WO2019237726A1 - 一种骨传导扬声器及其测试方法 - Google Patents

一种骨传导扬声器及其测试方法 Download PDF

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Publication number
WO2019237726A1
WO2019237726A1 PCT/CN2019/070545 CN2019070545W WO2019237726A1 WO 2019237726 A1 WO2019237726 A1 WO 2019237726A1 CN 2019070545 W CN2019070545 W CN 2019070545W WO 2019237726 A1 WO2019237726 A1 WO 2019237726A1
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WO
WIPO (PCT)
Prior art keywords
vibration
housing
panel
bone conduction
casing
Prior art date
Application number
PCT/CN2019/070545
Other languages
English (en)
French (fr)
Inventor
郑金波
廖风云
张磊
齐心
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201980039998.7A priority Critical patent/CN112470491B/zh
Priority to BR112020025568-8A priority patent/BR112020025568A2/pt
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Priority to KR1020217001172A priority patent/KR102414292B1/ko
Priority to JP2020569946A priority patent/JP2021527365A/ja
Priority to CN202210376066.5A priority patent/CN114866930A/zh
Priority to AU2019285890A priority patent/AU2019285890B2/en
Priority to MX2020013708A priority patent/MX2020013708A/es
Priority to CN202210376069.9A priority patent/CN114866931A/zh
Priority to CN202210420776.3A priority patent/CN114786102A/zh
Priority to IL279393A priority patent/IL279393B2/en
Priority to NZ771861A priority patent/NZ771861A/en
Priority to CA3103582A priority patent/CA3103582C/en
Priority to EP19818634.8A priority patent/EP3793214A4/en
Priority to PE2020002031A priority patent/PE20210778A1/es
Priority to RU2021100591A priority patent/RU2754382C1/ru
Priority to CN202210376074.XA priority patent/CN114866932A/zh
Publication of WO2019237726A1 publication Critical patent/WO2019237726A1/zh
Priority to US16/922,965 priority patent/US11115751B2/en
Priority to CONC2021/0000022A priority patent/CO2021000022A2/es
Priority to US17/169,604 priority patent/US11363362B2/en
Priority to US17/170,813 priority patent/US11350207B2/en
Priority to US17/218,804 priority patent/US11463814B2/en
Priority to US17/335,154 priority patent/US11974091B2/en
Priority to US17/662,082 priority patent/US11641538B2/en
Priority to JP2022076638A priority patent/JP2022115989A/ja
Priority to US18/154,026 priority patent/US11825259B2/en
Priority to US18/432,103 priority patent/US20240179449A1/en
Priority to US18/621,209 priority patent/US20240244364A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H04R29/003—Monitoring arrangements; Testing arrangements for loudspeakers of the moving-coil type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/066—Loudspeakers using the principle of inertia
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/105—Manufacture of mono- or stereophonic headphone components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers

Definitions

  • the present application relates to the field of bone conduction earphones, and in particular, to a bone conduction speaker capable of improving sound quality and sound leakage problems and a test method thereof.
  • Bone conduction speakers can convert electrical signals into mechanical vibration signals, and transmit mechanical vibration signals to the human auditory nerve through human tissues and bones, so that the wearer can hear the sound. Because the bone conduction speaker transmits sound through mechanical vibration, when the bone conduction speaker works, it will drive the surrounding air to vibrate, causing a sound leakage problem.
  • the present application provides a bone conduction speaker with a simple structure and a small size, which can not only significantly reduce the leakage of bone conduction headphones, but also improve the sound quality of bone conduction headphones.
  • the purpose of the present invention is to provide a bone conduction speaker, which aims to simplify the structure of the bone conduction speaker, to achieve the purpose of reducing sound leakage and improving sound quality.
  • a bone conduction speaker includes: a magnetic circuit component for providing a magnetic field; a vibration component, at least a part of the vibration component is located in the magnetic field, and converts an electrical signal input to the vibration component into a mechanical vibration signal;
  • a body including a housing panel facing a human body side and a housing back opposite the housing panel, the housing containing the vibration component, the vibration component causing the housing panel and the housing rear to vibrate, the housing
  • the vibration of the panel has a first phase
  • the vibration of the back of the housing has a second phase, wherein when the frequency of the vibration of the housing panel and the vibration of the back of the housing is 2000 Hz to 3000 Hz, the first phase and the The absolute value of the difference between the two phases is less than 60 degrees.
  • the vibration of the casing panel has a first amplitude
  • the vibration of the back surface of the casing has a second amplitude
  • a ratio of the first amplitude to the second amplitude is in a range of 0.5 to 1.5.
  • the vibration of the shell panel generates a first leaky sound wave
  • the vibration of the back of the shell generates a second leaky sound wave
  • the first leaky sound wave and the second leaky sound wave are superimposed on each other, The superimposing reduces the amplitude of the first leaky sound wave.
  • the shell panel and the back of the shell are made of a material having a Young's modulus greater than 4000Mpa.
  • the difference between the area of the shell panel and the back of the shell does not exceed 30% of the area of the shell panel.
  • the bone conduction speaker further includes a first element, wherein the vibration component is connected to the housing through the first element, and the Young's modulus of the first element is greater than 4000Mpa .
  • the shell panel is connected to other parts of the shell by one or any combination of glue, snap, welding, or screw connection.
  • the housing panel and the housing back are made of a fiber reinforced plastic material.
  • the bone conduction speaker further includes a headphone fixing component for maintaining stable contact between the bone conduction speaker and a human body; and the headphone fixing component communicates with the bone through an elastic member.
  • the speakers are permanently connected.
  • the bone conduction speaker generates two low-frequency resonance peaks in a frequency range of less than 500 Hz.
  • the two low-frequency resonance peaks are related to elastic modulus of the vibration component and the earphone fixing component.
  • the two low-frequency resonance peaks generated in the frequency range less than 500 Hz correspond to the headset fixing component and the vibration component, respectively.
  • the bone conduction speaker generates at least two high-frequency resonance peaks in a frequency range greater than 2000 Hz.
  • the two high-frequency resonance peaks are related to the elastic modulus of the casing, the The volume, the stiffness of the shell panel and / or the stiffness of the back of the shell are related.
  • the vibration component includes a coil and a vibration transmitting plate; at least a part of the coil is located in the magnetic field and moves in the magnetic field under the driving of an electric signal.
  • one end of the vibration transmitting plate is in contact with the inner surface of the housing, and the other end of the vibration transmitting plate is in contact with the magnetic circuit assembly.
  • the bone conduction speaker further includes a first element, wherein the coil is connected to the housing through the first element, and the first element is made of a Young's modulus greater than 4000Mpa Made of materials.
  • the bone conduction speaker further includes a second element, wherein the magnetic circuit system is connected to the housing through the second element, and the elastic modulus of the first element is greater than the elastic element. Modulus of elasticity of the second element.
  • the second element is a vibration transmitting plate, and the vibration transmitting plate is an elastic member.
  • the vibration transmitting sheet has a three-dimensional structure, and can perform mechanical vibration in its own thickness space.
  • the magnetic circuit assembly includes a first magnetic element, a first magnetically permeable element, and a second magnetically permeable element; a lower surface of the first magnetically permeable element is connected to an upper surface of the first magnetic element The upper surface of the second magnetically conductive element is connected to the lower surface of the first magnetic element; the second magnetically conductive element has a groove, and the first magnetic element and the first magnetically conductive element are fixed at There is a magnetic gap between the groove and a side surface of the second magnetically permeable element.
  • the magnetic circuit assembly further includes a second magnetic element; the second magnetic element is disposed above the first magnetically permeable element, and the second magnetic element and the first magnetic element The magnetization direction is opposite.
  • the magnetic circuit assembly further includes a third magnetic element; the third magnetic element is disposed below the second magnetically permeable element, and the third magnetic element and the first magnetic element The magnetization direction is opposite.
  • a test method for a bone conduction speaker includes: sending a test signal to the bone conduction speaker, the bone conduction speaker includes a vibration component and a housing accommodating the vibration component, and the housing includes two sides respectively located on the vibration component The housing panel and the housing back plate, the vibration component causing the housing panel and the back of the housing to vibrate based on the test signal; obtaining a first vibration signal corresponding to the vibration of the housing panel; A second vibration signal corresponding to the back vibration; and determining a phase difference between the vibration of the case panel and the back vibration of the case based on the first vibration signal and the second vibration signal.
  • determining a phase difference between the vibration of the housing panel and the vibration of the back of the housing based on the first vibration signal and the second vibration signal includes: obtaining a waveform of the first vibration signal and A waveform of the second vibration signal; and determining the phase difference based on a waveform of the first vibration signal and a waveform of the second vibration signal.
  • determining a phase difference between the vibration of the casing panel and the vibration of the back of the casing based on the first vibration signal and the second vibration signal includes: based on the first vibration signal and the vibration A test signal determines a first phase of the first vibration signal; determines a second phase of the second vibration signal based on the second vibration signal and the test signal; and based on the first phase and the second phase The phase determines the phase difference.
  • the test signal is a sinusoidal periodic signal.
  • acquiring the first vibration signal corresponding to the vibration of the shell panel includes: transmitting a first laser light to an outer surface of the shell panel; and receiving the outer surface of the shell panel to reflect the first laser light. The generated first reflected laser light; the first vibration signal is determined based on the first reflected laser light.
  • obtaining a second vibration signal corresponding to the vibration of the back of the housing includes: transmitting a second laser light to an outer surface of the back of the housing; and receiving the outer surface of the back of the housing to reflect the second laser A generated second reflected laser light; and determining the second vibration signal based on the second reflected laser light.
  • a bone conduction speaker includes: a magnetic circuit component for providing a magnetic field; a vibration component, at least a part of the vibration component is located in the magnetic field, and converts an electrical signal input to the vibration component into a mechanical vibration signal; a shell The body accommodates the vibration component; and an earphone fixing component, the earphone fixing component is fixedly connected to the housing for maintaining contact between the bone conduction speaker and a human body, wherein the housing has The casing panel facing the human body and the casing back opposite the casing panel, and the casing side between the casing panel and the casing back, the vibration component causes the casing panel and the casing back to vibrate.
  • the back surface of the casing and the side surface of the casing are an integrally formed structure; the casing panel and the side of the casing are connected by one or any of glue, snap, welding, or screw connection. Combine to connect.
  • the shell panel and the side of the shell are an integrally formed structure; the back of the shell and the side of the shell are connected by one or any of glue, snap, welding, or screw connection. Combine to connect.
  • the bone conduction speaker further includes a first element, wherein the vibration component is connected to the housing through the first element.
  • the side of the shell and the first element are an integrally formed structure; the shell panel and the outer surface of the first element are connected by one of glue, snap, welding, or screw connection. Or any combination of any combination; the back of the casing and the side of the casing are connected by one or any combination of glue, snap, welding, or screw connection.
  • the earphone fixing component and the back of the casing or the side of the casing are an integrally formed structure.
  • the earphone fixing component is connected to the back of the casing or the side of the casing by one or any combination of glue, snap, welding or screw connection.
  • the housing is a pillar
  • the shell panel and the back of the shell are an upper end and a lower end of the pillar, respectively; and the shell panel and the back of the shell are on the pillar
  • the projected areas of the cross-section of the body perpendicular to the axis are equal.
  • the vibration of the housing panel has a first phase and the vibration of the back of the housing has a second phase; when the frequency of the vibration of the housing panel and the vibration of the back of the housing is 2000 Hz to 3000 Hz, The absolute value of the difference between the first phase and the second phase is less than 60 degrees.
  • the vibration of the casing panel and the vibration of the back of the casing include vibrations having a frequency within 2000 Hz to 3000 Hz.
  • the shell panel and the back of the shell are made of a material having a Young's modulus greater than 4000Mpa.
  • the bone conduction speaker further includes a first element, wherein the vibration component is connected to the housing through the first element, and the Young's modulus of the first element is greater than 4000Mpa .
  • FIG. 1 is a structural module diagram of a bone conduction headset according to some embodiments of the present application.
  • FIG. 2 is a schematic longitudinal sectional view of a bone conduction headset according to some embodiments of the present application.
  • FIG. 3 is a partial frequency response curve of a bone conduction headset according to some embodiments of the present application.
  • FIG. 4 is a partial frequency response curve of a bone-conduction earphone when a shell of the bone-conduction earphone according to some embodiments of the present application adopts materials with different Young's modulus;
  • FIG. 5 is a partial frequency response curve of a bone conduction earphone under different stiffnesses of a bone conduction earphone according to some embodiments of the present application;
  • FIG. 6 is a partial frequency response curve of a bone conduction earphone when the earphone fixing component of the bone conduction earphone has different stiffnesses according to some embodiments of the present application;
  • FIG. 7A is a schematic structural diagram of a shell of a bone conduction earphone according to some embodiments of the present application.
  • 7B is a schematic diagram showing a relationship between a frequency of generating a high-order mode and a volume of a shell and a Young's modulus of a material according to some embodiments of the present application;
  • FIG. 7C is a schematic diagram showing a relationship between a volume of a bone conduction speaker and a volume of a housing according to some embodiments of the present application;
  • FIG. 8 is a schematic diagram of reducing the sound leakage of the casing according to some embodiments of the present application.
  • FIG. 9 is a partial frequency response curve of a bone-conduction earphone when the weight of the shell of the bone-conduction earphone according to some embodiments of the present application is different; FIG.
  • FIG. 10A is a schematic structural diagram of a housing of a bone conduction earphone according to some embodiments of the present application.
  • FIG. 10B is a schematic structural diagram of a housing of a bone conduction earphone according to some embodiments of the present application.
  • FIG. 10C is a schematic structural diagram of a housing of a bone conduction earphone according to some embodiments of the present application.
  • FIG. 11 is a comparison diagram of a sound leakage effect between a conventional bone conduction earphone and a bone conduction earphone according to some embodiments of the present application;
  • FIG. 12 is a frequency response curve generated by a shell panel of a bone conduction earphone
  • FIG. 13 is a schematic structural diagram of a housing panel according to some embodiments of the present application.
  • FIG. 14A is a frequency response curve generated by the back of the casing of the bone conduction earphone
  • 14B is a frequency response curve generated by the side of the casing of the bone conduction earphone
  • 15 is a frequency response curve of a bone conduction earphone generated by a housing bracket of the bone conduction earphone;
  • 16A is a schematic structural diagram of a bone conduction earphone having a earphone fixing component according to some embodiments of the present application;
  • 16B is a schematic structural diagram of another bone conduction earphone having a earphone fixing component according to some embodiments of the present application.
  • FIG. 17 is a schematic structural diagram of a shell of a bone conduction earphone according to some embodiments of the present application.
  • 18A is a schematic structural diagram of a vibration transmitting sheet of a bone conduction earphone according to some embodiments of the present application.
  • 18B is a schematic structural diagram of a vibration transmitting sheet of another bone conduction earphone according to some embodiments of the present application.
  • FIG. 18C is a schematic structural diagram of a vibration transmitting sheet of another bone conduction earphone according to some embodiments of the present application.
  • 18D is a schematic structural diagram of a vibration transmitting sheet of another bone conduction earphone according to some embodiments of the present application.
  • FIG. 19 is a schematic structural diagram of a bone conduction earphone having a three-dimensional vibration transmitting sheet according to some embodiments of the present application.
  • 20A is a schematic structural diagram of a bone conduction headset according to some embodiments of the present application.
  • 20B is a schematic structural diagram of another bone conduction headset according to some embodiments of the present application.
  • 20C is a schematic structural diagram of another bone conduction headset according to some embodiments of the present application.
  • 20D is a schematic structural diagram of another bone conduction headset according to some embodiments of the present application.
  • FIG. 21 is a schematic structural diagram of a bone conduction earphone having an acoustic hole according to some embodiments of the present application.
  • 22A-22C are schematic structural diagrams of a bone conduction headset according to some embodiments of the present application.
  • 23A-23C are schematic structural diagrams of a bone conduction earphone with a earphone fixing component according to some embodiments of the present application.
  • FIG. 24 is an exemplary method for measuring vibration of a bone-conduction earphone casing according to some embodiments of the present application.
  • 26 is an exemplary method for measuring vibration of a bone-conduction earphone housing according to some embodiments of the present application.
  • FIG. 27 is an exemplary result measured in the manner shown in FIG. 26; FIG.
  • FIG. 28 is an exemplary method for measuring vibration of a bone-conduction earphone housing according to some embodiments of the present application.
  • FIG. 29 is an exemplary method for measuring vibration of a bone conduction earphone casing according to some embodiments of the present application.
  • bone conduction speakers or “bone conduction headphones” will be used.
  • This description is only a form of bone conduction application.
  • “speaker” or “headphone” can also be replaced with other similar words, such as “player”, “hearing aid”, and the like.
  • the various implementations of the present invention can be easily applied to other non-speaker-type hearing devices.
  • those skilled in the art after understanding the basic principles of bone conduction headphones, they may make various changes in the form and details of the specific methods and steps of implementing bone conduction headphones without departing from this principle.
  • Modifications and changes in particular, the addition of ambient sound pickup and processing functions to the bone conduction earphones, enabling the earphones to function as hearing aids.
  • a microphone such as a microphone can pick up the sound of the surroundings of the user / wearer, and transmit the sound processed (or the generated electrical signal) to the bone conduction speaker under a certain algorithm. That is, the bone conduction earphone can be modified to include the function of picking up ambient sound, and after certain signal processing, the sound is transmitted to the user / wearer through the bone conduction speaker part, thereby realizing the function of the bone conduction hearing aid.
  • the algorithm mentioned here can include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active noise reduction, directional processing, tinnitus processing, multi-channel wide dynamic range compression, and active howling One or more combinations of suppression, volume control, etc.
  • FIG. 1 is a structural block diagram of a bone conduction speaker 100 according to some embodiments of the present application.
  • the bone conduction speaker 100 may include a magnetic circuit component 102, a vibration component 104, a housing 106, and a connection component 108.
  • the magnetic circuit assembly 102 may provide a magnetic field.
  • the magnetic field can be used to convert a signal containing sound information into a vibration signal.
  • the sound information may include a video, an audio file having a specific data format, or data or a file that can be converted into sound through a specific route.
  • the signal containing sound information may come from a storage component of the bone conduction speaker 100 itself, or may be from an information generation, storage, or transmission system other than the bone conduction speaker 100.
  • the signal containing sound information may include a combination of one or more of an electrical signal, an optical signal, a magnetic signal, and a mechanical signal.
  • the signal containing sound information may come from one signal source or multiple signal sources. The multiple signal sources may or may not be related.
  • the bone conduction speaker 100 can acquire the signal containing sound information in a variety of different ways, and the signal acquisition can be wired or wireless, and can be real-time or delayed.
  • the bone conduction speaker 100 may receive an electric signal containing sound information in a wired or wireless manner, or may directly acquire data from a storage medium to generate a sound signal.
  • a bone conduction hearing aid may include a component with a sound collection function, which picks up sound in the environment, converts the mechanical vibration of the sound into an electrical signal, and obtains an electrical signal that meets specific requirements after processing by an amplifier.
  • the wired connection may include a metal cable, an optical cable, or a mixed metal and optical cable, for example, a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metallic sheathed cable, a metal sheath Cables, multi-core cables, twisted-pair cables, ribbon cables, shielded cables, telecommunication cables, double-stranded cables, parallel twin-core conductors, twisted-pair wires, etc.
  • the examples described above are only used for convenience of explanation.
  • the wired connection medium may also be other types, such as other electrical or optical signal transmission carriers.
  • Wireless connections may include radio communications, free-space optical communications, acoustic communications, and electromagnetic induction.
  • the radio communication can include IEEE802.11 series standards, IEEE802.15 series standards (such as Bluetooth technology and cellular technology, etc.), first generation mobile communication technology, second generation mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), general packet wireless service technology, third-generation mobile communication technologies (such as CDMA2000, WCDMA, TD-SCDMA, and WiMAX, etc.), fourth-generation mobile communication technologies (such as TD-LTE and FDD-LTE, etc.), satellites Communication (such as GPS technology), near field communication (NFC) and other technologies operating in the ISM band (such as 2.4GHz, etc.); free-space optical communications can include visible light, infrared signals, etc .; acoustic communications can include acoustic waves, ultrasonic signals, etc.
  • Electromagnetic induction can include near field communication technology.
  • the example described above is only for convenience of explanation.
  • the medium of wireless connection can also be other types, such as Z-wave technology, other charged civilian radio frequency bands and military radio frequency bands.
  • the bone conduction speaker 100 may acquire signals containing sound information from other devices through Bluetooth technology.
  • the vibration assembly 104 may generate mechanical vibration.
  • the generation of the vibration is accompanied by energy conversion.
  • the bone conduction speaker 100 can use the magnetic circuit component 102 and the vibration component 104 to convert a signal containing sound information into mechanical vibration.
  • the conversion process may involve the coexistence and conversion of many different types of energy.
  • an electrical signal can be directly converted into mechanical vibration through a transducing device to generate sound.
  • sound information may be contained in the optical signal, and a specific transducing device may implement a process of converting the optical signal into a vibration signal.
  • Other types of energy that can coexist and convert during the operation of the energy conversion device include thermal energy, magnetic field energy, and so on.
  • the energy conversion method of the energy conversion device may include a moving coil type, an electrostatic type, a piezoelectric type, a moving iron type, a pneumatic type, an electromagnetic type, and the like.
  • the frequency response range and sound quality of the bone conduction headset 100 are affected by the vibration component 104.
  • the vibration component 104 includes a wound cylindrical coil and a vibrating body (for example, a vibrating piece).
  • the cylindrical coil driven by a signal current drives the vibrating body to generate sound in a magnetic field.
  • the material of the vibrating body The expansion and contraction, the deformation, size, shape and fixing method of the folds, the magnetic density of the permanent magnets, etc. will all affect the sound quality of the bone conduction speaker 100.
  • the vibrating body in the vibrating component 104 may be a mirror-symmetrical structure, a center-symmetrical structure, or an asymmetrical structure; the vibrating body may be provided with an intermittent hole-like structure, which will cause the vibrating body to have a larger displacement under the same input energy , So that the bone conduction speaker can achieve higher sensitivity and improve the output power of vibration and sound; the vibrating body can be a torus or a torus-like structure, and a plurality of struts and struts radiating toward the center are arranged in the torus. The number can be two or more.
  • the vibration assembly 104 may include a coil, a vibration plate, a vibration transmitting plate, and the like.
  • the housing 106 can transmit mechanical vibration to the human body so that the human body can hear sound.
  • the housing 106 may constitute a closed or non-closed accommodating space, and the magnetic circuit component 102 and the vibration component 104 may be disposed inside the housing 106.
  • the housing 106 may include a housing panel.
  • the shell panel can be directly or indirectly connected to the vibration component 104, and the mechanical vibration of the vibration component 104 is transmitted to the auditory nerve through the bones, so that the human body can hear sound.
  • connection component 108 can support the magnetic circuit component 102, the vibration component 104, and / or the housing 106.
  • the connection assembly 108 may include one or more connections.
  • the one or more connectors may connect the housing 106 with one or more structures in the magnetic circuit assembly 102 and / or the vibration assembly 104.
  • the bone conduction speaker 100 may include one or more processors that may execute one or more sound signal processing algorithms.
  • the sound signal processing algorithm may modify or strengthen the sound signal.
  • the bone conduction speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, and the like. The sensor can collect user information or environmental information.
  • FIG. 2 is a schematic structural diagram of a bone conduction headset 200 according to some embodiments of the present application.
  • the bone conduction earphone 200 may include a magnetic circuit assembly 210, a coil 212, a vibration transmitting sheet 214, a connection member 216, and a housing 220.
  • the magnetic circuit assembly 210 may include a first magnetic element 202, a first magnetically permeable element 204, and a second magnetically permeable element 206.
  • the magnetic element described in this application refers to an element that can generate a magnetic field, such as a magnet or the like.
  • the magnetic element may have a magnetization direction, and the magnetization direction refers to a direction of a magnetic field inside the magnetic element.
  • the first magnetic element 202 may include one or more magnets.
  • the magnet may include a metal alloy magnet, ferrite, or the like.
  • the metal alloy magnet may include neodymium iron boron, samarium cobalt, aluminum nickel cobalt, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or a combination thereof.
  • the ferrite may include barium ferrite, ferrite, ferromanganese ferrite, lithium manganese ferrite, or the like, or a combination thereof.
  • the lower surface of the first magnetically conductive element 204 may be connected to the upper surface of the first magnetic element 202.
  • the second magnetically conductive element 206 may be a concave structure including a bottom wall and a side wall.
  • the first magnetic element 202 can be connected to the inner side of the bottom wall of the second magnetically conductive element 206, and the side wall can surround the first magnetic element 202 and form a magnetic gap with the first magnetic element 202.
  • the permeable magnet mentioned here can also be called a magnetic field concentrator or an iron core.
  • the magnetizer can adjust the distribution of a magnetic field (for example, a magnetic field generated by the first magnetic element 202).
  • the magnetizer may include an element processed from a soft magnetic material.
  • the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, and the like, such as iron, an iron-silicon-based alloy, an iron-aluminum-based alloy, a nickel-iron-based alloy, and iron-cobalt Series alloy, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc.
  • the magnetizer may be processed by one or more combinations of casting, plastic working, cutting processing, powder metallurgy, and the like.
  • Casting can include sand casting, investment casting, pressure casting, centrifugal casting, etc .; plastic processing can include one or more combinations of rolling, casting, forging, stamping, extrusion, drawing, etc .; cutting processing can include turning, milling , Planing, grinding, etc.
  • the processing method of the magnetizing means may include 3D printing, a numerically controlled machine tool, and the like.
  • the connection manner between the first magnetically permeable element 204, the second magnetically permeable element 206, and the first magnetic element 202 may include one or more combinations such as adhesion, snapping, welding, riveting, and bolting.
  • the coil 212 may be disposed in a magnetic gap between the first magnetic element 202 and the second magnetically permeable element 206.
  • the coil 212 can pass a signal current.
  • the coil 212 is in a magnetic field formed by the magnetic circuit assembly 210 and is subjected to an ampere force to drive the coil 212 to generate mechanical vibration.
  • the magnetic circuit assembly 210 receives a reaction force opposite to the coil.
  • the vibration transmitting sheet 214 may be connected to the magnetic circuit assembly 210, and the other end may be connected to the housing 220.
  • the vibration transmitting sheet 214 is an elastic member. The elasticity is determined by various aspects such as the material, thickness, and structure of the vibration transmitting sheet 214.
  • the material of the vibration transmitting plate 214 includes, but is not limited to, steel (such as, but not limited to, stainless steel, carbon steel, etc.), light alloy (such as, but not limited to, aluminum alloy, beryllium copper, magnesium alloy, titanium alloy, etc.), plastic ( (Such as, but not limited to, high-molecular polyethylene, blown nylon, engineering plastics, etc.), or other single or composite materials that can achieve the same performance.
  • Composite materials may include, for example, but not limited to, glass fibers, carbon fibers, boron fibers, graphite fibers, graphene fibers, silicon carbide fibers, or aramid fibers, or other composites of organic and / or inorganic materials, such as glass fibers Various types of glass steel reinforced with unsaturated polyester, epoxy or phenolic resin matrix.
  • the thickness of the vibration transmitting sheet 214 is not less than 0.005mm, preferably, the thickness is 0.005mm-3mm, more preferably, the thickness is 0.01mm-2mm, and even more preferably, the thickness is 0.01mm-1mm, Further preferably, the thickness is 0.02 mm-0.5 mm.
  • the vibration transmitting plate 214 may be an elastic structure.
  • the elastic structure refers to that the structure itself is an elastic structure. Even if the material is hard, the structure itself has elasticity, so that the vibration transmitting plate 214 itself has elasticity.
  • the vibration transmitting sheet 214 can be made into a spring-like elastic structure.
  • the structure of the vibration transmitting plate 214 may be set to a ring-like or toroid-like structure.
  • the structure includes at least one ring, preferably at least two rings, which may be concentric rings or non-circular rings.
  • the rings are connected by at least two struts, and the struts radiate from the outer ring to the center of the inner ring, further preferably including at least one elliptical ring, further preferably including at least two elliptical rings, and different elliptical rings having With different curvature radii, the rings are connected by a support rod, and further preferably, the vibration transmitting plate 214 includes at least one square ring.
  • the structure of the vibration transmitting sheet 214 may also be set in a sheet shape.
  • a hollow pattern is provided on the top, and the area of the hollow pattern is not less than the area without the hollow.
  • the ring-shaped diaphragm has different thickness distributions.
  • the thickness of the support rod is equal to the thickness of the ring.
  • the thickness of the support rod is greater than the thickness of the ring, and even more preferably, the thickness of the inner ring is greater than the thickness of the outer ring.
  • part of the vibration transmitting plate 214 is connected to the magnetic circuit assembly 210 and part of the vibration transmitting plate 214 is connected to the housing 220.
  • the vibration transmitting plate 214 is connected to the first magnetically conductive element 204.
  • the vibration transmitting sheet 214 may be connected to the magnetic circuit assembly 210 and the housing 220 by glue.
  • the vibration transmission plate 214 can be connected by welding, snap-fitting, riveting, threaded connection (screw, screw, screw, bolt, etc.), interference connection, clamp connection, pin connection, wedge key connection, and molded connection. It is fixed on the housing 220.
  • the vibration transmitting plate 214 may be connected to the magnetic circuit assembly 210 through a connecting member 216.
  • the bottom end of the connecting member 216 may be fixed on the magnetic circuit assembly 210.
  • the connecting member may be fixed on the upper surface of the first magnetically conductive element.
  • the connecting member 216 has a top end opposite to the bottom surface, and the top end may be fixedly connected to the vibration transmitting plate 214.
  • the top end of the connecting member 216 may be adhered to the vibration transmitting sheet 214 by glue.
  • the casing 220 has a casing panel 222, a casing back surface 224, and a casing side surface 226.
  • the housing back surface 224 is located on a side opposite to the housing panel 222 and is respectively disposed on both end surfaces of the housing side surface 226.
  • the casing panel 222, the casing back surface 224, and the casing side surface 226 form an integrated structure with a certain accommodation space.
  • the magnetic circuit assembly 210, the coil 212, and the vibration transmitting sheet 214 are fixed inside the housing 220.
  • the bone conduction earphone 200 may further include a housing support 228, and the vibration transmitting sheet 214 may be connected to the housing 220 through the housing support 228.
  • the coil 212 may be fixed on the housing support 228 and passed The housing bracket 228 drives the housing 220 to vibrate.
  • the housing bracket 228 may be a part of the housing 220 or a separate component, which is directly or indirectly connected to the inside of the housing 220.
  • the housing bracket 228 is fixed on the inner surface of the side 226 of the housing.
  • the housing bracket 228 may be affixed to the housing 220 by glue, and may also be fixed to the housing 220 by stamping, injection molding, snap-fitting, riveting, screwing or welding.
  • the bone conduction speaker 100 further includes a headphone fixing assembly (not shown in FIG. 2).
  • the earphone fixing component is fixedly connected to the housing 220, and keeps the bone conduction speaker 100 in stable contact with human tissues or bones, avoids shaking of the bone conduction speaker 100, and ensures that the earphone can stably transmit sound.
  • the earphone fixing component may be an arc-shaped elastic member capable of forming a force for rebounding toward the middle of the arc.
  • a housing 220 is respectively connected to two ends of the earphone fixing component, and the housing 220 at both ends is kept in contact with human tissue or bone.
  • FIG. 3 is a frequency response curve of a bone conduction speaker according to some embodiments of the present application.
  • the horizontal axis is the vibration frequency
  • the vertical axis is the vibration intensity of the bone conduction speaker 200.
  • the vibration intensity mentioned here can be expressed as the vibration acceleration of the bone conduction speaker 200.
  • the flatter the frequency response curve the better the sound quality exhibited by the bone conduction speaker 200 is considered.
  • the structure, design of parts, and material properties of the bone conduction speaker 200 may affect the frequency response curve.
  • low frequencies refer to sounds less than 500Hz
  • intermediate frequencies refer to sounds in the range of 500Hz-4000Hz
  • high frequencies refer to sounds greater than 4000Hz.
  • the frequency response curve of the bone conduction speaker 200 may have two resonance peaks (310 and 320) in the low frequency region, and a first high frequency valley 330, a first high frequency peak 340, and a second high frequency peak 350 in the high frequency region.
  • the two resonance peaks (310 and 320) in the low frequency region can be generated by the joint action of the vibration transmitting plate 214 and the earphone fixing component.
  • the first high-frequency valley 330 and the first high-frequency peak 340 may be generated by deformation of the casing side surface 226 at high frequencies
  • the second high-frequency peak 350 may be generated by deformation of the casing panel 222 at high frequencies.
  • the positions of the different resonance peaks and high-frequency peaks / valleys are related to the stiffness of the corresponding component.
  • the stiffness is the ability of a material or structure to resist elastic deformation when subjected to a force. Stiffness is related to the Young's modulus of the material and its structural dimensions. The greater the stiffness, the smaller the deformation of the structure when subjected to force.
  • the frequency response from 500Hz to 6000Hz is particularly critical for bone conduction speakers. In this frequency range, sharp peaks and valleys are not expected. The flatter the frequency response curve, the better the sound quality of the headphones.
  • the peaks and valleys in the high frequency region can be adjusted to a higher frequency region by adjusting the stiffness of the casing panel 222 and the casing back surface 224.
  • the housing bracket 228 may also affect the peaks and valleys in the high frequency region. By adjusting the stiffness of the housing bracket 228, the peaks and valleys in the high frequency region can be adjusted to a higher frequency region.
  • the effective frequency band of the frequency response curve of the bone conduction speaker can cover at least 500 Hz to 1000 Hz, or 1000 Hz to 2000 Hz.
  • the effective frequency band referred to here is set according to the common standards in the industry, for example, IEC and JIS. In some embodiments, there are no peaks / valleys in the effective frequency band whose frequency range exceeds 1/8 octave, and the peak / valley value exceeds the average vibration intensity by 10 dB.
  • the stiffness of different components is related to the Young's modulus, thickness, size, volume, and the like of their materials.
  • FIG. 4 is a frequency response curve of a bone conduction speaker when a shell of the bone conduction speaker is made of materials with different Young's modulus according to some embodiments of the present application.
  • the casing 220 may include a casing panel 222, a casing back surface 224, and a casing side surface 226.
  • the casing panel 222, the casing back surface 224, and the casing side surface 226 may be made of the same material, or may be made of different materials.
  • the back of the housing 224 and the housing panel 222 may be made of the same material, and the housing side 226 may be made of other materials.
  • the housing 220 may be made of the same material as the housing panel 222, the housing back 224, and the housing side 226, so that the frequency response of the Young's modulus of the housing material to the bone conduction earphone can be clearly illustrated. The effect of the curve. From Fig.
  • the stiffness of the shell mentioned here can be characterized as the elastic modulus of the shell, that is, the shape change of the shell when the shell is under stress. When the structure and size of the shell are constant, the stiffness of the shell increases as the Young's modulus of the shell material increases.
  • the peak of the frequency response curve at a high frequency can be adjusted to a higher frequency by adjusting the Young's modulus of the material of the housing 220.
  • the Young's modulus of the material of the housing 220 may be greater than 2000 MPa, preferably, the Young's modulus of the material of the housing 220 may be greater than 4000 MPa, preferably, the Young's modulus of the material of the housing 220 is greater than 6000 MPa, preferably Ground, the Young's modulus of the material of the housing 220 is greater than 8000 MPa, preferably, the Young's modulus of the material of the housing 220 is greater than 12000 MPa, more preferably, the Young's modulus of the material of the housing 220 is greater than 15000 MPa, and further preferably, the shell The Young's modulus of the bulk 220 material is greater than 18000 MPa.
  • the high-frequency peak frequency in the frequency response curve of the bone-conduction earphone can be not less than 1000 Hz, preferably, the high-frequency peak frequency can be not less than 2000 Hz, and preferably, the high-frequency peak frequency can not be changed.
  • the high-frequency peak frequency can be not less than 6000Hz, more preferably, the high-frequency peak frequency can be not less than 8000Hz, more preferably, the high-frequency peak frequency can be not less than 10000Hz, and even more preferably, the high-frequency peak frequency can be not less than 12000Hz, Further preferably, the high-frequency peak frequency may be not less than 14000 Hz, further preferably, the high-frequency peak frequency may be not less than 16000 Hz, even more preferably, the high-frequency peak frequency may be not less than 18000 Hz, and still more preferably, the high-frequency peak frequency may be not less than 20000 Hz.
  • the high-frequency peak frequency in the frequency response curve of the bone conduction earphone can be outside the hearing range of the human ear. In some embodiments, by adjusting the stiffness of the housing 220, the high-frequency peak frequency in the frequency response curve of the earphone can be within the hearing range of the human ear. In some embodiments, when there are multiple high-frequency peaks / valleys, by adjusting the stiffness of the housing 220, one or more high-frequency peak / valley frequencies in the frequency response curve of the bone conduction earphone can be outside the hearing range of the human ear. The remaining one or more high-frequency peak / valley frequencies are within the hearing range of the human ear. For example, the second high-frequency peak 350 may be located outside the hearing range of the human ear, and the first high-frequency valley 330 and the first high-frequency peak 340 may be located within the hearing range of the human ear.
  • connection manner of the casing panel 222, the casing back surface 224, and the casing side surface 226 can be used to ensure that the casing 220 has greater rigidity.
  • the case panel 222, the case back 224, and the case side 226 may be integrally formed.
  • the case back 224 and the case side 226 may be a one-piece structure.
  • the outer shell panel 222 and the outer shell side 226 can be directly fixed by glue, or fixed by means of snapping, welding or screwing.
  • the glue may be glue with strong viscosity and high hardness.
  • the casing panel 222 and the casing side surface 226 may be a one-piece structure, and the casing back surface 224 and the casing side surface 226 may be directly fixed and fixed by glue, or may be fixed by snapping, welding, or screwing.
  • the casing panel 222, the casing back surface 224, and the casing side surface 226 are independent components, and the three can be performed by one or any combination of glue, snap, welding, or screw connection. Fixed connection.
  • the shell panel 222 and the shell side 226 are connected by glue, and the shell back surface 224 and the shell side 226 are connected by snapping, welding or screwing.
  • the shell back surface 224 and the shell side surface 226 are connected by glue, and the shell panel 222 and the shell side surface 226 are connected by snapping, welding or screwing.
  • the overall stiffness of the housing 220 can be improved by using materials with the same or different Young's modulus for matching.
  • the case panel 222, the case back 224, and the case side 226 may all be made of one material.
  • the casing panel 222, the casing back surface 224, and the casing side surface 226 may be made of different materials, and different materials may have the same Young's modulus or different Young's moduli.
  • the case panel 222 and the case back 224 are made of the same material, and the case side 226 is made of other materials. The Young's modulus of the two materials may be the same or different.
  • the Young's modulus of the material of the case side 226 may be greater than the Young's modulus of the material of the case panel 222 and the case back 224, or the Young's modulus of the material of the case side 226 may be less than the case panel 222 and the case back 224 Material's Young's modulus.
  • the shell panel 222 and the shell side 226 are made of the same material, and the shell back 224 is made of other materials.
  • the Young's modulus of the two materials may be the same or different.
  • the Young's modulus of the material of the case back 224 may be greater than the Young's modulus of the material of the case panel 222 and the case side 226, or the Young's modulus of the material of the case back 224 may be less than the case panel 222 and the case side 226 Material's Young's modulus.
  • the housing back 224 and the housing side 226 are made of the same material, and the housing panel 222 is made of other materials. The Young's modulus of the two materials may be the same or different.
  • the Young's modulus of the material of the case panel 222 may be greater than the Young's modulus of the material of the case back 224 and the case side 226, or the Young's modulus of the material of the case panel 222 may be less than the case back 224 and the case side 226 Material's Young's modulus.
  • the materials of the shell panel 222, the shell back 224, and the shell side 226 are different.
  • the Young's modulus of the three materials can be all the same or different, and the Young's modulus of the three materials is greater than 2000MPa.
  • FIG. 5 is a frequency response curve of a bone conduction headset when the vibration transmitting plates of the bone conduction headset have different rigidities, according to some embodiments of the present application.
  • FIG. 6 is a frequency response curve of a bone conduction earphone when the earphone fixing component of the bone conduction earphone has different stiffnesses according to some embodiments of the present application. It can be known from FIG. 5 and FIG. 6 that the two resonance peaks in the low frequency region are related to the vibration transmitting plate and the earphone fixing component. The smaller the stiffness of the vibration transmitting plate 214 and the earphone fixing component, the more obvious the response of the resonance peak at low frequencies.
  • the two resonance peak frequencies of the low frequency region of the bone conduction earphone can be less than 2000 Hz.
  • the peak frequencies are both less than 1000 Hz, and more preferably, the two resonant peak frequencies of the low-frequency region of the bone-conduction earphone can be less than 500 Hz.
  • the difference between the peaks of the two resonance peaks in the low frequency region of the bone conduction headset is not greater than 150 Hz.
  • the difference between the peaks of the two resonance peaks in the low frequency region of the bone conduction headset is not more than 100 Hz. More preferably, the bone conduction headset The difference between the peak values of the two resonance peaks in the low frequency region is not greater than 50 Hz.
  • the present application can adjust the peak / valley of the high-frequency region to a higher frequency by adjusting the stiffness of each component of the bone conduction speaker (for example, the housing, the housing bracket, the vibration transmitting plate, or the headphone fixing component).
  • the low-frequency resonance peak is adjusted to the low frequency to ensure a frequency response curve platform in the range of 500 Hz to 6000 Hz, which improves the sound quality of bone conduction headphones.
  • the bone conduction speaker generates sound leakage during vibration transmission.
  • the sound leakage refers to the change in the volume of the surrounding air caused by the vibration of the internal components of the bone conduction speaker 200 or the vibration of the casing, which causes the surrounding air to form a compressed area or a sparse area and propagate to the surroundings, leading to the transmission of sound to the surrounding environment, making Persons other than the wearer of the bone conduction headset can hear the sound of the headset.
  • This application can provide a solution to reduce the sound leakage of bone conduction headphones from the perspective of changing the structure and stiffness of the housing.
  • FIG. 7A is a schematic structural diagram of a shell of a bone conduction earphone according to some embodiments of the present application.
  • the case 700 may include a case panel 710, a case back 720, and a case side 730.
  • the casing panel 710 is in contact with the human body, and transmits the vibration of the bone conduction earphone to the human auditory nerve.
  • the amplitude and phase of the vibration of the housing panel 710 and the housing back 720 remain the same or substantially the same within a certain frequency range (the side 730 of the housing does not compress air and therefore does not Generate sound leakage), so that the first sound leakage signal generated by the housing panel 710 and the second sound leakage signal generated by the back surface 720 of the housing can be superimposed on each other.
  • the superposition can reduce the amplitude of the first leaky sound wave or the second leaky sound wave, thereby achieving the purpose of reducing the sound leakage of the housing 700.
  • the certain frequency range includes at least a portion whose frequency is greater than 500 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 600 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 800 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 1000 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 2000 Hz. More preferably, the certain frequency range includes at least a portion whose frequency is greater than 5000 Hz. More preferably, the certain frequency range includes at least a portion having a frequency greater than 8000 Hz. Further preferably, the certain frequency range includes at least a portion having a frequency greater than 10000 Hz.
  • FIG. 7B is a schematic diagram showing the relationship between the frequency of generating higher-order modes, the volume of the shell, and the Young's modulus of the material according to some embodiments of the present application.
  • the housing 700 for example, the housing panel 710, the housing back surface 720, and the housing side surface 730
  • different parts of the housing 700 are made of materials having the same Young's modulus.
  • the dotted line 712 indicates the relationship between the frequency of the shell 700 generating a higher-order mode and the shell volume when the Young's modulus of the material is 15 GPa.
  • the volume of the housing is 25000mm 3, the housing 700 generates a higher mode frequencies around 4000Hz, when the volume of the housing is 400mm 3, the housing 700 generates a higher mode frequencies above 32000Hz.
  • the dashed line 713 indicates the relationship between the frequency at which the shell 700 generates a higher-order mode and the shell volume when the Young's modulus of the shell material is 5 GPa.
  • the solid line 714 indicates the relationship between the frequency at which the shell 700 generates a higher-order mode and the shell volume when the Young's modulus of the shell material is 2 GPa. It can be known from this that, when the volume of the shell is smaller, the Young's modulus of the shell material is larger, and the frequency of the high-order mode of the shell 700 is higher.
  • the volume of the shell 700 may be in the range of 400mm 3 -6000mm 3 , and the Young's modulus of the shell material is between 2GPa-18GPa.
  • the volume of the shell 700 is 400mm 3 -5000mm 3
  • the Young's modulus of the shell material is between 2GPa-10GPa
  • the shell volume is in the range of 400mm 3 -3500mm 3
  • the Young's modulus of the shell material is 2GPa- Between 6GPa
  • the shell volume is in the range of 400mm 3 -3000mm 3
  • the Young's modulus of the shell material is between 2GPa-5.5GPa.
  • the shell volume is in the range of 400mm 3 -2800mm 3
  • the Young's modulus of the shell material is between 2GPa-5GPa, more preferably, the shell volume is in the range of 400mm 3 -2000mm 3 , and the Young's modulus of the shell material is between 2GPa-4GPa.
  • the housing volume in the range of 400mm 3 -1000mm 3, while the Young's modulus of the casing material between 2GPa-3GPa.
  • FIG. 7C is a schematic diagram showing a relationship between a volume of a bone conduction speaker and a volume of a housing according to some embodiments of the present application. As shown in FIG.
  • the abscissa represents the size of the shell volume
  • the ordinate represents the volume of the bone conduction speaker under the same input signal (represented by the relative volume, that is, relative volume).
  • the volume of the bone conduction speaker increases as the volume of the housing increases. For example, when the shell volume is 3000 mm 3 , the relative volume of the bone conduction speaker is 1, and when the shell volume is 400 mm 3 , the relative volume of the bone conduction speaker is between 0.25 and 0.5.
  • the volume of the housing in order to make the bone conduction speaker have higher sensitivity (volume), the volume of the housing may be 2000mm 3 -6000mm 3 , preferably, the volume of the housing may be 2000mm 3 -5000mm 3 , preferably, the housing The volume may be 2800mm 3 -5000mm 3 , preferably, the housing volume may be 3500mm 3 -5000mm 3 , preferably, the housing volume may be 1500mm 3 -3500mm 3 , preferably, the housing volume may be 1500mm 3 -2500mm 3 .
  • FIG. 8 is a schematic diagram of reducing noise leakage of the housing 700.
  • the casing panel 710 contacts the human body and performs mechanical vibration.
  • the shell panel 710 may be in contact with the skin of a person's face, causing a certain degree of compression on the contacted skin, so that the skin around the shell panel 710 protrudes outward and deforms.
  • the shell panel 710 is vibrating, it moves toward the face of the person, squeezing the skin, pushing the deformed skin around the shell panel 710 to protrude outward, and compressing the air around the shell panel 710.
  • the back of the housing 720 When the housing panel 710 moves toward the face, the back of the housing 720 also moves toward the face , A sparse area of air is formed around the back surface 720 of the casing, that is, when the air is compressed around the casing panel 710, the air is absorbed around the back surface of the casing 720.
  • the shell panel 710 moves away from the human face, the shell back surface 720 also moves away from the human face, and a compressed area of air is formed around the shell back surface 720, that is, when air is absorbed around the shell panel 710, The air around the back of the housing 720 compresses the air.
  • the opposite effect of the back of the casing 720 and the casing panel 710 on the air makes the effects of the bone conduction headphones on the surrounding air mutually cancel, that is, the external sound leakage can cancel each other, and the effect of significantly reducing the sound leakage outside the housing 700 is achieved. That is to say, by increasing the overall rigidity of the case 700, it is possible to ensure that the back of the case 720 and the case panel 710 vibrate uniformly, while the side of the case 720 does not push air and does not cause sound leakage. The sound leakage cancels, greatly reducing the sound leakage outside the casing 700.
  • the rigidity of the housing 700 is large, which can ensure that the shell panel 710 and the housing back 720 vibrate uniformly, so that the sound leakage outside the housing 700 can cancel each other, thereby achieving the purpose of significantly reducing the sound leakage.
  • the rigidity of the casing 700 is large, which can reduce the sound leakage of the casing panel 710 and the casing back 720 in the mid-low frequency range.
  • increasing the stiffness of the housing 700 may be achieved by increasing the stiffness of the housing panel 710, the housing back 720, and the housing side 730.
  • the stiffness of the housing panel 710 is related to parameters such as Young's modulus, size, and weight of the material. The greater the Young's modulus of the material, the greater the stiffness of the housing panel 710.
  • the Young's modulus of the material of the shell panel 710 is greater than 2000Mpa, preferably, the Young's modulus of the material of the shell panel 710 is greater than 3000Mpa, and the Young's modulus of the material of the shell panel 710 is greater than 4000Mpa, preferably, the shell panel
  • the Young's modulus of 710 material is greater than 6000Mpa, preferably, the Young's modulus of the shell panel 710 material is greater than 8000Mpa, preferably, the Young's modulus of the shell panel 710 material is greater than 12000Mpa, and more preferably, the Yang panel of the shell panel 710 material is young
  • the Young's modulus of the material of the shell panel 710 is more than 15000Mpa, and more preferably, the Young's modulus of the material of the shell panel 710 is more than 18000Mpa.
  • the material of the shell panel 710 includes, but is not limited to, Acrylonitrile butadiene styrene (ABS), Polystyrene (PS), High impact polystyrene (High impact polystyrene) polystyrene (HIPS), polypropylene (Polypropylene, PP), polyethylene terephthalate (Polyethylene terephthalate, PET), polyester (Polyester, PES), polycarbonate (Polycarbonate, PC), polyamide (Polyamides, PA), Polyvinyl chloride (PVC), Polyurethanes (PU), Polyvinylidene chloride, Polyethylene (PE), Polymethylmethacrylate (PMMA), Polyetheretherketone (PEEK), Phenolics (PF), Urea-formaldehyde (UF), Melamine formaldehyde resin (MF), and some metals and alloys (such as aluminum alloy, chromium Molybdenum steel, rhenium alloy, magnesium alloy
  • the material of the housing panel 710 is any combination of glass fiber, carbon fiber, and materials such as polycarbonate (PC), polyamide (PA), and the like.
  • the material of the shell panel 710 may be a mixture of carbon fiber and polycarbonate (PC) according to a certain ratio.
  • the material of the shell panel 710 may be carbon fiber, glass fiber, and polycarbonate (Polycarbonate, PC).
  • the material of the shell panel 710 may be made of glass fiber and polycarbonate (Polycarbonate, PC) according to a certain ratio, or glass fiber and polyamide (Polyamides, PA) may be mixed according to a certain ratio.
  • the stiffness of the obtained materials is different. For example, by adding 20% to 50% glass fiber, the Young's modulus of the material can reach 4000 MPa to 8000 MPa.
  • the thickness of the shell panel 710 is not less than 0.3 mm, preferably, the thickness of the shell panel 710 is not less than 0.5 mm, more preferably, the thickness of the shell panel 710 is not less than 0.8 mm, and more preferably, the shell panel 710 is The thickness is not less than 1mm.
  • the weight of the housing 700 increases, thereby increasing the self-weight of the bone-conduction earphones, which affects the sensitivity of the earphones. Therefore, the thickness of the shell panel 710 should not be too large.
  • the thickness of the shell panel 710 does not exceed 2.0 mm, preferably, the thickness of the shell panel 710 does not exceed 1.5 mm, preferably, the thickness of the shell panel 710 does not exceed 1.2 mm, and more preferably, The thickness does not exceed 1.0 mm, and more preferably, the thickness of the housing panel 710 does not exceed 0.8 mm.
  • the housing panel 710 may be provided in different shapes.
  • the shell panel 710 may be provided in a rectangular shape, an approximately rectangular shape (that is, a track shape, or a structure in which four corners of a rectangular shape are replaced with arc shapes), an oval shape, or any other shape.
  • the area of the shell panel 710 is not greater than 8 cm 2 , preferably, the area of the shell panel 710 is not greater than 6 cm 2 , preferably, the area of the shell panel 710 is not greater than 5 cm 2 , and more preferably, the The area is not more than 4 cm 2 , and more preferably, the area of the housing panel 710 is not more than 2 cm 2 .
  • the stiffness of the housing 700 may be achieved by adjusting the weight of the housing 700.
  • the heavier the weight of the case 700 the lower the overall sensitivity of the headset.
  • FIG. 9 is a frequency response curve of a bone conduction earphone according to some embodiments of the present invention when the weights of the bone conduction earphones are different. As shown in FIG.
  • the weight of the housing 700 is 8 grams or less, preferably, the weight of the housing 700 is 6 grams or less, more preferably, the weight of the housing 700 is 4 grams or less, and further preferably, the housing 700 The weight is less than or equal to 2 grams.
  • the stiffness of the housing panel 710 can be improved by adjusting any combination of Young's modulus, thickness, weight, shape and other factors of the housing panel 710 at the same time.
  • the desired stiffness can be obtained by adjusting the Young's modulus and thickness. Or you can adjust the Young's modulus, thickness and weight to get the ideal stiffness.
  • the Young's modulus of the material of the shell panel 710 is not less than 2000 MPa, and the thickness is not less than 1 mm. In some embodiments, the Young's modulus of the material of the shell panel 710 is not less than 4000 MPa, and the thickness is not less than 0.9 mm.
  • the Young's modulus of the material of the shell panel 710 is not less than 6000 MPa, and the thickness is not less than 0.7 mm. In some embodiments, the Young's modulus of the material of the shell panel 710 is not less than 8000 MPa, and the thickness is not less than 0.6 mm. In some embodiments, the Young's modulus of the material of the shell panel 710 is not less than 10000 MPa, and the thickness is not less than 0.5 mm. In some embodiments, the Young's modulus of the material of the shell panel 710 is not less than 18000 MPa, and the thickness is not less than 0.4 mm.
  • the housing may be any shape capable of vibrating together as a whole, and is not limited to the shape shown in FIG. 7.
  • the housing may be any shape with the same projected area on the same plane of the housing panel and the back of the housing.
  • the housing 900 may be a cylinder.
  • the housing panel 910 and the housing back 930 are the upper and lower end surfaces of the cylinder, respectively, and the housing side 920 is a cylinder. On the side.
  • the projected areas of the housing panel 910 and the housing back surface 930 are equal on the cross-section of the cylinder perpendicular to the axis.
  • the sum of the projected areas of the back surface and the side of the case is equal to the projected area of the case panel.
  • the housing 900 may have an approximately hemispherical shape.
  • the housing panel 910 may be a flat surface or a curved surface
  • the housing side surface 920 may be a curved surface (eg, a bowl-shaped curved surface) to be parallel to the housing panel.
  • the plane of 910 is a projection surface.
  • the back surface of the housing 920 may be a plane or a curved surface having a smaller projected area than the projection area of the housing panel 910.
  • the sum of the projection areas of the housing side 920 and the housing back 930 is equal to the projection area of the housing panel 910.
  • the projected area of the side of the casing facing the human body is equal to the projected area of the side of the casing facing away from the human body.
  • the case panel 910 and the case back 930 are opposite curved surfaces
  • the case side 920 is a curved surface transitioning from the case panel 910 to the case back
  • a part of the case side 920 is located on the same side as the case panel 910
  • the case side The other part of 920 is located on the same side as the back of the case 930
  • the cross section with the largest cross-sectional area is the projection plane.
  • the projected areas are equal.
  • the difference between the area of the housing panel and the back of the housing does not exceed 50% of the area of the housing panel, preferably, the difference between the area of the housing panel and the back of the housing does not exceed 40% of the area of the housing panel, more preferably The difference between the area of the housing panel and the back of the housing does not exceed 30% of the area of the housing panel, more preferably, the difference between the area of the housing panel and the back of the housing does not exceed 25% of the area of the housing panel, more preferably, the housing panel and The difference in the area of the back of the case does not exceed 20% of the area of the case panel, more preferably, the difference in the area of the case panel and the back of the case does not exceed 15% of the area of the case panel, more preferably, the area of the case panel and the back of the case
  • the difference between the area of the case panel and the back of the case is not more than 12%, and more preferably, the area of the area of the case panel and the back of the case is not more than 10% of the area of the case panel
  • the difference between the area of the housing panel and the back of the housing does not exceed 5% of the area of the housing panel, more preferably, The difference between the area of the case panel and the back of the case does not exceed 3% of the area of the case panel, more preferably, the difference between the area of the case panel and the back of the case does not exceed 1% of the area of the case panel, and more preferably, the case panel and the case The difference in the area of the back surface does not exceed 0.5% of the area of the case panel, and more preferably, the areas of the case panel and the back of the case are equal.
  • FIG. 11 is a comparison diagram of the effects of noise cancellation of a conventional bone conduction speaker and a bone conduction speaker according to some embodiments of the present application.
  • the traditional bone conduction speaker refers to a bone conduction speaker made of a shell made of a material having a conventional Young's modulus.
  • the broken line is the sound leakage curve of the conventional bone conduction speaker
  • the solid line is the sound leakage curve of the bone conduction speaker of the present application.
  • Set the leakage sound of the traditional speaker at low frequency to 0, which is based on the leakage cancellation of the traditional speaker at low frequency. It can be seen that the noise cancellation effect of the bone conduction speaker of the present application is significantly better than that of the conventional speaker.
  • the effect of leakage cancellation is the best.
  • the leakage can be reduced by 40dB.
  • the degree of leakage cancellation gradually decreases. Weakened, compared to traditional bone conduction speakers at 1000Hz can reduce 20dB leakage sound, while at 4000Hz can only reduce 5dB leakage sound.
  • the above-mentioned comparison test result may be obtained by means of simulation. In some embodiments, the above-mentioned comparison test result may be obtained by a physical test.
  • a bone conduction speaker can be placed in a quiet environment, a signal current is input to the bone conduction speaker, and a microphone is arranged in the space around the bone conduction speaker to receive a sound signal, thereby measuring the magnitude of the sound leakage.
  • the bone conduction speaker casing of the present application has good vibration consistency, which can offset most of the sound leakage, and its effect of reducing sound leakage is significantly better than that of traditional bone conduction headphones.
  • high-frequency vibration occurs, it is still difficult to maintain a whole body to vibrate together, so there will still be relatively serious sound leakage.
  • the casing will inevitably be deformed.
  • the shell panel and the back of the shell are deformed and the deformations are inconsistent (for example, the shell panel and the back of the shell itself will appear in a high-order mode at high frequencies), the sound leakage generated by the two will not cancel each other, resulting in sound leakage.
  • the side of the casing will also deform, resulting in increased deformation of the casing panel and the back of the casing, and increased sound leakage.
  • Fig. 12 is a frequency response curve of a housing panel of a bone conduction speaker.
  • the shell moves together as a whole, and the size, speed, and direction of the shell panel and the back of the shell are the same.
  • the shell panel has higher-order modes (ie, the points on the shell panel have inconsistent vibrations), and due to the existence of the higher-order modes, the shell also has obvious peaks in the frequency response curve (see Figure 12).
  • the Young's modulus, weight, and / or size of the material of the housing panel can be adjusted to adjust the peak frequency.
  • the Young's modulus of the shell panel material can be greater than 2000 MPa, preferably, the Young's modulus of the material can be greater than 4000 MPa, preferably, the Young's modulus of the material is greater than 6000 MPa, preferably, the Young's modulus of the material
  • the modulus is greater than 8000 MPa, preferably, the Young's modulus of the material is greater than 12000 MPa, more preferably, the Young's modulus of the material is greater than 15000 MPa, and even more preferably, the Young's modulus of the material is greater than 18000 MPa.
  • the minimum frequency at which the high-order mode appears on the shell panel is not less than 4000 Hz, preferably, the minimum frequency at which the high-order mode appears on the shell panel is not less than 6000 Hz, and more preferably, the minimum frequency at which the high-order mode appears on the shell panel is not less than 8000 Hz, more preferably, the minimum frequency of the high-order mode on the shell panel is not less than 10000 Hz, and more preferably, the minimum frequency of the high-order mode on the shell panel is not less than 15000 Hz. More preferably, the minimum frequency of the high-order mode on the shell panel is not less than Less than 20000Hz.
  • the peak frequency in the frequency response curve of the shell panel can be greater than 1000 Hz, preferably, the peak frequency can be greater than 2000 Hz, preferably, the peak frequency can be greater than 4000 Hz, preferably, The peak frequency may be greater than 6000 Hz, more preferably, the peak frequency may be greater than 8000 Hz, more preferably, the peak frequency may be greater than 10000 Hz, more preferably, the peak frequency may be greater than 12000 Hz, and even more preferably, the peak frequency may be greater than 14000 Hz. Further preferably, the peak frequency can be made larger than 16000 Hz, further preferably, the peak frequency can be made larger than 18000 Hz, and still more preferably, the peak frequency can be made larger than 20000 Hz.
  • the housing panel may be composed of a single material.
  • the shell panel may be formed by stacking two or more materials.
  • the shell panel may be formed by combining a layer of material with a larger Young's modulus and a layer of material with a smaller Young's modulus. This advantage is that while ensuring the rigidity requirements of the shell panel, it can also increase the comfort of contact with the human body and improve the degree of cooperation between the shell panel and the human body.
  • the material having a larger Young's modulus may be an acrylonitrile-butadiene-styrene copolymer (Acrylonitrile butadiene styrene (ABS), polystyrene (PS), high impact polystyrene (PS) High impact polystyrene (HIPS), polypropylene (Polypropylene, PP), polyethylene terephthalate (Polyethylene terephthalate, PET), polyester (Polyester, PES), polycarbonate (Polycarbonate, PC), polyamide ( Polyamides (PA), Polyvinyl chloride (PVC), Polyurethanes (PU), Polyvinylidene chloride, Polyethylene (PE), Polymethyl methacrylate (PMMA) ), Polyetheretherketone (PEEK), Phenolics (PF), Urea-formaldehyde (UF), Melamine formaldehyde (MF), and some metals, alloys (such as aluminum alloy , Chrome-mol
  • ABS
  • the material of the housing panel 710 is any combination of glass fiber, carbon fiber, and materials such as polycarbonate (PC), polyamide (PA), and the like.
  • the material of the shell panel 710 may be a mixture of carbon fiber and polycarbonate (PC) according to a certain ratio.
  • the material of the shell panel 710 may be carbon fiber, glass fiber, and polycarbonate (Polycarbonate, PC).
  • the material of the shell panel 710 may be made of glass fiber and polycarbonate (Polycarbonate, PC) according to a certain ratio.
  • the stiffness of the obtained materials is different. For example, by adding 20% to 50% glass fiber, the Young's modulus of the material can reach 4000 MPa to 8000 MPa. In some embodiments, the material having a smaller Young's modulus may be silica gel.
  • the outer surface of the housing panel that contacts the human body may be a flat surface. In some embodiments, the outer surface of the housing panel may have some protrusions or depressions. As shown in FIG. 13, the upper surface of the housing panel 1300 may have a protrusion 1310. In some embodiments, the outer surface of the shell panel may be a curved surface of any profile.
  • FIG. 14A is a frequency response curve of the back of the housing of the bone conduction speaker.
  • the back of the case is at low and medium frequencies, it is consistent with the vibration of the case panel, and at high frequencies, a high-order mode appears on the back of the case.
  • the higher-order mode on the back of the case will pass through the side of the case, affecting the speed and direction of the movement of the case panel.
  • the deformation of the back of the casing and the deformation of the panel of the casing can reinforce or cancel each other out, generating peaks and valleys at high frequencies.
  • a wider range of flatter frequency response curves can be obtained by adjusting the material and geometry of the back of the housing to make the peak frequency appear higher.
  • the Young's modulus, weight, and / or size of the material of the case back plate can be adjusted to adjust the peak frequency at which the back of the case appears.
  • the Young's modulus of the material on the back of the housing can be greater than 2000Mpa, preferably, the Young's modulus of the material can be greater than 4000Mpa, preferably, the Young's modulus of the material is greater than 6000Mpa, preferably, the Young's modulus of the material
  • the modulus is greater than 8000Mpa, preferably, the Young's modulus of the material is greater than 12000Mpa, more preferably, the Young's modulus of the material is greater than 15000Mpa, and even more preferably, the Young's modulus of the material is greater than 18000Mpa.
  • the peak frequency of the back of the case can be made greater than 1000 Hz, preferably, the peak frequency can be made greater than 2000 Hz, preferably the peak frequency can be made greater than 4000 Hz, and preferably, the peak value can be made
  • the frequency is greater than 6000 Hz, more preferably, the peak frequency of the back of the case may be greater than 8000 Hz, more preferably, the peak frequency of the back of the case may be greater than 10000 Hz, and even more preferably, the peak frequency of the back of the case may be greater than 12000 Hz, further preferably
  • the peak frequency of the back of the case may be greater than 14000 Hz, further preferably, the peak frequency of the back of the case may be greater than 16000 Hz, and further preferably, the peak frequency of the back of the case may be greater than 18000 Hz, and further preferably, the peak frequency of the back of the case may be increased Greater than 20000Hz.
  • the back of the housing may consist of a material. In some embodiments, the back of the housing may be formed by stacking two or more materials.
  • Fig. 14B is a frequency response curve of the side of the casing of the bone conduction earphone.
  • the side of the housing itself will not cause sound leakage when vibrating at low frequencies.
  • the side of the shell is at high frequency, it also affects the sound leakage of the speaker. The reason is that when the frequency is high, the side of the shell will deform, and this deformation will cause the movement of the shell panel and the back of the shell to be inconsistent, so the sound leakage from the shell panel and the back of the shell cannot cancel each other, causing the overall sound leakage to become larger.
  • the side of the shell when there is deformation on the side of the shell, it will also cause changes in bone conduction sound quality. As shown in FIG.
  • the frequency response curve on the side of the housing will show peaks / valleys at high frequencies.
  • a wider range of flatter frequency response curves can be obtained by adjusting the material and geometric dimensions of the side of the casing to make it appear more frequently. Improve the sound quality of bone conduction speakers. And reduce the human ear's sensitivity to high-frequency leakage, thereby reducing the leakage of speakers.
  • the Young's modulus, weight, and / or size of the material on the side of the housing can be adjusted to adjust the frequency of peak / valley appearance.
  • the Young's modulus of the material on the side of the shell can be greater than 2000Mpa, preferably, the Young's modulus of the material can be greater than 4000Mpa, preferably, the Young's modulus of the material is greater than 6000Mpa, preferably, the Young's The modulus is greater than 8000Mpa, preferably, the Young's modulus of the material is greater than 12000Mpa, more preferably, the Young's modulus of the material is greater than 15000Mpa, and even more preferably, the Young's modulus of the material is greater than 18000Mpa.
  • the peak frequency of the side of the shell can be made greater than 2000 Hz, preferably, the peak frequency of the side of the shell can be greater than 4000 Hz, and preferably, the peak frequency of the side of the shell can be greater than 6000 Hz,
  • the peak frequency of the side of the case can be made greater than 8000 Hz, more preferably, the peak frequency of the side of the case can be made greater than 10000 Hz, more preferably, the peak frequency of the side of the case can be made greater than 12000 Hz, and even more preferably, the The peak frequency is greater than 14000 Hz.
  • the peak frequency of the side of the case can be greater than 16000 Hz.
  • the peak frequency of the side of the case can be greater than 18000 Hz. More preferably, the peak frequency of the side of the case can be greater than 20000 Hz.
  • the sides of the housing may be composed of a material. In some embodiments, the side of the housing may be formed by stacking two or more materials.
  • FIG. 15 is a frequency response curve of a housing bracket of a bone conduction earphone. As shown in Fig. 15, at high frequencies, the housing bracket will generate a resonance peak on the frequency response curve. The shell brackets with different stiffnesses have different resonance peak positions at high frequencies.
  • the frequency and frequency of resonance peaks can be adjusted by adjusting the material and geometric size of the housing bracket, so that the bone conduction speaker can obtain a wider and flatter frequency response curve at low and medium frequencies, thereby improving bone Conductive speaker sound quality.
  • the Young's modulus, weight, and / or size of the material of the housing support can be adjusted to adjust the frequency at which the resonance peak appears.
  • the Young's modulus of the housing support material may be greater than 2000 MPa, preferably, the Young's modulus of the material may be greater than 4000 MPa, preferably, the Young's modulus of the material is greater than 6000 MPa, preferably, the Young's modulus of the material
  • the modulus is greater than 8000 MPa, preferably, the Young's modulus of the material is greater than 12000 MPa, more preferably, the Young's modulus of the material is greater than 15000 MPa, and even more preferably, the Young's modulus of the material is greater than 18000 MPa.
  • the peak frequency of the shell bracket can be greater than 2000 Hz, preferably, the peak frequency of the shell bracket can be greater than 4000 Hz, preferably, the peak frequency of the shell bracket can be greater than 6000 Hz, preferably Ground, the peak frequency of the shell bracket can be greater than 8000 Hz, more preferably, the peak frequency of the shell bracket can be greater than 10000 Hz, more preferably, the peak frequency of the shell bracket can be greater than 12000 Hz, and further preferably, the peak frequency of the shell bracket can be increased.
  • the frequency is greater than 14000 Hz, further preferably, the peak frequency of the shell bracket can be greater than 16000 Hz, further preferably, the peak frequency of the shell bracket can be greater than 18000 Hz, and further preferably, the peak frequency of the shell bracket can be greater than 20000 Hz.
  • the stiffness of the shell is increased by adjusting the Young's modulus and the size of the shell material, and the consistency of the shell vibration is ensured, so that the leakage sounds can be superimposed and eliminated to reduce the leakage sounds.
  • adjusting the peak frequency corresponding to different parts of the casing to higher frequencies can reduce the sound leakage while improving the sound quality.
  • FIG. 16A is a schematic structural diagram of a connection between a fixing component of a bone conduction speaker 1600 and a shell according to some embodiments of the present application.
  • the earphone fixing assembly 1620 is connected to the casing 1610.
  • the earphone fixing component 1620 can keep the bone conduction earphone in stable contact with human tissue or bone, avoid shaking of the bone conduction earphone, and ensure that the earphone can stably transmit sound.
  • the earphone fixing component 1620 can be equivalent to an elastic structure.
  • the stiffness of the earphone fixing component 1620 is smaller (that is, the stiffness coefficient is smaller), the more obvious the response of the resonance peak at low frequencies is, the more beneficial it is to improve.
  • the sound quality of bone conduction headphones On the other hand, if the stiffness of the earphone fixing assembly 1620 is small (that is, the stiffness coefficient is small), it is beneficial to the vibration of the casing.
  • FIG. 16B is a manner in which the bone conduction speaker 1600 earphone fixing assembly 1620 and the housing 1610 are connected through a connecting member 1630.
  • the connecting member 1630 may be one or a combination of any one of silicone, sponge, and elastic sheet.
  • the earphone fixing component 1620 may be in the form of an ear hook. Two ends of the earphone fixing component 1620 are respectively connected to a shell 1610, and the two shells are respectively fixed on two sides of the skull in an ear hook manner.
  • the earphone fixing assembly 1620 may be a single-ear ear clip. The earphone fixing component 1620 can be separately connected to a shell 1610 and fix the shell 1610 on one side of the skull.
  • the bone conduction speaker 1700 may include a magnetic circuit assembly 1710, a coil 1720, a connector 1730, a vibration transmitting plate 1740, a housing 1750, and a housing bracket 1760.
  • the bone conduction speaker 1700 further includes a first element and a second element.
  • the coil 1720 is connected to the case 1750 through a first element.
  • the magnetic circuit assembly 1710 is connected to the housing 1750 through a second element.
  • the elastic modulus of the first element is greater than the elastic modulus of the second element.
  • the magnetic circuit component and the shell are soft connected. The purpose is to adjust the positions of the low-frequency resonance peak and the high-frequency resonance peak, and optimize the frequency response curve.
  • the first element may be a housing support 1760, the housing support 1760 is fixedly connected inside the housing 1750, and the coil 1720 is connected to the housing support 1760.
  • the housing bracket 1760 is a ring-shaped bracket fixed to an inner wall of the housing 1750.
  • the housing support 1760 is a rigid member.
  • the housing support 1760 is made of a material having a Young's modulus greater than 2000Mpa.
  • the second element may be a vibration transmitting plate 1740.
  • the magnetic circuit assembly 1710 is connected to the vibration transmitting plate 1740, and the vibration transmitting plate is an elastic member.
  • the housing 1750 can be mechanically vibrated by the vibration transmitting sheet 1740 to transmit the vibration to tissues and bones, and through the tissues and bones to the auditory nerve, so that the human body can hear sound.
  • the overall stiffness of the casing 1750 is large, so that when the bone conduction headset 1700 works, the casing 1750 as a whole vibrates together, that is, the shell panel, the side of the shell, and the back of the shell on the shell 1750 can maintain substantially the same amplitude and phase of vibration.
  • the sound leakage from the outside of the casing 1750 is superimposed and canceled each other, and the external sound leakage is significantly reduced.
  • the magnetic circuit assembly 1710 may include a first magnetic element 1706, a first magnetically permeable element 1704, a second magnetic element 1702, and a second magnetically permeable element 1708.
  • the lower surface of the first magnetically conductive element 1704 may be connected to the upper surface of the first magnetic element 1706.
  • An upper surface of the second magnetically conductive element 1708 may be connected to a lower surface of the first magnetic element 1706.
  • a lower surface of the second magnetic element 1708 may be connected to an upper surface of the first magnetically conductive element 1704.
  • the magnetization directions of the first magnetic element 1706 and the second magnetic element 1708 are opposite.
  • the second magnetic element 1708 can suppress magnetic leakage on the upper surface side of the first magnetic element 1706, so that the magnetic field generated by the first magnetic element 1706 can be more compressed to the second magnetically permeable element 1708 and the first magnetic element 1706. Between the magnetic gaps, the magnetic induction strength in the magnetic gaps is increased, thereby improving the sensitivity of the bone conduction headset 1700.
  • a third magnetic element 1709 can also be added to the lower surface of the second magnetically permeable element 1708.
  • the third magnetic element 1709 has a magnetization direction opposite to that of the first magnetic element 1706. The magnetic field further compresses the magnetic field generated by the first magnetic element 1706 into the magnetic gap, thereby improving the magnetic induction intensity in the magnetic gap and the sensitivity of the bone conduction speaker 1700.
  • the first magnetic element 1706, the first magnetically permeable element 1704, the second magnetic element 1702, the second magnetically permeable element 1708, and the third magnetically permeable element 1709 can be fixed by glue.
  • the first magnetic element 1706, the first magnetically permeable element 1704, the second magnetically permeable element 1702, the second magnetically permeable element 1708, and the third magnetically permeable element 1709 can also be drilled and fixed by screws.
  • the vibration transmitting plate may include an outer ring and an inner ring, and a plurality of connecting rods disposed between the outer ring and the inner ring.
  • the outer and inner rings may be concentric circles.
  • the connecting rod may be arc-shaped with a certain length.
  • the number of connecting rods can be three or more.
  • the inner ring of the vibration transmitting plate can be fixedly connected with the connecting member.
  • the vibration transmitting plate may include an outer ring and an inner ring, and a plurality of connecting rods disposed between the outer ring and the inner ring.
  • the connecting rod may be a straight rod.
  • the number of connecting rods can be three or more.
  • the vibration transmitting plate may include an inner ring, and a plurality of bent rods surrounding the inner ring and radiating outwardly.
  • the number of bends can be 3 or more.
  • the vibration transmitting plate may be composed of a plurality of curved rods.
  • One end of the curved rod is concentrated at the center point of the vibration transmitting plate, and the other end of the curved rod surrounds the center point of the vibration transmitting plate.
  • the number of bends can be 3 or more.
  • FIG. 19 is a schematic structural diagram of a bone conduction speaker according to some embodiments of the present application.
  • the bone conduction speaker 1900 may include a magnetic circuit assembly 1910, a coil 1920, a vibration transmitting plate 1930, a housing 1940, and a housing support 1950.
  • the vibration transmitting plate in FIG. 17 is a planar structure, and the vibration transmitting plate is on a plane.
  • the vibration transmitting sheet in this embodiment has a three-dimensional structure.
  • the vibration transmitting sheet 1930 has a three-dimensional structure in a thickness direction in a natural state under no force. The use of the three-dimensional vibration transmitting sheet can reduce the size of the bone conduction earphone 1900 in the thickness direction.
  • the vibration transmitting plate when the vibration transmitting plate has a flat structure, in order to ensure that the vibration transmitting plate can vibrate in a vertical direction when working, a certain space needs to be reserved above and below the vibration transmitting plate. If the vibration transmitting plate itself has a thickness of 0.2mm, a size of 1mm needs to be reserved above the vibration transmitting plate, and a size of 1mm needs to be reserved below the vibration transmitting plate, then the lower surface of the panel of the housing 1940 to the upper surface of the magnetic circuit assembly, A minimum of 2.2mm space is required. After using the three-dimensional vibration transmission plate, the vibration transmission plate can vibrate in its own thickness space. The size of the three-dimensional vibration transmitting plate in the thickness direction may be 1.5 mm.
  • the distance from the lower surface of the panel of the case 1940 to the upper surface of the magnetic circuit assembly 1910 only needs 1.5 mm, saving 0.7 mm of space.
  • the size of the earphone 1900 in the thickness direction is greatly reduced. And can eliminate the connection, simplify the internal structure.
  • the housing using the three-dimensional vibration transmitting plate and the housing using the planar structure have the same size, the three-dimensional vibration transmitting plate can have greater vibration than the planar structure. Amplitude, thereby increasing the maximum volume that the bone conduction speaker can provide.
  • the projection shape of the three-dimensional vibration transmitting sheet 1930 may be any one of the second embodiment.
  • the outer edge of the three-dimensional vibration transmitting plate 1930 may be connected to the inner side of the housing bracket 1950.
  • its outer ring can be connected to the inside of the housing support 1950 by means of glue, snap connection, welding or screw connection.
  • the curved rod surrounding the inner ring can be glued, snapped, welded or screwed to the inside of the housing bracket 1950. connection.
  • the housing bracket 1950 may be provided with a plurality of slots, and the outer edge of the three-dimensional vibration transmission plate 1930 may be connected to the outside of the housing bracket 1950 through the slot, and the length of the vibration transmission plate may be increased, which is beneficial to The resonance peak changes towards a lower frequency, thereby improving the sound quality.
  • the size of the slot can provide sufficient space for the vibration of the vibration transmitting plate.
  • the 20A-20D are schematic structural diagrams of several bone conduction speakers according to some embodiments of the present application.
  • the speaker structure does not have a housing bracket.
  • the first element is a connecting piece 2030, and the coil 2020 is connected to the housing 2050 through the connecting piece 2030.
  • the connector 2030 includes a columnar body. One end of the columnar body is connected to the housing 2050. The other end of the columnar body is provided with a round end with a large cross-sectional area, and the round end is fixedly connected to the coil 2020.
  • the connecting piece 2030 is a rigid member, and the connecting piece is made of a material having a Young's modulus greater than 4000Mpa.
  • a gasket may be connected between the coil 2020 and the connecting member 2030.
  • the second component is a vibration transmitting plate 2040.
  • the magnetic circuit assembly 2010 is connected to the vibration transmitting plate 2040, and the vibration transmitting plate 2040 is directly connected to the housing 2050.
  • the vibration transmitting sheet 2040 is an elastic member.
  • the vibration transmitting plate 2040 may be located above the magnetic circuit assembly 2010, and the vibration transmitting plate 2040 may be connected to the upper end surface of the second magnetically permeable element 2008.
  • the vibration transmitting plate 2040 and the second magnetically permeable element 2008 may be connected through a gasket.
  • the vibration transmitting sheet 2040 may be located between the second magnetically permeable element 2008 and the side wall of the housing 2050, and connected to the outside of the second magnetically permeable element 2008.
  • the vibration transmitting sheet 2040 may be further disposed below the magnetic circuit assembly 2010 and connected to the lower surface of the second magnetically permeable element 2008.
  • the coil 2020 is fixedly connected to the back of the housing through a connecting member 2030.
  • the bone conduction speaker 2100 may include a magnetic circuit assembly 2110, a coil 2120, a connector 2130, a vibration transmitting sheet 2140, a housing 2150, and a housing bracket 2160.
  • the housing 2150 can be mechanically vibrated under the driving of the vibration transmitting sheet 2140 to transmit the vibration to the tissues and bones, and the tissues and bones to the auditory nerve, so that the human body can hear sound.
  • the overall rigidity of the casing 2150 is large, so that when the bone conduction earphone 2100 works, the entire casing 2150 vibrates together, which can cancel the sound leakage outside the casing 2150 with each other, and significantly reduce the external sound leakage.
  • the casing 2150 may be provided with a plurality of sound guiding holes 2151.
  • the sound introduction hole 2151 can propagate the sound leakage inside the earphone 2100 to the outside of the housing 2150 and cancel the sound leakage outside the housing 2150, thereby further reducing the sound leakage of the headphones.
  • the vibration of the components inside the housing 2150 will also generate the vibration of the internal air, thereby generating sound leakage.
  • the vibration of the internal components and the vibration of the casing 2150 may be consistent, so that a leakage sound in a direction opposite to that of the casing 2150 can be generated, which can cancel the leakage sound of the casing 2150 and reduce the leakage sound.
  • a damping layer may be provided at the position of the sound introduction hole 2151 on the housing 2150, and the phase and amplitude of the sound can be adjusted to enhance the effect of sound cancellation.
  • the shell of the bone conduction earphone described in this application can be made by different assembling methods.
  • the housing of the bone conduction earphone may be a one-piece molding method, a split combination method, or a combination of the two.
  • different splits can be fixed with glue, or fixed by snapping, welding or screwing.
  • FIGS. 22A-22C describe examples of the assembly manner of the shell of the bone conduction earphone.
  • the housing of the bone conduction earphone may include a housing panel 2222, a housing back 2224, and a housing side 2226.
  • the housing side 2226 and the housing back 2224 are made in an integrated manner, and the housing panel 2222 is connected to one end of the housing side 2226 by a combination of parts.
  • the method of combining the pieces includes using glue to fix or fix the shell panel 2222 at one end of the side 2226 of the shell by snapping, welding or screwing.
  • the case panel 2222 and the case side 2226 (or the case back 2224) may be made of different, the same, or partially the same materials.
  • the shell panel 2222 and the shell side 2226 are made of the same material, and the Young's modulus of the same material is greater than 2000 MPa. More preferably, the Young's modulus of the same material is greater than 4000 MPa. Preferably, the Young's modulus of the same material is greater than 6000 MPa, more preferably, the Young's modulus of the material of the housing 220 is greater than 8000 MPa, more preferably, the Young's modulus of the same material is greater than 12000 MPa, more preferably The Young's modulus of the same material is greater than 15000 MPa, and further preferably, the Young's modulus of the same material is greater than 18000 MPa.
  • the shell panel 2222 and the shell side 2226 are made of different materials, and the Young's modulus of the different materials is greater than 4000 MPa, and more preferably, the Young's modulus of the different materials are greater than 6000 MPa. More preferably, the Young's modulus of the different materials is greater than 8000 MPa, more preferably, the Young's modulus of the different materials is greater than 12000 MPa, and even more preferably, the Young's modulus of the different materials is greater than 15000 MPa. Further preferably, the Young's modulus of the different materials is greater than 18000 MPa.
  • the material of the shell panel 2222 and / or the shell side 2226 includes, but is not limited to, acrylonitrile-butadiene-styrene copolymer (ABS), polystyrene (PS), polystyrene High-impact polystyrene (HIPS), Polypropylene (PP), Polyethylene terephthalate (PET), Polyester (PES), Polycarbonate (PC ), Polyamides (PA), Polyvinyl chloride (PVC), Polyurethanes (PU), Polyvinylidene chloride, Polyethylene (PE), Polymethyl methacrylate (Polymethyl methylmethacrylate (PMMA)), Polyetheretherketone (PEEK), Phenolics (PF), Urea-formaldehyde (UF), Melamine-formaldehyde (MF), and some metals, Alloys (such as aluminum alloys, chromium-molybdenum steels, rhenium alloys, magnesium alloys, titanium alloy
  • the material of the housing panel 710 is any combination of glass fiber, carbon fiber, and materials such as polycarbonate (PC), polyamide (PA), and the like.
  • the material of the shell panel 2222 and / or the shell side 2226 may be made of carbon fiber and polycarbonate (Polycarbonate, PC) according to a certain ratio.
  • the material of the shell panel 2222 and / or the shell side 2226 may be carbon fiber, glass fiber, and polycarbonate (Polycarbonate, PC).
  • the material of the shell panel 2222 and / or the shell side 2226 may be made of glass fiber and polycarbonate (Polycarbonate, PC) according to a certain ratio, and glass fiber and polyamide (Polyamides, PA) may also be used. Made by mixing in a certain proportion.
  • the casing panel 2222, the casing back surface 2224, and the casing side surface 2226 form an overall structure with a certain accommodation space.
  • the vibration transmitting sheet 2214 is connected to the magnetic circuit assembly 2210 through a connecting member 2216.
  • the two sides of the magnetic circuit assembly 2210 are connected to the first magnetically permeable element 2204 and the second magnetically permeable element 2206, respectively.
  • the vibration transmitting sheet 2214 is fixed to the inside of the integrated structure through a housing bracket 2228.
  • the housing side 2226 has a step structure for supporting the housing bracket 2228.
  • the case panel 2222 may be fixed to the case bracket 2228 and the case side 2226 at the same time, or separately fixed to the case bracket 2228 or the case side 2226.
  • the housing side 2226 and the housing bracket 2228 may be integrally formed.
  • the housing bracket 2228 can be directly fixed on the housing panel 2222 (for example, by means of glue sticking, snapping, welding or screwing).
  • the fixed shell panel 2222 and the shell bracket 2228 are then fixed to the side of the shell (for example, by means of glue sticking, snapping, welding or screwing).
  • the housing bracket 2228 and the housing panel 2222 may be integrally formed.
  • the housing bracket 2258 and the housing side 2256 are integrally formed.
  • the housing panel 2252 is fixed on the side of the housing side 2256 that is connected to the housing bracket 2258 (for example, by gluing, snapping, welding or screwing), and the housing back 2254 is fixed on the other side of the housing side 2256 (for example, (Through glue sticking, snapping, welding or screwing).
  • the housing bracket 2258 and the housing side 2256 are separate structures, and the housing panel 2252, the housing back 2254, and the housing bracket 2258 and the housing side 2256 are all pasted and snapped together by glue. , Welding or threaded connection for fixed connection.
  • the housing panel 2282 and the housing side 2286 are integrally formed.
  • the housing back 2284 is fixed on a side of the housing side 2286 opposite to the housing panel 2282 (for example, by means of gluing, snapping, welding, or screwing).
  • the shell bracket 2288 is fixed on the shell panel 2282 and / or the shell side 2286 by means of glue sticking, snapping, welding or screwing.
  • the housing bracket 2288, the housing panel 2282, and the housing side 2286 are integrally formed structures.
  • the housing of a bone-conduction earphone can maintain stable contact with human tissue or bone through the earphone fixing assembly.
  • the headset fixing component and the shell can be connected in different ways.
  • the headphone fixing component and the casing may be integrated, or may be a combination of separate bodies, or a combination of the two.
  • the earphone fixing component can be glued on or fixedly connected to a specific part of the casing by means of snapping or welding.
  • the specific part of the casing includes a casing panel, a casing back, and / or a casing side.
  • FIGS. 23A-23C describe examples of the connection manners of the shells of several bone conduction earphones.
  • an ear hook is used as an earphone fixing component as an example.
  • the ear hook 2330 is fixedly connected to the housing.
  • the fixed connection method includes using glue to fix or fix the ear hook 2330 on the side surface 2326 of the casing or the back surface 2424 of the casing by means of snapping, welding or screwing.
  • the part of the ear hook 2330 that is connected to the shell can be made of the same, different, or partially the same material as the side 2326 of the shell or the back 2324 of the shell.
  • the ear hook 2330 may further include plastic, silicone, and / or metal materials.
  • the ear hook 2330 may include an arc-shaped titanium wire.
  • the ear hook 2330 may be integrally formed with the side surface 2326 or the back surface 2324 of the case.
  • the ear hook 2360 is fixedly connected to the housing.
  • the fixed connection method includes using glue to fix or fix the ear hook 2360 on the side surface 2356 or the back surface 2354 of the casing by means of snapping, welding or screwing.
  • a part of the ear hook 2360 connected to the shell may be made of the same, different, or partially the same material as the side 2356 or the back 2354 of the shell.
  • the ear hook 2360 can be integrally formed with the side of the housing 2356 or the back of the housing 2354.
  • the ear hook 2390 is fixedly connected to the housing.
  • the fixed connection method includes using glue to fix or fix the ear hook 2390 on the side 2386 or the back 2384 of the casing by means of snapping, welding or screwing.
  • the part of the ear hook 2390 connected to the shell may be made of the same, different, or partially the same material as the side 2386 or the back 2384 of the shell.
  • the ear hook 2390 may be formed integrally with the side 2386 of the case or the back 2384 of the case.
  • the rigidity of the housing of a bone conduction earphone affects the amplitude and phase of vibration in different parts of the housing (for example, the housing panel, the back of the housing, and / or the side of the housing), thereby affecting the Missing sound.
  • the housing panel and the back of the housing can maintain the same or substantially the same amplitude and phase of vibration at a higher frequency, thereby significantly reducing the bone conduction earphone. Sound leakage.
  • the higher frequency mentioned here may include a frequency not less than 1000 Hz, for example, a frequency between 1000 Hz-2000 Hz, a frequency between 1100 Hz-2000 Hz, a frequency between 1300 Hz-2000 Hz, and a frequency between 1500 Hz-2000 Hz. Frequency between 1700Hz-2000Hz, frequency between 1900Hz-2000Hz.
  • the higher frequency mentioned herein may include a frequency not less than 2000 Hz, for example, a frequency between 2000 Hz and 3000 Hz, a frequency between 2100 Hz and 3000 Hz, a frequency between 2300 Hz and 3000 Hz, and a frequency between 2500 Hz and 3000 Hz. Frequency, between 2700Hz-3000Hz, or between 2900Hz-3000Hz.
  • the higher frequency mentioned herein may include a frequency not less than 4000 Hz, for example, a frequency between 4000 Hz and 5000 Hz, a frequency between 4100 Hz and 5000 Hz, a frequency between 4300 Hz and 5000 Hz, and a frequency between 4500 Hz and 5000 Hz.
  • Frequency between 4700Hz-5000Hz, or between 4900Hz-5000Hz.
  • the higher frequency mentioned herein may include a frequency not less than 6000 Hz, for example, a frequency between 6000 Hz-8000 Hz, a frequency between 6100 Hz-8000 Hz, a frequency between 6300 Hz-8000 Hz, and a frequency between 6500 Hz-8000 Hz.
  • the higher frequency mentioned herein may include a frequency not less than 8000 Hz, for example, a frequency between 8000 Hz to 12000 Hz, a frequency between 8100 Hz to 12000 Hz, a frequency between 8300 Hz to 12000 Hz, and a frequency between 8500 Hz to 12000 Hz.
  • the ratio of the vibration amplitude of the shell panel and the back of the shell is within a certain range.
  • the ratio of the amplitude of the vibration of the case panel and the back of the case is between 0.3 and 3, preferably, the ratio of the amplitude of the vibration of the case panel and the back of the case is between 0.4 and 2.5, preferably, the amplitude of the vibration of the case panel and the back of the case.
  • the ratio of the vibration amplitude is between 0.5 and 1.5. More preferably, the ratio of the vibration amplitude between the case panel and the back of the case is between 0.6 and 1.4.
  • the ratio of the vibration amplitude of the case panel and the back of the case is between 0.7 and 1.2. , More preferably, the ratio of the amplitude of the vibration between the case panel and the back of the case is between 0.75 and 1.15, more preferably, the ratio of the amplitude of the vibration between the case panel and the back of the case is between 0.8 and 1.1, more preferably, the case panel and The ratio of the amplitude of the vibration on the back of the case is between 0.85 and 1.1, and it is further preferred that the ratio of the amplitude of the vibration on the case panel and the back of the case is between 0.9 and 1.05.
  • the vibrations of the housing panel and the back of the housing may be expressed by other physical quantities capable of characterizing the amplitude of the vibrations.
  • the sound pressure generated by the shell panel and the back of the shell at one point in the space can be used to characterize the vibration amplitude of the shell panel and the back of the shell.
  • the difference between the vibration phase of the case panel and the back of the case is between -90 ° and 90 °, preferably, the difference of the vibration phase of the case panel and the back of the case is between -80 ° and 80 °, preferably, The difference between the vibration phase of the housing panel and the back of the housing is between -60 ° and 60 °, preferably, the difference between the vibration phase of the housing panel and the back of the housing is between -45 ° and 45 °, and more preferably, the housing
  • the difference between the vibration phase of the panel and the back of the case is between -30 ° and 30 °, more preferably, the difference of the vibration phase of the case panel and the back of the case is between -20 ° and 20 °, and more preferably, the case The difference between the vibration phase of the panel and the back of
  • the difference between the vibration phase of the case panel and the back of the case is between -12 ° and 12 °. More preferably, the case The difference between the vibration phase of the panel and the back of the case is between -10 ° and 10 °, more preferably, the difference of the vibration phase of the case panel and the back of the case is between -8 ° and 8 °, and more preferably, the case The difference between the vibration phase of the panel and the back of the housing is between -6 ° and 6 °, more preferably, the housing panel The difference between the vibration phase on the back of the housing is between -5 ° and 5 °. More preferably, the difference between the vibration phase on the housing panel and the back of the housing is between -4 ° and 4 °.
  • the housing panel and The difference between the vibration phase on the back of the housing is between -3 ° and 3 °, more preferably, the difference between the vibration phase on the housing panel and the back of the housing is between -2 ° and 2 °, more preferably, the housing panel and The difference between the vibration phases on the back of the casing is between -1 ° and 1 °. More preferably, the difference between the vibration phases on the back of the casing and the back of the casing is 0 °.
  • FIGS. 24-26 describe several examples of methods for measuring the vibration of the bone-conduction earphone housing.
  • the signal generating device 2420 can provide a driving signal to the bone conduction headset, so that the shell panel 2412 of the housing 2410 generates vibration.
  • a periodic signal for example, a sinusoidal signal
  • the casing panel 2412 performs periodic vibration under the driving of the periodic signal.
  • the rangefinder 2440 transmits a test signal 2450 (for example, a laser) to the housing panel 2412, receives the signal reflected from the housing panel 2412, converts it to a first electrical signal, and sends the signal to the signal testing device 2430.
  • the first electrical signal (also referred to as a first vibration signal) may reflect a vibration state of the housing panel 2412.
  • the signal testing device 2430 can compare the periodic signal generated by the signal generating device 2420 and the first electrical signal measured by the range finder 2440 to obtain a phase difference (also referred to as a first phase difference) between the two signals.
  • the rangefinder 2440 can measure a second electrical signal (also referred to as a second vibration signal) generated by vibration on the back of the housing, and a signal testing device 2430 obtains the interval between the periodic signal and the second electrical signal Phase difference (also known as the second phase difference). Based on the first phase difference and the second phase difference, a phase difference between the case panel 2412 and the back of the case can be obtained.
  • the relationship between the vibration amplitude of the housing panel 2412 and the back of the housing can be determined.
  • a microphone score may be used instead of the rangefinder 2440.
  • the microphone can be placed near the housing panel 2412 and the back of the housing, respectively, and the sound pressure generated by the housing panel 2412 and the back of the housing can be measured to obtain signals similar to the first electrical signal and the second electrical signal, and Based on this, the relationship between the amplitude and phase of the vibration between the casing panel 2412 and the back of the casing is determined.
  • the microphones should preferably be placed relatively close to the housing panel 2412 and the back of the housing (e.g., the vertical distance is less than 10mm), and the distance between the microphone and the housing panel 2412 and the back of the housing is the same or close or close, and the corresponding positions of the microphone and the housing panel 2412 and the back of the housing are the same.
  • FIG. 25 is an exemplary result measured according to FIG. 24.
  • the abscissa represents time, and the ordinate represents the magnitude of the signal.
  • the solid line 2410 represents the periodic signal generated by the signal generating device 2420
  • the dashed line 2520 represents the first electrical signal measured by the rangefinder.
  • the amplitude of the first electrical signal that is, V 1/2 , can reflect the vibration amplitude of the shell panel.
  • the phase difference between the first electrical signal and the periodic signal may be expressed as:
  • t 1 represents a time interval between the periodic signal and adjacent peaks of the first electrical signal
  • t 2 represents a period of the periodic signal
  • the amplitude of the second electrical signal can be obtained.
  • a ratio of an amplitude of the first electrical signal to an amplitude of the second electrical signal may represent a ratio of a vibration amplitude of a casing panel and a vibration amplitude of a back surface of the casing.
  • the second electrical signal The phase difference from the periodic signal can be expressed as:
  • t 1 ′ represents a time interval between the periodic signal and adjacent peaks of the second electrical signal
  • t 2 ′ represents a period of the periodic signal. with The difference between them can reflect the phase difference between the case panel 2412 and the back of the case.
  • the state of the test system should be kept as consistent as possible to avoid causing inaccuracy in the subsequently calculated phase difference. If the test system has a delay during the measurement, the delay of each measurement result needs to be compensated separately, or the delay of the test system must be the same when measuring the panel and the back of the case to offset the effect of the delay.
  • FIG. 26 illustrates another exemplary method of measuring vibration of a bone-conducting earphone housing.
  • FIG. 26 includes two rangefinders 2640 and 2640 '. These two rangefinders can simultaneously measure the vibration of the housing panel and the back of the housing of the bone conduction headset housing 2610, and transmit the first electrical signal and the second electrical signal, which reflect the vibration of the housing panel and the back of the housing, to the signal testing device, respectively. 2630.
  • the two rangefinders 2640 and 2640 ' may be replaced with two microphones, respectively.
  • FIG. 27 is an exemplary result measured according to FIG. 26.
  • the solid line 2710 indicates the first electrical signal reflecting the vibration of the panel of the casing
  • the dotted line 2720 indicates the second electrical signal reflecting the vibration of the back of the casing.
  • the amplitude of the first electrical signal i.e. V 3/2
  • the amplitude of the second electrical signal i.e., V 4/2
  • the vibration amplitude can be reflected back of the housing.
  • the ratio of the vibration amplitude of the case panel and the back of the case is V 3 / V 4 .
  • the phase difference between the first electrical signal and the second that is, the vibration phase difference between the housing panel and the back of the housing, can be expressed as:
  • t 3 ′ represents a time interval between adjacent peaks of the first signal and the second electrical signal
  • t 4 ′ represents a period of the second signal
  • Figures 28 and 29 describe examples of a method for measuring vibration of a bone-conducting headphone case in the presence of a headphone fixing assembly.
  • FIG. 28 The difference between FIG. 28 and FIG. 24 is that the housing 2810 of the bone conduction earphone is fixedly connected to the earphone fixing component 2860, for example, connected by any of the connection methods described elsewhere in this application.
  • the headphone fixing assembly 2860 is further fixed on the fixing device 2870.
  • the fixing device 2870 can keep a part of the earphone fixing component 2860 connected to the stationary component 2860 in a static state.
  • the signal testing device 2830 can obtain the first electrical signal and the second electrical signal respectively reflecting the vibration of the casing panel and the back of the casing, and determine the phase difference between the casing panel and the back of the casing accordingly.
  • FIG. 29 The difference between FIG. 29 and FIG. 26 is that the housing 2910 of the bone conduction earphone is fixedly connected to the earphone fixing component 2960, for example, connected by any of the connection methods described elsewhere in this application.
  • the headphone fixing assembly 2960 is further fixed on the fixing device 2970.
  • the fixing device 2970 can keep a part of the earphone fixing component 2960 connected to the stationary component 2960 in a static state.
  • the signal testing device 2830 can simultaneously obtain the first electrical signal and the second electrical signal reflecting the vibration of the casing panel and the back of the casing, and determine the phase difference between the casing panel and the back of the casing accordingly.
  • aspects of this application can be illustrated and described through several patentable categories or situations, including any new and useful process, machine, product, or combination of materials or their Any new and useful improvements. Accordingly, various aspects of the present application can be executed entirely by hardware, can be executed entirely by software (including firmware, resident software, microcode, etc.), and can also be executed by a combination of hardware and software.
  • the above hardware or software can be called “data block”, “module”, “engine”, “unit”, “component” or “system”.
  • aspects of the present application may manifest as a computer product located in one or more computer-readable media, the product including computer-readable program code.
  • numbers describing components and the number of attributes are used. It should be understood that, for such numbers used in the description of the embodiments, the modifiers "about”, “approximately” or “substantially” are used in some examples. To modify. Unless stated otherwise, “about”, “approximately” or “substantially” indicates that the number allows for ⁇ 20% variation. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximate values, and the approximate values may be changed according to the characteristics required by individual embodiments. In some embodiments, the numerical data should take the specified significant digits into account and adopt a general digits retention method. Although the numerical fields and data used to confirm the breadth of the range in some embodiments of this application are approximate values, in specific embodiments, the setting of such values is as accurate as possible within the feasible range.

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Abstract

本申请实施例公开了一种骨传导扬声器及其测试方法。所述骨传导扬声器包括：磁路组件，用于提供磁场；振动组件，所述振动组件的至少一部分位于所述磁场中，将输入至所述振动组件的电信号转化为机械振动信号；壳体，包含面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，所述壳体容纳所述振动组件，所述振动组件导致所述外壳面板和所述外壳背面振动，所述外壳面板的振动具有第一相位，所述外壳背面的振动具有第二相位，其中，所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。本申请的骨传导扬声器可以显著减低漏音，提高音质。并且结构更为简单，尺寸更小。

Description

一种骨传导扬声器及其测试方法
本申请要求2018年06月15日提交的中国申请号201810624043.5的优先权，其全部内容通过引用并入本文。
技术领域
本申请涉及骨传导耳机领域，特别涉及一种能够改善音质和漏音问题的骨传导扬声器及其测试方法。
背景技术
骨传导扬声器能将电信号转换为机械振动信号，并将机械振动信号通过人体组织及骨骼传入人体的听觉神经，使佩戴者听到声音。由于骨传导扬声器通过机械振动传递声音，在骨传导扬声器工作时，会带动周围的空气振动，产生漏音问题。本申请提供了一种结构简单、体积小巧的骨传导扬声器，其不仅能够显著降低骨传导耳机的漏音，而且可以改善骨传导耳机的音质。
发明内容
本发明的目的在于提供一种骨传导扬声器，目的是简化骨传导扬声器的结构，达到降低漏音，并改善音质的目的。
为了达到上述发明的目的，本发明提供的技术方案如下：
一种骨传导扬声器，包括：磁路组件，用于提供磁场；振动组件，所述振动组件的至少一部分位于所述磁场中，将输入至所述振动组件的电信号转化为机械振动信号；壳体，包含面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，所述壳体容纳所述振动组件，所述振动组件导致所述外壳面板和所述外壳背面振动，所述外壳面板的振动具有第一相 位，所述外壳背面的振动具有第二相位，其中，所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
在一些实施例中，所述外壳面板的振动具有第一振幅，所述外壳背面的振动具有第二振幅，所述第一振幅和所述第二振幅的比值在0.5到1.5的范围之内。
在一些实施例中，所述外壳面板的振动产生第一漏音声波，所述外壳背面的振动产生第二漏音声波，所述第一漏音声波和所述第二漏音声波相互叠加，所述叠加减小所述第一漏音声波的幅值。
在一些实施例中，所述外壳面板与所述外壳背面由杨氏模量大于4000Mpa的材料制成。
在一些实施例中，所述外壳面板和所述外壳背面的面积的差值不超过外壳面板面积的30％。
在一些实施例中，所述骨传导扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接，且所述第一元件的杨氏模量大于4000Mpa。
在一些实施例中，所述外壳面板与所述外壳其它部分通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
在一些实施例中，所述外壳面板和所述外壳背面由纤维增强塑料材料制成。
在一些实施例中，所述骨传导扬声器还包括耳机固定组件，所述耳机固定组件用于保持所述骨传导扬声器与人体的稳定接触；以及所述耳机 固定组件通过弹性部件与所述骨传导扬声器固定连接。
在一些实施例中，所述骨传导扬声器在小于500Hz的频率范围内产生两个低频谐振峰。
在一些实施例中，所述两个低频谐振峰与所述振动组件和所述耳机固定组件的弹性模量有关。
在一些实施例中，所述小于500Hz的频率范围内产生的两个低频谐振峰分别和所述耳机固定组件和所述振动组件对应。
在一些实施例中，所述骨传导扬声器在大于2000Hz的频率范围内产生至少两个高频谐振峰，所述两个高频谐振峰与所述壳体的弹性模量、所述壳体的体积、所述外壳面板的刚度和/或所述外壳背面的刚度有关。
在一些实施例中，所述振动组件包括线圈和传振片；所述线圈的至少一部分位于所述磁场内，并在电信号的驱动下在所述磁场内运动。
在一些实施例中，所述传振片的一端与所述壳体的内表面相接触，所述传振片的另一端与所述磁路组件相接触。
在一些实施例中，所述骨传导扬声器还包括第一元件，其中，所述线圈通过所述第一元件与所述壳体进行连接，且所述第一元件由杨氏模量大于4000Mpa的材料制成。
在一些实施例中，所述骨传导扬声器还包括第二元件，其中，所述磁路系统通过所述第二元件与所述壳体进行连接，所述第一元件的弹性模量大于所述第二元件的弹性模量。
在一些实施例中，所述第二元件为传振片，所述传振片为弹性构件。
在一些实施例中，所述传振片为立体结构，能够在自身厚度空间内进行机械振动。
在一些实施例中，所述磁路组件包括第一磁性元件、第一导磁元件和第二导磁元件；所述第一导磁元件的下表面和所述第一磁性元件的上表面连接；所述第二导磁元件的上表面和所述第一磁性元件的下表面连接；所述第二导磁元件具有凹槽，所述第一磁性元件和所述第一导磁元件固定在所述凹槽内，并与所述第二导磁元件的侧表面之间具有磁间隙。
在一些实施例中，所述磁路组件还包括第二磁性元件；所述第二磁性元件设置在所述第一导磁元件的上方，并且所述第二磁性元件和所述第一磁性元件的磁化方向相反。
在一些实施例中，所述磁路组件还包括第三磁性元件；所述第三磁性元件设置在所述第二导磁元件的下方，并且所述第三磁性元件和所述第一磁性元件的磁化方向相反。
一种骨传导扬声器的测试方法，包括：向骨传导扬声器发送测试信号，所述骨传导扬声器包括振动组件和容纳所述振动组件的壳体，所述壳体包括分别位于所述振动组件两侧的外壳面板和外壳背板，所述振动组件基于所述测试信号导致所述外壳面板和所述外壳背面的振动；获取与所述外壳面板的振动对应的第一振动信号；获取与所述外壳背面的振动对应的第二振动信号；以及基于所述第一振动信号和所述第二振动信号确定所述外壳面板的振动和所述外壳背面的振动的相位差。
在一些实施例中，基于所述第一振动信号和所述第二振动信号确定所述外壳面板的振动和所述外壳背面的振动的相位差，包括：获取所述第 一振动信号的波形和所述第二振动信号的波形；以及基于所述第一振动信号的波形和所述第二振动信号的波形确定所述相位差。
在一些实施例中，基于所述第一振动信号和所述第二振动信号确定所述外壳面板的振动和所述外壳背面的振动的相位差，包括：基于所述第一振动信号和所述测试信号确定所述第一振动信号的第一相位；基于所述第二振动信号和所述测试信号确定所述第二振动信号的第二相位；以及基于所述第一相位和所述第二相位确定所述相位差。
在一些实施例中，所述测试信号为正弦周期信号。
在一些实施例中，获取与所述外壳面板的振动对应的第一振动信号，包括：发射第一激光到所述外壳面板的外表面；接收所述外壳面板的外表面反射所述第一激光产生的第一反射激光；基于所述第一反射激光确定所述第一振动信号。
在一些实施例中，获取与所述外壳背面的振动对应的第二振动信号，包括：发射第二激光到所述外壳背面的外表面；接收所述外壳背面的外表面反射所述第二激光产生的第二反射激光；基于所述第二反射激光确定所述第二振动信号。
一种骨传导扬声器，包括：磁路组件，用于提供磁场；振动组件，所述振动组件的至少一部分位于所述磁场中，将输入至所述振动组件的电信号转化为机械振动信号；壳体，所述壳体容纳所述振动组件；以及耳机固定组件，所述耳机固定组件与所述壳体固定连接，用于保持所述骨传导扬声器与人体的接触，其中，所述壳体具有面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，以及位于所述外壳面板和所述外壳背面之 间的外壳侧面，所述振动组件导致所述外壳面板和外壳背面振动。
在一些实施例中，所述外壳背面和所述外壳侧面为一体成型结构；所述外壳面板与所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
在一些实施例中，所述外壳面板和所述外壳侧面为一体成型结构；所述外壳背面与所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
在一些实施例中，所述骨传导扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接。
在一些实施例中，所述外壳侧面和所述第一元件为一体成型结构；所述外壳面板与所述第一元件的外表面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接；外壳背面与所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
在一些实施例中，所述耳机固定组件和所述外壳背面或所述外壳侧面为一体成型结构。
在一些实施例中，所述耳机固定组件与所述外壳背面或所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
在一些实施例中，所述壳体为柱体，所述外壳面板和所述外壳背面分别为所述柱体的上端面和下端面；以及所述外壳面板和所述外壳背面在所述柱体的垂直于轴线的横截面上的投影面积相等。
在一些实施例中，所述外壳面板的振动具有第一相位，所述外壳背 面的振动具有第二相位；所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
在一些实施例中，所述外壳面板的振动和所述外壳背面的振动包括频率在2000Hz到3000Hz之内的振动。
在一些实施例中，所述外壳面板与所述外壳背面由杨氏模量大于4000Mpa的材料制成。
在一些实施例中，所述骨传导扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接，且所述第一元件的杨氏模量大于4000Mpa。
附图说明
本申请将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示类似的结构，其中：
图1是根据本申请一些实施例所示的一种骨传导耳机的结构模块图；
图2是根据本申请一些实施例所示的一种骨传导耳机的纵截面示意图；
图3是根据本申请一些实施例所示的一种骨传导耳机的部分频率响应曲线；
图4是根据本申请的一些实施例所示的一种骨传导耳机的壳体采用不同杨氏模量的材料时，骨传导耳机的部分频率响应曲线；
图5是根据本申请的一些实施例所示的一种骨传导耳机的传振片在不同刚度下时，骨传导耳机的部分频率响应曲线；
图6是根据本申请的一些实施例所示的一种骨传导耳机的耳机固定组件具有不同刚度时，骨传导耳机的部分频率响应曲线；
图7A是根据本申请一些实施例所示的一种骨传导耳机的壳体结构示意图；
图7B是根据本申请一些实施例所示的产生高阶模态的频率与壳体体积和材料的杨氏模量的关系示意图；
图7C是根据本申请一些实施例所示的骨传导扬声器的音量与壳体体积的关系示意图；
图8是根据本申请的一些实施例所示的壳体降低漏音的原理性示意图；
图9是根据本申请的一些实施例所示的一种骨传导耳机的壳体重量不同时，骨传导耳机的部分频率响应曲线；
图10A是根据本申请的一些实施例所示的一种骨传导耳机的壳体的结构示意图；
图10B是根据本申请的一些实施例所示的一种骨传导耳机的壳体的结构示意图；
图10C是根据本申请的一些实施例所示的一种骨传导耳机的壳体的结构示意图；
图11是传统的骨传导耳机和根据本申请的一些实施例所示的一种骨传导耳机的漏音效果对比图；
图12是骨传导耳机的外壳面板产生的频率响应曲线；
图13是根据本申请的一些实施例所示的外壳面板的结构示意图；
图14A是骨传导耳机的外壳背面产生的频率响应曲线；
图14B是骨传导耳机的外壳侧面产生的频率响应曲线；
图15是骨传导耳机的外壳支架产生的骨传导耳机的频率响应曲线；
图16A是根据本申请的一些实施例所示的一种具有耳机固定组件的骨传导耳机的结构示意图；
图16B是根据本申请的一些实施例所示的另一种具有耳机固定组件的骨传导耳机的结构示意图；
图17是根据本申请的一些实施例所示的一种骨传导耳机的壳体结构示意图；
图18A是根据本申请的一些实施例所示的一种骨传导耳机的传振片的结构示意图；
图18B是根据本申请的一些实施例所示的另一种骨传导耳机的传振片的结构示意图；
图18C是根据本申请的一些实施例所示的另一种骨传导耳机的传振片的结构示意图；
图18D是根据本申请的一些实施例所示的另一种骨传导耳机的传振片的结构示意图；
图19是根据本申请的一些实施例所示的一种具有立体传振片的骨传导耳机的结构示意图；
图20A是根据本申请的一些实施例所示的一种骨传导耳机的结构示意图；
图20B是根据本申请的一些实施例所示的另一种骨传导耳机的结构示意图；
图20C是根据本申请的一些实施例所示的另一种骨传导耳机的结构示意图；
图20D是根据本申请的一些实施例所示的另一种骨传导耳机的结构示意图；
图21是根据本申请的一些实施例所示的一种具有引声孔的骨传导 耳机的结构示意图；
图22A-22C是根据本申请的一些实施例所示的骨传导耳机的结构示意图；
图23A-23C是根据本申请的一些实施例所示的具有耳机固定组件的骨传导耳机的结构示意图；
图24是根据本申请一些实施例所示的一种测量骨传导耳机壳体振动的示例性方法；
图25是按照图24所示方式测得的一个示例性的结果；
图26是根据本申请一些实施例所示的一种测量骨传导耳机壳体振动的示例性方法；
图27是按照图26所示方式测得的一个示例性的结果；
图28是根据本申请一些实施例所示的一种测量骨传导耳机壳体振动的示例性方法；以及
图29是根据本申请一些实施例所示的一种测量骨传导耳机壳体振动的示例性方法；
具体实施方式
为了更清楚地说明本申请的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本发明，而并非以任何方式限制本发明的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、 “一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。其他术语的相关定义将在下文描述中给出。以下，不失一般性，在描述本发明中骨传导相关技术时，将采用“骨传导扬声器”或“骨传导耳机”的描述。该描述仅仅为骨传导应用的一种形式，对于该领域的普通技术人员来说，“扬声器”或“耳机”也可用其他同类词语代替，比如“播放器”、“助听器”等。事实上，本发明中的各种实现方式可以很方便地应用到其它非扬声器类的听力设备上。例如，对于本领域的专业人员来说，在了解骨传导耳机的基本原理后，可能在不背离这一原理的情况下，对实施骨传导耳机的具体方式与步骤进行形式和细节上的各种修正和改变，特别地，在骨传导耳机中加入环境声音拾取和处理功能，使该耳机实现助听器的功能。例如，麦克风等传声器可以拾取使用者/佩戴者周围环境的声音，在一定的算法下，将声音处理后(或者产生的电信号)传送至骨传导扬声器部分。即，骨传导耳机可以经过一定的修改，加入拾取环境声音的功能，并经过一定的信号处理后通过骨传导扬声器部分将声音传递给使用者/佩戴者，从而实现骨传导助听器的功能。作为举例，这里所说的算法可以包括噪声消除、自动增益控制、声反馈抑制、宽动态范围压缩、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制等一种或多种的组合。
图1是根据本申请的一些实施例所示的一种骨传导扬声器100的结构模块图。如图1所示，骨传导扬声器100可以包括磁路组件102、振动组件104、壳体106以及连接组件108。
磁路组件102可以提供磁场。所述磁场可以用于将含有声音信息的信号转化为振动信号。在一些实施例中，所述声音信息可以包括具有特定数据格式的视频、音频文件或者可以通过特定途径转化为声音的数据或文件。所述含有声音信息的信号可以来自于骨传导扬声器100本身的存储组件，也可以来自于骨传导扬声器100以外的信息产生、存储或者传递系统。所述含有声音信息的信号可以包括电信号、光信号、磁信号、机械信号等一种或多种的组合。所述含有声音信息的信号可以来自一个信号源或多个信号源。所述多个信号源可以相关也可以不相关。在一些实施例中，骨传导扬声器100可以通过多种不同的方式获取所述含有声音信息的信号，所述信号的获取可以是有线的或无线的，可以是实时或延时的。例如，骨传导扬声器100可以通过有线或者无线的方式接收含有声音信息的电信号，也可以直接从存储介质上获取数据，产生声音信号。又例如，骨传导助听器中可以包括具有声音采集功能的组件，通过拾取环境中的声音，将声音的机械振动转换成电信号，通过放大器处理后获得满足特定要求的电信号。在一些实施例中，所述有线连接可以包括金属电缆、光学电缆或者金属和光学的混合电缆，例如，同轴电缆、通信电缆、软性电缆、螺旋电缆、非金属护皮电缆、金属护皮电缆、多芯电缆、双绞线电缆、带状电缆、屏蔽电缆、电信电缆、双股电缆、平行双芯导线、双绞线等一种或多种的组合。以上描述的例子仅作为方便说明之用，有线连接的媒介还可以是其它类型，例如，其它电信号或光信号等的传输载体。
无线连接可以包括无线电通信、自由空间光通信、声通讯、和电磁感应等。其中无线电通讯可以包括IEEE802.11系列标准、IEEE802.15系列标准(例如蓝牙技术和蜂窝技术等)、第一代移动通信技术、第二代移动通信技术(例如FDMA、TDMA、SDMA、CDMA、和SSMA等)、通用分组无线服务技术、第三代移动通信技术(例如CDMA2000、WCDMA、TD-SCDMA、 和WiMAX等)、第四代移动通信技术(例如TD-LTE和FDD-LTE等)、卫星通信(例如GPS技术等)、近场通信(NFC)和其它运行在ISM频段(例如2.4GHz等)的技术；自由空间光通信可以包括可见光、红外线讯号等；声通讯可以包括声波、超声波讯号等；电磁感应可以包括近场通讯技术等。以上描述的例子仅作为方便说明之用，无线连接的媒介还可以是其它类型，例如，Z-wave技术、其它收费的民用无线电频段和军用无线电频段等。例如，作为本技术的一些应用场景，骨传导扬声器100可以通过蓝牙技术从其他设备获取含有声音信息的信号。
振动组件104可以产生机械振动。所述振动的产生伴随着能量的转换，骨传导扬声器100可以使用磁路组件102与振动组件104实现含有声音信息的信号向机械振动转换。转换的过程中可能包含多种不同类型能量的共存和转换。例如，电信号通过换能装置可以直接转换成机械振动，产生声音。再例如，声音信息可以包含在光信号中，一种特定的换能装置可以实现由光信号转换为振动信号的过程。其它可以在换能装置工作过程中共存和转换的能量类型包括热能、磁场能等。换能装置的能量转换方式可以包括动圈式、静电式、压电式、动铁式、气动式、电磁式等。骨传导耳机100的频率响应范围以及音质会受到振动组件104的影响。例如，在动圈式换能装置中，振动组件104包括缠绕的柱状线圈和一个振动体(例如，一个振动片)，受信号电流驱动的柱状线圈在磁场中带动振动体振动发声，振动体材质的伸展和收缩、褶皱的变形、大小、形状以及固定方式，永磁体的磁密度等，都会对骨传导扬声器100的音效质量带来影响。振动组件104中振动体可以是镜面对称的结构、中心对称的结构或者非对称的结构；振动体上可以设置有间断的孔状结构，在相同的输入能量下，使振动体产生更大的位移，从而让骨传导扬声器实现更高的灵敏度，提高振动与声音的输出功率；振动体可以是圆环体或者类圆环体结构，在圆环体内设置向中心 辐辏的多个支杆，支杆的个数可以是两个或更多。在一些实施例中，振动组件104可以包括线圈、振动板、传振片等。
壳体106可以将机械振动传递给人体，使人体能够听到声音。壳体106可以构成一个密闭或者非密闭的容置空间，磁路组件102和振动组件104可以设置在壳体106内部。壳体106可以包括外壳面板。外壳面板可以和振动组件104直接或者间接相连接，将振动组件104的机械振动经由骨骼传递到听觉神经，使人体听到声音。
连接组件108可以对磁路组件102、振动组件104和/壳体106起到连接支撑作用。连接组件108可以包括一个或多个连接件。所述一个或多个连接件可以连接壳体106与磁路组件102和/或振动组件104中的一个或者多个结构。
以上对骨传导扬声器结构的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解骨传导扬声器的基本原理后，可能在不背离这一原理的情况下，对实施骨传导扬声器的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，骨传导扬声器100可以包括一个或多个处理器，所述处理器可以执行一个或多个声音信号处理算法。所述声音信号处理算法可以对所述声音信号进行修正或强化。例如对声音信号进行降噪、声反馈抑制、宽动态范围压缩、自动增益控制、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制，或其它类似的，或以上任意组合的处理，这些修正和改变仍在本发明的权利要求保护范围之内。又例如，骨传导扬声器100可以包括一个或多个传感器，例如温度传感器、湿度传感器、速度传感器、位移传感器等。所述传感器可以采集用户信息或环境信息。
图2是根据本申请的一些实施例所示的一种骨传导耳机200的结构 示意图。如图2所示，骨传导耳机200可以包括磁路组件210、线圈212、传振片214、连接件216、以及壳体220。
磁路组件210可以包括第一磁性元件202、第一导磁元件204和第二导磁元件206。在本申请中描述的磁性元件是指可以产生磁场的元件，例如磁铁等。所述磁性元件可以具有磁化方向，所述磁化方向是指在所述磁性元件内部的磁场方向。第一磁性元件202可以包括一个或多个磁铁。在一些实施例中，所述磁铁可以包括金属合金磁铁，铁氧体等。其中，金属合金磁铁可以包括钕铁硼、钐钴、铝镍钴、铁铬钴、铝铁硼、铁碳铝，或类似的，或其中多种的组合。铁氧体可以包括钡铁氧体，钢铁氧体，美锰铁氧体，锂锰铁氧体，或类似的，或其中多种组合。
第一导磁元件204的下表面可以连接第一磁性元件202的上表面。第二导磁元件206可以是一个凹形结构，包括底壁和侧壁。第二导磁元件206的底壁内侧可以连接第一磁性元件202，侧壁可以环绕第一磁性元件202并和第一磁性元件202之间形成一个磁间隙。需要注意的是，这里所说的导磁体也可以称为磁场集中器或铁芯。导磁体可以调整磁场(例如，第一磁性元件202产生的磁场)的分布。所述导磁体可以包括由软磁材料加工而成的元件。在一些实施例中，所述软磁材料可以包括金属材料、金属合金、金属氧化物材料、非晶金属材料等，例如铁、铁硅系合金、铁铝系合金、镍铁系合金、铁钴系合金、低碳钢、硅钢片、矽钢片、铁氧体等。在一些实施例中，可以通过铸造、塑性加工、切削加工、粉末冶金等一种或多种组合的方法加工所述导磁体。铸造可以包括砂型铸造、熔模铸造、压力铸造、离心铸造等；塑性加工可以包括轧制、铸造、锻造、冲压、挤压、拔制等一种或多种组合；切削加工可以包括车削、铣削、刨削、磨削等。在一些实施例中，所述导磁体的加工方法可以包括3D打印、数控机床等。第一导磁元件204、第二导磁元件206与第一磁性元件202之间的连接方式可以包括粘 接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
线圈212可以设置在第一磁性元件202和第二导磁元件206之间的磁间隙中。在一些实施例中，线圈212可以通入信号电流，线圈212处于磁路组件210形成的磁场中，受到安培力的作用，驱动线圈212产生机械振动。同时磁路组件210受到与线圈相反的反作用力。
传振片214的一端可以与磁路组件210连接，另一端可以与壳体220连接。在一些实施例中，传振片214为弹性构件。该弹性由传振片214的材料、厚度、结构等多方面决定。传振片214的材料，包括但不限于，钢材(例如但不限于不锈钢、碳素钢等)、轻质合金(例如但不限于铝合金、铍铜、镁合金、钛合金等)、塑胶(例如但不限于高分子聚乙烯、吹塑尼龙、工程塑料等)，也可以是能达到同样性能的其他单一或复合材料。复合材料可以包括，例如但不限于玻璃纤维、碳纤维、硼纤维、石墨纤维、石墨烯纤维、碳化硅纤维或芳纶纤维等增强材料，或者其它有机和/或无机材料的复合物，例如玻璃纤维增强不饱和聚酯、环氧树脂或酚醛树脂基体组成的各类玻璃钢。在一些实施例中，传振片214的厚度不低于0.005mm，优选地，厚度为0.005mm-3mm，更优选地，厚度为0.01mm-2mm，再优选地，厚度为0.01mm-1mm，进一步优选地，厚度为0.02mm-0.5mm。在一些实施例中，传振片214可以是弹性结构体，所述弹性结构体是指结构本身是弹性结构，即便材料较硬，但是由于结构本身具有弹性，使得传振片214本身具有弹性。例如，传振片214可以制成类似弹簧的弹性结构体。在一些实施例中，传振片214的结构可以设定成环状或者类圆环状结构，优选地，包含至少一个环，优选地，包含至少两个环，可以是同心环，也可以是非同心环，环间通过至少两个支杆相连，支杆从外环向内环中心辐射，进一步优选地，包含至少一个椭圆环，进一步优选地，包含至少两个椭圆环，不同的椭圆环有不同的曲率半径，环之间通过支杆相连，更进一步优选地，传振片214 包含至少一个方形环。传振片214结构也可以设定成片状，优选地，上面设置镂空图案，镂空图案的面积不小于没有镂空的面积。以上描述中材料、厚度、结构可以组合成不同的传振片。例如，环状传振片具有不同的厚度分布，优选地，支杆厚度等于圆环厚度，进一步优选地，支杆厚度大于圆环厚度，更进一步优选地，内环的厚度大于外环的厚度。在一些实施例中，传振片214的部分连接在磁路组件210上，部分连接在壳体220上，优选地，传振片214连接在第一导磁元件204上。在一些实施例中，传振片214可以通过胶水连接在磁路组件210和壳体220上。在一些实施例中，传振片214可以通过焊接、卡接、铆接、螺纹连接(螺钉、螺丝、螺杆、螺栓等)、过盈连接、卡箍连接、销连接、楔键连接、成型连接的方式固定在壳体220上。
在一些实施例中，传振片214可以通过连接件216与磁路组件210连接。在一些实施例中，连接件216的底端可以固定在磁路组件210上，例如，连接件可以固定在第一导磁元件的上表面上。在一些实施例中，连接件216具有与所述底面相对的顶端，且所述顶端可以与传振片214固定连接。在一些实施例中，连接件216的顶端可以通过胶水粘贴在传振片214上。
壳体220具有外壳面板222、外壳背面224和外壳侧面226。外壳背面224位于与外壳面板222相对的一面，并分别设置在外壳侧面226的两端面上。外壳面板222、外壳背面224和外壳侧面226形成具有一定容置空间的整体结构。在一些实施例中，磁路组件210、线圈212和传振片214固定在壳体220内部。在一些实施例中，骨传导耳机200还可以包括外壳支架228，传振片214可以通过外壳支架228与壳体220连接，在一些实施例中，线圈212可以固定在外壳支架228上，并通过外壳支架228带动外壳220振动。其中，外壳支架228可以是壳体220的一部分，也可以是 单独的组件，直接或者间接连接于壳体220的内部，在一些实施例中，外壳支架228固定在外壳侧面226的内表面上。在一些实施例中，外壳支架228可以通过胶水粘贴在壳体220上，也可以通过冲压、注塑、卡接、铆接、螺纹连接或焊接固定在壳体220上。
在一些实施例中，骨传导扬声器100还包括耳机固定组件(在图2中未画出)。耳机固定组件与壳体220固定连接，并保持骨传导扬声器100与人体组织或骨骼的稳定接触，避免骨传导扬声器100的晃动，保证耳机能够稳定的进行声音传递。在一些实施例中，耳机固定组件可以是弧形的弹性部件，能够形成向弧形中部回弹的力。耳机固定组件的两端分别连接有一壳体220，将两端的壳体220与人体组织或骨骼保持接触。关于耳机固定组件更详细的描述请参见本申请中其他地方的说明，例如，图16以及相关描述。
图3是根据本申请一些实施例所示的一种骨传导扬声器的频率响应曲线。横轴为振动频率，纵轴为骨传导扬声器200的振动强度。这里所说的振动强度可以表示为骨传导扬声器200的振动加速度。在一些实施例中，在频率从1000Hz～10000Hz的频响范围内，频响曲线越平坦，则认为骨传导扬声器200表现出的音质越好。骨传导扬声器200的结构、零部件的设计、材料属性等都可能对频响曲线产生影响。一般的，低频指的是小于500Hz的声音，中频指是500Hz-4000Hz范围的声音，高频是指大于4000Hz的声音。如图3所示，骨传导扬声器200的频率响应曲线可以在低频区具有两个谐振峰(310和320)，在高频区具有第一高频谷330、第一高频峰340和第二高频峰350。低频区的两个谐振峰(310和320)可以为传振片214和耳机固定组件共同作用产生。第一高频谷330和第一高频峰340可以为外壳侧面226在高频下变形而产生的，第二高频峰350可以为外壳面板222在高频下变形产生的。
所述不同谐振峰、高频峰/谷的位置与对应组件的刚度有关。所述刚度是材料或结构受力时抵抗弹性变形的能力。刚度和材料本身的杨氏模量及结构尺寸有关。刚度越大，结构受力时变形越小。如上所述，频率从500Hz～6000Hz的频响对于骨传导扬声器尤为关键，在这个频率范围内，不希望出现很尖锐的峰谷，频响曲线越平坦，耳机的音质越好。在一些实施例中，可以通过调整外壳面板222和外壳背面224的刚度，可以将高频区的峰谷调节至更高频的区域。在一些实施例中，外壳支架228也可以影响高频区的峰谷。通过调整外壳支架228的刚度，可以将高频区的峰谷调节至更高频的区域。在一些实施例中，可以使得骨传导扬声器的频率响应曲线的有效频段至少能覆盖500Hz～1000Hz，或者1000Hz～2000Hz。更优选地，500Hz～2000Hz，更优选地，500Hz～4000Hz，更优选地，500Hz～6000Hz，更优选地，100Hz～6000Hz，更优选地，100Hz～10000Hz。这里所指的有效频段是指根据业内通用的标准设定的，例如，IEC和JIS。在一些实施例中，有效频段中没有频率宽度范围超过1/8倍频程的，且峰值/谷值大小超过平均振动强度10dB的峰/谷。
在一些实施例中，不同组件(例如，壳体220和外壳支架228)的刚度与其材料的杨氏模量、厚度、大小及体积等有关。图4是根据本申请的一些实施例所示的一种骨传导扬声器的壳体由不同杨氏模量的材料制成时，骨传导扬声器的频率响应曲线。需要说明的是，如前所述，壳体220可以包括外壳面板222、外壳背面224和外壳侧面226。外壳面板222、外壳背面224和外壳侧面226可以采用同样的材料制成，也可以采用不同的材料制成。例如，外壳背面224和外壳面板222可以采用同种的材料，外壳侧面226可以采用其他材料制成。在图4中，壳体220可以是外壳面板222、外壳背面224和外壳侧面226采用同样的材料制成的，这样可以清楚说明壳体材料的杨氏模量的变化对骨传导耳机的频率响应曲线的影响。从图4 中，对比杨氏模量为18000MPa、6000MPa和2000MPa三种不同材料制成的同样尺寸壳体220的频响曲线，可以发现：在尺寸不变的条件下，壳体220材料的杨氏模量越大，壳体220的刚度越大，频响曲线中高频峰的频率也会更高。这里所说的壳体的刚度可以表征为壳体的弹性模量，即壳体在受力时，发生的形状的改变。当壳体的结构和尺寸一定时，壳体的刚度随着制成壳体材料的杨氏模量的增大而增大。在一些实施例中，可以通过调整壳体220材料的杨氏模量，将频响曲线在高频的峰向更高频率调整。在一些实施例中，壳体220材料杨氏模量可以大于2000MPa，优选地，壳体220材料的杨氏模量可以大于4000MPa，优选地，壳体220材料的杨氏模量大于6000MPa，优选地，壳体220材料的杨氏模量大于8000MPa，优选地，壳体220材料的杨氏模量大于12000MPa，更优选地，壳体220材料的杨氏模量大于15000MPa，进一步优选地，壳体220材料的杨氏模量大于18000MPa。
在一些实施例中，通过调整壳体220的刚度，可以使骨传导耳机的频响曲线中的高频峰频率不小于1000Hz，优选地，可以使高频峰频率不小于2000Hz，优选地，可以使高频峰频率不小于4000Hz，优选地，可以使高频峰频率不小于6000Hz，更优选地，可以使高频峰频率不小于8000Hz，更优选地，可以使高频峰频率不小于10000Hz，更优选地，可以使高频峰频率不小于12000Hz，进一步优选地，可以使高频峰频率不小于14000Hz，进一步优选地，可以使高频峰频率不小于16000Hz，进一步优选地，可以使高频峰频率不小于18000Hz，进一步优选地，可以使高频峰频率不小于20000Hz。在一些实施例中，通过调整壳体220的刚度，可以使骨传导耳机的频响曲线中的高频峰频率位于人耳听力范围之外。在一些实施例中，通过调整壳体220的刚度，可以使耳机的频响曲线中的高频峰频率位于人耳听力范围之内。在一些实施例中，当有多个高频峰/谷时，通过调整壳体220的刚度， 可以使骨传导耳机的频响曲线中的一个或多个高频峰/谷频率位于人耳听力范围之外，其余的一个或多个高频峰/谷频率位于人耳听力范围之内。例如，可以使第二高频峰350位于人耳听力范围之外，使第一高频谷330和第一高频峰340位于人耳听力范围之内。
在一些实施例中，可以通过设计外壳面板222、外壳背面224和外壳侧面226的连接方式确保壳体220具有较大的刚度。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226可以是一体成型。在一些实施例中，外壳背面224和外壳侧面226可以是一体成型结构。外壳面板222和外壳侧面226可以通过胶水直接粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。所述胶水可以是粘性强、硬度较大的胶水。在一些实施例中，外壳面板222和外壳侧面226可以是一体成型结构，外壳背面224和外壳侧面226之间可以通过胶水直接粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226都是独立的部件，三者之间可以通过胶水、卡接、焊接或螺纹连接方式中的一种或任意几种的组合进行固定连接。例如，外壳面板222和外壳侧面226之间通过胶水连接，外壳背面224和外壳侧面226之间通过卡接、焊接或螺纹连接进行连接。或是外壳背面224和外壳侧面226之间通过胶水连接，外壳面板222和外壳侧面226之间通过卡接、焊接或螺纹连接进行连接。
在一些实施例中，可以通过选用相同或者不同杨氏模量的材料进行搭配，提高壳体220的整体刚度。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226可以都采用一种材料制成。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226可以采用不同的材料制成，不同材料可以具有相同的杨氏模量或是不同的杨氏模量。在一些实施例中，外壳面板222和外壳背面224采用同样的材料制成，外壳侧面226采用其他 材料制成，两种材料的杨氏模量可以相同，也可以不同。例如，外壳侧面226的材料的杨氏模量可以大于外壳面板222和外壳背面224的材料的杨氏模量，或是外壳侧面226的材料的杨氏模量可以小于外壳面板222和外壳背面224的材料的杨氏模量。在一些实施例中，外壳面板222和外壳侧面226采用同样的材料制成，外壳背面224采用其他材料制成，两种材料的杨氏模量可以相同，也可以不同。例如，外壳背面224的材料的杨氏模量可以大于外壳面板222和外壳侧面226的材料的杨氏模量，或是外壳背面224的材料的杨氏模量可以小于外壳面板222和外壳侧面226的材料的杨氏模量。在一些实施例中，外壳背面224和外壳侧面226采用同样的材料制成，外壳面板222采用其他材料制成，两种材料的杨氏模量可以相同，也可以不同。例如，外壳面板222的材料的杨氏模量可以大于外壳背面224和外壳侧面226的材料的杨氏模量，或是外壳面板222的材料的杨氏模量可以小于外壳背面224和外壳侧面226的材料的杨氏模量。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226的材料都不同，三种材料的杨氏模量可以全都相同或是全不相同，且三种材料的杨氏模量均大于2000MPa。
图5是根据本申请的一些实施例所示的当骨传导耳机的传振片具有不同的刚度时，骨传导耳机的频率响应曲线。图6是根据本申请的一些实施例所示的一种骨传导耳机的耳机固定组件具有不同刚度时，骨传导耳机的频率响应曲线。由图5和图6可知，低频区的两个谐振峰与传振片和耳机固定组件有关。传振片214和耳机固定组件的刚度越小时，谐振峰在低频的响应越明显。传振片214和耳机固定组件的刚度越大时，谐振峰会向中频或高频方向变化，导致音质下降。因此，传振片214和耳机固定组件的刚度较小时，本身结构的弹性越好，耳机的音质越好。在一些实施例中，通过调整传振片214和耳机固定组件的刚度，可以使骨传导耳机低频区的 两个谐振峰频率均小于2000Hz，优选地，可以使骨传导耳机低频区的两个谐振峰频率均小于1000Hz，更优选地，可以使骨传导耳机低频区的两个谐振峰频率均小于500Hz。在一些实施例中，骨传导耳机低频区的两个谐振峰的峰值相差不大于150Hz，优选地，骨传导耳机低频区的两个谐振峰的峰值相差不大于100Hz，更优选地，骨传导耳机低频区的两个谐振峰的峰值相差不大于50Hz。
如上所述，本申请可以通过对骨传导扬声器各部件的刚度(例如，壳体、外壳支架、传振片或耳机固定组件)的调整，将高频区的峰/谷向更高频率调整，将低频谐振峰向低频调整，保证在500Hz～6000Hz范围内频响曲线平台，提高骨传导耳机的音质。
另一方面，骨传导扬声器在进行振动传递的过程中会产生漏音。所述漏音是指骨传导扬声器200的内部部件振动或壳体的振动而导致周围空气的体积发生变化，使周围空气形成压缩区或稀疏区并向四周传播，导致向周围环境传递声音，使得除了骨传导耳机的佩戴者之外的人员能够听到耳机发出的声音。本申请可以从改变壳体结构、刚度等角度，提供降低骨传导耳机漏音的解决方案。
图7A是根据本申请一些实施例所示的一种骨传导耳机的壳体结构示意图。如图7所示，壳体700可以包括外壳面板710、外壳背面720和外壳侧面730。外壳面板710与人体接触，将骨传导耳机的振动传递给人体的听觉神经。在一些实施例中，当壳体700的整体刚度较大时，在一定的频率范围内，外壳面板710和外壳背面720的振动幅度和相位保持相同或基本相同(外壳侧面730不压缩空气因而不产生漏音)，使得外壳面板710产生的第一漏音信号和外壳背面720产生的第二漏音信号能够相互叠加。所述叠加可以减小第一漏音声波或第二漏音声波的幅值，从而达到降低壳体700漏音的目的。在一些实施例中，所述的一定频率范围至少包括频率大于 500Hz的部分。优选地，所述的一定频率范围至少包括频率大于600Hz的部分。优选地，所述的一定频率范围至少包括频率大于800Hz的部分。优选地，所述的一定频率范围至少包括频率大于1000Hz的部分。优选地，所述的一定频率范围至少包括频率大于2000Hz的部分。更优选地，所述的一定频率范围至少包括频率大于5000Hz的部分。更优选地，所述的一定频率范围至少包括频率大于8000Hz的部分。进一步优选地，所述的一定频率范围至少包括频率大于10000Hz的部分。更多关于骨传导耳机的壳体结构的描述可以参考本申请中其他地方的描述(例如，图22A-22C，及其相关描述)。
当频率超过一定阈值时，壳体700上的特定部位(例如，外壳面板710、外壳背面720和外壳侧面730)在振动时会产生高阶模态(即所述特定部位上不同的点会出现振动不一致的情况)。在一些实施例中，可以通过设计壳体700的壳体体积和材料，使得产生所述高阶模态的频率较高。图7B是根据本申请一些实施例所示的产生高阶模态的频率与壳体体积和材料的杨氏模量的关系示意图。为方便描述，这里认为壳体700上不同部位(例如，外壳面板710、外壳背面720和外壳侧面730)采用具有相同杨氏模量的材料构成。需要知道的是，对于本领域的技术人员来说，当壳体700上不同部位由不同杨氏模量的材料构成时(例如，如本申请中其他地方的实施例所示的情况)，仍然可以获得类似的结果。如图7B所示，虚线712表示当材料的杨氏模量为15GPa时，壳体700产生高阶模态的频率与壳体体积的关系。具体的，当壳体材料的杨氏模量为15GPa时，壳体700的壳体体积越小，其产生高阶模态的频率越高。例如，当壳体体积为25000mm 3时，壳体700产生高阶模态的频率在4000Hz附近，当壳体体积为400mm 3时，壳体700产生高阶模态的频率在32000Hz以上。类似的，虚线713表示当壳体材料的杨氏模量为5GPa时，壳体700产生高阶模态的频率与壳 体体积的关系。实线714表示当壳体材料的杨氏模量为2GPa时，壳体700产生高阶模态的频率与壳体体积的关系。由此可知，当壳体体积越小，壳体材料的杨氏模量越大时，壳体700产生高阶模态的频率越高。在一些实施例中，可以使得壳体700的体积在400mm 3-6000mm 3的范围内，同时壳体材料的杨氏模量在2GPa-18GPa之间，优选地，壳体体积在400mm 3-5000mm 3的范围内，同时壳体材料的杨氏模量在2GPa-10GPa之间，更优选地，壳体体积在400mm 3-3500mm 3的范围内，同时壳体材料的杨氏模量在2GPa-6GPa之间，壳体体积在400mm 3-3000mm 3的范围内，同时壳体材料的杨氏模量在2GPa-5.5GPa之间，更优选地，壳体体积在400mm 3-2800mm 3的范围内，同时壳体材料的杨氏模量在2GPa-5GPa之间，更优选地，壳体体积在400mm 3-2000mm 3的范围内，同时壳体材料的杨氏模量在2GPa-4GPa之间，进一步优选地，壳体体积在400mm 3-1000mm 3的范围内，同时壳体材料的杨氏模量在2GPa-3GPa之间。
需要知道的是，当壳体体积越大时，壳体700内部能容纳更大的磁路系统，从而使得骨传导扬声器的具有更高的灵敏度。在一些实施例中，骨传导扬声器的灵敏度可以由一定输入信号下，骨传导扬声器产生的音量大小来反映。当输入相同信号时，骨传导扬声器产生的音量越大，则表示该骨传导扬声器的灵敏度越高。图7C是根据本申请一些实施例所示的骨传导扬声器的音量与壳体体积的关系示意图。如图7C所示，横坐标表示壳体体积的大小，纵坐标表示在相同输入信号的情况下骨传导扬声器的音量大小(以相对于参考音量的大小，即相对音量，来表示)。骨传导扬声器的音量随着壳体体积的增大而变大。例如，当壳体体积为3000mm 3时，骨传导扬声器的相对音量为1，当壳体体积为400mm 3时，骨传导扬声器的相对音量介于0.25到0.5之间。在一些实施例中，为了使得骨传导扬声器具有较高的灵敏度(音量)，壳体体积可以是2000mm 3-6000mm 3，优选地，壳 体体积可以是2000mm 3-5000mm 3，优选地，壳体体积可以是2800mm 3-5000mm 3，优选地，壳体体积可以是3500mm 3-5000mm 3，优选地，壳体体积可以是1500mm 3-3500mm 3，优选地，壳体体积可以是1500mm 3-2500mm 3。
图8是壳体700降低漏音的原理性示意图。如图8所示，骨传导扬声器处于工作状态时，外壳面板710与人体接触并进行机械振动。在一些实施例中，外壳面板710可以与人脸部皮肤进行接触，对接触的皮肤产生一定程度的挤压，使得外壳面板710周边的皮肤向外突出，发生变形。当外壳面板710振动中，向人脸方向运动，对皮肤进行挤压，推动外壳面板710周边变形的皮肤向外突出，对外壳面板710周围的空气形成压缩。而当外壳面板向远离人脸的方向运动时，会在外壳面板710和人脸皮肤之间形成稀疏区，对外壳面板710周围的空气形成吸收。这种对空气的压缩和吸收，导致了外壳面板710周围空气的体积的不断变化，使周围空气不断形成压缩区或稀疏区并向四周传播，向周围环境传递声音，从而产生漏音。如果壳体700的刚度足够大，使得外壳背面720能够和外壳面板710一起振动，振动的大小和方向一致，当外壳面板710向人脸方向运动时，外壳背面720也随之向人脸方向运动，就会在外壳背面720的周围形成空气的稀疏区，即当外壳面板710周围对空气进行压缩时，外壳背面720的周围会对空气进行吸收。而当外壳面板710向远离人脸方向运动时，外壳背面720也随之向远离人脸方向运动，在外壳背面720的周围形成空气的压缩区，即在外壳面板710周围对空气进行吸收时，外壳背面720的周围会对空气进行压缩。这种外壳背面720和外壳面板710对空气作用的相反效果，使得骨传导耳机对周边空气的作用可以相互抵消，即外部漏音可以相互抵消，达到显著降低壳体700外部的漏音的效果。也就是说可以通过提高壳体700的整体刚度，来保证外壳背面720和外壳面板710振动一致，而外 壳侧面720不推动空气，不会产生漏音，就可使得外壳背面720和外壳面板710的漏音相消，大大降低壳体700外部的漏音。
在一些实施例中，壳体700的刚度较大，能够保证外壳面板710和外壳背面720振动一致，从而使得壳体700外部的漏音能够相互抵消，达到显著降低漏音的目的。在一些实施例中，壳体700的刚度较大，能够减少外壳面板710和外壳背面720在中低频范围内的漏音。
在一个实施例中，提高壳体700的刚度可以通过提高外壳面板710、外壳背面720和外壳侧面730的刚度实现。外壳面板710的刚度和材料的杨氏模量、尺寸、重量等参数有关。材料的杨氏模量越大，外壳面板710的刚度越大。在一些实施例中，外壳面板710材料的杨氏模量大于2000Mpa，优选地，外壳面板710材料的杨氏模量大于3000Mpa，外壳面板710材料的杨氏模量大于4000Mpa，优选地，外壳面板710材料的杨氏模量大于6000Mpa，优选地，外壳面板710材料的杨氏模量大于8000Mpa，优选地，外壳面板710材料的杨氏模量大于12000Mpa，更优选地，外壳面板710材料的杨氏模量大于15000Mpa，进一步优选地，外壳面板710材料的杨氏模量大于18000Mpa。在一些实施例中，外壳面板710材料包括但不限于丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile butadiene styrene,ABS)、聚苯乙烯(Polystyrene,PS)、高冲击聚苯乙烯(High impact polystyrene,HIPS)、聚丙烯(Polypropylene,PP)、聚对苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚酯(Polyester,PES)、聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)、聚氯乙烯(Polyvinyl chloride,PVC)、聚氨酯(Polyurethanes,PU)、聚二氯乙烯(Polyvinylidene chloride)、聚乙烯(Polyethylene,PE)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)、聚醚醚酮(Polyetheretherketone,PEEK)、酚醛树脂(Phenolics,PF)、尿素甲醛树脂(Urea-formaldehyde,UF)、三聚氰胺-甲醛树脂(Melamine  formaldehyde,MF)以及一些金属、合金(如铝合金、铬钼钢、钪合金、镁合金、钛合金、镁锂合金、镍合金等)、玻璃纤维或碳纤维中的任意材料或上述任意材料的组合。在一些实施例中，外壳面板710的材料为玻璃纤维、碳纤维与聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)等材料的任意组合。在一些实施例中，外壳面板710材料可以是碳纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板710材料可以是碳纤维、玻璃纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板710材料可以是玻璃纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成，也可以使玻璃纤维和聚酰胺(Polyamides,PA)按照一定比例混合制成。加入不同比例的碳纤维或玻璃纤维，得到的材料的刚度不同。例如，加入20％～50％的玻璃纤维，材料的杨氏模量可以达到4000MPa～8000MPa。
在一些实施例中，外壳面板710的厚度越大，外壳面板710的刚度越大。在一些实施例中，外壳面板710的厚度不小于0.3mm，优选地，外壳面板710的厚度不小于0.5mm，更优选地，外壳面板710的厚度不小于0.8mm，更优选地，外壳面板710的厚度不小于1mm。但是随着厚度的增加，壳体700的重量也会增加，从而增加骨传导耳机的自重，导致耳机的灵敏度受到影响。因此，外壳面板710的厚度不宜太大。在一些实施例中，外壳面板710的厚度不超过2.0mm，优选地，外壳面板710的厚度不超过1.5mm，优选地，外壳面板710的厚度不超过1.2mm，更优选地，外壳面板710的厚度不超过1.0mm，更优选地，外壳面板710的厚度不超过0.8mm。
在一些实施例中，外壳面板710可以设置成不同形状。例如，外壳面板710可以设置成长方形、近似长方形(即跑道形，或是将长方形四个角替换成弧形的结构)、椭圆形或者其他任意形状。外壳面板710的面积越 小，外壳面板710的刚度则越大。在一些实施例中，外壳面板710的面积不大于8cm 2，优选地，外壳面板710的面积不大于6cm 2，优选地，外壳面板710的面积不大于5cm 2，更优选地，外壳面板710的面积不大于4cm 2，更优选地，外壳面板710的面积不大于2cm 2。
在一些实施例中，壳体700的刚度可以通过调节壳体700的重量实现。壳体700的重量越重，壳体700的刚度越大。但是壳体700的重量越重，耳机的自重也会随之增加，影响骨传导耳机的佩戴舒适度。并且壳体700的重量越重，耳机整体的灵敏度也会变低。图9是根据本申请的一些实施例所示的一种骨传导耳机的壳体重量不同时，骨传导耳机的频率响应曲线。如图9所示，壳体重量越重时，高频的频率响应曲线整体向低频方向变化，使得耳机的频率响应曲线在中高频出现峰/谷，音质变差。在一些实施例中，壳体700的重量小于等于8克，优选地，壳体700的重量小于等于6克，更优选地，壳体700的重量小于等于4克，进一步优选地，壳体700的重量小于等于2克。
在一些实施例中，可以通过同时调节外壳面板710的杨氏模量、厚度、重量、形状等因素中的任意几种的组合，来提高外壳面板710的刚度。例如，可以通过调节杨氏模量和厚度得到理想的刚度。或是可以通过调节杨氏模量、厚度和重量来得到理想的刚度。在一些实施例中，外壳面板710的材料的杨氏模量不小于2000MPa，厚度不小于1mm。在一些实施例中，外壳面板710的材料的杨氏模量不小于4000MPa，厚度不小于0.9mm。在一些实施例中，外壳面板710的材料的杨氏模量不小于6000MPa，厚度不小于0.7mm，。在一些实施例中，外壳面板710的材料的杨氏模量不小于8000MPa，厚度不小于0.6mm。在一些实施例中，外壳面板710的材料的杨氏模量不小于10000MPa，厚度不小于0.5mm。在一些实施例中，外壳面板710的材料的杨氏模量不小于18000MPa，厚度不小于0.4mm。
在一些实施例中，壳体可以是能够整体一起振动的任意形状，不限于图7所示的形状。在一些实施例中，壳体可以是外壳面板和外壳背面在同一平面上的投影面积相等的任意形状。在一些实施例中，壳体900可以是柱体，如图10A所示，所述外壳面板910和所述外壳背面930分别为所述柱体的上端面和下端面，外壳侧面920是柱体的侧边。外壳面板910和外壳背面930在所述柱体上垂直于轴线的横截面上投影面积相等。在一些实施例中，外壳背面和外壳侧面的投影面积的和，与外壳面板的投影面积相等。例如，壳体900可以为近似半球体的形状，如图10B所示，外壳面板910可以是一平面或曲面，外壳侧面920可以是曲面(例如，碗状曲面)，以平行于所述外壳面板910的平面为投影面，外壳背面920可以是投影面积小于外壳面板910的投影面积的平面或曲面，外壳侧面920和外壳背面930的投影面积的和，与外壳面板910的投影面积相等。在一些实施例中，壳体面向人体的一侧的投影面积，与壳体背向人体的一侧的投影面积相等。例如，如图10C所示，外壳面板910和外壳背面930为相对的曲面，外壳侧面920为由外壳面板910向外壳背面过渡的曲面，外壳侧面920的一部分与外壳面板910位于同一侧，外壳侧面920的另一部分与外壳背面930位于同一侧，以横截面积最大的横截面为投影平面，外壳侧面920的一部分与外壳面板910的投影面积和，与外壳侧面920的另一部分与外壳背面930的投影面积和相等。在一些实施例中，外壳面板和外壳背面的面积的差值不超过外壳面板面积的50％，优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的40％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的30％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的25％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的20％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的15％，更优选地，外壳面板和外壳背面 的面积的差值不超过外壳面板面积的12％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的10％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的8％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的5％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的3％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的1％，更优选地，外壳面板和外壳背面的面积的差值不超过外壳面板面积的0.5％，更优选地，外壳面板和外壳背面的面积相等。
图11是传统的骨传导扬声器和根据本申请的一些实施例所示的一种骨传导扬声器的漏音相消的效果对比图。其中，传统的骨传导扬声器是指采用常规杨氏模量的材料制成的壳体构成的骨传导扬声器。图11中，虚线为传统骨传导扬声器的漏音曲线，实线为本申请的骨传导扬声器的漏音曲线。设定低频时传统扬声器的漏音为0，即以低频时传统扬声器的漏音相消为基准，绘制漏音相消的曲线。可以看出本申请的骨传导扬声器的漏音相消效果显著比传统扬声器要好。在低频部分(例如，频率小于100Hz的部分)，漏音相消的效果最好，相比传统的骨传导扬声器可以降低40dB的漏音，随着频率的升高，漏音相消的程度逐渐变弱，在1000Hz相比传统的骨传导扬声器可以降低20dB的漏音，而在4000Hz只能降低5dB的漏音。在一些实施例中，上述对比测试结果可以通过仿真模拟的方式得到。在一些实施例中，上述对比测试结果可以通过实体测试的方式得到。例如，可以将骨传导扬声器放置在安静环境中，向骨传导扬声器中输入信号电流，在骨传导扬声器周围空间内布置麦克风接收声音信号，从而测得漏音的大小。
由图11中的结果可见，在中低频时，本申请的骨传导扬声器壳体振动一致性较好，能够抵消大部分的漏音，其降漏音的效果显著好于传统骨 传导耳机。但是，发生高频振动时，由于壳体很难再保持一个整体进行一起振动，仍然会存在比较严重的漏音。一方面，由于高频时，即使采用杨氏模量很大的材料，壳体也难免会发生变形。当外壳面板和外壳背面发生变形后，并且变形不一致时(例如，外壳面板和外壳背面本身在高频时会出现高阶模态)，两者产生的漏音就不会相互抵消，从而导致漏音。并且，在高频时，外壳侧面也会出现变形，导致外壳面板和外壳背面变形加大，漏音变大。
图12是骨传导扬声器的外壳面板的频率响应曲线。在中低频时，壳体作为整体一起运动，外壳面板和外壳背面振动的大小、速度和方向都相同。在高频时，外壳面板出现高阶模态(即外壳面板上的点的振动不一致)，壳体也会由于高阶模态的存在，频率响应曲线出现明显的峰值(参见图12所示)。在一些实施例中，可以调节外壳面板的材料的杨氏模量、重量和/或尺寸来调节峰值频率。在一些实施例中，外壳面板材料的杨氏模量可以大于2000MPa，优选地，材料的杨氏模量可以大于4000MPa，优选地，材料的杨氏模量大于6000MPa，优选地，材料的杨氏模量大于8000MPa，优选地，材料的杨氏模量大于12000MPa，更优选地，材料的杨氏模量大于15000MPa，进一步优选地，材料的杨氏模量大于18000MPa。在一些实施例中，外壳面板上出现高阶模态的最小频率不小于4000Hz，优选地，外壳面板上出现高阶模态的最小频率不小于6000Hz，更优选地，外壳面板上出现高阶模态的最小频率不小于8000Hz，更优选地，外壳面板上出现高阶模态的最小频率不小于10000Hz，更优选地，外壳面板上出现高阶模态的最小频率不小于15000Hz，更优选地，外壳面板上出现高阶模态的最小频率不小于20000Hz。
在一些实施例中，通过调整外壳面板的刚度，可以使外壳面板频率响应曲线中的峰值频率大于1000Hz，优选地，可以使峰值频率大于2000Hz， 优选地，可以使峰值频率大于4000Hz，优选地，可以使峰值频率大于6000Hz，更优选地，可以使峰值频率大于8000Hz，更优选地，可以使峰值频率大于10000Hz，更优选地，可以使峰值频率大于12000Hz，进一步优选地，可以使峰值频率大于14000Hz，进一步优选地，可以使峰值频率大于16000Hz，进一步优选地，可以使峰值频率大于18000Hz，进一步优选地，可以使峰值频率大于20000Hz。
在一些实施例中，外壳面板可以由一种材料组成。在一些实施例中，外壳面板可以由两种或两种以上的材料叠层设置而成。在一些实施例中，外壳面板可以由一层杨氏模量较大的材料，外加一层杨氏模量较小的材料组合而成。这样的好处是在保证外壳面板的刚度要求的同时，还可以增加与人体接触的舒适性，提高外壳面板和人体接触的配合度。在一些实施例中，杨氏模量较大的材料可以为丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile butadiene styrene,ABS)、聚苯乙烯(Polystyrene,PS)、高冲击聚苯乙烯(High impact polystyrene,HIPS)、聚丙烯(Polypropylene,PP)、聚对苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚酯(Polyester,PES)、聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)、聚氯乙烯(Polyvinyl chloride,PVC)、聚氨酯(Polyurethanes,PU)、聚二氯乙烯(Polyvinylidene chloride)、聚乙烯(Polyethylene,PE)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)、聚醚醚酮(Polyetheretherketone,PEEK)、酚醛树脂(Phenolics,PF)、尿素甲醛树脂(Urea-formaldehyde,UF)、三聚氰胺-甲醛树脂(Melamine formaldehyde,MF)以及一些金属、合金(如铝合金、铬钼钢、钪合金、镁合金、钛合金、镁锂合金、镍合金等)、玻璃纤维或碳纤维中的任意材料或上述任意材料的组合。在一些实施例中，外壳面板710的材料为玻璃纤维、碳纤维与聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)等材料的任意组合。在一些实施例中，外壳面板710的材料可以是碳纤维和聚碳 酸酯(Polycarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板710的材料可以是碳纤维、玻璃纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板710的材料可以是玻璃纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成。加入不同比例的碳纤维或玻璃纤维，得到的材料的刚度不同。例如，加入20％～50％的玻璃纤维，材料的杨氏模量可以达到4000MPa～8000MPa。在一些实施例中，杨氏模量较小的材料可以为硅胶。
在一些实施例中，外壳面板与人体接触的外表面可以是一个平面。在一些实施例中，外壳面板的外表面可以具有一些凸起或凹坑，如图13所示，外壳面板1300的上表面上可以具有一凸起1310。在一些实施例中，外壳面板的外表面可以是任意轮廓的曲面。
图14A是骨传导扬声器的外壳背面的频率响应曲线。外壳背面在中低频时，与外壳面板振动一致，在高频时，外壳背面出现高阶模态。外壳背面的高阶模态会通过外壳侧面，影响外壳面板的运动速度与运动方向。在高频时，外壳背面的变形能够与外壳面板的变形相互加强或相互抵消，在高频产生峰和谷。在一些实施例中，可以通过调节外壳背面的材料和几何尺寸使其出现的峰值频率更高，获得更大范围的更平坦的频率响应曲线。提高骨传导耳机的音质。并降低人耳对高频漏音的敏感度，从而降低扬声器的漏音。在一些实施例中，可以调节外壳背板的材料的杨氏模量、重量和/或尺寸来调节出现外壳背面的峰值频率。在一些实施例中，外壳背面材料的杨氏模量可以大于2000Mpa，优选地，材料的杨氏模量可以大于4000Mpa，优选地，材料的杨氏模量大于6000Mpa，优选地，材料的杨氏模量大于8000Mpa，优选地，材料的杨氏模量大于12000Mpa，更优选地，材料的杨氏模量大于15000Mpa，进一步优选地，材料的杨氏模量大于18000Mpa。
在一些实施例中，通过调整外壳背面的刚度，可以使出现外壳背面的峰值频率大于1000Hz，优选地，可以使峰值频率大于2000Hz，优选地，可以使峰值频率大于4000Hz，优选地，可以使峰值频率大于6000Hz，，更优选地，可以使外壳背面的峰值频率大于8000Hz，更优选地，可以使外壳背面的峰值频率大于10000Hz，更优选地，可以使外壳背面的峰值频率大于12000Hz，进一步优选地，可以使外壳背面的峰值频率大于14000Hz，进一步优选地，可以使外壳背面的峰值频率大于16000Hz，进一步优选地，可以使外壳背面的峰值频率大于18000Hz，进一步优选地，可以使外壳背面的峰值频率大于20000Hz。
在一些实施例中，外壳背面可以由一种材料组成。在一些实施例中，外壳背面可以由两种或两种以上的材料叠层设置而成。
图14B是骨传导耳机的外壳侧面的频率响应曲线。如前所述，外壳侧面在低频振动时本身不会引起漏音。但外壳侧面在高频时，也会影响扬声器的漏音。原因是，在频率较高时，外壳侧面会出现变形，这种变形会引起外壳面板与外壳背面的运动的不一致，从而外壳面板与外壳背面的漏音不能互相抵消，引起整体的漏音变大。并且，当外壳侧面存在变形时，也会引起骨传导音质的变化。如图14B所示，外壳侧面的频响曲线在高频会出现峰/谷。在一些实施例中，可以通过调节外壳侧面的材料和几何尺寸使其出现峰谷的频率更高，获得更大范围的更平坦的频率响应曲线。提高骨传导扬声器的音质。并降低人耳对高频漏音的敏感度，从而降低扬声器的漏音。在一些实施例中，可以调节外壳侧面的材料的杨氏模量、重量和/或尺寸来调节出现峰/谷的频率。在一些实施例中，外壳侧面材料的杨氏模量可以大于2000Mpa，优选地，材料的杨氏模量可以大于4000Mpa，优选地，材料的杨氏模量大于6000Mpa，优选地，材料的杨氏模量大于8000Mpa，优选地，材料的杨氏模量大于12000Mpa，更优选地，材料的杨氏模量大于 15000Mpa，进一步优选地，材料的杨氏模量大于18000Mpa。
在一些实施例中，通过调整外壳侧面的刚度，可以使出现外壳侧面的峰值频率大于2000Hz，优选地，可以使外壳侧面的峰值频率大于4000Hz，优选地，可以使外壳侧面的峰值频率大于6000Hz，优选地，可以使外壳侧面的峰值频率大于8000Hz，更优选地，可以使外壳侧面的峰值频率大于10000Hz，更优选地，可以使外壳侧面的峰值频率大于12000Hz，进一步优选地，可以使外壳侧面的峰值频率大于14000Hz，进一步优选地，可以使外壳侧面的峰值频率大于16000Hz，进一步优选地，可以使外壳侧面的峰值频率大于18000Hz，进一步优选地，可以使外壳侧面的峰值频率大于20000Hz。
在一些实施例中，外壳侧面可以由一种材料组成。在一些实施例中，外壳侧面可以由两种或两种以上的材料叠层设置而成。
外壳支架的刚度也可以影响耳机在高频的频率响应。图15是骨传导耳机的外壳支架的频率响应曲线。如图15所示，在高频时，外壳支架会在频响曲线上产生一个谐振峰。不同刚度的外壳支架，在高频的谐振峰位置不同。在一些实施例中，可以通过调节外壳支架的材料和几何尺寸使其出现谐振峰的频率更高，从而使得骨传导扬声器在中低频能够获得更大范围的更平坦的频率响应曲线，进而提高骨传导扬声器的音质。在一些实施例中，可以调节外壳支架的材料的杨氏模量、重量和/或尺寸来调节出现谐振峰的频率。在一些实施例中，外壳支架材料的杨氏模量可以大于2000MPa，优选地，材料的杨氏模量可以大于4000MPa，优选地，材料的杨氏模量大于6000MPa，优选地，材料的杨氏模量大于8000MPa，优选地，材料的杨氏模量大于12000MPa，更优选地，材料的杨氏模量大于15000MPa，进一步优选地，材料的杨氏模量大于18000MPa。
在一些实施例中，通过调整外壳支架的刚度，可以使外壳支架的峰 值频率大于2000Hz，优选地，可以使外壳支架的峰值频率大于4000Hz，优选地，可以使外壳支架的峰值频率大于6000Hz，优选地，可以使外壳支架的峰值频率大于8000Hz，更优选地，可以使外壳支架的峰值频率大于10000Hz，更优选地，可以使外壳支架的峰值频率大于12000Hz，进一步优选地，可以使外壳支架的峰值频率大于14000Hz，进一步优选地，可以使外壳支架的峰值频率大于16000Hz，进一步优选地，可以使外壳支架的峰值频率大于18000Hz，进一步优选地，可以使外壳支架的峰值频率大于20000Hz。
本申请中，通过调节壳体材料的杨氏模量和尺寸提高壳体的刚度，保证壳体振动的一致性，使得漏音可以相互叠加相消，降低漏音。并将壳体上不同部分对应的峰值频率向更高频调整，可以在降低漏音的同时提高音质。
图16A是根据本申请的一些实施例所示的一种骨传导扬声器1600的固定组件与壳体连接的结构示意图。如图所示，耳机固定组件1620与壳体1610相连。耳机固定组件1620能够保持骨传导耳机与人体组织或骨骼的稳定接触，避免骨传导耳机的晃动，保证耳机能够稳定的进行声音传递。如前所述，耳机固定组件1620可以等效为一个弹性结构，当耳机固定组件1620的刚度越小(即劲度系数越小)时，谐振峰在低频的响应越明显，则越有利于提高骨传导耳机的音质。另一方面，如果耳机固定组件1620刚度小(即劲度系数小)时，有利于壳体的振动。
图16B是骨传导扬声器1600耳机固定组件1620与壳体1610之间通过连接部件1630进行连接的方式。在一些实施例中，连接部件1630可以是硅胶、海绵、弹片中的一种或任意几种的组合。
在一些实施例中耳机固定组件1620可以是耳挂的形式，耳机固定组件1620的两端分别连接有一个壳体1610，以耳挂的方式将两个壳体分别 固定在头骨的两侧。在一些实施例中，耳机固定组件1620可以是单耳式耳夹。耳机固定组件1620可以单独连接一个壳体1610，并将壳体1610固定在头骨一侧。
需要知道的是，以上对于耳机固定组件与壳体相连的方式仅仅是本申请的一些示例或实施例，本领域的普通技术人员还可以根据本申请的不同应用场景，对以上耳机固定组件与壳体相连的方式做适当的调整。更多关于耳机固定组件与壳体相连的描述可以参见本申请中其他地方的描述(例如，图23A-图23C，及其相关描述)。
实施例一
如图17所示，骨传导扬声器1700可以包括磁路组件1710、线圈1720、连接件1730、传振片1740、壳体1750和外壳支架1760。在一些实施例中，所述骨传导扬声器1700还包括第一元件和第二元件。线圈1720通过第一元件与壳体1750进行连接。磁路组件1710通过第二元件与壳体1750进行连接。第一元件的弹性模量大于第二元件的弹性模量。以实现线圈与壳体的硬连接，磁路组件与壳体的软连接。达到调节低频谐振峰和高频谐振峰的位置，优化频率响应曲线的目的。在一些实施例中，第一元件可以是外壳支架1760，外壳支架1760固定连接在壳体1750内部，线圈1720与外壳支架1760连接。外壳支架1760为固定在壳体1750内侧壁的环形支架。外壳支架1760为刚性构件，外壳支架1760由杨氏模量大于2000Mpa的材料制成。在一些实施例中，第二元件可以是传振片1740。磁路组件1710与传振片1740连接，传振片为弹性构件。壳体1750可以在传振片1740的带动下进行机械振动，将振动传递给组织和骨骼，通过组织和骨骼传递到听觉神经，使人体能够听到声音。壳体1750的整体刚度较大，使得在骨传导耳机1700工作时，壳体1750整体一起振动，即壳体1750上的外壳面板、外壳侧面和外壳背面能够保持基本相同的振动幅度和相位，能够 将壳体1750外部的漏音相互叠加相消，显著降低外部漏音。
磁路组件1710可以包括第一磁性元件1706、第一导磁元件1704、第二磁性元件1702、第二导磁元件1708。第一导磁元件1704的下表面可以连接第一磁性元件1706的上表面。第二导磁元件1708的上表面可以连接第一磁性元件1706的下表面。第二磁性元件1708的下表面可以连接在第一导磁元件1704的上表面。第一磁性元件1706和第二磁性元件1708的磁化方向相反。第二磁性元件1708可以抑制第一磁性元件1706上表面一侧的漏磁，从而使第一磁性元件1706产生的磁场可以较多的被压缩到第二导磁元件1708和第一磁性元件1706之间的磁间隙中，提高磁间隙内的磁感应强度，进而提高骨传导耳机1700的灵敏度。
同样，还可以在第二导磁元件1708的下表面增加第三磁性元件1709，第三磁性元件1709与第一磁性元件1706磁化方向相反，用来抑制第一磁性元件1706下表面一侧的漏磁，进一步将第一磁性元件1706产生的磁场压缩到磁间隙内，提高磁间隙内的磁感应强度和骨传导扬声器1700的灵敏度。
第一磁性元件1706、第一导磁元件1704、第二磁性元件1702、第二导磁元件1708和第三导磁元件1709可以通过胶水粘贴方式进行固定。还可以在第一磁性元件1706、第一导磁元件1704、第二磁性元件1702、第二导磁元件1708和第三导磁元件1709中打孔，通过螺钉进行固定。
实施例二
图18A-18D为骨传导耳机的传振片的几种结构示意图。如图18A所示，传振片可以包括外环和内环，以及设置在外环和内环之间的若干连接杆。外环和内环可以是同心圆。连接杆可以是具有一定长度的弧形。连接杆的个数可以是3个或更多。传振片的内环可以与连接件固定连接。
如图18B所示，传振片可以包括外环和内环，以及设置在外环和内 环之间的若干连接杆。连接杆可以是直杆。连接杆的个数可以是3个或更多。
如图18C所示，传振片可以包括内环，以及环绕在内环周围并向外放射分布的若干弯杆。弯杆的个数可以是3个或更多。
如图18D所示，传振片可以由若干弯杆组成，弯杆的一端集中在传振片的中心点处，弯杆的另一端环绕在传振片的中心点周围。弯杆的个数可以是3个或更多。
实施例三
图19是根据本申请的一些实施例所示的一种骨传导扬声器的结构示意图。骨传导扬声器1900可以包括磁路组件1910、线圈1920、传振片1930、壳体1940和外壳支架1950。参考图17，对比实施例一中的结构，图17中的传振片为平面结构，传振片处于一平面上。本实施例中的传振片为立体结构，如图19所示，传振片1930在不受力的自然状态下，在厚度方向具有立体结构。采用立体传振片可以减小骨传导耳机1900的厚度方向上的尺寸。参见图17，当传振片为平面结构时，为了保证传振片工作时能够在竖直方向进行振动，需要在传振片的上方和下方预留一定的空间。如果传振片本身具有厚度0.2mm，传振片上方需要预留1mm的尺寸，传振片的下方需要预留1mm的尺寸，那么壳体1940的面板的下表面到磁路组件的上表面，至少需要2.2mm的空间。采用立体传振片后，传振片可以在自身厚度空间上进行振动。立体传振片在厚度方向上的尺寸可以是1.5mm，此时，壳体1940的面板的下表面到磁路组件1910上表面的距离只需要1.5mm，节省了0.7mm的空间。大大缩小了耳机1900厚度方向上的尺寸。并且可以取消连接件，简化内部结构。另一方面，当采用立体传振片的壳体与采用平面结构的传振片的壳体具有相同的尺寸时，立体传振片与平面结构的传振片相比，可以具有更大的振动幅度，从而提高骨传导扬声器所能 提供的最大音量。
立体传振片1930的投影形状可以是实施例二中的任意一种。
在一些实施例中，立体传振片1930外边缘可以与外壳支架1950的内侧相连。例如，当立体传振片1930采用如图18A或18B所示的传振片构型时，其外环可以与外壳支架1950的内侧通过胶水、卡接、焊接或者螺纹连接的方式连接。当立体传振片1930采用如图18C或18D所示的传振片构型时，其环绕在内环周围的弯杆可以与外壳支架1950的内侧通过胶水、卡接、焊接或者螺纹连接的方式连接。在一些实施例中，外壳支架1950可以开设有若干槽孔，立体传振片1930的外边缘可以穿过所述槽孔连接在外壳支架1950的外侧，同时可以增加传振片的长度，有利于谐振峰向低频方向变化，从而提高音质。所述槽孔的尺寸能够为传振片的振动提供足够的空间。
实施例四
图20A-20D是根据本申请的一些实施例所示的几种骨传导扬声器的结构示意图。如图20A所示，与实施例一中的结构不同的是，该扬声器结构中没有外壳支架，第一元件为连接件2030，线圈2020通过连接件2030与壳体2050连接。连接件2030包括柱状主体，柱状主体的一端与壳体2050连接，柱状主体的另一端设置有截面积较大的圆形端部，圆形端部与线圈2020固定连接。连接件2030为刚性构件，连接件由杨氏模量大于4000Mpa的材料制成。线圈2020和连接件2030之间可以连接有垫圈。第二元件为传振片2040，磁路组件2010与传振片2040连接，传振片2040直接和壳体2050连接。传振片2040为弹性构件。传振片2040可以位于磁路组件2010的上方，传振片2040可以连接在第二导磁元件2008的上端面。传振片2040和第二导磁元件2008之间可以通过垫圈连接。
如图20B所示，与图20A的结构不同的是，传振片2040可以位于 第二导磁元件2008和壳体2050侧壁之间，与第二导磁元件2008的外侧连接。
如图20C所示，传振片2040还可以设置在磁路组件2010的下方，与第二导磁元件2008的下表面连接。
如图20D所示，线圈2020通过连接件2030固定连接在外壳背面。
实施例五
如图21所示，骨传导扬声器2100可以包括磁路组件2110、线圈2120、连接件2130、传振片2140、壳体2150和外壳支架2160。壳体2150可以在传振片2140的带动下进行机械振动，将振动传递给组织和骨骼，通过组织和骨骼传递到听觉神经，使人体能够听到声音。壳体2150的整体刚度较大，使得在骨传导耳机2100工作时，壳体2150整体一起振动，能够将壳体2150外部的漏音相互抵消，显著降低外部漏音。壳体2150上可以开设有若干引声孔2151。引声孔2151可以将耳机2100内部的漏音传播在壳体2150外部，与壳体2150外部的漏音相互抵消，进一步降低耳机的漏音。需要理解的是，壳体2150内部的零部件振动也会产生内部空气的振动，从而产生漏音。并且内部零部件的振动和壳体2150的振动也可以是一致的，从而产生与壳体2150相反方向的漏音，能够和壳体2150的漏音相互抵消，降低漏音。可以通过调节引声孔2151的位置、尺寸和数量来调整需要引出的内部漏音，保证内外漏音可以相消，降低漏音。在一些实施例中，壳体2150上可以引声孔2151的位置可以设置阻尼层，可以调整引出声音时的相位和幅度，从而加强漏音相消的效果。
实施例六
在不同的应用场景中，本申请中所描述的骨传导耳机的壳体可以通过不同的装配方式制成。例如，如本申请中其他地方的描述，骨传导耳机的壳体可以是一体成型的方式，也可以是分体组合的方式，或者两者相结 合的方式。在分体组合的方式中，不同分体之间可以采用胶水粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。具体地，为了更好地理解本申请中骨传导耳机的壳体的装配方式，图22A-22C描述了几种骨传导耳机的壳体的装配方式的示例。
如图22A所示，骨传导耳机的壳体可以包括外壳面板2222，外壳背面2224和外壳侧面2226。外壳侧面2226和外壳背面2224由一体成型的方式制成，外壳面板2222通过分件组合的方式连接到外壳侧面2226的一端。所述分件组合的方式包括使用胶水粘结固定，或是通过卡接、焊接或螺纹连接的方式将外壳面板2222固定在外壳侧面2226的一端。外壳面板2222和外壳侧面2226(或者外壳背面2224)可以采用不同、相同或者部分相同的材料制成。在一些实施例中，外壳面板2222和外壳侧面2226采用相同的材料制成，且所述相同材料的杨氏模量大于2000MPa，更优选地，所述相同材料的杨氏模量大于4000MPa，更优选地，所述相同材料的杨氏模量大于6000MPa，更优选地，壳体220材料的杨氏模量大于8000MPa，更优选地，所述相同材料的杨氏模量大于12000MPa，更优选地，所述相同材料的杨氏模量大于15000MPa，进一步优选地，所述相同材料的杨氏模量大于18000MPa。在一些实施例中，外壳面板2222和外壳侧面2226采用不同的材料制成，所述不同材料的杨氏模量都大于4000MPa，更优选地，所述不同材料的杨氏模量都大于6000MPa，更优选地，所述不同材料的杨氏模量都大于8000MPa，更优选地，所述不同材料的杨氏模量都大于12000MPa，更优选地，所述不同材料的杨氏模量都大于15000MPa，进一步优选地，所述不同材料的杨氏模量都大于18000MPa。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料包括但不限于丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile butadiene styrene,ABS)、聚苯乙烯(Polystyrene,PS)、高冲击聚苯乙烯(High impact polystyrene,HIPS)、聚丙烯(Polypropylene, PP)、聚对苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚酯(Polyester,PES)、聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)、聚氯乙烯(Polyvinyl chloride,PVC)、聚氨酯(Polyurethanes,PU)、聚二氯乙烯(Polyvinylidene chloride)、聚乙烯(Polyethylene,PE)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)、聚醚醚酮(Polyetheretherketone,PEEK)、酚醛树脂(Phenolics,PF)、尿素甲醛树脂(Urea-formaldehyde,UF)、三聚氰胺-甲醛树脂(Melamine formaldehyde,MF)以及一些金属、合金(如铝合金、铬钼钢、钪合金、镁合金、钛合金、镁锂合金、镍合金等)、玻璃纤维或碳纤维中的任意材料或上述任意材料的组合。在一些实施例中，外壳面板710的材料为玻璃纤维、碳纤维与聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)等材料的任意组合。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是碳纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是碳纤维、玻璃纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是玻璃纤维和聚碳酸酯(Polycarbonate,PC)按照一定比例混合制成，也可以使玻璃纤维和聚酰胺(Polyamides,PA)按照一定比例混合制成。
如图22A所示，外壳面板2222、外壳背面2224和外壳侧面2226形成具有一定容置空间的整体结构。在所述整体结构内，传振片2214通过连接件2216与磁路组件2210连接。磁路组件2210的两侧分别连接第一导磁元件2204和第二导磁元件2206。传振片2214通过外壳支架2228固定在所述整体结构的内部。在一些实施例中，外壳侧面2226上具有用于支撑外壳支架2228的台阶结构。在外壳支架2228固定于外壳侧面2226后，外壳面板2222可以同时固定在外壳支架2228和外壳侧面2226上，或者单独固 定在外壳支架2228或外壳侧面2226上。在这种情况下，可选地，外壳侧面2226和外壳支架2228可以一体成型。在一些实施例中，外壳支架2228可以直接固定在外壳面板2222上(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。固定后的外壳面板2222和外壳支架2228再与外壳侧面固定(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。在这种情况下，可选地，外壳支架2228和外壳面板2222可以一体成型。
如图22B所示，与图22A的不同之处在于，外壳支架2258和外壳侧面2256一体成型。外壳面板2252固定在外壳侧面2256上与外壳支架2258连接的一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)，外壳背面2254固定在外壳侧面2256的另一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。在这种情况下，可选地，外壳支架2258和外壳侧面2256是分体组合的结构，并且外壳面板2252，外壳背面2254，外壳支架2258和外壳侧面2256之间都是通过胶水粘贴、卡接、焊接或螺纹连接的方式进行固定连接。
如图22C所示，与图22A和图22B的不同之处在于，外壳面板2282和外壳侧面2286一体成型。外壳背面2284固定在外壳侧面2286上相对于外壳面板2282的一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。外壳支架2288通过胶水粘贴、卡接、焊接或螺纹连接的方式固定在外壳面板2282和/或外壳侧面2286上。在这种情况下，可选地，外壳支架2288，外壳面板2282和外壳侧面2286是一体成型的结构。
实施例七
如本申请中其他地方的描述，骨传导耳机的壳体可以通过耳机固定组件保持与人体组织或骨骼的稳定接触。在不同的应用场景中，所述耳机固定组件与壳体可以采用不同的方式进行连接。例如，所述耳机固定组件与壳体可以是一体成型的方式，也可以是分体组合的方式，或者两者相结 合的方式。在分体组合的方式中，耳机固定组件可以采用胶水粘贴，或是通过卡接或焊接的方式与壳体上的特定部位进行固定连接。所述壳体上特定部位包括外壳面板，外壳背面，和/或外壳侧面。具体地，为了更好地理解本申请中耳机固定组件与壳体的连接方式，图23A-23C描述了几种骨传导耳机的壳体的连接方式的示例。
如图23A所示，以耳挂作为耳机固定组件为例，在图22A的基础上，耳挂2330与外壳固定连接。所述固定连接的方式包括使用胶水粘结固定，或是通过卡接、焊接或螺纹连接的方式将耳挂2330固定在外壳侧面2326或者外壳背面2324。耳挂2330上与外壳相连的部分可以采用与外壳侧面2326或外壳背面2324相同，不同，或者部分相同的材料制成。在一些实施例中，为了使耳挂2330具有较小的刚度(即较小的劲度系数)，耳挂2330中还可以包括塑胶、硅胶和/或金属材料。例如，耳挂2330中可以包括圆弧状的钛丝。可选地，耳挂2330可以与外壳侧面2326或外壳背面2324一体成型。
如图23B所示，在图22B的基础上，耳挂2360与外壳固定连接。所述固定连接的方式包括使用胶水粘结固定，或是通过卡接、焊接或螺纹连接的方式将耳挂2360固定在外壳侧面2356或者外壳背面2354。与图23A类似，耳挂2360上与外壳相连的部分可以采用与外壳侧面2356或外壳背面2354相同，不同，或者部分相同的材料制成。可选地，耳挂2360可以与外壳侧面2356或外壳背面2354一体成型。
如图23C所示，在图22C的基础上，耳挂2390与外壳固定连接。所述固定连接的方式包括使用胶水粘结固定，或是通过卡接、焊接或螺纹连接的方式将耳挂2390固定在外壳侧面2386或者外壳背面2384。与图23A类似，耳挂2390上与外壳相连的部分可以采用与外壳侧面2386或外壳背面2384相同，不同，或者部分相同的材料制成。可选地，耳挂2390可 以与外壳侧面2386或外壳背面2384一体成型。
实施例八
如本申请中其他地方的描述，骨传导耳机的壳体的刚度会影响壳体上不同部位(例如，外壳面板、外壳背面和/或外壳侧面)的振动幅度和相位，从而影响骨传导耳机的漏音。在一些实施例中，当骨传导耳机的壳体具有比较大的刚度时，外壳面板和外壳背面能够在较高的频率下保持相同或者基本相同的振动幅度和相位，从而显著减小骨传导耳机的漏音。
这里所说的较高的频率可以包括不小于1000Hz的频率，例如，1000Hz-2000Hz之间的频率，1100Hz-2000Hz之间的频率，1300Hz-2000Hz之间的频率，1500Hz-2000Hz之间的频率，1700Hz-2000Hz之间的频率，1900Hz-2000Hz之间的频率。优选地，这里所说的较高的频率可以包括不小于2000Hz的频率，例如，2000Hz-3000Hz之间的频率，2100Hz-3000Hz之间的频率，2300Hz-3000Hz之间的频率，2500Hz-3000Hz之间的频率，2700Hz-3000Hz之间的频率，或者2900Hz-3000Hz之间的频率。优选地，这里所说的较高的频率可以包括不小于4000Hz的频率，例如，4000Hz-5000Hz之间的频率，4100Hz-5000Hz之间的频率，4300Hz-5000Hz之间的频率，4500Hz-5000Hz之间的频率，4700Hz-5000Hz之间的频率，或者4900Hz-5000Hz之间的频率。更优选地，这里所说的较高的频率可以包括不小于6000Hz的频率，例如，6000Hz-8000Hz之间的频率，6100Hz-8000Hz之间的频率，6300Hz-8000Hz之间的频率，6500Hz-8000Hz之间的频率，7000Hz-8000Hz之间的频率，7500Hz-8000Hz之间的频率，或者7900Hz-8000Hz之间的频率。进一步优选地，这里所说的较高的频率可以包括不小于8000Hz的频率，例如，8000Hz-12000Hz之间的频率，8100Hz-12000Hz之间的频率，8300Hz-12000Hz之间的频率，8500Hz-12000Hz之间的频率，9000Hz-12000Hz之间的频率，10000Hz-12000Hz之间的频率，或者11000Hz- 12000Hz之间的频率。
这里所说的外壳面板和外壳背面保持相同或者基本相同的振动幅度是指，所述外壳面板和外壳背面的振动幅度的比值在一定的范围之内。例如，外壳面板和外壳背面的振动幅度的比值在0.3到3之间，优选地，外壳面板和外壳背面的振动幅度的比值在0.4到2.5之间，优选地，外壳面板和外壳背面的振动幅度的比值在0.5到1.5之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.6到1.4之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.7到1.2之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.75到1.15之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.8到1.1之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.85到1.1之间，进一步优选地，外壳面板和外壳背面的振动幅度的比值在0.9到1.05之间。在一些实施例中，外壳面板和外壳背面的振动可以用其他能够表征其振动幅度的物理量来表示。例如，可以分别用空间中一点处由外壳面板和外壳背面产生的声压来表征外壳面板和外壳背面的振动幅度。
这里所说的外壳面板和外壳背面保持相同或者基本相同的振动相位是指，所述外壳面板和外壳背面的振动相位的差值在一定的范围之内。例如，外壳面板和外壳背面的振动相位的差值在-90°到90°之间，优选地，外壳面板和外壳背面的振动相位的差值在-80°到80°之间，优选地，外壳面板和外壳背面的振动相位的差值在-60°到60°之间，优选地，外壳面板和外壳背面的振动相位的差值在-45°到45°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-30°到30°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-20°到20°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-15°到15°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-12°到12°之间，更优选地，外壳面板和外壳背面的振动相位的差 值在-10°到10°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-8°到8°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-6°到6°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-5°到5°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-4°到4°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-3°到3°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-2°到2°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-1°到1°之间，进一步优选地，外壳面板和外壳背面的振动相位的差值为0°。
具体地，为了更好地理解本申请中外壳面板和外壳背面的振动幅度和相位的关系，图24-26描述了几种测量骨传导耳机壳体振动的方法的示例。
如图24所示，信号发生装置2420可以给骨传导耳机提供一个驱动信号，使得壳体2410的外壳面板2412产生振动。为简洁起见，以一个周期信号(例如，正弦信号)作为所述驱动信号进行描述。外壳面板2412在所述周期信号的驱动下进行周期振动。测距仪2440向外壳面板2412发射测试信号2450(例如，激光)，接收从外壳面板2412反射的信号并转换为第一电信号后发送给信号测试装置2430。所述第一电信号(也称为第一振动信号)可以反映外壳面板2412的振动状态。信号测试装置2430可以对比信号发生装置2420产生的周期信号，以及测距仪2440测得的第一电信号，从而得到两个信号之间的相位差(也称为第一相位差)。类似地，测距仪2440可以测量由外壳背面的振动产生的第二电信号(也称为第二振动信号)，并由信号测试装置2430得到所述周期信号和所述第二电信号之间的相位差(也称为第二相位差)。根据所述第一相位差和所述第二相位差，可以获得外壳面板2412和外壳背面的相位差。类似的，通过比较第一电信号和第二电信号的幅值，可以确定外壳面板2412和外壳背面的振动幅度的关 系。
在一些实施例中，可以使用麦克分代替测距仪2440。具体的，可以分别将麦克风放置于外壳面板2412和外壳背面的附近位置，分别测量由外壳面板2412和外壳背面产生的声压，获得与上述第一电信号和第二电信号类似的信号，并基于此确定外壳面板2412和外壳背面的振动幅度和相位的关系。需要注意的是，在分别测量由外壳面板2412和外壳背面产生的声压大小和相位时，所述麦克风最好能分别放置在距离外壳面板2412和外壳背面较近的位置(例如，垂直距离小于10mm)，并且保持所述麦克风与外壳面板2412和外壳背面的距离相同或相近或接近，所述麦克风与外壳面板2412和外壳背面对应的位置相同等。
图25是根据图24测得的一个示例性的结果。其中，横坐标表示时间，纵坐标表示信号的大小。图中实线2410表示信号发生装置2420产生的周期信号，虚线2520表示测距仪测得第一电信号。所述第一电信号的幅值，即V 1/2，可以反映外壳面板的振动幅度。所述第一电信号和所述周期信号的相位差可以表示为：
Figure PCTCN2019070545-appb-000001
其中，t 1表示所述周期信号和所述第一电信号相邻波峰的时间间隔，t 2表示所述周期信号的周期。
类似地，可以获得第二电信号的幅值。所述第一电信号的幅值与所述第二电信号的幅值的比值可以表示外壳面板的振动幅度和外壳背面的振动幅度的比值。另外，考虑到测量时第一电信号和第二电信号之间可能存在180°的相位差(即分别发射测试信号到外壳面板和外壳背面的外表面进行的测量)，所述第二电信号和周期信号的相位差可以表示为：
Figure PCTCN2019070545-appb-000002
其中，t 1′表示所述周期信号和所述第二电信号相邻波峰的时间间隔，t 2′表 示所述周期信号的周期。
Figure PCTCN2019070545-appb-000003
和
Figure PCTCN2019070545-appb-000004
之间的差值则可以反映外壳面板2412和外壳背面的相位差。
需要注意的是，在分别测试外壳面板和外壳背面的振动时，测试系统的状态应尽量保持一致，以避免导致后续所计算的相位差的不准确。如果测试系统在测量时会产生延时，则需要分别对每次测量的结果进行延时补偿，或者使得在测量外壳面板和外壳背面时测试系统的延迟相同，以抵消延时的影响。
图26描述了另一种测量骨传导耳机壳体振动的示例性的方法。与图24不同的地方在于，图26中包含两个测距仪2640和2640’。这两个测距仪可以同时测量骨传导耳机的壳体2610的外壳面板和外壳背面的振动，并分别将反映外壳面板和外壳背面振动的第一电信号和第二电信号传递给信号测试装置2630。同样地，所述两个测距仪2640和2640’可以分别用两个麦克风代替。
图27是根据图26测得的一个示例性的结果。图中实线2710表示反映外壳面板振动的第一电信号，虚线2720表示反映外壳背面振动的第二电信号。所述第一电信号的幅值，即V 3/2，可以反映外壳面板的振动幅度。所述第二电信号的幅值，即V 4/2，可以反映外壳背面的振动幅度。在这种情况下，所述外壳面板和所述外壳背面的振动幅度的比值为V 3/V 4。所述第一电信号和所述第二的相位差，即所述外壳面板和所述外壳背面的振动相位差，可以表示为：
Figure PCTCN2019070545-appb-000005
其中，t 3′表示所述第一信号和所述第二电信号相邻波峰的时间间隔，t 4′表示所述第二信号的周期。
实施例九
图28和图29描述了存在耳机固定组件的情况下测量骨传导耳机壳 体振动的方法的示例。
图28与图24的区别在于，骨传导耳机的壳体2810与耳机固定组件2860固定相连，例如，通过本申请中其他地方描述的任一种连接方式相连。在测量的过程中，耳机固定组件2860进一步固定在固定装置2870上。固定装置2870可以使得耳机固定组件2860上与其相连的部分保持静止的状态。在信号发生装置2820向骨传导耳机提供驱动信号后，壳体2810整体可以相对振动装置2870振动。类似地，信号测试装置2830可以分别获得反映外壳面板和外壳背面振动的第一电信号和第二电信号，并据此确定外壳面板和外壳背面的相位差。
图29与图26的区别在于，骨传导耳机的壳体2910与耳机固定组件2960固定相连，例如，通过本申请中其他地方描述的任一种连接方式相连。在测量的过程中，耳机固定组件2960进一步固定在固定装置2970上。固定装置2970可以使得耳机固定组件2960上与其相连的部分保持静止的状态。在信号发生装置2920向骨传导耳机提供驱动信号后，壳体2910整体可以相对固定装置2970振动。类似地，信号测试装置2830可以同时获得反映外壳面板和外壳背面振动的第一电信号和第二电信号，并据此确定外壳面板和外壳背面的相位差。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述发明披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。
同时，本申请使用了特定词语来描述本申请的实施例。如“一个实施例”、“一实施例”和/或“一些实施例”意指与本申请至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本说明书中在不同 位置两次或多次提及的“一实施例”或“一个实施例”或“一替代性实施例”并不一定是指同一实施例。此外，本申请的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
此外，本领域技术人员可以理解，本申请的各方面可以通过若干具有可专利性的种类或情况进行说明和描述，包括任何新的和有用的工序、机器、产品或物质的组合或对他们的任何新的和有用的改进。相应地，本申请的各个方面可以完全由硬件执行、可以完全由软件(包括固件、常驻软件、微码等)执行、也可以由硬件和软件组合执行。以上硬件或软件均可被称为“数据块”、“模块”、“引擎”、“单元”、“组件”或“系统”。此外，本申请的各方面可能表现为位于一个或多个计算机可读介质中的计算机产品，该产品包括计算机可读程序编码。
此外，除非权利要求中明确说明，本申请所述处理元素和序列的顺序、数字字母的使用或其他名称的使用，并非用于限定本申请流程和方法的顺序。尽管上述披露中通过各种示例讨论了一些目前认为有用的发明实施例，但应当理解的是，该类细节仅起到说明的目的，附加的权利要求并不仅限于披露的实施例，相反，权利要求旨在覆盖所有符合本申请实施例实质和范围的修正和等价组合。例如，虽然以上所描述的系统组件可以通过硬件设备实现，但是也可以只通过软件的解决方案得以实现，如在现有的服务器或移动设备上安装所描述的系统。
同理，应当注意的是，为了简化本申请披露的表述，从而帮助对一个或多个发明实施例的理解，前文对本申请实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本申请对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。
一些实施例中使用了描述成分、属性数量的数字，应当理解的是，此 类用于实施例描述的数字，在一些示例中使用了修饰词“大约”、“近似”或“大体上”等来修饰。除非另外说明，“大约”、“近似”或“大体上”表明所述数字允许有±20％的变化。相应地，在一些实施例中，说明书和权利要求中使用的数值数据均为近似值，该近似值根据个别实施例所需特点可以发生改变。在一些实施例中，数值数据应考虑规定的有效数位并采用一般位数保留的方法。尽管本申请一些实施例中用于确认其范围广度的数值域和数据为近似值，在具体实施例中，此类数值的设定在可行范围内尽可能精确。
最后，应当理解的是，本申请中所述实施例仅用以说明本申请实施例的原则。其他的变形也可能属于本申请的范围。因此，作为示例而非限制，本申请实施例的替代配置可视为与本申请的教导一致。相应地，本申请的实施例不仅限于本申请明确介绍和描述的实施例。

Claims (53)

  1. 一种骨传导扬声器，其特征在于，包括：
    磁路组件，用于提供磁场；
    振动组件，所述振动组件的至少一部分位于所述磁场中，将输入至所述振动组件的电信号转化为机械振动信号；以及
    壳体，包含面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，所述壳体容纳所述振动组件，所述振动组件导致所述外壳面板和所述外壳背面振动，所述外壳面板的振动具有第一相位，所述外壳背面的振动具有第二相位，其中，
    所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
  2. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述外壳面板的振动具有第一振幅，所述外壳背面的振动具有第二振幅，所述第一振幅和所述第二振幅的比值在0.5到1.5的范围之内。
  3. 根据权利要求1所述的骨传导扬声器，其特征在于，所述外壳面板的振动产生第一漏音声波，所述外壳背面的振动产生第二漏音声波，所述第一漏音声波和所述第二漏音声波相互叠加，所述叠加减小所述第一漏音声波的幅值。
  4. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述外壳面板与所述外壳背面由杨氏模量大于4000Mpa的材料制成。
  5. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述外壳面板和所述外壳背面的面积的差值不超过外壳面板面积的30％。
  6. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接，且所述第一元件的杨氏模量大于4000Mpa。
  7. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述外壳面板与所述外壳其它部分通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  8. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述外壳面板和所述外壳背面由纤维增强塑料材料制成。
  9. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器还包括耳机固定组件，所述耳机固定组件用于保持所述骨传导扬声器与人体的稳定接触；以及
    所述耳机固定组件通过弹性部件与所述骨传导扬声器固定连接。
  10. 根据权利要求9所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器在小于500Hz的频率范围内产生两个低频谐振峰。
  11. 根据权利要求10所述的骨传导扬声器，其特征在于，
    所述两个低频谐振峰与所述振动组件和所述耳机固定组件的弹性模量有关。
  12. 根据权利要求10所述的骨传导扬声器，其特征在于，
    所述小于500Hz的频率范围内产生的两个低频谐振峰分别和所述耳机固定组件和所述振动组件对应。
  13. 根据权利要求12所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器在大于2000Hz的频率范围内产生至少两个高频谐振峰，所述两个高频谐振峰与所述壳体的弹性模量、所述壳体的体积、所述外壳面板的刚度和/或所述外壳背面的刚度有关。
  14. 根据权利要求12所述的骨传导扬声器，其特征在于，
    所述振动组件包括线圈和传振片；
    所述线圈的至少一部分位于所述磁场内，并在电信号的驱动下在所述磁场内运动。
  15. 根据权利要求14所述的骨传导扬声器，其特征在于，
    所述传振片的一端与所述壳体的内表面相接触，所述传振片的另一端与所述磁路组件相接触。
  16. 根据权利要求14所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器还包括第一元件，其中，所述线圈通过所述第一元件与所述壳体进行连接，且所述第一元件由杨氏模量大于4000Mpa的材料制成。
  17. 根据权利要求16所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器还包括第二元件，其中，所述磁路系统通过所述第二元件与所述壳体进行连接，所述第一元件的弹性模量大于所述第二元件的弹性模量。
  18. 根据权利要求17所述的骨传导扬声器，其特征在于，所述第二元件为传振片，所述传振片为弹性构件。
  19. 根据权利要求18所述的骨传导扬声器，其特征在于，所述传振片为立体结构，能够在自身厚度空间内进行机械振动。
  20. 根据权利要求1所述的骨传导扬声器，其特征在于，
    所述磁路组件包括第一磁性元件、第一导磁元件和第二导磁元件；
    所述第一导磁元件的下表面和所述第一磁性元件的上表面连接；
    所述第二导磁元件的上表面和所述第一磁性元件的下表面连接；
    所述第二导磁元件具有凹槽，所述第一磁性元件和所述第一导磁元件固定在所述凹槽内，并与所述第二导磁元件的侧表面之间具有磁间隙。
  21. 根据权利要求20所述的骨传导扬声器，其特征在于，
    所述磁路组件还包括第二磁性元件；
    所述第二磁性元件设置在所述第一导磁元件的上方，并且所述第二磁性元件和所述第一磁性元件的磁化方向相反。
  22. 根据权利要求21所述的骨传导扬声器，其特征在于，
    所述磁路组件还包括第三磁性元件；
    所述第三磁性元件设置在所述第二导磁元件的下方，并且所述第三磁性元件和所述第一磁性元件的磁化方向相反。
  23. 一种骨传导扬声器的测试方法，其特征在于，包括：
    向骨传导扬声器发送测试信号，所述骨传导扬声器包括振动组件和容纳所述振动组件的壳体，所述壳体包括分别位于所述振动组件两侧的外壳面板和外壳背板，所述振动组件基于所述测试信号导致所述外壳面板和所述外壳背面的振动；
    获取与所述外壳面板的振动对应的第一振动信号；
    获取与所述外壳背面的振动对应的第二振动信号；以及
    基于所述第一振动信号和所述第二振动信号确定所述外壳面板的振动和所述外壳背面的振动的相位差。
  24. 根据权利要求23所述的方法，其特征在于，基于所述第一振动信号和所述第二振动信号确定所述外壳面板的振动和所述外壳背面的振动的相位差，包括：
    获取所述第一振动信号的波形和所述第二振动信号的波形；以及
    基于所述第一振动信号的波形和所述第二振动信号的波形确定所述相位差。
  25. 根据权利要求23所述的方法，其特征在于，基于所述第一振动信号和所述第二振动信号确定所述外壳面板的振动和所述外壳背面的振动的相位差，包括：
    基于所述第一振动信号和所述测试信号确定所述第一振动信号的第一相位；
    基于所述第二振动信号和所述测试信号确定所述第二振动信号的第二相位；以及
    基于所述第一相位和所述第二相位确定所述相位差。
  26. 根据权利要求23所述的方法，其特征在于，
    所述测试信号为正弦周期信号。
  27. 根据权利要求23所述的方法，其特征在于，获取与所述外壳面板的振动对应的第一振动信号，包括：
    发射第一激光到所述外壳面板的外表面；
    接收所述外壳面板的外表面反射所述第一激光产生的第一反射激光；
    基于所述第一反射激光确定所述第一振动信号。
  28. 根据权利要求23所述的方法，其特征在于，获取与所述外壳背面的振动对应的第二振动信号，包括：
    发射第二激光到所述外壳背面的外表面；
    接收所述外壳背面的外表面反射所述第二激光产生的第二反射激光；
    基于所述第二反射激光确定所述第二振动信号。
  29. 根据权利要求23所述的方法，其特征在于，所述扬声器还包括：
    磁路组件，用于提供磁场，其中，所述振动组件的至少一部分位于所述磁场中，将所述测试信号转化为机械振动信号。
  30. 根据权利要求23所述的方法，其特征在于，
    所述扬声器还包括耳机固定组件，所述耳机固定组件通过弹性部件与所述扬声器连接，所述耳机固定组件用于支撑所述扬声器，并且使所述壳体自由振动。
  31. 根据权利要求23所述的方法，其特征在于，
    所述外壳面板的振动具有第一相位，所述外壳背面的振动具有第二相位；
    所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
  32. 根据权利要求31所述的方法，其特征在于，
    所述外壳面板的振动具有第一振幅，所述外壳背面的振动具有第二振幅，所述第一振幅和所述第二振幅的比值在0.5到1.5的范围之内。
  33. 根据权利要求31所述的方法，其特征在于，所述外壳面板的振动产生第一漏音声波，所述外壳背面的振动产生第二漏音声波，所述第一漏音声波和所述第二漏音声波相互叠加，所述叠加减小所述第一漏音声波的幅值。
  34. 根据权利要求31所述的方法，其特征在于，
    所述外壳面板与所述外壳背面由杨氏模量大于4000Mpa的材料制成。
  35. 根据权利要求33所述的方法，其特征在于，
    所述外壳面板和所述外壳背面的面积差不超过外壳面板面积的30％。
  36. 根据权利要求31所述的方法，其特征在于，
    所述扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接，且所述第一元件的杨氏模量大于4000Mpa。
  37. 根据权利要求23所述的方法，其特征在于，
    所述外壳面板与所述外壳其他部分通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  38. 根据权利要求23中任一项所述的方法，其特征在于，
    所述扬声器还包括耳机固定组件，所述耳机固定组件通过弹性部件与所述扬声器连接；
    所述耳机固定组件和所述外壳背面或所述外壳侧面为一体成型结构。
  39. 根据权利要求38中任一项所述的方法，其特征在于，
    所述扬声器还包括耳机固定组件，所述耳机固定组件通过弹性部件与所述扬声器连接；
    所述耳机固定组件与所述外壳背面或所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  40. 一种骨传导扬声器，其特征在于，包括：
    磁路组件，用于提供磁场；
    振动组件，所述振动组件的至少一部分位于所述磁场中，将输入至所述振动组件的电信号转化为机械振动信号；
    壳体，所述壳体容纳所述振动组件；以及
    耳机固定组件，所述耳机固定组件与所述壳体固定连接，用于保持所述骨传导扬声器与人体的接触，其中，
    所述壳体具有面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，以及位于所述外壳面板和所述外壳背面之间的外壳侧面，所述振动组件导致所述外壳面板和外壳背面振动。
  41. 根据权利要求40所述的骨传导扬声器，其特征在于，
    所述外壳背面和所述外壳侧面为一体成型结构；
    所述外壳面板与所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  42. 根据权利要求40所述的骨传导扬声器，其特征在于，
    所述外壳面板和所述外壳侧面为一体成型结构；
    所述外壳背面与所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  43. 根据权利要求40所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接。
  44. 根据权利要求43所述的骨传导扬声器，其特征在于，
    所述外壳侧面和所述第一元件为一体成型结构；
    所述外壳面板与所述第一元件的外表面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接；
    外壳背面与所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  45. 根据权利要求41-44中任一项所述的骨传导扬声器，其特征在于，
    所述耳机固定组件和所述外壳背面或所述外壳侧面为一体成型结构。
  46. 根据权利要求41-44中任一项所述的骨传导扬声器，其特征在于，
    所述耳机固定组件与所述外壳背面或所述外壳侧面之间通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  47. 根据权利要求40所述的骨传导扬声器，其特征在于，
    所述壳体为柱体，所述外壳面板和所述外壳背面分别为所述柱体的上端面和下端面；以及
    所述外壳面板和所述外壳背面在所述柱体的垂直于轴线的横截面上的投影面积相等。
  48. 根据权利要求40所述的骨传导扬声器，其特征在于，
    所述外壳面板的振动具有第一相位，所述外壳背面的振动具有第二相位；
    所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
  49. 根据权利要求48所述的骨传导扬声器，其特征在于，
    所述外壳面板的振动和所述外壳背面的振动包括频率在2000Hz到3000Hz之内的振动。
  50. 根据权利要求48所述的骨传导扬声器，其特征在于，
    所述外壳面板的振动具有第一振幅，所述外壳背面的振动具有第二振幅，所述第一振幅和所述第二振幅的比值在0.5到1.5的范围之内。
  51. 根据权利要求48所述的骨传导扬声器，其特征在于，所述外壳面板的振动产生第一漏音声波，所述外壳背面的振动产生第二漏音声波，所述第一漏音声波和所述第二漏音声波相互叠加，所述叠加减小所述第一漏音声波的幅值。
  52. 根据权利要求48所述的骨传导扬声器，其特征在于，
    所述外壳面板与所述外壳背面由杨氏模量大于4000Mpa的材料制成。
  53. 根据权利要求51所述的骨传导扬声器，其特征在于，
    所述骨传导扬声器还包括第一元件，其中，所述振动组件通过所述第一元件与所述壳体进行连接，且所述第一元件的杨氏模量大于4000Mpa。
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