CN103481195A - Multi-shaft driving device for single-face grinding polisher - Google Patents
Multi-shaft driving device for single-face grinding polisher Download PDFInfo
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- CN103481195A CN103481195A CN201310393908.9A CN201310393908A CN103481195A CN 103481195 A CN103481195 A CN 103481195A CN 201310393908 A CN201310393908 A CN 201310393908A CN 103481195 A CN103481195 A CN 103481195A
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- grinding
- polishing disc
- upper grinding
- polishing dish
- grinding polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a multi-shaft driving device for a single-face grinding polisher. The driving device comprises a rack; multiple independent horizontally-arranged upper grinding polishing disc units are arranged on the rack; the upper grinding polishing disc units are connected with a lifting driving system and a rotary driving system respectively. The multiple independent upper grinding polishing disc units are adopted and each upper grinding polishing disc can perform both rotating motion and lifting motion and can jointly move together with a main grinding polishing disc rotary motor, so the high-precision and high-efficiency grinding polishing operation on high-hardness materials such as sapphires can be realized. A joint combining assembly in the device can automatically align planes of a ground workpiece and a main grinding polishing disc. The multi-shaft driving device for the single-face grinding polisher can realize the aims of adjustable size range and controllable size precision of a machined product, and a cylinder can precisely press the workpiece by a precise pressure adjusting system according to machining process demands, so the aims of improving production precision and efficiency can be achieved.
Description
Technical field
The invention belongs to grinding and polishing process equipment field, be specifically related to a kind of Multi-shaft drive device of single face polisher lapper.
Background technology
At present, the upper polishing disk of most of single face polisher lappers adopts passive mode, and main grinding and polishing dish is driven and rotated by motor, on main grinding and polishing dish, is provided with building ring, workpiece is arranged on the workpiece retainer and is placed in building ring, and upper polishing disk is pressed on workpiece with certain pressure.During main abrasive disk rotation, the workpiece retainer is not with main abrasive disk revolution, but building ring drives polishing disk under rubbing action and the workpiece retainer produces rotation.Two kinds of motion modes of the rotation of the rotation of main abrasive disk and workpiece retainer are synthetic, and workpiece is carried out to polishing operation.This polishing operation precision is higher but the activity duration is longer.The higher workpiece to hardness such as sapphires particularly, operating efficiency is lower.Due to the restriction that is subject to structure, the rotary speed of main polishing disk is difficult to improve, the rotational velocity that simultaneously workpiece is managed device is limited by the rotating speed of main polishing disk, can not be improved, and be random uncontrollable, limit the variation of single face attrition process movement locus, be difficult to further improve machining accuracy and operating efficiency; Be difficult to meet by the adjusting of kinematic parameter the processing technology of different workpieces.
Summary of the invention
The objective of the invention is the defect existed for prior art, proposed a kind ofly can improve production precision and efficiency, the Multi-shaft drive device of the single face polisher lapper that applicability is good.
The technical scheme that realizes the object of the invention employing is as follows:
The Multi-shaft drive device of single face polisher lapper provided by the invention, comprise frame, is provided with a plurality of independently horizontally disposed upper grinding and polishing dish unit on frame, and on each, grinding and polishing dish unit is connected with the lifting drive system with rotary drive system respectively.
Described upper grinding and polishing dish unit comprises by sleeve pipe and bearing and is fixed on the rotating shaft on frame, and the lower end of rotating shaft connects the upper grinding and polishing dish of dividing into scratch diskette by joint assembly; Described rotary drive system comprises the synchronous pulley that is fixed on described sleeve pipe, is located at the motor deceleration device on frame, and described motor deceleration device is connected with described synchronous pulley by Timing Belt; Described lifting drive system comprises the floating connection body that is located at described rotating shaft upper end and connects by bearing, is located at the linear drive apparatus on frame, and described linear drive apparatus is connected with described floating connection body.
Described joint assembly comprises body, and body is in-built oscillating bearing, the oscillating bearing built-in shaft, and load female connector on axle, adapter sleeve is connected with upper grinding and polishing dish.
The present invention is owing to adopting a plurality of grinding and polishing dish unit of independently going up, on each, grinding and polishing dish unit both can rotate by rotary drive system and lifting drive system, can move up and down again, can with main abrasive disk electric rotating machine associated movement, realize the high accuracy of the high rigidity materials such as sapphire, high efficiency grinding and polishing operation.Joint set component energy automatic capturing in device is polished workpiece and main grinding and polishing dish plane.Apparatus of the present invention speed and pressure are controlled flexibly, can, according to convenient workpiece motion s speed and the pressure regulated of different workpieces, meet the processing technology of different workpieces.
The present invention can realize that the scope of converted products size is adjustable, the controlled purpose of dimensional accuracy; Cylinder can be realized respectively workpiece accurately being pressurizeed by the accurate voltage regulating system according to the processing technology requirement, thereby reaches the purpose that improves production precision and efficiency.
Further illustrate technical scheme of the present invention below in conjunction with accompanying drawing.
The accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is top view of the present invention.
The specific embodiment
Referring to Fig. 1, Fig. 2, the Multi-shaft drive device of the single face polisher lapper of polisher lapper of the present invention, comprise frame, by Equal round, 4 independently horizontally disposed upper grinding and polishing dish unit are set on frame, on each, grinding and polishing dish unit is connected with the lifting drive system with rotary drive system respectively;
Described upper grinding and polishing dish unit comprises the rolling spline axle 4 as rotating shaft, sleeve pipe 25 is housed on rolling spline axle 4, synchronous pulley 5 and pair of bearings 6 are housed on sleeve pipe 25, bearing 6 is contained in the inner pedestal 21 be fixed on sleeve pipe 25 and is fixed in the outer bearing carrier 20 on gantry base 11, and by lower cover 22 sealings that are connected with outer bearing carrier 20 with inner pedestal 21; The lower end of rolling spline axle 4 connects grinding and polishing dish 14 by joint assembly, and upper grinding and polishing dish 14 is divided into scratch diskette 16; Joint assembly comprises body 13, and body 13 is in-built oscillating bearing 7, oscillating bearing 7 built-in shafts 23, and load female connector 24 on axle 23, adapter sleeve 24 is connected with upper grinding and polishing dish 14.
Described rotary drive system comprises the synchronous pulley 5 that is fixed on sleeve pipe 25, is located at the motor deceleration device on frame, motor deceleration device comprises motor 8, the reductor 9 be connected with motor 8, the fixing reducer pedestal 10 of reductor 9, reducer pedestal 10 is fixed on gantry base 11, and motor 8 is connected with synchronous pulley 5 by Timing Belt 12;
Described lifting drive system comprises and being located on frame as the cylinder 1 of linear drive apparatus, the floating connection body 2 be connected by bearing with rolling spline axle 4 upper ends, cylinder 1 is arranged on cylinder fixed mount 15, cylinder fixed mount 15 is fixed on gantry base 11, the piston rod 26 of cylinder 1 is connected with floating connection body 2, pair of bearings 3 is housed in floating connection body 2, bearing 3 is contained on rolling spline axle 4, lower cover 19 is floating connection body lower end fixedly, round nut 18 is threaded onto rolling spline axle upper end, controls the end play of bearing 3.
Motor 8 drives synchronous pulleys 5, rolling spline axle 4 to rotate by Timing Belt 12, thereby drives upper grinding and polishing dish 14 and scratch diskette 16 rotations, and with the polishing operation motion that has formed workpiece together with the rotation of main grinding and polishing dish 17.When the piston rod of cylinder 1 moves up and down, drive floating connection body 2, rolling spline axle 4, joint set component 13, upper grinding and polishing dish 14 and scratch diskette 16 and move up and down.Thereby realized that upper polishing disk can rotate and can lifting or pressurization.And joint set component energy automatic capturing is polished workpiece and main grinding and polishing dish plane.Solved the defect that polishing disk on existing single face polisher lapper can only passive rotation.Reach the purpose that improves production precision and efficiency.
Claims (3)
1. the Multi-shaft drive device of a single face polisher lapper, comprise frame, it is characterized in that being provided with a plurality of independently horizontally disposed upper grinding and polishing dish unit on frame, and on each, grinding and polishing dish unit is connected with the lifting drive system with rotary drive system respectively.
2. the Multi-shaft drive device of single face polisher lapper according to claim 1, it is characterized in that described upper grinding and polishing dish unit comprises by sleeve pipe and bearing is fixed on the rotating shaft on frame, and the lower end of rotating shaft connects the upper grinding and polishing dish of dividing into scratch diskette by joint assembly; Described rotary drive system comprises the synchronous pulley that is fixed on described sleeve pipe, is located at the motor deceleration device on frame, and described motor deceleration device is connected with described synchronous pulley by Timing Belt; Described lifting drive system comprises the floating connection body that is located at described rotating shaft upper end and connects by bearing, is located at the linear drive apparatus on frame, and described linear drive apparatus is connected with described floating connection body.
3. the Multi-shaft drive device of single face polisher lapper according to claim 2, is characterized in that described joint assembly comprises body, and body is in-built oscillating bearing, the oscillating bearing built-in shaft, and load female connector on axle, adapter sleeve is connected with upper grinding and polishing dish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310393908.9A CN103481195A (en) | 2013-09-03 | 2013-09-03 | Multi-shaft driving device for single-face grinding polisher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310393908.9A CN103481195A (en) | 2013-09-03 | 2013-09-03 | Multi-shaft driving device for single-face grinding polisher |
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| Publication Number | Publication Date |
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| CN103481195A true CN103481195A (en) | 2014-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310393908.9A Pending CN103481195A (en) | 2013-09-03 | 2013-09-03 | Multi-shaft driving device for single-face grinding polisher |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798747A (en) * | 2016-04-25 | 2016-07-27 | 上海发那科机器人有限公司 | Floating type polishing tool and polishing robot with tool |
| CN106078500A (en) * | 2016-07-27 | 2016-11-09 | 湖南宇晶机器股份有限公司 | A kind of buffing machine absorption and drive system |
| CN106985067A (en) * | 2017-05-12 | 2017-07-28 | 宇环数控机床股份有限公司 | A kind of Workpiece clamping slewing equipment for multiaspect polishing machine |
| CN109397061A (en) * | 2018-12-26 | 2019-03-01 | 深圳西可实业有限公司 | The lower scratch diskette device of intelligent precise polishing machine |
| CN109955146A (en) * | 2018-05-14 | 2019-07-02 | 东莞市纳智自动化机械有限公司 | A kind of pressure adjustable is fully cooled ceramic material batch grinding head |
| CN112847076A (en) * | 2021-01-25 | 2021-05-28 | 宇环数控机床股份有限公司 | Workpiece disc turnover device and double-station turnover polishing machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787561A1 (en) * | 1996-02-05 | 1997-08-06 | Ebara Corporation | Polishing apparatus |
| JP2001315058A (en) * | 2000-05-02 | 2001-11-13 | Fujikoshi Mach Corp | Polishing device for wafer |
| JP2002299297A (en) * | 2001-03-30 | 2002-10-11 | Sumitomo Mitsubishi Silicon Corp | Single-wafer polishing method for semiconductor wafer and apparatus therefor |
| JP2006082139A (en) * | 2004-09-14 | 2006-03-30 | Matsushita Electric Ind Co Ltd | Dry polishing device and dry polish method |
| CN203460058U (en) * | 2013-09-03 | 2014-03-05 | 宇环数控机床股份有限公司 | Multi-axis driving device of single-faced grinding and polishing machine |
-
2013
- 2013-09-03 CN CN201310393908.9A patent/CN103481195A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787561A1 (en) * | 1996-02-05 | 1997-08-06 | Ebara Corporation | Polishing apparatus |
| JP2001315058A (en) * | 2000-05-02 | 2001-11-13 | Fujikoshi Mach Corp | Polishing device for wafer |
| JP2002299297A (en) * | 2001-03-30 | 2002-10-11 | Sumitomo Mitsubishi Silicon Corp | Single-wafer polishing method for semiconductor wafer and apparatus therefor |
| JP2006082139A (en) * | 2004-09-14 | 2006-03-30 | Matsushita Electric Ind Co Ltd | Dry polishing device and dry polish method |
| CN203460058U (en) * | 2013-09-03 | 2014-03-05 | 宇环数控机床股份有限公司 | Multi-axis driving device of single-faced grinding and polishing machine |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798747A (en) * | 2016-04-25 | 2016-07-27 | 上海发那科机器人有限公司 | Floating type polishing tool and polishing robot with tool |
| CN106078500A (en) * | 2016-07-27 | 2016-11-09 | 湖南宇晶机器股份有限公司 | A kind of buffing machine absorption and drive system |
| CN106985067A (en) * | 2017-05-12 | 2017-07-28 | 宇环数控机床股份有限公司 | A kind of Workpiece clamping slewing equipment for multiaspect polishing machine |
| CN109955146A (en) * | 2018-05-14 | 2019-07-02 | 东莞市纳智自动化机械有限公司 | A kind of pressure adjustable is fully cooled ceramic material batch grinding head |
| CN109397061A (en) * | 2018-12-26 | 2019-03-01 | 深圳西可实业有限公司 | The lower scratch diskette device of intelligent precise polishing machine |
| CN109397061B (en) * | 2018-12-26 | 2024-05-24 | 深圳西可实业有限公司 | Lower working disc device of intelligent precision polishing machine |
| CN112847076A (en) * | 2021-01-25 | 2021-05-28 | 宇环数控机床股份有限公司 | Workpiece disc turnover device and double-station turnover polishing machine |
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Application publication date: 20140101 |