WO2020034656A1 - 热量冷却器 - Google Patents

热量冷却器 Download PDF

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Publication number
WO2020034656A1
WO2020034656A1 PCT/CN2019/083472 CN2019083472W WO2020034656A1 WO 2020034656 A1 WO2020034656 A1 WO 2020034656A1 CN 2019083472 W CN2019083472 W CN 2019083472W WO 2020034656 A1 WO2020034656 A1 WO 2020034656A1
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WIPO (PCT)
Prior art keywords
heat
vacuum chamber
capillary
lower member
cooler according
Prior art date
Application number
PCT/CN2019/083472
Other languages
English (en)
French (fr)
Inventor
郭铁男
郭铁龙
徐广林
谭勇刚
Original Assignee
深圳市嘉姆特通信电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市嘉姆特通信电子有限公司 filed Critical 深圳市嘉姆特通信电子有限公司
Priority to US16/632,821 priority Critical patent/US20210227719A1/en
Publication of WO2020034656A1 publication Critical patent/WO2020034656A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the present invention relates to a heat cooler.
  • the cooler is provided with a vacuum cavity between a lower member and an upper member that are attached to each other, which not only makes the capillary line easy to form, but also can be directly used as the lower member.
  • the materials in the electronic equipment make the heat cooler not as an additional component, but as an integral part with the electronic equipment, which can minimize the occupied space, and realize the lightness, thinness and shortness according to the simple structure, thereby ensuring that This maximizes productivity and heat dissipation.
  • a heat pipe is an electronic component that transfers heat from a heating part to a heat dissipation part through evaporation and condensation of a medium (working oil), so as to be able to dissipate heat in an electronic device.
  • the heat transfer tube is a working oil such as alcohol or ethanol placed in a reduced pressure (vacuum state), and if one side is heated, the liquid becomes steam and flows to the other side (under vacuum In the state, the temperature required for phase transition is low. That is, the phase transition temperature from liquid to gas is low.) On the other side, after the steam dissipates to become a liquid, the liquid is reduced back to one side by the capillary phenomenon. structure.
  • FIG. 1a is a diagram showing a portable device including a heat pipe 120 in a prior art document (Republic of Korea Publication Patent No. 2015-0091873).
  • the portable device 100 includes: a circuit substrate 110 including at least one electronic component 110a; a heat pipe 120 configured on the electronic component 110a to dissipate heat generated from the electronic component 110a; and a heat dissipating material that enables The circuit substrate 110 and the heat pipe 120 are adhered to each other.
  • the electronic component 110a may be an AP (Application Processor), a CPU (Central Processing Unit), or a PMIC (Power Management IC). Such an electronic component 110a is a main heat source that generates heat in a portable device. Therefore, the heat pipe 120 should be disposed on the electronic component 110a, and the heat generated in the electronic component 110a can be dissipated to other places.
  • AP Application Processor
  • CPU Central Processing Unit
  • PMIC Power Management IC
  • FIG. 1b is a diagram illustrating an example in which a heat pipe is arranged on a circuit board in a prior art document.
  • the heat pipe 120 includes: an evaporator (310), which is disposed on the electronic component 110a and absorbs heat generated from the circuit substrate 110; and a connection portion 320, which is formed in a side area of the circuit substrate 110 and directs the absorbed heat to the The electronic components 110a are transferred in the opposite direction; and a condenser (330), which releases the transferred heat.
  • an evaporator 310
  • a connection portion 320 which is formed in a side area of the circuit substrate 110 and directs the absorbed heat to the
  • the electronic components 110a are transferred in the opposite direction
  • a condenser (330) which releases the transferred heat.
  • the evaporation section 310 absorbs heat generated in the electronic component 110a, and changes the heat into a gas.
  • the heat changed into a gas moves along the connecting portion 320 to the condensing portion 330.
  • the condensing unit 220 releases the absorbed heat while condensing the heat changed into a gas into a liquid.
  • the released heat moves again along the connection portion 320 to the evaporation portion 310.
  • the heat pipe 120 can dissipate the heat generated in the circuit substrate 110 a to a portable device other than the circuit substrate 110.
  • Fig. 1c is a diagram illustrating a heat pipe of the prior art document.
  • the portable device a is a cross-sectional view of the portable device of FIG. 1b cut along "X2".
  • a portion cut along X2 is a portion forming the connection portion 320 of the heat pipe 120.
  • the heat conducting tube 120 may be composed of a steam cavity 410, a drainage core (Wick; 420), and a heat conducting member 430.
  • a vapor cavity 410 may phase change the heat absorbed from the circuit substrate 450 to form a gas.
  • the heat changed into a gas moves along the steam chamber 410 and is transmitted to the condensation unit 330.
  • the drainage core 420 surrounds the steam cavity 410, and can transform the heat released from the condensation part 330 into a liquid.
  • the heat changed into a liquid is re-transmitted to the evaporation part 310 along the drainage core 420.
  • the thermally conductive member 430 is formed to surround the drainage core 420.
  • the heat conducting member 430 may be made of aluminum (Al), copper (Cu), silver (Ag), titanium (Ti), chromium (Cr), gold (Au), carbon (C), nickel (Ni), iron (Fe), An alloy of at least one or more of platinum (Pt), graphite (Graphite), and boron nitride (BN).
  • the heat pipe 120 is used to absorb the heat of the electronic component 11a and dissipate heat at the battery, and the heat pipe 120 is too thick.
  • the method of inserting the heat pipe 120 from the form in which the electronic component 110a is directly connected to the battery 130 requires not only additional space, but also the insertion process is cumbersome.
  • the drainage core 420 is placed in the steam chamber 410 and then pressed, a defect is often caused.
  • the heat pipe 120 cannot be bent or bent freely, and there is a problem that it is difficult to install the heat pipe 120 in an electronic device.
  • FIG. 2 is a sectional view showing a step of manufacturing a general heat pipe P for an electronic device.
  • the general heat pipe for electronic equipment is designed to insert a mesh (Mesh; M) into a pipe P made of copper, and the working oil R is added in a vacuum state to perform flattening.
  • the heat pipe It is arranged beside the circuit board, and dissipates heat according to the vaporization and condensation phase change of the working oil R.
  • the present invention provides the following solutions.
  • the invention provides a heat cooler, including:
  • a vacuum chamber provided between the lower member and the upper member and functioning as a condensing section, a moving section, and a gasification section;
  • a capillary line provided in the vacuum chamber
  • a working oil is filled in the vacuum chamber, the working oil moves along the moving part after being vaporized in the gasification part due to high temperature, and the working oil is liquefied in the condensation part due to low temperature, Return to the moving part and the gasification part along the capillary line, and the cooler realizes heat dissipation through the phase change of the working oil in the circulation.
  • the vacuum chamber is provided on the lower member, or is provided on the lower member and the upper member.
  • the condensing part is formed wider and deeper than the moving part and the gasification part.
  • the capillary line is formed on a bottom surface of the vacuum chamber provided on the lower member.
  • the capillary lines are formed on both sides of the vacuum cavity, and a channel is provided between the capillary lines.
  • the capillary line is formed in the center of the vacuum cavity, and channels are respectively provided on both sides of the capillary line.
  • the lower member and the upper member are planar regions
  • the vacuum chamber is a linear pipeline in the planar regions.
  • the vacuum chamber of the linear pipeline is a plurality of linear pipelines with the condensing portion as the center and communicating with each other in the planar region.
  • the lower member is provided with a mounting groove along the periphery of the vacuum chamber, and the upper member is mounted and attached to the mounting groove.
  • the lower member is provided with a plurality of guide protrusions protruding along the periphery of the vacuum chamber, and the upper member is provided with a guide hole that coincides with the guide protrusion.
  • the capillary wire is a sheet having a capillary, the capillary wire is interposed between the lower member and the upper member and is inserted into the vacuum chamber.
  • the lower member further includes a plurality of heat radiation pins for heat radiation.
  • the present invention has the effect that a vacuum chamber is provided between the lower and upper members which are attached to each other, which not only makes the capillary line easy to form, but also can directly use the materials in the electronic device as the lower member.
  • the heat cooler is not used as an additional component, but as an integral part of the integration with electronic equipment. It can minimize the occupied space and reduce the thickness, thickness, and thickness according to a simple structure, thereby ensuring maximum productivity and heat dissipation. effect.
  • the coagulation part of the present invention is formed relatively wider and deeper than the moving part and the gasification part, so that the effect of preventing the fluid from drying out can be ensured while ensuring efficient circulation of the working oil.
  • the present invention has the effect of forming a capillary line on the bottom surface of the vacuum chamber provided on the lower member, which can maximize the diffusion phenomenon of the working oil.
  • capillary lines are formed on both sides of the vacuum chamber, and channels are formed between the capillary lines, so that when the working oil is sufficient, the effect can be quickly circulated through the capillary line and the central channel.
  • a capillary line is formed in the center of the vacuum chamber, and channels are respectively provided on both sides of the capillary line, so that when the working oil is sufficient, the capillary line and the channels on both sides can quickly circulate.
  • the vacuum cavity of the linear pipeline in the present invention is a plurality of linear pipelines centered on the condensing portion and connected to each other in the planar region, so that the effect of maximizing heat dissipation can be ensured.
  • the upper member of the present invention is placed and attached to the receiving groove of the lower member, and has the effects of being able to contribute to firm fixing and minimizing the overall thickness.
  • the present invention has the effect that simple assembly and strong assembly of the lower member and the upper member with each other can be ensured by the guide protrusion and the guide hole.
  • the capillary wire of the present invention is provided for a sheet having a capillary tube and is interposed between the lower member and the upper member, and has a thinner and more diverse capillary wire that can be formed in advance on the sheet while ensuring convenient assembly work. effect.
  • the present invention further includes a plurality of heat radiation pins for heat radiation on the lower member, which has the effect of maximizing heat radiation.
  • Figure 1a is a diagram showing a portable device including a heat pipe in the prior art document
  • FIG. 1b is a diagram illustrating an example in which a heat pipe is disposed on a circuit substrate in a related art document
  • Figure 1c is a diagram illustrating a heat pipe of the prior art document
  • FIG. 2 is a cross-sectional view showing a process of manufacturing a general heat pipe for an electronic device
  • FIG. 3 is an exploded perspective view showing a heat cooler of the present invention.
  • FIG. 4a and 4b are sectional views showing a heat cooler according to an embodiment of the present invention.
  • 5a and 5b are cross-sectional views respectively showing a capillary line applied to a heat cooler according to an embodiment of the present invention
  • FIG. 6a and 6b are perspective views respectively showing a vacuum cavity applied to a heat cooler according to an embodiment of the present invention
  • FIG. 7a to 7c are an exploded perspective view or a cutaway perspective view of a main part showing a heat cooler according to an embodiment of the present invention
  • FIG. 8a is a perspective view and an exploded perspective view showing a circuit substrate and a protective cover in an electronic device to which the heat cooler of the present invention is applied;
  • 8b is an exploded perspective view showing a frame of a mobile phone to which the heat cooler of the present invention is applied;
  • 9a and 9b are exploded perspective views showing a frame of an LED lamp to which the heat cooler of the present invention is applied.
  • H lower side H1: heat sink pin
  • circuit board 200 mobile phone frame
  • FIGS. 4a and 4b are cross-sectional views showing the heat cooler according to the embodiment of the present invention.
  • the heat cooler of the present invention includes: a lower member H and an upper member S attached to each other; and a vacuum chamber C, which is provided between the lower member H and the upper member S so that Capable of condensing section C1, moving section C2, and gasification section C3; capillary line M, which is provided in vacuum chamber C; working oil R, which is filled in vacuum chamber C, and working oil R in gasification section C3 due to high temperature. After gasification, it moves along the moving part C2. After the working oil R is liquefied in the condensation part C1 due to low temperature, it returns to the moving part C2 and the gasification part C3 along the capillary line M. The cooler passes the working oil R in the above cycle. Phase change to achieve heat dissipation.
  • the working oil R in the vacuum chamber C is based on various components such as a circuit board 100, an IC chip, a CPU, and an LED in an electronic device such as a mobile phone, tablet computer, home appliance, or LED lamp that comes into contact with or close to the gasification unit C3.
  • the high heat generated is vaporized (the vacuum chamber C is in a vacuum state, so the vaporization temperature of the working oil R becomes lower, that is, the gasification can be started from about 30 ° C to 50 ° C, the heat radiation temperature can be reduced, and the electronic device can be actively realized.
  • the condensing portion C1 in the low-temperature state passes through the moving portion C2 to liquefy.
  • the invention realizes heat dissipation through the above-mentioned phase change process, so that the heat in the electronic equipment can be actively cooled, and the working oil R is repeatedly gasified along the capillary line M from the gasification part C3 to the moving part C2 and the condensation part C1. And condensation cycles to achieve continuous heat dissipation.
  • a vacuum chamber C is provided between the lower member H and the upper member S that are attached to each other, which not only makes the capillary line M easy to form, but also can directly use the materials in the electronic device (from metal, FCCL) as the lower member H.
  • FCCL Metal, FCCL
  • the heat cooler is not an additional component, but as an integral part with electronic equipment, which can minimize the occupied space
  • the thinner, lighter, shorter size is achieved with a simple structure, which maximizes productivity and heat dissipation.
  • the vacuum chamber C can be equipped with the lower member H, and the simple attachment means J (adhesive or double-sided tape) of the upper member S can be used to complete the attachment.
  • the lower member H and the upper member S are provided by being bonded to each other.
  • the condensing part C1 of the vacuum chamber C applied to the heat cooler of the present invention is formed relatively wider and deeper than the moving part C2 and the gasification part C3, which ensures the high efficiency of the working oil R. At the same time, it also prevents the fluid R from drying out.
  • 5a and 5b are cross-sectional views respectively showing a capillary line M applied to a heat cooler according to an embodiment of the present invention.
  • a capillary line M is formed on the bottom surface of the vacuum chamber C provided to the lower member H, so that the diffusion phenomenon of the working oil R is maximized.
  • capillary lines M are formed on both sides of the vacuum chamber C, and a channel U is provided between the capillary lines M.
  • the working oil R is sufficient, it can be quickly circulated through the capillary line M and the middle passage U.
  • a capillary line M is formed in the center of the vacuum chamber C, and channels U are provided on both sides of the capillary line M, respectively.
  • the working oil R can quickly circulate through the capillary line M and the channels U on both sides.
  • FIG. 6a and 6b are perspective views respectively showing a vacuum chamber C applied to a heat cooler according to an embodiment of the present invention.
  • the lower member H and the upper member S are composed of a planar region, and the vacuum chamber C is formed by a linear pipeline in the planar region, which can ensure the circulation of the working oil R, as shown in FIGS. 6a and 6b.
  • the vacuum cavity of the linear pipeline is a plurality of linear pipelines centered on the condensing portion and connected to each other in the planar region, which can ensure the maximum heat dissipation.
  • FIG. 7a to 7c are exploded perspective views or cutaway perspective views of a main part of a heat cooler according to an embodiment of the present invention.
  • the lower member H includes a mounting groove H2 provided along the periphery of the vacuum chamber C, and the upper member S is mounted and attached to the mounting groove H2. That is, the upper member S is placed and attached to the receiving groove H2 of the lower member H, so that the upper member S can be firmly fixed, and the overall thickness can be minimized.
  • the lower member H includes a guide protrusion H3 protruding along the periphery of the vacuum chamber C
  • the upper member S includes a guide hole S1 that coincides with the guide protrusion H3 to ensure the lower member H and the upper member S. Simple and robust assembly with each other.
  • the capillary line M is a sheet M1 having a capillary tube, and the capillary line M is interposed between the lower member H and the upper member S, so that it is simply inserted into the vacuum chamber C. Therefore, while ensuring the convenience of assembling work, a thinner and more diverse capillary line M can be formed in advance on the sheet M1.
  • the lower member H further includes a plurality of heat-dissipating pins H1 for heat dissipation, which contributes to maximizing heat dissipation.
  • Fig. 8a is a perspective view and an exploded perspective view showing a circuit board 100 and a protective cover in an electronic device to which the heat cooler of the present invention is applied.
  • Fig. 8b is an exploded perspective view showing a frame 200 of a mobile phone to which the heat cooler of the present invention is applied.
  • 9a and 9b are exploded perspective views showing an LED lamp frame 300 to which the thermal cooler of the present invention is applied.
  • the lower side member H and the upper side member S of the present invention have a basic configuration.
  • a heat shield can be completed by using a shield 10 (Shield) 10 that is protected after loading various circuit components such as a mobile phone and the like.
  • the frame 200 of the mobile phone can be used as the lower member H to complete the heat cooler.
  • the heat sink can be completed by using the LED lamp frame 300 as the lower member H.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种热量冷却器，包括相互附着的下侧构件和上侧构件以及介于下侧构件及上侧构件之间的真空腔，真空腔内填充有工作油，工作油根据外部温度的高低在真空腔内进行相变循环。本发明实现了占有空间的最小化及根据简单构成来实现轻薄短小化，进而保障生产率和散热的最大化。

Description

热量冷却器 技术领域
本发明涉及一种热量冷却器，更详细而言，该冷却器在相互附着的下侧构件及上侧构件之间配备有真空腔，不仅使得毛细管线容易形成，而且作为下侧构件可以直接利用电子设备内的材料，使热量冷却器不作为另外添加的部件，而是作为与电子设备一体化的构成部分，能够实现占有空间的最小化，而且根据简单的构成来实现轻薄短小化，进而保障了生产率和散热的最大化。
背景技术
一般而言，导热管(Heat Pipe)是通过介质(工作油)的蒸发和凝聚，将热量从加热部传递到散热部，以便能够对电子设备内的热量进行散热的电子部件。
具体而言，导热管是在减压(Reduced Pressure；真空状态)的内部置入诸如酒精或乙醇等的工作油后，如果将一侧加热，则液体成为蒸汽并向另一侧流动(在真空状态下，相变所需的温度较低。即从液体到气体的相变温度低的特性)，在另一侧，蒸汽散热而成为液体后，液体借助于毛细现象而重新还原到一侧的结构。
图1a是显示现有技术文献(大韩民国公布专利第2015-0091873号)的包括导热管120的便携装置的图。
参考图1a，便携装置100包括：电路基板110，其包括至少一个电子部件110a；导热管120，其配置于电子部件110a上，对从电子部件110a发生的热进行散热；及散热材料，其使电路基板110与导热管120相互粘合。
电子部件110a可以为AP(Application Processor，应用处理器)、CPU(Central Processing Unit，中央处理器)、PMIC(Power Management IC，电源管理集成电路)。这种电子部件110a是在便携装置中发生热的主发热源。因此，导热管120应配置于电子部件110a上，可以将电子部件110a中发生的热散热到别处。
图1b是图示现有技术文献的在电路基板配置导热管的一个示例的图。
导热管120包括：蒸发部(Evaporator；310)，其配置于电子部件110a上，吸收从电路基板110发生的热；连接部320，其在电路基板110的侧面区域形成，将吸收的热向与电子部件110a相向的方向传递；及凝聚部(Condenser；330)，其释放所传递的热。
蒸发部310吸收电子部件110a中发生的热，使热变化成气体。变化成气体的热沿着连接部320移动到凝聚部330。凝聚部220在将变化成气体的热凝聚成液体的同时，释放所吸收的热。释放的热重新沿着连接部320移动到蒸发部310。
因此，导热管120可以将电路基板110a中发生的热，分散到电路基板110之外的便携装置内。
图1c是图示现有技术文献的导热管的图。
参照图1c，便携装置a是将图1b的便携装置沿“X2”切开的剖面图。沿X2切开的部分是形成导热管120的连接部320的部分。导热管120可以由蒸汽腔410、引流芯(Wick；420)、导热构件430构成。
参考图1c，蒸汽腔410(Vapor Cavity)可以使从电路基板450吸收的热发生相变而形成为气体。变化成气体的热沿着蒸汽腔410移动，传递到凝聚部330。引流芯420环绕蒸汽腔410，可以使从凝聚部330释放的热发生相变而变换成液体。变化为液体的热沿着引流芯420重新传递到蒸发部310。导热构件430包围引流芯420而形成。导热构件430可以以铝(Al)、铜(Cu)、银(Ag)、钛(Ti)、铬(Cr)、金(Au)、碳(C)、镍(Ni)、铁(Fe)、铂(Pt)、石墨(Graphite)及氮化硼(BN)中至少一者或两者以上的合金构成。
可是，利用导热管120来吸收电子部件11a的热并在电池处进行散热，导热管120厚度又过大。当考虑到便携装置的宽度时，从电子部件110a直接连接到电池130的形态插入导热管120的方式，不仅需要另外的空间，而且该插入工序也麻烦。进而在蒸汽腔410内放入引流芯420后进行按压时，往往导致不良。而且导热管120无法自由弯曲或折弯，有着很难设置在电子设备内的问 题。
图2是显示制作通常的电子设备用导热管P的工序的剖面图。
通常的电子设备用导热管设计成在由铜构成的管P内插入网(Mesh；M)，在真空处理的状态下加入工作油R后进行压平，如现有技术文献所示，导热管配置于电路基板的旁边，根据工作油R的气化及凝聚的相变来进行散热。
可是，这种用于电子设备的常规导热管存在着，当在铜质管P内插入网(Mesh；M)后，在真空处理的状态下加入工作油R后进行压平时，发生大量不良的问题。
发明内容
鉴于现有技术存在的不足，本发明提供了以下方案。
本发明提供了一种热量冷却器，包括：
相互附着的下侧构件及上侧构件；
真空腔，其配备于所述下侧构件及上侧构件之间并发挥凝聚部、移动部及气化部的功能；
毛细管线，其配备于所述真空腔内；
工作油，其填充于所述真空腔内，所述工作油因高温在所述气化部气化后，沿着所述移动部移动，所述工作油因低温在所述凝聚部液化后，沿所述毛细管线重新回到所述移动部及气化部，所述冷却器通过上述循环中的所述工作油的相变来实现散热。
可选地，所述真空腔配备于所述下侧构件，或配备于所述下侧构件和所述上侧构件。
可选地，所述凝聚部与所述移动部和气化部相比，更宽、更深地形成。
可选地，所述毛细管线形成在配备于所述下侧构件的所述真空腔的底面。
可选地，所述毛细管线形成在所述真空腔的两侧，所述毛细管线之间设有通道。
可选地，所述毛细管线形成在所述真空腔的中心，所述毛细管线的两侧分别设有通道。
可选地，所述下侧构件及上侧构件为面状区域，所述真空腔在所述面状区域内为线形管线。
可选地，线形管线的所述真空腔在所述面状区域内为，以所述凝聚部为中心并相互连通的多个线形管线。
可选地，所述下侧构件沿所述真空腔周边具备安放槽，所述上侧构件安放并附着于所述安放槽。
可选地，所述下侧构件具备沿所述真空腔周边凸出的多个引导凸起，所述上侧构件具备与所述引导凸起吻合的引导孔。
可选地，所述毛细管线为具有毛细管的薄片，所述毛细管线介于所述下侧构件及上侧构件之间并插入于所述真空腔内。
可选地，所述下侧构件还具备用于散热的多个散热针。
通过上述技术特征，本发明具有的效果是，在相互附着的下侧构件及上侧构件之间配备有真空腔，不仅使得毛细管线容易形成，而且作为下侧构件可以直接利用电子设备内的材料，使热量冷却器不作为另外添加的部件，而是作为与电子设备一体化的构成部分，能够实现占有空间的最小化及根据简单构成来实现轻薄短小化，进而保障生产率和散热的最大化的效果。
进一步地，本发明的凝聚部比移动部及气化部相对更宽、更深地形成，使得能够在保障工作油的高效循环的同时，防止工作油的流体干涸(Dry)现象的效果。
进一步地，本发明在配备于下侧构件的真空腔的底面形成毛细管线，具有能够使工作油的扩散现象实现最大化的效果。
进一步地，本发明在在真空腔的两侧形成了毛细管线，并在毛细管线之间形成了通道，使得工作油充分时，可以通过毛细管线及中央的通道而迅速循环的效果。
进一步地，本发明在真空腔的中心形成了毛细管线，并在毛细管线的两侧分别设置通道，使得工作油充分时，可以通过毛细管线及两侧的通道而迅速循环的效果。
进一步地，本发明的线形管线的真空腔在面状区域内为，以凝聚部为中心的并相互连通的多个线形管线，使得能够保障散热的最大化的效果。
进一步地，本发明的上侧构件安放并附着于下侧构件的安放槽内，具有可以有助于坚固地固定以及整体厚度最小化的效果。
进一步地，本发明具有可以借助于引导凸起及引导孔而保障下侧构件及上侧构件相互间的简单组装及坚固组装的效果。
进一步地，本发明的毛细管线为具有毛细管的薄片配备并介于下侧构件及上侧构件之间，具有可以在保障组装作业便利的同时，在薄片上预先形成更纤细、多样的毛细管线的效果。
进一步地，本发明在下侧构件还具备用于散热的多个散热针，具有以求散热最大化的效果。
附图说明
图1a是显示现有技术文献的包括导热管的便携装置的图；
图1b是图示现有技术文献的在电路基板配置导热管的一个示例的图；
图1c是图示现有技术文献的导热管的图；
图2是显示制作通常的电子设备用导热管的工序的剖面图；
图3是显示本发明的热量冷却器的分解立体图；
图4a及图4b是显示本发明实施例的热量冷却器的剖面图；
图5a及图5b是分别显示本发明实施例的热量冷却器中应用的毛细管线的剖面图；
图6a及图6b是分别显示本发明实施例的热量冷却器中应用的真空腔的立体图；
图7a至图7c是显示本发明实施例的热量冷却器的分解立体图或主要部分切开立体图；
图8a是显示应用本发明的热量冷却器的电子设备内的电路基板及防护罩的立体图及分解立体图；
图8b是显示应用本发明的热量冷却器的手机的框架的分解立体图；
图9a及图9b是显示应用本发明的热量冷却器的LED灯具框架的分解立体图。
以下为附图标记说明。
H：下侧构件         H1：散热针
H2：安放槽          H3：引导凸起
S：上侧构件         S1：引导孔
J：粘合手段         C：真空腔
C1：凝聚部          C2：移动部
C3：气化部          M：毛细管线
M1：薄片            R：工作油
U：通道             10：防护罩
100：电路基板       200：手机的框架
300：LED灯具框架
具体实施方式
参照附图，说明本发明的热量冷却器的优选实施例，其实施例可以存在多个，通过这些实施例，可以更好地理解本发明的目的、特征及优点。
图3是显示本发明的热量冷却器的分解立体图，图4a及图4b是显示本发明实施例的热量冷却器的剖面图。
本发明的热量冷却器如图3至图4b所示，包括：相互附着的下侧构件H及上侧构件S；真空腔C，其配备于下侧构件H及上侧构件S之间，使得发挥凝聚部C1、移动部C2及气化部C3的功能；毛细管线M，其配备于真空腔C内；工作油R，其填充于真空腔C内，工作油R因高温在气化部C3气化后，沿着移动部C2移动，工作油R因低温在凝聚部C1液化后，沿毛细管线M重新回到移动部C2及气化部C3，冷却器通过上述循环中的工作油R的相变来实现散热。
真空腔C内的工作油R根据与气化部C3碰到或接近的手机或平板电脑、家电制品或LED灯等电子设备内的诸如电路基板100、IC芯片、CPU、LED等各种部件所发生的高热进行气化(真空腔C为真空状态，因而工作油R的气化温度变得较低，即可以使得从大致30 50℃开始气化，降低散热温度，积极地实现电子设备内的散热)后，经移动部C2在低热状态的凝聚部C1进行液化。本发明通过上述相变过程来实现散热，使得可以积极冷却电子设备内的热量，而且通过工作油R从气化部C3开始沿毛细管线M，到达移动部C2及凝聚部C1的反复的气化和凝聚循环来实现持续的散热。
特别是在相互附着的下侧构件H及上侧构件S之间配备有真空腔C，不仅使得毛细管线M容易形成，而且作为下侧构件H可以直接利用电子设备内的材料(由金属、FCCL(Flexible Copper Clad Laminate，柔性覆铜板)、散热塑料等构成的材料)，使热量冷却器不作为另外添加的部件，而是作为与电子设备一体化的构成部分，能够实现占有空间的最小化，而且根据简单的构成来实现轻薄短小化，进而保障了生产率和散热的最大化。
根据本发明，真空腔C如图4a所示，可以配备于下侧构件H，利用上侧 构件S的简单粘合手段J(粘合剂或双面胶带等)来完成附着，当然可以如图4b及后述图7b所示，配备于下侧构件H及上侧构件S，通过相互间的粘合来完成。
另一方面，本发明的热量冷却器中应用的真空腔C的凝聚部C1如图3所示，比移动部C2及气化部C3相对更宽、更深地形成，在保障工作油R的高效的循环的同时，还防止工作油R的流体干涸(Dry)现象。
图5a及图5b是分别显示本发明实施例的热量冷却器中应用的毛细管线M的剖面图。
工作油R在气化部C3气化后，在凝聚部C1液化时，使得工作油R可以沿着毛细管线M重新扩散并回流到气化部C3。在本发明中，在配备于下侧构件H的真空腔C的底面形成了毛细管线M，使得工作油R的扩散现象实现最大化。
如图5a所示，在真空腔C的两侧形成了毛细管线M，且在毛细管线M之间设置了通道U。当工作油R充分时，可以通过毛细管线M及中间的通道U迅速地循环。
如图5b所示，在真空腔C的中心形成了毛细管线M，且在毛细管线M的两侧分别设置了通道U。当工作油R充分时，工作油R可以通过毛细管线M及两侧的通道U迅速地循环。
图6a及图6b是分别显示本发明实施例的热量冷却器中应用的真空腔C的立体图。
根据本发明，下侧构件H及上侧构件S由面状区域构成，真空腔C在面状区域内以线形管线形成，可以保障工作油R的循环，进而，如图6a及图6b所示，线形管线的真空腔在面状区域内为，以凝聚部为中心的并相互连通的多个线形管线，可以保障散热的最大化。
图7a至图7c是显示本发明实施例的热量冷却器的分解立体图或主要部分切开立体图。
根据本发明的实施例，如图7a所示，下侧构件H包括沿真空腔C周边配备的安放槽H2，上侧构件S安放并附着于安放槽H2。即上侧构件S安放并附着于下侧构件H的安放槽H2内，可以使上侧构件S坚固地固定，且能够实现整体厚度的最小化。
如图7b所示，下侧构件H包括沿真空腔C周边凸设的引导凸起H3，上侧构件S包括与引导凸起H3吻合的引导孔S1，保障下侧构件H及上侧构件S相互间的简单坚固的组装。
如图7c所示，毛细管线M为具有有毛细管的薄片M1，毛细管线M介于下侧构件H及上侧构件S之间，使得简单地插入于真空腔C内。从而保障组装作业便利的同时，可以在薄片M1预先形成更纤细、多样的毛细管线M。
另一方面，根据本发明的实施例，下侧构件H如图6b所示，还具备用于散热的多个散热针H1，有助于散热的最大化。
图8a是显示应用本发明的热量冷却器的电子设备内的电路基板100及防护罩的立体图及分解立体图。图8b是显示应用本发明的热量冷却器的手机的框架200的分解立体图。图9a及图9b是显示应用本发明的热量冷却器的LED灯具框架300的分解立体图。
本发明以下侧构件H及上侧构件S为基本构成而构成。如图8a所示，可以将装载诸如手机等各种电路部件后进行保护的防护罩(Shield Can)10作为下侧构件H来完成热量冷却器。如图8b所示，可以将手机的框架200作为下侧构件H来完成热量冷却器。如图9a及图9b所示，可以将LED灯具框架300作为下侧构件H来完成热量冷却器。

Claims (12)

  1. 一种热量冷却器，其中，包括：
    相互附着的下侧构件及上侧构件；
    真空腔，其配备于所述下侧构件及上侧构件之间并发挥凝聚部、移动部及气化部的功能；
    毛细管线，其配备于所述真空腔内；
    工作油，其填充于所述真空腔内，所述工作油因高温在所述气化部气化后，沿着所述移动部移动，所述工作油因低温在所述凝聚部液化后，沿所述毛细管线重新回到所述移动部及气化部，所述冷却器通过上述循环中的所述工作油的相变来实现散热。
  2. 根据权利要求1所述的热量冷却器，其中，所述真空腔配备于所述下侧构件，或配备于所述下侧构件和所述上侧构件。
  3. 根据权利要求2所述的热量冷却器，其中，所述凝聚部与所述移动部和气化部相比，更宽、更深地形成。
  4. 根据权利要求2所述的热量冷却器，其中，所述毛细管线形成在配备于所述下侧构件的所述真空腔的底面。
  5. 根据权利要求4所述的热量冷却器，其中，所述毛细管线形成在所述真空腔的两侧，所述毛细管线之间设有通道。
  6. 根据权利要求4所述的热量冷却器，其中，所述毛细管线形成在所述真空腔的中心，所述毛细管线的两侧分别设有通道。
  7. 根据权利要求1所述的热量冷却器，其中，所述下侧构件及上侧构件为面状区域，所述真空腔在所述面状区域内为线形管线。
  8. 根据权利要求7所述的热量冷却器，其中，线形管线的所述真空腔在所述面状区域内为，以所述凝聚部为中心并相互连通的多个线形管线。
  9. 根据权利要求2所述的热量冷却器，其中，所述下侧构件沿所述真空腔周边具备安放槽，所述上侧构件安放并附着于所述安放槽。
  10. 根据权利要求2所述的热量冷却器，其中，所述下侧构件具备沿所述真空腔周边凸出的多个引导凸起，所述上侧构件具备与所述引导凸起吻合的引导孔。
  11. 根据权利要求1所述的热量冷却器，其中，所述毛细管线为具有毛细管的薄片，所述毛细管线介于所述下侧构件及上侧构件之间并插入于所述真空腔内。
  12. 根据权利要求1所述的热量冷却器，其中，所述下侧构件还具备用于散热的多个散热针。
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