WO2020062146A1 - 摄像模组中的承载结构及制造方法、摄像模组及终端设备 - Google Patents

摄像模组中的承载结构及制造方法、摄像模组及终端设备 Download PDF

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Publication number
WO2020062146A1
WO2020062146A1 PCT/CN2018/108653 CN2018108653W WO2020062146A1 WO 2020062146 A1 WO2020062146 A1 WO 2020062146A1 CN 2018108653 W CN2018108653 W CN 2018108653W WO 2020062146 A1 WO2020062146 A1 WO 2020062146A1
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WIPO (PCT)
Prior art keywords
slot
groove
bearing structure
pcb
camera module
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Application number
PCT/CN2018/108653
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English (en)
French (fr)
Inventor
冉坤
矢岛淳史
罗振东
傅立峰
林威智
黄昌福
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2018/108653 priority Critical patent/WO2020062146A1/zh
Priority to CN201880097929.7A priority patent/CN112753209B/zh
Publication of WO2020062146A1 publication Critical patent/WO2020062146A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present application relates to the field of electronic technology applications, and in particular, to a bearing structure and a manufacturing method in a camera module, a camera module, and a terminal device.
  • a camera module (also referred to as a camera module) is provided in a terminal device with a shooting function, and a user can shoot images through the camera module.
  • terminal devices are becoming miniaturized and thin.
  • the size of the camera module also needs to be reduced, especially the thickness needs to be reduced.
  • the current camera module consists of a bearing structure and a lens module.
  • the bearing structure includes: a printed circuit board (English: Printed Circuit Board) (abbreviated as: PCB), a light sensor, a filter, and a surface mount component Devices (abbreviation: SMD), the lens module includes: a zoom module and a lens.
  • PCB printed circuit board
  • SMD surface mount component Devices
  • the light sensor and the SMD are usually arranged on the PCB by an injection molding (English: molding) process.
  • injection molding multiple sets of SMD and light sensors are usually set on a large PCB motherboard, and then a protective film is formed on the photosensitive area of each light sensor. Then, the edge area and SMD of the light sensor are covered with injection molding material After the injection molding material is cured, the protective film is removed, and the PCB mother board is cut to obtain multiple bearing structures.
  • the application provides a bearing structure and a manufacturing method in a camera module, a camera module and a terminal device, which can reduce the thickness of the bearing structure in the camera module while ensuring that the light sensor is not polluted.
  • a bearing structure in a camera module including:
  • the support cover is fastened on the PCB and forms a cavity with the PCB, and the light sensor and the surface mount component are both disposed on the PCB and located in the cavity;
  • the side of the support cover remote from the PCB has a first through slot, and the orthographic projection of the first through slot on the PCB covers the orthographic projection of the surface mount component on the PCB, and the surface An end of the mounting component remote from the PCB is located in the first through slot;
  • the side of the support cover remote from the PCB has a second through slot, and the second through slot is used for light to pass through and to irradiate the light to the photosensitive area of the light sensor.
  • the support cover and the printed circuit board form a cavity
  • the support cover has a first through slot and a second through slot
  • the second through slot can allow light to pass through and illuminate the light on
  • the photosensitive area of the light sensor ensures the normal function of the light sensor.
  • the first through groove and the surface mount component overlap in the thickness direction, which can effectively reduce the thickness of the load bearing structure. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the final formation. Camera module quality.
  • the bearing structure may further include: a filter housed in the second through slot, and the filter is used to adjust the color reducibility of the camera module;
  • the wavelength range of the corresponding filter is also different.
  • different filters can be set as needed to control the light of different wavelengths to enter the light sensor.
  • a side wall of the filter is fixedly connected to a side wall of the second through slot. This makes the filter and the second through groove overlap in the thickness direction, thereby effectively reducing the thickness of the bearing structure.
  • the optical filter is bonded to at least one side wall of the second through groove by a gel material.
  • the second through groove is a rectangular groove, and at least one glue overflow groove is provided on a side of the support cover away from the PCB.
  • the at least one glue overflow groove corresponds to the at least one side wall one by one.
  • the glue grooves are rectangular grooves, and the length direction of each glue overflow groove is parallel to the length direction of the corresponding side wall.
  • the glue When bonding the filter to at least one side wall of the second through groove, the glue can be filled into the overflow groove, and the glue can overflow into the gap between the filter and the corresponding side wall through the overflow groove, Thereby, the glue can overflow uniformly, the flow rate is stable, and a better bonding effect can be achieved, and excessive glue can be prevented from overflowing to the light sensor, thereby preventing the light sensor from being polluted.
  • the side of the support cover near the PCB further has a support sheet, the support sheet is located at an edge or a corner of the second through slot, and extends toward the inside of the second through slot.
  • the filter card Connected to the space surrounded by the second through groove and the support sheet.
  • the support sheet can support the filter and avoid contact between the filter and the light sensor.
  • the second through slot is a rectangular slot
  • the filter is bonded to at most three side walls of the second through slot by a gel material
  • the support sheet is located at a target edge of the second through slot.
  • the target edge is an edge of a side wall of the second through slot except the at most three side walls.
  • the supporting sheet is provided on the edge of the side wall where the second through groove is not bonded to the filter. The supporting sheet can bear part of the force of the filter and reduce the stress of the cured glue, thereby improving the reliability of the bearing structure. Sex.
  • the target side of the light sensor is electrically connected to the PCB through a wire;
  • the wire may be a bonding wire, such as a key alloy wire, which has good electrical, thermal conductivity, mechanical properties, and chemical stability, which enables the light sensor It is stably connected with the printed circuit board, so as to achieve a good light-sensing effect of the light sensor.
  • the orientations of the at least one side wall with respect to the second through slot and the target side with respect to the light sensor are the same. In this way, the support sheet and the wires avoid each other, and will not affect each other with the wires. Under the premise of ensuring the normal function of the camera module, the thickness of the bearing structure is further reduced.
  • the target side of the light sensor is two opposite sides of the light sensor.
  • the thickness of the filter is less than or equal to the thickness of the support cover. In this way, when the filter is set in the second through groove, the filter will not protrude from the support cover, so that the overall thickness of the bearing structure can be reduced.
  • a protective material is provided in an end of the surface mount component remote from the PCB, and in a gap between the surface mount component and the first through slot. This can prevent dust from contaminating the surface mount components, and can prevent the surface mount components from reflecting the light passing through the lens module, thereby improving the imaging quality of the light sensor.
  • the protective material may be made of a gelatinous material.
  • the gelatinous material is the same as the gelatinous material used to bond the filter and the second through groove, so that the filter can be bonded with When the second through groove is used, the gel material overflows onto the surface-mount component.
  • the manufacturing process is simple, and on the other hand, the gap between the surface-mount component and the support cover can be effectively closed.
  • the support cover includes a bottom plate and a side wall located on the bottom plate.
  • the bottom plate is circular or rectangular.
  • the material of the support cover is plastic, and the support cover made of plastic is a deformable support cover. When other components are in contact with the support cover, the support cover can play a certain buffering effect to avoid damage to other components.
  • the support cover is made by an injection molding process, and the manufacturing process is simple.
  • a camera module including:
  • the lens module includes a zoom module and a lens located in the zoom module;
  • the bearing structure is the bearing structure according to any one of the first aspects, and the lens module is fixed to a side of the support cover away from the PCB.
  • a terminal device including at least one camera module, and the camera module is the camera module according to the second aspect.
  • a method for manufacturing a bearing structure in a camera module including:
  • Preparing a support cover Preparing a support cover, the bottom of the support cover having a first through slot and a second through slot;
  • the orthographic projection of the first through-groove on the PCB covers the orthographic projection of the surface mount component on the PCB, and an end of the surface mount component remote from the PCB is located in the first through hole.
  • the second through groove is used for allowing light to pass through, and to make the light shine on the photosensitive area of the light sensor.
  • the method further includes:
  • the optical filter and at least one side wall of the second through groove are bonded by a gel material.
  • the camera module and the terminal device, the support cover and the printed circuit board form a cavity, and the support cover has a first through slot and a second through slot.
  • the two through grooves can fix the filter through the support sheet, so that the light passes through the filter and shines the light on the photosensitive area of the light sensor to ensure the normal function of the light sensor.
  • There is overlap in the direction which can effectively reduce the thickness of the bearing structure. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera.
  • the quality of the module can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera.
  • FIG. 1 is a schematic diagram of an implementation environment related to a bearing structure in a camera module according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a related art camera module.
  • FIG. 3 is a schematic side view of a bearing structure in a camera module according to an embodiment of the present application.
  • FIG. 4 is a schematic side view of a bearing structure in another camera module according to an embodiment of the present application.
  • FIG. 5 is a schematic top view of a support cover according to an embodiment of the present application.
  • FIG. 6 is another schematic side view of a bearing structure in another camera module according to an embodiment of the present application.
  • FIG. 7 is a schematic side view of a camera module according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 9 is a flowchart of a manufacturing method of a bearing structure in a camera module according to an embodiment of the present application.
  • the camera module can be integrated in the terminal device, or it can be deployed separately.
  • the terminal device includes a rear case and a front cover, and a middle plate located between the rear case and the front cover, and the camera module can be electrically connected to the middle plate.
  • the camera module can be divided into a front camera module and a rear camera module.
  • the front camera module can be set on the front of the terminal device, such as the front cover and the center.
  • FIG. 1 is a schematic structural diagram of a rear case of a terminal device according to an exemplary embodiment of the present application.
  • the rear case 10 is provided with a fixing groove 11 for fixing. Camera module.
  • FIG. 2 is a schematic structural diagram of a camera module known to the inventor.
  • the camera module 20 includes a bearing structure 21 and a lens module 22.
  • the bearing structure 21 includes: a printed circuit board 210, a light sensor 211, a filter 212, and a surface mount component 213.
  • the lens module 22 includes: a zoom Module 220 and lens 221.
  • the light sensor and the surface mount component can be disposed on the printed circuit board 210 through an injection molding process to reduce the thickness of the carrier structure 21 and further reduce the thickness of the camera module.
  • the light sensor 211 may be contaminated, thereby affecting the quality of the camera module.
  • the carrying structure 30 includes a printed circuit board 31, a light sensor 32, a surface mount component 33, and a support cover 34.
  • the support cover 34 is fastened on the printed circuit board 31 and forms a cavity with the printed circuit board 31.
  • the light sensor 32 and the surface mount component 33 are both disposed on the printed circuit board 31 and located in the cavity.
  • the light sensor is used to receive light rays passing through the lens, and convert the light signals of these light rays into electrical signals.
  • the larger the light-sensitive area of the light sensor the more photons captured, the better the light-sensing performance, and the better the shooting effect.
  • the side of the support cover 34 far from the printed circuit board has a first through groove 340.
  • the orthographic projection of the first through groove 340 on the printed circuit board 31 covers the surface mount component 33 on the printed circuit board 31. Orthographic projection. Wherein, an end of the surface mount component 33 far from the printed circuit board 31 is located in the first through groove 340, that is, a portion of the surface mount component 33 is located in the first through groove 340, and the surface mount component 33 and the first through The grooves 340 overlap in the thickness direction.
  • the thickness of the surface mount component can be different for different terminal devices, for example, it can be: 0.15 mm, 0.35 mm, or 0.5 mm, so the position relationship between the surface mount component of different thickness and the first through slot can be different .
  • the thickness of the surface mount component is smaller than the thickness of the support cover, that is, the part of the surface mount component is located in the first through slot and is far from the end of the printed circuit board (ie, the upper end of the surface mount component in FIG. 3).
  • the thickness of the surface mount component is equal to the thickness of the support cover, that is, the part of the surface mount component is located in the first through groove and is far from the printed circuit
  • One end of the board is flush with the side of the first through groove away from the printed circuit board; for example, the thickness of the surface mount component is greater than the thickness of the support cover, that is, the part of the surface mount component is located in the first through groove, The end far from the printed circuit board is higher than (that is, protrudes from) the side of the first through groove far from the printed circuit board.
  • the end of the surface mount component far from the printed circuit board is higher than the side of the first through groove far from the printed circuit board, the end of the surface mount component far from the printed circuit board is higher than the first through groove far from the printed circuit.
  • the size of one side of the board needs to be smaller than a specified error threshold, which is an acceptable error threshold for the terminal device.
  • the support cover 34 has a second through groove 341 on a side remote from the printed circuit board.
  • the second through groove 341 is used for allowing light to pass through and to irradiate the light to the photosensitive area of the light sensor.
  • the orthographic projection of the second through slot 341 on the printed circuit board may be located within the orthographic projection of the light sensor on the printed circuit board.
  • the second through slot is located on the light incident path of the lens in the lens module.
  • the second through slot can transmit the light entered by the lens to the photosensitive area of the light sensor.
  • Partly located in the first through slot, and the first through slot is located outside the light incident light path of the lens in the lens module.
  • Light cannot enter the support cover through the first through slot. In this way, the cooperation between the support cover and the surface mount component
  • light in areas other than the second through grooves cannot enter the photosensitive area of the light sensor, so as to prevent other light from interfering with the light sensor.
  • the support cover and the printed circuit board form a cavity, and the support cover has the first through slot and the second through slot, and the second through slot.
  • the light can be passed through and irradiated on the photosensitive area of the light sensor to ensure the normal function of the light sensor.
  • the first through groove and the surface mount component overlap in the thickness direction, which can effectively reduce the thickness of the bearing structure. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera. The quality of the module.
  • FIG. 4 is a schematic side view of a bearing structure in a camera module according to an embodiment of the present application.
  • the bearing structure 30 may further include a filter 35 for adjusting the camera. Color reproduction of the module.
  • the filter 35 is accommodated in a second through slot (not labeled in FIG. 4), and the thickness of the filter 35 is less than or equal to the thickness of the support cover. When the filter is set in the second through slot, The filter does not protrude out of the supporting cover, thereby reducing the overall thickness of the bearing structure.
  • the wavelength range filtered by the corresponding filter is different, that is, different filters are used.
  • the light sensor is used to convert light signals into electrical signals.
  • the light sensor in the camera module is more sensitive to light in different wavelength ranges. That is, the light sensor can sense infrared light, ultraviolet light, and visible light. Therefore, it is usually based on
  • the function required by the camera module is to set different filters to control the light of different wavelengths to enter the photosensitive area of the light sensor.
  • the filter may include an ultraviolet filter to filter out ultraviolet light.
  • filter The light filter may include a visible light filter to filter out visible light.
  • the filter may include an infrared filter to filter out infrared light.
  • the infrared filter may be a blue glass (English: blue glass).
  • the camera module when the camera module is set in a night vision device, the camera module may have a night vision function, and an infrared light emitter may be provided in the night vision device. At night, the infrared light emitted by the infrared light emitter is reflected by the object. After entering the light sensor imaging.
  • the camera module does not need to be provided with a filter.
  • the camera module may be provided with a non-infrared filter, for example, a crystal chip.
  • each filter is used to implement a filtering function, which is not limited in the embodiment of the present application. .
  • the support cover includes a bottom plate and a side wall located on the bottom plate.
  • the bottom plate may be circular or rectangular or other shapes.
  • the material of the supporting cover may be plastic, and the supporting cover of plastic material may be a deformable supporting cover. When other parts in the bearing structure contact the supporting cover, the supporting cover may play a certain buffering effect and avoid Damage to other components.
  • the above-mentioned support cover can be made by an injection molding process, and the manufacturing process is simple.
  • FIG. 5 is a schematic top view of a support cover provided in an embodiment of the present application.
  • the support cover has a first through slot 340 and a second side away from the printed circuit board. ⁇ ⁇ 341. Since the surface mount component is arranged around the light sensor, the first through groove is arranged around the second through groove, and the second through groove corresponds to the position of the light sensor.
  • the orthographic projection of the first through groove 340 on the printed circuit board Cover the orthographic projection of the surface mount component on the printed circuit board so that a part of the surface mount component is located in the first through slot 340, and then the orientation of the first through slot relative to the second through slot is relative to that of the surface mount component.
  • the orientation of the light sensors is the same.
  • the surface-mount component is on the first side of the light sensor
  • the first through groove is on the first side of the second through groove
  • the first side may be at least one of the left side, the right side, the front side, and the rear side. side.
  • the plurality of surface mount elements may be arranged in an array on at least one side of the light sensor.
  • the support cover has two first through grooves 340, and the two first through grooves 340 are respectively located on the left and right sides of the second through groove 341.
  • the first through grooves located on different sides of the second through groove are usually independent of each other, that is, they are not connected.
  • the first through grooves located on at most three sides of the second through groove are adjacent.
  • a through slot can also communicate.
  • the above-mentioned filter is fixedly connected to the side wall of the second through groove, so that the filter and the second through groove overlap in the thickness direction, thereby effectively reducing the thickness of the bearing structure.
  • the filter may be bonded to at least one side wall of the second through groove by a gel material, and the gel material may be ultraviolet (English: Ultraviolet Rays; UV for short) curing adhesive, which is implemented in the present application. Examples do not limit this.
  • the side of the support cover remote from the printed circuit board may be provided with at least one overflow groove, the overflow groove is a blind groove, and the second through groove may be a rectangular groove, and at least one of the overflow groove and the second through groove One-to-one correspondence of at least one side wall.
  • one side of the glue overflow groove may be communicated with a side wall corresponding to the second through groove.
  • Each overflow groove is a rectangular groove, and the length direction of each overflow groove is parallel to the length direction of the corresponding side wall.
  • the end of the surface mount component far from the printed circuit board, and the gap between the surface mount component and the first through groove are provided with a protective material, so as to prevent dust from contaminating the surface mount component and avoid surface mount
  • the mounting element reflects the light passing through the lens module, thereby improving the imaging quality of the light sensor.
  • the protective material may be made of a gelatinous material. Further, the gelatinous material is the same as the gelatinous material used for bonding the filter and the second through groove.
  • the glue can be continued to be dispensed so that the gum material covers one end of the surface mount component away from the printed circuit board, and flows into the surface mount component and the first In the slot of the through slot, this can allow the gel material to overflow to the surface mount component when the filter and the second through slot are bonded.
  • the manufacturing process is simple, and on the other hand, the surface mount component can be effectively closed. And the gap between the support cover.
  • FIG. 4 and FIG. 5 take the support cover with two overflow grooves 342 as an example for description.
  • the glue grooves 342 a and 342 b correspondingly, the filter is bonded to the two side walls of the second through groove 341.
  • the two overflow tanks are opposite two overflow tanks, and the filter is bonded to two opposite sidewalls of the second through slot 342, for example, bonded to the side wall a and the side wall b.
  • the overflow tank 342a Corresponding to the side wall a, the glue overflow groove 342b corresponds to the side wall b.
  • the glue can be filled into the overflow groove 342a first, and the glue can overflow to the filter and the second through groove 341 through the overflow groove 342a.
  • the adhesion between the filter and the side wall a of the second through groove 341 is achieved.
  • This bonding method can prevent excessive glue from flowing into the gap between the filter and the side wall a and overflowing to the surface of the light sensor, thereby preventing the filter from being polluted by the overflowing glue.
  • the length of each overflow groove is greater than or equal to the length of the side wall of the corresponding second through groove, so that during the glue overflow process, the glue can evenly overflow to the filter and the second through groove. In the gap between the side walls, a better bonding effect is achieved.
  • the length of the overflow groove can also be shorter than the length of the side wall of the corresponding second through groove, as long as the filter can be adhered and fixed to the second through groove, which is not limited in this embodiment of the present application. .
  • FIG. 6 is a schematic side view of a load-bearing structure provided by an embodiment of the present application.
  • a side of the support cover 34 near the printed circuit board has a support piece 343, which is located in the second through slot (FIG. 6).
  • the edge (ie, the location of the boundary) or the corner portion of the second through slot extends toward the inside of the second through slot, and the filter 35 is snapped into the space surrounded by the second through slot and the supporting piece.
  • the support sheet can support the filter and avoid contact between the filter and the light sensor.
  • the above-mentioned supporting sheet may be disposed on any one or more side wall edges or any one or more corner portions of the second through groove, as long as it plays a supporting role.
  • the edge of the side walls may be provided with the filter.
  • the supporting sheet can support a part of the force of the filter through the supporting sheet, reduce the stress of the cured glue, thereby improving the reliability of the bearing structure.
  • the second through slot is a rectangular slot, and the filter is bonded to at most three side walls of the second through slot by a gel material.
  • the support sheet is located at the target edge of the second through slot, and the target edge is the second through slot. An edge of a side wall other than at most three side walls.
  • the target side of the light sensor 32 and the printed circuit board 31 are electrically connected through a wire.
  • a light sensor is connected to a printed circuit board by a wire bonding (English: wire bond) process.
  • the wire bonding process refers to using two ends of a relatively small bonding wire to bond to a chip and a pin to form an electrical connection.
  • the wire is a bonding wire, such as a key alloy wire.
  • the key alloy wire has good electrical, thermal conductivity, mechanical properties, and chemical stability. It can stably connect the light sensor to the printed circuit board, thereby achieving good light sensitivity of the light sensor. effect.
  • the orientation of the target side with respect to the light sensor is the same as the orientation of the at least one side wall with respect to the second through slot, that is, the orientation of the wire with respect to the light sensor is the same as that for bonding the filter.
  • the side wall has the same orientation with respect to the second through groove. For example: assuming the target side is the left side of the light sensor, the filter is bonded to the left side wall of the second through groove; assuming the target side is the right side of the light sensor, the filter is to the right of the second through groove Wall bonding. In this way, the support sheet and the wires avoid each other, and will not affect each other with the wires. Under the premise of ensuring the normal function of the camera module, the thickness of the bearing structure is further reduced.
  • FIG. 4, FIG. 5, and FIG. 6 are schematic diagrams of a bearing structure at different perspectives, in which FIG. 4 is a schematic sectional view of the bearing structure, and FIG. 5 is the bearing structure 6 is a schematic side sectional view of the load bearing structure.
  • FIG. 4 Assuming that the left and right sides of the light sensor 32 are electrically connected to the printed circuit board 31 through a wire, the filter 35 and the second through slot are electrically connected. The left side wall and the right side wall are bonded by a gel material.
  • the supporting piece 343 is provided on the front side wall (that is, the right side wall in FIG. 6) and the rear side wall of the second through groove. (Ie, the side wall on the left in FIG. 6).
  • the target side may also be two adjacent sides of the light sensor.
  • the position of the target side of the light sensor 32 with respect to the light sensor is relative to the side wall a and the side wall c with respect to the second channel.
  • the orientation of the grooves is the same, the filter 35 is adhered to the side wall a and the side wall c of the second through groove with a gel material, respectively, and the supporting sheet 343 is disposed on the edge of the side wall b and the side wall d of the second through groove
  • this embodiment of the present application does not limit this.
  • the support cover and the printed circuit board form a cavity, and the support cover has the first through slot and the second through slot, and the second through slot.
  • the filter can be fixed through the support sheet, so that the light passes through the filter and irradiates the light to the photosensitive area of the light sensor to ensure the normal function of the light sensor.
  • the first through groove and the surface mount component overlap in the thickness direction. , Can effectively reduce the thickness of the bearing structure. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera.
  • the quality of the module is generally reduced by 0.1 to 0.4 mm compared with the thickness of the conventional supporting structure.
  • the embodiment of the present application provides a camera module, which can be installed in a terminal device, such as a mobile phone, a notebook, a tablet computer, a driving recorder, a camera, or a monitoring device, which can ensure the miniaturization and thinness of the terminal device.
  • a terminal device such as a mobile phone, a notebook, a tablet computer, a driving recorder, a camera, or a monitoring device, which can ensure the miniaturization and thinness of the terminal device.
  • FIGS. 7 and 8 is a schematic diagram of a camera module according to an embodiment of the present application.
  • 40 includes a bearing structure 41 (not labeled in FIG. 8) and a lens module 42.
  • the lens module 42 includes a zoom module 420 and a lens 421 located in the zoom module.
  • the zoom The module can be a voice coil motor.
  • the bearing structure 41 may be any of the bearing structures provided in the embodiments of the present application.
  • the lens module 42 is fixed to a side of the support cover 34 away from the printed circuit board 31.
  • the lens module 42 may be away from the support cover 34.
  • One side of the printed circuit board 31 is bonded with a gel material to ensure that the lens module is effectively fixed on the support cover.
  • the second through slot is located on the light incident path of the lens in the lens module.
  • the orthographic projection of the light emitting surface of the lens on the printed circuit board is located in the first through slot on the printed circuit board.
  • the light-emitting surface is directly opposite the second through-groove.
  • the second through-groove can transmit the light entering from the lens to the photosensitive area of the light sensor.
  • the first through slot is located outside the incident light path of the lens in the lens module, and light cannot enter the support cover through the first through slot. In this way, with the cooperation of the support cover and the surface mount component, the second through slot is excluded. Light from outside areas cannot enter the photosensitive area of the light sensor, avoiding other light from interfering with the light sensor.
  • the support cover and the printed circuit board form a cavity
  • the support cover has a first through groove and a second through groove
  • the second through groove can pass through the support sheet.
  • the first through groove and the surface mount component overlap in the thickness direction, which can effectively reduce Small load-bearing structure thickness. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera.
  • the quality of the module without the use of injection molding technology
  • this application briefly introduces the working principle of the camera module: light is projected into the photosensitive area of the light sensor through the lens of the camera module, and the light sensor converts the light signal of the light into an electrical signal, and the electrical signal Digital signals are obtained through surface-mount component processing.
  • the surface-mount components may include surface-mount components for analog-to-digital conversion and surface-mount components for filter processing.
  • the processed digital signals can be displayed by a display device. .
  • the processed digital signal can be output to the processor of the terminal device, and the processor performs related processing to obtain an image displayable by the display device in the terminal device.
  • a memory can also be set in the camera module, and the processed digital signals can be stored in the memory, and the memory can also be set in the camera module in the form of surface mount components.
  • An embodiment of the present application provides a terminal device.
  • the terminal device includes at least one camera module, and the camera module is any camera module provided in the embodiments of the present application.
  • the terminal device may be a mobile phone, a notebook, a tablet computer, a driving recorder, a camera, or a monitoring device.
  • the at least one camera module may include a front camera module and a rear camera module.
  • the support cover and the printed circuit board form a cavity, and the support cover has the first through groove and the second through groove, and the second through groove
  • the filter can be fixed through the support sheet, so that the light passes through the filter and irradiates the light to the photosensitive area of the light sensor to ensure the normal function of the light sensor.
  • the first through groove and the surface mount component overlap in the thickness direction. , Can effectively reduce the thickness of the bearing structure. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera. The quality of the module.
  • An embodiment of the present application provides a method for manufacturing a bearing structure in a camera module.
  • the method for manufacturing the bearing structure may include:
  • a support cover is prepared.
  • the support cover has a first through groove and a second through groove at the bottom.
  • the material of the support cover can be plastic, and the support cover made of plastic can be made through an injection molding process.
  • the above-mentioned second through groove is a rectangular groove, and at least one glue overflow groove is provided on a side of the support cover remote from the printed circuit board, and the at least one glue overflow groove corresponds to at least one side wall, and each glue overflow groove It is a rectangular groove, and the length direction of each overflow groove is parallel to the length direction of the corresponding side wall.
  • a side of the support cover near the printed circuit board further includes a support sheet, the support sheet is located at an edge or a corner of the second through slot, and extends toward the inside of the second through slot, and the filter is clipped on the second through slot.
  • the support sheet may be integrally formed with the support cover when the support cover is prepared, or may be separately provided on the support cover after the support cover is manufactured.
  • step 102 a light sensor and a surface mount component are provided on a printed circuit board.
  • a surface-mount component can be attached to a printed circuit board, and then the light sensor is set on the printed circuit board, and the target side of the light sensor is electrically connected to the printed circuit board through a wire.
  • a light sensor is connected to a printed circuit board by a wire bonding process. It should be noted that a light sensor may also be provided on the printed circuit board before the surface-mount components are attached. The embodiment of the present application does not limit the setting order of the two.
  • step 103 the supporting cover is fastened on the printed circuit board.
  • the support cover and the printed circuit board form a cavity, so that the light sensor and the surface mount component are located in the cavity.
  • the orthographic projection of the first through groove on the printed circuit board covers the orthographic projection of the surface mount component on the printed circuit board.
  • the end of the surface mount component far from the printed circuit board is located in the first through groove, and the second through groove is used for For light to pass through, and make the light shine on the photosensitive area of the light sensor.
  • a filter can be set in the second through groove on the support cover.
  • a support cover provided with a filter there can be multiple ways to fasten the support cover to the printed circuit board. The following two methods are used as examples in this embodiment of the present application for illustration:
  • a filter is set in the second through groove, and then the support cover provided with the filter is buckled on the printed circuit board.
  • the filter may be bonded to at least one side wall of the second through groove through a gel material to provide the filter in the second through groove.
  • the side of the support cover remote from the printed circuit board may be provided with at least one glue overflow groove, the glue overflow groove is a blind groove, the second through groove may be a rectangular groove, at least one glue overflow groove and the second through groove At least one of the side walls corresponds to each other, and each of the overflow grooves is a rectangular groove, and the length direction of each overflow groove is parallel to the length direction of the corresponding side wall.
  • the process of bonding the filter to at least one side wall of the second through groove by a gel material may include: for each glue overflow groove, dispensing in the glue overflow groove until the glue material in the glue overflow groove It overflows and fills the gap between the corresponding sidewall and the filter.
  • the surface mount component can be dispensed so that the gel material covers the end of the surface mount component away from the printed circuit board and flows into the surface mount. In the gap between the component and the first through slot, this can prevent dust from contaminating the surface mount component, and can prevent the surface mount component from reflecting the light passing through the lens module, thereby improving the imaging quality of the light sensor.
  • the supporting cover is buckled on the printed circuit board, and then a filter is set in the second through groove.
  • the filter and at least one side wall of the second through groove may be bonded with a gel material to provide the filter in the second through groove.
  • the side of the support cover remote from the printed circuit board may be provided with at least one glue overflow groove, the glue overflow groove is a blind groove, the second through groove may be a rectangular groove, at least one glue overflow groove and the second through groove At least one of the side walls corresponds to each other, and each of the overflow grooves is a rectangular groove, and the length direction of each overflow groove is parallel to the length direction of the corresponding side wall.
  • the process of bonding the filter to at least one side wall of the second through groove by a gel material may include: for each glue overflow groove, dispensing in the glue overflow groove until the glue material in the glue overflow groove It overflows and fills the gap between the corresponding sidewall and the filter.
  • a protective material may be provided at the end of the surface mount component away from the printed circuit board, and in the gap between the surface mount component and the first through slot, so as to prevent dust from contaminating the surface mount component and prevent reflection of the surface mount component from the lens. The light passed by the module, thereby improving the imaging quality of the light sensor.
  • the protective material may be made of a gelatinous material.
  • the gelatinous material is the same as the gelatinous material used for bonding the filter and the second through groove.
  • the glue can be continued to be dispensed so that the gum material covers one end of the surface mount component away from the printed circuit board, and flows into the surface mount component and the first In the slot of the through slot, this can allow the gel material to overflow to the surface mount component when the filter and the second through slot are bonded.
  • the manufacturing process is simple, and on the other hand, the surface mount component can be effectively closed. And the gap between the support cover.
  • the support sheet is located on any one or more side wall edges or any one or more corners of the second through groove.
  • the filter and the second through groove are When the side walls are bonded, the position of the support sheet may not be considered, as long as the filter is adhered to the side wall of the second through groove. Since the support sheet can receive a part of the force of the filter, the side wall on which the support sheet is provided can also be avoided when the filter is bonded to the side wall of the second through groove. For example, if the supporting sheet is located at the target edge of the second through slot, the side wall of the second through slot other than the corresponding side wall of the target edge and the filter may be bonded by a gel material.
  • the supporting cover can be directly buckled on the printed circuit board, but the thickness of the supporting structure formed in this way is relatively thick. In order to reduce the thickness of the supporting structure, it is possible to avoid the supporting sheet and the wires.
  • the support cover is fastened, it is necessary to ensure that the orientation of the support sheet with respect to the light sensor (or the second through slot) and the orientation of the wire with respect to the light sensor are different.
  • the target side of the light sensor is electrically connected to the printed circuit board through a wire.
  • the target side is the left side, when the support cover is buckled, it is necessary to ensure that the support piece is not located on the left side of the light sensor.
  • the bearing structure manufactured by the method can be the bearing structure shown in FIG. 4 to FIG. 6.
  • the method includes: first preparing a support cover, the bottom of the support cover has a first through groove, a second through groove and a support sheet.
  • a support cover made of plastic material can be made by an injection molding process, and then the filter and the second The side walls of the through grooves are bonded by a gel material, and then a light sensor and a surface-mount component are set on the printed circuit board. Finally, the manufactured support cover is buckled on the printed circuit board, so as to obtain FIGS. 4 to 6 Shown bearing structure.
  • the support cover and the printed circuit board form a cavity
  • the support cover has the first through groove and the second through groove
  • the second The through groove can fix the filter through the support sheet, so that the light passes through the filter and shines the light on the photosensitive area of the light sensor to ensure the normal function of the light sensor.
  • the first through groove and the surface mount component are in the thickness direction. There is overlap, which can effectively reduce the thickness of the bearing structure. Therefore, without the use of injection molding technology, the thickness of the bearing structure can be reduced on the premise of ensuring the normal function of the camera module, thereby reducing the thickness of the bearing structure and ensuring that the light sensor is not contaminated, further improving the resulting camera. The quality of the module.

Abstract

本申请涉及一种摄像模组中的承载结构及制造方法、摄像模组及终端设备，涉及电子技术应用领域，包括：印刷电路板、光传感器、表面贴装元件和支撑罩，支撑罩扣置在PCB上，与PCB形成腔体，光传感器和表面贴装元件均设置在PCB上，且位于腔体内；支撑罩远离PCB的一侧具有第一通槽，第一通槽在PCB上的正投影覆盖表面贴装元件在PCB上的正投影，表面贴装元件远离PCB的一端位于第一通槽内；支撑罩远离PCB的一侧具有第二通槽，第二通槽用于供光线通过，并使光线照射在光传感器的感光区域。本申请在减小了摄像模组中的承载结构的厚度的同时保证了光传感器不被污染。本申请用于实现终端设备的小型化和薄型化。

Description

摄像模组中的承载结构及制造方法、摄像模组及终端设备 技术领域
本申请涉及电子技术应用领域，特别涉及一种摄像模组中的承载结构及制造方法、摄像模组及终端设备。
背景技术
如今，越来越多的终端设备都具有拍摄功能。具有拍摄功能的终端设备中设置有摄像模组(也称摄像头模组)，用户可以通过摄像模组进行图像的拍摄。目前的终端设备向小型化和薄型化发展，相应的，摄像模组的尺寸也需要减小，尤其厚度需要降低。
目前的摄像模组由承载结构和镜头模组组成，其中承载结构包括：印刷电路板(英文：Printed Circuit Board；简称：PCB)、光传感器、滤光片和表面贴装元件(英文：Surface Mounted Devices；简称：SMD)，镜头模组包括：变焦模块和镜头。
为了减小承载结构的厚度，通常通过注塑(英文：molding)工艺将光传感器和SMD设置在PCB上。在注塑过程中，通常在一块大的PCB母板上先设置多组SMD和光传感器，然后在每个光传感器的感光区域上形成保护膜，接着再采用注塑材料覆盖光传感器的边缘区域和SMD，在注塑材料固化后将保护膜移除，对该PCB母板进行切割，得到多个承载结构。
但是，这种承载结构的形成过程中，由于保护膜可能携带杂质，或者切割过程会产生污染物的飞溅，因此容易导致光传感器被污染，从而影响最终形成的摄像模组品质。
发明内容
本申请提供了一种摄像模组中的承载结构及制造方法、摄像模组及终端设备，可以在减小摄像模组中的承载结构的厚度的同时保证光传感器不被污染。
第一方面，提供一种摄像模组中的承载结构，包括：
印刷电路板PCB、光传感器、表面贴装元件和支撑罩，
所述支撑罩扣置在所述PCB上，与所述PCB形成腔体，所述光传感器和所述表面贴装元件均设置在所述PCB上，且位于所述腔体内；
所述支撑罩远离所述PCB的一侧具有第一通槽，所述第一通槽在所述PCB上的正投影覆盖所述表面贴装元件在所述PCB上的正投影，所述表面贴装元件远离所述PCB的一端位于所述第一通槽内；
所述支撑罩远离所述PCB的一侧具有第二通槽，所述第二通槽用于供光线通过，并使光线照射在所述光传感器的感光区域。
在该摄像模组中的承载结构中，支撑罩与印刷电路板形成腔体，且该支撑罩上具 有第一通槽和第二通槽，第二通槽可以使光线通过并使光线照射在光传感器的感光区域，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减小承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。
为了实现摄像模组的一些功能，该承载结构还可以包括：容置于所述第二通槽中的滤光片，滤光片用于调整摄像模组的色彩还原性；
对于不同的摄像模组，对应的滤光片的波长范围也不同，在实际应用时，可以根据需要设置不同的滤光片，以控制不同波长的光进入光传感器。
可选的，所述滤光片的侧壁与所述第二通槽的侧壁固定连接。这样使得滤光片与第二通槽在厚度方向上有重叠，从而有效减小承载结构的厚度。
示例的，所述滤光片与所述第二通槽的至少一个侧壁通过胶质材料粘接。
所述第二通槽为矩形槽，所述支撑罩远离所述PCB的一面上设置有至少一个溢胶槽，所述至少一个溢胶槽与所述至少一个侧壁一一对应，每个溢胶槽为矩形槽，每个溢胶槽的长度方向平行于对应侧壁的长度方向。
在将滤光片与第二通槽的至少一个侧壁进行粘接时，可以将胶水填充至溢胶槽，通过溢胶槽将胶水溢流至滤光片与对应的侧壁的缝隙中，从而使胶水能够均匀溢流，流速稳定，实现较好的粘接效果，并避免过多的胶水溢流至光传感器，防止光传感器被污染。
所述支撑罩靠近所述PCB的一侧还具有支撑片，所述支撑片位于所述第二通槽的边缘或角部，且朝向所述第二通槽内部延伸，所述滤光片卡接在所述第二通槽与所述支撑片围成的空间中。该支撑片可以辅助支撑滤光片，避免滤光片与光传感器的接触。
所述第二通槽为矩形槽，所述滤光片与所述第二通槽的至多三个侧壁通过胶质材料粘接，所述支撑片位于所述第二通槽的目标边缘，所述目标边缘为所述第二通槽除所述至多三个侧壁之外的侧壁的边缘。在第二通槽未与滤光片粘接的侧壁的边缘设置该支撑片，通过该支撑片能够承接滤光片的部分作用力，降低固化的胶水受力，从而提高该承载结构的可靠性。
所述光传感器的目标侧与所述PCB通过导线电连接；该导线可以为键合线，例如键合金线，键合金线具有良好的电气、导热、机械性能以及化学稳定性，能够使光传感器与印刷电路板稳定连接，从而实现光传感器良好的感光效果。
所述至少一个侧壁相对于所述第二通槽与所述目标侧相对于所述光传感器的方位相同。这样，支撑片与导线相互避让，不会和导线相互影响，在保证摄像模组的正常功能的前提下，使承载结构的厚度进一步减小。
可选的，所述光传感器的目标侧为所述光传感器的相对的两侧。
可选的，所述滤光片的厚度小于或等于所述支撑罩的厚度。这样在将滤光片设置在第二通槽中时，滤光片不会凸出于支撑罩，从而能够减小承载结构的整体厚度。
可选的，所述表面贴装元件远离所述PCB的一端，以及所述表面贴装元件与所述第一通槽的缝隙中均设置有保护材料。这样可以防止灰尘污染表面贴装元件，并能够避免表面贴装元件反射从镜头模组通过的光线，从而提高光传感器的成像质量。
可选的，该保护材料可以由胶质材料制成，进一步的，该胶质材料与用于粘接滤光片与第二通槽的胶质材料相同，这样可以在粘接滤光片与第二通槽时，使胶质材料溢流至表面贴装元件上，一方面制造工艺简便，另一方面能够有效封闭表面贴装元件与支撑罩之间的缝隙。
所述支撑罩包括底板和位于所述底板上的侧壁，所述底板呈圆形或矩形，所述支撑罩的材质为塑胶，塑胶材质的支撑罩为可形变支撑罩，当承载结构中的其他部件与该支撑罩接触时，该支撑罩可以起到一定的缓冲作用，避免其他部件的损伤。所述支撑罩通过注塑成型工艺制成，制造工艺简单。
第二方面，提供一种摄像模组，包括：
承载结构和镜头模组，
所述镜头模组包括变焦模块和位于所述变焦模块中的镜头；
其中，所述承载结构为第一方面任一所述的承载结构，所述镜头模组固定于所述支撑罩远离所述PCB的一侧。
第三方面，提供一种终端设备，包括至少一个摄像模组，所述摄像模组为第二方面所述的摄像模组。
第四方面，提供一种摄像模组中的承载结构的制造方法，包括：
制备支撑罩，所述支撑罩的底部具有第一通槽和第二通槽；
在PCB上设置光传感器和表面贴装元件；
将所述支撑罩扣置在所述PCB上，与所述PCB形成腔体，使所述光传感器和所述表面贴装元件位于所述腔体内；
其中，所述第一通槽在所述PCB上的正投影覆盖所述表面贴装元件在所述PCB上的正投影，所述表面贴装元件远离所述PCB的一端位于所述第一通槽内，所述第二通槽用于供光线通过，并使光线照射在所述光传感器的感光区域。
在PCB上设置光传感器和表面贴装元件之前，所述方法还包括：
将所述滤光片与所述第二通槽的至少一个侧壁通过胶质材料粘接。
本申请提供的摄像模组中的承载结构及制造方法、摄像模组及终端设备中，支撑罩与印刷电路板形成腔体，且该支撑罩上具有第一通槽和第二通槽，第二通槽可以通过支撑片将滤光片固定，使光线通过滤光片并使光线照射在光传感器的感光区域上，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减少承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。
附图说明
图1为本申请实施例提供的一种摄像模组中的承载结构所涉及的实施环境示意图。
图2为相关技术一示意性摄像模组的示意图。
图3为本申请实施例提供的一种摄像模组中的承载结构的侧面示意图。
图4为本申请实施例提供的另一种摄像模组中的承载结构的侧面示意图。
图5为本申请实施例提供的一种支撑罩的俯视示意图。
图6为本申请实施例提供的另一种摄像模组中的承载结构的另一侧面示意图。
图7为本申请实施例提供的一种摄像模组的侧面示意图。
图8为本申请实施例提供的一种摄像模组的示意图。
图9为本申请实施例提供的一种摄像模组中的承载结构的制造方法流程图。
具体实施方式
随着摄像技术的发展，摄像模组的应用越来越广泛。摄像模组可以集成在终端设备中，也可以单独部署。当将摄像模组集成在终端设备中时,例如，终端设备包括后壳和前盖，以及位于后壳和前盖之间的中板，该摄像模组可以与中板电连接。基于摄像模组在终端设备中的位置的不同，摄像模组可以划分为前置摄像模组和后置摄像模组，前置摄像模组可以设置在终端设备的前部，如前盖与中板之间，前盖上可以设置有镜头开孔，前置摄像模组的镜头朝向该镜头开孔；后置摄像模组可以设置在终端设备的后部，如后壳与中板之间，后壳上也可以设置有镜头开孔，后置摄像模组的镜头朝向该镜头开孔。可选的，请参考图1，图1是本申请一示意性实施例提供的一种终端设备的后壳的结构示意图，该后壳10上设置有固定槽11，该固定槽11用于固定摄像模组。
由于目前的终端设备向小型化和薄型化发展，相应的，摄像模组的尺寸也需要减小，示例的，请参考图2，图2为发明人所知的一种摄像模组的结构示意图，该摄像模组20包括承载结构21和镜头模组22，该承载结构21包括：印刷电路板210、光传感器211、滤光片212和表面贴装元件213，该镜头模组22包括：变焦模块220和镜头221。目前可以通过注塑工艺将光传感器和表面贴装元件设置在印刷电路板210上，以减小承载结构21的厚度，进一步减小摄像模组的厚度。但是，在注塑过程中，会导致光传感器211被污染，从而影响到摄像模组的品质。
本申请实施例提供了一种摄像模组中的承载结构，如图3所示，该承载结构30包括：印刷电路板31、光传感器32、表面贴装元件33和支撑罩34。其中，支撑罩34扣置在印刷电路板31上，与印刷电路板31形成腔体，光传感器32和表面贴装元件33均设置在印刷电路板31上，且位于腔体内。其中，光传感器用于接收通过镜头的光线，并且将这些光线的光信号转换成为电信号。通常情况下，光传感器的感光区域面积越大，捕获的光子越多，感光性能越好，拍摄效果也更好。
如图3所示，上述支撑罩34远离印刷电路板的一侧具有第一通槽340，该第一通槽340在印刷电路板31上的正投影覆盖表面贴装元件33在印刷电路板31上的正投影。其中，表面贴装元件33远离印刷电路板31的一端位于第一通槽340内，也即是，表面贴装元件33的部分位于第一通槽340内，表面贴装元件33和第一通槽340在厚度方向上有重叠。
由于对于不同的终端设备，表面贴装元件的厚度可以不同，例如可以为：0.15毫米、0.35毫米或者0.5毫米，所以对于不同厚度的表面贴装元件，其与第一通槽的位置关系可以不同。例如，表面贴装元件的厚度小于支撑罩的厚度，也即是，表面贴装元件的部分位于第一通槽内，且远离印刷电路板的一端(即图3中表面贴装元件的上端)低于第一通槽远离印刷电路板的一侧；又例如，表面贴装元件的厚度等于支撑罩 的厚度，也即是，表面贴装元件的部分位于第一通槽内，且远离印刷电路板的一端与第一通槽远离印刷电路板的一侧平齐；再例如，表面贴装元件的厚度大于支撑罩的厚度，也即是，表面贴装元件的部分位于第一通槽内，且远离印刷电路板的一端高于(也即凸出于)第一通槽远离印刷电路板的一侧。需要说明的是，当表面贴装元件远离印刷电路板的一端高于第一通槽远离印刷电路板的一侧时，表面贴装元件远离印刷电路板的一端高出第一通槽远离印刷电路板的一侧的尺寸需要小于指定误差阈值，该指定误差阈值为终端设备的可接受误差阈值。
上述支撑罩34远离印刷电路板的一侧具有第二通槽341，该第二通槽341用于供光线通过，并使光线照射在光传感器的感光区域。可选的，该第二通槽341在印刷电路板上的正投影可以位于光传感器在印刷电路板上的正投影内。
在摄像模组中，该第二通槽位于镜头模组中的镜头的入光光路上，该第二通槽可以将由镜头进入的光线传输至光传感器的感光区域，并且由于表面贴装元件的部分位于第一通槽内，而第一通槽位于镜头模组中的镜头的入光光路之外，光线无法通过第一通槽进入支撑罩，这样，在支撑罩与表面贴装元件的配合下，除第二通槽之外的区域的光线无法进入光传感器的感光区域，从而避免其他光线干扰光传感器。
综上所述，本申请实施例提供的摄像模组中的承载结构中，支撑罩与印刷电路板形成腔体，且该支撑罩上具有第一通槽和第二通槽，第二通槽可以使光线通过并使光线照射在光传感器的感光区域，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减少承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。
示例的，请参考图4，图4为本申请实施例提供的一种摄像模组中的承载结构的侧面示意图，该承载结构30还可以包括：滤光片35，滤光片用于调整摄像模组的色彩还原性。该滤光片35容置于第二通槽(图4中未标示)中，滤光片35的厚度小于或等于支撑罩的厚度，这样在将滤光片设置在第二通槽中时，滤光片不会凸出于支撑罩，从而能够减小承载结构的整体厚度。
对于不同的摄像模组，对应的滤光片所滤除的波长范围也不同，也即是，所采用的滤光片不同。光传感器用于将光信号转换为电信号，摄像模组中的光传感器对不同波长范围的光均较为敏感，也即是光传感器可以感知红外光、紫外光和可见光等等，因此，通常根据摄像模组所需功能，设置不同的滤光片，以控制不同波长的光进入光传感器的感光区域。
示例的，摄像模组需要识别紫外光之外的光线，则滤光片可以包括紫外滤光片，以滤除紫外光；又一示例的，摄像模组需要识别可见光之外的光线，则滤光片可以包括可见光滤光片，以滤除可见光；再一示例的，摄像模组需要识别红外光之外的光线，则滤光片可以包括红外滤光片，以滤除红外光。
例如，当将该摄像模组设置于手机中时，由于人眼无法观察到红外光，为了保证摄像模组拍摄的图像的颜色与人眼实际观察到的颜色一致，保证成像质量，需要设置红外滤光片，该红外滤光片可以为蓝色玻璃片(英文：blue glass)。
又例如，当将该摄像模组设置于夜视仪中时，该摄像模组可以具有夜视功能，夜 视仪中可以设置红外发光器，在夜晚该红外发光器发出的红外光线经过物体反射后进入光传感器成像。在一种可选方式中，摄像模组无需设置滤光片，在另一种可选方式中，摄像模组可以设置非红外滤光片，例如，水晶片。
需要说明的是，摄像模组中的滤光片可以有多个，该多个滤光片层叠设置，每一个滤光片用于实现一种滤光功能，本申请实施例对此不做限定。
示例的，上述支撑罩包括底板和位于底板上的侧壁，该底板可以呈圆形或矩形或者其他形状。可选的，该支撑罩的材质可以为塑胶，塑胶材质的支撑罩为可形变支撑罩，当承载结构中的其他部件与该支撑罩接触时，该支撑罩可以起到一定的缓冲作用，避免其他部件的损伤。上述支撑罩可以通过注塑成型工艺制成，制造工艺简单。
为了清楚的描述支撑罩的结构，请参考图5，图5为本申请实施例提供的一种支撑罩的俯视示意图，该支撑罩远离印刷电路板的一侧具有第一通槽340和第二通槽341。由于表面贴装元件设置在光传感器周围，第一通槽设置在第二通槽周围，而第二通槽与光传感器的位置对应，为了保证第一通槽340在印刷电路板上的正投影覆盖表面贴装元件在印刷电路板上的正投影，以使表面贴装元件的一部分位于第一通槽340中，则第一通槽相对于第二通槽的方位与表面贴装元件相对于光传感器的方位一致。例如，表面贴装元件位于光传感器的第一侧，则第一通槽位于第二通槽的第一侧，该第一侧可以为左侧、右侧、前侧和后侧中的至少一侧。需要说明的是，上述表面贴装元件可以有一个或多个，当其有多个时，该多个表面贴装元件可以阵列排布在光传感器的至少一侧。
示例的，表面贴装元件有多个，多个表面贴装元件分别位于光传感器的左侧和右侧，则第一通槽位于第二通槽的左侧和右侧，如图4和图5所示，支撑罩上具有两个第一通槽340，该两个第一通槽340分别位于第二通槽341的左侧和右侧。需要说明的是，位于第二通槽不同侧的第一通槽通常是相互独立的，也即是不连通的，本申请在实际实现时，位于第二通槽相邻的至多三侧的第一通槽也可以连通。
可选的，上述滤光片与第二通槽的侧壁固定连接，使得滤光片与第二通槽在厚度方向上有重叠，从而有效减小承载结构的厚度。可选的，该滤光片可以与第二通槽的至少一个侧壁通过胶质材料粘接，该胶质材料可以为紫外光(英文：Ultraviolet Rays；简称：UV)固化胶，本申请实施例对此不做限定。示例的，该支撑罩远离印刷电路板的一侧可以设置有至少一个溢胶槽，该溢胶槽为盲槽，上述第二通槽可以为矩形槽，至少一个溢胶槽与第二通槽的至少一个侧壁一一对应。可选的，该溢胶槽的一侧可以与第二通槽对应的侧壁连通。每个溢胶槽为矩形槽，每个溢胶槽的长度方向平行于对应侧壁的长度方向。在将滤光片与第二通槽的至少一个侧壁进行粘接时，可以将胶水填充至溢胶槽，通过溢胶槽将胶水溢流至滤光片与对应的侧壁的缝隙中，从而使胶水能够均匀溢流，流速稳定，实现较好的粘接效果，并避免过多的胶水溢流至光传感器，防止光传感器被污染。
需要说明的是，表面贴装元件远离印刷电路板的一端，以及表面贴装元件与第一通槽的缝隙中均设置有保护材料，这样可以防止灰尘污染表面贴装元件，并能够避免表面贴装元件反射从镜头模组通过的光线，从而提高光传感器的成像质量。该保护材料可以由胶质材料制成，进一步的，该胶质材料与用于粘接滤光片与第二通槽的胶质 材料相同。在将滤光片与第二通槽的至少一个侧壁进行粘接后，可以继续点胶，使得胶质材料覆盖表面贴装元件远离印刷电路板的一端，并且流入表面贴装元件与第一通槽的缝隙中，这样可以在粘接滤光片与第二通槽时，使胶质材料溢流至表面贴装元件上，一方面制造工艺简便，另一方面能够有效封闭表面贴装元件与支撑罩之间的缝隙。
示例的，请参考上述图4和图5，图4和图5以该支撑罩上具有两个溢胶槽342为例进行说明，该支撑罩远离印刷电路板31的一面上设置有两个溢胶槽342a和342b，相应的，滤光片与第二通槽341的两个侧壁粘接。该两个溢胶槽为相对的两个溢胶槽，滤光片与第二通槽342的两个相对的侧壁，例如与侧壁a和侧壁b粘接，其中，溢胶槽342a与侧壁a对应，溢胶槽342b与侧壁b对应。在将滤光片与第二通槽341的侧壁a进行粘接时，可以将胶水先填充至溢胶槽342a，通过溢胶槽342a将胶水溢流至滤光片与第二通槽341的侧壁a之间的缝隙中，从而实现滤光片与第二通槽341的侧壁a的粘接。这种粘接方式能够避免过多的胶水流入滤光片与侧壁a的缝隙并溢流至光传感器表面，从而避免滤光片被溢流的胶水所污染。
示例的，每个溢胶槽的长度大于或等于对应的第二通槽的侧壁的长度，这样能够保证在溢胶过程中，胶水可以均匀地溢流至滤光片与第二通槽的侧壁之间的缝隙中，从而实现较好的粘接效果。当然，该溢胶槽的长度也可以小于对应的第二通槽的侧壁的长度，只要能够保证将滤光片与第二通槽粘接固定即可，本申请实施例对此不做限定。
请参考图6，图6为本申请实施例提供的一种承载结构的侧面示意图，支撑罩34靠近印刷电路板的一侧具有支撑片343，该支撑片343位于第二通槽(图6中未标示)的边缘(即边界所在位置)或角部，且朝向第二通槽内部延伸，滤光片35卡接在第二通槽与支撑片围成的空间中。该支撑片可以辅助支撑滤光片，避免滤光片与光传感器的接触。
在一种可选的实现方式中，上述支撑片可以设置在第二通槽的任意一个或多个侧壁边缘，或任意一个或多个角部，只要起到支撑作用即可。
在另一种可选的实现方式中，由于第二通槽未与滤光片通过胶质材料粘接的侧壁无法为滤光片提供支撑作用，因此，可以在这些侧壁的边缘设置该支撑片，通过该支撑片能够承接滤光片的部分作用力，降低固化的胶水受力，从而提高该承载结构的可靠性。例如，第二通槽为矩形槽，滤光片与第二通槽的至多三个侧壁通过胶质材料粘接，支撑片位于第二通槽的目标边缘，该目标边缘为第二通槽除至多三个侧壁之外的侧壁的边缘。
示例的，请继续参考上述图4，光传感器32的目标侧与印刷电路板31通过导线电连接。例如，光传感器通过引线键合(英文：wire bond)工艺与印刷电路板连接，引线键合工艺指的是用较为细小的键合线的两端分别与芯片和管脚键合以形成电气连接。相应的，该导线为键合线，例如键合金线，键合金线具有良好的电气、导热、机械性能以及化学稳定性，能够使光传感器与印刷电路板稳定连接，从而实现光传感器良好的感光效果。
需要说明的是，上述目标侧相对于光传感器的方位与上述至少一个侧壁相对于第二通槽的方位相同，也即是，导线相对于光传感器的方位与用于粘接滤光片的侧壁相 对于第二通槽的方位相同。例如：假设目标侧为光传感器的左侧，则滤光片与第二通槽的左侧壁粘接；假设目标侧为光传感器的右侧，则滤光片与第二通槽的右侧壁粘接。这样，支撑片与导线相互避让，不会和导线相互影响，在保证摄像模组的正常功能的前提下，使承载结构的厚度进一步减小。
如图4、图5和图6所示，假设图4、图5和图6为一个承载结构在不同视角的示意图，其中，图4为该承载结构的正视截面示意图，图5为该承载结构的俯视图，图6为该承载结构的侧视截面示意图，请参考图4，假设光传感器32的左侧和右侧与印刷电路板31通过导线电连接，则滤光片35与第二通槽的左侧壁和右侧壁通过胶质材料粘接，如图6所示，支撑片343设置于第二通槽的前侧壁(即位于图6中右侧的侧壁)和后侧壁(即位于图6中左侧的侧壁)的边缘。
可选的，该目标侧也可以为光传感器的相邻的两侧，请参考图5，假设光传感器32的目标侧相对于光传感器的方位与侧壁a和侧壁c相对于第二通槽的方位相同，则滤光片35与第二通槽的侧壁a和侧壁c分别通过胶质材料粘接，支撑片343设置于第二通槽的侧壁b和侧壁d的边缘,只要能够保证光传感器与印刷电路板稳定连接且支撑片与导线互不影响即可，本申请实施例对此不做限定。
综上所述，本申请实施例提供的摄像模组中的承载结构中，支撑罩与印刷电路板形成腔体，且该支撑罩上具有第一通槽和第二通槽，第二通槽可以通过支撑片将滤光片固定，使光线通过滤光片并使光线照射在光传感器的感光区域，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减少承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。本申请提供的承载结构通常较传统的承载结构的厚度减少0.1至0.4毫米。
本申请实施例提供了一种摄像模组，该摄像模组可以设置于终端设备中，例如手机、笔记本、平板电脑、行车记录仪、相机或者监控设备，可以保证终端设备的小型化和薄型化。示例的，请参考图7和图8，图7为本申请实施例提供的一种摄像模组的侧面示意图，图8为本申请实施例提供的一种摄像模组的示意图，该摄像模组40包括：承载结构41(图8中未标示)和镜头模组42，在该摄像模组40中，镜头模组42包括变焦模块420和位于变焦模块中的镜头421，可选的，该变焦模块可以为音圈马达。
其中，承载结构41可以为本申请实施例提供的任一承载结构，镜头模组42固定于支撑罩34远离印刷电路板31的一侧，示例的，该镜头模组42可以与支撑罩34远离印刷电路板31的一侧通过胶质材料粘接，以保证镜头模组有效固定在支撑罩上。
在摄像模组中，该第二通槽位于镜头模组中的镜头的入光光路上，可选的，镜头的出光面在印刷电路板上的正投影位于第一通槽在印刷电路板上的正投影内，这样，出光面正对第二通槽，该第二通槽可以将由镜头进入的光线传输至光传感器的感光区域，并且由于表面贴装元件的部分位于第一通槽内，而第一通槽位于镜头模组中的镜头的入光光路之外，光线无法通过第一通槽进入支撑罩，这样，在支撑罩与表面贴装 元件的配合下，除第二通槽之外的区域的光线无法进入光传感器的感光区域，避免其他光线干扰光传感器。
综上所述，本申请实施例提供的摄像模组中，支撑罩与印刷电路板形成腔体，且该支撑罩上具有第一通槽和第二通槽，第二通槽可以通过支撑片将滤光片固定，使光线通过滤光片并使光线照射在光传感器的感光区域，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减少承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。
为了便于读者理解，本申请对摄像模组的工作原理进行简单介绍：光线通过摄像模组的镜头投射到光传感器的感光区域内，光传感器将该光线的光信号转化成电信号，该电信号经过表面贴装元件处理得到数字信号，该表面贴装元件可以包括用于模数转换的表面贴装元件以及用于滤波处理的表面贴装元件等，处理得到的数字信号可以供显示器件进行显示。
当摄像模组集成在终端设备中时，处理得到的数字信号可以输出至终端设备的处理器中，由该处理器进行相关处理，得到终端设备中的显示器件可显示的图像。当摄像模组单独部署时，摄像模组中还可以设置存储器，处理得到的数字信号可以存储在该存储器中，该存储器也可以以表面贴装元件的形式设置在摄像模组中。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的摄像模组中的承载结构的具体结构，可以参考前述实施例中的承载结构，本申请实施例在此不再赘述。
本申请实施例提供了一种终端设备，该终端设备包括至少一个摄像模组，该摄像模组为本申请实施例提供的任一摄像模组。例如，该终端设备可以为手机、笔记本、平板电脑、行车记录仪、相机或者监控设备等。当该终端设备为手机时，该至少一个摄像模组可以包括前置摄像模组和后置摄像模组。
综上所述，本申请实施例提供的摄像模组中的终端设备中，支撑罩与印刷电路板形成腔体，且该支撑罩上具有第一通槽和第二通槽，第二通槽可以通过支撑片将滤光片固定，使光线通过滤光片并使光线照射在光传感器的感光区域，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减少承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的终端设备中的摄像模组的具体结构，可以参考前述实施例中的摄像模组，本申请实施例在此不再赘述。
本申请实施例提供了一种摄像模组中的承载结构的制造方法，请参考图9，该承载结构的制造方法可以包括：
在步骤101中，制备支撑罩。该支撑罩的底部具有第一通槽和第二通槽。
可选的，该支撑罩的材质可以为塑胶，可以通过注塑成型工艺制成材质为塑胶的支撑罩。示例的，上述第二通槽为矩形槽，支撑罩远离印刷电路板的一侧上设置有至少一个溢胶槽，该至少一个溢胶槽与至少一个侧壁一一对应，每个溢胶槽为矩形槽，每个溢胶槽的长度方向平行于对应侧壁的长度方向。
可选的，支撑罩靠近印刷电路板的一侧还具有支撑片，该支撑片位于第二通槽的边缘或角部，且朝向第二通槽内部延伸，滤光片卡接在第二通槽与支撑片围成的空间中。该支撑片可以是在支撑罩制备时与支撑罩一体成型的，也可以在支撑罩制成后单独设置在支撑罩上的。
在步骤102中，在印刷电路板上设置光传感器和表面贴装元件。
示例的，可以在印刷电路板上贴附表面贴装元件，然后将光传感器设置在印刷电路板上，将光传感器的目标侧与印刷电路板通过导线电连接。例如，通过引线键合工艺将光传感器与印刷电路板连接。需要说明的是，也可以先在印刷电路板上设置光传感器再贴附表面贴装元件，本申请实施例对两者的设置顺序不做限定。
在步骤103中，将支撑罩扣置在印刷电路板上。
该支撑罩与印刷电路板形成腔体，使光传感器和表面贴装元件位于腔体内。其中，第一通槽在印刷电路板上的正投影覆盖表面贴装元件在印刷电路板上的正投影，表面贴装元件远离印刷电路板的一端位于第一通槽内，第二通槽用于供光线通过，并使光线照射在光传感器的感光区域。
为了实现摄像模组的不同功能，其支撑罩上的第二通槽中可以设置滤光片。则对于设置有滤光片的支撑罩，其扣置在印刷电路板上的方式可以有多种，本申请实施例以以下两种方式为例进行说明：
第一种方式，先在第二通槽中设置滤光片，然后将设置有滤光片的支撑罩扣置在印刷电路板上。
示例的，可以将滤光片与第二通槽的至少一个侧壁通过胶质材料粘接，以在第二通槽中设置滤光片。例如，该支撑罩远离印刷电路板的一侧上可以设置有至少一个溢胶槽，该溢胶槽为盲槽，上述第二通槽可以为矩形槽，至少一个溢胶槽与第二通槽的至少一个侧壁一一对应，每个溢胶槽为矩形槽，每个溢胶槽的长度方向平行于对应侧壁的长度方向。则将滤光片与第二通槽的至少一个侧壁通过胶质材料粘接的过程可以包括：对于每个溢胶槽，在溢胶槽中点胶，直至溢胶槽中的胶质材料溢出并填充满对应的侧壁与滤光片的间隙。
在将设置有滤光片的支撑罩扣置在印刷电路板上后，可以在表面贴装元件上点胶，使得胶质材料覆盖表面贴装元件远离印刷电路板的一端，并且流入表面贴装元件与第一通槽的缝隙中，这样可以防止灰尘污染表面贴装元件，并能够避免表面贴装元件反射从镜头模组通过的光线，从而提高光传感器的成像质量。
第二种方式，先将支撑罩扣置在印刷电路板上，再在第二通槽中设置滤光片。
示例的，在将支撑罩扣置在印刷电路板上后，可以将滤光片与第二通槽的至少一个侧壁通过胶质材料粘接，以在第二通槽中设置滤光片。例如，该支撑罩远离印刷电路板的一侧上可以设置有至少一个溢胶槽，该溢胶槽为盲槽，上述第二通槽可以为矩 形槽，至少一个溢胶槽与第二通槽的至少一个侧壁一一对应，每个溢胶槽为矩形槽，每个溢胶槽的长度方向平行于对应侧壁的长度方向。则将滤光片与第二通槽的至少一个侧壁通过胶质材料粘接的过程可以包括：对于每个溢胶槽，在溢胶槽中点胶，直至溢胶槽中的胶质材料溢出并填充满对应的侧壁与滤光片的间隙。在表面贴装元件远离印刷电路板的一端，以及表面贴装元件与第一通槽的缝隙中可以设置保护材料，这样可以防止灰尘污染表面贴装元件，并能够避免表面贴装元件反射从镜头模组通过的光线，从而提高光传感器的成像质量。该保护材料可以由胶质材料制成，进一步的，该胶质材料与用于粘接滤光片与第二通槽的胶质材料相同。在将滤光片与第二通槽的至少一个侧壁进行粘接后，可以继续点胶，使得胶质材料覆盖表面贴装元件远离印刷电路板的一端，并且流入表面贴装元件与第一通槽的缝隙中，这样可以在粘接滤光片与第二通槽时，使胶质材料溢流至表面贴装元件上，一方面制造工艺简便，另一方面能够有效封闭表面贴装元件与支撑罩之间的缝隙。
在上述步骤101中，支撑片位于第二通槽的任意一个或多个侧壁边缘，或任意一个或多个角部，在上述两种方式中，在将滤光片与第二通槽的侧壁粘接时，可以不考虑支撑片的位置，只要保证滤光片与第二通槽的侧壁粘接即可。由于支撑片能够承接滤光片的部分作用力，因此，也可以在将滤光片与第二通槽的侧壁粘接时，避让设置有支撑片的侧壁。例如，支撑片位于第二通槽的目标边缘，则可以将第二通槽除目标边缘对应侧壁之外的侧壁与滤光片通过胶质材料粘接。
进一步的，在上述两种方式中，可以直接将支撑罩扣置在印刷电路板上，但是这样形成的承载结构的厚度较厚，为了减少承载结构的厚度，可以进行支撑片与导线的避让。则在扣置支撑罩时，需要保证支撑片相对于光传感器(或第二通槽)的方位与导线相对于光传感器的方位不同，例如，光传感器的目标侧与印刷电路板通过导线电连接，该目标侧为左侧，则扣置支撑罩时，需要保证支撑片不位于光传感器的左侧。
为了便于理解，本申请实施例假设提供了一种摄像模组中的承载结构的制造方法，其制造得到的承载结构可以为图4至图6所示的承载结构，则该承载结构的制造方法包括：先制备支撑罩，该支撑罩的底部具有第一通槽、第二通槽和支撑片，示例的，可以通过注塑工艺制成材质为塑胶的支撑罩，接着将滤光片与第二通槽的侧壁通过胶质材料粘接，再在印刷电路板上设置光传感器和表面贴装元件，最后将制成的支撑罩扣置在印刷电路板上，从而得到图4至图6所示的承载结构。
需要说明的是，本申请实施例提供的制造方法步骤的先后顺序可以进行适当调整，步骤也可以根据情况进行相应增减，例如步骤101和步骤102的顺序可以颠倒。
综上所述，本申请实施例提供的摄像模组中的承载结构的制造方法，支撑罩与印刷电路板形成腔体，且该支撑罩上具有第一通槽和第二通槽，第二通槽可以通过支撑片将滤光片固定，使光线通过滤光片并使光线照射在光传感器的感光区域，以保证光传感器的正常功能，第一通槽与表面贴装元件在厚度方向上有重叠，可以有效减小承载结构的厚度。因此，无需采用注塑工艺即可在保证摄像模组正常功能的前提下，减少承载结构的厚度，从而在减小了承载结构的厚度同时保证了光传感器不被污染，进一步提高了最终形成的摄像模组的品质。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的摄像 模组中的承载结构的制造方法的过程，可以参考前述实施例中的承载结构的具体工作过程，本申请实施例在此不再赘述。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (15)

  1. 一种摄像模组中的承载结构，其特征在于，包括：
    印刷电路板PCB、光传感器、表面贴装元件和支撑罩，
    所述支撑罩扣置在所述PCB上，与所述PCB形成腔体，所述光传感器和所述表面贴装元件均设置在所述PCB上，且位于所述腔体内；
    所述支撑罩远离所述PCB的一侧具有第一通槽，所述第一通槽在所述PCB上的正投影覆盖所述表面贴装元件在所述PCB上的正投影，所述表面贴装元件远离所述PCB的一端位于所述第一通槽内；
    所述支撑罩远离所述PCB的一侧具有第二通槽，所述第二通槽用于供光线通过，并使光线照射在所述光传感器的感光区域。
  2. 根据权利要求1所述的承载结构，其特征在于，所述承载结构还包括：
    容置于所述第二通槽中的滤光片；
    所述滤光片的侧壁与所述第二通槽的侧壁固定连接。
  3. 根据权利要求2所述的承载结构，其特征在于，
    所述滤光片与所述第二通槽的至少一个侧壁通过胶质材料粘接。
  4. 根据权利要求3所述的承载结构，其特征在于，
    所述第二通槽为矩形槽，所述支撑罩远离所述PCB的一面上设置有至少一个溢胶槽，所述至少一个溢胶槽与所述至少一个侧壁一一对应，每个溢胶槽为矩形槽，每个溢胶槽的长度方向平行于对应侧壁的长度方向。
  5. 根据权利要求3或4所述的承载结构，其特征在于，
    所述支撑罩靠近所述PCB的一侧还具有支撑片，所述支撑片位于所述第二通槽的边缘或角部，且朝向所述第二通槽内部延伸，所述滤光片卡接在所述第二通槽与所述支撑片围成的空间中。
  6. 根据权利要求5所述的承载结构，其特征在于，
    所述第二通槽为矩形槽，所述滤光片与所述第二通槽的至多三个侧壁通过胶质材料粘接，所述支撑片位于所述第二通槽的目标边缘，所述目标边缘为所述第二通槽除所述至多三个侧壁之外的侧壁的边缘。
  7. 根据权利要求6所述的承载结构，其特征在于，
    所述光传感器的目标侧与所述PCB通过导线电连接；
    所述至少一个侧壁相对于所述第二通槽与所述目标侧相对于所述光传感器的方位相同。
  8. 根据权利要求7所述的承载结构，其特征在于，
    所述光传感器的目标侧为所述光传感器的相对的两侧。
  9. 根据权利要求2所述的承载结构，其特征在于，
    所述滤光片的厚度小于或等于所述支撑罩的厚度。
  10. 根据权利要求1至9任一所述的承载结构，其特征在于，
    所述表面贴装元件远离所述PCB的一端，以及所述表面贴装元件与所述第一通槽的缝隙中均设置有保护材料。
  11. 根据权利要求1至9任一所述的承载结构，其特征在于，
    所述支撑罩包括底板和位于所述底板上的侧壁，所述底板呈圆形或矩形，所述支撑罩的材质为塑胶，所述支撑罩通过注塑成型工艺制成。
  12. 一种摄像模组，其特征在于，包括：
    承载结构和镜头模组，
    所述镜头模组包括变焦模块和位于所述变焦模块中的镜头；
    其中，所述承载结构为权利要求1至11任一所述的承载结构，所述镜头模组固定于所述支撑罩远离所述PCB的一侧。
  13. 一种终端设备，其特征在于，包括至少一个摄像模组，所述摄像模组为权利要求12所述的摄像模组。
  14. 一种摄像模组中的承载结构的制造方法，其特征在于，包括：
    制备支撑罩，所述支撑罩的底部具有第一通槽和第二通槽；
    在PCB上设置光传感器和表面贴装元件；
    将所述支撑罩扣置在所述PCB上，与所述PCB形成腔体，使所述光传感器和所述表面贴装元件位于所述腔体内；
    其中，所述第一通槽在所述PCB上的正投影覆盖所述表面贴装元件在所述PCB上的正投影，所述表面贴装元件远离所述PCB的一端位于所述第一通槽内，所述第二通槽用于供光线通过，并使光线照射在所述光传感器的感光区域。
  15. 根据权利要求14所述的方法，其特征在于，在PCB上设置光传感器和表面贴装元件之前，所述方法还包括：
    将所述滤光片与所述第二通槽的至少一个侧壁通过胶质材料粘接。
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