WO2020116448A1 - リフロー対応ダイシングテープ - Google Patents
リフロー対応ダイシングテープ Download PDFInfo
- Publication number
- WO2020116448A1 WO2020116448A1 PCT/JP2019/047232 JP2019047232W WO2020116448A1 WO 2020116448 A1 WO2020116448 A1 WO 2020116448A1 JP 2019047232 W JP2019047232 W JP 2019047232W WO 2020116448 A1 WO2020116448 A1 WO 2020116448A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- carbon atoms
- radiation
- meth
- adhesive layer
- Prior art date
Links
- 0 C*c(c(S)c(C(C(*)(*)N(C)*)=O)c(S)c1*)c1SC(C)(C)C(*)(*)C(C)(C)C(O**)=O Chemical compound C*c(c(S)c(C(C(*)(*)N(C)*)=O)c(S)c1*)c1SC(C)(C)C(*)(*)C(C)(C)C(O**)=O 0.000 description 2
- BBASEKHCWSHGQP-LICLKQGHSA-N C/C(/C(c(cc1)ccc1Sc(cc1)ccc1C(O)=O)=O)=N\O Chemical compound C/C(/C(c(cc1)ccc1Sc(cc1)ccc1C(O)=O)=O)=N\O BBASEKHCWSHGQP-LICLKQGHSA-N 0.000 description 1
- GDUZPNKSJOOIDA-UHFFFAOYSA-N CC(C(OC1CC2OC2CC1)=O)=C Chemical compound CC(C(OC1CC2OC2CC1)=O)=C GDUZPNKSJOOIDA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Definitions
- the present invention relates to a reflowable dicing tape used in a semiconductor manufacturing process.
- Patent Document 1 discloses a tape using a pressure-sensitive adhesive layer that is cured by irradiating an energy ray to induce a crosslinking reaction. ing.
- glue adheresive
- the photopolymerization initiator contained in the pressure-sensitive adhesive layer splits and becomes a low molecular weight, which causes outgas.
- the outgas generated from the adhesive floats and the chips cannot be fixed and peel off from the dicing tape. I have something to do.
- the tape that has undergone the reflow process is peeled from the silicon wafer before the dicing process, and another tape for the dicing process is attached to the silicon wafer.
- Such tape replacement causes a deterioration in throughput and increases the amount of waste, and therefore improvement is desired.
- the present invention has been made based on the above problems, and an object of the present invention is to provide a reflow-compatible dicing tape that suppresses the generation of outgas from a radiation-curable pressure-sensitive adhesive layer and has excellent stain resistance. To do.
- the present inventor diligently studied the physical properties and materials of the heat-resistant adhesive tape in order to achieve the above object.
- a tape containing a radiation-curable pressure-sensitive adhesive which was bonded to the radiation-curable pressure-sensitive adhesive layer with a silicon wafer as an adherend, was irradiated with radiation, and was subjected to heat treatment at 210° C. for 10 minutes.
- the gist of the configuration of the present invention is as follows. [1] A base layer and a radiation-curable pressure-sensitive adhesive layer provided on the base layer, After the silicon wafer is attached to the radiation-curable pressure-sensitive adhesive layer, radiation treatment is performed, and then heat treatment is performed at 210° C. for 10 minutes, and after the heat treatment, the silicon wafer is peeled from the radiation-curable pressure-sensitive adhesive layer. A reflow-compatible dicing tape having a carbon content of 30 mol% or less when the bonded surface of the silicon wafer is measured by X-ray photoelectron spectroscopy.
- the radiation-curable pressure-sensitive adhesive layer has a cyclic structure in which a polymerizable compound having an ethylenically unsaturated bond, a polymer of the polymerizable compound having an ethylenically unsaturated bond, and/or a cation and/or anion reacts.
- the polymer of the polymerizable compound having an ethylenically unsaturated bond includes a (meth)acrylic polymer that is a polymer of a monomer containing (meth)acrylic acid and/or (meth)acrylate [2 ]
- the radiation-curable pressure-sensitive adhesive layer of the dicing tape bonded to the silicon wafer before the reflow step is pre-irradiated with radiation, so that the molecular weight of the main component constituting the radiation-curable pressure-sensitive adhesive layer is cross-linked. Increases due to reaction, etc. Even if the dicing tape contains a low molecular component, the low molecular component can be incorporated into the main skeleton to reduce the volatile component when the molecular weight of the main component constituting the radiation-curable pressure-sensitive adhesive layer increases. .. Therefore, the reflow-compatible dicing tape of the present invention can reduce outgas components.
- the adhesive of the radiation-curable adhesive layer remains on the silicon wafer, so-called adhesive residue can be prevented, and the radiation-curable adhesive layer can be prevented. Since it is possible to prevent the silicon wafer from floating from the dicing tape due to the generation of outgas from the adhesive layer, it is possible to prevent chip jump.
- the reflow compatible dicing tape of the present invention will be described below.
- the reflow-compatible dicing tape of the present invention includes a base material layer and a radiation-curable pressure-sensitive adhesive layer provided on the base material layer.
- the radiation-curable pressure-sensitive adhesive layer can be formed by applying a radiation-curable pressure-sensitive adhesive on the base material layer.
- the radiation curable pressure-sensitive adhesive layer of the reflowable dicing tape of the present invention is measured according to JIS Z0237 after irradiation with radiation having a wavelength of 350 nm at 1000 mJ/cm 2 and heat treatment at 210° C. for 10 minutes.
- the adhesive strength is not particularly limited, but its lower limit value is to prevent the so-called chip jump in which the chip cannot be fixed during the dicing process and the chip flies, or the peeling during the process including transportation is surely prevented.
- 0.3 N/25 mm width or more is preferable, and 0.5 N/25 mm width or more is particularly preferable.
- the upper limit of the adhesive strength is to reliably prevent a so-called adhesive residue, which is a part of the radiation-curable adhesive layer adhered to the adherend when the reflowable dicing tape is peeled off. It is preferably 0 N/25 mm or less, and particularly preferably 1.5 N/25 mm width or less.
- the material for the base material layer is not particularly limited. However, since the base material layer is heated together with the radiation-curable pressure-sensitive adhesive layer, it is heated to 210° C. or higher. Therefore, the base material layer needs to have sufficient heat resistance under the above heating conditions.
- a base material layer for example, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, a polyether sulfone (PES) film, a polyetherimide (PEI) film, a polysulfone (PSF) film, Examples thereof include polyphenylene sulfide (PPS) film, polyether ether ketone (PEEK) film, polyarylate (PAR) film, aramid film, polyimide film, liquid crystal polymer (PCP) film and the like.
- PPS polyphenylene sulfide
- PEEK polyether ether ketone
- PAR polyarylate
- aramid film polyimide film
- PCP liquid crystal polymer
- a polyether ether ketone (PEEK) film is particularly preferable from the viewpoint of chucking property during the dicing process.
- the thickness of the base material layer can be appropriately selected according to usage conditions and the like, and is preferably within a range of 5 to 250 ⁇ m, for example.
- the thickness of the base material layer is within the above numerical range, the reflow-compatible dicing tape can be prevented from being broken or torn, and excellent handling properties can be obtained.
- the radiation-curable pressure-sensitive adhesive layer is prepared by bonding an adherend to the radiation-curable pressure-sensitive adhesive layer, and then subjecting it to heat treatment at 210° C. for 10 minutes after irradiation, and after the heat treatment, the radiation-curable pressure-sensitive adhesive layer
- the amount of carbon is 30 mol% or less.
- the conditions for irradiation with radiation include irradiation with radiation having a wavelength of 350 nm at 1000 mJ/cm 2 .
- the carbon content on the peeled surface of the adherend is reduced to 30 mol% or less even after heat treatment at 210° C. for 10 minutes after irradiation with radiation. Therefore, the pressure-sensitive adhesive of the radiation-curable pressure-sensitive adhesive layer is prevented from remaining on the adherend, and the adherend is also prevented from floating from the dicing tape.
- the amount of carbon on the peeled surface of the adherend is not particularly limited as long as it is 30 mol% or less, but 25 mol% or less is particularly preferable.
- the carbon amount on the peeling surface of the adherend means the ratio of carbon in the total amount of the components adhering to the peeling surface of the adherend.
- the radiation-curable adhesive layer contains an adhesive as an adhesive component.
- the adhesive is a polymerizable compound having an ethylenically unsaturated bond as a main component, a polymer of a polymerizable compound having an ethylenically unsaturated bond, and/or a compound having a cyclic structure that reacts with a cation and/or anion, And a polymerization initiator.
- the polymerizable compound having an ethylenically unsaturated bond that is blended as the main component of the pressure-sensitive adhesive is not particularly limited, and one that has been blended with a conventional photosensitive composition is used. be able to.
- Examples of the polymerizable compound having an ethylenically unsaturated bond include, for example, unsaturated aliphatic hydrocarbons such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene; (meth)acrylic acid , ⁇ -chloro(meth)acrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetic acid, allyl acetic acid, cinnamic acid, sorbic acid, mesaconic acid, etc.
- unsaturated aliphatic hydrocarbons such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene
- Carboxylic acid having a saturated bond both mono[2-(meth)acryloyloxyethyl]succinate, mono[2-(meth)acryloyloxyethyl]phthalate, ⁇ -carboxypolycaprolactone mono(meth)acrylate, etc.
- Polymeric mono(meth)acrylates having a carboxy group and a hydroxyl group at the terminal hydroxyethyl (meth)acrylate malate, hydroxypropyl (meth)acrylate malate, dicyclopentadiene malate or one carboxyl group and two or more Unsaturated polybasic acids such as polyfunctional (meth)acrylates having a (meth)acryloyl group; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, (meth)acrylic acid Glycidyl, the following compound No. A1 to No.
- A4 methyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, -t-butyl (meth)acrylate, cyclohexyl (meth)acrylate, n-octyl (meth)acrylate, ( Isooctyl (meth)acrylate, isononyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, methoxyethyl (meth)acrylate, dimethylaminomethyl (meth)acrylate, dimethyl (meth)acrylate Aminoethyl, aminopropyl (meth)acrylate, dimethylaminopropyl (meth)acrylate, ethoxyethyl (meth)acrylate, poly(ethoxy)ethyl (meth)acrylate, butoxyethoxyethyl (meth)acrylate, (meth ) Ethylhexy
- Examples of the other polymerizable compound having an ethylenically unsaturated bond include, for example, metal salts of (meth)acrylic acid such as zinc (meth)acrylate and magnesium (meth)acrylate; maleic anhydride, itaconic acid.
- Unsaturated aldehydes unsaturated nitriles such as (meth)acrylonitrile, ⁇ -chloroacrylonitrile, vinylidene cyanide, allyl cyanide; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, Unsaturated aromatic compounds such as 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinylphenol, vinylsulfonic acid, 4-vinylbenzenesulfonic acid, vinylbenzyl methyl ether, vinylbenzyl glycidyl ether; methyl vinyl ketone, etc.
- unsaturated nitriles such as (meth)acrylonitrile, ⁇ -chloroacrylonitrile, vinylidene cyanide, allyl cyanide
- styrene 4-methylstyrene, 4-ethy
- Unsaturated ketone compounds unsaturated amine compounds such as vinylamine, allylamine, N-vinylpyrrolidone, vinylpiperidine; vinyl alcohols such as allyl alcohol, crotyl alcohol; vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl ether, Vinyl ethers such as allyl glycidyl ether; unsaturated imides such as maleimide, N-phenylmaleimide and N-cyclohexylmaleimide; indenes such as indene and 1-methylindene; aliphatic conjugation such as 1,3-butadiene, isoprene and chloroprene Dienes; polystyrene, polymethyl (meth) acrylate, poly-n-butyl (meth) acrylate, polysiloxane, etc.
- unsaturated amine compounds such as vinylamine, allylamine, N-vinylpyrroli
- Macromonomers having a mono (meth) acryloyl group at the end of the polymer molecular chain vinyl chloride, vinyl Ridene chloride, divinyl succinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, hydroxyl group-containing vinyl monomer and polyisocyanate compound
- vinyl urethane compounds hydroxyl group-containing vinyl monomers, and vinyl epoxy compounds such as polyepoxy compounds. These compounds may be used alone or in combination of two or more.
- (meth)acrylic acid means acrylic acid and/or methacrylic acid
- (meth)acrylate” means acrylate and/or methacrylate.
- an epoxy compound is reacted with an unsaturated monocarboxylic acid, and the generated hydroxyl group is reacted with a polybasic acid and/or a polybasic acid anhydride.
- the polybasic acid-modified unsaturated monocarboxylic oxide epoxy compound thus obtained can be mentioned.
- Examples of the epoxy compound that can be used for preparing the polybasic acid-modified unsaturated monocarboxylic oxide epoxy compound include an epoxy compound that is a compound having a cyclic structure that reacts with the above-mentioned cation and/or anion.
- Examples of the unsaturated monocarboxylic acid that can be used for preparing the polybasic acid-modified unsaturated monocarboxylic oxide epoxy compound include (meth)acrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl (meth)acrylate. Examples thereof include malate, hydroxyethyl(meth)acrylate maleate, hydroxypropyl(meth)acrylate maleate, hydroxypropyl(meth)acrylate maleate, dicyclopentadiene maleate and the like.
- polybasic acid-modified unsaturated monocarboxylic acid epoxy compound examples include biphenyltetracarboxylic acid, tetrahydrophthalic acid, succinic acid, biphthalic acid, maleic acid, trimellitic acid, pyromellitic acid, and 2.
- 2'-3,3'-benzophenone tetracarboxylic acid hexahydrophthalic acid, methyltetrahydrophthalic acid, nadic acid, methylnadic acid, trialkyltetrahydrophthalic acid, hexahydrophthalic acid, 5-(2,5-dioxo Tetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic acid, trialkyltetrahydrophthalic acid-maleic acid adduct, dodecenylsuccinic acid, methylhymic acid and the like can be mentioned.
- polybasic acid anhydrides include anhydrides of the above-mentioned polybasic acids, ethylene glycol bisanhydrotrimellitate, glycerol trisanhydrotrimellitate, and the like.
- the reaction molar ratio of the epoxy compound, unsaturated monocarboxylic acid, polybasic acid and/or polybasic acid anhydride is, for example, the epoxy group of the epoxy compound.
- the epoxy adduct having a structure in which 0.1 to 1.0 of the carboxyl groups of the unsaturated monocarboxylic acid are added to one of the above the polybasic acid is added to one of the hydroxyl groups of the epoxy adduct. And/or it is preferable that the ratio of polybasic acid anhydride is 0.1 to 1.0.
- the reaction of the epoxy compound, unsaturated monocarboxylic acid, polybasic acid and/or polybasic acid anhydride can be carried out according to a conventional method.
- Polymer of Polymerizable Compound Having Ethylenically Unsaturated Bond As the polymer of the polymerizable compound having ethylenically unsaturated bond, which is blended as the main component of the pressure-sensitive adhesive, for example, the above-mentioned polymerization having ethylenically unsaturated bond Examples thereof include polymers and copolymers of the organic compound.
- a (meth)acrylic polymer which is a polymer of a monomer containing (meth)acrylic acid and/or the above-mentioned (meth)acrylate, is preferable from the viewpoint of easily controlling the molecular weight and adjusting the adhesive strength. preferable.
- the compound having a cyclic structure reacting with cation and/or anion, which is blended as a main component of the pressure-sensitive adhesive is, for example, an oxygen atom such as an epoxy compound or glycidyl ethers.
- glycidyl ethers examples include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8-octanediol diglycidyl ether, 1, 10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri(glycidyloxymethyl)propane, 1,1,1-tri(glycidyloxymethyl)ethane, 1,1,1-tri(glycidy
- Examples of the compound having a cyclic structure which reacts with a cation and/or anion to be blended as the main component of the pressure-sensitive adhesive include a compound having a 4-membered ring structure having an oxygen atom such as oxetane. These compounds may be used alone or in combination of two or more.
- Photopolymerization initiator promotes photocuring when a polymerizable compound having an ethylenically unsaturated bond is photocured by irradiating the polymerizable compound having an ethylenically unsaturated bond with an active energy ray. Exert the effect of causing.
- a known polymerization initiator can be appropriately selected, and examples thereof include ⁇ -hydroxyacetophenone, ⁇ -aminoalkylphenone, benzophenone, phenylbiphenyl ketone, 1-hydroxy-1-benzoylcyclohexane, benzoin, and benzyldimethylketal.
- Examples of ⁇ -aminoalkylphenones include compounds represented by the following formulas: (In the formula, R 1 and R 2 are each independently a hydrogen atom; a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms; A phenyl group substituted or unsubstituted by an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, An arylalkyl group having 7 to 30 carbon atoms which is substituted or unsubstituted by a halogen atom, a cyano group or a nitro group; represents an alkenyl group having 2 to 12 carbon atom
- R 14 , R 15 , R 16 , R 17 and R 18 are each a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms;
- R 1 and R 2 are each independently a hydrogen atom; a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms; A phenyl group substituted or unsubstituted by an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, An arylalkyl group having 7 to 30 carbon atoms which is substituted or unsubstituted with a halogen atom, a cyano group or a nitro group; represents an alkenyl group having 2 to 12 carbon atoms, and R 1 and R 2 are connected to each other.
- R 3 and R 4 are each independently a hydrogen atom; a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms; ⁇ 4 alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group substituted or unsubstituted phenyl group; alkyl group having 1 to 4 carbon atoms, hydroxyl group, having 1 to 4 carbon atoms Alkoxy group, amino group, alkylthio group having 1 to 4 carbon atoms, carboxyl group, halogen atom, cyano group or nitro group, substituted or unsubstituted arylalkyl group having 7 to 30 carbon atoms; number of carbon atoms 2 to 12 represents an alkenyl group, and R 3 and R 4 may combine to form a 3 to
- an unsubstituted alkyl group having 1 to 8 carbon atoms an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted carbon atom 7
- an arylalkyl group of X represents a single bond or an n-valent organic group, an oxygen atom, a sulfur atom or a nitrogen atom, n is a number of 2 to 6, and the n groups are the same as each other.
- R 1 and R 2 are each independently a hydrogen atom; a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms; A phenyl group substituted or unsubstituted by an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group; an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, An arylalkyl group having 7 to 30 carbon atoms which is substituted or unsubstituted with a halogen atom, a cyano group or a nitro group; represents an alkenyl group having 2 to 12 carbon atoms, and R 1 and R 2 are connected to each other.
- R 3 and R 4 are each independently a hydrogen atom; a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms; ⁇ 4 alkyl group, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group substituted or unsubstituted phenyl group; alkyl group having 1 to 4 carbon atoms, hydroxyl group, having 1 to 4 carbon atoms Alkoxy group, amino group, alkylthio group having 1 to 4 carbon atoms, carboxyl group, halogen atom, cyano group or nitro group, substituted or unsubstituted arylalkyl group having 7 to 30 carbon atoms; number of carbon atoms 2 to 12 alkenyl groups; R 3 and R 4 may combine to form a 3 to 6 membere
- Group represents an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted arylalkyl group having 7 to 30 carbon atoms
- R 9 and R 10 each independently represent a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and when n is 2 or more, the same or different, n represents a number from 1 to 12
- X is a divalent organic group
- Y is a structure represented by the following formula (I-1) or (I-2), The above-mentioned alkyl group and arylalkyl group, and the methylene chain in the alkylene group are replaced with -O-, -S-, -CO-, -CO-O-, -O-CO- or -O-CO-O
- R 1′ and R 2′ are each independently a hydrogen atom; a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, or an unsubstituted alkyl group having 1 to 12 carbon atoms.
- R 12 and R 13 are each independently a hydrogen atom, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl having 7 to 30 carbon atoms. Represents a group or a heterocyclic group having 2 to 20 carbon atoms, R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 and R 21 are each independently a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group, R 22 or OR.
- R 16 and R 18 are represented, and R 16 and R 18 may be bonded to each other to form a ring, R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 and R 31 are each independently an alkyl group having 1 to 20 carbon atoms or a carbon atom having 6 to 20 carbon atoms.
- X2 represents a single bond or CO
- X3 represents an oxygen atom, a sulfur atom, a selenium atom
- CR 32 R 33 , CO, NR 34 or PR 35 R 32 , R 33 , R 34 and R 35 are each independently an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- the methylene group in the alkyl group having 1 to 20 atoms or the arylalkyl group having 7 to 30 carbon atoms may be substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocyclic group,
- the methylene chain in the alkyl or arylalkyl group may be interrupted by -O-.
- an oxime ester compound may be used as the photopolymerization initiator. Since the photopolymerization initiator is an oxime ester compound, the generation of outgas can be reliably reduced.
- R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN;
- R 11 , R 12 and R 13 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- R 11 , R 12 and R 13 Represents a heterocyclic group of the numbers 2 to 20,
- the hydrogen atom of the substituent represented by R 11 , R 12 and R 13 is further represented by OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , —NR 22 —OR 23 and —NCOR 22 —OCOR.
- R 21 , R 22 and R 23 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- R 21 , R 22 and R 23 may be further substituted with CN, a halogen atom, a hydroxyl group or a carboxyl group
- R 24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.
- R 11 , R 12 , R 13 , R 21 , R 22 and R 23 may have a branched side chain, may be cyclic alkyl, and R 12 and R 13 and R 22 and R 23 may be taken together to form a ring
- R 3 and R 4 are each independently, R 11, OR 11, SR 11, COR 11, CONR 12 R 13, NR 12 COR 11, OCOR 11, COOR 11, SCOR 11, OCSR 11, COSR 11, CSOR 11 , CN or a halogen atom
- a and b each independently represent an integer of 0 to 4
- X represents an oxygen atom, a sulfur atom, a selenium atom
- R 31 , R 32 , R 33 and R 34 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7
- R 31 , R 32 , R 33 and R 34 may have a branched side chain or may be cyclic alkyl, and R 31 , R 32 , R 33 and R 34 may be present. May independently form a ring together with either of the adjacent benzene rings, R 5 represents OH, COOH or a group represented by the following general formula (II).
- Z 1 is a bond, and is —O—, —S—, —NR 22 —, —NR 22 CO—, —SO 2 —, —CS—, —OCO— or —COO—
- Z 2 is a bond and is an alkyl group having 1 to 20 carbon atoms, which is substituted with 1 to 3 R 6 , an aryl group having 6 to 30 carbon atoms, and an arylalkyl group having 7 to 30 carbon atoms.
- the alkylene moiety of the bond represented by Z 2 is —O—, —S—, —COO—, —OCO—, —NR 22 —, —NR 22 COO—, —OCONR 22 —, —SCO—, — It may be interrupted 1 to 5 times with COS-, -OCS- or -CSO-, and the alkylene moiety of the bond represented by Z 2 may have a branched side chain or may be cyclic alkylene.
- R 6 represents OR 41 , SR 41 , CONR 42 R 43 , NR 42 COR 43 , OCOR 41 , COOR 41 , SCOR 41 , OCSR 41 , COSR 41 , CSOR 41 , CN or a halogen atom
- R 41 , R 42 and R 43 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms,
- the alkyl part of the substituent represented by R 41 , R 42 and R 43 may have a branched side chain or may be cyclic alkyl, and R 42 and R 43 are taken together to form a ring.
- c represents an integer of 1 to 3.
- R 1, R 2 and R 3 each independently represent R 11, OR 11, COR 11 , SR 11, CONR 12 R 13 or CN
- R 11, R 12 and R 13 each Independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms
- the hydrogen atom of the alkyl group, the aryl group, the arylalkyl group and the heterocyclic group is further represented by OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , —NR 22 —OR 23 , and —NCOR 22 —OCOR.
- the methylene group of the alkylene part of the group may be interrupted 1 to 5 times by an unsaturated bond, an ether bond, a thioether bond, an ester bond, a thioester bond, an amide bond or a urethane bond, and the alkyl part of the substituent is branched.
- R 3 may form a ring together with the adjacent benzene ring
- R 4 and R 5 may each independently represent R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSOR 11 , CN, a halogen atom or a hydroxyl group, and a and b are each independently. And 0 to 3.)
- R 1 and R 2 each independently represent R 11, OR 11, COR 11 , SR 11, CONR 12 R 13 or CN, R 11, R 12 and R 13 each independently, A hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms, an alkyl group,
- the hydrogen atom of the aryl group, the arylalkyl group and the heterocyclic group is further OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 , -NCOR 22 -OCOR 23 , -.
- R 21 , R 22 and R 23 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, An alkylene of the substituent represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23, which represents an arylalkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms.
- the methylene group of the moiety may be interrupted 1 to 5 times by an unsaturated bond, an ether bond, a thioether bond, an ester bond, a thioester bond, an amide bond or a urethane bond, and the alkyl part of the above substituent has a branched side chain. May be present, may be cyclic alkyl, the alkyl terminal of the above-mentioned substituent may be an unsaturated bond, and R 12 and R 13 and R 22 and R 23 are each a ring together.
- R 3 and R 4 are each independently R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 , COSR 11 , CSRR 11 , CN, a halogen atom or a hydroxyl group, a and b are each independently 0 to 4.
- X is an oxygen atom, a sulfur atom, a selenium atom, CR 31 R 32 , CO, NR 33 or PR 34 is represented, and R 31 , R 32 , R 33 and R 34 are each independent.
- R 11 Represents R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, and R 3 is bonded to one of the carbon atoms of the adjacent benzene ring via —X— to form a ring structure.
- R 3 and R 4 may be joined together to form a ring, and R 31 , R 33 and R 34 are independently, together with one of the adjacent benzene rings. And may form a ring.
- R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN;
- R 11 , R 12 and R 13 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- R 11 , R 12 and R 13 Represents a heterocyclic group of the numbers 2 to 20,
- the hydrogen atom of the groups represented by R 11 , R 12 and R 13 is further represented by R 21 , OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 , -NCOR 22.
- R 21 , R 22 and R 23 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- R 21 , R 22 and R 23 may be further substituted with a hydroxyl group, a nitro group, CN, a halogen atom, a hydroxyl group or a carboxyl group
- R 24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to
- the alkyl moiety of the group represented by R 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 may have a branched side chain or may be cyclic alkyl.
- R 3 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.
- R 3 may have a branched side chain, may be cyclic alkyl, and R 3 and R 7 , R 3 and R 8 , R 4 and R 5 , R 5 and R 6 and R 6 and R 7 may be taken together to form a ring,
- the hydrogen atom of the group represented by R 3 is further represented by R 21 , OR 21 , COR 21 , SR 21 , SR 22 NR 22 R 23 , CONR 22 R 23 , —NR 22 —OR 23 , —NCOR 22 —OCOR 23 , NR 22.
- R 4, R 5, R 6 and R 7 are each independently, R 11, OR 11, SR 11, COR 14, CONR 15 R 16, NR 12 COR 11, OCOR 11, COOR 14, SCOR 11, OCSR 11 , COSR 14 , CSOR 11 , hydroxyl group, CN or a halogen atom
- R 4 and R 5 , R 5 and R 6 and R 6 and R 7 may be taken together to form a ring
- R 14 , R 15 and R 16 represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, and the alkyl moiety of the group represented by R 14 , R 15 and R 16 has a branched side chain.
- R 8 is R 11 , OR 11 , SR 11 , COR 11 , CONR 12 R 13 , NR 12 COR 11 , OCOR 11 , COOR 11 , SCOR 11 , OCSR 11 or COSR 11.
- CSOR 11 a hydroxyl group, CN or a halogen atom, n represents 0 or 1.
- R 1 and R 2 represent R, OR, COR, SR, CONR′R′′ or CN, and R, R′ and R′′ are an alkyl group, an aryl group, an aralkyl group or a heterocycle.
- R'and R'' may together form a ring
- R 3 and R 4 each independently represent R, OR, SR, a cyano group, a halogen atom or a hydroxyl group.
- a and b are each independently 0 to 4.
- X represents an oxygen atom, a sulfur atom, a selenium atom, a carbon atom, N—R 5 or P—R 12 , and R 5 and R 12 represent Represents an alkyl group, which may be interrupted by —O—, —S—, —CO—O—, —O—CO—, —CO—S— or —S—CO—, X Is a carbon atom, R 3 and R 4 together form a ring, or R 3 is bonded to one of the carbon atoms of the adjacent benzene ring via —X— to form a ring structure.
- R 3 is bonded to one of the carbon atoms of the adjacent benzene ring via —X—.
- R 3 and R 4 may together form a ring, and R 5 and R 12 may independently form a ring together with an adjacent benzene ring. Good too.
- Y 1 represents an oxygen atom, a sulfur atom or a selenium atom
- a 1 Represents a heterocyclic group
- m represents an integer of 0 to 4
- p represents an integer of 0 to 5
- q represents 0 or 1.
- R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, and R 11 , R 12 and R 13 are each independently hydrogen.
- R 21 , R 22 and R 23 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- the hydrogen atom of the substituent represented by R 21 , R 22 and R 23 which represents the heterocyclic group of the formula 2 to 20, may be substituted with CN, a halogen atom, a hydroxyl group or a carboxyl group,
- the alkyl part of the substituent represented by R 22 and R 23 may have a branched side chain or may be cyclic alkyl, and R 12 and R 13 and R 22 and R 23 may be the same as each other.
- R 3 , L 1 , L 2 and L 3 are R 11 , OR 11 , SR 11 , COR 14 , CONR 15 R 16 , NR 12 COR 11 , OCOR 11 , COOR 14 , SCOR 11 , OCSR 11 , COSR 14 , CSOR 11 represents a hydroxyl group, a nitro group, CN or a halogen atom, and L 1 and R 3 , R 3 and L 2 and L 2 and L 3 may combine together to form a ring, and R 14 and R 15 and R 16 are a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.
- R 4 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic ring having 2 to 20 carbon atoms.
- the alkyl moiety of the group represented by R 4 may have a branched side chain or may be a cyclic alkyl, and the hydrogen atom of the group represented by R 4 may be further represented by R 21 , OR 21 and COR.
- Z 1 and Z 2 are bonds and are a single bond, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and an arylalkyl group having 7 to 30 carbon atoms. Or represents a heterocyclic group having 2 to 20 carbon atoms.
- the alkylene portion of the bond represented by Z 1 and Z 2 is —O—, —S—, —COO—, —OCO—, —NR 24 —, —NR 24 COO—, —OCONR 24 —, —SCO.
- R 5 represents R 11, OR 11, COR 11 , SR 11, CONR 12 R 13 or CN
- R 11, R 12 and R 13 are as defined for general formula (I). ))
- R 6 , R 7 and R 8 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN, and R 11 , R 12 and R 13 are the same as those described above.
- R 9 represents OH, COOH or a group represented by general formula (II-A) below
- Y represents an oxygen atom, a sulfur atom, a selenium atom
- CR 31 R 32 , CO, NR 33 or PR 34 ⁇ represents an integer of 1 to 10
- R 31 , R 32 , R 33, and R 34 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or Represents an arylalkyl group having 7 to 30 carbon atoms
- the alkyl part of the substituent represented by R 31 , R 32 , R 33 and R 34 may have a branched side chain or may be a cyclic alkylene, and R 31 , R 32 , R 33 and R 34 are Each of them may independently form a ring together with one of the adjacent benzene rings.
- Z 3 is a bond, and is —O—, —S—, —NR 22 —, —NR 22 CO—, —SO 2 —, —CS—, —OCO— or —COO—
- Z 4 is a bond and is an alkyl group having 1 to 20 carbon atoms, which is substituted with 1 to 3 R 10 , an aryl group having 6 to 30 carbon atoms, and an arylalkyl group having 7 to 30 carbon atoms.
- Alkylene moiety of bond represented by Z 4 is, -O -, - S -, - COO -, - OCO, -NR 24 -, - NR 24 COO -, - OCONR 24 -, - SCO -, - COS It may be interrupted 1 to 5 times by —, —OCS— or —CSO—, the alkylene moiety of the bond represented by Z 4 may have a branched side chain or may be a cyclic alkylene, and R 10 Represents OR 41 , SR 41 , CONR 42 R 43 , NR 42 COR 43 , OCOR 41 , COOR 41 , SCOR 41 , OCSR 41 , COSR 41 , CSOR 41 , CN or a halogen atom, and R 41 , R 42 and R.
- And 43 each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms, and R 41 , R 42 and R
- the alkyl part of the substituent represented by 43 may have a branched side chain or may be cyclic alkylene, R 42 and R 43 may combine together to form a ring, and a is 1 to 3 Represents the integer.
- R 22 and R 24 are the same as in the general formula (I). ))
- R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms, or a heterocyclic ring-containing group having 2 to 20 carbon atoms.
- R 3 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are each independently a hydrogen atom, a halogen atom, a nitro group, a cyano group or a hydroxyl group.
- R 10 , OR 10 , SR 10 , NR 11 R 12 , COR 10 , SOR 10 , SO 2 R 10 or CONR 11 R 12 , R 10 , R 11 and R 12 each independently represent a hydrocarbon group having 1 to 20 carbon atoms or a heterocycle-containing group having 2 to 20 carbon atoms, and R 11 and R 12 are bonded to each other to form a ring.
- the hydrogen atom of the hydrocarbon group having 1 to 20 carbon atoms or the heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 1 , R 2 , R 10 , R 11 and R 12 is a halogen atom, a nitro group, It may be substituted with a cyano group, a hydroxyl group, NR 11 R 12 , a carboxyl group, a (meth)acryloyl group, an epoxy group, a vinyl group, a mercapto group, an isocyanate group, a carboxyl group or a heterocycle-containing group, and has 2 carbon atoms.
- the hydrocarbon group having 20 to 20 or the methylene group in the heterocyclic group having 2 to 20 carbon atoms is —O—, —CO—, —COO—, —OCO—, —NR 13 —, —NR 13 CO—, In some cases, it may be substituted with —S—, —SO 2 —, —SCO— or —COS—, R 13 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, R 3 and R 4 , R 4 and R 5 , R 5 and R 6 , R 6 and R 7 , R 7 and R 8, and R 8 and R 9 may combine with each other to form a ring. )
- R 1 , R 2 and R 3 represent R, OR, COR, SR, CONRR′ or CN
- R 4 represents a hydrogen atom or a methyl group
- R and R′ are alkyl groups, It represents an aryl group, an aralkyl group or a heterocyclic group, which may be substituted with a halogen atom or a heterocyclic group.
- the alkyl group and the alkylene moiety of the aralkyl group have an unsaturated bond, an ether bond or a thioether bond.
- X is the same or different and represents a halogen atom or an alkyl group
- Y 1 is oxygen.
- Y 2 represents an alkaneidyl group
- the carbon atom of the main chain of the alkaneidyl group may be substituted with an oxygen atom
- a is an integer of 0 to 4
- q represents 0 or 1.
- R 1 and R 2 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN;
- R 11 , R 12 and R 13 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkylalkyl group having 4 to 20 carbon atoms, Represents an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms,
- the hydrogen atom of the substituent represented by R 11 , R 12 and R 13 is further represented by OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , —NR 22 —OR 23 and —NCOR 22 —OCOR.
- R 21 , R 22 and R 23 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a carbon atom.
- R 21 , R 22 and R 23 may be further substituted with CN, a halogen atom, a hydroxyl group or a carboxyl group
- R 24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.
- the alkyl part of the substituent represented by R 11 , R 12 , R 13 , R 21 , R 22 and R 23 may have a branched side chain, may be cyclic alkyl, and R 12 and R 13 and R 22 and R 23 may together form a ring, Z 1 is a bond and represents a single bond, —O—, —S—, —NR 22 —, —NR 22 CO—, —SO 2 —, —CS—, —OCO— or —COO—.
- Z 2 is a bond and is a single bond, an alkanediyl group having 1 to 20 carbon atoms, an aryldiyl group having 6 to 30 carbon atoms, an arylalkyldiyl group having 7 to 30 carbon atoms, or 2 carbon atoms.
- the alkylene moiety of the bond represented by Z 2 is —O—, —S—, —COO—, —OCO—, —NR 22 —, —NR 22 COO—, —OCONR 22 —, —SCO—, — It may be interrupted 1 to 5 times by COS-, -OCS- or -CSO-, the alkylene portion of the bond represented by Z 2 may have a branched side chain, and it may be cyclic alkylene.
- X represents a bond represented by the following chemical formula (IA) or (IB). ) (In the formulas (IA) and (IB), * represents a bond.)
- R 1 and R 2 are each independently a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms, or a heterocyclic ring containing 2 to 20 carbon atoms.
- R 1 and R 2 having 1 to 20 carbon atoms represented by R 1 and R 2, -O -, - CO -, - COO -, - OCO -, - NR 3 -, - NR 3 CO -, - S -, - CS -, - SO 2 -, - SCO -, - COS -, - OCS -Or CSO- in some cases
- R 3 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms
- n represents 0 or 1.
- * means that the * moiety is bonded to an adjacent group.
- R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 and R 12 (hereinafter also referred to as R 1 to R 12 ))
- R 1 to R 12 are each independently a group represented by the following general formula (II), a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group, R 13 , OR 13 , SR 13 , NR 14 R 15 , COR.
- R 13 , SOR 13 , SO 2 R 13 or CONR 14 R 15 is represented, R 13 , R 14 and R 15 are each independently an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkylalkyl group having 4 to 20 carbon atoms, and the number of carbon atoms.
- the hydrogen atom of the aryl group having 20 to 20 carbon atoms, the arylalkyl group having 7 to 20 carbon atoms or the heterocyclic group having 2 to 20 carbon atoms is a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, a carboxyl group, It may be substituted with a methacryloyl group, an acryloyl group, an epoxy group, a vinyl group, a vinyl ether group, a mercapto group, an isocyanate group or a heterocyclic ring-containing group, and has 1 carbon atom represented by R 13 , R 14 and R 15.
- the methylene group in the group is —O—, —CO—, —COO—, —OCO—, —NR 16 —, —NR 16 CO—, —S—, —CS—, —SO 2 —, —SCO—.
- R 16 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkylalkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or Represents an arylalkyl group having 7 to 20 carbon atoms, Ring A 1 and Ring A 2 are condensed to form an aromatic ring having 30 or less carbon atoms, At least one of R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 (hereinafter also referred to as R 1 to R 10 ) is represented by the following general formula ( II) is a group represented by m is a positive integer less than or equal to the number of substituents that A 1 can take, In the case of m ⁇ 2, a plurality of R 11 may be
- R 17 and R 18 are each independently a hydrogen atom, a halogen atom, a nitro group, a cyano group, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, or a carbon atom.
- the hydrogen atom of the aryl group, the arylalkyl group having 7 to 20 carbon atoms or the heterocyclic group having 2 to 20 carbon atoms is a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, a carboxyl group, a methacryloyl group, acryloyl.
- R 17 and R 18 an alkyl group having 1 to 20 carbon atoms, carbon
- the cycloalkyl group having 3 to 20 atoms, the cycloalkylalkyl group having 4 to 20 carbon atoms, the arylalkyl group having 7 to 20 carbon atoms, or the methylene group in the heterocycle-containing group having 2 to 20 carbon atoms is- O-, -CO-, -COO-, -OCO-, -NR 19 -, -NR 19 CO-, -S-, -CS-, -SO 2 -, -SCO-, -COS-, -OCS- Or it may be replaced by CSO-, R 19 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 4 to 20 carbon atoms, the arylalkyl group having 7 to 20 carbon atoms, or the methylene group in the heterocycle-containing group having 2 to 20 carbon atoms
- the methylene group in the hydrocarbon group having 2 to 20 carbon atoms or the heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 13 , R 14 and R 15 is —O—, —CO— , -COO-, -OCO-, -NR 16 -, -NR 16 CO-, -S-, -SO 2 -, -SCO- or -COS-,
- R 16 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms
- R 11 and R 12 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a heterocycle-containing group having 2 to 20 carbon atoms
- the hydrogen atom of the hydrocarbon group having 1 to 20 carbon atoms or the heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 11 and R 12 is a halogen atom, a
- the hydrocarbon group or the methylene group in the heterocyclic ring-containing group having 2 to 20 carbon atoms is —O—, —CO—, —COO—, —OCO—, —NR 17 —, —NR 17 CO—, —S.
- R 17 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms
- At least one of R 1 to R 10 is a group represented by the following general formula (II)
- R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9, and R 9 and R 10 combine to form a ring.
- m represents 0 or 1.
- R 21 and R 22 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a heterocyclic ring-containing group having 2 to 20 carbon atoms.
- the hydrogen atom of the hydrocarbon group having 1 to 20 carbon atoms or the heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 21 and R 22 is a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, a carboxyl group.
- the hydrocarbon group or the methylene group in the heterocyclic ring-containing group having 2 to 20 carbon atoms is -O-, -CO-, -COO-, -OCO-, -NR 23 -, -NR 23 CO-, -S. -, -SO 2 -, -SCO- or -COS- may be substituted,
- R 23 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, n represents 0 or 1. )
- a photopolymerization initiator having a high molecular weight is preferable from the viewpoint of surely suppressing the generation of outgas by preventing it from causing outgas even if the photopolymerization initiator is split, Specifically, a photopolymerization initiator having a molecular weight of 400 or more is preferable, and a photopolymerization initiator having a molecular weight of 500 or more is particularly preferable.
- the upper limit of the molecular weight of the photopolymerization initiator is not particularly limited, but is, for example, 10,000 or less.
- the blending amount of the photopolymerization initiator is not particularly limited and can be appropriately selected. For example, 0.1 to 10% by mass is preferable and 100% by mass is particularly preferable in 100% by mass of the adhesive.
- various additives such as a plasticizer, a pigment, a dye, an antiaging agent, an antistatic agent, and a filler added to improve the physical properties of the pressure-sensitive adhesive layer such as elastic modulus are added as optional components. Agents can also be added.
- the thickness of the radiation-curable pressure-sensitive adhesive layer is not particularly limited, but is preferably 1 to 50 ⁇ m, particularly preferably 5 to 25 ⁇ m. If the thickness of the radiation-curable pressure-sensitive adhesive layer is less than 1 ⁇ m, the ability to follow the adherend may be impaired, and the adhesion force in dicing after the reflow step may be reduced. On the other hand, if the thickness of the radiation-curable pressure-sensitive adhesive layer is more than 50 ⁇ m, the pressure-sensitive adhesive itself may be broken and adhesive residue that adheres to the adherend lacking on the adherend may occur.
- the type of radiation is appropriately set according to the type of adhesive contained in the radiation-curable adhesive layer.
- the radiation include ultraviolet rays and electron beams.
- ultraviolet rays are particularly preferable among these radiations. That is, the radiation-curable adhesive layer is particularly preferably an ultraviolet-curable adhesive layer, and the adhesive is particularly preferably an ultraviolet-curable adhesive layer.
- the generation method of ultraviolet rays is not particularly limited, and conventionally known generation methods can be appropriately adopted.
- Specific examples of the method of generating ultraviolet rays include a discharge lamp method (arc lamp), a flash method, and a laser method.
- the discharge lamp method is preferable from the viewpoint of industrial production, and among the discharge lamp methods, the irradiation method using a high-pressure mercury lamp or a metal halide lamp is particularly preferable from the viewpoint of ultraviolet irradiation efficiency.
- the wavelength in the ultraviolet region is not particularly limited, but it is within the range of 250 nm to 400 nm in terms of the wavelength used for general photocuring and the wavelength of the ultraviolet ray generation source used in the irradiation method. Preferably.
- the irradiation amount of ultraviolet rays is not particularly limited as long as it is an irradiation amount capable of producing the effect of the photopolymerization initiator by ultraviolet rays. Specifically, for example, preferably 10 ⁇ 3000mJ / cm 2, particularly preferably 50 ⁇ 2000mJ / cm 2. If the irradiation amount of ultraviolet rays is less than 10 mJ/cm 2 , the adhesive may not be sufficiently cured. Further, when the irradiation amount of ultraviolet rays exceeds 3000 mJ/cm 2 , photocuring of the pressure-sensitive adhesive may proceed excessively, and the radiation-curable pressure-sensitive adhesive layer may crack.
- a silicon wafer As an adherend of the reflowable dicing tape of the present invention, for example, a silicon wafer can be cited.
- Example 1 ⁇ -Hydroxyacetophenone (Irugacure 184, manufactured by BASF) was used as a photopolymerization initiator.
- ⁇ -Hydroxyacetophenone and an acrylic copolymer (Mw 700,000) synthesized by mixing 5 parts by mass of a (meth)acrylic acid monomer with 100 parts by mass of a butyl (meth)acrylate monomer,
- a radiation-curable pressure-sensitive adhesive was prepared by mixing acetophenone:acrylic copolymer at a mass ratio of 5:100. This adhesive was applied to a 50 ⁇ m PEEK film, and the solvent in the adhesive was volatilized at 120° C. to prepare a reflow-compatible dicing tape as a radiation curable adhesive layer (thickness 20 ⁇ m).
- Example 2 An oxime ester compound was used as a photopolymerization initiator. The following compound (molecular weight 355) was used as the oxime ester compound.
- the oxime ester compound used in Example 2 was prepared as follows. To a solution of 92 g of dichloroethane and 21.7 g (163 mmol) of aluminum chloride, 20.73 g (6.5 mmol) of the following alcohol was added, and then 9.0 g (97 mmol) of propionyl chloride was added dropwise at 6°C or lower. After stirring for 1 hour, the reaction solution was poured into ice water, ethyl acetate was added to separate oil and water, and the organic layer was washed with water. The organic layer was dried over anhydrous magnesium sulfate and then desolvated to obtain 17.5 g of acyl derivative a.
- Oxime esterification A solution of 5.0 g (13 mmol) of the obtained oxime a, 2.1 g (27 mmol) of pyridine and 12 g of dimethylformamide was brought to a temperature of -10°C or lower, and 1.6 g (15 mmol) of acetic anhydride was added. After dropping, the mixture was stirred at 5° C. for 2 hours. After stirring, ethyl acetate and water were added to the reaction solution to separate oil and water, and the organic layer was washed with water. The organic layer was dried over anhydrous magnesium sulfate and then desolvated to obtain 3.5 g of the above oxime ester compound.
- An acrylic copolymer (Mw 700,000) synthesized by mixing 5 parts by mass of a (meth)acrylic acid monomer with 100 parts by mass of a butyl (meth)acrylate monomer and the oxime ester compound obtained as described above. ) was mixed with a mass ratio of oxime ester compound:acrylic copolymer of 5:100 to prepare a radiation-curable pressure-sensitive adhesive.
- This adhesive was applied to a 50 ⁇ m PEEK film, and the solvent in the adhesive was volatilized at 120° C. to prepare a reflow-compatible dicing tape as a radiation curable adhesive layer (thickness 20 ⁇ m).
- Example 3 A reflow-compatible dicing tape was prepared in the same manner as in Example 2 except that the oxime ester compound of Example 2 blended as a photopolymerization initiator was changed to the following oxime ester compound (molecular weight 445, Irugacure OXE01, manufactured by BASF). It was made.
- Example 4 A reflow-compatible dicing tape was produced in the same manner as in Example 2 except that the oxime ester compound of Example 2 blended as a photopolymerization initiator was changed to the following oxime ester compound (molecular weight 515).
- the oxime ester compound of Example 4 was charged with 10.4 g (78 mmol) of aluminum chloride and 33.0 g of ethane dichloride in a nitrogen atmosphere, 36 mmol of acid chloride under ice cooling, and then 30 mmol of nitrocarbazole compound. And 33.0 g of ethane dichloride were gradually added dropwise, and the mixture was stirred at 5°C for 30 minutes. The reaction solution was poured into ice water and oil/water separation was performed.
- Comparative Example 1 A dicing tape was prepared in the same manner as in Example 1 except that the blending amount of ⁇ -hydroxyacetophenone in Example 1 blended as a photopolymerization initiator was changed to a mass ratio of ⁇ -hydroxyacetophenone:acrylic copolymer of 10:100. Was produced.
- Chip flying prevention property After performing the heat treatment at 210° C. for 10 minutes as described above, the number of chips peeled from the dicing tape during the dicing step of dividing the silicon wafer into pieces is measured, and evaluated as follows. did. ⁇ : No chip peeled from the dicing tape ⁇ : There are chips peeled from the dicing tape, but the ratio is 1% or less ⁇ : The ratio of chips peeled from the dicing tape is more than 1% and 5% or less ⁇ : Peeled from the dicing tape More than 5% of chips
- Table 1 shows the evaluation results.
- Comparative Example 1 in which the amount of carbon was more than 30 mol% when measured by X-ray photoelectron spectroscopy, the outgas reduction property was not obtained, and the ratio of chips peeled from the dicing tape was more than 5%. Oops.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Abstract
Description
[1]基材層と該基材層上に設けられた放射線硬化型粘着剤層を備え、
前記放射線硬化型粘着剤層にシリコンウエハを貼りあわせた後に、放射線照射してから210℃にて10分の加熱処理をし、該加熱処理後に前記放射線硬化型粘着剤層から前記シリコンウエハを剥離させた際における前記シリコンウエハの貼り合わせ面をX線光電子分光法にて測定した際の炭素量が、30mol%以下であるリフロー対応ダイシングテープ。
[2]前記放射線硬化型粘着剤層が、エチレン性不飽和結合を有する重合性化合物、該エチレン性不飽和結合を有する重合性化合物の重合体並びに/またはカチオン及び/若しくはアニオンと反応する環状構造を有する化合物と、光重合開始剤と、を含む[1]に記載のリフロー対応ダイシングテープ。
[3]前記エチレン性不飽和結合を有する重合性化合物の重合体が、(メタ)アクリル酸及び/または(メタ)アクリレートを含むモノマーの重合体である(メタ)アクリル系重合体を含む[2]に記載のリフロー対応ダイシングテープ。
[4]前記光重合開始剤が、オキシムエステル化合物である[2]または[3]に記載のリフロー対応ダイシングテープ。
[5]前記光重合開始剤の分子量が、400以上である[2]乃至[4]のいずれか1つに記載のリフロー対応ダイシングテープ。
[6]前記放射線硬化型粘着剤層が、紫外線硬化型粘着剤層である[1]乃至[5]のいずれか1つに記載のリフロー対応ダイシングテープ。
[7]前記放射線硬化型粘着剤層の、波長350nmの放射線を1000mJ/cm2照射してから210℃にて10分の加熱処理をした後の、JIS Z0237に準拠して測定した粘着力が、0.3N/25mm幅以上2.0N/25mm幅以下である[1]乃至[6]のいずれか1つに記載のリフロー対応ダイシングテープ。
粘着剤の主成分として配合されるエチレン性不飽和結合を有する重合性化合物は、特に限定されず、従来の感光性組成物に配合されているものを用いることができる。エチレン性不飽和結合を有する重合性化合物としては、例えば、エチレン、プロピレン、ブチレン、イソブチレン、塩化ビニル、塩化ビニリデン、フッ化ビニリデン、テトラフルオロエチレン等の不飽和脂肪族炭化水素;(メタ)アクリル酸、α―クロル(メタ)アクリル酸、イタコン酸、マレイン酸、シトラコン酸、フマル酸、ハイミック酸、クロトン酸、イソクロトン酸、ビニル酢酸、アリル酢酸、桂皮酸、ソルビン酸、メサコン酸等のエチレン性不飽和結合を有するカルボン酸;コハク酸モノ[2-(メタ)アクリロイロキシエチル]、フタル酸モノ[2-(メタ)アクリロイロキシエチル]、ω-カルボキシポリカプロラクトンモノ(メタ)アクリレート等の両末端にカルボキシ基と水酸基とを有するポリマーのモノ(メタ)アクリレート;ヒドロキシエチル(メタ)アクリレート・マレート、ヒドロキシプロピル(メタ)アクリレート・マレート、ジシクロペンタジエン・マレートまたは1個のカルボキシル基と2個以上の(メタ)アクリロイル基とを有する多官能(メタ)アクリレート等の不飽和多塩基酸;(メタ)アクリル酸-2-ヒドロキシエチル、(メタ)アクリル酸-2-ヒドロキシプロピル、(メタ)アクリル酸グリシジル、下記化合物No.A1~No.A4、(メタ)アクリル酸メチル、(メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸-t-ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n-オクチル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸ラウリル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ジメチルアミノメチル、(メタ)アクリル酸ジメチルアミノエチル、(メタ)アクリル酸アミノプロピル、(メタ)アクリル酸ジメチルアミノプロピル、(メタ)アクリル酸エトキシエチル、(メタ)アクリル酸ポリ(エトキシ)エチル、(メタ)アクリル酸ブトキシエトキシエチル、(メタ)アクリル酸エチルヘキシル、(メタ)アクリル酸フェノキシエチル、(メタ)アクリル酸テトラヒドロフリル、(メタ)アクリル酸ビニル、(メタ)アクリル酸アリル、(メタ)アクリル酸ベンジル、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート、トリ[(メタ)アクリロイルエチル]イソシアヌレート、ポリエステル(メタ)アクリレートオリゴマー等の(メタ)アクリル酸とアルコール又はフェノールとのエステルである(メタ)アクリレートが挙げられる。
粘着剤の主成分として配合されるエチレン性不飽和結合を有する重合性化合物の重合体としては、例えば、上記したエチレン性不飽和結合を有する重合性化合物の重合体や共重合体を挙げることができる。このうち、分子量の制御が容易で粘着力の調整が行いやすいという観点から、(メタ)アクリル酸及び/または上記した(メタ)アクリレートを含むモノマーの重合体である(メタ)アクリル系重合体が好ましい。
粘着剤の主成分として配合されるカチオン及び/またはアニオンと反応する環状構造を有する化合物としては、例えば、エポキシ化合物、グリシジルエーテル類等の酸素原子を有する3員環構造を有する化合物が挙げられる。エポキシ化合物としては、フェノールノボラック型エポキシ化合物、ビフェニルノボラック型エポキシ化合物、クレゾールノボラック型エポキシ化合物、ビスフェノールAノボラック型エポキシ化合物、ジシクロペンタジエンノボラック型エポキシ化合物等のノボラック型エポキシ化合物;ビスフェノール型エポキシ化合物、多官能エポキシ基を有するポリフェニルメタン型エポキシ化合物等のエポキシ化合物、3,4-エポキシ-6-メチルシクロヘキシルメチル-3,4-エポキシ-6-メチルシクロヘキサンカルボキシレート、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート、1-エポキシエチル-3,4-エポキシシクロヘキサン等の脂環式エポキシ化合物;フタル酸ジグリシジルエステル、テトラヒドロフタル酸ジグリシジルエステル、ダイマー酸グリシジルエステル等のグリシジルエステル類;テトラグリシジルジアミノジフェニルメタン、トリグリシジルP-アミノフェノール、N,N-ジグリシジルアニリン等のグリシジルアミン類;1,3-ジグリシジル-5,5-ジメチルヒダントイン、トリグリシジルイソシアヌレート等の複素環式エポキシ化合物;ジシクロペンタジエンジオキシド等のジオキシド化合物;ナフタレン型エポキシ化合物;トリフェニルメタン型エポキシ化合物;ジシクロペンタジエン型エポキシ化合物等が挙げられる。
光重合開始剤は、エチレン性不飽和結合を有する重合性化合物に活性エネルギー線を照射することによりエチレン性不飽和結合を有する重合性化合物を光硬化させる際に、光硬化を促進させる効果を発揮する。
R3及びR4は、それぞれ独立に、水素原子;水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数1~12のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換のフェニル基;炭素原子数1~4のアルキル基、水酸基、炭素原子数1~4のアルコキシ基、アミノ基、炭素原子数1~4のアルキルチオ基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基;炭素数2~12のアルケニル基を表し、R3とR4は、連結して3~6員環の環状アルカンを形成してもよく、
R5、R6、R7及びR8は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、カルボキシル基、水酸基;ハロゲン原子で置換されている若しくは無置換の炭素原子数1~8のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基を表し、
R9、R10、R11、R12及びR13は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、カルボキシル基、水酸基;ハロゲン原子で置換されている若しくは無置換の炭素原子数1~8のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基、-OR14、-O-CO-O-R15、-NR16R17、-SR18を表し、かつ、R9、R10、R11、R12及びR13のうち少なくとも1つは、ニトロ基、-OR14、-O-CO-O-R15、-NR16R17、-SR18の群より選ばれる基であり、
R14、R15、R16、R17及びR18は、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数1~12のアルキル基;水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換のフェニル基;炭素原子数1~4のアルキル基、水酸基、炭素原子数1~4のアルコキシ基、アミノ基、炭素原子数1~4のアルキルチオ基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基;炭素数2~12のアルケニル基;炭素原子数2~12の複素環含有基、トリアルキルシリル基又はトリアリールシリル基を表し、 上記アルキル基及びアリールアルキル基中のメチレン鎖は、-O-、-S-、-NR19-、-CO-、-CO-O-、-O-CO-又は-O-CO-O-で置き換えられていてもよく、上記アルキル基の末端は不飽和結合であってもよく、
R19は、水素原子;水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数1~12のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換のフェニル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基;炭素数2~12のアルケニル基を表す。)
R3及びR4は、それぞれ独立に、水素原子;水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数1~12のアルキル基;炭素子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換のフェニル基;炭素原子数1~4のアルキル基、水酸基、炭素原子数1~4のアルコキシ基、アミノ基、炭素原子数1~4のアルキルチオ基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基;炭素原子数2~12のアルケニル基を表し、R3とR4は、連結して3~6員環の環状アルカンを形成してもよく、
R5、R6、R7、R8、R9、R10、R11及びR12は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、水酸基;ハロゲン原子で置換されている若しくは無置換の炭素原子数1~8のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基を表し、
Xは、単結合又はn価の有機基、酸素原子、硫黄原子又は窒素原子を表し、
nは、2~6の数であり、n個の基は互いに同じである。)
R3及びR4は、それぞれ独立に、水素原子;水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数1~12のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換のフェニル基;炭素原子数1~4のアルキル基、水酸基、炭素原子数1~4のアルコキシ基、アミノ基、炭素原子数1~4のアルキルチオ基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基;炭素原子数2~12のアルケニル基;R3とR4は、連結して3~6員環の環状アルカンを形成してもよく、
R5、R6、R7及びR8は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、水酸基;ハロゲン原子で置換されている若しくは無置換の炭素原子数1~8のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基を表し、
R9及びR10は、それぞれ独立に、水素原子、水酸基、カルボキシル基、ハロゲン原子または炭素原子数1~4のアルキル基を表し、nが2以上の場合は同じか又は異なり、
nは、1~12の数を表し、
Xは、二価の有機基であり、
Yは、下記式(I-1)又は(I-2)で表される構造であり、
上記アルキル基及びアリールアルキル基、ならびにアルキレン基中のメチレン鎖は、-O-、-S-、-CO-、-CO-O-、-O-CO-又は-O-CO-O-で置き換えられていてもよい。)
R3’及びR4’は、それぞれ独立に、水素原子;水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数1~12のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換のフェニル基;炭素原子数1~4のアルキル基、水酸基、炭素原子数1~4のアルコキシ基、アミノ基、炭素原子数1~4のアルキルチオ基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基;炭素原子数2~12のアルケニル基を表し、R3’とR4’は、連結して3~6員環の環状アルカンを形成してもよく、
R5’、R6’、R7’及びR8’は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、水酸基;ハロゲン原子で置換されている若しくは無置換の炭素原子数1~8のアルキル基;炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されているかあるいは無置換の炭素原子数7~30のアリールアルキル基を表し、
上記アルキル基及びアリールアルキル基、ならびにアルキレン基中のメチレン鎖は、-O-、-S-、-CO-、-CO-O-、-O-CO-又は-O-CO-O-で置き換えられていてもよい。)
R14、R15、R16、R17、R18、R19、R20及びR21は、それぞれ独立に、水素原子、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R22、OR23、SR24、NR25R26、COR27、SOR28、SO2R29又はCONR30R31を表し、R16及びR18は、互いに結合して環を形成していてもよく、
R22、R23、R24、R25、R26、R27、R28、R29、R30及びR31は、それぞれ独立に、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
X2は、単結合又はCOを表し、
X3は、酸素原子、硫黄原子、セレン原子、CR32R33、CO、NR34又はPR35を表し、
R32、R33、R34及びR35は、それぞれ独立に、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R12、R13、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34及びR35中の炭素原子数1~20のアルキル基又は炭素原子数7~30のアリールアルキル基中のメチレン基は、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基又は複素環基で置換されていてもよく、該アルキル基又はアリールアルキル基中のメチレン鎖は-O-で中断されていてもよい。)
R11、R12及びR13は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R11、R12及びR13で表わされる置換基の水素原子は、更にOR21、COR21、SR21、NR22R23、CONR22R23、-NR22-OR23、-NCOR22-OCOR23、-C(=N-OR21)-R22、-C(=N-OCOR21)-R22、CN、ハロゲン原子、又はCOOR21で置換されていてもよく、
R21、R22及びR23は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R21、R22及びR23で表される置換基の水素原子は、更にCN、ハロゲン原子、水酸基又はカルボキシル基で置換されていてもよく、
R11、R12、R13、R21、R22及びR23で表される置換基のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR24-、-NR24COO-、-OCONR24-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断されていてもよく、
R24は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R11、R12、R13、R21、R22及びR23で表される置換基のアルキル部分は、分岐側鎖があってもよく、環状アルキルであってもよく、また、R12とR13及びR22とR23はそれぞれ一緒になって環を形成していてもよく、
R3及びR4は、それぞれ独立に、R11、OR11、SR11、COR11、CONR12R13、NR12COR11、OCOR11、COOR11、SCOR11、OCSR11、COSR11、CSOR11、CN又はハロゲン原子を表し、
a及びbは、それぞれ独立に、0~4の整数を表し、
Xは、酸素原子、硫黄原子、セレン原子、CR31R32、CO、NR33又はPR34を表し、
R31、R32、R33及びR34は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基又は炭素原子数7~30のアリールアルキル基を表し、
R31、R32、R33及びR34で表される置換基のアルキル部分は、分岐側鎖があってもよく、環状アルキルであってもよく、R31、R32、R33及びR34は、それぞれ独立に、隣接するどちらかのベンゼン環と一緒になって環を形成していてもよく、
R5はOH、COOH又は下記一般式(II)で表される基を表す。
Z2は、結合手であって、1~3のR6で置換された炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
Z2で表される結合手のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR22-、-NR22COO-、-OCONR22-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断されていてもよく、Z2で表される結合手のアルキレン部分は分岐側鎖があってもよく、環状アルキレンであってもよく、
R6は、OR41、SR41、CONR42R43、NR42COR43、OCOR41、COOR41、SCOR41、OCSR41、COSR41、CSOR41、CN又はハロゲン原子を表し、
R41、R42及びR43は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基又は炭素原子数7~30のアリールアルキル基を表し、R41、R42及びR43表される置換基のアルキル部分は分岐側鎖があってもよく、環状アルキルであってもよく、R42とR43は、一緒になって環を形成していてもよく、
cは1~3の整数を表す。))
R11、R12及びR13は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R11、R12及びR13で表わされる基の水素原子は、更にR21、OR21、COR21、SR21、NR22R23、CONR22R23、-NR22-OR23、-NCOR22-OCOR23、NR22COR21、OCOR21、COOR21、SCOR21、OCSR21、COSR21、CSOR21、水酸基、ニトロ基、CN、ハロゲン原子、又はCOOR21で置換されていてもよく、
R21、R22及びR23は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R21、R22及びR23で表される基の水素原子は、更に水酸基、ニトロ基、CN、ハロゲン原子、水酸基又はカルボキシル基で置換されていてもよく、
R11、R12、R13、R21、R22及びR23で表される基のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR24-、-NR24CO-、-NR24COO-、-OCONR24-、-SCO-、-COS-、-OCS-又は-CSO-により酸素原子が隣り合わない条件で1~5回中断されていてもよく、
R24は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R11、R12、R13、R21、R22、R23及びR24で表される基のアルキル部分は、分岐側鎖があってもよく、環状アルキルであってもよく、
R3は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、R3で表される基のアルキル部分は、分岐側鎖があってもよく、環状アルキルであってもよく、また、R3とR7、R3とR8、R4とR5、R5とR6及びR6とR7はそれぞれ一緒になって環を形成していてもよく、
R3で表わされる基の水素原子は、更にR21、OR21、COR21、SR21、NR22R23、CONR22R23、-NR22-OR23、-NCOR22-OCOR23、NR22COR21、OCOR21、COOR21、SCOR21、OCSR21、COSR21、CSOR21、水酸基、ニトロ基、CN、ハロゲン原子、又はCOOR21で置換されていてもよく、
R4、R5、R6及びR7は、それぞれ独立に、R11、OR11、SR11、COR14、CONR15R16、NR12COR11、OCOR11、COOR14、SCOR11、OCSR11、COSR14、CSOR11、水酸基、CN又はハロゲン原子を表し、R4とR5、R5とR6及びR6とR7はそれぞれ一緒になって環を形成していてもよく、
R14、R15及びR16は、水素原子又は炭素原子数1~20のアルキル基を表し、R14、R15及びR16で表される基のアルキル部分は、分岐側鎖があってもよく、環状アルキルであってもよく、R8は、R11、OR11、SR11、COR11、CONR12R13、NR12COR11、OCOR11、COOR11、SCOR11、OCSR11、COSR11、CSOR11、水酸基、CN又はハロゲン原子を表し、
nは、0又は1を表す。)
R21、R22及びR23は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、R21、R22及びR23で表される置換基の水素原子は、CN、ハロゲン原子、水酸基又はカルボキシル基で置換される場合もあり、
R11、R12、R13、R21、R22及びR23で表される置換基のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR24-、-NR24COO-、-OCONR24-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断される場合もあり、R24は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、R11、R12、R13、R21、R22及びR23で表される置換基のアルキル部分は、分岐側鎖がある場合や環状アルキルである場合があり、また、R12とR13及びR22とR23はそれぞれ一緒になって環を形成する場合もあり、
R3、L1、L2及びL3は、R11、OR11、SR11、COR14、CONR15R16、NR12COR11、OCOR11、COOR14、SCOR11、OCSR11、COSR14、CSOR11、水酸基、ニトロ基、CN又はハロゲン原子を表し、L1とR3、R3とL2及びL2とL3はそれぞれ一緒になって環を形成する場合もあり、R14、R15及びR16は、水素原子又は炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、R4は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、R4で表される基のアルキル部分は、分岐側鎖がある場合や環状アルキルである場合があり、R4で表わされる基の水素原子は、更にR21、OR21、COR21、SR21、NR22R23、CONR22R23、-NR22-OR23、-NCOR22-OCOR23、NR22COR21、OCOR21、COOR21、-C(=N-OR21)-R22、-C(=N-OCOR21)-R22、SCOR21、OCSR21、COSR21、CSOR21、水酸基、ニトロ基、CN、ハロゲン原子、又はCOOR21で置換される場合もあり、Xは、直接結合、COまたは下記一般式(I-A)で表される基を表す。
Z1及びZ2で表される結合手のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR24-、-NR24COO-、-OCONR24-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断される場合もあり、Z2で表される結合手のアルキレン部分は分岐側鎖がある場合や環状アルキレンである場合もある。
R5は、R11、OR11、COR11、SR11、CONR12R13又はCNを表し、R11、R12及びR13は、上記一般式(I)と同じである。))
R9は、OH、COOH又は下記一般式(II-A)で表される基を表し、
Yは、酸素原子、硫黄原子、セレン原子、CR31R32、CO、NR33又はPR34を表し、
αは1~10の整数を表し、R31、R32、R33及びR34は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基又は炭素原子数7~30のアリールアルキル基を表し、
R31、R32、R33及びR34で表される置換基のアルキル部分は、分岐側鎖がある場合や環状アルキレンである場合もあり、R31、R32、R33及びR34は、それぞれ独立に、隣接するどちらかのベンゼン環と一緒になって環を形成する場合もある。
Z4は、結合手であって、1~3のR10で置換される炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
Z4で表される結合手のアルキレン部分は、-O-、-S-、-COO-、-OCO、-NR24-、-NR24COO-、-OCONR24-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断される場合もあり、Z4で表される結合手のアルキレン部分は分岐側鎖がある場合や環状アルキレンである場合もあり、R10は、OR41、SR41、CONR42R43、NR42COR43、OCOR41、COOR41、SCOR41、OCSR41、COSR41、CSOR41、CN又はハロゲン原子を表し、R41、R42及びR43は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基又は炭素原子数7~30のアリールアルキル基を表し、R41、R42及びR43で表される置換基のアルキル部分は分岐側鎖がある場合や環状アルキレンである場合もあり、R42とR43は、一緒になって環を形成する場合もあり、aは1~3の整数を表す。R22及びR24は、上記一般式(I)と同じである。))
R3、R4、R5、R6、R7、R8及びR9(以下、R3~R9とも記載)は、それぞれ独立に、水素原子、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R10、OR10、SR10、NR11R12、COR10、SOR10、SO2R10又はCONR11R12を表し、
R10、R11及びR12は、それぞれ独立に、炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基を表し、R11とR12は、結合して環を形成する場合もあり、
R1、R2、R10、R11及びR12で表される炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、NR11R12、カルボキシル基、(メタ)アクリロイル基、エポキシ基、ビニル基、メルカプト基、イソシアネート基、カルボキシル基又は複素環含有基で置換される場合があり、炭素原子数2~20の炭化水素基又は炭素原子数2~20の複素環含有基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR13-、-NR13CO-、-S-、-SO2-、-SCO-又は-COS-により置換される場合もあり、
R13は、水素原子、炭素原子数1~20の炭化水素基を表し、R3とR4、R4とR5、R5とR6、R6とR7、R7とR8及びR8とR9は結合して環を形成する場合もある。)
R11、R12及びR13は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R11、R12及びR13で表わされる置換基の水素原子は、更にOR21、COR21、SR21、NR22R23、CONR22R23、-NR22-OR23、-NCOR22-OCOR23、-C(=N-OR21)-R22、-C(=N-OCOR21)-R22、CN、ハロゲン原子、又はCOOR21で置換されている場合もあり、
R21、R22及びR23は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R21、R22及びR23で表される置換基の水素原子は、更にCN、ハロゲン原子、水酸基又はカルボキシル基で置換されている場合もあり、
R11、R12、R13、R21、R22及びR23で表される置換基のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR24-、-NR24COO-、-OCONR24-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断されている場合もあり、
R24は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環基を表し、
R11、R12、R13、R21、R22及びR23で表される置換基のアルキル部分は、分岐側鎖がある場合があり、環状アルキルである場合があり、また、R12とR13及びR22とR23はそれぞれ一緒になって環を形成する場合があり、
Z1は、結合手であって、単結合、-O-、-S-、-NR22-、-NR22CO-、-SO2-、-CS-、-OCO-又は-COO-を表し、
Z2は、結合手であって、単結合、炭素原子数1~20のアルカンジイル基、炭素原子数6~30のアリールジイル基、炭素原子数7~30のアリールアルキルジイル基又は炭素原子数2~20の2価の複素環基を表し、
Z2で表される結合手のアルキレン部分は、-O-、-S-、-COO-、-OCO-、-NR22-、-NR22COO-、-OCONR22-、-SCO-、-COS-、-OCS-又は-CSO-により1~5回中断されている場合があり、Z2で表される結合手のアルキレン部分は分岐側鎖がある場合があり、環状アルキレンである場合があり、
Xは下記化学式(I-A)又は(I-B)で表される結合手を表す。)
R1及びR2で表される炭素原子数1~20の炭化水素基又はR1及びR2で表される複素環を含有する炭素原子数2~20の基の水素原子は、ハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、CH2=CH-O-、メルカプト基、イソシアネート基又は複素環含有基で置換される場合があり、R1及びR2で表される炭素原子数1~20の炭化水素基又はR1及びR2で表される複素環を含有する炭素原子数2~20の基中のメチレン基は、-O-、-CO-、-COO-、-OCO-、-NR3-、-NR3CO-、-S-、-CS-、-SO2-、-SCO-、-COS-、-OCS-又はCSO-で置換される場合もあり、
R3は、水素原子又は炭素原子数1~20の炭化水素基を表し、
nは0又は1を表す。式中の*は、*部分で、隣接する基と結合することを意味する。)
R13、R14及びR15は、それぞれ独立に、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
R13、R14及びR15で表される、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基の水素原子は、ハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環含有基で置換される場合があり、R13、R14及びR15で表される、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基中のメチレン基は、-O-、-CO-、-COO-、-OCO-、-NR16-、-NR16CO-、-S-、-CS-、-SO2-、-SCO-、-COS-、-OCS-又はCSO-で置換される場合もあり、
R16は、水素原子、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~20のアリール基又は炭素原子数7~20のアリールアルキル基を表し、
環A1及び環A2は、縮合して炭素原子数30以下の芳香環を形成し、
R1、R2、R3、R4、R5、R6、R7、R8、R9及びR10(以下、R1~R10とも記載)のうち少なくとも一つが、下記一般式(II)で表される基であり、
mは、A1が取り得る置換基の数以下の正の整数であり、
m≧2の場合は、複数存在するR11が各々異なる場合があり、
nは、A2が取り得る置換基の数以下の正の整数であり、
n≧2の場合は、複数存在するR12が各々異なる場合があり、
R1とR2、R2とR3、R3とR4、R4とR5、R6とR7、R7とR8、R8とR9、R9とR10、R11とR12が結合して環を形成する場合もあり、m≧2の場合はR11とR11が結合して環を形成する場合もあり、n≧2の場合はR12とR12が結合して環を形成する場合もある。
R17及びR18で表される、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環含有基で置換される場合があり、R17及びR18で表される、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR19-、-NR19CO-、-S-、-CS-、-SO2-、-SCO-、-COS-、-OCS-又はCSO-で置換される場合もあり、
R19は、水素原子、炭素原子数1~20のアルキル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~20のアリール基又は炭素原子数7~20のアリールアルキル基を表し、
kは0又は1を表す。))
R13、R14及びR15は、それぞれ独立に、炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基を表し、
R13、R14及びR15で表される炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基の水素原子は、下記一般式(II)で表される基、ニトリル基、ハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環含有基で置換される場合があり、R13、R14及びR15で表される炭素原子数2~20の炭化水素基又は炭素原子数2~20の複素環含有基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR16-、-NR16CO-、-S-、-SO2-、-SCO-又は-COS-で置換される場合もあり、
R16は、水素原子、炭素原子数1~20の炭化水素基を表し、
R11及びR12は、それぞれ独立に水素原子、ハロゲン原子、ニトロ基、シアノ基、炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基を表し、
R11及びR12で表される炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環含有基で置換される場合があり、R11及びR12で表される炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR17-、-NR17CO-、-S-、-SO2-、-SCO-又は-COS-で置換される場合もあり、
R17は、水素原子、炭素原子数1~20の炭化水素基を表し、
R1~R10のうち少なくとも一つが、下記一般式(II)で表される基であり、
R2とR3、R3とR4、R4とR5、R6とR7、R7とR8、R8とR9及びR9とR10が結合して環を形成する場合もあり、
mは0又は1を表す。
R21及びR22で表される炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環含有基で置換される場合があり、R21及びR22で表される炭素原子数1~20の炭化水素基又は炭素原子数2~20の複素環含有基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR23-、-NR23CO-、-S-、-SO2-、-SCO-又は-COS-で置換される場合もあり、
R23は、水素原子、炭素原子数1~20の炭化水素基を表し、
nは0又は1を表す。))
光重合開始剤として、α-ヒドロキシアセトフェノン(Irugacure 184、BASF社製)を用いた。α-ヒドロキシアセトフェノンと、ブチル(メタ)アクリレートモノマー100質量部に対して(メタ)アクリル酸モノマーを5質量部配合して合成したアクリル系共重合体(Mw=70万)とを、α-ヒドロキシアセトフェノン:アクリル系共重合体の質量比5:100にて混合して、放射線硬化型の粘着剤を調製した。この粘着剤を50μmのPEEKフィルムに塗布し、粘着剤中の溶媒を120℃で揮発させて放射線硬化型粘着剤層(厚さ20um)としたリフロー対応ダイシングテープを作製した。
ジクロロエタン92gと塩化アルミ21.7g(163 mmol)の溶液に、下記アルコール20.73g(6.5mmol)を加え、次いで、6℃以下でプロピオニルクロライド9.0g(97mmol)を滴下した。1時間攪拌後、反応液を氷水に注ぎ、酢酸エチルを加え油水分離し、有機層を水で洗浄した。有機層を無水硫酸マグネシウムで乾燥後、脱溶媒しアシル体aを17.5g得た。
得られたアシル体aの13.0g(35mmol)と濃塩酸3.6g(35mmol)とジメチルホルムアミド30gの溶液に、亜硝酸イソブチル5.4g(52mmol)を加え、室温で3.5時間攪拌した。攪拌後、反応液に、酢酸エチルと水を加え油水分離し、有機層を水で洗浄した。固体の析出した有機層にヘキサンを加え、ろ過した。得られた固体を減圧乾燥し、オキシム体aを7.8g得た。
得られたオキシム体aの5.0g(13mmol)と、ピリジン2.1g(27mmol)とジメチルホルムアミド12gの溶液を、-10℃以下の状態にし、無水酢酸1.6g(15mmol)を滴下し、滴下後5℃で2時間攪拌した。攪拌後、反応液に、酢酸エチルと水を加え油水分離し、有機層を水で洗浄した。有機層を無水硫酸マグネシウムで乾燥後、脱溶媒し、上記のオキシムエステル化合物を3.5g得た。
光重合開始剤として配合した実施例2のオキシムエステル化合物を、下記のオキシムエステル化合物(分子量445、Irugacure OXE01、BASF社製)に変更した以外は、実施例2と同様にしてリフロー対応ダイシングテープを作製した。
光重合開始剤として配合した実施例2のオキシムエステル化合物を、下記のオキシムエステル化合物(分子量515)に変更した以外は、実施例2と同様にしてリフロー対応ダイシングテープを作製した。なお、実施例4のオキシムエステル化合物は、窒素雰囲気下、塩化アルミニウム10.4g(78ミリモル)及び二塩化エタン33.0gを仕込み、氷冷下で酸クロリド36ミリモル、続いてニトロカルバゾール化合物30ミリモル及び二塩化エタン33.0gを徐々に滴下し、5℃で30分間撹拌した。反応液を氷水にあけ、油水分離を行った。脱溶媒して、アシル体を得た。窒素気流下、得られたアシル体の20ミリモル、塩酸ヒドロキシルアミン2.1g(30ミリモル)、及びジメチルホルムアミド16.9gを仕込み、80℃で1時間撹拌した。室温に冷却して油水分離を行った。溶媒を留去して、残さに酢酸ブチル25.4g、続いて無水酢酸2.45g(24ミリモル)を加えて90℃で1時間撹拌し、室温に冷却した。5%水酸化ナトリウム水溶液で中和し、油水分離、脱溶媒、酢酸エチルからの再結晶を経て、目的物である下記のオキシムエステル化合物を得た。
光重合開始剤として配合した実施例1のα-ヒドロキシアセトフェノンの配合量を、α-ヒドロキシアセトフェノン:アクリル系共重合体の質量比10:100とした以外は、実施例1と同様にしてダイシングテープを作製した。
作製したリフロー対応ダイシングテープをシリコンウエハに貼り合わせて紫外線(波長365nm)を1000mJ/cm2照射した後、210℃にて10分の熱処理を行った。次に、リフロー対応ダイシングテープをシリコンウエハから剥離後、シリコンウエハのリフロー対応ダイシングテープが貼られていた面について、付着している成分全量中における炭素量をX線光電子分光法(XPS)にて測定し、以下のように評価した。なお、XPSの装置はPHI Quantes(アルバック・ファイ社製)を使用し、励起X線は単色化Al-Kα線で脱出角度は45°、wide scan方式で1350~0eVの範囲で測定を行った。分析領域は100μmφとした。
○:炭素量30mol%以下
×:炭素量30mol%超
上記した210℃にて10分の熱処理を行った際におけるアウトガスの発生の有無を、上記熱処理後における放射線硬化型粘着剤層に生じた気泡を目視及び光学顕微鏡にて観察することで評価した。
○:気泡の発生ほとんどなし
△:若干の気泡あり
×:著しく気泡あり
上記した210℃にて10分の熱処理を行った後、シリコンウエハを個片化するダイシング工程時においてダイシングテープから剥離したチップの個数を測定し、以下のように評価した。
◎:ダイシングテープから剥離したチップなし
○:ダイシングテープから剥離したチップがあるが、その割合は1%以下
△:ダイシングテープから剥離したチップの割合が1%超5%以下
×:ダイシングテープから剥離したチップの割合が5%超
Claims (7)
- 基材層と該基材層上に設けられた放射線硬化型粘着剤層を備え、
前記放射線硬化型粘着剤層にシリコンウエハを貼りあわせた後に、放射線照射してから210℃にて10分の加熱処理をし、該加熱処理後に前記放射線硬化型粘着剤層から前記シリコンウエハを剥離させた際における前記シリコンウエハの貼り合わせ面をX線光電子分光法にて測定した際の炭素量が、30mol%以下であるリフロー対応ダイシングテープ。 - 前記放射線硬化型粘着剤層が、エチレン性不飽和結合を有する重合性化合物、該エチレン性不飽和結合を有する重合性化合物の重合体並びに/またはカチオン及び/若しくはアニオンと反応する環状構造を有する化合物と、光重合開始剤と、を含む請求項1に記載のリフロー対応ダイシングテープ。
- 前記エチレン性不飽和結合を有する重合性化合物の重合体が、(メタ)アクリル酸及び/または(メタ)アクリレートを含むモノマーの重合体である(メタ)アクリル系重合体を含む請求項2に記載のリフロー対応ダイシングテープ。
- 前記光重合開始剤が、オキシムエステル化合物である請求項2または3に記載のリフロー対応ダイシングテープ。
- 前記光重合開始剤の分子量が、400以上である請求項2乃至4のいずれか1項に記載のリフロー対応ダイシングテープ。
- 前記放射線硬化型粘着剤層が、紫外線硬化型粘着剤層である請求項1乃至5のいずれか1項に記載のリフロー対応ダイシングテープ。
- 前記放射線硬化型粘着剤層の、波長350nmの放射線を1000mJ/cm2照射してから210℃にて10分の加熱処理をした後の、JIS Z0237に準拠して測定した粘着力が、0.3N/25mm幅以上2.0N/25mm幅以下である請求項1乃至6のいずれか1項に記載のリフロー対応ダイシングテープ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020537799A JP7407714B2 (ja) | 2018-12-04 | 2019-12-03 | リフロー対応ダイシングテープ |
CN201980020184.9A CN111868887A (zh) | 2018-12-04 | 2019-12-03 | 回焊对应切晶带 |
KR1020207031507A KR102403288B1 (ko) | 2018-12-04 | 2019-12-03 | 리플로 대응 다이싱 테이프 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018226963 | 2018-12-04 | ||
JP2018-226963 | 2018-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020116448A1 true WO2020116448A1 (ja) | 2020-06-11 |
Family
ID=70975451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/047232 WO2020116448A1 (ja) | 2018-12-04 | 2019-12-03 | リフロー対応ダイシングテープ |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7407714B2 (ja) |
KR (1) | KR102403288B1 (ja) |
CN (1) | CN111868887A (ja) |
TW (1) | TWI753328B (ja) |
WO (1) | WO2020116448A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7392401B2 (ja) | 2018-11-08 | 2023-12-06 | 三菱ケミカル株式会社 | 粘着剤樹脂組成物、粘着シート、活性エネルギー線硬化性粘着シート、光学部材、画像表示装置用積層体及び画像表示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008027960A (ja) * | 2006-07-18 | 2008-02-07 | Nitto Denko Corp | 耐熱ダイシングテープ又はシート |
JP2010129701A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2012033636A (ja) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100910672B1 (ko) | 2007-08-03 | 2009-08-04 | 도레이새한 주식회사 | 내열성 점착시트 |
JP4845065B2 (ja) * | 2009-08-05 | 2011-12-28 | 古河電気工業株式会社 | 粘着フィルム及び半導体ウエハ加工用テープ |
WO2011058995A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ |
KR101143109B1 (ko) * | 2010-08-05 | 2012-05-08 | 후루카와 덴키 고교 가부시키가이샤 | 점착 필름 및 반도체 웨이퍼 가공용 테이프 |
JP5834606B2 (ja) * | 2011-08-05 | 2015-12-24 | Dic株式会社 | 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体 |
JP6391597B2 (ja) * | 2014-08-29 | 2018-09-19 | 古河電気工業株式会社 | 導電性接着剤組成物 |
JP2016204406A (ja) * | 2015-04-15 | 2016-12-08 | 藤森工業株式会社 | 粘着剤層及び粘着フィルム |
JP6724907B2 (ja) * | 2015-05-01 | 2020-07-15 | コニカミノルタ株式会社 | 長尺状のガスバリア性フィルムおよびその製造方法、ならびに短尺状のガスバリア性フィルムおよびその製造方法 |
JP2017125093A (ja) * | 2016-01-12 | 2017-07-20 | 積水化学工業株式会社 | 半導体保護テープ及びウエハの処理方法 |
JP6827877B2 (ja) * | 2017-04-28 | 2021-02-10 | サンアロマー株式会社 | 中空成形用ポリプロピレン系樹脂組成物、その製造方法及び中空成形品 |
-
2019
- 2019-12-03 KR KR1020207031507A patent/KR102403288B1/ko active IP Right Grant
- 2019-12-03 JP JP2020537799A patent/JP7407714B2/ja active Active
- 2019-12-03 CN CN201980020184.9A patent/CN111868887A/zh active Pending
- 2019-12-03 WO PCT/JP2019/047232 patent/WO2020116448A1/ja active Application Filing
- 2019-12-04 TW TW108144249A patent/TWI753328B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008027960A (ja) * | 2006-07-18 | 2008-02-07 | Nitto Denko Corp | 耐熱ダイシングテープ又はシート |
JP2010129701A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2012033636A (ja) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7392401B2 (ja) | 2018-11-08 | 2023-12-06 | 三菱ケミカル株式会社 | 粘着剤樹脂組成物、粘着シート、活性エネルギー線硬化性粘着シート、光学部材、画像表示装置用積層体及び画像表示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111868887A (zh) | 2020-10-30 |
JP7407714B2 (ja) | 2024-01-04 |
KR20200138374A (ko) | 2020-12-09 |
JPWO2020116448A1 (ja) | 2021-10-14 |
KR102403288B1 (ko) | 2022-05-30 |
TW202028395A (zh) | 2020-08-01 |
TWI753328B (zh) | 2022-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5339907B2 (ja) | 光硬化型粘接着剤組成物 | |
WO2017188229A1 (ja) | 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 | |
JP6956074B2 (ja) | 保護膜形成用フィルム及び保護膜形成用複合シート | |
JPWO2017188199A1 (ja) | 保護膜形成用フィルムおよび保護膜形成用複合シート | |
JP2016141749A (ja) | 保護膜形成用シート、及び保護膜形成用複合シート | |
JP7407714B2 (ja) | リフロー対応ダイシングテープ | |
JPH10147745A (ja) | 光及び熱硬化性組成物 | |
JP7044780B2 (ja) | 樹脂膜形成用フィルム及び樹脂膜形成用複合シート | |
KR20190003944A (ko) | 보호막이 형성된 반도체 칩의 제조 방법 및 반도체 장치의 제조 방법 | |
JPWO2019082959A1 (ja) | 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 | |
JP6293051B2 (ja) | ハードディスク装置用硬化性組成物 | |
JP7159186B2 (ja) | 保護膜形成用複合シート、及び半導体チップの製造方法 | |
JP7237847B2 (ja) | 保護膜形成用複合シート、及び半導体チップの製造方法 | |
JP7086986B2 (ja) | 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 | |
JPH0782544A (ja) | 可視光硬化型接着剤 | |
JP2022089876A (ja) | 保護膜形成用フィルム及び保護膜形成用複合シート | |
JP7132938B2 (ja) | 保護膜形成用複合シート、及び半導体チップの製造方法 | |
JPH0565467A (ja) | 硬化性粘着剤組成物およびこれを用いたシートもしくはテープ | |
JP7039460B2 (ja) | 保護膜形成用複合シート | |
JP6929835B2 (ja) | 保護膜形成用複合シート | |
JP4705233B2 (ja) | 再剥離型粘着剤組成物 | |
JP2019062107A (ja) | 樹脂膜形成用複合シート | |
JP7500169B2 (ja) | 保護膜形成用複合シート | |
JP2021007168A (ja) | 保護膜形成用複合シート | |
JP2023148426A (ja) | 保護膜形成フィルム、保護膜形成用複合シート、キット、及び、保護膜形成フィルムの使用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2020537799 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19891736 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20207031507 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19891736 Country of ref document: EP Kind code of ref document: A1 |