WO2020065698A1 - Données de composant, système de création de données de composant, appareil de montage de composant et système d'optimisation de production pour ligne de montage de composants - Google Patents

Données de composant, système de création de données de composant, appareil de montage de composant et système d'optimisation de production pour ligne de montage de composants Download PDF

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Publication number
WO2020065698A1
WO2020065698A1 PCT/JP2018/035287 JP2018035287W WO2020065698A1 WO 2020065698 A1 WO2020065698 A1 WO 2020065698A1 JP 2018035287 W JP2018035287 W JP 2018035287W WO 2020065698 A1 WO2020065698 A1 WO 2020065698A1
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WIPO (PCT)
Prior art keywords
component
data
super
resolution image
image processing
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PCT/JP2018/035287
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English (en)
Japanese (ja)
Inventor
雄哉 稲浦
雅史 天野
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株式会社Ｆｕｊｉ
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Priority to JP2020547615A priority Critical patent/JP7019065B2/ja
Priority to PCT/JP2018/035287 priority patent/WO2020065698A1/fr
Publication of WO2020065698A1 publication Critical patent/WO2020065698A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present specification discloses technologies related to component data used when recognizing a component, a component data creation system that automatically creates the component data, a component mounter that uses the component data, and a production optimization system for a component mounting line. It was done.
  • Patent Document 1 International Publication WO2015 / 083220
  • dimensional information of a component to be imaged is acquired, and the component to be imaged is a small component that is difficult to recognize by normal image processing.
  • one super-resolution image (high-resolution image) is obtained from a plurality of low-resolution component images obtained by imaging the component a plurality of times while moving the camera by using the super-resolution technique.
  • the component is created and the super-resolution image is processed to recognize the part.
  • Patent Document 1 it is determined whether or not to create a super-resolution image based on whether or not a component to be imaged is a small component.
  • a component mounter that determines the necessity of a super-resolution image based on only the component size as in Patent Document 1, even if the component size does not create a super-resolution image, the terminal size is small or the terminal size is small.
  • the shape and arrangement pattern of the terminal are complicated, it may be necessary to create a super-resolution image in order to correctly recognize the terminal. Conversely, even if the component size for creating a super-resolution image is used, if the terminal size is relatively large and the terminal shape or arrangement pattern is relatively simple, the super-resolution image need not be created. In some cases, terminal recognition accuracy can be ensured from one low-resolution component image.
  • component data including shape data indicating a shape characteristic of the component used when processing the image of the component captured by the component imaging camera of the component mounter and recognizing the component.
  • shape data indicating a shape characteristic of the component used when processing the image of the component captured by the component imaging camera of the component mounter and recognizing the component.
  • a super-resolution image created by super-resolution processing of a part image is processed to include data for specifying which of the super-resolution image processing to recognize the part and to perform image processing. .
  • the component mounter uses component data including shape data indicating the geometric characteristics of the component when performing image recognition of the component. Since this component data is created for each component type, in addition to the shape data of the component type, data specifying whether to perform image processing by low-resolution image processing or super-resolution image processing is also stored in the component type. If the data is included in the component data, not only the component size of the component type but also the shape and size of the terminal, the arrangement pattern of the terminals, etc. are considered, and the image processing method suitable for the component type is included in the component data. Can be specified. This allows the component mounter to perform image processing using the image processing method specified by the component data of the component type when performing image recognition of the component, thereby performing image processing using an image processing method suitable for the component type.
  • a component mounter does not needlessly create a super-resolution image with a component type that does not originally require a super-resolution image, and minimizes the number of component types for creating a super-resolution image.
  • FIG. 1 is a vertical sectional front view showing a configuration of a camera stand for creating component data according to the first embodiment.
  • FIG. 2 is a plan view of the mounting table showing an example of the reference position mark.
  • FIG. 3 is a block diagram showing an electrical configuration of the camera stand for creating component data.
  • FIG. 4 is a diagram illustrating a first component image acquired in the first imaging.
  • FIG. 5 is a diagram illustrating a second component image acquired in the second imaging.
  • FIG. 6 is a block diagram showing the configuration of the component mounting line.
  • FIG. 7 is a flowchart illustrating the flow of processing in the first half of the component data creation program according to the first embodiment.
  • FIG. 8 is a flowchart illustrating the flow of processing in the second half of the part data creation program according to the first embodiment.
  • FIG. 9 is a flowchart illustrating a flow of processing of the image processing program of the component mounter according to the first embodiment.
  • FIG. 10 is a flowchart illustrating the flow of processing in the first half of the part data creation program according to the second embodiment.
  • FIG. 11 is a flowchart illustrating the flow of processing in the second half of the component data creation program according to the second embodiment.
  • a first embodiment will be described with reference to FIGS.
  • the configuration of the camera stand 11 for creating component data will be described with reference to FIGS.
  • a camera 13 is mounted on the upper part of the body frame 12 of the camera stand 11 for creating component data, facing downward.
  • the camera 13 is a camera of the same type as the component imaging camera 56 mounted on the component mounter 54 shown in FIG. 6, and is configured using, for example, an imaging element that captures a grayscale image (monochrome image). However, a camera using an image sensor that captures a color image may be used.
  • a lens unit 14 is attached below the camera 13
  • a coaxial epi-illumination device 15 is attached below the lens unit 14, and a side-illumination device 16 is attached below the coaxial epi-illumination device 15.
  • the coaxial epi-illumination device 15 includes a light-emitting source such as an LED that emits light in the horizontal direction from the side toward the center and a light emitting source that emits light at a right angle toward the imaging object below. And a half mirror or the like that reflects the light.
  • the side illuminating device 16 has a configuration in which, for example, upper and lower three-stage side illuminating light sources 21, 22, 23 are arranged in a bowl shape or a truncated polygonal pyramid shape.
  • the side emission light sources 21, 22, and 23 of each stage are configured by, for example, assembling a plurality of LED mounting boards on which a large number of LEDs are mounted in a polygonal ring such as an octagon.
  • the side-projection light sources 21, 22, and 23 of the respective stages with respect to the imaging target are arranged such that the illumination light of 22 and 23 irradiates the imaging target (component) located on the optical axis of the camera 13 from obliquely above.
  • the angle of side lighting is set.
  • the side-projection light sources 21, 22, and 23 of each side of the side-projection illumination device 16 are configured to be individually switchable between ON and OFF, and are controlled by an image processing device 41 (see FIG. 3) described later.
  • the lighting pattern which is a combination pattern of lighting and extinguishing of the side emission light sources 21, 22, 23 of each stage, is switched according to the type (size, shape, etc.) of the component to be imaged. Thereby, it is configured to be able to reproduce lighting conditions equivalent to those of a lighting device (not shown) mounted on the component mounter 54 that mounts the same type of component as the component to be imaged.
  • a mounting table 25 on which a component to be imaged is mounted is provided below the ⁇ side illumination device 16.
  • the mounting table 25 is horizontally supported by a moving table 27 of a moving device 26 that moves the mounting table 25 in the horizontal direction.
  • the moving device 26 is configured to use an actuator 28 such as a ball screw device, a linear motor, or a linear solenoid as a driving source, and to move the mounting table 25 in the horizontal direction by the actuator 28.
  • the moving direction of the mounting table 25 is, for example, a direction in which the component to be imaged moves obliquely within the field of view of the camera 13.
  • the moving device 26 may be configured so that the moving direction of the mounting table 25 can be adjusted.
  • At least a portion of the mounting table 25 on which components are to be mounted is subjected to a non-slip process in order to prevent the components from shifting during movement.
  • a non-slip process for example, any one of coating with a material having a high friction coefficient such as silicone, roughening processing for increasing the surface friction coefficient, and chemical surface treatment may be used.
  • at least a portion of the mounting table 25 on which components are mounted may be formed of a material having a high coefficient of friction such as silicone resin or rubber.
  • the mounting table 25 may be provided with a holder (not shown) for holding the mounted components.
  • This holder may be one that holds the components on the mounting table 25 by, for example, a negative pressure suction force or a magnetic attraction force, or one that holds the components on the mounting table 25 by the adhesive force of an adhesive tape. There may be.
  • one or a plurality of reference position marks 29 are provided as reference position portions at predetermined positions on the upper surface of the mounting table 25 which do not overlap with components to be mounted.
  • the reference position mark 29 may have any shape as long as it can be specified by image recognition.
  • the direction may be specified by the positional relationship between the plurality of reference position marks 29. If the shape of the reference position mark 29 is a shape that can specify the direction by image recognition, the number of reference position marks 29 is one. The number may be only one. Further, when the moving direction of the mounting table 25 by the moving device 26 is accurately fixed only in a fixed direction, the number of the reference position marks 29 may be only one.
  • the image processing device 41 also functions as a super-resolution image creating unit 44 (see FIG. 3), and when performing the super-resolution processing, the components on the mounting table 25 and the reference position mark 29 are displayed in the field of view of the camera 13.
  • a super-resolution image is created by performing a super-resolution process of combining and integrating.
  • the component image captured by the camera 13 is taken into the image processing device 41 (see FIG. 3) and subjected to super-resolution image processing or low-resolution image processing described later.
  • the image processing device 41 is mainly configured by a computer, and as shown in FIG. 3, an input device 42 configured by a keyboard, a mouse, a touch panel, and the like, a component image captured by the camera 13, and a super-resolution generated by super-resolution processing.
  • a display device 43 for displaying a resolution image (high-resolution image) and the like are connected.
  • the illumination mode (illumination pattern) for illuminating the components on the mounting table 25 is switched depending on the type of the components imaged by the camera 13. For example, a full lighting mode in which components are illuminated by both the coaxial epi-illumination device 15 and the side-illumination device 16, a coaxial epi-illumination mode in which components are co-axially epi-illuminated only by the co-axial epi-illumination device 15, and a side-illumination device 16. There is a side-illumination mode in which a part is only side-illuminated with only a part.
  • the mounting table 25 must be moved for each imaging position. Is stopped, and the imaging of the component that is side-illuminated by the side-illumination device 16 at that position and the imaging of the reference position mark 29 that is co-axially illuminated by the coaxial epi-illumination device 15 are separately performed.
  • the amount of movement between the positions where each component image is picked up is measured, and the measured value is used as the measured value. Based on this, the super-resolution image is created by aligning and integrating a plurality of component images captured by side projection illumination with the side projection illumination device 16.
  • the components on the mounting table 25 and the reference position mark 29 are placed in the field of view of the camera 13 and imaged to obtain a first component image (first imaging). Then, after the mounting table 25 is moved by the moving device 26 within a range where the components on the mounting table 25 and the reference position mark 29 fall within the field of view of the camera 13, the components on the mounting table 25 and the reference position are moved by the camera 13. The second component image is obtained by imaging the mark 29 (second imaging). Thereafter, the same operation is repeated to acquire a predetermined number (n) of component images.
  • the image processing device 41 performs image processing on each of the component images, and positions (X1, Y1) of the reference position mark 29 in each of the component images. X2, Y2),..., (Xn, Yn).
  • the upper right corner of each component image is set to the origin (0, 0)
  • the reference position mark 29 in each component image is obtained.
  • a super-resolution process is performed in which a predetermined number (n) of component images are aligned and integrated so that the positions coincide with each other to create one super-resolution image.
  • the component data creation system 48 includes the component data creation camera stand 11, the image processing device 41, and the like, and creates component data based on the image processing result of the image processing device 41.
  • the component data includes shape data indicating a shape characteristic of the component used when processing the image of the component captured by the component imaging camera 56 of the component mounter 54 and recognizing the component.
  • the shape data is, for example, data relating to the size (dimensions in the X, Y, and Z directions) of the component body and the terminals.
  • the width, length, lead pitch This is data such as the position and the number of leads, and in the case of a BGA component, it is data such as the bump diameter, bump pitch, bump position, and number of bumps.
  • the component data according to the first embodiment includes “low-resolution image processing” in which the component mounter 54 processes one component image captured by the component imaging camera 56 and recognizes the component. Specifies which of "super-resolution image processing" to process a super-resolution image created by super-resolution processing of a plurality of component images captured by the imaging camera 56 and recognize the component, and to perform image processing. Data to be included. Further, when the component data includes data designating the super-resolution image processing, the component data includes the magnification of the super-resolution image, the number of component images used for the super-resolution processing, and imaging of each component image. Data that specifies at least one super-resolution image processing condition of the movement amount between the positions to be performed.
  • the component data includes data for specifying an imaging condition and / or an illumination condition for imaging the component.
  • the imaging conditions include, for example, a shutter speed (exposure time), an imaging magnification, an imaging distance, and an aperture value of the component imaging camera 56
  • the illumination conditions include, for example, the brightness of the illumination light of the illumination device of the component mounter 54.
  • the image processing device 41 of the component data creation system 48 functions as the above-described super-resolution image creation unit 44 by executing a component data creation program of FIGS. 7 and 8 described below.
  • the first shape data creation unit 45 creates the part data including the shape data created from the super-resolution image and the data designating the super-resolution image processing.
  • the second shape data creating unit 46 creates shape data from one component image captured by the camera 13, the number of component images is only one (camera 13 is imaged only once).
  • the second shape data creation unit 46 in order to reduce the error occurrence rate of the low-resolution image processing, the second shape data creation unit 46 also uses the camera 13 as in the first shape data creation unit 45 in order to reduce the error rate.
  • the number of component images to be imaged is set to a plurality (the number of times of imaging by the camera 13 is set to a plurality of times), and a process of creating shape data from one component image in order for the plurality of component images is performed. If the creation of the shape data from any one of the component images fails, the first shape data creation unit 45 includes the shape data created from the super-resolution image and the data including the data designating the super-resolution image processing. Create data It is way.
  • the image processing device 41 sets the imaging conditions for imaging the component on the mounting table 25 and / or Alternatively, shape data is created by changing lighting conditions.
  • the imaging conditions are, for example, a shutter speed (exposure time) of the camera 13, an imaging magnification, an imaging distance, an aperture value, and the like
  • the illumination conditions are, for example, illumination of the coaxial incident illumination device 15 and / or the side illumination device 16. The brightness of the light, the incident angle of the illuminating light to the component (illumination angle), the illumination mode (illumination pattern), the lighting time of pulse lighting (duty ratio), and the like.
  • the image processing device 41 when creating the component data including the data designating the super-resolution image processing, the image processing device 41 generates the super-resolution image when the super-resolution image creating unit 44 creates the super-resolution image.
  • Data specifying at least one super-resolution image processing condition among a magnification, the number of component images used for super-resolution processing, and a movement amount between positions at which each component image is captured is included in the component data.
  • the image processing device 41 determines the imaging conditions when capturing the plurality of component images used for creating the super-resolution image, and And / or include data for specifying lighting conditions in the component data.
  • the imaging condition and / or an illumination condition of the component mounter 54 are changed by the component data creation system 48 into the component data. Can be set to the same conditions as when the image was created, and the image processing accuracy can be improved.
  • the image processing device 41 of the component data creation system 48 is connected to the network 51 of the component mounting line 50.
  • the component mounting line 50 is configured by arranging a plurality of component mounters 54 in a transport path 53 for transporting a circuit board 52, and picks up components supplied from a feeder 55 by the component mounters 54 with a suction nozzle.
  • the components are mounted on the substrate 52 to produce a component mounting substrate.
  • Each of the component mounters 54 includes a component imaging camera 56 that captures an image of the component sucked by the suction nozzle, an illumination device (not shown) that illuminates a component that is captured by the component imaging camera 56, and a component mounter 54.
  • the configuration includes a control device 57 for controlling the operation of the function.
  • the control device 57 of the component mounter 54 also functions as an image processing device that processes component images captured by the component imaging camera 56.
  • the control device 57 of each component mounter 54 of the component mounting line 50 acquires the component data created by the image processing device 41 of the component data creation system 48 via the network 51 of the component mounting line 50.
  • the network 51 of the component mounting line 50 includes, in addition to the image processing device 41 of the component data creation system 48, a production management device 61 that manages the production of the component mounting line 50 and a production management device that optimizes the production of the component mounting line 50.
  • the optimizing device 62 and the like are connected.
  • the component data created by the image processing device 41 of the component data creation system 48 is also transmitted to the production management device 61 and the production optimization device 62 via the network 51 of the component mounting line 50.
  • the production management device 61 receives the component data transmitted from the image processing device 41 of the component data creation system 48, and transmits the component data from the production management device 61 to the control device 57 of each component mounting machine 54 and / or Or you may make it transmit to the production optimization apparatus 62.
  • each component mounter 54 executes the image processing program of the component mounter shown in FIG. 9 to be described later during production, thereby specifying low-resolution image processing for the component data of the component sucked by the suction nozzle.
  • the processing of one part image captured by the part imaging camera 56 is performed, and the part is recognized with reference to the shape data included in the part data.
  • the component data of the component sucked by the suction nozzle includes data specifying super-resolution image processing, a plurality of component images captured by the component imaging camera 56 at different positions are subjected to the super-resolution processing.
  • the super-resolution image processing is performed by recognizing the component by referring to the shape data included in the component data.
  • each component mounter 54 includes data specifying the super-resolution image processing in the component data of the component to be imaged, and uses the magnification of the super-resolution image and the super-resolution processing.
  • data for designating at least one super-resolution image processing condition of the number of component images and the amount of movement between the positions at which each component image is captured is included, when performing super-resolution image processing, The super-resolution image processing is executed under the super-resolution image processing conditions specified by the component data.
  • the control device 57 of each component mounter 54 uses the component data.
  • Super-resolution image processing or low-resolution image processing is executed under designated imaging conditions and / or illumination conditions.
  • the production optimizing device 62 distributes a feeder 55 necessary for supplying all the component types used for the production of the component mounting board to a plurality of component mounting machines 54 constituting the component mounting line 50 and The processing of optimizing the feeder arrangement of the component mounter 54 and optimizing the production job (production program) to be executed by each component mounter 54 is performed.
  • the production optimizing device 62 uses the image processing device 41 of the component data creation system 48 for the component data used for image processing for each component type for all component types used for the production of the component mounting board. Or via the production management device 61, and in consideration of the image processing method designated by the component data and the image processing capability of each component mounter 54, the feeder arrangement of each component mounter 54 is determined. Optimize.
  • step 101 an image processing preparation work (the operator places components on the mounting table 25). Then, a preparation completion operation is performed by the input device 42).
  • step 102 the components on the mounting table 25 and the reference position mark 29 are placed in the field of view of the camera 13 and imaged to obtain a first component image (first imaging).
  • step 103 the mounting table 25 is moved by the moving device 26 within a range in which the components on the mounting table 25 and the reference position mark 29 fall within the field of view of the camera 13, and then the process proceeds to step 104.
  • step 104 To capture the second component image by capturing the component on the mounting table 25 and the reference position mark 29 (second imaging).
  • step 105 it is determined whether or not the number of times of imaging has reached a predetermined number (n times). If the number of times of imaging has not yet reached the predetermined number, the above steps 102 to 104 are repeated until the number of times reaches the predetermined number. The process is repeated to acquire a predetermined number (n) of component images.
  • step 106 the predetermined number of component images are subjected to super-resolution processing to create a super-resolution image. Thereafter, the process proceeds to step 107, where the super-resolution image is processed, and shape data indicating the shape characteristics of the component used when the component mounter 54 recognizes the component is created.
  • a component image used for low-resolution image processing is imaged a predetermined number of times.
  • the predetermined number of component images used for creating the super-resolution image described above may be used as they are, but in the low-resolution image processing, the reference position mark 29 is added to the component image. Need not be included, and only the components on the mounting table 25 need to be captured within the field of view of the camera 13 for imaging. Therefore, the component image may be captured with a high imaging magnification.
  • the predetermined number of component images used for the low-resolution image processing may be imaged at the same position, or the mounting device 26 may be used by the moving device 26 within a range where the components on the mounting table 25 fall within the field of view of the camera 13. 25 may be moved to capture images at different positions.
  • step 109 a process of creating shape data indicating the shape characteristic of the component from a single component image in order for a predetermined number of component images is performed.
  • the process of creating the shape data may be performed in parallel with the operation of capturing the component image a predetermined number of times.
  • step 110 in FIG. 8 determines whether or not the creation of shape data from any one of the predetermined number of component images has failed. If it is determined that there has been no failure to create the shape data (that is, the shape data has been successfully created for all of the predetermined number of part images), the process proceeds to step 114, where the shape data and the low Create component data including data specifying the resolution image processing.
  • a predetermined number of shape data are generated to generate shape data from each of the predetermined number of component images.
  • only one shape data may be included in the component data.
  • the shape data created from the specific component image of the second or subsequent sheet may be included in the component data.
  • the average value of a predetermined number of shape data may be calculated and the averaged shape data may be included in the component data.
  • intermediate shape data may be selected from a predetermined number of shape data and included in the component data.
  • the component data includes data for specifying an imaging condition and / or an illumination condition when the component image is captured.
  • step 110 determines whether or not the creation of shape data from any one of the predetermined number of component images has failed. If it is determined in step 110 that the creation of shape data from any one of the predetermined number of component images has failed, the process proceeds to step 111, where the creation of shape data from the super-resolution image is started. It is determined whether or not the process is successful. If it is determined that the shape data is successfully created from the super-resolution image, the process proceeds to step 112, where the shape data and the super-resolution image created from the super-resolution image are obtained. Create component data that includes data that specifies processing. Further, at least one of the magnification of the super-resolution image when the super-resolution image is created, the number of component images used for the super-resolution processing, and the moving amount between the positions where the respective component images are captured. Data specifying image processing conditions is included in the component data, and data specifying imaging conditions and / or lighting conditions when a predetermined number of component images used to create a super-resolution image are captured are also included in the
  • step 111 when it is determined in step 111 that the creation of the shape data from the super-resolution image has failed, the process proceeds to step 113, where the imaging conditions and / or the illumination conditions for imaging the component on the mounting table 25 are changed. Then, the processing after step 102 in FIG. 7 is executed again, and the processing for creating a super-resolution image from a predetermined number of component images to create shape data and the processing for creating shape data from each component image are repeated. Execute.
  • the change of the imaging condition and / or the lighting condition may be automatically set by the image processing device 41 or may be set by an operator operating the input device 42.
  • the process proceeds to step 114, where the shape data and low-resolution Create component data including data specifying image processing.
  • the component data includes data for specifying an imaging condition and / or an illumination condition when the component image is captured.
  • the creation of shape data from the super-resolution image is successful.
  • the process proceeds to step 112, where component data including shape data created from the super-resolution image and data specifying super-resolution image processing is created.
  • the component data includes data for specifying the above-described super-resolution image processing conditions and data for specifying imaging conditions and / or illumination conditions when a predetermined number of component images used for creating a super-resolution image are captured. Is included.
  • each component mounter 54 directly acquires, from the image processing device 41 of the component data creation system 48, component data to be used for image recognition of components mounted on the circuit board 52 before the start of production or production. It is obtained via the management device 61.
  • the control device 57 of each component mounter 54 executes the image processing program of the component mounter of FIG. 9 at each timing of imaging the component sucked by the suction nozzle during the production, and is designated by the component data of the component.
  • Image processing is performed by an image processing method.
  • step 201 it is determined whether super-resolution image processing is designated by component data of the component to be imaged. If it is determined that the super-resolution image processing has been designated, the processing of steps 202 to 206 is executed, and the super-resolution image is created by the component data creation system 48. In the same manner as described above, a predetermined number of component images are acquired to create a super-resolution image.
  • the component data of the component to be imaged includes data specifying super-resolution image processing conditions and data specifying imaging conditions and / or illumination conditions
  • the A super-resolution image is created by setting the resolution image processing condition, the imaging condition, and / or the illumination condition to the super-resolution image processing condition, the imaging condition, and / or the illumination condition specified by the component data.
  • step 202 a component sucked by the suction nozzle and a reference position mark (not shown) provided in a fixed positional relationship with the suction nozzle are placed in the field of view of the component imaging camera 56.
  • step 203 the suction nozzle is moved within a range in which the component and the reference position mark fall within the field of view of the camera 13, and then, to step 204, the component and the reference position mark are imaged by the component imaging camera 56. Then, a second component image is obtained (second imaging).
  • step 205 it is determined whether or not the number of times of imaging has reached a predetermined number (n times). If the number of times of imaging has not reached the predetermined number yet, the above steps 202 to 204 are repeated until the number of times reaches the predetermined number. The process is repeated to acquire a predetermined number (n) of component images.
  • step 206 the predetermined number of component images are subjected to super-resolution processing to create a super-resolution image.
  • step 208 the super-resolution image is processed, and super-resolution image processing for recognizing the component is executed by referring to the shape data included in the component data.
  • step 201 when it is determined in step 201 that super-resolution image processing is not specified in the component data of the component to be imaged, that is, when it is determined that low-resolution image processing is specified, Goes to step 207, and puts the component sucked by the suction nozzle in the field of view of the component imaging camera 56 to take an image to acquire one component image.
  • the imaging condition and / or the lighting condition is specified in the component data
  • the imaging condition and / or the lighting condition of the component mounter 54 are changed to the imaging condition and / or the lighting condition specified by the component data.
  • the setting is performed to capture one component image.
  • step 208 where one component image is processed, and low-resolution image processing for recognizing the component with reference to the shape data included in the component data is executed.
  • the component mounter 54 uses the component data including the shape data indicating the geometric characteristics of the component when performing image recognition of the component. Since this component data is created for each component type, in addition to the shape data of the component type, data specifying whether to perform image processing by low-resolution image processing or super-resolution image processing is also stored in the component type. If the data is included in the component data, not only the component size of the component type but also the shape and size of the terminal, the arrangement pattern of the terminals, etc. are considered, and the image processing method suitable for the component type is Can be specified.
  • the component mounter 54 when the component mounter 54 recognizes an image of a component, it performs image processing using an image processing method specified by component data of the component type, and performs image processing using an image processing method suitable for the component type. be able to. As a result, the component mounter 54 does not needlessly create a super-resolution image with a component type that does not originally require a super-resolution image, and minimizes the number of component types for creating a super-resolution image. In addition to being able to perform low-resolution image processing on components that originally require super-resolution images and failing to recognize terminals, image recognition of components can be performed stably. Productivity can be improved.
  • step 301 an image processing preparation work (the operator places components on the placement table 25). Then, a preparation completion operation is performed by the input device 42).
  • step 302 a predetermined number of component images are obtained by capturing a predetermined number of component images used for low-resolution image processing.
  • step 303 a predetermined number of component images are sequentially processed from one component image to generate shape data indicating the geometric characteristics of the component.
  • the process of creating the shape data may be performed in parallel with the operation of capturing the component image a predetermined number of times.
  • step 304 it is determined whether or not creation of shape data from any one of the predetermined number of component images has failed. If it is determined that there is no failure (that is, the creation of the shape data has been successful for all of the predetermined number of component images), the process proceeds to step 305, and any one of the component images is processed in the same manner as in the first embodiment. Then, the component data including the shape data created from and the data designating the low-resolution image processing is created.
  • step 304 if it is determined in step 304 that the creation of the shape data from any one of the predetermined number of component images has failed, the processing in steps 306 to 309 is executed, and In the same manner as in 1, a predetermined number of component images required to create a super-resolution image are captured while the mounting table 25 is moved by the moving device 26.
  • step 310 in FIG. 11 the process proceeds to step 310 in FIG. 11 to super-resolve the predetermined number of component images to create a super-resolution image. Thereafter, the process proceeds to step 311, where the super-resolution image is processed, and shape data indicating the shape characteristics of the component used when the component mounter 54 recognizes the component is created.
  • step 312 it is determined whether or not shape data has been successfully created from the super-resolution image.
  • step 312 it is determined whether or not shape data has been successfully created from the super-resolution image.
  • step 312 if it is determined that shape data has been successfully created from the super-resolution image, the process proceeds to step 312. Proceeding to 313, component data including shape data created from the super-resolution image and data specifying super-resolution image processing is created. Further, at least one of the magnification of the super-resolution image when the super-resolution image is created, the number of component images used for the super-resolution processing, and the moving amount between the positions where the respective component images are captured. Data specifying image processing conditions is included in the component data, and data specifying imaging conditions and / or lighting conditions when a predetermined number of component images used to create a super-resolution image are captured are also included in the component data. To be included.
  • step 312 determines whether the creation of the shape data from the super-resolution image has failed. If it is determined in step 312 that the creation of the shape data from the super-resolution image has failed, the process proceeds to step 314, and the component on the mounting table 25 is imaged in the same manner as in the first embodiment. The imaging conditions and / or illumination conditions to be performed are changed, and the processing of steps 302 to 304 in FIG. 10 is executed again.
  • the process proceeds to step 305, where the shape data and low-resolution Create component data including data specifying image processing.
  • the component data includes data for specifying an imaging condition and / or an illumination condition when the component image is captured.
  • steps 306 to 309 is executed again. After capturing a predetermined number of component images required to create a super-resolution image in the same manner as in the first embodiment, the process proceeds to step 310 in FIG. Then, in the next step 311, shape data is created from the super-resolution image.
  • the component data includes data for specifying the above-described super-resolution image processing conditions and data for specifying imaging conditions and / or illumination conditions when a predetermined number of component images used for creating a super-resolution image are captured. Is included.
  • the same effects as in the first embodiment can be obtained, and the super-resolution image creation processing can be omitted for the component types that can perform low-resolution image processing.
  • the component data creation processing can be simplified and the processing time can be reduced.
  • the number of component images captured by the camera 13 is set to a plurality (the number of times of imaging by the camera 13 is set to a plurality of times). Processing for forming shape data from one component image in order for the component images of the plurality of component images, and if the creation of shape data from any one of the plurality of component images fails, the super-resolution Although the component data including the shape data created from the image and the data specifying the super-resolution image processing is created, when the shape data is created from the component image taken by the camera 13, the image is taken by the camera 13.
  • the number of component images may be only one (the number of times of imaging by the camera 13 is only one), and shape data may be created from the single component image.
  • the reference position mark 29 which is a reference position portion provided on the upper surface of the mounting table 25 of the camera stand 11 for component data creation described in the first embodiment needs to be imaged by coaxial incident illumination with the coaxial incident illumination device 15. Therefore, when a component on the mounting table 25 is side-illuminated and imaged only by the side-illumination device 16, the movement of the mounting table 25 is stopped for each imaging position, and the side-illumination device is placed at that position. It is necessary to separately perform imaging of the component that is side-illuminated by 16 and imaging of the reference position mark 29 that is coaxially illuminated by the coaxial epi-illumination device 15, and the number of times of imaging required for super-resolution processing is doubled. .
  • a light emitting element for displaying a reference position such as an LED may be provided as a reference position on the upper surface of the mounting table 25.
  • the position and number of the light emitting elements for displaying the reference position may be the same as those of the reference position mark 29 of the first embodiment.
  • the component on the mounting table 25 may be a component that is imaged by side-illumination only with the side-illumination device 16, such as a bump component having an array of bumps.
  • a bump component it is mounted on the mounting table 25 with the bump facing upward.
  • the light-emitting element for displaying the reference position provided on the upper surface of the mounting table 25 emits light, and the light is emitted from the mounting table 25 within the field of view of the camera 13. Both the bump component and the light emitting element for displaying the reference position are imaged.
  • the light emitting element for displaying the reference position is made to emit light, and both the bump component on the mounting table 25 and the light emitting element for displaying the reference position are imaged within the field of view of the camera 13, the image is taken.
  • One image can recognize both the bump component on the mounting table 25 and the light emitting element for displaying the reference position. For this reason, even when the component on the mounting table 25 is a component such as a bump component that is imaged only by side illumination, the light-emitting element for displaying the reference position is made to emit light so that the light-emitting element for displaying the reference position is coaxially incident. There is no need to perform imaging with illumination, and the number of times of imaging required for super-resolution processing does not increase.
  • a reference unit is not provided on the upper surface of the mounting table 25, and as a sensor unit that measures the amount of movement of the mounting table 25, for example, X that measures the amount of movement in the X direction (X coordinate of the position of the mounting table 25)
  • X that measures the amount of movement in the X direction (X coordinate of the position of the mounting table 25)
  • a directional linear scale and a Y-direction linear scale for measuring the amount of movement in the Y direction (Y coordinate of the position of the mounting table 25) may be provided, and the amount of movement of the mounting table 25 may be measured using both linear scales.
  • the camera stand 11 for creating component data described in the first embodiment captures the components on the mounting table 25 at different positions by fixing the position of the camera 13 and moving the mounting table 25 by the moving device 26. However, by fixing the position of the mounting table 25 and moving the camera 13 in the horizontal direction by the moving device, a plurality of images of the parts on the mounting table 25 at different positions are acquired. You may make it acquire two part images.
  • the operator manually moves the mounting table 25 or the camera 13, and the operator manually moves the mounting table 25 or the camera 13, thereby capturing an image of a component on the mounting table 25 at a different position.
  • a plurality of component images may be acquired.
  • the present invention is not limited to the above embodiments.
  • the gist of the present invention may be such that the configuration of the moving device 26 may be changed or the configuration of a lighting device that illuminates the components on the mounting table 25 may be changed.
  • various changes can be made without departing from the scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne des données de composant comprenant des données de forme indiquant une caractéristique de forme d'un composant, les données de forme étant utilisées lors de la reconnaissance du composant par traitement d'une image du composant capturée par une caméra de capture d'image de composant (56) d'un appareil de montage de composant (54). Les données de composant comprennent, en plus des données de forme, des données indiquant si un traitement d'image doit être effectué par un processus d'image à basse résolution par lequel le composant est reconnu par traitement d'une image de composant unique capturée par la caméra de capture d'image de composant, ou par un processus d'image en super-résolution par lequel le composant est reconnu par traitement d'une image en super-résolution créée par soumission d'une pluralité d'images de composant capturées par la caméra de capture d'image de composant dans différentes positions à un processus de super-résolution. Les données de composant comprenant les données désignant le processus d'image en super-résolution comprennent des données désignant au moins une des conditions de traitement d'image en super-résolution suivantes : rapport de grossissement de l'image en super-résolution ; nombre d'images de composant utilisées pour le processus de super-résolution ; et quantité de mouvement entre les positions dans lesquelles les images de composant respectives sont capturées.
PCT/JP2018/035287 2018-09-25 2018-09-25 Données de composant, système de création de données de composant, appareil de montage de composant et système d'optimisation de production pour ligne de montage de composants WO2020065698A1 (fr)

Priority Applications (2)

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JP2020547615A JP7019065B2 (ja) 2018-09-25 2018-09-25 部品実装ラインの生産最適化システム
PCT/JP2018/035287 WO2020065698A1 (fr) 2018-09-25 2018-09-25 Données de composant, système de création de données de composant, appareil de montage de composant et système d'optimisation de production pour ligne de montage de composants

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PCT/JP2018/035287 WO2020065698A1 (fr) 2018-09-25 2018-09-25 Données de composant, système de création de données de composant, appareil de montage de composant et système d'optimisation de production pour ligne de montage de composants

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306492A (ja) * 2007-06-07 2008-12-18 Sharp Corp 画像処理装置、画像処理システム、画像処理方法、画像処理プログラムおよびコンピュータ読み取り可能な記録媒体
JP2009071137A (ja) * 2007-09-14 2009-04-02 Yamaha Motor Co Ltd 生産管理装置
JP2011155050A (ja) * 2010-01-26 2011-08-11 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2013074337A (ja) * 2011-09-26 2013-04-22 Canon Inc 撮像装置、画像処理装置、画像処理方法及びプログラム
WO2015136669A1 (fr) * 2014-03-13 2015-09-17 富士機械製造株式会社 Dispositif de traitement d'image et système de production de substrat

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306492A (ja) * 2007-06-07 2008-12-18 Sharp Corp 画像処理装置、画像処理システム、画像処理方法、画像処理プログラムおよびコンピュータ読み取り可能な記録媒体
JP2009071137A (ja) * 2007-09-14 2009-04-02 Yamaha Motor Co Ltd 生産管理装置
JP2011155050A (ja) * 2010-01-26 2011-08-11 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2013074337A (ja) * 2011-09-26 2013-04-22 Canon Inc 撮像装置、画像処理装置、画像処理方法及びプログラム
WO2015136669A1 (fr) * 2014-03-13 2015-09-17 富士機械製造株式会社 Dispositif de traitement d'image et système de production de substrat

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