WO2019221211A1 - Etiquette rfid - Google Patents

Etiquette rfid Download PDF

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Publication number
WO2019221211A1
WO2019221211A1 PCT/JP2019/019427 JP2019019427W WO2019221211A1 WO 2019221211 A1 WO2019221211 A1 WO 2019221211A1 JP 2019019427 W JP2019019427 W JP 2019019427W WO 2019221211 A1 WO2019221211 A1 WO 2019221211A1
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WO
WIPO (PCT)
Prior art keywords
rfid tag
substrate
resin member
buffer member
outer edge
Prior art date
Application number
PCT/JP2019/019427
Other languages
English (en)
Japanese (ja)
Inventor
山下　浩二
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to KR1020207032248A priority Critical patent/KR102494457B1/ko
Priority to CN201980032259.5A priority patent/CN112119402B/zh
Priority to JP2020519905A priority patent/JP7060684B2/ja
Publication of WO2019221211A1 publication Critical patent/WO2019221211A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines

Definitions

  • This disclosure relates to a RFID (Radio Frequency Identifier) tag.
  • Japanese Laid-Open Patent Publication No. 2017-76290 proposes an RFID tag that operates with high reliability even under severe use environment by improving a protector that covers the semiconductor integrated circuit in the RFID tag.
  • the RFID tag according to the present disclosure is RFID tag substrate mounted with a semiconductor integrated circuit; A resin member for holding the RFID tag substrate; A buffer member for holding the resin member; With The buffer member includes an outer edge portion, and an intermediate portion that is closer to the center than the outer edge portion and has a variable relative distance from the outer edge portion due to elasticity. The resin member is held in the intermediate portion.
  • FIG. 1 is a plan view showing an RFID tag according to Embodiment 1.
  • FIG. It is a top view which shows the resin member with which the board
  • FIG. 3B is a sectional view taken along line AA in FIG. 3A. It is a figure which shows an example of the state by which the RFID tag was attached to building material. It is the figure which looked at the state of Drawing 5 in the direction of an axis of building material. It is a side view which shows the RFID tag which concerns on Embodiment 2 of this indication.
  • FIG. 6 is a plan view showing an RFID tag according to Embodiment 2.
  • FIG. It is a top view which shows the 1st example of the board
  • FIG. 10 is an exploded perspective view of the RFID tag substrate of FIG. 9. It is a top view which shows the 2nd example of the board
  • FIG. 12 is an exploded perspective view of the RFID tag substrate of FIG. 11.
  • FIG. 1 is a side view showing the RFID tag according to the first embodiment.
  • FIG. 2 is a plan view showing the RFID tag of FIG.
  • orthogonal coordinates X, Y, and Z fixedly defined in the buffer member 30 are shown.
  • the Z direction corresponds to the expansion / contraction direction of the buffer member 30.
  • the RFID tag 1 is used by being attached to each of these pipes in order to manage, for example, a large number of pipes that are building materials for a piping facility of a ship.
  • the RFID tag 1 includes an RFID tag substrate 100, a resin member 20, a buffer member 30, and a binding member 40.
  • the buffer member 30 may be called an impact absorbing jig.
  • the buffer member 30 is made of metal and has a form of a compression coil spring in which a gap is provided between adjacent windings. As a material of the buffer member 30, stainless steel or the like having a high strength and chemical resistance is applied. Both end portions in the expansion / contraction direction of the buffer member 30 constitute an outer edge portion 31 that is an outer edge of the buffer member 30, and a central vicinity portion in the expansion / contraction direction of the buffer member 30 constitutes an intermediate portion 32 that holds the resin member 20.
  • the winding diameter (outer diameter) of the coil of the outer edge part 31 and the intermediate part 32 is substantially the same.
  • the outer lines of the intermediate portion 32 and the resin member 20 are arranged so as to be hidden by the outer edge portion 31 as shown in FIG.
  • the intermediate portion 32 and the resin member 20 do not protrude from the range of the convex polygon W1 having the minimum area surrounding the outer edge portion 31. Placed in. In FIG. 1, the convex polygon W ⁇ b> 1 is simplified for easy viewing.
  • the buffer member 30 is provided with gaps that lead to the resin member 20 from the outside along various directions such as the Z direction, the reverse direction of the Z direction, the X direction, the reverse direction of the X direction, and the Y direction. ing.
  • This gap corresponds to an example of the opening portion according to the present disclosure.
  • the RFID tag substrate 100 is a substrate on which an RFID tag semiconductor integrated circuit and an antenna are mounted. A specific configuration of the RFID tag substrate 100 will be described in detail later.
  • 3A and 3B are a plan view and a side view showing the resin member in which the RFID tag substrate is embedded.
  • 4 is a cross-sectional view taken along line AA in FIG. 3A.
  • orthogonal coordinates x1, y1, and z1 fixedly defined on the resin member 20 are shown.
  • the z1 direction is also referred to as the thickness direction of the resin member 20.
  • Resin member 20 is a resin molded product having heat resistance, weather resistance, chemical resistance and high strength.
  • the RFID tag substrate 100 is embedded in the center of the resin member 20 by molding.
  • a tie mold registered trademark
  • the resin member 20 has a disk-like form, and has a central main portion 21 holding the RFID tag substrate 100, a peripheral portion 22 extending from the main portion 21 in a direction along the x1-y1 plane, A plurality of (for example, four) through holes 23 provided in the peripheral portion 22.
  • the main part 21 is substantially circular when viewed from the z1 direction, and its diameter is larger than the length (thickness) in the z1 direction.
  • the main part 21 includes the RFID tag substrate 100 in the center so that the height direction of the RFID tag substrate 100 (the direction of the smallest dimension among the three dimensions) faces the z1 direction.
  • the peripheral portion 22 has a substantially circular outer peripheral shape when viewed from the z1 direction, and extends from the main portion 21 in the direction along the x1-y1 plane over the entire periphery of the main portion 21.
  • the length (thickness) of the peripheral portion 22 in the z1 direction is smaller than the length (thickness) of the main portion 21 in the z1 direction, whereby the peripheral portion 22 has a property of being more easily bent than the main portion 21.
  • the main portion 21 protrudes in a convex shape from the peripheral portion 22 in the z1 direction and vice versa, whereby the resin member 20 has a symmetrical shape in the z1 direction.
  • the plurality of through holes 23 are holes penetrating in the z1 direction, and are provided side by side at substantially equal intervals in the circumferential direction of the peripheral portion 22.
  • the binding member 40 is a wire or a resin binding band, and is passed through the through hole 23 of the resin member 20 to bind the peripheral portion 22 of the resin member 20 and the intermediate portion 32 of the buffer member 30. By this binding, the resin member 20 is held on the intermediate portion 32 of the buffer member 30.
  • one bundling member 40 passed through the through hole 23 is wound around two adjacent sections of the winding of the buffer member 30, but may be wound around only one section.
  • the resin member 20 may be bound to the buffer member 30 by the binding member 40 at a part (two or more) of the plurality of through holes 23, or the binding member 40 at all the through holes 23. May be bound to the buffer member 30. In addition, even when binding at two or more locations among the plurality of through holes 23, two or more through holes 23 are selected for binding so that the two through holes 23 facing each other are not included. Also good.
  • the resin member 20 is held so as to be displaceable with respect to the intermediate portion 32 of the buffer member 30.
  • a holding form can be realized, for example, by bundling the resin member 20 using only a part of the plurality of through holes 23 (for example, two that do not face each other).
  • Such a holding form can be realized by binding the binding member 40 loosely or by making the thickness of the binding member 40 sufficiently smaller than the diameter of the through hole 23.
  • FIG. 5 is a diagram illustrating an example of a state in which the RFID tag is attached to the building material.
  • FIG. 6 is a view of the state of FIG. 5 as viewed in the axial direction of the building material.
  • the RFID tag 1 is attached to, for example, a pipe 200 that is a construction material of a piping facility for a ship, and is used for managing a large number of pipes 200.
  • the RFID tag 1 is attached by engaging a portion of the outer edge portion 31 of the buffer member 30 with, for example, a bolt hole 211 of the flange 210 of the pipe 200.
  • the pipe 200 may be plated by passing it through a high temperature liquid agent.
  • a high temperature liquid agent When the conventional RFID tag is pasted on the pipe, there is a problem that normal plating cannot be performed on the pasting surface, and there is a problem that the function of the RFID tag cover is eroded due to high heat and chemicals. .
  • identification information is provided on the surface of the pipe 200 using characters or codes, there is a problem that the identification information disappears due to the plating process.
  • the RFID tag substrate 100 is embedded in the resin member 20 having heat resistance and chemical resistance, and the buffer member 30 is made of a metal having heat resistance and chemical resistance. It is configured.
  • the function of the RFID tag 1 is not impaired. Furthermore, since the RFID tag 1 can be attached to the pipe 200 with a relatively high degree of freedom, the normal plating process of the pipe 200 is unlikely to be hindered by the RFID tag 1.
  • the resin member 20 holding the RFID tag substrate 100 is held by the intermediate portion 32 of the buffer member 30 and further buffered by elastic deformation of the buffer member 30.
  • the relative distance between the outer edge portion 31 and the intermediate portion of the member 30 is variable.
  • the resin member 20 is held displaceably at the intermediate portion 32 within a range in which the resin member 20 does not protrude outside the buffer member 30. Therefore, even when a large force is applied to the buffer member 30 and the intermediate portion 32 is relatively elastically deformed, a force such as pressure, torsional force, or tensile force is applied to the resin member 20 due to the elastic deformation. Can be suppressed. Thereby, the high robustness with respect to the external force of RFID tag 1 is acquired.
  • the RFID tag substrate 100 is embedded in the resin member 20. Therefore, the RFID tag substrate 100 is not directly exposed to the external environment, the heat resistance and chemical resistance of the RFID tag are improved, and high robustness of the RFID tag 1 against high heat and chemicals can be obtained.
  • the buffer member 30 is made of metal, it is easy to ensure the required elasticity, strength, heat resistance, and chemical resistance. Furthermore, since the buffer member 30 has gaps that lead to the resin member 20 from the outside in various directions, even if the buffer member 30 is made of metal, obstruction of wireless communication of the RFID tag substrate 100 is reduced. The function of tag 1 is not impaired.
  • the buffer member 30 has the form of a compression coil spring, both end portions in the expansion / contraction direction constitute the outer edge portion 31, and the resin member 20 is located near the center in the expansion / contraction direction.
  • maintain is comprised. Therefore, the above-described configuration that exerts a buffering effect can be easily manufactured, and the RFID tag 1 having high robustness can be reduced in price.
  • the resin member 20 includes the main portion 21 where the RFID tag substrate 100 is disposed, and the peripheral portion 22 extending from the main portion 21 in the direction along the plane. And a plurality of through holes 23 provided in the peripheral portion 22.
  • the binding member 40 passed through the through hole 23 of the peripheral portion 22 is bound to the peripheral portion 22 and the intermediate portion 32 of the buffer member 30.
  • the main portion 21 of the resin member 20 is thicker than the peripheral portion 22. Therefore, even when a force is applied to the resin member 20 from the buffer member 30 via the binding member 40, the peripheral portion 22 absorbs the force by bending first, and the force is applied to the RFID tag substrate 100 of the main portion 21. It can be suppressed. Thereby, the robustness of the RFID tag 1 is further improved.
  • FIG. 7 is a side view showing the RFID tag according to the second embodiment.
  • FIG. 8 is a plan view showing the RFID tag of FIG.
  • the RFID tag 1A of the second embodiment is mainly different from the first embodiment in the shape of the buffer member 30A, and the other components are the same as those of the RFID tag 1 of the first embodiment.
  • the same components as those of the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.
  • the buffer member 30A is made of metal and has the form of a compression coil spring in which a gap is provided between adjacent windings.
  • a material of the buffer member 30A stainless steel or the like having high strength and chemical resistance is applied.
  • Both end portions in the expansion / contraction direction of the buffer member 30A constitute an outer edge portion 31A which is an outer edge of the buffer member 30A, and a central vicinity portion in the expansion / contraction direction of the buffer member 30A constitutes an intermediate portion 32 holding the resin member 20.
  • the coil winding diameter (outer diameter) of the outer edge portion 31A is larger than the coil winding diameter (outer diameter) of the intermediate portion 32.
  • the intermediate portion 32 when viewed from the Z direction, is disposed within a range of a convex polygon W3 having a minimum area surrounding the outer edge portion 31A.
  • the intermediate portion 32 when viewed from the Y direction, is disposed within the range of the convex polygon W ⁇ b> 2 having the smallest area surrounding the outside of the outer edge difference.
  • the convex polygons W2 and W3 are simplified for easy understanding.
  • the buffer member 30 ⁇ / b> A is provided with a gap that leads to the resin member 20 from the outside along various directions such as the Z direction, the reverse direction of the Z direction, the X direction, the reverse direction of the X direction, and the Y direction depending on the form of the compression coil spring. ing.
  • This gap corresponds to an example of the opening portion according to the present disclosure.
  • the intermediate portion 32 of the buffer member 30A is a convex polygon having a minimum area that surrounds the outer periphery of the outer edge portion 31A when viewed from the X direction, the Y direction, and the Z direction. Arranged within the range of W2 and W3. Therefore, when the RFID tag 1A is attached to the article, when another object collides with the RFID tag 1A from the outside, the object collides with the outer edge portion 31A of the buffer member 30A and directly collides with the intermediate portion 32. hard. Thereby, even when an object collides from the outside, it is possible to reduce a large impact from being applied to the resin member 20 and the RFID tag substrate 100 held by the intermediate portion 32 of the buffer member 30A, and the robustness of the RFID tag 1 Is improved more.
  • the RFID tag substrates 100 and 100A to 100K of the first to twelfth examples mounted on the RFID tags 1 and 1A of the first and second embodiments will be described in detail.
  • 9 to 15 show orthogonal coordinates x, y, and z that are fixedly defined on the RFID tag substrate 100.
  • the z direction is also referred to as a height direction of the RFID tag substrate 100. The height mentioned here is merely a way of calling for convenience, and does not need to coincide with the actual height direction when the RFID tag 1 is used.
  • the z direction coincides with the z1 direction defined for the resin member 20.
  • 9A, 9B, and 9C are a plan view, a longitudinal sectional view, and a bottom view showing a first example of the RFID tag substrate, respectively.
  • 10 is an exploded perspective view of the RFID tag substrate of FIG.
  • the RFID tag substrate 100 of the first example is a package-like substrate using a ceramic material as an insulator, and accommodates a chip-like semiconductor integrated circuit 101 and has conductors (121, 122) constituting an antenna. Is formed.
  • the RFID tag substrate 100 is a single unit in which the semiconductor integrated circuit 101 is mounted, and is a module capable of receiving power from a reader / writer via radio waves and wirelessly communicating with the reader / writer.
  • the RFID tag substrate 100 is not particularly limited, for example, radio communication is performed using radio waves having a frequency of a UHF (Ultra High Frequency) band such as 920 MHz.
  • UHF Ultra High Frequency
  • the RFID tag substrate 100 includes a dielectric substrate 111, a radiating conductor 121, a ground conductor 122, interlayer conductors 123a to 123c, and connection pads 124, as shown in FIGS. In FIG. 10, the locations where the interlayer conductors 123a to 123c pass are indicated by chain lines and broken lines.
  • the dielectric substrate 111 has a first main surface 111a extending in the xy direction on one side and a second main surface 111b extending in the xy direction on the opposite side, and has a height (length in the z direction). It has a rectangular parallelepiped shape shorter than the width dimension (length in the x direction) and the depth dimension (length in the y direction). Furthermore, the dielectric substrate 111 includes a concave cavity 113 opened in the first main surface 111a.
  • the dielectric substrate 111 is a dielectric such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. It can be formed by stacking and sintering green sheets.
  • connection pad 124 that is a conductor is provided on the inner surface of the bottom of the cavity 113.
  • the connection pad 124 is electrically connected to the terminal of the semiconductor integrated circuit 101 by wire bonding or the like.
  • the radiation conductor 121, the ground conductor 122, and the interlayer conductors 123a, 123b, and 123c constitute a plate-like inverted F antenna.
  • the radiation conductor 121 is a film-like conductor, and is provided in a wide range on the first main surface 111 a of the dielectric substrate 111 except for the opening of the cavity 113.
  • the ground conductor 122 is a film-like conductor and is provided in a wide range of the second main surface 111b of the dielectric substrate 111.
  • the radiating conductor 121 and the ground conductor 122 are placed at a corresponding position of the ceramic green sheet (dielectric substrate 111 before sintering) by using a method such as screen printing at a stage before the dielectric substrate 111 is sintered. It can be formed by printing and then sintering together with a ceramic green sheet.
  • a material obtained by mixing copper powder with an organic solvent and an organic binder can be used as the metal paste.
  • the exposed surfaces of the radiation conductor 121, the ground conductor 122, and the connection pad 124 may be coated with a plating layer of nickel, cobalt, palladium, gold, or the like, thereby suppressing oxidative corrosion and improving the bonding characteristics of wire bonding. .
  • the interlayer conductor 123a is passed in the z direction between the first main surface 111a and the second main surface 111b of the dielectric substrate 111, and electrically connects the radiation conductor 121 and the ground conductor 122.
  • the interlayer conductor 123a is provided closer to one end in the longitudinal direction (x direction) of the radiation conductor 121 than the cavity 113 is.
  • the interlayer conductor 123a may be provided at a plurality of locations separated in the short direction (y direction) of the radiation conductor 121.
  • the interlayer conductor 123b is passed through the dielectric substrate 111 in the z direction, and electrically connects one connection pad 124 of the cavity 113 and the ground conductor 122.
  • the other interlayer conductor 123c is passed through the dielectric substrate 111 in the z direction, and electrically connects the other connection pad 124 of the cavity 113 and the radiation conductor 121.
  • a through hole or an interlayer hole is provided at a corresponding portion of the ceramic green sheet, filled with a metal paste, and sintered together with the ceramic green sheet.
  • a metal paste for example, a material in which copper powder is mixed with an organic solvent and an organic binder can be applied as in the material of the radiation conductor 121.
  • 11A, 11B, and 11C are a plan view, a longitudinal sectional view, and a bottom view showing a second example of the RFID tag substrate, respectively.
  • 12 is an exploded perspective view of the RFID tag substrate of FIG. In FIG. 12, the locations where the interlayer conductors 123a, 123b, 123d, and 123e pass are indicated by chain lines and broken lines.
  • the RFID tag substrate 100A of the second example is mainly different in that a capacitive conductor 125 is added to the configuration of the first example.
  • the same components as those in the first example are denoted by the same reference numerals as those in the first example, and detailed description thereof is omitted.
  • the capacitive conductor 125 is a film-like conductor provided in an intermediate layer between the first main surface 111 a and the second main surface 111 b of the dielectric substrate 111, and is electrostatically opposed to a part of the ground conductor 122. Configure capacity. Due to this capacitance, the RFID tag substrate 100A can be made more compact.
  • the interlayer distance between the capacitive conductor 125 and the ground conductor 122 is shorter than the interlayer distance between the capacitive conductor 125 and the radiation conductor 121.
  • the capacitive conductor 125 can be formed as follows.
  • the above-described metal paste is provided by screen printing or the like on the corresponding intermediate layer of the ceramic green sheet. Thereafter, a plurality of ceramic green sheets are stacked, and the metal paste is sintered together with the ceramic green sheets. Thereby, the capacitive conductor 125 can be formed in the intermediate layer of the dielectric substrate 111.
  • the capacitor conductor 125 is electrically connected to one connection pad 124 via the interlayer conductor 123d and electrically connected to the radiation conductor 121 via the interlayer conductor 123e.
  • the interlayer conductors 123d and 123e can be formed in the same manner as the interlayer conductors 123a and 123b described above.
  • FIGS. 13A to 16B are longitudinal sectional views showing third to twelfth examples of the RFID tag substrate, respectively.
  • the same components as those of the RFID tag substrates 100 and 100A of the first example and the second example are denoted by the same reference numerals.
  • the electrical connection among the radiation conductor 121, the ground conductor 122, the connection pad 124 and the capacitive conductor 125, the position of the capacitive conductor 125, and Presence / absence and some detailed structures can be changed as appropriate.
  • the RFID tag substrate 100B (FIG. 13A) of the third example is an example in which the radiation conductor 121 is connected to one connection pad 124 and the capacitive conductor 125 via the interlayer conductors 123c and 123e, respectively.
  • the capacitive conductor 125 is omitted, and one of the connection pads 124 extends between the layers of the dielectric substrate 111 in the x direction via the connection conductor 127. It is an example connected to 123a.
  • the RFID tag substrate 100D (FIG. 13C) of the fifth example is an example in which the capacitive conductor 125 is omitted and both the connection pads are connected to the radiation conductor 121 via the interlayer conductors 123c and 123f.
  • the RFID tag substrate 100E (FIG. 14A) of the sixth example is an example in which an interlayer conductor 123a that connects the radiating conductor 121 and the ground conductor 122 is disposed in the vicinity of the end far from the cavity 113.
  • the RFID tag substrate 100F (FIG. 14B) of the seventh example is an example in which the capacitive conductor 125 is provided at a position overlapping the cavity 113 when viewed in the z direction. Further, the RFID tag substrate 100F of the seventh example is an example in which the cavity 113 containing the semiconductor integrated circuit 101 is filled with a sealing material 131 such as resin and the opening is sealed.
  • the structure for sealing the opening of the cavity 113 can be similarly applied to the RFID tag substrates 100, 100A to 100E, and 100G to 100K of the first to sixth examples and the eighth to twelfth examples. is there.
  • the radiation conductor 121 may be provided including the upper part of the opening of the cavity 113.
  • the RFID tag substrate 100G (FIG. 15A) of the eighth example is provided at a position where the capacitive conductor 125 overlaps the cavity 113 in the z direction, and one connection pad 124 is connected to the capacitive conductor 125 via the interlayer conductor 123h. This is an example.
  • the RFID tag substrate 100H (FIG. 15B) of the ninth example has a capacitive conductor 125 that overlaps the cavity 113 in the z direction, and one side through a connection conductor 128 that extends between the layers of the dielectric substrate 111 in the x direction.
  • the RFID tag substrate 100I (FIG. 15C) of the tenth example is provided at a position where the capacitive conductor 125 overlaps the cavity 113 in the z direction, while the two connection pads 124 are connected to the radiating conductor 121 via the interlayer conductors 123f and 123c. This is an example of connection.
  • the RFID tag substrate 100J (FIG. 16A) of the eleventh example is an example in which the capacitive conductor 125 is configured to face the ground conductor 122 with a large area.
  • a plate-like internal ground conductor 129 connected to the ground conductor 122 and the radiation conductor 121 via the interlayer conductor 123i is provided between the layers of the dielectric substrate 111.
  • the capacitive conductor 125 is disposed to face the ground conductor 122 and the internal ground conductor 129 so that a large capacitance is formed.
  • the form of the compression coil spring is shown as the buffer member.
  • the material of the buffer material is not limited to metal, and various materials such as resin may be applied.
  • the RFID tag substrate is embedded in the resin member by molding.
  • the present invention is not limited to this, and the RFID tag substrate is accommodated in, for example, a recess provided in the resin member. A configuration in which the concave portion is closed with a lid may be applied.
  • the bundling by the bundling member is shown as an example, but the present invention is not limited to this, and various forms may be applied. Further, the shape of the resin member is not limited to the example of the embodiment.
  • a package-like RFID tag substrate using ceramic as an insulating portion is shown, but the RFID tag substrate is not limited to this.
  • various substrates such as a configuration in which a wiring that configures an antenna is provided on a film-like substrate and a semiconductor integrated circuit chip is mounted may be applied.
  • the RFID tag substrate may include a battery.
  • the description of this embodiment is illustrative in all aspects, and the present invention is not limited thereto.
  • the present disclosure can also be applied to embodiments in which combinations, changes, replacements, additions, omissions, and the like have been made as appropriate, as long as they do not contradict each other. And it is understood that the countless modification which is not illustrated can be assumed without deviating from the scope of the present invention.
  • This disclosure can be used for RFID tags.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Waveguide Aerials (AREA)

Abstract

La présente invention concerne une étiquette RFID qui présente une solidité élevée. Ladite étiquette RFID (1) comprend : un substrat (100) pour des étiquettes RFID, sur lequel est monté un circuit intégré à semi-conducteur ; un élément en résine (20) qui maintient le substrat pour des étiquettes RFID ; et un élément tampon (30) qui maintient l'élément en résine. L'élément tampon (30) a une partie périphérique externe (31) et une partie intermédiaire (32) qui est située plus près du centre que la partie périphérique externe, et qui est conçue de telle sorte que la distance relative entre elle-même et la partie périphérique externe est variable par élasticité ; et l'élément en résine (20) est maintenu par la partie intermédiaire (32).
PCT/JP2019/019427 2018-05-18 2019-05-16 Etiquette rfid WO2019221211A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020207032248A KR102494457B1 (ko) 2018-05-18 2019-05-16 Rfid 태그
CN201980032259.5A CN112119402B (zh) 2018-05-18 2019-05-16 Rfid标签
JP2020519905A JP7060684B2 (ja) 2018-05-18 2019-05-16 Ｒｆｉｄタグ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-095835 2018-05-18
JP2018095835 2018-05-18

Publications (1)

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WO2019221211A1 true WO2019221211A1 (fr) 2019-11-21

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JP (1) JP7060684B2 (fr)
KR (1) KR102494457B1 (fr)
CN (1) CN112119402B (fr)
WO (1) WO2019221211A1 (fr)

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2012118811A (ja) * 2010-12-01 2012-06-21 Toppan Printing Co Ltd Ｉｃタグ
US20130200164A1 (en) * 2010-08-11 2013-08-08 Karl-Heinz Wendisch Transponder
JP2014067234A (ja) * 2012-09-26 2014-04-17 Hitachi Chemical Co Ltd Ｒｆｉｄタグ及び自動認識システム
WO2018101315A1 (fr) * 2016-12-02 2018-06-07 株式会社村田製作所 Etiquette rfid

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JP4826195B2 (ja) * 2005-09-30 2011-11-30 大日本印刷株式会社 Ｒｆｉｄタグ
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