WO2020138086A1 - 光学センサ装置 - Google Patents

光学センサ装置 Download PDF

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Publication number
WO2020138086A1
WO2020138086A1 PCT/JP2019/050612 JP2019050612W WO2020138086A1 WO 2020138086 A1 WO2020138086 A1 WO 2020138086A1 JP 2019050612 W JP2019050612 W JP 2019050612W WO 2020138086 A1 WO2020138086 A1 WO 2020138086A1
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WO
WIPO (PCT)
Prior art keywords
optical sensor
light
sensor device
opening
substrate
Prior art date
Application number
PCT/JP2019/050612
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
啓介 戸田
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to CN201980085205.5A priority Critical patent/CN113272971A/zh
Priority to US17/417,799 priority patent/US20220054027A1/en
Priority to EP19903424.0A priority patent/EP3905342A4/en
Priority to JP2020563307A priority patent/JP7267304B2/ja
Publication of WO2020138086A1 publication Critical patent/WO2020138086A1/ja

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/026—Measuring blood flow
    • A61B5/0261—Measuring blood flow using optical means, e.g. infrared light
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/026—Measuring blood flow
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6844—Monitoring or controlling distance between sensor and tissue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
    • A61B2562/0238—Optical sensor arrangements for performing transmission measurements on body tissue

Definitions

  • the present disclosure relates to an optical sensor device.
  • optical sensor devices such as measurement sensors that can measure biological information such as blood flow easily and at high speed.
  • blood flow can be measured using the Doppler effect of light.
  • the light When blood is irradiated with light, the light is scattered by blood cells such as red blood cells.
  • the moving speed of the blood cells is calculated from the frequency of the irradiation light and the frequency of the scattered light.
  • a transparent substrate is bonded to the upper surface of a substrate in which a light receiving element and a light emitting element are accommodated in Japanese Patent Laid-Open No. 2011-134663.
  • such an optical sensor is mounted on the mounting board.
  • the mounting substrate and the optical sensor are bonded in parallel by a bonding material or the like, of the light received by the light receiving element, the noise light reflected by the epidermis is strong and the blood cell There is a risk that the intensity of the signal light scattered by will be relatively small.
  • An optical sensor device includes an optical sensor and a mounting board on which the optical sensor is mounted.
  • the optical sensor includes a first upper surface and a first lower surface, a substrate, a light receiving element, a light emitting element, and a transparent substrate.
  • the mounting board has a second upper surface and a second lower surface.
  • the substrate has a first opening and a second opening spaced apart from the first opening.
  • the light receiving element is located in the first opening.
  • the light emitting element is located at the second opening and is spaced apart from the light receiving element.
  • the transparent substrate is located on the first upper surface of the substrate and is bonded to the substrate by closing the first opening and the second opening.
  • the first lower surface of the optical sensor is mounted to be inclined with respect to the second lower surface of the mounting substrate.
  • FIG. 3 is a top view showing an optical sensor device according to an embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional view showing an optical sensor device according to an embodiment of the present disclosure taken along the line AA of FIG. 1.
  • FIG. 2 is a cross-sectional view showing an optical sensor device according to an embodiment of the present disclosure taken along the line AA of FIG. 1.
  • FIG. 2 is a cross-sectional view showing an optical sensor device according to an embodiment of the present disclosure taken along the line BB of FIG. 1.
  • FIG. 2 is a cross-sectional view showing an optical sensor device according to an embodiment of the present disclosure taken along the line BB of FIG. 1.
  • FIG. 2 is a cross-sectional view showing an optical sensor device according to an embodiment of the present disclosure taken along the line BB of FIG. 1. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this indication. It is a perspective view showing an optical sensor device concerning an embodiment of this indication.
  • FIG. 10 is a cross-sectional view showing the optical sensor device according to the embodiment of the present disclosure taken along the line CC of FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line CC of FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line CC of FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line CC of FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line DD in FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line DD in FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line DD in FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line DD in FIG. 9.
  • FIG. 10 is a cross-sectional view showing an optical sensor device according to another embodiment of the present disclosure, taken along line DD in FIG. 9.
  • the optical sensor device 10 includes the optical sensor 1 and a mounting substrate 7 on which the optical sensor 1 is mounted.
  • the optical sensor 1 also includes a substrate 2, a transparent substrate 3, a light emitting element 5, and a light receiving element 6.
  • the optical sensor 1 has a first upper surface 23 and a first lower surface 11.
  • the first upper surface 23 and the first lower surface 11 may be the same as the upper surface and the lower surface of the substrate 2.
  • the substrate 2 has a rectangular shape in plan view and may be formed by stacking a plurality of dielectric layers.
  • the substrate 2 has, for example, a size of 0.5 mm to 5 mm and a thickness of 0.5 mm to 5 mm in plan view.
  • the substrate 2 may be, for example, a dielectric layer made of a ceramic material, or an organic wiring substrate having a dielectric layer made of a resin insulating material.
  • the substrate 2 is a wiring board made of a ceramic material (ceramic wiring board)
  • conductors such as connection pads, internal wiring, and signal wiring are formed on the dielectric layer made of the ceramic material.
  • the ceramic wiring board includes a plurality of ceramic dielectric layers.
  • Examples of the ceramic material used in the ceramic wiring board include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic sintered body. Examples include ties.
  • the substrate 2 is a wiring substrate made of an organic material (organic wiring substrate)
  • wiring conductors such as signal wirings described later are formed on an insulating layer made of an organic material.
  • the organic wiring board is formed of a plurality of organic dielectric layers.
  • the organic wiring board may be, for example, a printed wiring board, a build-up wiring board, a flexible wiring board, or the like whose dielectric layer is made of an organic material.
  • Examples of the organic material used in the organic wiring board include epoxy resin, polyimide resin, polyester resin, acrylic resin, phenol resin, and fluorine resin.
  • At least two recesses serving as openings are located on the substrate 2, one of the two recesses is the first opening 21 for accommodating the light receiving element 6, and one of the two recesses is provided.
  • the other is a second opening 22 that houses the light emitting element 5.
  • the first opening 21 and the second opening 22 are positioned so as to open on the same main surface of the substrate 2 (the first upper surface 23 of the optical sensor 1).
  • the optical sensor device 10 is used as a measurement sensor that measures the flow of fluid such as blood flow by utilizing the Doppler effect of light.
  • the measurement sensor includes a light emitting element that irradiates the measured object with light and a light receiving element that receives the light scattered by the measured object.
  • a part of the body such as a finger
  • the measurement sensor includes a light emitting element that irradiates the measured object with light and a light receiving element that receives the light scattered by the measured object.
  • the light emitting element 5 and the light receiving element 6 are arranged at a predetermined interval based on the positional relationship between the irradiation light and the scattered light.
  • the first opening 21 and the second opening 22 are provided according to the positional relationship between the light receiving element 6 and the light emitting element 5.
  • the size of the first opening portion 21 and the size of the second opening portion 22 may be appropriately set according to the sizes of the light receiving element 6 and the light emitting element 5 to be housed.
  • the shape of the opening of the first opening 21 may be, for example, a rectangle or a square, and its size is For example, the length in the vertical direction is 0.3 mm to 2.0 mm, the length in the horizontal direction is 0.3 mm to 2.0 mm, and the depth is 0.3 mm to 1.0 mm.
  • the opening of the second opening 22 may have, for example, a rectangular shape or a square shape.
  • the size is, for example, a longitudinal length of 0.3 mm to 2.0 mm, a lateral length of 0.3 mm to 2.0 mm, and a depth of 0.4 mm to 1.5 mm.
  • the distance between the first opening 21 and the second opening 22 (between the light receiving element 6 and the light emitting element 5) may be such that the light emitted by the light emitting element 5 does not directly enter the light receiving element 6. ..
  • the first opening 21 and the second opening 22 are provided. (The light receiving element 6 and the light emitting element 5) can be made closer to each other.
  • the opening shape of the first opening 21 and the second opening 22 may be, for example, a circular shape, a square shape, a rectangular shape, or any other shape.
  • the first opening 21 and the second opening 22 may have a uniform cross-section in the depth direction in a cross section parallel to the main surface of the substrate 2. It may be a concave portion having a step, which has the same shape as the opening shape and is uniform, and has a uniform cross-sectional shape to the bottom after a predetermined depth.
  • a mounting region for mounting the light receiving element 6 is provided on the bottom of the first opening 21, and a bottom of the second opening 22 is provided.
  • a mounting area for mounting the light emitting element 5 is provided.
  • connection pads for electrically connecting to the light emitting element 5 or the light receiving element 6 are provided on the step surface.
  • the substrate 2 is provided with a signal wiring electrically connected to the light emitting element 5 or the light receiving element 6, transmitting an electric signal input to the light emitting element 5, and transmitting an electric signal output from the light receiving element 6. It may be.
  • the signal wiring is connected to the light emitting element 5 or the light receiving element 6 with a bonding wire which is a connecting member, a connection pad to which the bonding wire is connected, and an electrical connection to the connection pad from directly below the connection pad of the substrate 2. It may be composed of a via conductor extending to the lower surface and an external connection terminal electrically connected to the via conductor.
  • the external connection terminal is provided on the lower surface of the substrate 2, and is electrically connected to the connection terminal of the external mounting substrate on which the measurement sensor including the optical sensor device 10 is mounted by a terminal connection material such as solder.
  • the external connection terminals have improved wettability with a bonding material such as solder and corrosion resistance.
  • a bonding material such as solder and corrosion resistance.
  • a nickel layer having a thickness of 0.5 ⁇ m to 10 ⁇ m and a gold layer having a thickness of 0.5 ⁇ m to 5 ⁇ m may be sequentially deposited by a plating method.
  • the transparent substrate 3 covers the upper surface of the substrate 2 (first upper surface 23 of the optical sensor 1) and is bonded to the first upper surface 23 with a bonding material.
  • the transparent substrate 3 closes and seals the first opening 21 and the second opening 22 in which the light receiving element 6 and the light emitting element 5 are accommodated.
  • the transparent substrate 3 is a plate-shaped member made of an insulating material, through which the light emitted from the light emitting element 5 accommodated in the second opening 22 is transmitted, and the light receiving element 6 accommodated in the first opening 21 receives the light. It suffices that it is made of a material having a light-transmitting property such that the light that passes through is transmitted.
  • a semiconductor laser element such as VCSEL can be used as the light emitting element 5, and various photodiodes such as a silicon photodiode, a GaAs photodiode, an InGaAs photodiode, and a germanium photodiode can be used as the light receiving element 6.
  • the light emitting element 5 and the light receiving element 6 may be appropriately selected depending on the type of the object to be measured, the type of parameter to be measured, and the like.
  • the VCSEL which is the light emitting element 5 can emit laser light having a wavelength of 850 nm in order to measure by utilizing the Doppler effect of light.
  • the light emitting element 5 that emits laser light having a wavelength according to the purpose of measurement may be selected.
  • the light receiving element 6 only needs to be able to receive the light emitted from the light emitting element 5 when the received light does not change in wavelength from the laser light emitted from the light emitting element 5, and when there is a change in wavelength, after the change. Any light can be received as long as it can receive the light of the wavelength.
  • the light emitting element 5 and the light receiving element 6 and the connection pad are electrically connected by, for example, a bonding wire, but other connections such as flip chip connection, bump connection, connection using an anisotropic conductive film, etc. It may be a connection method.
  • the transparent substrate 3 needs to transmit the irradiation light and the scattered light to the object to be measured. Since the characteristics of the irradiation light and the scattered light are determined by the mounted light emitting element, it is sufficient that at least the light emitted by the mounted light emitting element is transmitted. With respect to the wavelength of light emitted from the light emitting element, the transparent substrate 3 may be made of an insulating material having a transmittance of 70% or more and 90% or more of the light of the wavelength.
  • the insulating material of the transparent substrate 3 for example, a transparent ceramic material such as sapphire, a glass material, or a resin material can be used.
  • a transparent ceramic material such as sapphire, a glass material, or a resin material
  • the glass material borosilicate glass, crystallized glass, quartz, soda glass, or the like can be used.
  • resin material polycarbonate resin, unsaturated polyester resin, epoxy resin or the like can be used.
  • the transparent substrate 3 has, for example, a rectangular shape in a plan view, and has a size of 0.5 mm ⁇ 1 mm to 5 mm ⁇ 5 mm. The thickness is 0.2 mm to 5 mm.
  • the adhesive bonds the substrate 2 and the transparent substrate 3 together. More specifically, the first upper surface 23 and the lower surface of the transparent substrate 3 are joined at the outer peripheral portion.
  • the adhesive is a sealing material that is provided in an annular shape along the first upper surface 23 and that secures airtightness and watertightness in the first opening 21 and the second opening 22 of the substrate 2.
  • the light-receiving element 6 and the light-emitting element 5 housed in the first opening 21 and the second opening 22 are vulnerable to moisture and the like, and the adhesive is not discontinuous in order to prevent moisture from entering from the outside. It is provided in a ring shape.
  • the adhesive may have a light shielding property. Since the adhesive has a light shielding property, it is possible to reduce light entering from the outside through the space between the substrate 2 and the transparent substrate 3 and into the first opening 21 and the second opening 22. You can
  • the light-shielding property of the adhesive is preferably that of absorbing light. From the viewpoint of preventing the entry of light from the outside, it may have a light-shielding property due to reflection, but stray light generated inside the measurement sensor may be reflected by the adhesive and may be received by the light receiving element. .. If the adhesive absorbs light, it is possible to absorb light from the outside to prevent entry and also to absorb stray light generated inside.
  • Adhesive is composed of a material having a light shielding property by absorbing such light.
  • the adhesive is obtained, for example, by dispersing a light absorbing material in a resin-based adhesive such as an epoxy resin or a conductive silicone resin that has a bonding property between the substrate 2 and the transparent substrate 3.
  • a resin-based adhesive such as an epoxy resin or a conductive silicone resin that has a bonding property between the substrate 2 and the transparent substrate 3.
  • an inorganic pigment can be used as the light absorbing material.
  • the inorganic pigment include carbon-based pigments such as carbon black, nitride-based pigments such as titanium black, Cr-Fe-Co-based, Cu-Co-Mn-based, Fe-Co-Mn-based, Fe-Co-Ni.
  • a metal oxide pigment such as —Cr pigment can be used.
  • the conductive bonding agent may be made of a metal material such as solder.
  • a brazing material such as Sn-Ag, Sn-Ag-Cu, Au-Sn, Au-Sn-Ag, Au-Si can be used.
  • the light shielding film 4 is provided on the lower surface of the transparent substrate 3.
  • the light shielding film 4 is made of, for example, a metal material such as Cr, Ti, Al, Cu, Co, Ag, Au, Pd, Pt, Ru, Sn, Ta, Fe, In, Ni or W, or a metal material such as an alloy thereof. It is formed by vapor deposition, sputtering, baking or the like.
  • the light-shielding film 4 has a thickness of, for example, 50 nm to 1000 nm.
  • the light shielding film 4 may be located so as to overlap the light emitting element 5. At this time, overlapping means that the light shielding film 4 covers a part of the light emitting element 5.
  • the light-shielding film 4 has a through hole in a part thereof so that at least the light emitted by the light emitting element 5 and the reflected light reaching the light receiving element 6 can pass therethrough.
  • the light-shielding film 4 may be provided in other places without providing the light-shielding film 4 only in a portion where the light emitted from the light emitting element 5 is desired to be transmitted. With this, it is possible to reduce light leakage from other portions of the transparent substrate 3. As a result, it is possible to reduce the incidence of light incident on the light receiving element 6 due to the unexpected reflection of the measured object due to the leakage.
  • the optical sensor 1 is mounted on the mounting board 7.
  • the mounting substrate 7 may have, for example, a rectangular shape in plan view, a size of 3 mm ⁇ 7 mm to 50 mm ⁇ 70 mm, and a thickness of 0.3 mm to 2 mm. Further, it may contain an organic material, a ceramic material, or the like.
  • the mounting board 7 and the optical sensor 1 are bonded together via a bonding material 8 or the like.
  • the bonding material 8 may be made of a metal material such as epoxy resin, silicone resin, or solder. Further, for example, a brazing material such as Sn-Ag, Sn-Ag-Cu, Au-Sn, Au-Sn-Ag, Au-Si can be used.
  • the first lower surface 11 of the optical sensor 1 is The second upper surface 71 and/or the second lower surface 72 are mounted to be inclined. At this time, the first lower surface 11 of the optical sensor 1 is tilted at least with respect to the second lower surface 72 of the mounting substrate 7, that is, the optical sensor 1 has an optical axis relative to the surface of the object (fluid). Is tilted.
  • the light emitting element 5 is located at a position where the light emitting elements 5 overlap each other when seen in a plan view, and is in an inclined state when seen in a cross section.
  • the inclination of the first lower surface 11 of the optical sensor 1 with respect to the second lower surface 72 of the mounting substrate 7 may cause a part of the first lower surface 11 of the optical sensor 1 to float, or the bonding material 8 may be hot with a thin portion.
  • the portions may be made to have different thicknesses.
  • the bonding material 8 may be a solder ball and may be inclined by having a plurality of solder balls having different diameters.
  • the solder ball refers to a ball-shaped solder.
  • the plurality of solder balls include a first solder ball located at a first position on the first lower surface 11 where a distance between the optical sensor 1 and the mounting substrate 7 is a first distance, and A second solder ball located at a second position on the lower surface 11 where the distance is a second distance larger than the first distance.
  • the diameter of the second solder ball is larger than the diameter of the first solder ball.
  • the plurality of solder balls have a larger diameter as they are located in the first lower surface 11 where the distance between the optical sensor 1 and the mounting substrate 7 is larger.
  • the bonding material 8 may be located on the entire surface of the first lower surface 11 of the optical sensor 1.
  • the optical sensor device 10 since the first lower surface 11 of the optical sensor 1 is inclined with respect to the second lower surface 72 of the mounting substrate 7 as described above, the light from the light emitting element 5 is not reflected.
  • the optical axis is tilted, and the specular reflection component on the surface of the fluid or the flow path as the object can be released to the outside of the optical sensor 1. That is, the ratio of the signal light can be relatively increased, and the detection of the intensity of the signal light is improved, as compared with the case where the light receiving element 6 is irradiated with the regular reflection component.
  • the optical sensor device 10 may include an optical sensor 1, a mounting substrate 7, a housing 9, and a flow path 13.
  • the housing 9 is located on the second upper surface 71 of the mounting board 7, and the optical sensor 1 is located inside.
  • the bottom surface of the housing 9 is the mounting substrate 7.
  • the mounting board 70 may further include the mounting portion 70 positioned in the housing 9 as a part of the mounting board 7.
  • the second upper surface 71 may be stepped due to the mounting portion 70.
  • only the mounting portion 70 may be made of a different material.
  • the first upper surface 23 of the optical sensor 1 is positioned to be inclined with respect to the flow path 13 when seen in a plan view.
  • the optical sensor 1 may be inclined with respect to the second upper surface 71 of the mounting substrate 7. That is, the second upper surface 71 of the mounting substrate 7 may be an inclined surface between the mounting substrate 7 and the optical sensor 1 located inside.
  • the housing 9 has, for example, a rectangular shape in a plan view, and its size varies depending on the size of a flow channel described later.
  • the housing 9 contains, for example, a ceramic material, an organic material, or the like.
  • a channel 13 is attached to the housing 9.
  • the flow path 13 is located above the optical sensor 1, and a fluid is flowing inside.
  • the flow path 13 may be circular or rectangular in cross section.
  • the size of the flow path 13 is determined by what kind of fluid to be measured.
  • the axis of light from the light emitting element does not have to pass through the circular center that is the cross section of the flow path 13. This allows the specular reflection component to escape to the outside.
  • the first lower surface 11 of the optical sensor 1 and the second upper surface 71 of the mounting board 7 may be joined in parallel with the joining material 8 interposed therebetween. Further, since the thicknesses are slightly different, they may be slightly inclined. At this time, the inclination of the inner bottom surface of the housing 9 may be larger.
  • the second upper surface 71 of the mounting substrate 7 and the first lower surface 11 of the optical sensor 1 be positioned in parallel with each other with the bonding material 8 interposed therebetween.
  • the optical sensor 1 can be positioned so as to be inclined with respect to the flow path 13. By doing so, the ratio of the signal light can be relatively increased, and the detection of the intensity of the signal light is improved, as compared with the case where the specular reflection component is applied to the light receiving element 6.
  • the inner bottom surface of the housing 9 is inclined in a direction perpendicular to the direction in which the fluid in the flow path 13 flows in a sectional view. That is, the axis of the light from the light emitting element 5 is tilted with respect to the flow path 13.
  • the second upper surface 71 of the mounting substrate 7 has an inclination, and the optical sensor 1 may be mounted further inclined with respect to the second upper surface 71. .. By doing so, the ratio of the signal light can be relatively increased, and the detection of the intensity of the signal light is improved, as compared with the case where the specular reflection component is applied to the light receiving element 6.
  • the optical sensor 1 is tilted with respect to the second lower surface 72 of the mounting substrate 7 as described above, and the optical sensor 1 is provided with respect to the flow of the fluid in the flow path 13. Since the light is emitted from the light emitting element 5, the optical axis of the light from the light emitting element 5 is inclined, and the specular reflection component on the surface of the fluid or the flow path as the object can escape to the outside of the optical sensor 1. That is, the ratio of the signal light can be relatively increased, and the detection of the intensity of the signal light is improved, as compared with the case where the light receiving element 6 is irradiated with the regular reflection component.
  • the substrate 2 is manufactured in the same manner as the method for manufacturing a multilayer wiring board.
  • the ceramic material is alumina
  • a raw material powder such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO) is suitable.
  • An organic solvent and a solvent are added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method or the like to obtain a ceramic green sheet (hereinafter, also referred to as a green sheet).
  • the green sheet is punched into a predetermined shape, and an organic solvent and a solvent are added to and mixed with raw material powder such as tungsten (W) and a glass material to form a metal paste, which is printed on the surface of the green sheet by a printing method such as screen printing.
  • a printing method such as screen printing.
  • the via conductor has a through hole formed in the green sheet, and the through hole is filled with a metal paste by screen printing or the like. Further, the metallized layer serving as the ground conductor layer is formed on the outermost surface by the metal paste.
  • a plurality of green sheets obtained in this way are laminated and co-fired at a temperature of about 1600° C., whereby the substrate 2 is manufactured.
  • a transparent substrate 3 is prepared by cutting a glass material into a predetermined shape by cutting, cutting, or the like.
  • a light-shielding film 4 to be described later is formed on the lower surface of the transparent substrate 3 by vapor deposition, sputtering, baking or the like.
  • the via conductor is formed in a straight line in the vertical direction within the substrate 2, but if it is electrically connected from the upper surface of the substrate 2 to the external connection terminal on the lower surface, it is in a straight line.
  • it may be formed so as to be displaced in the substrate 2 by an inner layer wiring, an internal ground conductor layer, or the like.
  • a lens may be attached to the upper surface of the transparent substrate 3 at a position overlapping the first opening 21 and the first through hole.
  • the lens has a size of, for example, ⁇ 20 ⁇ m to ⁇ 2 mm and a thickness of 0.5 mm to 2 mm.
  • the lens is made of, for example, a glass material such as quartz glass or borosilicate glass, or a resin material such as acrylic, polycarbonate, styrene, or polyolefin.
  • the lens is preferably transparent so that the light emitted from the light emitting element 5 can pass through the light receiving element 6.
  • the lens it is preferable to use a lens having a condensing property, such as a convex lens, which has a property of refracting light in the optical axis direction.
  • a lens having a condensing property such as a convex lens, which has a property of refracting light in the optical axis direction.
  • the presence of the lens refracts the diffused light emitted from the light emitting element 5 to form focused light or collimated light, thereby improving the light converging property on the light receiving element 6.
  • a second lens may be further attached to the upper surface of the transparent substrate 3 at a position overlapping the second opening 22 and the second through hole.
  • the second lens has, for example, a size of ⁇ 70 ⁇ m to ⁇ 2 mm and a thickness of 50 ⁇ m to 2 mm in plan view.
  • the second lens is made of, for example, a glass material such as quartz glass or borosilicate glass, or a resin material such as acrylic, polycarbonate, styrene, or polyolefin.
  • the second lens is preferably transparent so as to allow the light emitted from the light emitting element 5 to pass therethrough.
  • the second lens is preferably a lens having a light-condensing property, such as a convex lens, which has a property of refracting light in the optical axis direction. Due to the presence of the second lens, the diffused light emitted from the light emitting element 5 is refracted to be focused light or collimated light, whereby the light converging property can be improved.
  • a light-condensing property such as a convex lens
  • a control element that controls the light emission of the light emitting element 5
  • a processing unit 73 that processes the output signal of the light receiving element 6, and a blood flow from the signal of the processing unit 73.
  • a calculation unit 74 for calculating speed and the like is also mounted.
  • the light emitting element control current is input to the optical sensor device 10 from the mounting substrate 7 via the external connection terminal in a state where the fingertips of the fingers as the object to be measured are in contact with the surface of the transparent substrate 3.
  • the light for measurement is emitted from the light emitting element 5 after being input to the light emitting element 5 through the conductor, the connection pad, and the like.
  • the emitted light passes through the transparent substrate 3 and is applied to the fingertip, it is scattered by blood cells in the blood.
  • the scattered light transmitted through the transparent substrate 3 is received by the light receiving element 6, the light receiving element 6 outputs an electric signal corresponding to the amount of received light.
  • the output signal passes through the connection pad and the via conductor, is output from the optical sensor 1 to the processing unit 73 of the mounting substrate 7 via the external connection terminal, and is processed.
  • the signal processed by the processing unit 73 is input to the calculation unit 74 having a calculation element, and, for example, by analyzing the intensity for each frequency of the scattered light received by the light receiving element 6, the blood flow velocity is analyzed. Can be calculated.
  • the second light receiving element may be further located in the first opening 21.
  • the light-shielding film 4 is not partially provided above the second light-receiving element.
  • the light shielding film 4 may further have a through hole at a position overlapping with the second opening.
  • the through hole is a so-called through hole for reference light.
  • the reference light can be taken in by arranging the hole at a position close to the light receiving element of the light shielding film. Since the light is transmitted to the light receiving element 6 more accurately by incorporating the reference light, the speed can be calculated more accurately.
  • a space is provided between the lower surface of the transparent substrate 3 and the substrate 2 between the first opening 21 and the second opening 22. That is, the substrate 2 has a wall having a light blocking property between the first opening 21 and the second opening 22, and there is no part of the upper end of the wall. By doing so, the reference light can be made to reach the light receiving element 6 directly, so that more accurate measurement can be realized.
  • the optical sensor 1 has a rectangular shape having long sides and short sides in a plan view, and the first virtual straight line X1 is the long side of the optical sensor 1. It may be parallel. In this case, the second virtual straight line X2 is parallel to the short side of the optical sensor 1. At this time, the mounting substrate 7 is tilted to facilitate mounting.
  • the bottom surface of the first opening 21 and the bottom surface of the second opening 22 are inclined surfaces that are inclined. You may have. At this time, for example, the inclination angle of the inclined surface is 5° to 50° with respect to the first upper surface 23. This makes it possible to bring the irradiation positions of the light hitting the object to be measured closer to each other.
  • the optical sensor device according to the embodiment of the present disclosure has been described as a pulse wave blood flow sensor device for use, other devices that operate by a pair of sensor elements of a light emitting element and a light receiving element, for example, a proximity illuminance integrated type It can be applied to a sensor device, a proximity sensor device, a distance measuring sensor device, and the like.
  • Optical Sensor 11 First Lower Surface 2 Substrate 21 First Opening 22 Second Opening 23 First Upper Surface 3 Transparent Substrate 4 Light-Shielding Film 5 Light-Emitting Element 6 Light-Receiving Element 7 Mounting Substrate 70 Mounting Part 71 Second Upper Surface 72 Second Lower Surface 73 Processing unit 74 Calculation unit 8 Joining material 9 Housing 21 First opening 22 Second opening 10 Optical sensor device X1 First virtual straight line X2 Second virtual straight line

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
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  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
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PCT/JP2019/050612 2018-12-25 2019-12-24 光学センサ装置 WO2020138086A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201980085205.5A CN113272971A (zh) 2018-12-25 2019-12-24 光学传感器装置
US17/417,799 US20220054027A1 (en) 2018-12-25 2019-12-24 Optical sensor device
EP19903424.0A EP3905342A4 (en) 2018-12-25 2019-12-24 OPTICAL SENSING DEVICE
JP2020563307A JP7267304B2 (ja) 2018-12-25 2019-12-24 光学センサ装置

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JP2018-241588 2018-12-25
JP2018241588 2018-12-25
JP2018-244187 2018-12-27
JP2018244187 2018-12-27

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JP2003133582A (ja) * 2001-10-26 2003-05-09 Stanley Electric Co Ltd 投／受光装置
JP2003227735A (ja) * 2002-01-31 2003-08-15 Olympus Optical Co Ltd 光学式エンコーダーおよびそのセンサーヘッド
JP2006021344A (ja) * 2004-07-06 2006-01-26 Fuji Photo Film Co Ltd 光定着器
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JP2011134463A (ja) 2009-12-22 2011-07-07 Rohm Co Ltd 検出センサ、および検出システム
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CN113272971A (zh) 2021-08-17
EP3905342A1 (en) 2021-11-03
US20220054027A1 (en) 2022-02-24
EP3905342A4 (en) 2022-09-21
JP7267304B2 (ja) 2023-05-01

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