range with the rotating speed of presetting, thereby drive lapping liquid supply arm 103 to rotate in certain angular range with constant rotating speed, cleaning fluid supply line 105 rotates with lapping liquid supply arm 103, thereby can improve cleaning performance and the cleaning efficiency of grinding pad 101.
A kind of chemical and mechanical grinding method provided by the invention comprises: when rotating table and grinding head 102 carry out grinding wafer, within the scope of certain angle, with certain rotational speed lapping liquid supply arm 103, make to be laid in the lapping liquid supply line 104 in lapping liquid supply arm 103 and the lapping liquid supply tube head 107 that is connected with lapping liquid supply line 104 rotates and carries lapping liquid 106 to grinding pad 101 simultaneously.
This method also further comprises: after grinding finishes, within the scope of certain angle, with certain rotational speed lapping liquid supply arm 103, the cleaning fluid supply line 105 being laid in lapping liquid supply arm 103 is rotated simultaneously to grinding pad 101 jet cleaning liquid cleaning grinding pads 101.
Refer to Fig. 3 (a) and Fig. 3 (b), Fig. 3 (a) is for adopting the experiment effect figure after existing chemical mechanical polishing device and Ginding process grind, and Fig. 3 (b) is for adopting the experiment effect figure after chemical mechanical polishing device of the present invention and Ginding process grind.Comparison diagram 3(a) and Fig. 3 (b) can find out, adopt the clearance of chemical mechanical polishing device of the present invention and Ginding process grinding crystal wafer higher, and the clearance of X-axis and Y-axis is more approaching, therefore, adopt the flatness of chemical mechanical polishing device of the present invention and Ginding process grinding crystal wafer better.
Refer to Fig. 4, Fig. 4 is the concrete quantification of Fig. 3 (a) and Fig. 3 (b), further can find out that the clearance of employing chemical mechanical polishing device of the present invention and Ginding process grinding crystal wafer is higher, and the clearance of X-axis and Y-axis is more approaching.
From the above, chemical mechanical polishing device of the present invention and Ginding process are by adopting servo-driver 110 to drive servomotor 108 to rotate in default angular range with the rotating speed of presetting, thereby drive lapping liquid supply arm 103 to rotate in certain angular range with constant rotating speed, and then drive lapping liquid supply line 104 and lapping liquid supply tube head 107 and cleaning fluid supply line 105 to rotate to improve cleaning performance and the cleaning efficiency of flatness of wafer surface and grinding pad 101.
In sum, chemical mechanical polishing device of the present invention and Ginding process be by the explanation of above-mentioned embodiment and correlative type, the exposure that oneself is concrete, full and accurate correlation technique, those skilled in the art can be implemented according to this.And the above embodiment is just used for illustrating the present invention, instead of be used for limiting of the present invention, interest field of the present invention, should be defined by claim of the present invention.Still all should belong to interest field of the present invention as for the change of described component number or the replacement of equivalence element etc. herein.
Claims (8)
1. a chemical mechanical polishing device, comprise turntable, grinding pad, grinding head and lapping liquid supply arm, wherein, in lapping liquid supply arm, be laid with lapping liquid supply line, one end of lapping liquid supply line is connected with lapping liquid supply tube head, lapping liquid supply tube head is arranged on one end of lapping liquid supply arm and is positioned at the top of grinding pad, for carrying lapping liquid to grinding pad, it is characterized in that, also comprise the drive unit being connected with the other end of lapping liquid supply arm, in order to drive lapping liquid supply arm to rotate, thereby drive the lapping liquid supply tube head that is laid in the lapping liquid supply line in lapping liquid supply arm and be connected with lapping liquid supply line to rotate.
2. chemical mechanical polishing device according to claim 1, it is characterized in that, described drive unit comprises a servomotor, encoder and servo-driver, described servomotor is connected with described encoder and described servo-driver respectively, the speed of rotating in order to accurate control lapping liquid supply arm and the angular range of rotation, be provided with control panel and drive plate in described servo-driver, encoder is electrically connected with control panel, control panel is electrically connected with drive plate, and drive plate is electrically connected with servomotor.
3. chemical mechanical polishing device according to claim 1, it is characterized in that, described lapping liquid supply tube head has the first tube connector portion and the second tube connector portion that are vertically connected to one another, to form T shape, one end of the first tube connector portion is connected with lapping liquid supply line, in the second tube connector portion, offer several lapping liquid delivery outlets, these several lapping liquid delivery outlets are uniformly distributed in the second tube connector portion.
4. chemical mechanical polishing device according to claim 3, is characterized in that, the shape of described lapping liquid delivery outlet is circular.
5. chemical mechanical polishing device according to claim 3, is characterized in that, described the second tube connector portion is flat, and described lapping liquid delivery outlet is oval.
6. chemical mechanical polishing device according to claim 1, it is characterized in that, in described lapping liquid supply arm, be also laid with cleaning fluid supply line, thereby on cleaning fluid supply line, offer several jets for grinding pad being cleaned to grinding pad jet cleaning liquid, the bottom of lapping liquid supply arm offers opening, and the cleaning fluid spraying from the jet of cleaning fluid supply line is ejected into grinding pad via this opening.
7. a chemical and mechanical grinding method, it is characterized in that, comprise: when rotating table and grinding head grind, within the scope of certain angle, supply arm with certain rotational speed lapping liquid, make the lapping liquid that is laid in the lapping liquid supply line in lapping liquid supply arm and is connected with lapping liquid supply line supply tube head rotation simultaneously to grinding pad conveying lapping liquid.
8. chemical and mechanical grinding method according to claim 7, it is characterized in that, also further comprise: after the step of described grinding finishes, within the scope of certain angle, with certain rotational speed lapping liquid supply arm, the cleaning fluid supply line being laid in lapping liquid supply arm is rotated simultaneously to grinding pad jet cleaning liquid cleaning grinding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210500821.2A CN103846777A (en) | 2012-11-29 | 2012-11-29 | Chemical mechanical grinding device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210500821.2A CN103846777A (en) | 2012-11-29 | 2012-11-29 | Chemical mechanical grinding device and method |
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| CN103846777A true CN103846777A (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210500821.2A Pending CN103846777A (en) | 2012-11-29 | 2012-11-29 | Chemical mechanical grinding device and method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104308744A (en) * | 2014-08-26 | 2015-01-28 | 上海华力微电子有限公司 | Chemical mechanical grinding liquid supply device |
| CN106607765A (en) * | 2017-01-19 | 2017-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A compact adjustable polishing solution conveying arm and a work project thereof |
| CN108655947A (en) * | 2018-05-30 | 2018-10-16 | 宁波江丰电子材料股份有限公司 | Grinder station and grinding method |
| CN109940517A (en) * | 2019-03-29 | 2019-06-28 | 长江存储科技有限责任公司 | A kind of lapping liquid distribution arm and CMP apparatus |
| CN112720247A (en) * | 2020-12-30 | 2021-04-30 | 合肥晶合集成电路股份有限公司 | Chemical mechanical planarization equipment and application thereof |
| CN114074286A (en) * | 2020-08-17 | 2022-02-22 | 铠侠股份有限公司 | Polishing apparatus and polishing method |
| CN114536224A (en) * | 2022-04-11 | 2022-05-27 | 北京烁科精微电子装备有限公司 | Grinding fluid output arm and method for stabilizing grinding rate |
-
2012
- 2012-11-29 CN CN201210500821.2A patent/CN103846777A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104308744A (en) * | 2014-08-26 | 2015-01-28 | 上海华力微电子有限公司 | Chemical mechanical grinding liquid supply device |
| CN106607765A (en) * | 2017-01-19 | 2017-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A compact adjustable polishing solution conveying arm and a work project thereof |
| CN108655947A (en) * | 2018-05-30 | 2018-10-16 | 宁波江丰电子材料股份有限公司 | Grinder station and grinding method |
| CN109940517A (en) * | 2019-03-29 | 2019-06-28 | 长江存储科技有限责任公司 | A kind of lapping liquid distribution arm and CMP apparatus |
| CN114074286A (en) * | 2020-08-17 | 2022-02-22 | 铠侠股份有限公司 | Polishing apparatus and polishing method |
| CN114074286B (en) * | 2020-08-17 | 2024-04-26 | 铠侠股份有限公司 | Polishing apparatus and polishing method |
| CN112720247A (en) * | 2020-12-30 | 2021-04-30 | 合肥晶合集成电路股份有限公司 | Chemical mechanical planarization equipment and application thereof |
| CN112720247B (en) * | 2020-12-30 | 2022-04-19 | 合肥晶合集成电路股份有限公司 | Chemical mechanical planarization equipment and application thereof |
| CN114536224A (en) * | 2022-04-11 | 2022-05-27 | 北京烁科精微电子装备有限公司 | Grinding fluid output arm and method for stabilizing grinding rate |
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Application publication date: 20140611 |