CN112753209A - 摄像模组中的承载结构及制造方法、摄像模组及终端设备 - Google Patents

摄像模组中的承载结构及制造方法、摄像模组及终端设备 Download PDF

Info

Publication number
CN112753209A
CN112753209A CN201880097929.7A CN201880097929A CN112753209A CN 112753209 A CN112753209 A CN 112753209A CN 201880097929 A CN201880097929 A CN 201880097929A CN 112753209 A CN112753209 A CN 112753209A
Authority
CN
China
Prior art keywords
groove
pcb
bearing structure
camera module
surface mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201880097929.7A
Other languages
English (en)
Other versions
CN112753209B (zh
Inventor
冉坤
矢岛淳史
罗振东
傅立峰
林威智
黄昌福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN112753209A publication Critical patent/CN112753209A/zh
Application granted granted Critical
Publication of CN112753209B publication Critical patent/CN112753209B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Abstract

本申请涉及一种摄像模组中的承载结构及制造方法、摄像模组及终端设备，涉及电子技术应用领域，包括：印刷电路板、光传感器、表面贴装元件和支撑罩，支撑罩扣置在PCB上，与PCB形成腔体，光传感器和表面贴装元件均设置在PCB上，且位于腔体内；支撑罩远离PCB的一侧具有第一通槽，第一通槽在PCB上的正投影覆盖表面贴装元件在PCB上的正投影，表面贴装元件远离PCB的一端位于第一通槽内；支撑罩远离PCB的一侧具有第二通槽，第二通槽用于供光线通过，并使光线照射在光传感器的感光区域。本申请在减小了摄像模组中的承载结构的厚度的同时保证了光传感器不被污染。本申请用于实现终端设备的小型化和薄型化。

Description

PCT国内申请，说明书已公开。

Claims (15)

  1. PCT国内申请，权利要求书已公开。
CN201880097929.7A 2018-09-29 2018-09-29 摄像模组中的承载结构及制造方法、摄像模组及终端设备 Active CN112753209B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/108653 WO2020062146A1 (zh) 2018-09-29 2018-09-29 摄像模组中的承载结构及制造方法、摄像模组及终端设备

Publications (2)

Publication Number Publication Date
CN112753209A true CN112753209A (zh) 2021-05-04
CN112753209B CN112753209B (zh) 2022-08-09

Family

ID=69952695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880097929.7A Active CN112753209B (zh) 2018-09-29 2018-09-29 摄像模组中的承载结构及制造方法、摄像模组及终端设备

Country Status (2)

Country Link
CN (1) CN112753209B (zh)
WO (1) WO2020062146A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105577990A (zh) * 2014-10-09 2016-05-11 南昌欧菲光电技术有限公司 摄像头底座及移动终端摄像头
CN206100221U (zh) * 2016-09-28 2017-04-12 深圳市金康光电有限公司 虹膜摄像头
CN206292441U (zh) * 2017-01-03 2017-06-30 信利光电股份有限公司 一种摄像头模组底座及摄像头模组
US20180035029A1 (en) * 2016-08-01 2018-02-01 Ningbo Sunny Opotech Co., Ltd. Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
CN107799544A (zh) * 2017-11-29 2018-03-13 苏州昀冢电子科技有限公司 摄像头模组封装底座及摄像头模组
CN108401092A (zh) * 2017-02-04 2018-08-14 宁波舜宇光电信息有限公司 摄像模组及其模制电路板组件、电路板以及应用
WO2019137466A1 (zh) * 2018-01-11 2019-07-18 维沃移动通信有限公司 摄像头模组及移动终端

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206136070U (zh) * 2016-05-11 2017-04-26 宁波舜宇光电信息有限公司 具有粘结结构的摄像模组
CN108322632B (zh) * 2018-02-28 2020-09-08 Oppo广东移动通信有限公司 摄像头模组、电子装置及摄像头模组制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105577990A (zh) * 2014-10-09 2016-05-11 南昌欧菲光电技术有限公司 摄像头底座及移动终端摄像头
US20180035029A1 (en) * 2016-08-01 2018-02-01 Ningbo Sunny Opotech Co., Ltd. Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof
CN206100221U (zh) * 2016-09-28 2017-04-12 深圳市金康光电有限公司 虹膜摄像头
CN206292441U (zh) * 2017-01-03 2017-06-30 信利光电股份有限公司 一种摄像头模组底座及摄像头模组
CN108401092A (zh) * 2017-02-04 2018-08-14 宁波舜宇光电信息有限公司 摄像模组及其模制电路板组件、电路板以及应用
CN107799544A (zh) * 2017-11-29 2018-03-13 苏州昀冢电子科技有限公司 摄像头模组封装底座及摄像头模组
WO2019137466A1 (zh) * 2018-01-11 2019-07-18 维沃移动通信有限公司 摄像头模组及移动终端

Also Published As

Publication number Publication date
WO2020062146A1 (zh) 2020-04-02
CN112753209B (zh) 2022-08-09

Similar Documents

Publication Publication Date Title
CN110326280B (zh) 阵列摄像模组及其应用
EP3832797A1 (en) Handheld electronic device
EP3544284B1 (en) Array camera module having height difference
EP3832993B1 (en) Handheld electronic device
US10261225B2 (en) Filter assembly and camera module having the same
TW527727B (en) Small image pickup module
TW523922B (en) Small type module for taking picture
CN108401091B (zh) 摄像模组及其模制电路板组件和应用
CN112492129B (zh) 摄像模组和电子设备
CN110648980A (zh) 芯片封装结构及相机装置
WO2019075700A1 (zh) 一种摄像头模组及移动终端
KR20080031570A (ko) 이미지 센서 모듈 및 이를 구비한 카메라 모듈
CN111726483A (zh) 镜头模组及电子装置
KR102354606B1 (ko) 카메라 모듈 및 광학 기기
CN112753209B (zh) 摄像模组中的承载结构及制造方法、摄像模组及终端设备
CN212628063U (zh) 摄像头模组以及电子设备
JP4696192B2 (ja) 固体撮像素子ユニット及びその製造方法並びに撮像装置
TWI674445B (zh) 鏡頭模組及該鏡頭模組的組裝方法
CN113534575A (zh) 镜头模组及电子装置
JP5093324B2 (ja) 固体撮像素子ユニット及びその製造方法並びに撮像装置
CN216819939U (zh) 摄像模组和电子设备
JP2009003058A (ja) カメラモジュール、台座マウント及び撮像装置
CN111432097A (zh) 镜头模组及电子装置
CN217216688U (zh) 摄像模组及电子设备
TWI677730B (zh) 鏡頭模組

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant