WO2019137466A1 - 摄像头模组及移动终端 - Google Patents

摄像头模组及移动终端 Download PDF

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Publication number
WO2019137466A1
WO2019137466A1 PCT/CN2019/071323 CN2019071323W WO2019137466A1 WO 2019137466 A1 WO2019137466 A1 WO 2019137466A1 CN 2019071323 W CN2019071323 W CN 2019071323W WO 2019137466 A1 WO2019137466 A1 WO 2019137466A1
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WIPO (PCT)
Prior art keywords
pcb board
camera module
photosensitive chip
bracket
lens
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PCT/CN2019/071323
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English (en)
French (fr)
Inventor
王丹妹
李文珍
陈巍伟
Original Assignee
维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2019137466A1 publication Critical patent/WO2019137466A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure relates to the field of communications technologies, and in particular, to a camera module and a mobile terminal.
  • the camera module usually adopts a chip scale package (CSP) scheme and a chip on board (COB) scheme in the package design, and the above two schemes Both require a larger package size and occupy a larger installation space inside the mobile terminal, which is not conducive to the development of thin and light mobile terminal products.
  • CSP chip scale package
  • COB chip on board
  • the camera module of the mobile terminal in the related art has a problem of large size.
  • the embodiments of the present disclosure provide a camera module and a mobile terminal to solve the problem of large size of the camera module of the mobile terminal in the related art.
  • an embodiment of the present disclosure provides a camera module including a lens, a bracket, a printed circuit board (PCB board), and a photosensitive chip, wherein the lens is mounted in a mounting groove formed by the bracket, and the PCB board Provided at one end of the lens, and the PCB board penetrates through a through hole through which light passes, the photosensitive chip is disposed on a side of the PCB board facing away from the lens, and the back of the PCB board One side of the photosensitive chip is provided with a first electronic component, and the first electronic component is connected to the bracket; the photosensitive chip, the PCB board and the bracket are disposed coaxially.
  • an embodiment of the present disclosure further provides a mobile terminal, where the mobile terminal includes the camera module as described in the first aspect.
  • the PCB board is disposed above the photosensitive chip, so that the first electronic component disposed above the PCB board is also located above the photosensitive chip, and the electronic component in the related art is located around the photosensitive chip, and thus It will occupy the space around the sensor chip, which will reduce the lateral size of the camera module.
  • the longitudinal dimension of the camera module is reduced, the installation space of the camera module in the mobile terminal is saved, and the mobile terminal is more favorable for thinning development. .
  • FIG. 1 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure
  • FIG. 2 is a partial schematic structural diagram of a camera module according to another embodiment of the present disclosure.
  • FIG. 3 is a schematic longitudinal view of a camera module according to another embodiment of the present disclosure.
  • FIG. 4 is a schematic view showing the lateral dimension of the camera module of FIG. 3.
  • the present disclosure provides a camera module applied to a mobile terminal, including a lens 40 , a bracket 10 , a printed circuit board (PCB board ) 20 , and a photosensitive chip 30 .
  • the lens 40 is mounted on the bracket 10 .
  • the PCB board 20 is disposed at one end of the lens 40, and the PCB board 20 penetrates through the through hole 21 through which the light passes, and the photosensitive chip 30 is disposed on the side of the PCB board 20 facing away from the lens 40, and the PCB board 20
  • the first electronic component 61 is disposed on one side of the photosensitive chip 30, and the first electronic component 61 is connected to the bracket 10.
  • the photosensitive chip 30, the PCB board 20 and the bracket 10 are disposed coaxially.
  • the lens TTL (Total Track Length) size refers to the distance from the end surface of the lens 40 to the surface of the photosensitive chip 30, that is, the A size in FIG.
  • the PCB board 20 is mounted between the lens 40 and the photosensitive chip 30.
  • the size of the PCB board 20 has been counted in the TTL size of the lens, so that the longitudinal dimension of the camera module is the lens TTL size A and the photosensitive
  • the sum of the thickness B of the chip 30 is mounted on the lower surface of the photosensitive chip relative to the PCB board in the related art, thereby reducing the longitudinal dimension of the camera module, saving the installation space of the camera module in the mobile terminal, and facilitating the movement.
  • the terminal is developing towards thinning.
  • the distance from the axis to the outermost end of the bracket 10 is greater than or equal to the distance from the axis to the outermost end of the PCB board 20, and the distance from the axis to the outermost end of the PCB board 20 is greater than or equal to the self-axis of the photosensitive chip 30. The distance to the outermost end.
  • the lateral dimensions of the PCB board 20 and the photosensitive chip 30 do not exceed the lateral dimension of the bracket 10, and the PCB board 20 is disposed above the photosensitive chip 30, so that the first electronic component 61 disposed above the PCB board 20 is also Located above the photosensitive chip 30, compared with the electronic components in the related art, the surrounding area of the photosensitive chip 30 does not occupy the space around the photosensitive chip 30, thereby reducing the lateral size of the camera module, thereby saving the camera mode. Group the horizontal installation space within the mobile terminal.
  • a through hole 21 is penetrated in the middle of the PCB board 20, and a filter 80 is attached to the side of the PCB board 20 facing the lens 40, and the filter 80 covers the through hole 21.
  • the PCB board 20 may be in the shape of a ring or a square.
  • the thickness of the PCB board 20 can be set according to actual conditions, thereby adjusting the distance between the filter 80 and the photosensitive chip 30.
  • the distance from the axis to the outermost end of the PCB board 20 is greater than the distance from the axis to the outermost end of the photosensitive chip 30, and the first injection molded part 51 is disposed on the outer circumference of the photosensitive chip 30, and the first injection molded part 51 is The PCB board 20 abuts. It should be noted that the first injection molded part 51 may be in contact with the photosensitive chip 30 or may be disposed adjacent to the photosensitive chip 30.
  • the first injection molding 51 is used to encapsulate the photosensitive chip 30 and the PCB 20, and the first injection molding 51 is located on the outer circumference of the photosensitive chip 30, thereby better utilizing the peripheral space of the photosensitive chip 30, and thus better.
  • the overall space of the camera module is utilized to ensure the overall size of the camera module.
  • one side of the first injection molded part 51 facing away from the PCB board 20 is on the same plane as the side of the photosensitive chip 30 facing away from the PCB board 20.
  • the photosensitive chip 30 is at the bottom end of the camera module, and the bottom surface of the first injection molding 51 is on the same plane as the bottom surface of the photosensitive chip 30, thereby ensuring the longitudinal dimension of the camera module, and is more conducive to the thinning of the mobile terminal. .
  • the distance from the axis of the photosensitive chip 30 to the outermost end of the first injection molded part 51 is less than or equal to the distance from the axis to the outermost end of the bracket 10. That is, the sum of the lateral dimensions of the photosensitive chip 30 and the first injection molded part 51 is smaller than the lateral size of the stent 10.
  • the lateral dimension of the first injection molded part 51 is also limited, further ensuring the overall size of the camera module.
  • the first injection molded component 51 is in contact with the photosensitive chip 30.
  • the lateral dimension of the camera module is the sum of the lateral dimension a of the photosensitive chip 30 and the lateral dimension b of the first injection molded component 51, as compared with the correlation.
  • the PCB in the technology is disposed under the photosensitive chip, and the electronic component on the upper portion of the PCB 20 is located at the periphery of the photosensitive chip 30.
  • the electronic component does not occupy the lateral space of the camera module, and The small horizontal size of the camera module saves the installation space of the camera module in the mobile terminal.
  • a side of the PCB board 20 facing away from the lens 40 is provided with a second electronic component 62 embedded in the first injection molded part 51.
  • the second electronic component 62 is encapsulated in the first injection molded part 51 by an injection molding process.
  • the first electronic component 61 and the second electronic component 62 may be the same type of electronic component.
  • the two sides of the PCB board 20 are provided with electronic components on both sides, thereby fully utilizing the installation space on both sides of the PCB board 20.
  • a solder ball 70 is disposed between the photosensitive chip 30 and the PCB board 20.
  • the solder balls 70 are arranged to ensure that the photosensitive chip 30 is in communication with the electrical performance of the PCB board 20, and data transmission of the camera module is realized.
  • the thickness of the first injection molded part 51 is equal to the sum of the thickness of the solder ball 70 and the thickness of the photosensitive chip 30.
  • the bottom surface of the first injection molded part 51 is on the same horizontal surface as the bottom surface of the photosensitive chip 30, that is, when the camera module performs the packaging process, the injection thickness of the first injection molded part 51 is limited. To ensure the vertical size of the camera module.
  • the first electronic component 61 is embedded within the stent 10.
  • a side of the bracket 10 facing the PCB board 20 is provided with a receiving slot for receiving the first electronic component 61.
  • the first electronic component 61 is completely embedded in the bracket 10; when the bracket 10 does not abut the PCB board 20, the first electronic component 61 is partially embedded in the bracket 10. In this way, the longitudinal dimension of the camera module is further reduced, which is more conducive to the development of the thinning of the mobile terminal.
  • a second injection molded part 52 is disposed between the PCB board 20 and the bracket 10, and the first electronic component 61 is received in the second injection molded part 52.
  • the first electronic component 61 disposed on the PCB 20 is packaged in the second injection molding 52 by an injection molding process, and the connection of the PCB 20 and the bracket 10 is fixed by the second injection molding 52.
  • the embodiment of the present disclosure further provides a mobile terminal, which includes a housing and a camera module as described above, and the camera module is embedded in the housing.
  • the technical solutions of the present embodiment include all the technical solutions of the foregoing embodiments, so that at least all the technical effects of the foregoing embodiments can be implemented, and details are not described herein again.

Abstract

本公开提供一种摄像头模组及应用该摄像头模组的移动终端，所述摄像头模组包括镜头、支架、印刷电路板(PCB板)和感光芯片，镜头安装于支架形成的安装槽内，PCB板设于镜头一端，且PCB板贯通有用以光线穿过的通孔，感光芯片设于PCB板的背对镜头的一侧，PCB板的背对感光芯片的一侧设有第一电子元件，且第一电子元件连接支架；感光芯片、PCB板及支架均同轴线设置。

Description

摄像头模组及移动终端
相关申请的交叉引用
本申请主张在2018年1月11日在中国提交的中国专利申请No.201810025947.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种摄像头模组及移动终端。
背景技术
随着科学技术的进步，移动终端产品的更新也越来越迅速，以更好地满足消费者不断增长的使用需求。目前，移动终端基本都设有摄像头，以方便消费者进行拍照、录影等。但是，相关技术中的摄像头模组在进行封装设计时，通常会采用感光芯片级封装(Chip Scale Package，CSP)方案和板上感光芯片封装(Chip On Board，COB)方案，而上述两种方案都需要较大的封装尺寸，占用移动终端内部较大的安装空间，不利于移动终端产品轻薄化的发展需求。
可见，相关技术中的移动终端摄像头模组存在尺寸较大的问题。
发明内容
本公开实施例提供一种摄像头模组及移动终端，以解决相关技术中的移动终端摄像头模组尺寸较大的问题。
为解决上述技术问题，本公开是这样实现的：
第一方面，本公开实施例提供了一种摄像头模组，包括镜头、支架、印刷电路板(PCB板)和感光芯片，所述镜头安装于所述支架形成的安装槽内，所述PCB板设于所述镜头一端，且所述PCB板贯通有用以光线穿过的通孔，所述感光芯片设于所述PCB板的背对所述镜头的一侧，所述PCB板的背对所述感光芯片的一侧设有第一电子元件，且所述第一电子元件连接所述支架；所述感光芯片、所述PCB板及所述支架均同轴线设置。
第二方面，本公开实施例还提供了一种移动终端，所述移动终端包括如第一方面中所述的摄像头模组。
本公开实施例中，PCB板设于感光芯片上方，也就使得设于PCB板上方的第一电子元件也位于感光芯片上方，相比于相关技术中的电子元件位于感光芯片周围，也就不会再占用感光芯片周围的空间，进而减小了摄像头模组的横向尺寸。另外，相对于相关技术中的PCB板安装于感光芯片下面，也就减小了摄像头模组的纵向尺寸，节省了摄像头模组在移动终端内的安装空间，更有利于移动终端向薄型化发展。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获取其他的附图。
图1是本公开实施例提供的摄像头模组的结构示意图；
图2是本公开另一实施例提供的摄像头模组的局部结构示意图；
图3是本公开另一实施例提供的摄像头模组的纵向尺寸示意图；
图4是图3中摄像头模组的横向尺寸示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获取的所有其他实施例，都属于本公开保护的范围。
如图1至图4所示，本公开提供了一种应用于移动终端的摄像头模组，包括镜头40、支架10、印刷电路板(PCB板)20和感光芯片30，镜头40安装于支架10形成的安装槽内，PCB板20设于镜头40一端，且PCB板20贯通有用以光线穿过的通孔21，感光芯片30设于PCB板20的背对镜头40的一侧，PCB板20的背对感光芯片30的一侧设有第一电子元件61，且第一 电子元件61连接支架10；感光芯片30、PCB板20及支架10均同轴线设置。
请具体参照图3，镜头TTL(Total Track Length，镜头40全长)尺寸是指从镜头40端面至感光芯片30表面之间的距离，也就是图3中的A尺寸。本公开实施例中，PCB板20安装于镜头40与感光芯片30之间，PCB板20的尺寸已经被计入镜头TTL尺寸中，这样，摄像头模组的纵向尺寸即为镜头TTL尺寸A与感光芯片30厚度B的和，相对于相关技术中的PCB板安装于感光芯片下面，也就减小了摄像头模组的纵向尺寸，节省了摄像头模组在移动终端内的安装空间，更有利于移动终端向薄型化发展。
本公开实施例中，支架10自轴线至最外端的距离大于或等于PCB板20的自轴线至最外端的距离，PCB板20的自轴线至最外端的距离大于或等于感光芯片30的自轴线至最外端的距离。也就是说，PCB板20及感光芯片30的横向尺寸都不会超过支架10的横向尺寸，PCB板20设于感光芯片30上方，也就使得设于PCB板20上方的第一电子元件61也位于感光芯片30上方，相比于相关技术中的电子元件位于感光芯片周围，也就不会再占用感光芯片30周围的空间，进而减小了摄像头模组的横向尺寸，也就节省了摄像头模组在移动终端内的横向安装空间。
进一步地，PCB板20中部贯通有通孔21，PCB板20的面对镜头40的一侧贴附有滤光片80，滤光片80覆盖通孔21。PCB板20可以为环形或方框形。另外，PCB板20的厚度可根据实际情况进行设置，进而调节滤光片80至感光芯片30之间的距离。
本公开实施例中，PCB板20的自轴线至最外端的距离大于感光芯片30的自轴线至最外端的距离，感光芯片30的外周设有第一注塑件51，且第一注塑件51与PCB板20抵接。需要说明的是，第一注塑件51可以与感光芯片30抵接，也可以与感光芯片30相邻设置。第一注塑件51用以对感光芯片30及PCB板20起到封装作用，第一注塑件51位于感光芯片30的外周，从而更好地利用了感光芯片30的外围空间，也就更好地利用了摄像头模组的整体空间，确保摄像头模组的整体尺寸。
可选地，第一注塑件51的背对PCB板20的一侧与感光芯片30的背对PCB板20的一侧位于同一平面上。感光芯片30处于摄像头模组的最底端， 第一注塑件51的底面与感光芯片30的底面位于同一平面上，也就确保了摄像头模组的纵向尺寸，更有利于移动终端向薄型化发展。
可选地，感光芯片30自轴线至第一注塑件51最外端的距离小于或等于支架10自轴线至最外端的距离。也就是说，感光芯片30与第一注塑件51的横向尺寸之和小于支架10的横向尺寸。这样，也就对第一注塑件51的横向尺寸进行了限制，进一步确保了摄像头模组的整体尺寸。
请具体参照图4，第一注塑件51与感光芯片30抵接，摄像头模组的横向尺寸也就是感光芯片30的横向尺寸a与第一注塑件51的横向尺寸b的和，相比于相关技术中的PCB板设于感光芯片下方、PCB板20上部的电子元件位于感光芯片30的外围，本公开实施例提供的技术方案中，电子元件不会占用摄像头模组的横向空间，也就减小了摄像头模组的横向尺寸，节省了摄像头模组在移动终端内的安装空间。
进一步地，PCB板20的背对镜头40的一侧设有嵌于第一注塑件51中的第二电子元件62。通过注塑工艺将第二电子元件62封装在第一注塑件51中。需要说明的是，第一电子元件61与第二电子元件62可以为同类型的电子元件。这样，PCB板20的相互背对的两侧均设有电子元件，进而充分利用了PCB板20两侧的安装空间。
本公开实施例中，感光芯片30与PCB板20之间设有锡球70。锡球70的设置，以确保感光芯片30与PCB板20的电气性能连通，实现摄像头模组的数据传输。
请参照图2，第一注塑件51的厚度等于锡球70的厚度及感光芯片30的厚度之和。这样，也就进一步说明了第一注塑件51的底面与感光芯片30的底面位于同一水平面上，也就当摄像头模组在进行封装工艺时，对第一注塑件51的注塑厚度进行了限定，以确保摄像头模组的纵向尺寸。
在本公开实施例的一种实施方案中，第一电子元件61嵌入支架10内。例如，支架10的面对PCB板20的一侧设有收容槽，用以收容第一电子元件61。当支架10与PCB板20抵接时，第一电子元件61也就完全嵌入支架10内；当支架10不与PCB板20抵接时，第一电子元件61为部分嵌入支架10内。这样，进一步减小了摄像头模组的纵向尺寸，更有利于移动终端向薄型 化发展。
在本公开实施例的另一种实施方案中，PCB板20与支架10之间设有第二注塑件52，第一电子元件61收容于第二注塑件52中。通过注塑工艺，将设于PCB板20上的第一电子元件61封装于第二注塑件52中，通过第二注塑件52对PCB板20与支架10的连接起到固定作用。
本公开实施例还提供一种移动终端，该移动终端包括壳体及如上所述的摄像头模组，摄像头模组嵌入壳体内。由于本实施例的技术方案包含了上述实施例的全部技术方案，因此至少能实现上述实施例的全部技术效果，此处不再一一赘述。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种摄像头模组，包括镜头、支架、PCB板和感光芯片，所述镜头安装于所述支架形成的安装槽内，所述PCB板设于所述镜头一端，且所述PCB板贯通有用以光线穿过的通孔，所述感光芯片设于所述PCB板的背对所述镜头的一侧，所述PCB板的背对所述感光芯片的一侧设有第一电子元件，且所述第一电子元件连接所述支架；所述感光芯片、所述PCB板及所述支架均同轴线设置。
  2. 根据权利要求1所述的摄像头模组，其中，所述支架自所述轴线至最外端的距离大于或等于所述PCB板的自所述轴线至最外端的距离，所述PCB板的自所述轴线至最外端的距离大于或等于所述感光芯片的自所述轴线至最外端的距离。
  3. 根据权利要求2所述的摄像头模组，其中，所述PCB板的自所述轴线至最外端的距离大于所述感光芯片的自所述轴线至最外端的距离，所述感光芯片的外周设有第一注塑件，且所述第一注塑件与所述PCB板抵接。
  4. 根据权利要求3所述的摄像头模组，其中，所述第一注塑件的背对所述PCB板的一侧与所述感光芯片的背对所述PCB板的一侧位于同一平面上。
  5. 根据权利要求4所述的摄像头模组，其中，所述感光芯片自所述轴线至所述第一注塑件最外端的距离小于或等于所述支架自所述轴线至最外端的距离。
  6. 根据权利要求3所述的摄像头模组，其中，所述PCB板的背对所述镜头的一侧设有嵌于所述第一注塑件中的第二电子元件。
  7. 根据权利要求1至6中任一项所述的摄像头模组，其中，所述感光芯片与所述PCB板之间设有锡球。
  8. 根据权利要求1至6中任一项所述的摄像头模组，其中，所述第一电子元件嵌于所述支架内。
  9. 根据权利要求1至6中任一项所述的摄像头模组，其中，所述PCB板与所述支架之间设有第二注塑件，所述第一电子元件嵌于所述第二注塑件中。
  10. 一种移动终端，包括如权利要求1至9中任一项所述的摄像头模组。
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