CN104308744A - Chemical mechanical grinding liquid supply device - Google Patents
Chemical mechanical grinding liquid supply device Download PDFInfo
- Publication number
- CN104308744A CN104308744A CN201410422520.1A CN201410422520A CN104308744A CN 104308744 A CN104308744 A CN 104308744A CN 201410422520 A CN201410422520 A CN 201410422520A CN 104308744 A CN104308744 A CN 104308744A
- Authority
- CN
- China
- Prior art keywords
- lapping liquid
- liquid supply
- grinding liquid
- supply arm
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a chemical mechanical grinding liquid supply device which comprises a grinding liquid supply arm, a bearing shaft and a grinding liquid supply assembly, wherein the grinding liquid supply arm is movably arranged on a grinding machine table, and independent grinding liquid supply pipelines are arranged on one side of the grinding liquid supply arm at intervals; the bearing shaft is fixedly arranged on the inner side of the grinding liquid supply arm; the grinding liquid supply assembly is glidingly arranged on the bearing shaft and used for providing grinding liquid and applying the grinding liquid to a grinding pad through the grinding liquid supply pipelines selectively. According to the chemical mechanical grinding liquid supply device, by arranging a built-in motor in the grinding machine table, the grinding liquid supply arm is controlled to rotate along the plane on which the grinding pad is arranged; the independent grinding liquid supply pipelines are arranged on one side of the grinding liquid supply arm at an interval, and the grinding liquid supply assembly are selectively communicated with the grinding liquid supply pipelines through a control unit, so that the supply of the grinding liquid is adjusted and the overall uniformity of wafers is improved.
Description
Technical field
The present invention relates to the cmp technical field of semiconductor, particularly relate to a kind of lapping liquid feeder of cmp.
Background technology
Along with microelectronic integrated circuit is to miniaturization, multiple stratification, slimming, flatening process development, cmp technology develops into based on work-table of chemicomechanical grinding mill, integrates the cmp technology of on-line checkingi, end point determination, cleaning etc.
Normally, chemical mechanical planarization process comprises the following steps: first, is fixed on grinding head by wafer to be ground, and grinding head applies downward pressure and High Rotation Speed to described wafer; The second, during grinding, the wafer of rotation is applied on the grinding pad with grinding table High Rotation Speed with certain downward pressure, and does relative motion with described grinding pad; Three, lapping liquid supply arm provides lapping liquid to described grinding pad, and lapping liquid flows between described wafer and described grinding pad; Four, by the acting in conjunction of chemistry with machinery, the very thin material of one deck is removed from described crystal column surface, to obtain high accuracy, low roughness, undamaged crystal column surface.
But, easily know ground, in described traditional chemical mechanical milling tech, described lapping liquid supply arm is that fixed form is arranged, therefore lapping liquid usual skewness when being supplied to described grinding pad, not only the uniformity of wafer entirety is impacted, and problem, the reduction product yield such as the material that more seriously can produce required grinding is residual.
Therefore for prior art Problems existing, this case designer is by means of being engaged in the industry experience for many years, and active research improves, so there is the lapping liquid feeder of a kind of cmp of the present invention.
Summary of the invention
The present invention be directed in prior art, in traditional chemical mechanical milling tech, described lapping liquid supply arm is that fixed form is arranged, therefore lapping liquid usual skewness when being supplied to described grinding pad, not only the uniformity of wafer entirety is impacted, and the problem such as the material that more seriously can produce required grinding is residual, the defects such as reduction product yield provide a kind of lapping liquid feeder of cmp.
In order to solve the problem, the invention provides a kind of lapping liquid feeder of cmp, the lapping liquid feeder of described cmp, comprise: lapping liquid supply arm, be movably arranged on grinder station, and independently polishing liquid feeding pipe is set at the interval, side of described lapping liquid supply arm; Reach, is fixedly installed on the inner side of described lapping liquid supply arm; Lapping liquid feeding assembly, is slidably arranged on described reach, and for providing lapping liquid, and be optionally applied on grinding pad by described polishing liquid feeding pipe.
Alternatively, described lapping liquid supply arm is movably arranged on described grinder station and is specially described lapping liquid supply arm by the Plane Rotation of built-in motor along described grinding pad place, and the velocity of rotation of described lapping liquid supply arm is controlled to adjust by described built-in motor.
Alternatively, the lapping liquid feeder of described cmp comprises control unit further, and described control unit is for controlling the coasting distance of described lapping liquid feeding assembly on described reach.
Alternatively, described control unit adopts machinery or signal of telecommunication mode to realize to the control of the coasting distance of described lapping liquid feeding assembly on described reach.
In sum, the lapping liquid feeder of cmp of the present invention is by arranging built-in motor at described grinder station, control the Plane Rotation of described lapping liquid supply arm along grinding pad place, and independently polishing liquid feeding pipe is set at the interval, side of described lapping liquid supply arm, optionally be communicated with described polishing liquid feeding pipe to be made described lapping liquid feeding assembly by described control unit, regulate the supply of described lapping liquid, improve the uniformity of wafer entirety.
Accompanying drawing explanation
Figure 1 shows that the structural representation of the lapping liquid feeder of cmp of the present invention.
Detailed description of the invention
By describe in detail the invention technology contents, structural feature, reached object and effect, coordinate accompanying drawing to be described in detail below in conjunction with embodiment.
Refer to Fig. 1, Figure 1 shows that the structural representation of the lapping liquid feeder of cmp of the present invention.The lapping liquid feeder 1 of described cmp, comprise: lapping liquid supply arm 11, described lapping liquid supply arm 11 is movably arranged on grinder station 10, and arranges independently polishing liquid feeding pipe 12 at the interval, side of described lapping liquid supply arm 11; Reach 13, described reach 13 is fixedly installed on the inner side of described lapping liquid supply arm 11; Lapping liquid feeding assembly 14, described lapping liquid feeding assembly 14 is slidably arranged on described reach 13, and for providing lapping liquid, and be optionally applied on grinding pad (not shown) by described polishing liquid feeding pipe 12.
As those skilled in the art, easy understand ground, described lapping liquid supply arm 11 is movably arranged on described grinder station 10, namely described lapping liquid supply arm 11 is by the Plane Rotation of built-in motor 15 along described grinding pad place, and the velocity of rotation of described lapping liquid supply arm 11 controls to adjust by described built-in motor 15.
As embodiment particularly, the lapping liquid feeder 1 of described cmp, comprise control unit (not shown) further, described control unit is for controlling the coasting distance of described lapping liquid feeding assembly 14 on described reach 13, optionally be connected with the lapping liquid service 12 being arranged on described lapping liquid and supplying the side of arm 11 to control described lapping liquid feeding assembly 14 further, carry out lapping liquid supply and regulate.As those skilled in the art, easily know ground, the control of described control unit to the coasting distance of described lapping liquid feeding assembly 14 on described reach 13 can adopt the modes such as traditional machinery, the signal of telecommunication to realize, the scope that non-this patent is advocated.
Apparently, the lapping liquid feeder 1 of cmp of the present invention is by arranging built-in motor 15 at described grinder station 10, control the Plane Rotation of described lapping liquid supply arm 11 along grinding pad place, and independently polishing liquid feeding pipe 12 is set at the interval, side of described lapping liquid supply arm 11, optionally be communicated with described polishing liquid feeding pipe to be made described lapping liquid feeding assembly by described control unit, regulate the supply of described lapping liquid, improve the uniformity of wafer entirety.
In sum, the lapping liquid feeder of cmp of the present invention is by arranging built-in motor at described grinder station, control the Plane Rotation of described lapping liquid supply arm along grinding pad place, and independently polishing liquid feeding pipe is set at the interval, side of described lapping liquid supply arm, optionally be communicated with described polishing liquid feeding pipe to be made described lapping liquid feeding assembly by described control unit, regulate the supply of described lapping liquid, improve the uniformity of wafer entirety.
Those skilled in the art all should be appreciated that, without departing from the spirit or scope of the present invention, can carry out various modifications and variations to the present invention.Thus, if when any amendment or modification fall in the protection domain of appended claims and equivalent, think that these amendment and modification are contained in the present invention.
Claims (4)
1. a lapping liquid feeder for cmp, is characterized in that, the lapping liquid feeder of described cmp, comprising:
Lapping liquid supply arm, is movably arranged on grinder station, and arranges independently polishing liquid feeding pipe at the interval, side of described lapping liquid supply arm;
Reach, is fixedly installed on the inner side of described lapping liquid supply arm;
Lapping liquid feeding assembly, is slidably arranged on described reach, and for providing lapping liquid, and be optionally applied on grinding pad by described polishing liquid feeding pipe.
2. the lapping liquid feeder of cmp as claimed in claim 1, it is characterized in that, described lapping liquid supply arm is movably arranged on described grinder station and is specially described lapping liquid supply arm by the Plane Rotation of built-in motor along described grinding pad place, and the velocity of rotation of described lapping liquid supply arm is controlled to adjust by described built-in motor.
3. the lapping liquid feeder of cmp as claimed in claim 1, it is characterized in that, the lapping liquid feeder of described cmp comprises control unit further, and described control unit is for controlling the coasting distance of described lapping liquid feeding assembly on described reach.
4. the lapping liquid feeder of cmp as claimed in claim 3, is characterized in that, described control unit adopts machinery or signal of telecommunication mode to realize to the control of the coasting distance of described lapping liquid feeding assembly on described reach.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410422520.1A CN104308744A (en) | 2014-08-26 | 2014-08-26 | Chemical mechanical grinding liquid supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410422520.1A CN104308744A (en) | 2014-08-26 | 2014-08-26 | Chemical mechanical grinding liquid supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104308744A true CN104308744A (en) | 2015-01-28 |
Family
ID=52364127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410422520.1A Pending CN104308744A (en) | 2014-08-26 | 2014-08-26 | Chemical mechanical grinding liquid supply device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104308744A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106607765A (en) * | 2017-01-19 | 2017-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Compact adjustable polishing solution conveying arm and working engineering thereof |
| CN113714927A (en) * | 2021-08-27 | 2021-11-30 | 苏州斯尔特微电子有限公司 | Wafer grinding mechanical grinding process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040198184A1 (en) * | 2001-08-24 | 2004-10-07 | Joslyn Michael J | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
| CN1828840A (en) * | 2005-03-01 | 2006-09-06 | 台湾积体电路制造股份有限公司 | Multipurpose Slurry Dispenser Arm for Chemical Mechanical Polishing |
| WO2010019264A2 (en) * | 2008-08-14 | 2010-02-18 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
| CN103846777A (en) * | 2012-11-29 | 2014-06-11 | 盛美半导体设备（上海）有限公司 | Chemical mechanical grinding device and method |
-
2014
- 2014-08-26 CN CN201410422520.1A patent/CN104308744A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040198184A1 (en) * | 2001-08-24 | 2004-10-07 | Joslyn Michael J | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
| CN1828840A (en) * | 2005-03-01 | 2006-09-06 | 台湾积体电路制造股份有限公司 | Multipurpose Slurry Dispenser Arm for Chemical Mechanical Polishing |
| WO2010019264A2 (en) * | 2008-08-14 | 2010-02-18 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
| CN103846777A (en) * | 2012-11-29 | 2014-06-11 | 盛美半导体设备（上海）有限公司 | Chemical mechanical grinding device and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106607765A (en) * | 2017-01-19 | 2017-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Compact adjustable polishing solution conveying arm and working engineering thereof |
| CN113714927A (en) * | 2021-08-27 | 2021-11-30 | 苏州斯尔特微电子有限公司 | Wafer grinding mechanical grinding process |
| CN113714927B (en) * | 2021-08-27 | 2024-04-09 | 苏州斯尔特微电子有限公司 | Wafer chemical mechanical polishing process |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150128 |
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| RJ01 | Rejection of invention patent application after publication |