CN201960447U - Chemical mechanical polishing equipment - Google Patents
Chemical mechanical polishing equipment Download PDFInfo
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- CN201960447U CN201960447U CN2010206445701U CN201020644570U CN201960447U CN 201960447 U CN201960447 U CN 201960447U CN 2010206445701 U CN2010206445701 U CN 2010206445701U CN 201020644570 U CN201020644570 U CN 201020644570U CN 201960447 U CN201960447 U CN 201960447U
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- grinding
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010206445701U CN201960447U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical polishing equipment |
Applications Claiming Priority (1)
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CN2010206445701U CN201960447U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical polishing equipment |
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CN201960447U true CN201960447U (en) | 2011-09-07 |
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CN2010206445701U Expired - Fee Related CN201960447U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical polishing equipment |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105364699A (en) * | 2014-07-25 | 2016-03-02 | 中芯国际集成电路制造(上海)有限公司 | A chemical mechanical polishing method and a chemical mechanical polishing apparatus |
CN105479325A (en) * | 2015-12-30 | 2016-04-13 | 天通吉成机器技术有限公司 | Partition pressing device and method suitable for large single-face grinding polishing device |
CN106415797A (en) * | 2014-06-05 | 2017-02-15 | 应用材料公司 | Method and system for real-time polishing recipe control |
CN107344327A (en) * | 2017-05-05 | 2017-11-14 | 清华大学 | In the method for improved wire flatness of wafer surface |
CN109676527A (en) * | 2018-12-13 | 2019-04-26 | 中国科学院上海光学精密机械研究所 | The accurate automatic dripping device of small abrasive nose polishing machine special-purpose polishing liquid |
CN113814860A (en) * | 2021-08-15 | 2021-12-21 | 江苏本川智能电路科技股份有限公司 | Copper surface treatment equipment before solder resist and processing method thereof |
CN116810639A (en) * | 2023-07-28 | 2023-09-29 | 苏州博宏源机械制造有限公司 | Diamond liquid filling mechanism and grinding device |
-
2010
- 2010-12-06 CN CN2010206445701U patent/CN201960447U/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106415797A (en) * | 2014-06-05 | 2017-02-15 | 应用材料公司 | Method and system for real-time polishing recipe control |
CN105364699A (en) * | 2014-07-25 | 2016-03-02 | 中芯国际集成电路制造(上海)有限公司 | A chemical mechanical polishing method and a chemical mechanical polishing apparatus |
CN105479325A (en) * | 2015-12-30 | 2016-04-13 | 天通吉成机器技术有限公司 | Partition pressing device and method suitable for large single-face grinding polishing device |
CN105479325B (en) * | 2015-12-30 | 2018-04-17 | 天通吉成机器技术有限公司 | A kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment |
CN107344327A (en) * | 2017-05-05 | 2017-11-14 | 清华大学 | In the method for improved wire flatness of wafer surface |
CN107344327B (en) * | 2017-05-05 | 2019-11-22 | 清华大学 | In the method for improved wire flatness of wafer surface |
CN109676527A (en) * | 2018-12-13 | 2019-04-26 | 中国科学院上海光学精密机械研究所 | The accurate automatic dripping device of small abrasive nose polishing machine special-purpose polishing liquid |
CN113814860A (en) * | 2021-08-15 | 2021-12-21 | 江苏本川智能电路科技股份有限公司 | Copper surface treatment equipment before solder resist and processing method thereof |
CN116810639A (en) * | 2023-07-28 | 2023-09-29 | 苏州博宏源机械制造有限公司 | Diamond liquid filling mechanism and grinding device |
CN116810639B (en) * | 2023-07-28 | 2024-05-10 | 苏州博宏源机械制造有限公司 | Diamond liquid filling mechanism and grinding device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130326 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130326 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20181206 |
|
CF01 | Termination of patent right due to non-payment of annual fee |