CN104858771B - Zirconium oxide superthin section burnishing device and polishing method - Google Patents
Zirconium oxide superthin section burnishing device and polishing method Download PDFInfo
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- CN104858771B CN104858771B CN201510293653.8A CN201510293653A CN104858771B CN 104858771 B CN104858771 B CN 104858771B CN 201510293653 A CN201510293653 A CN 201510293653A CN 104858771 B CN104858771 B CN 104858771B
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- abrasive disk
- workpiece
- epicyclic train
- platen
- thickness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to polissoir technical field, specifically related to burnishing device, including rotating shaft, epicyclic train, first abrasive disk, second abrasive disk, first platen, second platen, first motor, second motor and drive mechanism, epicyclic train is driven by rotating shaft and rotated, first abrasive disk is provided close to the one side of epicyclic train and parallel with epicyclic train, first platen is connected with the one side of first abrasive disk away from epicyclic train, second abrasive disk is in contact with the another side of epicyclic train, second platen and the second abrasive disk are compressed, first platen is connected with drive mechanism, move in direction of first platen by drive mechanism with trend closer or far from epicyclic train, first abrasive disk, second abrasive disk is respectively by the first motor, the driving of second motor is rotated round about.Burnishing device of the present invention can process superthin section of the thickness in 0.08mm 0.2mm, and flatness is good, and equal thickness is low.
Description
Technical field
The present invention relates to polissoir technical field, and in particular to a kind of zirconium oxide superthin section burnishing device and polishing side
Method.
Background technology
Because the thickness of ceramic fingerprint recognition piece requirement is general within 0.1mm, thickness is thinner, and effect is better, and market
Upper present polishing machine uses one side grinding technics, and due to the setting of the parameter such as its structure and pressure, rotating speed, can only
Process the product that thickness is more than 0.2mm, and if pressure merely is applied to workpiece, the fracture of workpiece can be caused again, therefore right
It is required that for ultra-thin potsherd, existing polishing machine is unable to reach the thickness of needs；And present polishing machine is due to its structure
The problem of design, the planeness of workpiece of polishing does not often reach requirement, and equal thickness can not be controlled in relatively low scope；So polish
Potsherd effect it is poor, correct again, many times can be wasted.
The content of the invention
The invention aims to overcome the defect that prior art is present to be filled there is provided a kind of polishing of zirconium oxide superthin section
Put, it can process superthin section of the thickness in 0.08~0.2mm, and flatness is preferably, and equal thickness is relatively low.
The present invention also provides a kind of zirconium oxide superthin section polishing method.
In order to realize the purpose of the present invention, the present invention uses following technical scheme：
A kind of zirconium oxide superthin section burnishing device, it include rotating shaft, epicyclic train, the first abrasive disk, the second abrasive disk,
First platen, the second platen, the first motor, the second motor and drive mechanism, the epicyclic train is by described
Rotating shaft driving is rotated, and first abrasive disk is provided close to the one side of the epicyclic train and flat with the epicyclic train
OK, first platen is connected with the one side of first abrasive disk away from the epicyclic train, second abrasive disk with
The another side of the epicyclic train is in contact, and second platen and second abrasive disk are compressed, first platen with
The drive mechanism connection, first platen is by the drive mechanism with side of the trend closer or far from the epicyclic train
To movement, first abrasive disk, second abrasive disk respectively from first motor, the second motor drive to
Opposite direction is rotated.
In one of the embodiments, the epicyclic train is included in sun gear and planetary gear, the sun gear
Heart circle is connected with the rotating shaft, and the planetary gear is connected with external toothing and the central ring engagement of the sun gear respectively, described
The one side of second abrasive disk and the planetary gear is compressed, and first abrasive disk is set close to the another side of the planetary gear.
In one of the embodiments, the ultimate range between the planetary gear and first abrasive disk is 0.2mm.
In one of the embodiments, the drive mechanism is cylinder, the piston rod of the cylinder and first platen
Vertical connection.
In one of the embodiments, the piston rod of the cylinder is provided with pressure sensor.
The present invention is also adopted the following technical scheme that：Zirconium oxide superthin section polishing method, it comprises the following steps：
The planetary gear that thickness 0.2mm~0.3mm workpiece is placed in into thickness 0.15mm is fastened；
Drive mechanism drives the first platen to be moved to workpiece, the first abrasive disk workpiece pressing, and first abrasive disk is to institute
The Stress control of workpiece is stated in 23~27kg；
The workpiece is driven by the epicyclic train and rotated, the control of the rotating shaft rotating speed of the epicyclic train 12~
16r/min；
First abrasive disk, the relative motion in a reverse direction of the second abrasive disk, first abrasive disk, the second grinding
The rotating speed of disk is controlled in 18~22r/min；
Workpiece rotation under first abrasive disk, the pressure of the second abrasive disk, the workpiece rotational frequency control is 28
~32r/min；
After preset time, thickness is 0.13~0.18mm after the workpiece polishing；
The thickness is fastened for the planetary gear that 0.13~0.18mm workpiece is placed in thickness 0.08mm；
The drive mechanism drives the first platen to be moved to the workpiece, the first abrasive disk workpiece pressing, and described the
One abrasive disk is to the Stress control of the workpiece in 23~27kg；
The workpiece is driven by the epicyclic train and rotated, the control of the rotating shaft rotating speed of the epicyclic train 12~
16r/min；
First abrasive disk, the relative motion in a reverse direction of the second abrasive disk, first abrasive disk, the second grinding
The rotating speed of disk is controlled in 18~22r/min；
Workpiece rotation under first abrasive disk, the pressure of the second abrasive disk, the workpiece rotational frequency control is 28
~32r/min；
After preset time, thickness is 0.08~0.12mm after the workpiece polishing.
In one of the embodiments, after the preset time, thickness is 0.13~0.18mm after the workpiece polishing, its
Described in preset time be 20~30min.
In one of the embodiments, after the preset time, thickness is 0.08~0.12mm after the workpiece polishing, its
Described in preset time be 20~30min.
First abrasive disk, the second abrasive disk are rotated with same rotational speed.
Zirconium oxide superthin section burnishing device of the present invention, its beneficial effect compared with prior art is：
1) burnishing device is combined together using planetary gear train with first, second abrasive disk, using double side grinding process,
Planetary gear train drives workpiece to rotate, and first, second abrasive disk gives workpiece and applies pressure, and workpiece produces rotation；In Ginding process,
The parameters such as pressure, the rotating speed of grinding are rationally set, and using the method for secondary grinding, the super of 0.08~0.2mm is finally ground
Thin slice, more than 0.2mm thin slice can only be ground by overcoming traditional handicraft, meet the thinness requirement of ceramic fingerprint recognition piece；It is right
The application Stress control of workpiece in zone of reasonableness, and workpiece rotation itself reduce again workpiece fracture generation,
2) it is relative and opposite direction is rotated using first, second abrasive disk, because workpiece two sides all applies equal pressure, process
Planeness of workpiece preferably, solve the problem of flatness that existing work pieces process goes out is poor；Also solved using twin grinding
The problem of equal thickness so that the equal thickness of workpiece is controlled within 0.01mm.
Brief description of the drawings
Fig. 1 is the profile of zirconium oxide superthin section burnishing device described in the embodiment of the present invention.
Embodiment
For the feature, technological means and the specific purposes reached, function of the present invention can be further appreciated that, with reference to
Embodiment and accompanying drawing are described in further detail to the present invention.
Embodiment：
Reference picture 1, zirconium oxide superthin section burnishing device of the present invention, it includes rotating shaft 10, epicyclic train 30,
One abrasive disk 40, the second abrasive disk 50, the first platen 60, the second platen 80 and drive mechanism 70, epicyclic train 30 is by turning
Axle 10, which drives, to be rotated, and rotating shaft 10 is specifically that the center of the epicyclic train 30 is connected with rotating shaft 10 by motor-driven rotation, when turn
Axle 10 is in motor when being rotated by, and epicyclic train 30 also drives rotation by rotating shaft 10.
Second abrasive disk 50 is located at the one side of epicyclic train 30, and is in contact with the face of epicyclic train 30, and second
Platen 80 is compressed with the second abrasive disk 50, and the second abrasive disk 50 is driven by the second motor (not shown) and rotated, and second
The effect of platen 80 is to give the pressure of the second abrasive disk 50.First abrasive disk 40 is provided close at the another side of epicyclic train 30,
And be arranged in parallel with epicyclic train 30, and during work the face of the first abrasive disk 40 and epicyclic train 30 have 0.2mm with
Under distance (i.e. ultimate range be 0.2mm), the first platen 60 connects with the first one side of the abrasive disk 40 away from epicyclic train 30
Connect, the first platen 60 is connected with drive mechanism 70, by drive mechanism 70 with trend closer or far from the epicyclic train 30
Direction is moved, and the effect of the first platen 60 is to compress the first abrasive disk 40.The workpiece 100 to be processed is located at the epicyclic train 30
On, the first platen 60 drives the first abrasive disk 40 to be moved towards epicyclic train 30, and workpiece pressing 100, the first abrasive disk 40 exists
Rotated under the drive of first motor.
The drive mechanism 70 is preferably cylinder, and the piston rod of cylinder 70 is vertical with the first platen 60 to be connected so that cylinder 70
Activity can drive exactly the first platen 60 abreast towards epicyclic train 30 direction move so that the first platen 60 can
Drive the first abrasive disk 40 to be moved to workpiece 100, and be pressed on the one side of workpiece 100, so that the first abrasive disk 40 can be to work
Part 100 carries out sanding and polishing.
The epicyclic train 30 includes sun gear 302 and planetary gear 304, central ring 306 and the rotating shaft 10 of sun gear 302
Connection, planetary gear 304 be connected with the engagement of the external toothing 308 and central ring 306 of sun gear 302 respectively, the second abrasive disk 50 and
The one side of planetary gear 304 is in contact, and the first abrasive disk 40 is set close to the another side of planetary gear 304, and flat with planetary gear 304
OK.
The pressure of the first platen 60 and workpiece 100 is given for monitoring cylinder in real time, is provided with the piston rod of cylinder 70
Pressure sensor 702, monitors the pressure that cylinder 70 puts on the first platen 60, prevents that pressure is excessive and workpiece 100 is made in real time
Into damage.
The machinable thickness of workpiece of the device in 0.08~0.2mm, therefore the first abrasive disk 40 and epicyclic train 30 it
Between distance be 0.08~0.2mm between.
When the device works, the planetary gear that thickness 0.2mm~0.3mm workpiece 100 is placed in into thickness 0.15mm is fastened；
Drive mechanism 70 drives the first platen 60 to be moved to workpiece 100, and the first platen 60 drives the workpiece pressing 100 of the first abrasive disk 40,
First abrasive disk 40 is to the Stress control of workpiece 100 in 23~27kg；Workpiece 100 drives rotation, planet by epicyclic train 30
The rotating speed of rotating shaft 10 of gear train 30 is controlled in 12~16r/min；First abrasive disk 40, the second abrasive disk 50 phase in a reverse direction
To motion, the first abrasive disk 40, the rotating speed of the second abrasive disk 50 are controlled in 18~22r/min；Workpiece 100 is in the first abrasive disk
40th, rotation under the pressure of the second abrasive disk 50, the rotating speed of workpiece 100 is controlled in 28~32r/min；Preset time (is preset herein
Time is 20~30min) after, workpiece 100 is polished to the thin slice that thickness is 0.13~0.18mm；Again by above-mentioned thickness be 0.13~
0.18mm workpiece 100 is placed on thickness 0.08mm epicyclic train 30, and drive mechanism 70 drives the first platen 60 to workpiece
100 movements, the first abrasive disk 40 compresses the workpiece 100, the Stress controls of first 40 pairs of workpiece 100 of abrasive disk 23~
27kg, workpiece 100 drives rotation by epicyclic train 30, and the rotating shaft rotating speed of epicyclic train 30 is controlled in 12~16r/min, the
One abrasive disk 40, the second relative motion in a reverse direction of abrasive disk 50, the first abrasive disk 40, the rotating speed control of the second abrasive disk 50
System is in 18~22r/min, the rotation under the first abrasive disk 40, the pressure of the second abrasive disk 50 of workpiece 100, the rotating speed control of workpiece 100
System is after 28~32r/min, preset time (preset time is 20~30min herein), and the workpiece 100 is polished to thickness and is
0.08~0.12mm superthin section, thus, the device can process below 0.08-0.2 superthin section.
After said apparatus is polished, the obtained burnishing parameters of workpiece 100 such as following table.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. zirconium oxide superthin section polishing method, it is characterised in that comprise the following steps：
Zirconium oxide superthin section burnishing device is provided, it includes rotating shaft (10), epicyclic train (30), the first abrasive disk (40), the
Two abrasive disks (50), the first platen (60), the second platen (80), the first motor, the second motor and drive mechanism
(70), the epicyclic train (30) is driven by the rotating shaft (10) and rotated, and first abrasive disk (40) is provided close to described
The one side of epicyclic train (30) is simultaneously parallel with the epicyclic train (30), first platen (60) and the described first grinding
One side of the disk (40) away from the epicyclic train (30) is connected, second abrasive disk (50) and the epicyclic train (30)
Another side be in contact, second platen (80) and second abrasive disk (50) compress, first platen (60) and institute
Drive mechanism (70) connection is stated, first platen (60) is by the drive mechanism (70) band trend closer or far from the planet
The direction movement of gear train (30), first abrasive disk (40), second abrasive disk (50) are driven by described first respectively
Motor, the driving of the second motor are rotated round about；The epicyclic train (30) includes sun gear (302) and planet
Take turns (304), the central ring (306) of the sun gear (302) is connected with the rotating shaft (10), the planetary gear (304) respectively with
The sun gear (302) external toothing (308) and central ring (306) engagement connection, second abrasive disk (50) with it is described
The one side of planetary gear (304) is compressed, and first abrasive disk (40) is set close to the another side of the planetary gear (304)；
Thickness 0.2mm~0.3mm workpiece (100) is placed on thickness 0.15mm epicyclic train (30)；
Drive mechanism (70) drives the first platen (60) mobile to workpiece (100), the first abrasive disk (40) workpiece pressing (100),
First abrasive disk (40) is to the Stress control of the workpiece (100) in 23~27kg；
The workpiece (100) is driven by the epicyclic train (30) and rotated, and the rotating shaft (10) of the epicyclic train (30) turns
Speed control is in 12~16r/min；
First abrasive disk (40), the second abrasive disk (50) relative motion in a reverse direction, first abrasive disk (40),
The rotating speed of second abrasive disk (50) is controlled in 18~22r/min；
The workpiece (100) rotation, the workpiece under first abrasive disk (40), the pressure of the second abrasive disk (50)
(100) rotating speed control is in 28~32r/min；
After preset time, thickness is 0.13~0.18mm after workpiece (100) polishing；
The thickness is placed on thickness 0.08mm epicyclic train (30) for 0.13~0.18mm workpiece (100)；
The drive mechanism (70) drives the first platen (60) mobile to the workpiece (100), the first abrasive disk (40) pressure
Clamping of workpieces (100), first abrasive disk (40) is to the Stress control of the workpiece (100) in 23~27kg；
The workpiece (100) is driven by the epicyclic train (30) and rotated, and the rotating shaft (10) of the epicyclic train (30) turns
Speed control is in 12~16r/min；
First abrasive disk (40), the second abrasive disk (50) relative motion in a reverse direction, first abrasive disk (40),
The rotating speed of second abrasive disk (50) is controlled in 18~22r/min；
The workpiece (100) rotation, the workpiece under first abrasive disk (40), the pressure of the second abrasive disk (50)
(100) rotating speed control is in 28~32r/min；
After preset time, thickness is 0.08~0.12mm after workpiece (100) polishing.
2. zirconium oxide superthin section polishing method according to claim 1, it is characterised in that：The planetary gear (304) and institute
It is 0.2mm to state the ultimate range between the first abrasive disk (40).
3. zirconium oxide superthin section polishing method according to claim 1, it is characterised in that：The drive mechanism (70) is gas
Cylinder, the piston rod of the cylinder is vertical with first platen (60) to be connected.
4. zirconium oxide superthin section polishing method according to claim 3, it is characterised in that：Set on the piston rod of the cylinder
There is pressure sensor (702).
5. zirconium oxide superthin section polishing method according to claim 1, it is characterised in that：It is described after the preset time
Thickness is 0.13~0.18mm after workpiece (100) polishing, wherein the preset time is 20~30min.
6. zirconium oxide superthin section polishing method according to claim 1, it is characterised in that：It is described after the preset time
Thickness is 0.08~0.12mm after workpiece (100) polishing, wherein the preset time is 20~30min.
7. zirconium oxide superthin section polishing method according to claim 1, it is characterised in that：First abrasive disk (40),
Second abrasive disk (50) is rotated with same rotational speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510293653.8A CN104858771B (en) | 2015-06-01 | 2015-06-01 | Zirconium oxide superthin section burnishing device and polishing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510293653.8A CN104858771B (en) | 2015-06-01 | 2015-06-01 | Zirconium oxide superthin section burnishing device and polishing method |
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| Publication Number | Publication Date |
|---|---|
| CN104858771A CN104858771A (en) | 2015-08-26 |
| CN104858771B true CN104858771B (en) | 2017-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510293653.8A Active CN104858771B (en) | 2015-06-01 | 2015-06-01 | Zirconium oxide superthin section burnishing device and polishing method |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108237442B (en) * | 2016-12-23 | 2020-08-04 | 蓝思科技（长沙）有限公司 | Processing technology of ultrathin ceramic fingerprint identification sheet |
| CN110000654B (en) * | 2019-05-24 | 2020-12-18 | 高燕妮 | Round glass outer wall edging device |
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| CN102333737A (en) * | 2009-02-25 | 2012-01-25 | 精工电子有限公司 | Glass substrate polishing method, package manufacturing method, piezoelectric oscillator, oscillator, electronic device, and radio-controlled watch |
| CN202668319U (en) * | 2012-06-21 | 2013-01-16 | 宝鸡新泰精密设备制造有限公司 | Multifunctional double-side grinding machine |
| CN203210171U (en) * | 2013-04-16 | 2013-09-25 | 河南富耐克超硬材料股份有限公司 | Double-surface lapping machine |
| CN103331661A (en) * | 2013-06-06 | 2013-10-02 | 燕山大学 | High-precision electric servo double-faced grinding machine |
| CN103506936A (en) * | 2013-09-18 | 2014-01-15 | 洛阳鸿泰半导体有限公司 | Silicon wafer differentiation grinding device |
| WO2015072050A1 (en) * | 2013-11-18 | 2015-05-21 | 株式会社Sumco | Device for double-sided polishing and method for double-sided polishing of workpiece |
| CN204673451U (en) * | 2015-06-01 | 2015-09-30 | 东莞信柏结构陶瓷有限公司 | Zirconia superthin section burnishing device |
-
2015
- 2015-06-01 CN CN201510293653.8A patent/CN104858771B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102333737A (en) * | 2009-02-25 | 2012-01-25 | 精工电子有限公司 | Glass substrate polishing method, package manufacturing method, piezoelectric oscillator, oscillator, electronic device, and radio-controlled watch |
| CN202668319U (en) * | 2012-06-21 | 2013-01-16 | 宝鸡新泰精密设备制造有限公司 | Multifunctional double-side grinding machine |
| CN203210171U (en) * | 2013-04-16 | 2013-09-25 | 河南富耐克超硬材料股份有限公司 | Double-surface lapping machine |
| CN103331661A (en) * | 2013-06-06 | 2013-10-02 | 燕山大学 | High-precision electric servo double-faced grinding machine |
| CN103506936A (en) * | 2013-09-18 | 2014-01-15 | 洛阳鸿泰半导体有限公司 | Silicon wafer differentiation grinding device |
| WO2015072050A1 (en) * | 2013-11-18 | 2015-05-21 | 株式会社Sumco | Device for double-sided polishing and method for double-sided polishing of workpiece |
| CN204673451U (en) * | 2015-06-01 | 2015-09-30 | 东莞信柏结构陶瓷有限公司 | Zirconia superthin section burnishing device |
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| CN104858771A (en) | 2015-08-26 |
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