WO2020044884A1 - 可動部位置検出方法、基板処理方法、基板処理装置および基板処理システム - Google Patents

可動部位置検出方法、基板処理方法、基板処理装置および基板処理システム Download PDF

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Publication number
WO2020044884A1
WO2020044884A1 PCT/JP2019/029068 JP2019029068W WO2020044884A1 WO 2020044884 A1 WO2020044884 A1 WO 2020044884A1 JP 2019029068 W JP2019029068 W JP 2019029068W WO 2020044884 A1 WO2020044884 A1 WO 2020044884A1
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WIPO (PCT)
Prior art keywords
image
unit
processing
substrate
chamber
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PCT/JP2019/029068
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English (en)
French (fr)
Japanese (ja)
Inventor
有史 沖田
英司 猶原
央章 角間
達哉 増井
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Priority to KR1020217005081A priority Critical patent/KR102557072B1/ko
Priority to CN201980056745.0A priority patent/CN112639391B/zh
Publication of WO2020044884A1 publication Critical patent/WO2020044884A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Definitions

  • the present invention relates to a technique for processing a substrate using a movable part that moves in a substrate processing apparatus, and particularly to a technique for detecting the position of the movable part.
  • the substrate to be processed include a semiconductor substrate, a flat panel display (FPD) substrate such as a liquid crystal display device and an organic EL (electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, Examples include a photomask substrate, a ceramic substrate, a solar cell substrate, a printed circuit board, and the like.
  • various processing solutions such as pure water, a photoresist solution, and an etching solution are supplied to a substrate to perform a substrate process such as a cleaning process or a resist coating process.
  • a substrate processing apparatus that discharges a processing liquid from a nozzle onto a surface of the substrate while rotating the substrate may be used.
  • a movable unit that moves to a predetermined position and performs processing may be used.
  • a movable part includes a nozzle that discharges a processing liquid or air toward a substrate at a predetermined processing position, a brush that performs processing such as physical cleaning by contacting a predetermined position of the substrate, and the like. .
  • Patent Literature 1 in one chamber, a plurality of alignment marks (reference parts) and their position information are acquired by image processing for detecting a movable part from an original image obtained by imaging. It describes that the position of the movable part in the processing space is specified from the position information.
  • a typical substrate processing apparatus may include a plurality of chambers for performing the same processing on a substrate.
  • the installation state of the camera does not always match between the chambers. For this reason, it is necessary to perform advance setting for accurately detecting the position of the movable portion for each chamber.
  • an object of the present invention is to provide a technique for efficiently performing a presetting for detecting a position of a movable portion in each chamber.
  • a first aspect is a method of detecting a position of a movable part that moves in a processing space in a chamber, the method comprising: (a) a first movable part disposed in a first chamber; Obtaining a first image by imaging the unit and the first index unit with a first camera, and (b) imaging the second movable unit and the second index unit arranged in a second chamber with a second camera (C) calculating a positional difference between the position of the first index portion in the first image and the second index portion in the second image; Setting a determination area for detecting the position of the second movable part in the second image based on the position of the first movable part in the first image and the positional difference. .
  • a second aspect is the method for detecting the position of a movable part according to the first aspect, wherein the first indicator is provided at a plurality of locations in the first chamber.
  • a third mode is the method for detecting the position of a movable section according to the first mode or the second mode, wherein the first index section is a board holding section for holding the board in a horizontal posture.
  • a fourth aspect is the method for detecting the position of a movable part according to any one of the first to third aspects, wherein the step (d) includes (d-1) including the first movable part in the first image. Setting a reference determination area; and (d-2) setting the determination area by applying the reference determination area in the second image and correcting a position according to the positional difference.
  • a fifth aspect is a substrate processing method for processing a substrate using a movable part moving in a processing space in a chamber, wherein (A) a first movable part and a first index part disposed in a first chamber are provided. Obtaining a first image by imaging with a first camera; and (B) imaging a second movable portion and a second index portion disposed in a second chamber with a second camera, thereby obtaining a second image. Obtaining an image; (C) calculating a positional difference between the position of the first index portion in the first image and the second index portion in the second image; and (D) obtaining the first image. Setting a determination area for detecting the position of the second movable part in the second image based on the position of the first movable part and the positional difference in.
  • a sixth aspect is a substrate processing apparatus that processes a substrate using a movable part that moves in a processing space in a chamber, wherein the first chamber, a first movable part that moves in the processing space in the first chamber, A first processing unit including a first index unit provided in a first chamber; a second chamber; a second movable unit moving in a processing space in the second chamber; and a second processing unit provided in the second chamber.
  • a second processing unit including two indicator units, a first camera that captures the first movable unit and the first indicator unit to obtain a first image, and an image of the second movable unit and the second indicator unit A second camera that obtains a second image by performing the calculation, and a difference calculation unit that calculates a positional difference between the position of the first index unit in the first image and the position of the second index unit in the second image.
  • the first movable in the first image Position and, and a on the basis of the positional difference, sets a determination region for detecting the position of said second movable portion in the second image determination area setting unit.
  • a seventh aspect is a substrate processing system, comprising: a first substrate processing apparatus, a second substrate processing apparatus, and an information processing unit communicably connected to the first and second substrate processing apparatuses.
  • a first processing unit including a first chamber, a first movable unit that moves in a processing space in the first chamber, and a first index unit provided in the first chamber.
  • a first camera that captures the first movable section and the first index section to obtain a first image
  • the second substrate processing apparatus includes a second chamber, a processing space in the second chamber.
  • a second processing unit including a second movable portion moving in the second and a second index portion provided in the second chamber, and photographing the second movable portion and the second index portion to obtain a second image.
  • a second camera and wherein the information processing section comprises the second camera.
  • a difference calculation unit that calculates a positional difference between the position of the first index unit in the image and the position of the second index unit in the second image; and a position of the first movable unit in the first image.
  • a determination region setting unit configured to set a determination region for detecting a position of the second movable unit in the second image based on the positional difference.
  • the visual field position of the second camera with respect to the first camera is determined from the positional difference between the position of the first index part in the first image and the position of the second index part in the second image.
  • the error can be determined.
  • the position of the second movable part in the second image can be appropriately predicted from the positional difference between the first movable part and the index part in the first image. Therefore, the determination region for detecting the position of the second movable portion in the second image can be appropriately set.
  • the determination region can be set in another chamber with reference to one chamber, the presetting for detecting the position of the movable portion in each chamber can be efficiently performed.
  • the movable part position detection method of the second aspect position information of each of a plurality of dispersed locations is obtained. Thereby, the error of the visual field position of the second camera with respect to the first camera can be obtained with high accuracy.
  • the movable part position detection method of the third aspect it is possible to obtain an error in the visual field position from the position information of the substrate holding part.
  • the reference determination area set in the first image is applied to the second image, so that the determination area can be quickly set in the second image. Further, by correcting the position of the reference determination region according to the positional difference between the index portions, the determination region can be set to an appropriate position in the second image.
  • the error of the visual field position of the second camera with respect to the first camera is determined from the positional difference between the position of the first index unit in the first image and the position of the second index unit in the second image. You can ask. For this reason, the position of the second movable part in the second image can be appropriately predicted from the positional difference between the first movable part and the index part in the first image. Therefore, the determination region for detecting the position of the second movable portion in the second image can be appropriately set. In addition, since the determination region can be set in another chamber with reference to one chamber, the presetting for detecting the position of the movable portion in each chamber can be efficiently performed.
  • the error of the visual field position of the second camera with respect to the first camera is determined from the positional difference between the position of the first index unit in the first image and the position of the second index unit in the second image. You can ask. For this reason, the position of the second movable part in the second image can be appropriately predicted from the positional difference between the first movable part and the index part in the first image. Therefore, the determination region for detecting the position of the second movable portion in the second image can be appropriately set. In addition, since the determination region can be set in another chamber with reference to one chamber, the presetting for detecting the position of the movable portion in each chamber can be efficiently performed.
  • the error in the visual field position of the second camera with respect to the first camera is determined from the positional difference between the position of the first index unit in the first image and the position of the second index unit in the second image.
  • the position of the second movable part in the second image can be appropriately predicted from the positional difference between the first movable part and the index part in the first image. Therefore, the determination region for detecting the position of the second movable portion in the second image can be appropriately set.
  • the determination region can be set in the chamber of another substrate processing apparatus with reference to one chamber 10 in one substrate processing apparatus, the preliminary setting for detecting the position of the movable unit in each chamber is efficiently performed. be able to.
  • FIG. 1 is a diagram illustrating an overall configuration of a substrate processing apparatus 100 according to a first embodiment. It is a schematic plan view of cleaning processing unit 1 of a 1st embodiment. It is an outline longitudinal section of cleaning processing unit 1 of a 1st embodiment.
  • FIG. 3 is a diagram illustrating a positional relationship between a camera 70 and a nozzle 30 that is a movable part.
  • FIG. 3 is a block diagram of a camera 70 and a control unit 9.
  • 5 is a flowchart illustrating a procedure of preparations for a process of detecting a position of a nozzle.
  • FIG. 7 is a diagram illustrating an example of a reference image 80.
  • FIG. 6 is a diagram illustrating an example of a target image 82.
  • FIG. 7 is a diagram showing a determination area DR set in a target image 82. It is a flowchart which shows the procedure of a board
  • FIG. 1 is a diagram illustrating an overall configuration of a substrate processing apparatus 100 according to the first embodiment.
  • the substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W to be processed one by one.
  • the substrate processing apparatus 100 performs a cleaning process on a substrate W, which is a silicon substrate having a circular thin plate shape, using a rinsing solution such as a chemical solution and pure water, and then performs a drying process.
  • a chemical solution for example, SC1 (ammonia-hydrogen peroxide mixture), SC2 (hydrochloric hydrogen peroxide mixed water solution), DHF solution (dilute hydrofluoric acid) and the like are used.
  • the treatment liquid is a generic term of a treatment liquid and a rinsing liquid, and is referred to as a “treatment liquid”.
  • the substrate processing apparatus 100 supplies a coating liquid such as a photoresist liquid for a film formation processing, a chemical liquid for removing an unnecessary film, and a chemical liquid for etching, instead of a cleaning processing, to wet-process a substrate. It may be configured to do so.
  • the substrate processing apparatus 100 includes a plurality of cleaning units 1, an indexer 102, and a main transfer robot 103.
  • the indexer 102 transports the substrate W to be processed received from outside the apparatus into the apparatus, and unloads the processed substrate W after the cleaning processing from the apparatus.
  • the indexer 102 mounts a plurality of carriers (not shown) and includes a transfer robot (not shown).
  • a transfer robot As the carrier, a FOUP (Front Opening Unified Unified Pod) or SMIF (Standard Mechanical InterFace) pod for accommodating the substrate W in a closed space, or an OC (Open Cassette) for exposing the substrate W to the outside air may be employed.
  • the transfer robot transfers the substrate W between the carrier and the main transfer robot 103.
  • the cleaning unit 1 performs liquid processing and drying processing on one substrate W.
  • twelve cleaning processing units 1 are arranged. Specifically, four towers each including three cleaning units 1 stacked in the vertical direction are arranged so as to surround the main transfer robot 103.
  • FIG. 1 schematically shows one of the cleaning units 1 stacked in three stages.
  • the number of cleaning units 1 in the substrate processing apparatus 100 is not limited to 12, and may be changed as appropriate.
  • the main transfer robot 103 is installed at the center of the four towers on which the cleaning units 1 are stacked.
  • the main transfer robot 103 loads the substrate W to be processed, received from the indexer 102, into each cleaning processing unit 1.
  • the main transport robot 103 unloads the processed substrate W from each cleaning processing unit 1 and delivers it to the indexer 102.
  • ⁇ Cleaning unit 1> one of the twelve cleaning processing units 1 mounted on the substrate processing apparatus 100 will be described. However, the other cleaning processing units 1 are also different except that the arrangement relationship of the nozzles 30, 60, and 65 is different. It has the same configuration.
  • FIG. 2 is a schematic plan view of the cleaning unit 1 according to the first embodiment.
  • FIG. 3 is a schematic vertical sectional view of the cleaning unit 1 of the first embodiment.
  • FIG. 2 shows a state where the substrate W is not held on the spin chuck 20, and
  • FIG. 3 shows a state where the substrate W is held on the spin chuck 20.
  • the cleaning unit 1 includes a spin chuck 20 that holds a substrate W in a horizontal position (a position in which the normal of the surface of the substrate W is along the vertical direction) in the chamber 10, and an upper surface of the substrate W held by the spin chuck 20.
  • Nozzles 30, 60, and 65 for supplying a processing liquid to the substrate, a processing cup 40 surrounding the periphery of the spin chuck 20, and a camera 70 for imaging the space above the spin chuck 20.
  • a partition plate 15 is provided around the processing cup 40 in the chamber 10 to vertically partition the inner space of the chamber 10.
  • the chamber 10 includes a side wall 11 extending in the vertical direction and surrounding four sides, a ceiling wall 12 closing the upper side of the side wall 11, and a floor wall 13 closing the lower side of the side wall 11.
  • the space surrounded by the side wall 11, the ceiling wall 12, and the floor wall 13 is a processing space for the substrate W.
  • a part of the side wall 11 of the chamber 10 is provided with a loading / unloading port for the main transfer robot 103 to load / unload the substrate W with respect to the chamber 10 and a shutter for opening / closing the loading / unloading port (both not shown). ing.
  • a fan filter unit (FFU) 14 for further purifying air in a clean room where the substrate processing apparatus 100 is installed and supplying the air to a processing space in the chamber 10 is attached to the ceiling wall 12 of the chamber 10.
  • the FFU 14 includes a fan and a filter (for example, a HEPA filter) for taking in air in the clean room and sending the air into the chamber 10.
  • the FFU 14 forms a downflow of clean air in the processing space in the chamber 10.
  • a punching plate having a number of blowout holes may be provided directly below the ceiling wall 12.
  • the spin chuck 20 includes a spin base 21, a spin motor 22, a cover member 23, and a rotating shaft 24.
  • the spin base 21 has a disk shape, and is fixed in a horizontal posture to an upper end of a rotating shaft 24 extending along the vertical direction.
  • the spin motor 22 is provided below the spin base 21 and rotates the rotation shaft 24.
  • the spin motor 22 rotates the spin base 21 via a rotation shaft 24 in a horizontal plane.
  • the cover member 23 has a cylindrical shape surrounding the spin motor 22 and the rotation shaft 24.
  • the outer diameter of the disc-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has a holding surface 21a facing the entire lower surface of the substrate W to be held.
  • a plurality (four in the present embodiment) of chuck pins 26 are provided upright on the periphery of the holding surface 21a of the spin base 21.
  • the chuck pins 26 are arranged at equal intervals along the circumference corresponding to the outer diameter of the outer peripheral circle of the circular substrate W.
  • four chuck pins 26 are provided at 90 ° intervals.
  • Each of the chuck pins 26 is driven in conjunction with each other by a link mechanism (not shown) accommodated in the spin base 21.
  • the spin chuck 20 holds the substrate W by bringing each of the chuck pins 26 into contact with the outer peripheral edge of the substrate W, thereby holding the substrate W in a horizontal posture close to the holding surface 21 a above the spin base 21. Hold (see FIG. 3).
  • the spin chuck 20 releases the grip of the substrate W by separating each of the chuck pins 26 from the outer peripheral end of the substrate W.
  • Each chuck pin 26 is a substrate holding unit that holds the substrate W in a horizontal posture.
  • the cover member 23 covering the spin motor 22 has its lower end fixed to the floor wall 13 of the chamber 10 and its upper end reaching just below the spin base 21.
  • a flange-like member 25 that extends substantially horizontally outward from the cover member 23 and that bends downward and extends further is provided.
  • the nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32.
  • the base end of the nozzle arm 32 is fixedly connected to a nozzle base 33.
  • a motor 332 (nozzle moving unit) provided on the nozzle base 33 is rotatable around an axis extending in the vertical direction.
  • the nozzle 30 moves in the horizontal direction between a position above the spin chuck 20 and a standby position outside the processing cup 40 as indicated by an arrow AR34 in FIG. Move along the arc. Due to the rotation of the nozzle base 33, the nozzle 30 swings above the holding surface 21a of the spin base 21. More specifically, it moves to a predetermined processing position TP1 extending in the horizontal direction above the spin base 21. Moving the nozzle 30 to the processing position TP1 is synonymous with moving the ejection head 31 at the tip of the nozzle 30 to the processing position TP1.
  • the nozzle 30 is configured to be supplied with a plurality of types of processing liquids (including at least pure water), so that the discharging head 31 can discharge a plurality of types of processing liquids.
  • a plurality of ejection heads 31 may be provided at the tip of the nozzle 30, and the same or different treatment liquids may be individually ejected from each of them.
  • the nozzle 30 (specifically, the discharge head 31) stops at the processing position TP1, and discharges the processing liquid.
  • the processing liquid discharged from the nozzle 30 lands on the upper surface of the substrate W held by the spin chuck 20.
  • the cleaning unit 1 of this embodiment is provided with two nozzles 60 and 65 in addition to the nozzle 30 described above.
  • the nozzles 60 and 65 of the present embodiment have the same or similar configuration as the nozzle 30 described above. That is, the nozzle 60 is configured by attaching a discharge head to the distal end of the nozzle arm 62, and the nozzle base 63 connected to the proximal end side of the nozzle arm 62 is provided above the spin chuck 20 as indicated by an arrow AR64. It moves in an arc between the processing position and the standby position outside the processing cup 40.
  • the nozzle 65 is configured by attaching a discharge head to the tip of a nozzle arm 67, and a processing position above the spin chuck 20 as indicated by an arrow AR69 by a nozzle base 68 connected to the base end of the nozzle arm 67. And the standby position outside the processing cup 40 in an arc shape.
  • the nozzles 60 and 65 are also configured to be supplied with a plurality of types of processing liquids including at least pure water, and discharge the processing liquid onto the upper surface of the substrate W held by the spin chuck 20 at the processing position.
  • At least one of the nozzles 60 and 65 is a two-fluid nozzle that mixes a cleaning liquid such as pure water and a pressurized gas to generate droplets, and jets a mixed fluid of the droplets and the gas to the substrate W. It may be. Further, the number of nozzles provided in the cleaning processing unit 1 is not limited to three, but may be one or more.
  • each of the nozzles 30, 60, 65 may be moved linearly by providing a direct drive unit.
  • a lower surface processing liquid nozzle 28 is provided along the vertical direction so as to pass through the inside of the rotating shaft 24.
  • the upper end opening of the lower processing liquid nozzle 28 is formed at a position facing the center of the lower surface of the substrate W held by the spin chuck 20.
  • the lower processing liquid nozzle 28 is also configured to supply a plurality of types of processing liquid. The processing liquid discharged from the lower processing liquid nozzle 28 lands on the lower surface of the substrate W held by the spin chuck 20.
  • the processing cup 40 surrounding the spin chuck 20 includes an inner cup 41, a middle cup 42, and an outer cup 43 which can be raised and lowered independently of each other.
  • the inner cup 41 has a shape that surrounds the periphery of the spin chuck 20 and is substantially rotationally symmetric with respect to a rotation axis CX passing through the center of the substrate W held by the spin chuck 20.
  • the inner cup 41 has an annular bottom portion 44 in plan view, a cylindrical inner wall portion 45 rising upward from the inner peripheral edge of the bottom portion 44, a cylindrical outer wall portion 46 rising upward from the outer peripheral edge of the bottom portion 44, and an inner wall.
  • the first guide portion 47 which rises from between the portion 45 and the outer wall portion 46 and extends obliquely upward at the center (in a direction approaching the rotation axis CX of the substrate W held by the spin chuck 20) while drawing a smooth arc at the upper end. And a cylindrical middle wall 48 rising upward from between the first guide portion 47 and the outer wall 46.
  • the inner wall portion 45 is housed with an appropriate gap between the cover member 23 and the flange member 25 with the inner cup 41 raised most.
  • the middle wall portion 48 is accommodated in a state where the inner cup 41 and the middle cup 42 are closest to each other, with an appropriate gap kept between a second guide portion 52 described later of the middle cup 42 and the processing liquid separation wall 53. You.
  • the first guide portion 47 has an upper end portion 47b extending obliquely upward toward the center (in a direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc. Further, between the inner wall portion 45 and the first guide portion 47, a disposal groove 49 for collecting and discarding the used processing liquid is formed. An annular inner collecting groove 50 for collecting and collecting used processing liquid is provided between the first guide portion 47 and the middle wall portion 48. Further, between the middle wall portion 48 and the outer wall portion 46, there is an annular outer collection groove 51 for collecting and collecting different types of processing liquids from the inner collection groove 50.
  • An exhaust liquid mechanism (not shown) for discharging the treatment liquid collected in the waste groove 49 and forcibly exhausting the waste groove 49 is connected to the waste groove 49.
  • four exhaust liquid mechanisms are provided at equal intervals along the circumferential direction of the waste groove 49.
  • the inner collecting groove 50 and the outer collecting groove 51 have a collecting mechanism for collecting the processing liquid collected in the inner collecting groove 50 and the outer collecting groove 51 into a collecting tank provided outside the substrate processing apparatus 100. (Both not shown) are connected.
  • the bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined by a small angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position.
  • the processing liquid flowing into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.
  • the middle cup 42 has a shape that surrounds the periphery of the spin chuck 20 and is substantially rotationally symmetric with respect to a rotation axis CX passing through the center of the substrate W held by the spin chuck 20.
  • the middle cup 42 has a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.
  • the second guide part 52 draws a smooth arc outside the first guide part 47 of the inner cup 41 from the upper end of the lower end part 52a which is coaxially cylindrical with the lower end part of the first guide part 47, and the lower end part 52a. It has an upper end portion 52b extending obliquely upward toward the center (in a direction approaching the rotation axis CX of the substrate W), and a folded portion 52c formed by folding the distal end portion of the upper end portion 52b downward.
  • the lower end portion 52a is accommodated in the inner recovery groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48 in a state where the inner cup 41 and the middle cup 42 are closest to each other.
  • the upper end portion 52b is provided so as to vertically overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41, and when the inner cup 41 and the middle cup 42 are closest to each other, the first guide portion 47 is provided. Is kept close to the upper end portion 47b at a very small interval.
  • the folded portion 52c horizontally overlaps the tip of the upper end portion 47b of the first guide portion 47 when the inner cup 41 and the middle cup 42 are closest to each other.
  • the upper end portion 52b of the second guide portion 52 is formed so as to be thicker downward.
  • the processing liquid separation wall 53 has a cylindrical shape provided to extend downward from the outer peripheral edge of the lower end of the upper end 52b.
  • the processing liquid separation wall 53 is accommodated in the outer recovery groove 51 with an appropriate gap between the middle wall portion 48 and the outer cup 43 with the inner cup 41 and the middle cup 42 being closest to each other.
  • the outer cup 43 has a shape that is substantially rotationally symmetric with respect to a rotation axis CX passing through the center of the substrate W held by the spin chuck 20.
  • the outer cup 43 surrounds the spin chuck 20 outside the second guide portion 52 of the middle cup 42.
  • the outer cup 43 has a function as a third guide.
  • the outer cup 43 has a lower end portion 43a coaxial with the lower end portion 52a of the second guide portion 52, and a central side (in a direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc from the upper end of the lower end portion 43a. It has an upper end portion 43b extending obliquely upward and a folded portion 43c formed by folding a tip end of the upper end portion 43b downward.
  • the lower end portion 43a When the inner cup 41 and the outer cup 43 are closest to each other, the lower end portion 43a is formed with an outer collecting groove while maintaining an appropriate gap between the processing liquid separation wall 53 of the middle cup 42 and the outer wall portion 46 of the inner cup 41. 51.
  • the upper end portion 43b is provided so as to overlap the second guide portion 52 of the middle cup 42 in the up-down direction, and when the middle cup 42 and the outer cup 43 are closest to each other, the upper end portion 43b is located on the upper end portion 52b of the second guide portion 52. Keep close together with very small intervals.
  • the folded portion 43c overlaps the folded portion 52c of the second guide portion 52 in the horizontal direction.
  • the inner cup 41, the middle cup 42, and the outer cup 43 can be raised and lowered independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is individually provided with an elevating mechanism (not shown), whereby the elevating mechanism is separately and independently elevated.
  • an elevating mechanism various known mechanisms such as a ball screw mechanism and an air cylinder can be adopted.
  • the partition plate 15 is provided so as to vertically partition the inner space of the chamber 10 around the processing cup 40.
  • the partition plate 15 may be a single plate member surrounding the processing cup 40, or may be a combination of a plurality of plate members. Further, the partition plate 15 may be formed with a through hole or notch penetrating in the thickness direction. In the present embodiment, the partition plate 15 supports the nozzle bases 33, 63, 68 of the nozzles 30, 60, 65. Are formed through the support shaft.
  • the outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10.
  • the edge of the partition plate 15 surrounding the processing cup 40 is formed in a circular shape having a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not prevent the outer cup 43 from moving up and down.
  • An exhaust duct 18 is provided in a part of the side wall 11 of the chamber 10 and near the floor wall 13.
  • the exhaust duct 18 is connected to an exhaust mechanism (not shown).
  • the air passing between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.
  • FIG. 4 is a diagram showing a positional relationship between the camera 70 and the nozzle 30 as a movable part.
  • the camera 70 is provided vertically above the substrate W in the vertical direction.
  • the camera 70 includes, for example, a CCD, which is one of solid-state imaging devices, and an optical system such as an electronic shutter and a lens.
  • the imaging direction of the camera 70 (that is, the optical axis direction of the imaging optical system) is set obliquely downward toward the rotation center of the upper surface of the substrate W (or in the vicinity thereof) in order to image the upper surface of the substrate W.
  • the camera 70 covers the entire top surface of the substrate W held by the spin chuck 20 in its field of view. For example, in the horizontal direction, a range surrounded by a broken line in FIG.
  • the camera 70 is installed so that its imaging visual field includes at least the tip of the nozzle 30 at the processing position TP1, that is, at a position including the vicinity of the ejection head 31.
  • the camera 70 is installed at a position where the nozzle 30 at the processing position TP1 is imaged from the upper front. Therefore, the camera 70 can image the imaging area PA including the tip of the nozzle 30 at the processing position TP1.
  • the camera 70 captures an image of the imaging area PA including each tip when the nozzles 60 and 65 are at the processing position when performing processing on the substrate W held on the spin chuck 20.
  • the nozzles 30 and 60 move in the horizontal direction within the imaging field of view of the camera 70, so that the tips of the nozzles 30 and 60 at each processing position Can be properly imaged, but since the nozzle 65 moves in the depth direction within the field of view of the camera 70, the movement near the processing position may not be properly imaged.
  • a camera for imaging the nozzle 65 may be provided separately from the camera 70.
  • the nozzle 30 is driven by the nozzle base 33 to move the processing position TP1 (the position indicated by the broken line in FIG. 4) above the substrate W held by the spin chuck 20 and the standby position outside the processing cup 40 (FIG. 4).
  • the processing position TP1 is a position where the cleaning liquid is discharged from the nozzle 30 onto the upper surface of the substrate W held by the spin chuck 20 to perform the cleaning processing.
  • the processing position TP1 is a position closer to the edge than the center of the substrate W held by the spin chuck 20.
  • the standby position is a position where the nozzle 30 stops discharging the processing liquid and waits when the nozzle 30 does not perform the cleaning process.
  • the standby position is a position deviated from above the spin base 21 and a position outside the processing cup 40 in a horizontal plane.
  • a standby pod that accommodates the ejection head 31 of the nozzle 30 may be provided at the standby position.
  • the processing position TP1 may be an arbitrary position such as the center of the substrate W, and the processing position TP1 may be a position deviated from above the substrate W. In the latter case, the processing liquid discharged from the nozzle 30 may be scattered from outside the substrate W onto the upper surface of the substrate W. It is not essential that the processing liquid be ejected from the nozzle 30 while the nozzle 30 is stopped at the processing position TP1. For example, while discharging the processing liquid from the nozzle 30, the nozzle 30 may be moved within a predetermined processing section extending in the horizontal direction above the substrate W with the processing position TP1 as one end.
  • an illumination unit 71 is provided in the chamber 10 at a position above the partition plate 15.
  • the illumination unit 71 includes, for example, an LED lamp as a light source.
  • the illumination unit 71 supplies illumination light required for the camera 70 to image the inside of the chamber 10 to the processing space.
  • the control unit 9 may control the illumination unit 71 so that the illumination unit 71 irradiates the nozzles 30, 60, 65 with light when the camera 70 performs imaging.
  • FIG. 5 is a block diagram of the camera 70 and the control unit 9.
  • the configuration of the control unit 9 provided in the substrate processing apparatus 100 as hardware is the same as that of a general computer. That is, the control unit 9 includes a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores a basic program, a RAM that is a readable and writable memory that stores various information, and control software (program) and data. It has a magnetic disk and the like for storing.
  • the CPU of the control unit 9 executes a predetermined processing program, the operation of each element of the substrate processing apparatus 100 is controlled by the control unit 9 and the processing in the substrate processing apparatus 100 proceeds.
  • the image processing unit 91, the difference calculation unit 92, and the position detection unit 93 shown in FIG. 5 are function processing units realized in the control unit 9 when the CPU of the control unit 9 executes a predetermined processing program.
  • the image processing unit 91 performs image processing such as correction processing and pattern matching processing on the captured image obtained by the camera 70.
  • the image processing unit 91 detects the nozzles 30, 60, and 65 in the captured image acquired by the camera 70. Further, the image processing section 91 specifies the position of the index section in the captured image obtained by the camera 70.
  • the index unit is an element disposed in the chamber 10 and is an index for determining the position in the processing space of the imaging area PA to be a captured image.
  • the index portion is an element whose position in the processing space is known in advance.
  • the index portion is, for example, a plurality (specifically, three) of the chuck pins 26.
  • Each chuck pin 26 is arranged at a predetermined position when the rotation of the spin base 21 is stopped. By detecting each of the chuck pins 26 in the captured image, the position of the imaging area PA in the processing space is specified.
  • the indicator is preferably a member that can be easily detected by image processing. For example, in a captured image, it is preferable that the ratio of the brightness to the background is large. Since the chuck pin 26 has a higher contrast ratio than the spin base 21, it is easy to specify the position of the chuck pin 26 by image processing.
  • the position of each chuck pin 26 in the captured image may be the position of a representative point such as the detected center of gravity of each chuck pin. Elements other than the chuck pins 26 (for example, the spin base 21, the nozzle base 33, and the like) may be used as the indicator.
  • a plurality of marks having a pattern of a predetermined shape may be provided in the chamber 10. For example, when a mark (such as a cross) including an intersection where a plurality of straight lines intersect is adopted as the indicator, an intersection that is relatively easy to detect in the captured image may be set as the position of the mark.
  • the difference calculator 92 determines the position of the index portion (chuck pin 26) in the captured image (reference image 80) acquired in the reference chamber 10 and the position in the captured image (target image 82) acquired in the setting target chamber 10.
  • a positional difference which is a difference from the position of the index portion (chuck pin 26) is calculated (see FIGS. 7 and 8).
  • the positional difference between the index portions corresponds to an error in the visual field position of the camera 70 that images the chamber 10 to be set with respect to the camera 70 that images the reference chamber 10.
  • the visual field position of the camera 70 is the position of the imaging area PA of the camera 70 in each processing space.
  • the position detection unit 93 detects the positions of the nozzles 30, 60, and 65 on the captured image.
  • the position detection unit 93 includes a determination region setting unit 932 that sets a reference determination region SDR (see FIG. 7) and a determination region DR (see FIG. 10) for detecting the positions of the nozzles 30, 60, and 65.
  • the determination area setting unit 932 sets the reference determination area SDR based on the positions of the nozzles 30, 60, and 65 in the captured image (reference image 80) acquired in the reference chamber 10. Further, the determination area setting unit 932 sets the determination area DR in a captured image (target image 82) acquired in another chamber 10 to be set.
  • each camera 70 with respect to each chamber 10 may deviate from an appropriate position. That is, the position of the field of view of the camera 70 (the position of the imaging area PA of the camera 70 in the processing space) may be different for each cleaning processing unit 1. Therefore, the determination area setting unit 932 sets the determination area DR by correcting the position of the reference determination area SDR according to the positional difference of the index unit corresponding to the error of the visual field position of the camera 70 to be set. Thereby, even when there is an error in the visual field position of each camera 70, it is possible to appropriately cope with the error.
  • the position detection unit 93 includes an image in the determination region DR including the nozzles 30, 60, and 65 to be detected and a reference determination region SDR of the nozzles 30, 60, and 65 obtained in the reference cleaning processing unit 1.
  • a well-known pattern matching is performed with the image (reference determination region image), and a matching score indicating the degree of matching is calculated.
  • the matching score increases, and when the nozzle 30 is displaced from the processing position TP1, the matching score decreases.
  • An appropriate threshold value for the matching score may be set in advance by the operator, and a determination result obtained by comparison with the threshold value may be output to the output unit.
  • the output unit is, for example, the display unit 97, a printer, an alarm lamp, a speaker, or the like.
  • the control unit 9 includes a storage unit 96 including the above-described RAM or magnetic disk.
  • the storage unit 96 stores data of an image captured by the camera 70, input values of an operator, and the like.
  • the storage unit 96 stores, for each chamber 10 of each cleaning processing unit 1, data indicating the positional difference of the index unit calculated by the difference calculation unit 92, on the captured image of the determination area DR set by the determination area setting unit 932. Is stored.
  • the display unit 97 and the input unit 98 are connected to the control unit 9.
  • the display unit 97 displays various information according to the image signal from the control unit 9.
  • the input unit 98 includes an input device such as a keyboard and a mouse connected to the control unit 9 and receives an input operation performed by the operator on the control unit 9.
  • the main transport robot 103 sequentially loads the substrate W to be processed, which is received from the indexer 102, into each cleaning processing unit 1. It includes a step of performing a cleaning process, and a step of unloading the processed substrate W from the cleaning processing unit 1 and returning the processed substrate W to the indexer 102.
  • the outline of a typical cleaning processing procedure of the substrate W in each cleaning processing unit 1 is as follows. After supplying a chemical solution to the surface of the substrate W and performing a predetermined chemical solution process, pure water is supplied to perform a pure water rinsing process. Thereafter, the pure water is shaken off by rotating the substrate W at a high speed, and the substrate W is dried.
  • the cleaning processing unit 1 performs the processing of the substrate W
  • the substrate W is held on the spin chuck 20 and the processing cup 40 moves up and down.
  • the cleaning unit 1 performs the chemical treatment, for example, only the outer cup 43 is raised, and the spin chuck 20 is disposed between the upper end 43b of the outer cup 43 and the upper end 52b of the second guide portion 52 of the middle cup 42. An opening surrounding the held substrate W is formed.
  • the substrate W is rotated together with the spin chuck 20, and the chemical liquid is supplied from the nozzle 30 and the lower processing liquid nozzle 28 to the upper and lower surfaces of the substrate W.
  • the supplied chemical liquid flows along the upper surface and the lower surface of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is scattered laterally from the edge of the substrate W. Thereby, the chemical processing of the substrate W proceeds.
  • the chemical liquid scattered from the edge of the rotating substrate W is received by the upper end 43b of the outer cup 43, flows down the inner surface of the outer cup 43, and is collected in the outer collecting groove 51.
  • the cleaning processing unit 1 When the cleaning processing unit 1 performs the pure water rinsing processing, for example, all of the inner cup 41, the middle cup 42, and the outer cup 43 are raised, and the periphery of the substrate W held by the spin chuck 20 is the first cup of the inner cup 41. It is surrounded by the guide 47. In this state, the substrate W is rotated together with the spin chuck 20, and pure water is supplied from the nozzle 30 and the lower processing liquid nozzle 28 to the upper and lower surfaces of the substrate W. The supplied pure water flows along the upper surface and the lower surface of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered laterally from the edge of the substrate W. Thereby, the pure water rinsing process of the substrate W proceeds.
  • Pure water scattered from the edge of the rotating substrate W flows down along the inner wall of the first guide portion 47 and is discharged from the waste groove 49.
  • the middle cup 42 and the outer cup 43 are raised, and the upper end 52 b of the second guide portion 52 of the middle cup 42 and the first guide of the inner cup 41 are raised.
  • An opening that surrounds the periphery of the substrate W held by the spin chuck 20 may be formed between the upper end portion 47b of the portion 47.
  • the washing processing unit 1 When the washing processing unit 1 performs the shake-off drying process, all of the inner cup 41, the middle cup 42, and the outer cup 43 descend, and the upper end portion 47b of the first guide portion 47 of the inner cup 41 and the second guide of the middle cup 42. Both the upper end 52b of the portion 52 and the upper end 43b of the outer cup 43 are located below the substrate W held by the spin chuck 20. In this state, the substrate W is rotated at high speed together with the spin chuck 20, and water droplets attached to the substrate W are shaken off by centrifugal force, and a drying process is performed.
  • the camera 70 captures an image of the nozzle 30 stopped at the processing position TP1. Then, the position detection unit 93 uses the image in the determination region DR of the captured image (target image 82) obtained by the imaging and the image in the reference determination region SDR of the previously captured reference captured image (reference image 80). By comparing with the (reference determination area image 960), the position abnormality of the nozzle 30 is detected.
  • the technique will be described in detail. In the following, a technique for detecting the position of the nozzle 30 will be described, but the present invention is also applicable to other nozzles 60 and 65.
  • FIG. 6 is a flowchart showing a procedure for preparing in advance for the process of detecting the position of the nozzle 30.
  • the preliminary preparation shown in FIG. 6 is performed prior to the actual processing process of the substrate W to be processed, and may be performed, for example, when starting up the substrate processing apparatus 100 or during maintenance work. .
  • Each step shown in FIG. 6 is performed under the control of the control unit 9 unless otherwise specified.
  • the control unit 9 sets the determination area DR for each cleaning processing unit 1. First, the control unit 9 sets one of the cleaning processing units 1 as a reference cleaning processing unit 1 and uses a camera 70 (first camera) provided in the cleaning processing unit 1 to control the inside of the chamber 10 (first chamber). An image is taken (FIG. 6: step S11). By this step S11, the reference image 80 (first image), which is the reference photographed image, is obtained.
  • FIG. 7 is a diagram showing an example of the reference image 80.
  • the reference image 80 includes the nozzle 30 (first movable unit) that is correctly arranged at the processing position TP1 together with the four chuck pins 26.
  • the reference cleaning processing unit 1 has been confirmed to have, for example, an appropriate mounting position and an imaging direction of the camera 70.
  • a captured image of the inside of the chamber 10 captured by the camera 70 having an appropriate visual field position is acquired as the reference image 80.
  • the reference cleaning processing unit 1 is one in which the processing position TP1 of the nozzle 30 has been confirmed to be appropriate. In this case, a captured image of the nozzle 30 correctly arranged at the processing position TP1 is acquired as the reference image 80.
  • the control unit 9 specifies the position of each chuck pin 26 that is an index unit (first index unit) in the reference image 80 obtained in step S11 (FIG. 6: step). S12). Specifically, the image processing section 91 detects each chuck pin 26 in the reference image 80 by pattern matching processing. That is, the image processing unit 91 searches the reference image 80 for a portion that matches a previously prepared pattern corresponding to each chuck pin 26. Then, the image processing section 91 specifies a detected representative point such as the center of gravity of each chuck pin 26 as the position of each index section.
  • step S12 the positions ((a 1 x, a 1 y), (a 2 x, a 2 y), and (a 2 x) of three chuck pins 26 of the four chuck pins 26 in the reference image 80 shown in FIG. 3 x, a 3 y)) are specified.
  • the chuck pins 26 are provided in a plurality of places in the chamber 10 in a dispersed manner. Therefore, the position of the field of view of the camera 70 can be specified by obtaining the position of each chuck pin 26.
  • Each of the chuck pins 26 has an asymmetric shape. For this reason, each chuck pin 26 has a different shape when viewed from the camera 70. Therefore, each chuck pin 26 can be easily identified by pattern matching.
  • the chuck pin 26 serving as the index portion does not overlap the nozzle 30 serving as the movable portion that has moved to the processing position TP1 that is the position to be detected on the captured image.
  • the control unit 9 sets a reference determination area SDR for detecting the position of the nozzle 30 in the reference image 80 (Step S13).
  • the reference determination area SDR in the reference image 80 may be set based on, for example, an operator's designation.
  • the reference image 80 is displayed on the display unit 97, and the operator performs an operation on the input unit 98 on the reference image 80 so as to surround a part (for example, the tip) of the nozzle 30 (first movable unit). It is good to do it.
  • the determination area setting unit 932 may set the enclosed area as the reference determination area SDR.
  • the setting of the reference determination area SDR in the reference image 80 may be performed automatically.
  • the image processing unit 91 detects a part (for example, a tip) of the nozzle 30 by a pattern matching process. Then, the determination area setting unit 932 may set an area having a size including a part of the detected nozzle 30 as the reference determination area SDR.
  • the reference determination area SDR is set at the tip of the nozzle 30 at the processing position TP1.
  • the reference determination area SDR may have a smaller dimension than the captured image, and may have a horizontal dimension larger than the tip of each of the nozzles 30, 60, and 65 to be detected on the captured image.
  • the reference determination region SDR be set such that the center of the tip of the nozzle 30 in the horizontal direction matches the center of the reference determination region SDR.
  • the image obtained by cutting out the reference determination area SDR from the reference image 80 is stored in the storage unit 96 as the reference determination area image 960.
  • This reference determination area image 960 is used as a comparison target when detecting the position of the nozzle 30 in step S24 shown in FIG.
  • Reference determination area information 962 Information indicating the position and size of the reference determination area SDR set in the reference image 80 is stored in the storage unit 96 as reference determination area information 962.
  • the reference determination region information 962 is appropriately read when the determination region setting unit 932 sets the determination region DR in the captured image (target image 82) of the chamber 10 to be set.
  • control unit 9 captures an image of the inside of the chamber 10 (second chamber) of the cleaning unit 1 to be set by the camera 70 (second camera) (FIG. 6: step S14).
  • a target image that is a captured image to be set is obtained.
  • the target image is an example of a “second image”.
  • FIG. 8 is a diagram showing an example of the target image 82.
  • the target image 82 includes the nozzles 30 arranged at positions corresponding to the processing position TP1, together with the four chuck pins 26, similarly to the reference image 80 shown in FIG.
  • the nozzle 30 may be at another position such as a standby position.
  • the nozzle 30 is located at a position that does not overlap with each chuck pin 26 serving as an index portion (that is, the nozzle 30 and the chuck pin 26 do not overlap in the imaging direction of the camera 70). .
  • the cleaning processing unit 1 to be set has the same positional relationship as the reference cleaning processing unit 1 with respect to the nozzle 30 as a movable part and the chuck pins 26 as index parts.
  • the positional relationship between the nozzle 30 and each chuck pin 26 is the same. is there. Therefore, one of the cleaning processing units 1 belonging to the two opposing towers is one of the candidates for the reference cleaning processing unit 1, and one of the remaining cleaning processing units 1 is the cleaning processing unit 1 to be set.
  • the cleaning processing unit 1 to be set and the reference cleaning processing unit 1 have the same or bilaterally symmetrical positions of the nozzle 30 as the movable part and the chuck pins 26 as the index part.
  • the positions of the nozzles 30 and the respective chuck pins 26 have the same relationship between the respective cleaning processing units 1 belonging to two towers that face each other obliquely in the drawing. Therefore, one of the cleaning processing units 1 belonging to the two opposing towers is one of the candidates for the reference cleaning processing unit 1, and one of the remaining cleaning processing units 1 is the cleaning processing unit 1 to be set.
  • the positions of the nozzles 30 and the chuck pins 26 are symmetrical between two towers adjacent in the vertical direction or the horizontal direction on the paper surface. Of the two adjacent towers, setting the cleaning processing unit 1 belonging to one tower as a reference and setting the cleaning processing unit 1 belonging to the other tower as a setting object is not prevented. In this case, the position of the nozzle 30 and the position of the chuck pin 26 in each captured image can be apparently matched by inverting the reference captured image (reference image) or the captured image (target image) to be set. . Of course, it is not essential to invert either side of the captured image, and the position information of each chuck pin 26 in the case of inverting left and right. In addition, the position information of the determination region DR may be obtained by calculation.
  • control unit 9 specifies the position of each chuck pin 26 which is an index portion (second index portion) in the target image obtained in step S13 (FIG. 6: step S15). More specifically, the image processing unit 91 detects each chuck pin 26 in the target image by pattern matching processing. Then, the image processing section 91 specifies the detected center of gravity of each chuck pin 26 as the position of each index section.
  • step S15 the positions ((b 1 x, b 1 y), (b 2 x, b 2 y)) of the three chuck pins 26, which are index portions, in the target image 82. , (B 3 x, b 3 y)) are specified.
  • the positions of the three chuck pins 26 in the target image 82 are shifted from the positions of the three chuck pins 26 in the reference image 80. This is mainly because the visual field position of the camera 70 to be set is shifted from the reference visual field position.
  • control unit 9 calculates the positional difference between the index units (each chuck pin 26) (FIG. 6: step S16).
  • the difference calculation unit 92 determines the position of each index unit (three chuck pins 26) in the reference image specified in step S12 and the position of each index unit (three chuck pins) in the setting image specified in step S15. From the position of the pin 26), a positional difference between the chuck pins 26 is calculated.
  • FIG. 9 is a diagram conceptually showing a process of calculating the positional difference between the index portions.
  • the difference calculation unit 92 calculates the average value of the difference (amount of difference) between the coordinates of each index unit in the target image 82 and the coordinates of each index unit in the reference image 80 as the positional difference of the index units.
  • the positional difference Cx in the horizontal direction is obtained by Expression (1)
  • the positional difference Cy in the vertical direction is obtained by Expression (2).
  • the control unit 9 when calculating the positional difference between the index units, sets the determination area DR in the target image 82 (Step S17). Specifically, the determination area setting unit 932 applies to the target image 82 the parameter (reference determination area information 962) indicating the position and size of the reference determination area SDR set in the reference image 80 in step S13. Then, the position is corrected according to the positional difference between the index portions, and the determination region DR is set.
  • FIG. 10 is a diagram showing the determination region DR set in the target image 82.
  • the determination area setting unit 932 first applies a determination area DR having the same parameters as the reference determination area SDR set in the reference image 80. Thereby, a provisional determination area DR is prepared at the position indicated by the broken line (the same position as the reference determination area SDR). Subsequently, the determination area setting unit 932 corrects the position of the temporary determination area DR by the positional difference (Cx, Cy), and sets the determination area DR to the target image 82 as shown by the solid line. I do.
  • the tip of the nozzle 30 disposed at the processing position TP1 is disposed substantially at the center of the determination region DR. That is, the position and shape of the nozzle 30 in the determination region DR of the target image 82 are made closer to the position and shape of the nozzle 30 in the reference determination region SDR of the reference image 80.
  • control unit 9 has completed the setting of the determination region DR for all the cleaning processing units 1 to be set by appropriately referring to management data for managing the cleaning processing unit 1 to be set. It is determined whether or not (FIG. 6: step S18).
  • step S18 the control unit 9 ends the setting processing of the determination region DR, which is preparation in advance. If there is an unset cleaning processing unit 1 (No in step S18), the control unit 9 returns to step S14 and performs the setting processing of the determination region DR for the unset cleaning processing unit 1.
  • FIG. 11 is a flowchart illustrating a procedure of the substrate processing. Each operation shown in FIG. 11 is performed under the control of the control unit 9 unless otherwise specified.
  • the main transport robot 103 carries the substrate W to be processed into the specific cleaning processing unit 1 (step S21).
  • the loaded substrate W is held by the spin chuck 20 in a horizontal posture.
  • the processing cup 40 performs an elevating operation so as to reach a predetermined height position.
  • Step S22 After the spin chuck 20 holds the substrate W, the nozzle 30 moves from the standby position to the processing position TP1 (Step S22).
  • the movement of the nozzle 30 is performed by the control unit 9 controlling the nozzle base 33 according to a preset recipe (which describes a processing procedure and conditions of the substrate W).
  • the camera 70 photographs the inside of the chamber 10 (Step S23).
  • a captured image of the nozzle 30 that has moved to the processing position TP1 is obtained.
  • the camera 70 may continuously capture an image of the image capturing area PA.
  • the continuous imaging means that the imaging area PA is continuously imaged at a constant interval, for example, it is preferable to perform the continuous imaging at an interval of 33 milliseconds.
  • the imaging may be started at an appropriate timing such as when the nozzle 30 starts moving from the standby position toward the processing position TP1.
  • the control unit 9 detects the position of the nozzle 30 (Step S24). More specifically, the position detection unit 93 detects the position of the nozzle 30 in the determination region DR set by the advance preparation shown in FIG. 6 among the captured images obtained in step S23.
  • detecting the position of the nozzle 30 means calculating the position of the nozzle 30 in the processing space, calculating the amount of deviation from the reference position, or deviating from the reference position or the like. And the like based on a threshold value.
  • step S24 the position detection unit 93 determines the reference determination area image 960 (the image in the reference determination area SDR in the reference image 80) and the determination area set in advance preparation in the captured image obtained in step S23.
  • a matching score (matching degree) with the image in the DR is calculated.
  • the position detection unit 93 compares the matching coordinates with the image in the determination area DR with the case of the reference image, and if there is a difference equal to or larger than the predetermined threshold, determines that the position abnormality of the nozzle 30 has occurred. .
  • the determination result is output from a predetermined output unit.
  • the control unit 9 may stop the substrate processing in the cleaning processing unit 1 in which the abnormality has occurred.
  • the substrate W is cleaned by discharging the processing liquid toward the substrate W by the nozzle 30 (step S25).
  • the control unit 9 may perform other processing (for example, processing for discharging the processing liquid from the nozzles 60 and 65, spin dry processing, and the like) according to the recipe.
  • step S25 the spin chuck 20 releases the holding of the substrate W. Further, the processing cup 40 is lowered to a predetermined height position so that the substrate W can be unloaded from the spin base 21. Then, the main transport robot 103 unloads the processed substrate W from the cleaning processing unit 1 (Step S26).
  • the determination region DR is set in the target image 82 based on the position of the nozzle 30 in the reference image 80. Therefore, the determination region DR in the target image 82 can be set quickly. In this case, even if the number of processing units 1 to be set increases, it can be easily handled.
  • the position of the nozzle 30 in the target image 82 can be predicted from the position of the nozzle 30 in the reference image 80 and the positional difference between the reference chamber 10 and the setting target chamber 10. Therefore, the determination region DR for detecting the position of the nozzle 30 can be set to an appropriate position.
  • the determination region DR When the determination region DR is set in the target image 82, the reference determination region SDR set according to the position of the nozzle 30 in the reference image 80 is applied, and the position is corrected according to the positional difference between the index portions. You. Thus, the determination area can be set quickly and at an appropriate position in the second image.
  • the difference calculation unit 92 calculates the average value of the amount of parallel movement of each chuck pin 26 as the positional difference between the images 80 and 82 in the index portion.
  • the difference calculation unit 92 may calculate the enlargement ratio or the rotation amount as the positional difference between the index units. That is, the difference calculation unit 92 may calculate the enlargement ratio and the rotation amount between the images 80 and 82 from the positions of the chuck pins 26 in the images 80 and 82.
  • the determination area setting unit 932 may set the determination area DR in the target image 82 by correcting the reference determination area information 962 according to the enlargement ratio and the rotation amount calculated by the difference calculation unit 92.
  • the movable portion is the nozzle 30 for supplying the processing liquid
  • the present invention is also effective when a brush or the like is used as the movable portion to be detected.
  • FIG. 12 is a diagram showing a substrate processing system 1000 according to the second embodiment.
  • the substrate processing system 1000 includes a plurality of substrate processing apparatuses 100A and 100B and an information processing unit 104.
  • Each of the substrate processing apparatuses 100A and 100B includes, similarly to the substrate processing apparatus 100, an indexer 102, a main transfer robot 103, and a plurality of cleaning processing units 1.
  • the information processing unit 104 is connected to control units (not shown) of the plurality of substrate processing apparatuses 100A and 100B via a communication line or the like so that data communication is possible.
  • the information processing unit 104 sets the determination region DR for each of the cleaning units 1. For this reason, the information processing unit 104 includes an image processing unit 91, a difference calculation unit 92, and a position detection unit 93 as a configuration for setting the determination region DR.
  • one of the plurality of cleaning processing units 1 included in the substrate processing apparatus 100A is set as a reference cleaning processing unit 1, and a reference image 80 (see FIG. 7) is acquired in the cleaning processing unit 1. You. Then, the remaining cleaning processing units 1 of the substrate processing apparatus 100A and the plurality of cleaning processing units 1 provided in the substrate processing apparatus 100B are set as the cleaning processing units 1 to be set. (See FIG. 8) is obtained.
  • the procedure for setting the determination area DR for each cleaning processing unit 1 is the same as the procedure described in the first embodiment, except that the information processing unit 104 performs instead of the control unit 9.
  • the cleaning processing unit 1 of another substrate processing apparatus 100B is based on the cleaning processing unit 1 of one substrate processing apparatus 100A among the plurality of substrate processing apparatuses 100A and 100B.
  • the determination region DR can be set appropriately. Also in this mode, the position of the determination region DR is corrected and set according to the positional difference between the index portions. For this reason, in each of the cleaning units 1, the position of the nozzle 30, which is a movable portion, can be detected with high accuracy.
  • the information processing unit 104 is connected to two substrate processing apparatuses 100A and 100B, but may be connected to three or more substrate processing apparatuses. Then, based on one cleaning processing unit 1 in a specific substrate processing apparatus, a determination region DR may be set for each cleaning processing unit 1 provided in each of the other substrate processing apparatuses.
  • Substrate processing system 100, 100A, 100B Substrate processing apparatus 1 Cleaning processing unit 9 Control unit 10 Chamber 20 Spin chuck 21 Spin base 22 Spin motor 24 Rotation axis 26 Chuck pin (index unit) 30, 60, 65 Nozzle 31 Discharge head 32 Nozzle arm 33 Nozzle base 70 Camera 71 Illumination unit 80 Reference image 82 Target image 91 Image processing unit 92 Difference calculation unit 93 Position detection unit 932 Judgment area setting unit 96 Storage unit 960 Reference judgment Region image 962 reference determination region information 97 display unit 98 input unit 104 information processing unit DR determination region SDR reference determination region PA imaging region TP1 processing position W board

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