CN103264394A - Wafer catching adaptive control method and device for chemically mechanical polishing transmission robot - Google Patents
Wafer catching adaptive control method and device for chemically mechanical polishing transmission robot Download PDFInfo
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- CN103264394A CN103264394A CN2013100114084A CN201310011408A CN103264394A CN 103264394 A CN103264394 A CN 103264394A CN 2013100114084 A CN2013100114084 A CN 2013100114084A CN 201310011408 A CN201310011408 A CN 201310011408A CN 103264394 A CN103264394 A CN 103264394A
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Abstract
The invention provides a wafer catching adaptive control method for a chemically mechanical polishing transmission robot. The wafer catching adaptive control method comprises the following steps that an infrared sensor detects a wafer position on a station and obtains a wafer position value on the station and stores the wafer position value; the stored wafer position on the station is corrected and compensated to obtain a first position value; the first position value and the last wafer position value on the station are summed to obtain an accurate value of the wafer position on the station, namely a second position value; the infrared sensor transmits the second position value serving as an input value to an input/output (I/O) plate; and the I/O plate sends the input value to a main controller to execute wafer catching and store the input value. According to the method, the adaptability of a manipulator of the chemically mechanical polishing transmission robot for catching wafers on stations is realized; and the wafer catching adaptive control method has high efficiency, precision and applicability. The invention also discloses a wafer catching adaptive control device for the chemically mechanical polishing transmission robot.
Description
Technical field
The present invention relates to the chemical Mechanical Polishing Technique field, particularly a kind of chemically mechanical polishing transferring robot wafer grasps self-adaptation control method and device.
Background technology
At the wafer crawl position, polishing unit of CMP polishing equipment problem accurately not, propose a kind of new wafer and grasp self-adaptation control method.This part mainly adopts mechanically fixed-site design in the CMP polissoir both at home and abroad, and there is no Research on Adaptive Control.
The station pneumatic that this research is intended to solve the CMP system lifts the problem that the inaccurate manipulator in position can't grasping silicon wafer, and correlative study is used in the actual production manufacturing.Realize the smooth grasping silicon wafer of transferring robot, improve its adaptive capacity and machine works efficient.The correlation technique of this research also portable has certain autgmentability in other IC equipments and in the wafer extracting between equipment.Very high to the ROBOT CONTROL required precision in the IC equipment, because the transferring robot system is the height nonlinear dynamic system, load change and other uncertain interference exist, the accurate control that makes the transferring robot system is a difficult point, so that the manipulator of robot has adaptive ability is very important.
Summary of the invention
Purpose of the present invention is intended to solve at least one of described technological deficiency.
For this reason, first purpose of the present invention is to propose a kind of chemically mechanical polishing transferring robot wafer and grasps self-adaptation control method, this method realizes the adaptive ability that the manipulator of real time implementation optical polishing transferring robot grasps the wafer on the station, and has high efficiency, accuracy and applicability.Second purpose of the present invention is to propose a kind of chemically mechanical polishing transferring robot wafer and grasps adaptive controller.
To achieve these goals, the embodiment of first aspect present invention provides a kind of chemically mechanical polishing transferring robot wafer to grasp self-adaptation control method, may further comprise the steps: infrared sensor detects the wafer position on the station, obtain described wafer position value and storage on the described station, wherein, described infrared sensor is connected with described chemical-mechanical polishing mathing device people's manipulator; Described wafer position on the described station of storage is carried out correction-compensation, obtain the primary importance value; Wafer position value on the described station of described primary importance value and last time is carried out addition, obtain the exact value of the described wafer position on the described station, be i.e. second place value; Described infrared sensor as input value, is transferred to the I/O plate with described second place value, and wherein, described infrared sensor is connected with described I/O plate; Described I/O plate is delivered to main controller with described input value again, carry out grasping silicon wafer, and with described input value storage, wherein, described main controller is embedded computer system, and described master controller is connected with described I/O plate, described chemical-mechanical polishing mathing device people's described manipulator.
Chemically mechanical polishing transferring robot wafer according to the embodiment of the invention grasps self-adaptation control method, the manipulator of chemically mechanical polishing transferring robot, when in chemical-mechanical polisher, the wafer on its station being grasped, infrared sensor detects the wafer position on the station, the position that storage is grasped compensates, if detected distance, then the positional value with chemical polishing transferring robot last time carries out the position that addition obtains the transferring robot grasping silicon wafer.This method not only realizes the adaptive ability that the manipulator of real time implementation optical polishing transferring robot grasps the wafer on the station, and effectively reduced the computation burden to the load control algolithm, satisfy the requirement that robot realizes the multi-task research, has high efficiency, accuracy, versatility and applicability.
In one embodiment of the invention, the described wafer position on the described station of storage is carried out correction-compensation, also comprise: the wafer distance of the described manipulator of measuring described chemical-mechanical polishing mathing device people to the described station obtains distance value.Thus, improved the accuracy that obtains the correction-compensation value.
In one embodiment of the invention, motion control and described infrared sensor calculate described chemical-mechanical polishing mathing device people's described manipulator displacement.Thus, improved agility and the accuracy that obtains manipulator displacement.
In one embodiment of the invention, the situation according to described chemical-mechanical polishing mathing device people's described robot movement judges whether to carry out motion control commands.Thus, improved flexibility and the ease for use of carrying out motion control commands.
In one embodiment of the invention, if motion state is consistent with the last stored state value, then do not need to adjust; If described motion state and described last stored state value are inconsistent, then adjust.Thus, flexibility and the applicability adjusted have been improved.
The embodiment of second aspect present invention proposes a kind of chemically mechanical polishing transferring robot wafer and grasps adaptive controller, and comprising: detection module for detection of the wafer position on the station, obtains the described wafer position value on the described station; Memory module is used for the described wafer position value that obtains on the described station is stored; The correction-compensation module is used for the described wafer position on the described station of described memory module storage is carried out correction-compensation; Computing module is used for and will carries out addition by the value of described correction-compensation module correction-compensation and the wafer position value on the described station of last time, obtains the exact value of the described wafer position on the described station; Sending module, the described exact value that is used for obtaining the described wafer position on the described station is transferred to the I/O plate as input value; Executive Module is used for carrying out grasping silicon wafer according to by described I/O plate described input value being delivered to main controller.
Chemically mechanical polishing transferring robot wafer according to the embodiment of the invention grasps adaptive controller, the manipulator of chemically mechanical polishing transferring robot, when in chemical-mechanical polisher, the wafer on its station being grasped, infrared sensor detects the wafer position on the station, the position that storage is grasped compensates, if detected distance, then the positional value with chemical polishing transferring robot last time carries out the position that addition obtains the transferring robot grasping silicon wafer.This device is not only realized the adaptive ability that the manipulator of real time implementation optical polishing transferring robot grasps the wafer on the station, and effectively reduced the computation burden to the load control algolithm, satisfy the requirement that robot realizes the multi-task research, has high efficiency, accuracy, versatility and applicability.
In one embodiment of the invention, described correction-compensation module also comprises: measuring unit, described manipulator that be used for the to measure described chemical-mechanical polishing mathing device people wafer distance to the described station obtains distance value.Thus, improved the accuracy that obtains the correction-compensation value.
In one embodiment of the invention, described computing module also is used for, and motion control and described infrared sensor calculate described chemical-mechanical polishing mathing device people's described manipulator displacement.Thus, improved agility and the accuracy that obtains manipulator displacement.
In one embodiment of the invention, judge module is used for judging whether to carry out motion control commands according to the situation of described chemical-mechanical polishing mathing device people's described robot movement.Thus, improved flexibility and the ease for use of carrying out motion control commands.
The aspect that the present invention adds and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or the additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is the flow chart that grasps self-adaptation control method according to the chemically mechanical polishing transferring robot wafer of the embodiment of the invention;
Fig. 2 is CMP unit infrared sensor self adaptive flow figure;
Fig. 3 is the manipulator grasping silicon wafer schematic diagram of robot;
Fig. 4 grasps adaptive structure figure for chemically mechanical polishing unit station wafer;
Fig. 5 is the wafer grasping system block diagram of CMP system station;
Fig. 6 is the structural representation that grasps adaptive controller according to the chemically mechanical polishing transferring robot wafer of the embodiment of the invention; And
Fig. 7 is that chemically mechanical polishing transferring robot wafer grasps the structural representation of adaptive controller according to another embodiment of the present invention.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, need to prove, unless otherwise prescribed and limit, term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be mechanical connection or electrical connection, also can be the connection of two element internals, can be directly to link to each other, and also can link to each other indirectly by intermediary, for the ordinary skill in the art, can understand the concrete implication of described term as the case may be.
As shown in Figure 1, the chemically mechanical polishing transferring robot wafer of the embodiment of the invention grasps the flow chart of self-adaptation control method, comprises the steps:
Step S101 is that infrared sensor detects the wafer position on the station, obtains wafer position value and storage on the station, and wherein, infrared sensor is connected with chemical-mechanical polishing mathing device people's manipulator.
Step S102 obtains the primary importance value for the wafer position on the station of storage is carried out correction-compensation.Particularly, the wafer position on the station of storage is carried out correction-compensation, also comprise: the wafer distance of the manipulator of measuring chemical-mechanical polishing mathing device people to the station obtains distance value.
Step S103 obtains the exact value of the wafer position on the station, i.e. second place value for the wafer position value on the station of primary importance value and last time is carried out addition.
Step S104 be infrared sensor with second place value as input value, be transferred to the I/O plate, wherein, infrared sensor is connected with the I/O plate.
Step S105 is that the I/O plate is delivered to main controller with input value again, carries out grasping silicon wafer, and with the input value storage, wherein, main controller is embedded computer system, and master controller is connected with I/O plate, chemical-mechanical polishing mathing device people's manipulator.
Further, motion control and infrared sensor calculate chemical-mechanical polishing mathing device people's manipulator displacement, and judge whether to carry out motion control commands according to the situation of chemical-mechanical polishing mathing device people's robot movement, if motion state is consistent with the last stored state value, then do not need to adjust; If motion state and last stored state value are inconsistent, then adjust.
Chemically mechanical polishing transferring robot wafer according to the embodiment of the invention grasps self-adaptation control method, the manipulator of chemically mechanical polishing transferring robot, when in chemical-mechanical polisher, the wafer on its station being grasped, infrared sensor detects the wafer position on the station, the position that storage is grasped compensates, if detected distance, then the positional value with chemical polishing transferring robot last time carries out the position that addition obtains the transferring robot grasping silicon wafer.This method not only realizes the adaptive ability that the manipulator of real time implementation optical polishing transferring robot grasps the wafer on the station, and effectively reduced the computation burden to the load control algolithm, satisfy the requirement that robot realizes the multi-task research, has high efficiency, accuracy, versatility and applicability.
As shown in Figure 2, CMP unit infrared sensor self adaptive flow figure.
Step S201 is the systematic parameter initialization.Wherein, comprise z
0, x
0, k, n, the parameter of N and robot system and the relevant function of define system etc.
Step S202 obtains current location infrared sensor measured value x for the station of measuring the CMP unit.
Step S203 is for to carry out numerical transformation to infrared sensor measured value x.
Particularly, x0=5, namely zero-bit is 5mm, infrared sensor moves 5mm on the measuring position.
Further, the holotype formula of the station of chemically mechanical polishing unit is [0,40].Equal the 5mm distance greatly if detect, then the positional value Zk with last time carries out the position that addition obtains the transferring robot grasping silicon wafer; If detect the distance less than 5mm, then the positional value Zk with last time subtracts each other the position that obtains the transferring robot grasping silicon wafer.
Step S204 is for calculating and judge the difference of manipulator and wafer, i.e. x-x0.
Step S205 is for judging the robot movement iterations.
Particularly, if the robot movement iterations
, execution in step S202 then.
Further, transferring robot manipulator k-1 sub-value z (k-1), by the quantity of state z (k-1) of last time and the difference x-x0 of manipulator and wafer, obtain the current input quantity z (k) of transferring robot manipulator, the control input quantity z (k) that obtains is implemented on the transferring robot, obtains the new quantity of state z (k+1) of station at last.
Step S206 is for to judge whether iterations n=N finishes.
Particularly, do not finish as if iterations, then
Turning back to step S202 continues to carry out.
Step S207 then finishes for when judging iterations n=N.
Step S208 is for judging whether that manipulator k sub-value is Zk.
Chemical machinery hand polishing transferring robot wafer grasps the accurately grasping silicon wafer function that self-adaptation control method is realized the transferring robot manipulator, for the research of the accurate grasping silicon wafer of robot mechanical arm provides a kind of reference, can avoid because the inaccurate manipulator of station position can't grab wafer, make the situation that whole system can't operate as normal.If above-mentioned situation occurs, will influence whole system operation efficient and stability greatly, this method can improve efficient and stable and the reliability requirements of transferring robot system.
As shown in Figure 3, the manipulator grasping silicon wafer schematic diagram of robot.
Particularly, grasp the wafer that polishes on the unit station by manipulator 3, the position of wafer is measured by the infrared sensor 2 on the manipulator 3 and is obtained.
As shown in Figure 4, station wafer in chemically mechanical polishing unit grasps adaptive structure figure.
Particularly, wafer position on the loadcup of manipulator infrared sensor 410 measurement CMP boards 430 when the grasping silicon wafer self-adapting grasping control of CMP system station, with reference to wafer position Zk and infrared sensor 410 measured values on the last time CMP transferring robot 420loadcup, the displacement value that calculates transferring robot sends to CMP transferring robot 420, wherein, the wafer extracting process of CMP system station is at first rising support, pad lifts wafer then, and the 3 pairs of wafers of manipulator in the manipulator grasping silicon wafer schematic diagram of the robot by as shown in Figure 3 grasp at last.
As shown in Figure 5, the wafer grasping system block diagram of CMP system station.
Particularly, the major function of transferring robot is the grasping silicon wafer at CMP system station, measure wafer before the CMP robot film releasing process of CMP system station is carried out action and after the position.Process before putting wafer be manipulator band wafer at first run to station directly over the position, measure distance value by the infrared sensor on the manipulator then, by obtaining current crawl position value with the manipulator crawl position value addition of last stored in robot system, last manipulator moves extracting value accurately and grasping silicon wafer downwards, and the process behind the wafer is put in execution.This motion is that infrared sensor 410 is measured the wafer position on the station of CMP boards 430; I/O plate 450 receives infrared sensor 410 measured values; Master controller PC104 integrated circuit board 440 is with reference to wafer position and infrared sensor 410 measured values on the last time station, and the displacement value that calculates transferring robot sends to CMP transferring robot 420; Transferring robot is finished grasping silicon wafer work, thereby realizes the grasping silicon wafer Self Adaptive Control of real-time CMP system station.
Fig. 6 is the structural representation that grasps adaptive controller according to the chemically mechanical polishing transferring robot wafer of the embodiment of the invention.
As shown in Figure 6, the chemically mechanical polishing transferring robot wafer of the embodiment of the invention grasps adaptive controller 600, comprising: detection module 610, memory module 620, correction-compensation module 630, computing module 640, sending module 650 and Executive Module 660.
Particularly, the wafer position that detection module 610 detects on the station, obtain the wafer position value on the station, store by 620 pairs of wafer position values that obtain on the station of memory module, then carry out correction-compensation by the wafer position on the station of 630 pairs of memory modules of correction-compensation module, 620 storages again, wherein, correction-compensation module 630 also comprises measuring unit, the wafer distance of manipulator that be used for to measure chemical-mechanical polishing mathing device people to the station obtains distance value.
Further, computing module 640 will carry out addition by the value of correction-compensation module 630 correction-compensations and the wafer position value on the station of last time, obtain the exact value of the wafer position on the station, to obtain the exact value of the wafer position on the station as input value by sending module 650 again, be transferred to the I/O plate, last Executive Module 660 is carried out grasping silicon wafer according to by the I/O plate input value being delivered to main controller.
Particularly, computing module 640 also is used for the manipulator displacement that motion control and infrared sensor calculate chemical-mechanical polishing mathing device people.
Fig. 7 is that chemically mechanical polishing transferring robot wafer grasps the structural representation of adaptive controller according to another embodiment of the present invention.
As shown in Figure 7, the chemically mechanical polishing transferring robot wafer of the embodiment of the invention grasps adaptive controller 600, also comprise: judge module 670 is used for judging whether to carry out motion control commands according to the situation of chemical-mechanical polishing mathing device people's robot movement.
Chemically mechanical polishing transferring robot wafer according to the embodiment of the invention grasps adaptive controller, the manipulator of chemically mechanical polishing transferring robot, when in chemical-mechanical polisher, the wafer on its station being grasped, infrared sensor detects the wafer position on the station, the position that storage is grasped compensates, if detected distance, then the positional value with chemical polishing transferring robot last time carries out the position that addition obtains the transferring robot grasping silicon wafer.This device is not only realized the adaptive ability that the manipulator of real time implementation optical polishing transferring robot grasps the wafer on the station, and effectively reduced the computation burden to the load control algolithm, satisfy the requirement that robot realizes the multi-task research, has high efficiency, accuracy, versatility and applicability.
Describe and to be understood that in the flow chart or in this any process of otherwise describing or method, expression comprises module, fragment or the part of code of the executable instruction of the step that one or more is used to realize specific logical function or process, and the scope of preferred embodiment of the present invention comprises other realization, wherein can be not according to order shown or that discuss, comprise according to related function by the mode of basic while or by opposite order, carry out function, this should be understood by the embodiments of the invention person of ordinary skill in the field.
In flow chart the expression or in this logic of otherwise describing and/or step, for example, can be considered to the sequencing tabulation for the executable instruction that realizes logic function, may be embodied in any computer-readable medium, use for instruction execution system, device or equipment (as the computer based system, comprise that the system of processor or other can be from the systems of instruction execution system, device or equipment instruction fetch and execution command), or use in conjunction with these instruction execution systems, device or equipment.With regard to this specification, " computer-readable medium " can be anyly can comprise, storage, communication, propagation or transmission procedure be for instruction execution system, device or equipment or the device that uses in conjunction with these instruction execution systems, device or equipment.The example more specifically of computer-readable medium (non-exhaustive list) comprises following: the electrical connection section (electronic installation) with one or more wirings, portable computer diskette box (magnetic device), random-access memory (ram), read-only storage (ROM), can wipe and to edit read-only storage (EPROM or flash memory), fiber device, and portable optic disk read-only storage (CDROM).In addition, computer-readable medium even can be paper or other the suitable media that to print described program thereon, because can be for example by paper or other media be carried out optical scanner, then edit, decipher or handle to obtain described program in the electronics mode with other suitable methods in case of necessity, then it is stored in the computer storage.
Should be appreciated that each several part of the present invention can realize with hardware, software, firmware or their combination.In the above-described embodiment, a plurality of steps or method can realize with being stored in the memory and by software or firmware that suitable instruction execution system is carried out.For example, if realize with hardware, the same in another embodiment, in the available following technology well known in the art each or their combination realize: have for the discrete logic of data-signal being realized the logic gates of logic function, special IC with suitable combinational logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) etc.
Those skilled in the art are appreciated that and realize that all or part of step that above-described embodiment method is carried is to instruct relevant hardware to finish by program, described program can be stored in a kind of computer-readable recording medium, this program comprises one of step or its combination of method embodiment when carrying out.
In addition, each functional unit in each embodiment of the present invention can be integrated in the processing module, also can be that the independent physics in each unit exists, and also can be integrated in the module two or more unit.Above-mentioned integrated module both can adopt the form of hardware to realize, also can adopt the form of software function module to realize.If described integrated module realizes with the form of software function module and during as independently production marketing or use, also can be stored in the computer read/write memory medium.
The above-mentioned storage medium of mentioning can be read-only storage, disk or CD etc.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change above-described embodiment under the situation that does not break away from principle of the present invention and aim within the scope of the invention, modification, replacement and modification.Scope of the present invention extremely is equal to by claims and limits.
Claims (9)
1. a chemically mechanical polishing transferring robot wafer grasps self-adaptation control method, it is characterized in that, may further comprise the steps:
Infrared sensor detects the wafer position on the station, obtains described wafer position value and storage on the described station, and wherein, described infrared sensor is connected with described chemical-mechanical polishing mathing device people's manipulator;
Described wafer position on the described station of storage is carried out correction-compensation, obtain the primary importance value;
Wafer position value on the described station of described primary importance value and last time is carried out addition, obtain the exact value of the described wafer position on the described station, be i.e. second place value;
Described infrared sensor as input value, is transferred to the I/O plate with described second place value, and wherein, described infrared sensor is connected with described I/O plate;
Described I/O plate is delivered to main controller with described input value again, carry out grasping silicon wafer, and with described input value storage, wherein, described main controller is embedded computer system, and described master controller is connected with described I/O plate, described chemical-mechanical polishing mathing device people's described manipulator.
2. chemically mechanical polishing transferring robot wafer as claimed in claim 1 grasps self-adaptation control method, it is characterized in that, described wafer position on the described station of storage is carried out correction-compensation, also comprise: the wafer distance of the described manipulator of measuring described chemical-mechanical polishing mathing device people to the described station obtains distance value.
3. chemically mechanical polishing transferring robot wafer as claimed in claim 1 grasps self-adaptation control method, it is characterized in that, and is further comprising the steps of:
Motion control and described infrared sensor calculate described chemical-mechanical polishing mathing device people's described manipulator displacement.
4. chemically mechanical polishing transferring robot wafer as claimed in claim 1 grasps self-adaptation control method, it is characterized in that, and is further comprising the steps of:
Situation according to described chemical-mechanical polishing mathing device people's described robot movement judges whether to carry out motion control commands.
5. chemically mechanical polishing transferring robot wafer as claimed in claim 4 grasps self-adaptation control method, it is characterized in that, also comprises the steps:
If motion state is consistent with the last stored state value, then do not need to adjust; If described motion state and described last stored state value are inconsistent, then adjust.
6. a chemically mechanical polishing transferring robot wafer grasps adaptive controller, comprising:
Detection module for detection of the wafer position on the station, obtains the described wafer position value on the described station;
Memory module is used for the described wafer position value that obtains on the described station is stored;
The correction-compensation module is used for the described wafer position on the described station of described memory module storage is carried out correction-compensation;
Computing module is used for and will carries out addition by the value of described correction-compensation module correction-compensation and the wafer position value on the described station of last time, obtains the exact value of the described wafer position on the described station;
Sending module, the described exact value that is used for obtaining the described wafer position on the described station is transferred to the I/O plate as input value;
Executive Module is used for carrying out grasping silicon wafer according to by described I/O plate described input value being delivered to main controller.
7. chemically mechanical polishing transferring robot wafer as claimed in claim 6 grasps adaptive controller, and described correction-compensation module also comprises:
Measuring unit, described manipulator that be used for the to measure described chemical-mechanical polishing mathing device people wafer distance to the described station obtains distance value.
8. chemically mechanical polishing transferring robot wafer as claimed in claim 6 grasps adaptive controller, and described computing module also is used for, and motion control and described infrared sensor calculate described chemical-mechanical polishing mathing device people's described manipulator displacement.
9. chemically mechanical polishing transferring robot wafer as claimed in claim 6 grasps adaptive controller, also comprises judge module, is used for judging whether to carry out motion control commands according to the situation of described chemical-mechanical polishing mathing device people's described robot movement.
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Application publication date: 20130828 |