CN202702035U - Porous encircling type grinding lubricant supplying system and grinding device - Google Patents
Porous encircling type grinding lubricant supplying system and grinding device Download PDFInfo
- Publication number
- CN202702035U CN202702035U CN 201220218607 CN201220218607U CN202702035U CN 202702035 U CN202702035 U CN 202702035U CN 201220218607 CN201220218607 CN 201220218607 CN 201220218607 U CN201220218607 U CN 201220218607U CN 202702035 U CN202702035 U CN 202702035U
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- grinding
- division board
- lapping liquid
- partition plate
- supply system
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a porous encircling type grinding lubricant supplying system and a grinding device. The porous encircling type grinding lubricant supplying system comprises a supplying pipe, a circulating pipe, and a partition plate. The partition plate is arranged on part of the periphery of a grinding platform. A plurality of small holes are arranged on the side wall, opposite to the grinding platform, of the partition plate. The partition plate is a hollow structure. The small holes are communicated with the interior hollow space of the partition plate. The supplying pipe is connected with one end of the partition plate and communicated with the interior hollow space of the partition plate. The two ends of the circulating pipe are connected with the two ends of the partition plate. The circulating pipe and the interior hollow space of the partition plate form a loop. The presence of the partition plate prevents grinding lubricant from splashing during the grinding process to cause pollution to other chemical mechanical grinding systems; and through the design of the hollow structure and the multiple holes of the partition plate, the grinding lubricant can be distributed uniformly; and by utilizing the circulating pipe, the function of saving the grinding lubricant can be effectively realized.
Description
Technical field
The utility model relates to the cmp technical field in the semiconductor manufacturing, relates in particular to the lapping liquid supply system in a kind of cmp.
Background technology
Cmp (CMP) not only is used at the wafer preparatory phase as requisite one technique in the chip manufacture, and also is used to do the crystal column surface global planarization in the wafer machining process.Chemical mechanical milling method mainly is to utilize the mechanical polishing principle, the planarization that the chemical assistant in the cooperation lapping liquid and the yo-yo profile of chip surface height are polished.The parameter control of the various processing procedures of one highest wisdom is suitable, cmp can provide and be polished the surface and reach flatness more than 94%, but the development along with semicon industry, the integrated circuit manufacturing industry development is rapid, and cmp also is faced with more and more higher challenge as indispensable one technique in the chip manufacture.
Please refer to Fig. 1, it is the schematic diagram of existing chemical machinery polishing system.The existing machinery grinding system comprises at least: grinding head 101, grinding plate 102, grinding pad (not shown), lapping liquid supply system 103 and lapping liquid 104, described grinding pad is located at the upper surface of grinding plate, described lapping liquid supply system 103 is the pipeline of a transmission lapping liquid 104, and the opening of pipeline is suspended from grinding plate 102 tops.The wafer (not shown) that needs to grind is adsorbed on grinding head 101 bottoms, when pinning grinding head 101 downwards, wafer is close to grinding pad, in process of lapping, grinding plate 102 is to same direction rotation, and lapping liquid 104 is transported on the grinding pad by lapping liquid supply system 101.
Because existing lapping liquid supply system is the pipeline of fixed position, so that the lapping liquid 104 of supply concentrates stream in a fixed position of grinding pad 102, thereby cause lapping liquid 104 to be distributed on the grinding pad 102 by Quick uniform, be unfavorable for the grinding of crystal column surface.In addition, in process of lapping, when grinding plate drives grinding pad 102 rotation, because the effect of centrifugal force, lapping liquid can sputter grinding pad, will obviously cause the waste of lapping liquid 104, thereby increase production cost, simultaneously, near other chemical machinery polishing systems the lapping liquid 104 that sputters can pollute.
The utility model content
The technical problems to be solved in the utility model is, a kind of new lapping liquid supply system is provided, and can guarantee the even distribution of lapping liquid, can prevent again the adverse consequences of splashing and bringing of lapping liquid everywhere.
In order to address the above problem, the utility model provides a porous circulating type lapping liquid supply system, comprise supply pipe, circulation pipe and division board, described division board is arranged at the part peripheral region of described grinding plate, relatively offer some apertures on the sidewall of grinding plate on the described division board, described division board is hollow structure, described aperture is communicated with the inner hollow space of division board, described supply pipe is connected in an end of described division board and is communicated with the inner hollow space of division board, the two ends of described circulation pipe are connected in the two ends of described division board, and the inner hollow space of described circulation pipe and described division board forms a loop.
Preferably, in above-mentioned porous circulating type lapping liquid supply system, described division board and grinding plate interval arrange.
Preferably, in above-mentioned porous circulating type lapping liquid supply system, described division board is arc-shaped structure.
Preferably, in above-mentioned porous circulating type lapping liquid supply system, described aperture arranges along the circumferential interval of described division board.
Preferably, in above-mentioned porous circulating type lapping liquid supply system, described supply pipe is connected in an end of described division board by the first port.
Preferably, in above-mentioned porous circulating type lapping liquid supply system, the two ends of described circulation pipe are connected in respectively the two ends of described division board by the second port and the 3rd port.
Preferably, in above-mentioned porous circulating type lapping liquid supply system, also be provided with adjuster on the described grinding pad, the quantity of described aperture is four, two relative grinding head settings in the described aperture, two other relatively described adjuster setting.
The utility model also provides a kind of lapping device, comprise grinding head, grinding plate and grinding pad, described grinding pad is layed on the described grinding plate, and described grinding head is arranged on the described grinding pad, also comprises described porous circulating type lapping liquid supply system.
The porous circulating type lapping liquid supply system that the utility model provides can avoid the lapping liquid that sputters in the process of lapping to the pollution of other grinding systems by division board is set; By the hollow structure of division board and the design of porous, realized the even distribution of lapping liquid; By the use of circulation pipe, effectively played the effect of saving lapping liquid.
Description of drawings
Accompanying drawing 1 is the schematic diagram of chemical machinery polishing system in the prior art;
Accompanying drawing 2 is schematic diagrames of the chemical machinery polishing system of the utility model embodiment.
Among the figure, the 101-grinding head; The 102-grinding plate; 103-lapping liquid supply system; The 104-lapping liquid;
The 300-grinding plate; The 301-grinding head; The 302-adjuster; The 303-division board; The 304-supply pipe; 305,306,307,308-hole; The 309-input; The 310-output; The 311-circulation pipe; 312-the first port; 313-the second port; 314-the 3rd port; The 315-motion arm.
The specific embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, below in conjunction with accompanying drawing the specific embodiment of the present invention is described in detail.
See also Fig. 2, present embodiment provides a kind of porous circulating type lapping liquid supply system, and a kind of lapping device is provided simultaneously.
Described lapping device comprises grinding head 301, grinding plate 300, lapping liquid (not shown), grinding pad (not shown), adjuster 302, motion arm 315 and porous circulating type lapping liquid supply system.
Grinding pad is layed on the described grinding plate 300, and grinding head 301 is arranged on the described grinding pad.During grinding, described porous circulating type lapping liquid supply system provides described lapping liquid, during grinding plate 300 rotation, grinding pad is thereupon rotation also, grinding head 301 does not rotate with grinding pad with wafer, and wafer adsorption is pinned grinding head 101 downwards in the bottom of grinding head 301, wafer is close to grinding pad, thereby can grind wafer.
Described adjuster 302 under 315 controls of described motion arm in described grinding mat exercises.Help lapping liquid on grinding pad, evenly to distribute.
Described porous circulating type grinds supply system and comprises supply pipe 304, circulation pipe 311 and division board 303, and described division board 303 is arranged at the part peripheral region of described grinding plate 300, and described division board 303 is arc-shaped structures.
Described division board 303 arranges with grinding plate 300 intervals.When grinding plate 300 rotation, 303 maintenances of division board are static.Division board 303 is located between the different chemical machinery polishing systems, thereby having prevented effectively that lapping liquid on the grinding plate 300 from splashing out pollutes other chemical machinery polishing systems, the consumption of also effectively having saved lapping liquid simultaneously.
The two ends of described circulation pipe 311 are connected in the two ends of described division board 303, and the inner hollow space of described circulation pipe 311 and described division board 303 forms a loop.The two ends of described circulation pipe 311 are connected in respectively the two ends of described division board 303 by the second port 313 and the 3rd port 314.The output 310 of circulation pipe 311 is connected by the second port 313 with described division board 303, described the second port 313 is positioned at the below of described the first port 312, the input 309 of circulation pipe 311 is connected by the 3rd port 314 with described division board 303, the inner space of circulation pipe 311 is communicated with the 3rd port 314 by the second port 313 with the inner hollow space of described division board 303, so that lapping liquid can flow into circulation pipe 311 from division board 303, flow back to division board 303 from circulation pipe 311 again, thereby finish recycling of lapping liquid, improve the utilization rate of lapping liquid, the consumption of effectively saving lapping liquid.
Relatively offer some apertures on the sidewall of grinding plate 300 on the described division board 303, described aperture is communicated with the inner hollow space of division board 303.In the present embodiment, described division board 303 is provided with four holes 305,306,307 and 308, four apertures are connected respectively to division board 303 inner hollow spaces, so that lapping liquid can be from four orifice flows to the grinding pad that is located on the grinding plate 300, thereby so that lapping liquid can more be evenly distributed in grinds on the grinding pad.
In sum, the porous circulating type lapping liquid supply system that the utility model provides can avoid the lapping liquid that sputters in the process of lapping to the pollution of other grinding systems by division board is set; By the hollow structure of division board and the design of porous, realized the even distribution of lapping liquid; By the use of circulation pipe, effectively played the effect of saving lapping liquid.
Claims (8)
1. porous circulating type lapping liquid supply system, it is characterized in that: comprise supply pipe, circulation pipe and division board, described division board is arranged at the part peripheral region of described grinding plate, relatively offer some apertures on the sidewall of grinding plate on the described division board, described division board is hollow structure, described aperture is communicated with the inner hollow space of division board, described supply pipe is connected in an end of described division board and is communicated with the inner hollow space of division board, the two ends of described circulation pipe are connected in the two ends of described division board, and the inner hollow space of described circulation pipe and described division board forms a loop.
2. porous circulating type lapping liquid supply system as claimed in claim 1 is characterized in that: described division board and the setting of grinding plate interval.
3. porous circulating type lapping liquid supply system as claimed in claim 1, it is characterized in that: described division board is arc-shaped structure.
4. porous circulating type lapping liquid supply system as claimed in claim 1 is characterized in that: described aperture arranges along the circumferential interval of described division board.
5. porous circulating type lapping liquid supply system as claimed in claim 1, it is characterized in that: described supply pipe is connected in an end of described division board by the first port.
6. porous circulating type lapping liquid supply system as claimed in claim 1, it is characterized in that: the two ends of described circulation pipe are connected in respectively the two ends of described division board by the second port and the 3rd port.
7. porous circulating type lapping liquid supply system as claimed in claim 1, it is characterized in that: also be provided with adjuster on the described grinding pad, the quantity of described aperture is four, two relative grinding head settings in the described aperture, two other relatively described adjuster setting.
8. lapping device, comprise grinding head, grinding plate and grinding pad, described grinding pad is layed on the described grinding plate, and described grinding head is arranged on the described grinding pad, it is characterized in that: also comprise such as the described porous circulating type of any one lapping liquid supply system among the claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220218607 CN202702035U (en) | 2012-05-15 | 2012-05-15 | Porous encircling type grinding lubricant supplying system and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220218607 CN202702035U (en) | 2012-05-15 | 2012-05-15 | Porous encircling type grinding lubricant supplying system and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202702035U true CN202702035U (en) | 2013-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220218607 Expired - Fee Related CN202702035U (en) | 2012-05-15 | 2012-05-15 | Porous encircling type grinding lubricant supplying system and grinding device |
Country Status (1)
| Country | Link |
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| CN (1) | CN202702035U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878680A (en) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | Method for reducing wafer scratch, chemical machine grinding machine platform and cleaner |
| JP2015120229A (en) * | 2013-12-25 | 2015-07-02 | 国立大学法人九州大学 | Workpiece polishing device |
| CN105033864A (en) * | 2015-07-28 | 2015-11-11 | 厦门鼎运软件有限公司 | Polishing machine |
| CN106312795A (en) * | 2015-07-01 | 2017-01-11 | 不二越机械工业株式会社 | Polishing apparatus |
| CN108237467A (en) * | 2016-12-23 | 2018-07-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of processing method of grinding pad |
| CN110666678A (en) * | 2019-09-23 | 2020-01-10 | 黄建中 | Chemical mechanical planarization equipment |
-
2012
- 2012-05-15 CN CN 201220218607 patent/CN202702035U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015120229A (en) * | 2013-12-25 | 2015-07-02 | 国立大学法人九州大学 | Workpiece polishing device |
| CN103878680A (en) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | Method for reducing wafer scratch, chemical machine grinding machine platform and cleaner |
| CN106312795A (en) * | 2015-07-01 | 2017-01-11 | 不二越机械工业株式会社 | Polishing apparatus |
| CN105033864A (en) * | 2015-07-28 | 2015-11-11 | 厦门鼎运软件有限公司 | Polishing machine |
| CN108237467A (en) * | 2016-12-23 | 2018-07-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of processing method of grinding pad |
| CN108237467B (en) * | 2016-12-23 | 2020-10-02 | 中芯国际集成电路制造(上海)有限公司 | Method for processing grinding pad |
| CN110666678A (en) * | 2019-09-23 | 2020-01-10 | 黄建中 | Chemical mechanical planarization equipment |
| CN110666678B (en) * | 2019-09-23 | 2021-06-15 | 黄建中 | Chemical mechanical planarization equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130524 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130524 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130130 Termination date: 20180515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |