WO2020022345A1 - Dispositif de montage de composants électroniques - Google Patents

Dispositif de montage de composants électroniques Download PDF

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Publication number
WO2020022345A1
WO2020022345A1 PCT/JP2019/028891 JP2019028891W WO2020022345A1 WO 2020022345 A1 WO2020022345 A1 WO 2020022345A1 JP 2019028891 W JP2019028891 W JP 2019028891W WO 2020022345 A1 WO2020022345 A1 WO 2020022345A1
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WO
WIPO (PCT)
Prior art keywords
mounting
electronic component
heads
positions
pickup
Prior art date
Application number
PCT/JP2019/028891
Other languages
English (en)
Japanese (ja)
Inventor
秀博 田澤
晶義 久保
正人 辻
Original Assignee
株式会社新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to KR1020207030915A priority Critical patent/KR102432998B1/ko
Priority to CN201980044544.9A priority patent/CN112368811A/zh
Priority to JP2020532417A priority patent/JP6981700B2/ja
Priority to SG11202013223TA priority patent/SG11202013223TA/en
Publication of WO2020022345A1 publication Critical patent/WO2020022345A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Definitions

  • the present invention relates to a structure of an electronic component mounting device.
  • a pick-up unit that picks up a semiconductor die from a wafer and places it on an intermediate stage as a mounting device that mounts electronic components on a substrate, and picks up a semiconductor die from above the intermediate stage and transfers it to the substrate, And a bonding unit having a bonding portion for bonding to the semiconductor device.
  • the mounting device described in Patent Document 1 requires a large installation space because the two mounting heads are arranged side by side in the direction perpendicular to the support arm. Further, since the pick-up and the bonding are performed alternately, the vibration due to the operation of the other mounting head during the bonding of one mounting head may interfere with the mounting accuracy. This effect is more remarkable than when the mounting head is moved at a high speed to reduce the mounting time.
  • an object of the present invention is to reduce the installation space and improve the mounting accuracy in an electronic component mounting apparatus having a plurality of mounting heads.
  • An electronic component mounting apparatus is an electronic component mounting apparatus for mounting an electronic component on a substrate or another electronic component.
  • the electronic component mounting apparatus is arranged in a predetermined direction with a linear guide extending in a predetermined direction.
  • a plurality of mounting heads that are moved in a predetermined direction, and a control unit that adjusts the position of the mounting head in a predetermined direction, comprising a control unit that simultaneously starts each mounting head in the same direction, In addition, each mounting head is simultaneously stopped.
  • the mounting heads By arranging the mounting heads in a predetermined direction in this manner, the installation space can be reduced. Also, by starting and stopping a plurality of mounting heads at the same time, it is possible to suppress the interference of vibration due to the operation of each mounting head, and it is possible to improve the mounting quality.
  • each mounting head is provided with a mounting nozzle for picking up and mounting an electronic component, and a mounting position where the mounting nozzle picks up the electronic component, and a mounting nozzle for mounting the electronic component mounting the electronic component.
  • the control unit starts the respective mounting heads simultaneously from the respective pickup positions or the respective mounting positions in the same direction, and controls the respective mounting heads respectively. May be simultaneously reached and stopped at the same time.
  • the control unit simultaneously starts each mounting head from the pickup position or the mounting position in the same direction, reaches the mounting position or the pickup position at the same time, and stops the mounting heads at the same time, the other mounting heads may be stopped during the pick-up operation or the mounting operation of one mounting head. It can be suppressed that the vibration caused by the movement of the mounting head interferes with the mounting accuracy.
  • the electronic component mounting apparatus of the present invention includes a plurality of mounting stages for holding a substrate on which an electronic component is mounted or a substrate on which another electronic component is mounted, and a predetermined position between each pickup position and each mounting stage. May be equal.
  • the distance between the pickup position and the mounting position can be made equal, and the mounting quality can be improved by simultaneously starting and stopping a plurality of mounting heads.
  • the board is mounted with a plurality of electronic components in a predetermined direction, and the control unit is configured such that respective distances between the respective pickup positions and the respective mounting positions are equal.
  • a plurality of electronic components may be mounted by moving each mounting head.
  • the distance between the pickup position and the mounting position can be made equal, so that the plurality of mounting heads can be started and stopped simultaneously.
  • the mounting quality can be improved.
  • the moving speed of the shorter mounting head is changed by the moving speed of the longer mounting head. It may be lower than the moving speed.
  • the installation space can be reduced and the mounting accuracy can be improved.
  • FIG. 2 is a plan view showing a picking operation of a semiconductor die by a pickup head of the bonding apparatus shown in FIG. 1.
  • FIG. 2 is a plan view showing a movement operation of an intermediate stage of the bonding apparatus shown in FIG. 1.
  • FIG. 2 is a plan view showing movement of a mounting head of the bonding apparatus shown in FIG. 1 to a pickup position.
  • FIG. 2 is a plan view showing movement of a mounting head of the bonding apparatus shown in FIG. 1 to a mounting position.
  • FIG. 2 is a plan view showing movement of a mounting head to an initial position and movement of an intermediate stage to a first position after a semiconductor die is mounted on a substrate by the bonding apparatus shown in FIG. 1.
  • FIG. 2 is a graph showing a time change of the speed of each mounting head when each distance between each pickup position and each mounting position is equal in the bonding apparatus shown in FIG. 1.
  • 2 is a graph showing a time change of a position in a Y direction of each mounting head when each distance between each pickup position and each mounting position is equal in the bonding apparatus shown in FIG. 1.
  • FIG. 2 is a plan view showing movement of a mounting head to a mounting position when the distance between each pickup position and each mounting position is different in the bonding apparatus shown in FIG. 1.
  • FIG. 10 is a plan view showing movement of the mounting head to an initial position after mounting the semiconductor die on the substrate after movement of the mounting head shown in FIG. 9 and movement of the intermediate stage to a first position.
  • FIG. 10 is a graph showing a time change of the speed of each mounting head when the mounting head shown in FIG. 9 is moved. 10 is a graph showing a time change of a position in the Y direction of each mounting head when the mounting head shown in FIG. 9 is moved. It is a top view showing the composition of the bonding device of other embodiments.
  • FIG. 14 is a plan view showing movement of the mounting head of the bonding apparatus shown in FIG. 13 to a pickup position.
  • FIG. 14 is a plan view showing movement of the mounting head of the bonding apparatus shown in FIG. 13 to a mounting position.
  • the bonding device 100 which is the electronic component mounting device of the embodiment will be described with reference to the drawings.
  • the bonding apparatus 100 mounts a semiconductor die 16 as an electronic component on the substrate 15 or another semiconductor die 16.
  • the bonding apparatus 100 includes a base 10, a common linear guide 20 attached to the base 10 and extending in a Y direction which is a predetermined direction, and moved in the Y direction by being guided by the linear guide 20.
  • the control unit 50 includes a plurality of mounting heads 21a and 21b and a control unit 50 that adjusts the positions of the two mounting heads 21a and 21b in the Y direction.
  • two sets of transfer rails 11a and 11b for transferring the substrate 15 in the X direction and two mounting stages 12a and 12b are attached to the base 10 of the bonding apparatus 100.
  • the bonding apparatus 100 includes a guide frame 32 attached to the base 10 and extending in the X direction, a pickup head 33 guided by the guide frame 32 and moving in the X direction, and an attachment head attached to the base 10 and extending in the Y direction.
  • the apparatus includes a guide rail 30, an intermediate stage 31 that is guided by the guide rail 30 and moves in the Y direction, and a wafer holder (not shown) that holds a wafer 35.
  • the positions of the centers of the two mounting stages 12a and 12b in the Y direction are 12c and 12d, respectively, and the distance between the centers of the mounting stages 12a and 12b in the Y direction is W1.
  • the distance between the two mounting tables 17 in the Y direction is W1, which is the same as the distance between the mounting stages 12a and 12b in the Y direction.
  • the intermediate stage 31 moves in the Y direction between a first position indicated by a solid line in FIG. 1 and a second position indicated by a dashed line.
  • the Y-direction positions of the two mounting tables 17 become the pickup positions 13a and 13b.
  • the interval between the two mounting tables 17 in the Y direction is the same W1 as the interval between the mounting stages 12a and 12b in the Y direction. Therefore, the distance between each of the pickup positions 13a and 13b and each of the mounting stages 12a and 12b.
  • the distances .DELTA.Yc and .DELTA.Yd in the respective Y directions between the Y-direction positions 12c and 12d at the respective centers are equal.
  • the positions in the Y direction where the semiconductor die 16 is mounted are the mounting positions 14a and 14b.
  • the distance in the Y direction between the mounting positions 14a and 14b is W1, similarly to the distance in the Y direction between the two mounting tables 17.
  • the distances ⁇ Ya and ⁇ Yb in the respective Y directions between the pickup positions 13a and 13b and the mounting positions 14a and 14b are equal.
  • the mounting heads 21a and 21b are mounted side by side in the Y direction on one side of the linear guide 20, and move in the Y direction while being guided by the linear guide 20.
  • Mounting nozzles 22a and 22b for picking up and mounting the semiconductor die 16 are attached to each of the mounting heads 21a and 21b.
  • Each mounting head 21a, 21b has a pickup position 13a, 13b where the mounting nozzles 22a, 22b come directly above the mounting table 17 and picks up the semiconductor die 16, and a mounting position 14a where the mounting nozzles 22a, 22b mount the semiconductor die 16. , 14b in the Y direction.
  • the pickup head 33 is provided with a pickup nozzle 34 for picking up the semiconductor die 16 from the wafer 35 and placing it on the mounting table 17 of the intermediate stage 31.
  • a drive unit such as a linear motor is attached to each of the mounting heads 21a and 21b, the pickup head 33, and the intermediate stage 31, and each drive unit operates according to a command from the control unit 50.
  • the control unit 50 is configured by a computer including a CPU and a storage unit inside.
  • FIG. 1 a case will be described in which the semiconductor die 16 is mounted on the end of the substrate 15 on the minus side in the Y direction.
  • the control unit 50 moves each of the mounting heads 21a and 21b to the initial position, and moves the intermediate stage 31 to the first position on the minus side in the Y direction. Then, the control unit 50 moves the pickup head 33 in the X direction, picks up the semiconductor die 16 from the wafer 35 by the pickup nozzle 34, and places each of the semiconductor dies 16 on the two mounting tables 17 of the intermediate stage 31. The semiconductor dies 16 are placed on the two mounting tables 17 of the intermediate stage 31 at an interval of a distance W1 in the Y direction.
  • the control unit 50 moves the intermediate stage 31 to the Y direction plus side to the second position, as shown in FIG.
  • the Y-direction positions of the semiconductor dies 16 placed on the mounting tables 17 are the pickup positions 13a and 13b, respectively.
  • the control unit 50 moves the mounting heads 21a and 21b on the minus side in the Y direction so that the centers of the mounting nozzles 22a and 22b of the mounting heads 21a and 21b are at the pickup positions 13a and 13b. Move. At this time, the control unit 50 simultaneously starts the mounting heads 21a and 21b from the initial position toward the minus side in the Y direction, and simultaneously causes the centers of the mounting nozzles 22a and 22b to reach the pickup positions 13a and 13b. The movement of each of the mounting heads 21a and 21b toward the minus side in the Y direction is stopped.
  • the control unit 50 picks up the semiconductor die 16 from the intermediate stage 31 by adsorbing the semiconductor die 16 to the tip of each of the mounting nozzles 22 a and 22 b of each of the mounting heads 21 a and 21 b.
  • the mounting heads 21a and 21b are moved from the pickup positions 13a and 13b to the mounting positions 14a and 14b, as shown in FIG.
  • the control unit 50 simultaneously starts the mounting heads 21a and 21b toward the plus side in the Y direction, and simultaneously causes the centers of the mounting nozzles 22a and 22b to reach the mounting positions 14a and 14b. The movement of 21a, 21b to the plus side in the Y direction is stopped.
  • the control unit 50 sets the broken line a and the solid line shown in FIG. b, the mounting heads 21a and 21b are started at the same time at the time t0, accelerated to the same speed with the same acceleration until the time t1, moved in the Y direction at the same speed until the time t2, and reduced at the same time until the time t3.
  • the speed is reduced to zero speed, and stops at the same time at time t3.
  • a broken line a and a solid line b indicate a temporal change in the speed of each of the mounting heads 21a and 21b
  • a broken line c and a solid line d indicate a temporal change in the Y-direction position of each of the mounting heads 21a and 21b.
  • the control unit 50 lowers the mounting nozzles 22a and 22b, and moves the mounting nozzles 22a and 22b.
  • the semiconductor die 16 adsorbed on the tip of the substrate 22b is mounted on each substrate 15.
  • control unit 50 moves each mounting head 21a, 21b to the initial position, moves the intermediate stage to the first position, The pickup mounting operation of the next semiconductor die 16 is continued.
  • the control unit 50 controls each of the pickup positions 13a and 13b and each of the mounting positions 14a and 14b so that each distance is equal.
  • the plurality of semiconductor dies 16 are mounted by moving the mounting heads 21a and 21b. For example, as shown in FIG. 1, after mounting the semiconductor die 16 on the minus side end of each substrate 15 in the Y direction, the semiconductor die 16 is then shifted from the initial mounting position to the plus side in the Y direction by ⁇ Y1.
  • the mounting heads 21a, 21b can be started at the same time, reach the mounting positions 14a, 14b at the same time, and simultaneously stop the mounting heads 21a, 21b.
  • the mounting heads 21a and 21b are arranged on one side of the linear guide 20 in the Y direction, the mounting heads 21a and 21b of the linear guide 20 are arranged.
  • the space on the non-existing side can be used as a space for disposing other devices. For this reason, the installation space can be reduced.
  • the control unit 50 simultaneously starts the mounting heads 21a and 21b from the pickup positions 13a and 13b in the same direction, simultaneously reaches the mounting positions 14a and 14b, and stops the mounting heads at the same time. During the operation or the mounting operation, it is possible to suppress the influence of the vibration caused by the movement of the other mounting head 21b from affecting the mounting accuracy, thereby improving the mounting accuracy.
  • the semiconductor die 16 is attached to the Y direction minus side end of the substrate 15 on the Y direction minus side (front side) and the Y direction plus side end of the substrate 15 on the Y direction plus side (rear side).
  • the distance W2 between the mounting position 14b on the near side and the mounting position 14a1 on the back side is larger than the distance W1 between the pickup position 13b on the near side and the pickup position 13a on the back side.
  • the distance ⁇ Ya1 between the pickup position 13a on the back side and the mounting position 14a1 on the back side is larger than the distance ⁇ Yb between the pickup position 13b on the near side and the mounting position 14b on the near side.
  • the control unit 50 starts the mounting heads 21a and 21b simultaneously by making the moving speed of the mounting head 21b having the shorter moving distance slower than the moving speed of the mounting head 21a having the longer moving distance.
  • the mounting nozzles 22a and 22b of the mounting heads 21a and 21b are caused to reach the mounting positions 14a1 and 14b, respectively, and the movements of the mounting heads 21a and 21b in the Y direction are simultaneously stopped.
  • the control unit 50 controls the speeds of the mounting heads 21a and 21b as shown in FIG.
  • the dashed line e and the solid line b show the time change of the speed of each of the mounting heads 21a and 21b.
  • the dashed line f and the solid line d show the time change of the mounting heads 21a and 21b in the Y direction position. Is shown.
  • the control unit 50 simultaneously starts the mounting heads 21a and 21b at the time t0 as indicated by a dashed line e and a solid line b shown in FIG. Since the mounting head 21b on the near side has a short moving distance, it stops accelerating at time t11 and moves at a constant speed in the Y direction at a lower speed than the mounting head 21a on the far side. On the other hand, the mounting head 21a on the far side continues to accelerate until time t1, and moves at a constant speed from time t1, as described above. Then, the mounting head 21a on the far side starts decelerating from time t2, reaches the mounting position 14a1 at time t3, and reaches zero speed at time t3. The mounting head 21b on the front side continues to move at a constant speed until time t12, starts decelerating from time t12, reaches the mounting position 14a1 at time t3, and reaches zero speed at time t3.
  • the control unit 50 After stopping the movement of the mounting heads 21a and 21b in the Y direction at the time t3, the control unit 50 removes the semiconductor die 16 from which the mounting nozzles 22a and 22b of the mounting heads 21a and 21b have been sucked to the substrate 15 respectively. Implement on top. Then, when the mounting of each semiconductor die 16 on each substrate 15 is completed, as shown in FIG. 10, the control unit 50 moves each mounting head 21a, 21b to the initial position, and moves the intermediate stage 31 to the first position. Then, the pickup mounting operation of the next semiconductor die 16 is continued.
  • the bonding apparatus 100 of the embodiment when the distances ⁇ Ya1 and ⁇ Yb between the pickup positions 13a and 13b and the mounting positions 14a1 and 14b are different, the movement of the mounting head 21b having the shorter moving distance is shifted.
  • the speed is set lower than the moving speed of the mounting head 21a having the longer distance.
  • two linear guides 20 are arranged in parallel in the Y direction, and two mounting heads 21a, 21b and 21c, 21d of each linear guide 20 are attached. Things.
  • Each of the mounting heads 21a, 21b and 21c, 21d is disposed so as to face between the two linear guides 20. Therefore, the space on the side of the linear guide 20 where the mounting heads 21a and 21b are not disposed and the side where the mounting heads 21c and 21d are not disposed can be used as a space for other equipment. The installation space can be further reduced compared to arranging two units.
  • the bonding apparatus 200 is provided with two guide rails 30 and two intermediate stages 31 guided by each guide rail 30. Further, two pickup heads 33 are attached to the guide frame 32 extending in the X direction.
  • the controller 50 moves the two pickup heads 33 in the X direction and places a total of four semiconductor dies 16 from the two wafers 35 on the mounting tables 17 of the intermediate stage 31, respectively.
  • the control unit 50 sets the center of each of the mounting nozzles 22a, 22b, 22c, and 22d of each of the mounting heads 21a, 21b, 21c, and 21d as shown in FIG. , 13b, the mounting heads 21a, 21b, 21c, 21d are moved to the minus side in the Y direction.
  • the control unit 50 simultaneously starts the mounting heads 21a, 21b, 21c, and 21d from the initial position toward the minus side in the Y direction, and simultaneously centers the mounting nozzles 22a, 22b, 22c, and 22d at the pickup position 13a. , 13b, and at the same time, stops the mounting heads 21a, 21b, 21c, 21d from moving in the negative Y direction. Then, the semiconductor die 16 is sucked to the tip of each of the mounting nozzles 22a, 22b, 22c, 22d of each of the mounting heads 21a, 21b, 21c, 21d.
  • the controller 50 moves the mounting heads 21a, 21b, 21c, 21d from the pickup positions 13a, 13b to the mounting positions 14a, 14b, as described above with reference to FIG. At this time, the control unit 50 simultaneously starts the mounting heads 21a, 21b, 21c, 21d toward the plus side in the Y direction, and simultaneously centers the mounting nozzles 22a, 22b, 22c, 22d at the mounting positions 14a, 14b. At the same time, the movement of each mounting head 21a, 21b, 21c, 21d to the positive side in the Y direction is stopped.
  • the control unit 50 lowers the mounting nozzles 22a and 22b, and moves the mounting nozzles 22a and 22b.
  • the semiconductor die 16 adsorbed on the tip of the substrate 22b is mounted on each substrate 15.
  • the bonding apparatus 200 of the present embodiment can further reduce the installation space compared to the bonding apparatus 100 in addition to the operation and effect of the bonding apparatus 100, and can use four mounting heads 21a, 21b, 21c, and 21d to provide four semiconductors. Since the dies 16 can be mounted at the same time, the mounting speed can be further increased.
  • each pickup head 33 pick up the semiconductor dies 16 from the two wafers 35 and place the semiconductor dies 16 on the mounting tables 17 of the intermediate stage 31.
  • each pickup head 33 may pick up the semiconductor die 16 from one wafer 35 and place it on each mounting table 17 of each intermediate stage 31.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un dispositif de liaison (100) pour monter une puce semi-conductrice (16) sur un substrat (15) comprenant : un guide linéaire commun (20) s'étendant dans la direction Y ; une pluralité de têtes de montage (21a, 21b) qui sont disposées dans la direction Y et qui sont déplacées dans la direction Y tout en étant guidées par le guide linéaire (20) ; et une unité de commande (50) qui ajuste la position des têtes de montage (21a, 21b) dans la direction Y. L'unité de commande (50) amène les têtes de montage (21a, 21b) à être déplacées dans la même direction simultanément, et amène les têtes de montage (21a, 21b) à être arrêtées simultanément.
PCT/JP2019/028891 2018-07-24 2019-07-23 Dispositif de montage de composants électroniques WO2020022345A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020207030915A KR102432998B1 (ko) 2018-07-24 2019-07-23 전자 부품 실장 장치
CN201980044544.9A CN112368811A (zh) 2018-07-24 2019-07-23 电子零件封装装置
JP2020532417A JP6981700B2 (ja) 2018-07-24 2019-07-23 電子部品実装装置
SG11202013223TA SG11202013223TA (en) 2018-07-24 2019-07-23 Electronic component mounting apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-138294 2018-07-24
JP2018138294 2018-07-24

Publications (1)

Publication Number Publication Date
WO2020022345A1 true WO2020022345A1 (fr) 2020-01-30

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Application Number Title Priority Date Filing Date
PCT/JP2019/028891 WO2020022345A1 (fr) 2018-07-24 2019-07-23 Dispositif de montage de composants électroniques

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JP (1) JP6981700B2 (fr)
KR (1) KR102432998B1 (fr)
CN (1) CN112368811A (fr)
SG (1) SG11202013223TA (fr)
TW (1) TWI712100B (fr)
WO (1) WO2020022345A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022190976A1 (fr) * 2021-03-12 2022-09-15 キヤノンマシナリー株式会社 Dispositif de collage et procédé de collage
WO2022190979A1 (fr) * 2021-03-12 2022-09-15 キヤノンマシナリー株式会社 Appareil de liaison et procédé de liaison

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JP2017216311A (ja) * 2016-05-31 2017-12-07 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法

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US6749100B2 (en) * 2001-11-28 2004-06-15 Asm Technology Singapore Pte Ltd. Multiple-head wire-bonding system
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KR20200138312A (ko) 2020-12-09
TW202008495A (zh) 2020-02-16

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