CN105479325B - A kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment - Google Patents
A kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment Download PDFInfo
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- CN105479325B CN105479325B CN201511011304.9A CN201511011304A CN105479325B CN 105479325 B CN105479325 B CN 105479325B CN 201511011304 A CN201511011304 A CN 201511011304A CN 105479325 B CN105479325 B CN 105479325B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The present invention relates to a kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment, including the subregion pressue device connection control mechanism of outer ring pressing mechanism and inner ring pressing mechanism, control mechanism connection pneumatic mechanism；Outer ring pressing mechanism includes the cylinder being connected with pneumatic mechanism, and cylinder is connected by the first transmission mechanism with grinding and polishing component；Inner ring pressing mechanism includes the swivel joint being connected with pneumatic mechanism, and swivel joint is connected with the second transmission mechanism inside the first transmission mechanism, and the second transmission mechanism connection center abrasive sheet, center abrasive sheet is movably arranged on grinding and polishing component bottom center.The outer ring pressing mechanism entire pressurisation of the present invention, inner ring pressing mechanism completes core pressurization, diameter difference is avoided to cause the situation of whole disk wafer uniformity difference occur when linear velocity is different, outer on ceramic disk, inner ring finished product wafer uniformity height, grinding and polishing precision is high, production efficiency greatly promotes, and the qualification rate of finished product increases significantly.
Description
Technical field
It is more particularly to a kind of to utilize the invention belongs to the technical field of the lathe for being ground or polishing, device or technique
The pressure of abrasive body diverse location is controlled, the thickness of finished workpart after grinding and polishing is realized by the pressure differential block
Uniformly, the good subregion pressue device and method suitable for large-scale single side polishing grinding equipment of uniformity.
Background technology
Single side polishing grinding equipment is high-precision plane machining equipment, it has the essence that high-strength mechanical is constructed and stablized
Degree, be mainly used as quartz crystal slice, silicon, germanium wafer, glass, potsherd, piston ring, valve plate, valve block, bearing, molybdenum sheet, sapphire and
Various sheet metals and other disk part by performing, the single side grinding and polishing of non-metal workpiece.
At present, small-sized single side polishing grinding equipment, generally using the rising of single cylinder control grinding polisher head, declines
With the pressurization to grinding polisher head, and due on the ceramic disk of small-sized polishing grinding equipment, the quantity of chip often only has 1-2
Circle, and the diameter of ceramic disk itself is again smaller, so while the diameter difference of ceramic disk and the conformity error that produces can neglect
Slightly disregard.
But in the prior art, the requirement for single side polishing grinding equipment is higher and higher, for product demand also
Very big, this certainly will need to fulfil assignment using large-scale polishing grinding equipment, but according to identical Technology application big
On type polishing grinding equipment, during the work time, the grinding and polishing of chip passes through between grinding and polishing component and lower abrasive disk
Relative motion realizes that when the diameter on ceramic disk is different, linear velocity can increase with becoming larger for diameter, so as to can make
There is the phenomenon that the chip in ceramic disk internal layer is thick, the chip of outer layer is thin in the chip for obtaining final finished, have impact on whole disk chip
Uniformity, the diameter difference of ceramic disk is bigger, the conformity error of grinding and polishing will bigger, seriously affect grinding and polishing essence
Degree, reduces production efficiency, and disqualification rate greatly promotes.
The content of the invention
Present invention solves the technical problem that be, due in the prior art, during large-scale polishing grinding equipment works,
The grinding and polishing of chip realized by relative motion between grinding and polishing component and lower abrasive disk, when the diameter on ceramic disk not
When same, linear velocity can increase with becoming larger for diameter, caused by the chip of final finished occur in the ceramic disk
The phenomenon that the chip of layer is thick, the chip of outer layer is thin, have impact on the uniformity of whole disk chip, and the diameter difference of ceramic disk is bigger, grinding
The conformity error of polishing will bigger, seriously affect grinding and polishing precision, reduce production efficiency, what disqualification rate greatly promoted
Problem, and then provide the subregion pressue device and method suitable for large-scale single side polishing grinding equipment of a kind of optimization.
The technical solution adopted in the present invention, which is that a kind of subregion suitable for large-scale single side polishing grinding equipment pressurizes, to be filled
Put, the polishing grinding equipment includes the control mechanism being connected with the subregion pressue device, and the subregion pressue device includes
Outer ring pressing mechanism and inner ring pressing mechanism, the control mechanism are connected with pneumatic mechanism；The outer ring pressing mechanism include with
The cylinder of the pneumatic mechanism connection, the grinding and polishing group that the cylinder passes through the first transmission mechanism and the polishing grinding equipment
Part connects；The inner ring pressing mechanism includes the swivel joint being connected with the pneumatic mechanism, and the swivel joint is with being arranged on institute
The second transmission mechanism connection inside the first transmission mechanism is stated, second transmission mechanism is connected to center abrasive sheet, in described
Heart abrasive sheet is movably arranged on the bottom centre of the grinding and polishing component.
Preferably, first transmission mechanism includes connecting seat connected in sequence with the cylinder and splined shaft, the flower
Spline housing is equipped with the outside of key axis, the spline housing is connected with the grinding and polishing component.
Preferably, second transmission mechanism includes central shaft connected in sequence with the swivel joint and some guide shafts,
The central axis is arranged in splined shaft, and the guide shaft is connected to center abrasive sheet and is uniformly distributed on the abrasive sheet of center.
Preferably, the connecting seat includes limited block, and the limited block is arranged on above the splined shaft.
Preferably, the pneumatic mechanism include source of the gas, 1 three position five-way valve being connected with the cylinder and 1 with it is described
First pressure reducing valve of swivel joint connection, the source of the gas are connected by gas circuit and the three position five-way valve and the first pressure reducing valve respectively
Connect.
Preferably, the three position five-way valve includes declining solenoid valve and rises solenoid valve, the decline solenoid valve and rising
Solenoid valve is connected to source of the gas by gas circuit respectively, and the second decompression is additionally provided with the gas circuit for declining solenoid valve and being connected with source of the gas
Valve, second pressure reducing valve are connected with the first proportioning valve, and first proportioning valve is connected to source of the gas by gas circuit.
Preferably, the decline solenoid valve and rising solenoid valve are connected to noise elimination mechanism.
Preferably, first pressure reducing valve is also associated with the second proportioning valve, and second proportioning valve is connected to by gas circuit
Source of the gas.
Preferably, some sensors are provided with the cylinder, the sensor is close to switch.
A kind of subregion pressure method of subregion pressue device using suitable for large-scale polishing grinding equipment, the method bag
Include following steps：
Step 1：It is all resting state to decline solenoid valve at this time and rise solenoid valve, and three position five-way valve is in balanced mode,
The gas circuit of five mouths is all closed, and gas circuit will not be subject to air pressure up or down, grinding and polishing without connection source of the gas, cylinder
Component remains stationary as；
Step 2：Rise solenoid valves work, decline solenoid valve in a dormant state, three position five-way valve, which enters, rises work
Operation mode, the gas circuit risen between solenoid valve and source of the gas are connected, and the gas circuit between three position five-way valve and cylinder is connected, and are declined solenoid valve and are connected
Be connected to the exhaust of noise elimination mechanism, cylinder is up pushed up at this time air pressure and move upwards, drive grinding and polishing component to reach connection
Limes superiors home is reached during the limited block of seat to stop；
Step 3：After being put into polishing workpiece to be ground, decline solenoid valves work, rise solenoid valve and be in dormancy shape
State, three position five-way valve, which enters, declines operating mode, and the gas circuit declined between solenoid valve and source of the gas is connected, between three position five-way valve and cylinder
Gas circuit connect, gas circuit between the second pressure reducing valve and the first proportioning valve and source of the gas, which is connected, carries out gas circuit adjusting, rises solenoid valve and connects
The exhaust of noise elimination mechanism is connected to, cylinder is subject to air pressure and drives grinding and polishing component downward, up to grinding and polishing component a to positioning
Put, sensor feedback signal to control mechanism, cylinder stops driving, and grinding and polishing component stops declining；
Step 4：When sensor detects the down position of grinding and polishing component, the second pressure reducing valve and the first proportioning valve
The gas circuit adjusting mechanism of composition starts to control gas circuit flow, is gradually reduced it, the grinding polisher head following table of grinding and polishing component
Face is slowly dropped to be contacted with polishing workpiece to be ground, and subsequently into automatic grind polishing state, second subtracts during grinding and polishing
The processing of pressure valve and the gas circuit adjusting mechanism moment control throughput of the first proportioning valve composition until completing polishing workpiece to be ground；
Step 5：When step 4 reaches it is stable when, connect the first pressure reducing valve and the second proportioning valve composition regulating device with
Gas circuit between source of the gas, the first pressure reducing valve directly act on swivel joint, and control gas circuit flow acts on central shaft, thrown arranged on grinding
The center abrasive sheet pressure increase at optical assembly center, the center for treating grinding and polishing workpiece carries out pressure grinding polishing；
Step 6：Grinding and polishing terminates, and rises solenoid valves work, declines solenoid valve in a dormant state, three five
Port valve, which enters, rises operating mode, and the gas circuit risen between solenoid valve and source of the gas is connected, and the gas circuit between three position five-way valve and cylinder connects
It is logical, decline solenoid valve and be connected to the exhaust of noise elimination mechanism, close the regulating device and gas of the first pressure reducing valve and the second proportioning valve composition
Gas circuit between source, cylinder is up pushed up at this time air pressure and move upwards, drive grinding and polishing component to reach the limit of connecting seat
Limes superiors home is reached during the block of position to stop.
The present invention provides the subregion pressue device and method suitable for large-scale single side polishing grinding equipment of a kind of optimization,
By the way that subregion pressue device is arranged to outer ring pressing mechanism and inner ring pressing mechanism, outer ring pressing mechanism drives the by cylinder
One transmission mechanism moves and acts on the grinding and polishing component of polishing grinding equipment, carries out the pressurization in entire scope, and inner ring adds
Press mechanism is driven the second transmission mechanism being arranged on inside the first transmission mechanism and acted on by swivel joint is located at grinding and polishing
The center abrasive sheet at component center, that is, complete the pressurization of center part area, and the diameter difference avoided on ceramic disk causes
The situation of the uniformity difference for the whole disk chip that linear velocity occurs when different, by adjusting the pressure differential of different zones, realizes ceramics
The uniformity of the finished product chip of outer ring and inner ring is high on disk, and grinding and polishing precision is high, and production efficiency greatly promotes, the qualification of finished product
Rate increases significantly.
Brief description of the drawings
Fig. 1 is the section view figure structure schematic representation of the subregion pressue device of the present invention；
Fig. 2 is the gas circuit structure of the outer ring pressing mechanism of the present invention, and location A is air inlet position, and B location is to drive cylinder down
Gas circuit, location of C is to drive the gas circuit of cylinder up, and D positions are ratio valve regulation gas circuit；
Fig. 3 is the gas circuit structure of the inner ring pressing mechanism of the present invention, and E positions and F positions are air inlet position, and G positions are inner ring
The gas outlet of pressurization.
Embodiment
The present invention is described in further detail with reference to embodiment, but protection scope of the present invention is not limited to
This.
As shown in the figure, the present invention relates to a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment, it is described
Polishing grinding equipment includes the control mechanism being connected with the subregion pressue device, and the subregion pressue device pressurizes including outer ring
Mechanism and inner ring pressing mechanism, the control mechanism are connected with pneumatic mechanism；The outer ring pressing mechanism include with it is described pneumatic
The cylinder 1 of mechanism connection, the cylinder 1 are connected by the grinding and polishing component 2 of the first transmission mechanism and the polishing grinding equipment
Connect；The inner ring pressing mechanism includes the swivel joint 3 being connected with the pneumatic mechanism, and the swivel joint 3 is described with being arranged on
The second transmission mechanism connection inside first transmission mechanism, second transmission mechanism is connected to center abrasive sheet 2-1, in described
Heart abrasive sheet 2-1 is movably arranged on the bottom centre of the grinding and polishing component 2.
In the present invention, polishing grinding equipment includes the control mechanism being connected with subregion pressue device, subregion pressue device bag
Outer ring pressing mechanism and inner ring pressing mechanism are included, control mechanism is connected with pneumatic mechanism, i.e., is controlled in the present invention by control mechanism
Pneumatic mechanism manipulates the pressure grinding polishing operation of outer ring pressing mechanism and the workpiece of inner ring pressing mechanism completion different zones.
In the present invention, outer ring pressing mechanism includes the cylinder 1 being connected with pneumatic mechanism, and cylinder 1 passes through the first transmission mechanism
It is connected with the grinding and polishing component 2 of polishing grinding equipment, inner ring pressing mechanism includes the swivel joint 3 being connected with pneumatic mechanism,
Swivel joint 3 is connected with the second transmission mechanism inside the first transmission mechanism, and the second transmission mechanism is connected to center grinding
Plate 2-1, center abrasive sheet 2-1 are movably arranged on the center of grinding and polishing component 2；Outer ring pressurization is completed by the effect of cylinder 1, gas
When cylinder 1 moves up and down, the first transmission mechanism also moves up and down, so that drive whole grinding and polishing component 2 to move up and down,
And after grinding and polishing component 2 is contacted with the lower abrasive disk of equipment, if cylinder 1 continues to pressurize, pressure transmission is thrown to grinding
At the grinding polisher head 2-2 of optical assembly 2, the scope of pressure is in the outer collar region of whole grinding and polishing component 2, so as to fulfill grinding
The outer ring pressurization of grinding and polishing optical assembly 2；Inner ring be pressurised into gas among gas circuit import, by swivel joint 3 after, air pressure passes through
Second transmission mechanism is transferred to center abrasive sheet 2-1, and center abrasive sheet 2-1 increases downwards the pressure in contact area, and realization is ground
The inner ring pressurization of grinding and polishing optical assembly 2.
First transmission mechanism includes connecting seat 4 connected in sequence with the cylinder 1 and splined shaft 5, the splined shaft 5
Outside is equipped with spline housing 6, and the spline housing 6 is connected with the grinding and polishing component 2.
Second transmission mechanism includes central shaft 7 connected in sequence with the swivel joint 3 and some guide shafts 8, described
With being located in splined shaft 5, the guide shaft 8 is connected to center abrasive sheet 2-1 and is uniformly distributed in center abrasive sheet 2- central shaft 7
On 1.
In the present invention, the first transmission mechanism includes connecting seat 4 connected in sequence with cylinder 1 and splined shaft 5, outside splined shaft 5
Side is equipped with spline housing 6, and spline housing 6 is connected with grinding and polishing component 2, i.e., cylinder 1 acts on spline by connecting seat 4
Pressure is acted on spline housing 6 by axis 5, splined shaft 5 by the mating reaction with spline housing 6, and grinding and polishing group is driven by spline housing 6
Part 2 moves up and down and transmits pressure.
In the present invention, the second transmission mechanism includes central shaft 7 connected in sequence with swivel joint 3 and guide shaft 8, guide shaft 8 connect
Center abrasive sheet 2-1 is connected to, i.e., air pressure is passed through by swivel joint 3 acts on central shaft 7, and central shaft 7 acts on guide shaft 8, leads
Axis 8 directly acts on center abrasive sheet 2-1, and pressure grinding throwing is carried out for the polishing workpiece to be ground of lower abrasive disk center
Light.
In the present invention, central shaft 7 ensure that the workpiece of the same area completes grinding and polishing with being located in splined shaft 5
After the problem of being not in the out-of-flatness of grinding and polishing face.
In the present invention, guide shaft 8 is uniformly distributed on the abrasive sheet 2-1 of center, ensure that the workpiece of the same area is completed to grind
The problem of being not in the out-of-flatness of grinding and polishing face after grinding and polishing light.
The connecting seat 4 includes limited block 9, and the limited block 9 is arranged on the top of splined shaft 5.
In the present invention, limited block 9 is set on connecting seat 4 so that splined shaft 5 can be by limited block during rising
9 progress are spacing, and limes superiors home is reached when subregion pressue device rises to stop, and ensure the normal of grinding and polishing work
Safety carries out.
The pneumatic mechanism includes source of the gas, 1 three position five-way valve 10 being connected with the cylinder 1 and 1 and the rotation
The first pressure reducing valve 11 that connector 3 connects, the source of the gas pass through gas circuit and 10 and first pressure reducing valve 11 of three position five-way valve respectively
Connection.
In the present invention, pneumatic mechanism includes source of the gas, 10 and first pressure reducing valve 11 of three position five-way valve, three position five-way valve 10 and gas
Cylinder 1 connects, and is mainly used for controlling the normal work of outer ring pressing mechanism, and the first pressure reducing valve 11 is connected with swivel joint 3, main to use
In the normal work of control inner ring pressing mechanism.
The three position five-way valve 10 includes declining solenoid valve 12 and rises solenoid valve 13, described to decline solenoid valve 12 and rise
Solenoid valve 13 is connected to source of the gas by gas circuit respectively, and being additionally provided with second in the gas circuit for declining solenoid valve 12 and being connected with source of the gas subtracts
Pressure valve 14, second pressure reducing valve 14 are connected with the first proportioning valve 15, and first proportioning valve 15 is connected to source of the gas by gas circuit.
In the present invention, three position five-way valve 10 includes declining solenoid valve 12 and rises solenoid valve 13, is respectively used to control cylinder 1
The down or up control operation of subregion pressue device is completed, wherein, decline solenoid valve 12 and be also sequentially connected with the second pressure reducing valve
14th, the first proportioning valve 15 and source of the gas, the second pressure reducing valve 14 and the first proportioning valve 15 are used to adjust gas circuit flow, timely tonifying Qi or subtract
Gas, ensure that being normally carried out for pressurized operation.
The decline solenoid valve 12 and rising solenoid valve 13 are connected to noise elimination mechanism.
In the present invention, noise elimination mechanism plays auxiliary and declines solenoid valve 12 and rise solenoid valve 13 by gas export gas circuit and drop
The device of low outlet sound, under normal circumstances, noise elimination mechanism could be provided as the filter screen at air guide port.
First pressure reducing valve 11 is also associated with the second proportioning valve 16, and second proportioning valve 16 is connected to gas by gas circuit
Source.
In the present invention, the first pressure reducing valve 11, the second proportioning valve 16 and source of the gas are sequentially connected with, the first pressure reducing valve 11 and the second ratio
Example valve 16 increases the pressure of center abrasive sheet 2-1 by controlling gas circuit flow, makes to be placed in grinding and polishing device inner circle area
Polishing workpiece to be ground obtain sufficient grinding and polishing, ensure that the uniformity of grinding and polishing.
Some sensors are provided with the cylinder 1, the sensor is close to switch.
In the present invention, 3 sensors are generally set, sensor generally completes sensing operations using close to switch on cylinder 1.
In the present invention, 3 on cylinder 1 are respectively arranged at 2 stroke limit positions of cylinder 1 and by specific close to switch
The middle shift position that is set according to actual conditions of operating personnel.
Below in conjunction with the operating mode of the further clearly subregion pressue device of the present invention of method.
A kind of subregion pressure method of subregion pressue device using suitable for large-scale polishing grinding equipment, the method bag
Include following steps：
Step 1：It is all resting state to decline solenoid valve 12 at this time and rise solenoid valve 13, and three position five-way valve 10 is in flat
Weighing apparatus pattern, the gas circuit of five mouths are all closed, and gas circuit will not be subject to air pressure up or down without connection source of the gas, cylinder 1,
Grinding and polishing component 2 remains stationary as；
Step 2：Rise 13 energization work of solenoid valve, decline solenoid valve 12 in a dormant state, three position five-way valve 10 enters
Rising operating mode, the gas circuit risen between solenoid valve 13 and source of the gas is connected, and the gas circuit between three position five-way valve 10 and cylinder 1 is connected,
Decline solenoid valve 12 and be connected to the exhaust of noise elimination mechanism, cylinder 1 is up pushed up at this time air pressure and move upwards, drive grinding to throw
Limes superiors home is reached when optical assembly 2 reaches the limited block 9 of connecting seat 4 to stop；
Step 3：After being put into polishing workpiece to be ground, decline 12 energization work of solenoid valve, rise solenoid valve 13 and be in dormancy
State, three position five-way valve 10, which enters, declines operating mode, and the gas circuit declined between solenoid valve 12 and source of the gas is connected, three position five-way valve 10
Gas circuit between cylinder 1 is connected, and the gas circuit between the second pressure reducing valve 14 and the first proportioning valve 15 and source of the gas, which is connected, carries out gas circuit adjusting,
Rise solenoid valve 13 and be connected to the exhaust of noise elimination mechanism, cylinder 1 is subject to air pressure and drives grinding and polishing component 2 downward, until grinding
Polishing assembly 2 to certain position, sensor feedback signal to control mechanism, cylinder 1 stops driving, and grinding and polishing component 2 stops
Decline；
Step 4：When sensor detects the down position of grinding and polishing component 2, the second pressure reducing valve 14 and the first ratio
The gas circuit adjusting mechanism that valve 11 forms starts to control gas circuit flow, is gradually reduced it, the grinding polisher head of grinding and polishing component 2
2-2 lower surfaces are slowly dropped to be contacted with polishing workpiece to be ground, subsequently into automatic grind polishing state, during grinding and polishing
The gas circuit adjusting mechanism moment control throughput of second pressure reducing valve 14 and the first proportioning valve 15 composition is until completing polishing to be ground
The processing of workpiece；
Step 5：When step 4 reaches it is stable when, connect the first pressure reducing valve 11 and the second proportioning valve 16 composition adjusting dress
The gas circuit between source of the gas is put, the first pressure reducing valve 11 directly acts on swivel joint 3, and control gas circuit flow acts on central shaft 7, if
Center abrasive sheet 2-1 pressure increase in 2 center of grinding and polishing component, the center for treating grinding and polishing workpiece is pressurizeed
Grinding and polishing；
Step 6：Grinding and polishing terminates, and rises 13 energization work of solenoid valve, declines solenoid valve 12 in a dormant state, and three
Position five-way valve 10, which enters, rises operating mode, and the gas circuit risen between solenoid valve 13 and source of the gas is connected, three position five-way valve 10 and cylinder 1
Between gas circuit connect, decline solenoid valve 12 and be connected to the exhaust of noise elimination mechanism, close 16 groups of the first pressure reducing valve 11 and the second proportioning valve
Into regulating device and source of the gas between gas circuit, cylinder 1 is up pushed up at this time air pressure and move upwards, drive grinding and polishing group
Limes superiors home is reached when part 2 reaches the limited block 9 of connecting seat 4 to stop.
In the present invention, above step has been respectively completed subregion pressue device balance, subregion pressue device rises overally, subregion
Pressue device entire lowering, the polishing of subregion pressue device integral grinding, subregion pressue device pressurized subregion grinding and polishing
The course of work to rise overally with subregion pressue device.
In the present invention, location A is air inlet position, and B location is to drive the gas circuit of cylinder 1 down, and location of C is to drive cylinder 1 past
On gas circuit, D positions are ratio valve regulation gas circuit, and E positions and the air inlet position that F positions are inner ring pressurization, G positions add for inner ring
The gas outlet of pressure, above-mentioned different position is opened and closed according to the difference of the solenoid valve of keying.
The present invention solves in the prior art, during large-scale polishing grinding equipment works, the grinding and polishing of chip
Realized by the relative motion between grinding and polishing component 2 and lower abrasive disk, when the diameter on ceramic disk is different, linear speed
Degree can increase with becoming larger for diameter, caused by the chip of final finished the chip in ceramic disk internal layer occur thick, outer
The thin phenomenon of chip of layer, have impact on the uniformity of whole disk chip, and the diameter difference of ceramic disk is bigger, and the uniformity of grinding and polishing is missed
Difference will bigger, seriously affect grinding and polishing precision, reduce production efficiency, the problem of disqualification rate greatly promotes, by will point
Area's pressue device is arranged to outer ring pressing mechanism and inner ring pressing mechanism, and outer ring pressing mechanism drives the first transmission by cylinder 1
Mechanism kinematic and the grinding and polishing component 2 for acting on polishing grinding equipment, carry out the pressurization in entire scope, inner ring pressing mechanism
Drive the second transmission mechanism being arranged on inside the first transmission mechanism by swivel joint 3 and act on and be located at grinding and polishing component 2
The center abrasive sheet 2-1 at center, that is, complete the pressurization of center part area, and the diameter difference avoided on ceramic disk causes line
The situation of the uniformity difference for the whole disk chip that speed occurs when different, by adjusting the pressure differential of different zones, realizes ceramic disk
The uniformity of the finished product chip of upper outer ring and inner ring is high, and grinding and polishing precision is high, and production efficiency greatly promotes, the qualification rate of finished product
Increase significantly.
Claims (8)
1. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment, the polishing grinding equipment include with it is described
The control mechanism of subregion pressue device connection, it is characterised in that：The subregion pressue device includes outer ring pressing mechanism and inner ring
Pressing mechanism, the control mechanism are connected with pneumatic mechanism；The outer ring pressing mechanism includes what is be connected with the pneumatic mechanism
Cylinder, the cylinder are connected by the first transmission mechanism with the grinding and polishing component of the polishing grinding equipment；The inner ring adds
Press mechanism includes the swivel joint being connected with the pneumatic mechanism, and the swivel joint is with being arranged on inside first transmission mechanism
The connection of the second transmission mechanism, second transmission mechanism is connected to center abrasive sheet, and the center abrasive sheet is movably arranged on institute
State the bottom centre of grinding and polishing component；The pneumatic mechanism include source of the gas, 1 three position five-way valve being connected with the cylinder and
1 the first pressure reducing valve being connected with the swivel joint, the source of the gas pass through gas circuit and the three position five-way valve and first respectively
Pressure reducing valve connects；First pressure reducing valve is also associated with the second proportioning valve, and second proportioning valve is connected to source of the gas by gas circuit.
2. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment according to claim 1, its feature
It is：First transmission mechanism includes connecting seat connected in sequence with the cylinder and splined shaft, matches somebody with somebody on the outside of the splined shaft
Conjunction is provided with spline housing, and the spline housing is connected with the grinding and polishing component.
3. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment according to claim 2, its feature
It is：Second transmission mechanism includes central shaft connected in sequence with the swivel joint and some guide shafts, the central shaft
With being located in splined shaft, the guide shaft is connected to center abrasive sheet and is uniformly distributed on the abrasive sheet of center.
4. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment according to claim 2, its feature
It is：The connecting seat includes limited block, and the limited block is arranged on above the splined shaft.
5. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment according to claim 1, its feature
It is：The three position five-way valve includes declining solenoid valve and rises solenoid valve, described to decline solenoid valve and rise solenoid valve difference
Source of the gas is connected to by gas circuit, is additionally provided with the second pressure reducing valve in the gas circuit for declining solenoid valve and being connected with source of the gas, described second
Pressure reducing valve is connected with the first proportioning valve, and first proportioning valve is connected to source of the gas by gas circuit.
6. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment according to claim 5, its feature
It is：The decline solenoid valve and rising solenoid valve are connected to noise elimination mechanism.
7. a kind of subregion pressue device suitable for large-scale single side polishing grinding equipment according to claim 1, its feature
It is：Some sensors are provided with the cylinder, the sensor is close to switch.
A kind of 8. subregion pressue device suitable for large-scale single side polishing grinding equipment using described in one of claim 1~7
Subregion pressure method, it is characterised in that：It the described method comprises the following steps：
Step 1：It is all resting state to decline solenoid valve at this time and rise solenoid valve, and three position five-way valve is in balanced mode, five
The gas circuit of mouth is all closed, and gas circuit will not be subject to air pressure up or down, grinding and polishing component without connection source of the gas, cylinder
Remain stationary as；
Step 2：Rise solenoid valves work, decline solenoid valve in a dormant state, three position five-way valve, which enters, rises Working mould
Formula, the gas circuit risen between solenoid valve and source of the gas are connected, and the gas circuit between three position five-way valve and cylinder is connected, and are declined solenoid valve and are connected to
Noise elimination mechanism is vented, cylinder is up pushed up at this time air pressure and move upwards, drive grinding and polishing component to reach connecting seat
Limes superiors home is reached during limited block to stop；
Step 3：After being put into polishing workpiece to be ground, decline solenoid valves work, rise solenoid valve in a dormant state, three
Position five-way valve, which enters, declines operating mode, and the gas circuit declined between solenoid valve and source of the gas is connected, the gas between three position five-way valve and cylinder
Road is connected, and the gas circuit between the second pressure reducing valve and the first proportioning valve and source of the gas, which is connected, carries out gas circuit adjusting, rises solenoid valve and is connected to
Noise elimination mechanism is vented, and cylinder is subject to air pressure and drives grinding and polishing component downward, until grinding and polishing component is passed to certain position
For sensor feedback signal to control mechanism, cylinder stops driving, and grinding and polishing component stops declining；
Step 4：When sensor detects the down position of grinding and polishing component, the second pressure reducing valve and the first proportioning valve composition
Gas circuit adjusting mechanism start control gas circuit flow, be gradually reduced it, the grinding polisher head lower surface of grinding and polishing component is slow
Slow drop to contacts with polishing workpiece to be ground, subsequently into automatic grind polishing state, the second pressure reducing valve during grinding and polishing
Gas circuit adjusting mechanism moment control throughput with the first proportioning valve composition is until completing the processing to be ground for polishing workpiece；
Step 5：When step 4 reaches it is stable when, connect the first pressure reducing valve and the second proportioning valve composition regulating device and source of the gas
Between gas circuit, the first pressure reducing valve directly acts on swivel joint, and control gas circuit flow acts on central shaft, arranged on grinding and polishing group
The center abrasive sheet pressure increase at part center, the center for treating grinding and polishing workpiece carries out pressure grinding polishing；
Step 6：Grinding and polishing terminates, and rises solenoid valves work, declines solenoid valve in a dormant state, three position five-way valve
Into operating mode is risen, the gas circuit risen between solenoid valve and source of the gas is connected, and the gas circuit between three position five-way valve and cylinder is connected, under
Drop solenoid valve is connected to the exhaust of noise elimination mechanism, closes between regulating device and the source of the gas of the first pressure reducing valve and the second proportioning valve composition
Gas circuit, cylinder is up pushed up at this time air pressure and move upwards, when driving the grinding and polishing component to reach the limited block of connecting seat
Limes superiors home is reached to stop.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102016102388A1 (en) * | 2016-02-11 | 2017-08-17 | Hoerbiger Automatisierungstechnik Holding Gmbh | proportional valve |
| JP7117171B2 (en) * | 2018-06-20 | 2022-08-12 | 株式会社荏原製作所 | Polishing apparatus, polishing method, and polishing control program |
| CN110142681A (en) * | 2019-05-29 | 2019-08-20 | 上海浩曦智能设备有限公司 | Thermal-insulation cup buffing machine fluid dynamic power control device |
| CN111070078A (en) * | 2020-01-08 | 2020-04-28 | 洛阳聚享新科智能科技有限公司 | Multi-stage gas path pressure control system and method for upper disc of double-end-face grinding machine |
| CN113910098B (en) * | 2021-10-19 | 2023-08-29 | 上海汉虹精密机械有限公司 | Accurate pressurization gas circuit control system for grinding polishing machine |
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