WO2019221211A1 - Rfid tag - Google Patents

Rfid tag Download PDF

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Publication number
WO2019221211A1
WO2019221211A1 PCT/JP2019/019427 JP2019019427W WO2019221211A1 WO 2019221211 A1 WO2019221211 A1 WO 2019221211A1 JP 2019019427 W JP2019019427 W JP 2019019427W WO 2019221211 A1 WO2019221211 A1 WO 2019221211A1
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WO
WIPO (PCT)
Prior art keywords
rfid tag
substrate
resin member
buffer member
outer edge
Prior art date
Application number
PCT/JP2019/019427
Other languages
French (fr)
Japanese (ja)
Inventor
山下　浩二
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2020519905A priority Critical patent/JP7060684B2/en
Priority to CN201980032259.5A priority patent/CN112119402B/en
Priority to KR1020207032248A priority patent/KR102494457B1/en
Publication of WO2019221211A1 publication Critical patent/WO2019221211A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines

Definitions

  • This disclosure relates to a RFID (Radio Frequency Identifier) tag.
  • Japanese Laid-Open Patent Publication No. 2017-76290 proposes an RFID tag that operates with high reliability even under severe use environment by improving a protector that covers the semiconductor integrated circuit in the RFID tag.
  • the RFID tag according to the present disclosure is RFID tag substrate mounted with a semiconductor integrated circuit; A resin member for holding the RFID tag substrate; A buffer member for holding the resin member; With The buffer member includes an outer edge portion, and an intermediate portion that is closer to the center than the outer edge portion and has a variable relative distance from the outer edge portion due to elasticity. The resin member is held in the intermediate portion.
  • FIG. 1 is a plan view showing an RFID tag according to Embodiment 1.
  • FIG. It is a top view which shows the resin member with which the board
  • FIG. 3B is a sectional view taken along line AA in FIG. 3A. It is a figure which shows an example of the state by which the RFID tag was attached to building material. It is the figure which looked at the state of Drawing 5 in the direction of an axis of building material. It is a side view which shows the RFID tag which concerns on Embodiment 2 of this indication.
  • FIG. 6 is a plan view showing an RFID tag according to Embodiment 2.
  • FIG. It is a top view which shows the 1st example of the board
  • FIG. 10 is an exploded perspective view of the RFID tag substrate of FIG. 9. It is a top view which shows the 2nd example of the board
  • FIG. 12 is an exploded perspective view of the RFID tag substrate of FIG. 11.
  • FIG. 1 is a side view showing the RFID tag according to the first embodiment.
  • FIG. 2 is a plan view showing the RFID tag of FIG.
  • orthogonal coordinates X, Y, and Z fixedly defined in the buffer member 30 are shown.
  • the Z direction corresponds to the expansion / contraction direction of the buffer member 30.
  • the RFID tag 1 is used by being attached to each of these pipes in order to manage, for example, a large number of pipes that are building materials for a piping facility of a ship.
  • the RFID tag 1 includes an RFID tag substrate 100, a resin member 20, a buffer member 30, and a binding member 40.
  • the buffer member 30 may be called an impact absorbing jig.
  • the buffer member 30 is made of metal and has a form of a compression coil spring in which a gap is provided between adjacent windings. As a material of the buffer member 30, stainless steel or the like having a high strength and chemical resistance is applied. Both end portions in the expansion / contraction direction of the buffer member 30 constitute an outer edge portion 31 that is an outer edge of the buffer member 30, and a central vicinity portion in the expansion / contraction direction of the buffer member 30 constitutes an intermediate portion 32 that holds the resin member 20.
  • the winding diameter (outer diameter) of the coil of the outer edge part 31 and the intermediate part 32 is substantially the same.
  • the outer lines of the intermediate portion 32 and the resin member 20 are arranged so as to be hidden by the outer edge portion 31 as shown in FIG.
  • the intermediate portion 32 and the resin member 20 do not protrude from the range of the convex polygon W1 having the minimum area surrounding the outer edge portion 31. Placed in. In FIG. 1, the convex polygon W ⁇ b> 1 is simplified for easy viewing.
  • the buffer member 30 is provided with gaps that lead to the resin member 20 from the outside along various directions such as the Z direction, the reverse direction of the Z direction, the X direction, the reverse direction of the X direction, and the Y direction. ing.
  • This gap corresponds to an example of the opening portion according to the present disclosure.
  • the RFID tag substrate 100 is a substrate on which an RFID tag semiconductor integrated circuit and an antenna are mounted. A specific configuration of the RFID tag substrate 100 will be described in detail later.
  • 3A and 3B are a plan view and a side view showing the resin member in which the RFID tag substrate is embedded.
  • 4 is a cross-sectional view taken along line AA in FIG. 3A.
  • orthogonal coordinates x1, y1, and z1 fixedly defined on the resin member 20 are shown.
  • the z1 direction is also referred to as the thickness direction of the resin member 20.
  • Resin member 20 is a resin molded product having heat resistance, weather resistance, chemical resistance and high strength.
  • the RFID tag substrate 100 is embedded in the center of the resin member 20 by molding.
  • a tie mold registered trademark
  • the resin member 20 has a disk-like form, and has a central main portion 21 holding the RFID tag substrate 100, a peripheral portion 22 extending from the main portion 21 in a direction along the x1-y1 plane, A plurality of (for example, four) through holes 23 provided in the peripheral portion 22.
  • the main part 21 is substantially circular when viewed from the z1 direction, and its diameter is larger than the length (thickness) in the z1 direction.
  • the main part 21 includes the RFID tag substrate 100 in the center so that the height direction of the RFID tag substrate 100 (the direction of the smallest dimension among the three dimensions) faces the z1 direction.
  • the peripheral portion 22 has a substantially circular outer peripheral shape when viewed from the z1 direction, and extends from the main portion 21 in the direction along the x1-y1 plane over the entire periphery of the main portion 21.
  • the length (thickness) of the peripheral portion 22 in the z1 direction is smaller than the length (thickness) of the main portion 21 in the z1 direction, whereby the peripheral portion 22 has a property of being more easily bent than the main portion 21.
  • the main portion 21 protrudes in a convex shape from the peripheral portion 22 in the z1 direction and vice versa, whereby the resin member 20 has a symmetrical shape in the z1 direction.
  • the plurality of through holes 23 are holes penetrating in the z1 direction, and are provided side by side at substantially equal intervals in the circumferential direction of the peripheral portion 22.
  • the binding member 40 is a wire or a resin binding band, and is passed through the through hole 23 of the resin member 20 to bind the peripheral portion 22 of the resin member 20 and the intermediate portion 32 of the buffer member 30. By this binding, the resin member 20 is held on the intermediate portion 32 of the buffer member 30.
  • one bundling member 40 passed through the through hole 23 is wound around two adjacent sections of the winding of the buffer member 30, but may be wound around only one section.
  • the resin member 20 may be bound to the buffer member 30 by the binding member 40 at a part (two or more) of the plurality of through holes 23, or the binding member 40 at all the through holes 23. May be bound to the buffer member 30. In addition, even when binding at two or more locations among the plurality of through holes 23, two or more through holes 23 are selected for binding so that the two through holes 23 facing each other are not included. Also good.
  • the resin member 20 is held so as to be displaceable with respect to the intermediate portion 32 of the buffer member 30.
  • a holding form can be realized, for example, by bundling the resin member 20 using only a part of the plurality of through holes 23 (for example, two that do not face each other).
  • Such a holding form can be realized by binding the binding member 40 loosely or by making the thickness of the binding member 40 sufficiently smaller than the diameter of the through hole 23.
  • FIG. 5 is a diagram illustrating an example of a state in which the RFID tag is attached to the building material.
  • FIG. 6 is a view of the state of FIG. 5 as viewed in the axial direction of the building material.
  • the RFID tag 1 is attached to, for example, a pipe 200 that is a construction material of a piping facility for a ship, and is used for managing a large number of pipes 200.
  • the RFID tag 1 is attached by engaging a portion of the outer edge portion 31 of the buffer member 30 with, for example, a bolt hole 211 of the flange 210 of the pipe 200.
  • the pipe 200 may be plated by passing it through a high temperature liquid agent.
  • a high temperature liquid agent When the conventional RFID tag is pasted on the pipe, there is a problem that normal plating cannot be performed on the pasting surface, and there is a problem that the function of the RFID tag cover is eroded due to high heat and chemicals. .
  • identification information is provided on the surface of the pipe 200 using characters or codes, there is a problem that the identification information disappears due to the plating process.
  • the RFID tag substrate 100 is embedded in the resin member 20 having heat resistance and chemical resistance, and the buffer member 30 is made of a metal having heat resistance and chemical resistance. It is configured.
  • the function of the RFID tag 1 is not impaired. Furthermore, since the RFID tag 1 can be attached to the pipe 200 with a relatively high degree of freedom, the normal plating process of the pipe 200 is unlikely to be hindered by the RFID tag 1.
  • the resin member 20 holding the RFID tag substrate 100 is held by the intermediate portion 32 of the buffer member 30 and further buffered by elastic deformation of the buffer member 30.
  • the relative distance between the outer edge portion 31 and the intermediate portion of the member 30 is variable.
  • the resin member 20 is held displaceably at the intermediate portion 32 within a range in which the resin member 20 does not protrude outside the buffer member 30. Therefore, even when a large force is applied to the buffer member 30 and the intermediate portion 32 is relatively elastically deformed, a force such as pressure, torsional force, or tensile force is applied to the resin member 20 due to the elastic deformation. Can be suppressed. Thereby, the high robustness with respect to the external force of RFID tag 1 is acquired.
  • the RFID tag substrate 100 is embedded in the resin member 20. Therefore, the RFID tag substrate 100 is not directly exposed to the external environment, the heat resistance and chemical resistance of the RFID tag are improved, and high robustness of the RFID tag 1 against high heat and chemicals can be obtained.
  • the buffer member 30 is made of metal, it is easy to ensure the required elasticity, strength, heat resistance, and chemical resistance. Furthermore, since the buffer member 30 has gaps that lead to the resin member 20 from the outside in various directions, even if the buffer member 30 is made of metal, obstruction of wireless communication of the RFID tag substrate 100 is reduced. The function of tag 1 is not impaired.
  • the buffer member 30 has the form of a compression coil spring, both end portions in the expansion / contraction direction constitute the outer edge portion 31, and the resin member 20 is located near the center in the expansion / contraction direction.
  • maintain is comprised. Therefore, the above-described configuration that exerts a buffering effect can be easily manufactured, and the RFID tag 1 having high robustness can be reduced in price.
  • the resin member 20 includes the main portion 21 where the RFID tag substrate 100 is disposed, and the peripheral portion 22 extending from the main portion 21 in the direction along the plane. And a plurality of through holes 23 provided in the peripheral portion 22.
  • the binding member 40 passed through the through hole 23 of the peripheral portion 22 is bound to the peripheral portion 22 and the intermediate portion 32 of the buffer member 30.
  • the main portion 21 of the resin member 20 is thicker than the peripheral portion 22. Therefore, even when a force is applied to the resin member 20 from the buffer member 30 via the binding member 40, the peripheral portion 22 absorbs the force by bending first, and the force is applied to the RFID tag substrate 100 of the main portion 21. It can be suppressed. Thereby, the robustness of the RFID tag 1 is further improved.
  • FIG. 7 is a side view showing the RFID tag according to the second embodiment.
  • FIG. 8 is a plan view showing the RFID tag of FIG.
  • the RFID tag 1A of the second embodiment is mainly different from the first embodiment in the shape of the buffer member 30A, and the other components are the same as those of the RFID tag 1 of the first embodiment.
  • the same components as those of the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.
  • the buffer member 30A is made of metal and has the form of a compression coil spring in which a gap is provided between adjacent windings.
  • a material of the buffer member 30A stainless steel or the like having high strength and chemical resistance is applied.
  • Both end portions in the expansion / contraction direction of the buffer member 30A constitute an outer edge portion 31A which is an outer edge of the buffer member 30A, and a central vicinity portion in the expansion / contraction direction of the buffer member 30A constitutes an intermediate portion 32 holding the resin member 20.
  • the coil winding diameter (outer diameter) of the outer edge portion 31A is larger than the coil winding diameter (outer diameter) of the intermediate portion 32.
  • the intermediate portion 32 when viewed from the Z direction, is disposed within a range of a convex polygon W3 having a minimum area surrounding the outer edge portion 31A.
  • the intermediate portion 32 when viewed from the Y direction, is disposed within the range of the convex polygon W ⁇ b> 2 having the smallest area surrounding the outside of the outer edge difference.
  • the convex polygons W2 and W3 are simplified for easy understanding.
  • the buffer member 30 ⁇ / b> A is provided with a gap that leads to the resin member 20 from the outside along various directions such as the Z direction, the reverse direction of the Z direction, the X direction, the reverse direction of the X direction, and the Y direction depending on the form of the compression coil spring. ing.
  • This gap corresponds to an example of the opening portion according to the present disclosure.
  • the intermediate portion 32 of the buffer member 30A is a convex polygon having a minimum area that surrounds the outer periphery of the outer edge portion 31A when viewed from the X direction, the Y direction, and the Z direction. Arranged within the range of W2 and W3. Therefore, when the RFID tag 1A is attached to the article, when another object collides with the RFID tag 1A from the outside, the object collides with the outer edge portion 31A of the buffer member 30A and directly collides with the intermediate portion 32. hard. Thereby, even when an object collides from the outside, it is possible to reduce a large impact from being applied to the resin member 20 and the RFID tag substrate 100 held by the intermediate portion 32 of the buffer member 30A, and the robustness of the RFID tag 1 Is improved more.
  • the RFID tag substrates 100 and 100A to 100K of the first to twelfth examples mounted on the RFID tags 1 and 1A of the first and second embodiments will be described in detail.
  • 9 to 15 show orthogonal coordinates x, y, and z that are fixedly defined on the RFID tag substrate 100.
  • the z direction is also referred to as a height direction of the RFID tag substrate 100. The height mentioned here is merely a way of calling for convenience, and does not need to coincide with the actual height direction when the RFID tag 1 is used.
  • the z direction coincides with the z1 direction defined for the resin member 20.
  • 9A, 9B, and 9C are a plan view, a longitudinal sectional view, and a bottom view showing a first example of the RFID tag substrate, respectively.
  • 10 is an exploded perspective view of the RFID tag substrate of FIG.
  • the RFID tag substrate 100 of the first example is a package-like substrate using a ceramic material as an insulator, and accommodates a chip-like semiconductor integrated circuit 101 and has conductors (121, 122) constituting an antenna. Is formed.
  • the RFID tag substrate 100 is a single unit in which the semiconductor integrated circuit 101 is mounted, and is a module capable of receiving power from a reader / writer via radio waves and wirelessly communicating with the reader / writer.
  • the RFID tag substrate 100 is not particularly limited, for example, radio communication is performed using radio waves having a frequency of a UHF (Ultra High Frequency) band such as 920 MHz.
  • UHF Ultra High Frequency
  • the RFID tag substrate 100 includes a dielectric substrate 111, a radiating conductor 121, a ground conductor 122, interlayer conductors 123a to 123c, and connection pads 124, as shown in FIGS. In FIG. 10, the locations where the interlayer conductors 123a to 123c pass are indicated by chain lines and broken lines.
  • the dielectric substrate 111 has a first main surface 111a extending in the xy direction on one side and a second main surface 111b extending in the xy direction on the opposite side, and has a height (length in the z direction). It has a rectangular parallelepiped shape shorter than the width dimension (length in the x direction) and the depth dimension (length in the y direction). Furthermore, the dielectric substrate 111 includes a concave cavity 113 opened in the first main surface 111a.
  • the dielectric substrate 111 is a dielectric such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. It can be formed by stacking and sintering green sheets.
  • connection pad 124 that is a conductor is provided on the inner surface of the bottom of the cavity 113.
  • the connection pad 124 is electrically connected to the terminal of the semiconductor integrated circuit 101 by wire bonding or the like.
  • the radiation conductor 121, the ground conductor 122, and the interlayer conductors 123a, 123b, and 123c constitute a plate-like inverted F antenna.
  • the radiation conductor 121 is a film-like conductor, and is provided in a wide range on the first main surface 111 a of the dielectric substrate 111 except for the opening of the cavity 113.
  • the ground conductor 122 is a film-like conductor and is provided in a wide range of the second main surface 111b of the dielectric substrate 111.
  • the radiating conductor 121 and the ground conductor 122 are placed at a corresponding position of the ceramic green sheet (dielectric substrate 111 before sintering) by using a method such as screen printing at a stage before the dielectric substrate 111 is sintered. It can be formed by printing and then sintering together with a ceramic green sheet.
  • a material obtained by mixing copper powder with an organic solvent and an organic binder can be used as the metal paste.
  • the exposed surfaces of the radiation conductor 121, the ground conductor 122, and the connection pad 124 may be coated with a plating layer of nickel, cobalt, palladium, gold, or the like, thereby suppressing oxidative corrosion and improving the bonding characteristics of wire bonding. .
  • the interlayer conductor 123a is passed in the z direction between the first main surface 111a and the second main surface 111b of the dielectric substrate 111, and electrically connects the radiation conductor 121 and the ground conductor 122.
  • the interlayer conductor 123a is provided closer to one end in the longitudinal direction (x direction) of the radiation conductor 121 than the cavity 113 is.
  • the interlayer conductor 123a may be provided at a plurality of locations separated in the short direction (y direction) of the radiation conductor 121.
  • the interlayer conductor 123b is passed through the dielectric substrate 111 in the z direction, and electrically connects one connection pad 124 of the cavity 113 and the ground conductor 122.
  • the other interlayer conductor 123c is passed through the dielectric substrate 111 in the z direction, and electrically connects the other connection pad 124 of the cavity 113 and the radiation conductor 121.
  • a through hole or an interlayer hole is provided at a corresponding portion of the ceramic green sheet, filled with a metal paste, and sintered together with the ceramic green sheet.
  • a metal paste for example, a material in which copper powder is mixed with an organic solvent and an organic binder can be applied as in the material of the radiation conductor 121.
  • 11A, 11B, and 11C are a plan view, a longitudinal sectional view, and a bottom view showing a second example of the RFID tag substrate, respectively.
  • 12 is an exploded perspective view of the RFID tag substrate of FIG. In FIG. 12, the locations where the interlayer conductors 123a, 123b, 123d, and 123e pass are indicated by chain lines and broken lines.
  • the RFID tag substrate 100A of the second example is mainly different in that a capacitive conductor 125 is added to the configuration of the first example.
  • the same components as those in the first example are denoted by the same reference numerals as those in the first example, and detailed description thereof is omitted.
  • the capacitive conductor 125 is a film-like conductor provided in an intermediate layer between the first main surface 111 a and the second main surface 111 b of the dielectric substrate 111, and is electrostatically opposed to a part of the ground conductor 122. Configure capacity. Due to this capacitance, the RFID tag substrate 100A can be made more compact.
  • the interlayer distance between the capacitive conductor 125 and the ground conductor 122 is shorter than the interlayer distance between the capacitive conductor 125 and the radiation conductor 121.
  • the capacitive conductor 125 can be formed as follows.
  • the above-described metal paste is provided by screen printing or the like on the corresponding intermediate layer of the ceramic green sheet. Thereafter, a plurality of ceramic green sheets are stacked, and the metal paste is sintered together with the ceramic green sheets. Thereby, the capacitive conductor 125 can be formed in the intermediate layer of the dielectric substrate 111.
  • the capacitor conductor 125 is electrically connected to one connection pad 124 via the interlayer conductor 123d and electrically connected to the radiation conductor 121 via the interlayer conductor 123e.
  • the interlayer conductors 123d and 123e can be formed in the same manner as the interlayer conductors 123a and 123b described above.
  • FIGS. 13A to 16B are longitudinal sectional views showing third to twelfth examples of the RFID tag substrate, respectively.
  • the same components as those of the RFID tag substrates 100 and 100A of the first example and the second example are denoted by the same reference numerals.
  • the electrical connection among the radiation conductor 121, the ground conductor 122, the connection pad 124 and the capacitive conductor 125, the position of the capacitive conductor 125, and Presence / absence and some detailed structures can be changed as appropriate.
  • the RFID tag substrate 100B (FIG. 13A) of the third example is an example in which the radiation conductor 121 is connected to one connection pad 124 and the capacitive conductor 125 via the interlayer conductors 123c and 123e, respectively.
  • the capacitive conductor 125 is omitted, and one of the connection pads 124 extends between the layers of the dielectric substrate 111 in the x direction via the connection conductor 127. It is an example connected to 123a.
  • the RFID tag substrate 100D (FIG. 13C) of the fifth example is an example in which the capacitive conductor 125 is omitted and both the connection pads are connected to the radiation conductor 121 via the interlayer conductors 123c and 123f.
  • the RFID tag substrate 100E (FIG. 14A) of the sixth example is an example in which an interlayer conductor 123a that connects the radiating conductor 121 and the ground conductor 122 is disposed in the vicinity of the end far from the cavity 113.
  • the RFID tag substrate 100F (FIG. 14B) of the seventh example is an example in which the capacitive conductor 125 is provided at a position overlapping the cavity 113 when viewed in the z direction. Further, the RFID tag substrate 100F of the seventh example is an example in which the cavity 113 containing the semiconductor integrated circuit 101 is filled with a sealing material 131 such as resin and the opening is sealed.
  • the structure for sealing the opening of the cavity 113 can be similarly applied to the RFID tag substrates 100, 100A to 100E, and 100G to 100K of the first to sixth examples and the eighth to twelfth examples. is there.
  • the radiation conductor 121 may be provided including the upper part of the opening of the cavity 113.
  • the RFID tag substrate 100G (FIG. 15A) of the eighth example is provided at a position where the capacitive conductor 125 overlaps the cavity 113 in the z direction, and one connection pad 124 is connected to the capacitive conductor 125 via the interlayer conductor 123h. This is an example.
  • the RFID tag substrate 100H (FIG. 15B) of the ninth example has a capacitive conductor 125 that overlaps the cavity 113 in the z direction, and one side through a connection conductor 128 that extends between the layers of the dielectric substrate 111 in the x direction.
  • the RFID tag substrate 100I (FIG. 15C) of the tenth example is provided at a position where the capacitive conductor 125 overlaps the cavity 113 in the z direction, while the two connection pads 124 are connected to the radiating conductor 121 via the interlayer conductors 123f and 123c. This is an example of connection.
  • the RFID tag substrate 100J (FIG. 16A) of the eleventh example is an example in which the capacitive conductor 125 is configured to face the ground conductor 122 with a large area.
  • a plate-like internal ground conductor 129 connected to the ground conductor 122 and the radiation conductor 121 via the interlayer conductor 123i is provided between the layers of the dielectric substrate 111.
  • the capacitive conductor 125 is disposed to face the ground conductor 122 and the internal ground conductor 129 so that a large capacitance is formed.
  • the form of the compression coil spring is shown as the buffer member.
  • the material of the buffer material is not limited to metal, and various materials such as resin may be applied.
  • the RFID tag substrate is embedded in the resin member by molding.
  • the present invention is not limited to this, and the RFID tag substrate is accommodated in, for example, a recess provided in the resin member. A configuration in which the concave portion is closed with a lid may be applied.
  • the bundling by the bundling member is shown as an example, but the present invention is not limited to this, and various forms may be applied. Further, the shape of the resin member is not limited to the example of the embodiment.
  • a package-like RFID tag substrate using ceramic as an insulating portion is shown, but the RFID tag substrate is not limited to this.
  • various substrates such as a configuration in which a wiring that configures an antenna is provided on a film-like substrate and a semiconductor integrated circuit chip is mounted may be applied.
  • the RFID tag substrate may include a battery.
  • the description of this embodiment is illustrative in all aspects, and the present invention is not limited thereto.
  • the present disclosure can also be applied to embodiments in which combinations, changes, replacements, additions, omissions, and the like have been made as appropriate, as long as they do not contradict each other. And it is understood that the countless modification which is not illustrated can be assumed without deviating from the scope of the present invention.
  • This disclosure can be used for RFID tags.

Abstract

The present invention provides an RFID tag which has high fastness. This RFID tag (1) is provided with: a substrate (100) for RFID tags, on which a semiconductor integrated circuit is mounted; a resin member (20) which holds the substrate for RFID tags; and a buffer member (30) which holds the resin member. The buffer member (30) has an outer peripheral part (31) and an intermediate part (32) which is positioned closer to the center than the outer peripheral part, and which is configured such that the relative distance between itself and the outer peripheral part is variable by means of elasticity; and the resin member (20) is held by the intermediate part (32).

Description

ＲＦＩＤタグRFID tag
　本開示は、ＲＦＩＤ（Radio Frequency Identifier）タグに関する。 This disclosure relates to a RFID (Radio Frequency Identifier) tag.
　以前より、物品管理等を目的として多くのＲＦＩＤタグが使用されている。特開２０１７－７６２９０号公報には、ＲＦＩＤタグにおいてその半導体集積回路を覆うプロテクタを改良することで、厳しい使用環境下でも信頼性高く動作するＲＦＩＤタグが提案されている。 Many RFID tags have been used for the purpose of article management etc. from before. Japanese Laid-Open Patent Publication No. 2017-76290 proposes an RFID tag that operates with high reliability even under severe use environment by improving a protector that covers the semiconductor integrated circuit in the RFID tag.
　本開示に係るＲＦＩＤタグは、
　半導体集積回路を搭載したＲＦＩＤタグ用基板と、
　前記ＲＦＩＤタグ用基板を保持する樹脂部材と、
　前記樹脂部材を保持する緩衝部材と、
　を備え、
　前記緩衝部材は、外縁部と、前記外縁部よりも中央に近くかつ弾性により前記外縁部との相対距離が可変な中間部と、を有し、
　前記樹脂部材が前記中間部に保持されている。 The RFID tag according to the present disclosure is
RFID tag substrate mounted with a semiconductor integrated circuit;
A resin member for holding the RFID tag substrate;
A buffer member for holding the resin member;
With
The buffer member includes an outer edge portion, and an intermediate portion that is closer to the center than the outer edge portion and has a variable relative distance from the outer edge portion due to elasticity.
The resin member is held in the intermediate portion.
　本開示によれば、高い堅牢性を有するＲＦＩＤタグを提供できるという効果が得られる。 According to the present disclosure, it is possible to provide an RFID tag having high robustness.
本開示の実施形態１に係るＲＦＩＤタグを示す側面図である。It is a side view showing an RFID tag concerning Embodiment 1 of this indication. 実施形態１に係るＲＦＩＤタグを示す平面図である。1 is a plan view showing an RFID tag according to Embodiment 1. FIG. ＲＦＩＤタグ用基板が埋め込まれた樹脂部材を示す平面図である。It is a top view which shows the resin member with which the board | substrate for RFID tags was embedded. ＲＦＩＤタグ用基板が埋め込まれた樹脂部材を示す側面図である。It is a side view which shows the resin member with which the board | substrate for RFID tags was embedded. 図３ＡのＡ－Ａ線断面図である。FIG. 3B is a sectional view taken along line AA in FIG. 3A. 建造材料にＲＦＩＤタグが取り付けられた状態の一例を示す図である。It is a figure which shows an example of the state by which the RFID tag was attached to building material. 図５の状態を建造材料の軸方向に見た図である。It is the figure which looked at the state of Drawing 5 in the direction of an axis of building material. 本開示の実施形態２に係るＲＦＩＤタグを示す側面図である。It is a side view which shows the RFID tag which concerns on Embodiment 2 of this indication. 実施形態２に係るＲＦＩＤタグを示す平面図である。6 is a plan view showing an RFID tag according to Embodiment 2. FIG. ＲＦＩＤタグ用基板の第１例を示す平面図である。It is a top view which shows the 1st example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第１例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 1st example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第１例を示す底面図である。It is a bottom view which shows the 1st example of the board | substrate for RFID tags. 図９のＲＦＩＤタグ用基板の分解斜視図である。FIG. 10 is an exploded perspective view of the RFID tag substrate of FIG. 9. ＲＦＩＤタグ用基板の第２例を示す平面図である。It is a top view which shows the 2nd example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第２例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 2nd example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第２例を示す底面図である。It is a bottom view which shows the 2nd example of the board | substrate for RFID tags. 図１１のＲＦＩＤタグ用基板の分解斜視図である。FIG. 12 is an exploded perspective view of the RFID tag substrate of FIG. 11. ＲＦＩＤタグ用基板の第３例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 3rd example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第４例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 4th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第５例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 5th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第６例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 6th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第７例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 7th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第８例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 8th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第９例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 9th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第１０例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 10th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第１１例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 11th example of the board | substrate for RFID tags. ＲＦＩＤタグ用基板の第１２例を示す縦断面図である。It is a longitudinal cross-sectional view which shows the 12th example of the board | substrate for RFID tags.
　以下、各実施形態について図面を参照して詳細に説明する。 Hereinafter, each embodiment will be described in detail with reference to the drawings.
　（実施形態１）
　図１は、実施形態１に係るＲＦＩＤタグを示す側面図である。図２は、図１のＲＦＩＤタグを示す平面図である。図中、緩衝部材３０に固定的に定義された直交座標Ｘ、Ｙ、Ｚを示す。Ｚ方向は緩衝部材３０の伸縮方向に相当する。 (Embodiment 1)
FIG. 1 is a side view showing the RFID tag according to the first embodiment. FIG. 2 is a plan view showing the RFID tag of FIG. In the drawing, orthogonal coordinates X, Y, and Z fixedly defined in the buffer member 30 are shown. The Z direction corresponds to the expansion / contraction direction of the buffer member 30.
　実施形態１に係るＲＦＩＤタグ１は、例えば船舶の配管設備の建造材料である多数のパイプを管理するために、これらの各パイプに取り付けられて使用される。ＲＦＩＤタグ１は、ＲＦＩＤタグ用基板１００、樹脂部材２０、緩衝部材３０及び結束部材４０を備える。緩衝部材３０は、衝撃吸収治具と呼んでもよい。 The RFID tag 1 according to the first embodiment is used by being attached to each of these pipes in order to manage, for example, a large number of pipes that are building materials for a piping facility of a ship. The RFID tag 1 includes an RFID tag substrate 100, a resin member 20, a buffer member 30, and a binding member 40. The buffer member 30 may be called an impact absorbing jig.
　緩衝部材３０は、金属製であり、隣合う巻線間に間隙が設けられた圧縮コイルバネの形態を有する。緩衝部材３０の材質としては、強度が高く、耐薬品性を有する種類のステンレス等が適用される。緩衝部材３０の伸縮方向における両端部が、緩衝部材３０の外縁である外縁部３１を構成し、緩衝部材３０の伸縮方向における中央の近傍部位が樹脂部材２０を保持する中間部３２を構成する。 The buffer member 30 is made of metal and has a form of a compression coil spring in which a gap is provided between adjacent windings. As a material of the buffer member 30, stainless steel or the like having a high strength and chemical resistance is applied. Both end portions in the expansion / contraction direction of the buffer member 30 constitute an outer edge portion 31 that is an outer edge of the buffer member 30, and a central vicinity portion in the expansion / contraction direction of the buffer member 30 constitutes an intermediate portion 32 that holds the resin member 20.
　実施形態１では、外縁部３１と中間部３２とのコイルの巻き径（外径）は、ほぼ同一である。Ｚ方向及びその逆方向から見たとき、図２に示すように、中間部３２及び樹脂部材２０の外形線は、外縁部３１に隠れるように配置される。同様に、Ｙ方向又はＸ方向に見たとき、図１に示すように、外縁部３１の外側を囲う最小面積の凸多角形Ｗ１の範囲から、中間部３２及び樹脂部材２０は飛び出さないように配置される。なお、図１では、見やすくするため凸多角形Ｗ１を簡略化して描いている。 In Embodiment 1, the winding diameter (outer diameter) of the coil of the outer edge part 31 and the intermediate part 32 is substantially the same. When viewed from the Z direction and the opposite direction, the outer lines of the intermediate portion 32 and the resin member 20 are arranged so as to be hidden by the outer edge portion 31 as shown in FIG. Similarly, when viewed in the Y direction or the X direction, as shown in FIG. 1, the intermediate portion 32 and the resin member 20 do not protrude from the range of the convex polygon W1 having the minimum area surrounding the outer edge portion 31. Placed in. In FIG. 1, the convex polygon W <b> 1 is simplified for easy viewing.
　緩衝部材３０は、圧縮コイルバネの形態により、Ｚ方向、Ｚ方向の逆方、Ｘ方向、Ｘ方向の逆方、Ｙ方向など、様々な方向に沿って外部から樹脂部材２０に通じる間隙が設けられている。この間隙が、本開示に係る開放部の一例に相当する。 Depending on the form of the compression coil spring, the buffer member 30 is provided with gaps that lead to the resin member 20 from the outside along various directions such as the Z direction, the reverse direction of the Z direction, the X direction, the reverse direction of the X direction, and the Y direction. ing. This gap corresponds to an example of the opening portion according to the present disclosure.
　ＲＦＩＤタグ用基板１００は、ＲＦＩＤタグ用の半導体集積回路と、アンテナとを搭載した基板である。ＲＦＩＤタグ用基板１００の具体的な構成については後に詳述する。 The RFID tag substrate 100 is a substrate on which an RFID tag semiconductor integrated circuit and an antenna are mounted. A specific configuration of the RFID tag substrate 100 will be described in detail later.
　図３Ａと図３Ｂは、ＲＦＩＤタグ用基板が埋め込まれた樹脂部材を示す平面図と側面図である。図４は、図３ＡのＡ－Ａ線断面図である。図中、樹脂部材２０に固定的に定義された直交座標ｘ１、ｙ１、ｚ１を示す。ｚ１方向は、樹脂部材２０の厚み方向とも呼ぶ。 3A and 3B are a plan view and a side view showing the resin member in which the RFID tag substrate is embedded. 4 is a cross-sectional view taken along line AA in FIG. 3A. In the drawing, orthogonal coordinates x1, y1, and z1 fixedly defined on the resin member 20 are shown. The z1 direction is also referred to as the thickness direction of the resin member 20.
　樹脂部材２０は、耐熱性、耐候性、耐薬品性及び高い強度を有する樹脂成形品である。ＲＦＩＤタグ用基板１００は、モールド成形により樹脂部材２０の中央部に埋め込まれている。樹脂部材２０の材料としては、例えば日光化成株式会社製のタイモールド（登録商標）を適用できる。樹脂部材２０は、円盤状の形態を有し、ＲＦＩＤタグ用基板１００を保持した中央の主部２１と、主部２１からｘ１－ｙ１平面に沿った方向に延在された周辺部２２と、周辺部２２に設けられた複数（例えば４つ）の貫通孔２３とを有する。 Resin member 20 is a resin molded product having heat resistance, weather resistance, chemical resistance and high strength. The RFID tag substrate 100 is embedded in the center of the resin member 20 by molding. As a material of the resin member 20, for example, a tie mold (registered trademark) manufactured by Nikko Kasei Co., Ltd. can be applied. The resin member 20 has a disk-like form, and has a central main portion 21 holding the RFID tag substrate 100, a peripheral portion 22 extending from the main portion 21 in a direction along the x1-y1 plane, A plurality of (for example, four) through holes 23 provided in the peripheral portion 22.
　主部２１は、ｚ１方向から見て、略円形であり、その直径は、ｚ１方向の長さ（厚み）よりも大きい。主部２１は、ＲＦＩＤタグ用基板１００の高さ方向（三方向の寸法のうち最も小さい寸法の方向）がｚ１方向を向くように、ＲＦＩＤタグ用基板１００を中央に含む。 The main part 21 is substantially circular when viewed from the z1 direction, and its diameter is larger than the length (thickness) in the z1 direction. The main part 21 includes the RFID tag substrate 100 in the center so that the height direction of the RFID tag substrate 100 (the direction of the smallest dimension among the three dimensions) faces the z1 direction.
　周辺部２２は、ｚ１方向から見た外周形状が略円形であり、主部２１の全周に渡って、主部２１からｘ１－ｙ１平面に沿った方向に延設されている。周辺部２２のｚ１方向の長さ（厚み）は、主部２１のｚ１方向の長さ（厚み）よりも小さく、これにより周辺部２２は主部２１よりも撓み易い性質を有する。主部２１は、周辺部２２からｚ１方向及びその逆方に凸状に突出し、これにより樹脂部材２０はｚ１方向において対称的な形状を有する。 The peripheral portion 22 has a substantially circular outer peripheral shape when viewed from the z1 direction, and extends from the main portion 21 in the direction along the x1-y1 plane over the entire periphery of the main portion 21. The length (thickness) of the peripheral portion 22 in the z1 direction is smaller than the length (thickness) of the main portion 21 in the z1 direction, whereby the peripheral portion 22 has a property of being more easily bent than the main portion 21. The main portion 21 protrudes in a convex shape from the peripheral portion 22 in the z1 direction and vice versa, whereby the resin member 20 has a symmetrical shape in the z1 direction.
　複数の貫通孔２３は、ｚ１方向に貫く孔であり、周辺部２２の周方向にほぼ等間隔に並んで設けられている。 The plurality of through holes 23 are holes penetrating in the z1 direction, and are provided side by side at substantially equal intervals in the circumferential direction of the peripheral portion 22.
　結束部材４０は、針金又は樹脂製の結束バンドなどであり、樹脂部材２０の貫通孔２３に通されて、樹脂部材２０の周辺部２２と緩衝部材３０の中間部３２とを結束する。この結束により、緩衝部材３０の中間部３２に樹脂部材２０が保持される。図１では、貫通孔２３に通された１つの結束部材４０が、緩衝部材３０の巻線のうち隣接する２区間の部分に巻かれているが、１区間の部分のみに巻かれていてもよい。樹脂部材２０は、複数の貫通孔２３のうちの一部（２個以上）の箇所で結束部材４０により緩衝部材３０に結束されていてもよいし、全ての貫通孔２３の箇所で結束部材４０により緩衝部材３０に結束されていてもよい。また、複数の貫通孔２３のうちの２個以上の箇所で結束する場合でも、互いに対向する２つの貫通孔２３が含まれないように、２個以上の貫通孔２３が結束用に選択されてもよい。 The binding member 40 is a wire or a resin binding band, and is passed through the through hole 23 of the resin member 20 to bind the peripheral portion 22 of the resin member 20 and the intermediate portion 32 of the buffer member 30. By this binding, the resin member 20 is held on the intermediate portion 32 of the buffer member 30. In FIG. 1, one bundling member 40 passed through the through hole 23 is wound around two adjacent sections of the winding of the buffer member 30, but may be wound around only one section. Good. The resin member 20 may be bound to the buffer member 30 by the binding member 40 at a part (two or more) of the plurality of through holes 23, or the binding member 40 at all the through holes 23. May be bound to the buffer member 30. In addition, even when binding at two or more locations among the plurality of through holes 23, two or more through holes 23 are selected for binding so that the two through holes 23 facing each other are not included. Also good.
　樹脂部材２０は、緩衝部材３０の中間部３２に対して変位可能に保持されている。このような保持形態は、例えば、複数の貫通孔２３のうちの一部（例えば互いに対向しない２つ）の貫通孔２３のみを用いて樹脂部材２０を結束することで実現できる。このような保持形態は、あるいは、緩く結束部材４０を結んだり、結束部材４０の太さを貫通孔２３の直径よりも十分に小さくすることで実現できる。樹脂部材２０が変位可能に保持されることで、緩衝部材３０の中間部３２が弾性変形した場合でも、この変形により樹脂部材２０に圧力、捩り力又は引張力などの力が加わることを抑制できる。 The resin member 20 is held so as to be displaceable with respect to the intermediate portion 32 of the buffer member 30. Such a holding form can be realized, for example, by bundling the resin member 20 using only a part of the plurality of through holes 23 (for example, two that do not face each other). Such a holding form can be realized by binding the binding member 40 loosely or by making the thickness of the binding member 40 sufficiently smaller than the diameter of the through hole 23. By holding the resin member 20 so as to be displaceable, even when the intermediate portion 32 of the buffer member 30 is elastically deformed, it is possible to suppress a force such as pressure, torsional force, or tensile force from being applied to the resin member 20 due to this deformation. .
　図５は、建造材料にＲＦＩＤタグが取り付けられた状態の一例を示す図である。図６は、図５の状態を建造材料の軸方向に見た図である。 FIG. 5 is a diagram illustrating an example of a state in which the RFID tag is attached to the building material. FIG. 6 is a view of the state of FIG. 5 as viewed in the axial direction of the building material.
　ＲＦＩＤタグ１は、例えば船舶の配管設備の建造材料であるパイプ２００に取り付けられて、多数のパイプ２００を管理するために使用される。ＲＦＩＤタグ１は、緩衝部材３０の外縁部３１の部分が、例えばパイプ２００のフランジ２１０のボルト穴２１１などに係合されることで、取り付けられる。 The RFID tag 1 is attached to, for example, a pipe 200 that is a construction material of a piping facility for a ship, and is used for managing a large number of pipes 200. The RFID tag 1 is attached by engaging a portion of the outer edge portion 31 of the buffer member 30 with, for example, a bolt hole 211 of the flange 210 of the pipe 200.
　パイプ２００の搬送時には非常に大きな衝撃がパイプ２００に加えられる場合がある。しかし、パイプ２００から緩衝部材３０の外縁部３１に伝わった衝撃は、緩衝されて緩衝部材３０の中間部３２及び樹脂部材２０に伝わり、ＲＦＩＤタグ用基板１００に伝わる衝撃が大幅に低減される。これにより、ＲＦＩＤタグ１の機能が損なわれることを大幅に抑制できる。 When the pipe 200 is transported, a very large impact may be applied to the pipe 200. However, the impact transmitted from the pipe 200 to the outer edge portion 31 of the buffer member 30 is buffered and transmitted to the intermediate portion 32 of the buffer member 30 and the resin member 20, and the impact transmitted to the RFID tag substrate 100 is greatly reduced. Thereby, it can suppress significantly that the function of the RFID tag 1 is impaired.
　また、パイプ２００は、高温の液剤に通されてメッキ処理されることがある。従来のＲＦＩＤタグをパイプに貼り付けたのでは、貼り付け面に正常なメッキが行えないという不都合が生じ、また、高熱及び薬品によりＲＦＩＤタグのカバーが浸食されて機能が損なわれるという不具合が生じる。また、パイプ２００の表面に文字又はコードにより識別情報を設けたのでは、メッキ処理により識別情報が消えてしまうという問題が生じる。しかし、本実施形態のＲＦＩＤタグ１であれば、ＲＦＩＤタグ用基板１００が耐熱性及び耐薬品性を有する樹脂部材２０に埋め込まれ、さらに、緩衝部材３０は耐熱性及び耐薬品性を有する金属から構成されている。したがって、ＲＦＩＤタグ１がパイプ２００と一緒にメッキ処理の環境に晒されても、ＲＦＩＤタグ１の機能が損なわれることがない。さらに、ＲＦＩＤタグ１は、比較的に高い自由度でパイプ２００に取付け可能であるので、ＲＦＩＤタグ１によりパイプ２００の正常なメッキ処理が阻害されにくい。 Also, the pipe 200 may be plated by passing it through a high temperature liquid agent. When the conventional RFID tag is pasted on the pipe, there is a problem that normal plating cannot be performed on the pasting surface, and there is a problem that the function of the RFID tag cover is eroded due to high heat and chemicals. . In addition, if identification information is provided on the surface of the pipe 200 using characters or codes, there is a problem that the identification information disappears due to the plating process. However, in the RFID tag 1 of the present embodiment, the RFID tag substrate 100 is embedded in the resin member 20 having heat resistance and chemical resistance, and the buffer member 30 is made of a metal having heat resistance and chemical resistance. It is configured. Therefore, even if the RFID tag 1 is exposed to a plating process environment together with the pipe 200, the function of the RFID tag 1 is not impaired. Furthermore, since the RFID tag 1 can be attached to the pipe 200 with a relatively high degree of freedom, the normal plating process of the pipe 200 is unlikely to be hindered by the RFID tag 1.
　以上のように、実施形態１のＲＦＩＤタグ１によれば、ＲＦＩＤタグ用基板１００を保持した樹脂部材２０が、緩衝部材３０の中間部３２に保持され、さらに、緩衝部材３０の弾性変形により緩衝部材３０の外縁部３１と中間部との相対距離が可変である。この構成により、ＲＦＩＤタグ１か設けられた物品から緩衝部材３０の外縁部３１に大きな緩衝が加わった場合でも、樹脂部材に伝わる衝撃を大幅に低減できる。これにより、ＲＦＩＤタグ１に衝撃に対する高い堅牢性を付与できる。 As described above, according to the RFID tag 1 of the first embodiment, the resin member 20 holding the RFID tag substrate 100 is held by the intermediate portion 32 of the buffer member 30 and further buffered by elastic deformation of the buffer member 30. The relative distance between the outer edge portion 31 and the intermediate portion of the member 30 is variable. With this configuration, even when a large buffer is applied to the outer edge portion 31 of the buffer member 30 from the article provided with the RFID tag 1, the impact transmitted to the resin member can be greatly reduced. Thereby, the high robustness with respect to an impact can be provided to the RFID tag 1.
　さらに、実施形態１のＲＦＩＤタグ１によれば、樹脂部材２０が緩衝部材３０の外側に飛び出さない範囲で、中間部３２に変位可能に保持されている。したがって、緩衝部材３０に大きな力が加わって中間部３２が比較的に大きく弾性変形した場合でも、この弾性変形に起因して圧力、捩り力又は引張力などの力が樹脂部材２０に加わることを抑制できる。これにより、ＲＦＩＤタグ１の外力に対する高い堅牢性が得られる。 Furthermore, according to the RFID tag 1 of the first embodiment, the resin member 20 is held displaceably at the intermediate portion 32 within a range in which the resin member 20 does not protrude outside the buffer member 30. Therefore, even when a large force is applied to the buffer member 30 and the intermediate portion 32 is relatively elastically deformed, a force such as pressure, torsional force, or tensile force is applied to the resin member 20 due to the elastic deformation. Can be suppressed. Thereby, the high robustness with respect to the external force of RFID tag 1 is acquired.
　さらに、実施形態１のＲＦＩＤタグ１によれば、ＲＦＩＤタグ用基板１００が樹脂部材２０に埋め込まれている。したがって、ＲＦＩＤタグ用基板１００が外部環境に直接に晒されず、ＲＦＩＤタグの耐熱性及び耐薬品性が向上され、高熱及び薬品に対するＲＦＩＤタグ１の高い堅牢性が得られる。 Furthermore, according to the RFID tag 1 of the first embodiment, the RFID tag substrate 100 is embedded in the resin member 20. Therefore, the RFID tag substrate 100 is not directly exposed to the external environment, the heat resistance and chemical resistance of the RFID tag are improved, and high robustness of the RFID tag 1 against high heat and chemicals can be obtained.
　同様に、実施形態１のＲＦＩＤタグ１によれば、緩衝部材３０が金属製であることから、要求される弾性、強度、耐熱性及び耐薬品性を確保することが容易である。さらに、緩衝部材３０は、様々な方向に外部から樹脂部材２０へ通じる間隙を有しているので、金属製であっても、ＲＦＩＤタグ用基板１００の無線通信を阻害することが低減され、ＲＦＩＤタグ１の機能を損なうことがない。 Similarly, according to the RFID tag 1 of Embodiment 1, since the buffer member 30 is made of metal, it is easy to ensure the required elasticity, strength, heat resistance, and chemical resistance. Furthermore, since the buffer member 30 has gaps that lead to the resin member 20 from the outside in various directions, even if the buffer member 30 is made of metal, obstruction of wireless communication of the RFID tag substrate 100 is reduced. The function of tag 1 is not impaired.
　さらに、実施形態１のＲＦＩＤタグ１によれば、緩衝部材３０は、圧縮コイルバネの形態を有し、その伸縮方向の両端部が外縁部３１を構成し、伸縮方向の中央近傍が樹脂部材２０を保持する中間部３２を構成する。したがって、上述した緩衝作用を及ぼす構成を、容易に製造でき、高い堅牢性を有するＲＦＩＤタグ１の低廉化を図ることができる。 Furthermore, according to the RFID tag 1 of the first embodiment, the buffer member 30 has the form of a compression coil spring, both end portions in the expansion / contraction direction constitute the outer edge portion 31, and the resin member 20 is located near the center in the expansion / contraction direction. The intermediate part 32 to hold | maintain is comprised. Therefore, the above-described configuration that exerts a buffering effect can be easily manufactured, and the RFID tag 1 having high robustness can be reduced in price.
　さらに、実施形態１のＲＦＩＤタグ１によれば、樹脂部材２０は、ＲＦＩＤタグ用基板１００が配置される主部２１と、主部２１から平面に沿った方向に延在された周辺部２２と、周辺部２２に設けられた複数の貫通孔２３とを有する。そして、周辺部２２の貫通孔２３に通された結束部材４０が、周辺部２２と緩衝部材３０の中間部３２とが結束されている。この構成により、緩衝部材３０に樹脂部材２０を保持させる組立工程の作業性を向上でき、緩衝部材３０に欠陥が生じたときに、緩衝部材３０を容易に交換できる。 Furthermore, according to the RFID tag 1 of the first embodiment, the resin member 20 includes the main portion 21 where the RFID tag substrate 100 is disposed, and the peripheral portion 22 extending from the main portion 21 in the direction along the plane. And a plurality of through holes 23 provided in the peripheral portion 22. The binding member 40 passed through the through hole 23 of the peripheral portion 22 is bound to the peripheral portion 22 and the intermediate portion 32 of the buffer member 30. With this configuration, the workability of the assembly process for holding the resin member 20 on the buffer member 30 can be improved, and the buffer member 30 can be easily replaced when the buffer member 30 is defective.
　さらに、実施形態１のＲＦＩＤタグ１によれば、樹脂部材２０の主部２１が周辺部２２よりも厚い。したがって、樹脂部材２０に緩衝部材３０から結束部材４０を介して力が加わった場合でも、周辺部２２が先に撓むことで力を吸収し、主部２１のＲＦＩＤタグ用基板１００に力が及ぶことを抑制できる。これにより、ＲＦＩＤタグ１の堅牢性がより向上される。 Furthermore, according to the RFID tag 1 of the first embodiment, the main portion 21 of the resin member 20 is thicker than the peripheral portion 22. Therefore, even when a force is applied to the resin member 20 from the buffer member 30 via the binding member 40, the peripheral portion 22 absorbs the force by bending first, and the force is applied to the RFID tag substrate 100 of the main portion 21. It can be suppressed. Thereby, the robustness of the RFID tag 1 is further improved.
　（実施形態２）
　図７は、実施形態２に係るＲＦＩＤタグを示す側面図である。図８は、図７のＲＦＩＤタグを示す平面図である。 (Embodiment 2)
FIG. 7 is a side view showing the RFID tag according to the second embodiment. FIG. 8 is a plan view showing the RFID tag of FIG.
　実施形態２のＲＦＩＤタグ１Ａは、主に緩衝部材３０Ａの形状が実施形態１と異なり、他の構成要素は実施形態１のＲＦＩＤタグ１と同様である。同様の構成は、実施形態１と同一符号を付して詳細な説明を省略する。 The RFID tag 1A of the second embodiment is mainly different from the first embodiment in the shape of the buffer member 30A, and the other components are the same as those of the RFID tag 1 of the first embodiment. The same components as those of the first embodiment are denoted by the same reference numerals and detailed description thereof is omitted.
　緩衝部材３０Ａは、金属製であり、かつ、隣合う巻線間に間隙が設けられた圧縮コイルバネの形態を有する。緩衝部材３０Ａの材質としては、強度が高く、耐薬品性を有する種類のステンレス等が適用される。緩衝部材３０Ａの伸縮方向における両端部が、緩衝部材３０Ａの外縁である外縁部３１Ａを構成し、緩衝部材３０Ａの伸縮方向における中央の近傍部位が樹脂部材２０を保持する中間部３２を構成する。 The buffer member 30A is made of metal and has the form of a compression coil spring in which a gap is provided between adjacent windings. As a material of the buffer member 30A, stainless steel or the like having high strength and chemical resistance is applied. Both end portions in the expansion / contraction direction of the buffer member 30A constitute an outer edge portion 31A which is an outer edge of the buffer member 30A, and a central vicinity portion in the expansion / contraction direction of the buffer member 30A constitutes an intermediate portion 32 holding the resin member 20.
　外縁部３１Ａのコイルの巻き径（外径）は、中間部３２のコイルの巻き径（外径）よりも大きい。図８に示すように、Ｚ方向から見て、中間部３２は、外縁部３１Ａの外側を囲う最小面積の凸多角形Ｗ３の範囲内に配置される。図７に示すように、Ｙ方向から見て、中間部３２は、外縁部差の外側を囲う最小面積の凸多角形Ｗ２の範囲内に配置される。Ｘ方向から見たときは、Ｙ方向から見たときとほぼ同様である。なお、図７、図８では、見やすくするため凸多角形Ｗ２、Ｗ３を簡略化して描いている。 The coil winding diameter (outer diameter) of the outer edge portion 31A is larger than the coil winding diameter (outer diameter) of the intermediate portion 32. As shown in FIG. 8, when viewed from the Z direction, the intermediate portion 32 is disposed within a range of a convex polygon W3 having a minimum area surrounding the outer edge portion 31A. As shown in FIG. 7, when viewed from the Y direction, the intermediate portion 32 is disposed within the range of the convex polygon W <b> 2 having the smallest area surrounding the outside of the outer edge difference. When viewed from the X direction, it is substantially the same as viewed from the Y direction. In FIG. 7 and FIG. 8, the convex polygons W2 and W3 are simplified for easy understanding.
　緩衝部材３０Ａは、圧縮コイルバネの形態により、Ｚ方向、Ｚ方向の逆方、Ｘ方向、Ｘ方向の逆方、Ｙ方向など、様々な方向に沿って外部から樹脂部材２０に通じる間隙が設けられている。この間隙が、本開示に係る開放部の一例に相当する。 The buffer member 30 </ b> A is provided with a gap that leads to the resin member 20 from the outside along various directions such as the Z direction, the reverse direction of the Z direction, the X direction, the reverse direction of the X direction, and the Y direction depending on the form of the compression coil spring. ing. This gap corresponds to an example of the opening portion according to the present disclosure.
　以上のように、実施形態２のＲＦＩＤタグ１Ａによれば、緩衝部材３０Ａの中間部３２が、Ｘ方向、Ｙ方向、Ｚ方向から見て、外縁部３１Ａの外周を囲う最小面積の凸多角形Ｗ２、Ｗ３の範囲内に配置される。したがって、ＲＦＩＤタグ１Ａが物品に取り付けられている状態で、外部から別の物体がＲＦＩＤタグ１Ａに衝突したときに物体は緩衝部材３０Ａの外縁部３１Ａに衝突し、中間部３２に直接に衝突し難い。これにより、外部から物体が衝突するような場合でも、緩衝部材３０Ａの中間部３２に保持された樹脂部材２０及びＲＦＩＤタグ用基板１００に大きな衝撃が加わることが低減され、ＲＦＩＤタグ１の堅牢性がより向上される。 As described above, according to the RFID tag 1A of the second embodiment, the intermediate portion 32 of the buffer member 30A is a convex polygon having a minimum area that surrounds the outer periphery of the outer edge portion 31A when viewed from the X direction, the Y direction, and the Z direction. Arranged within the range of W2 and W3. Therefore, when the RFID tag 1A is attached to the article, when another object collides with the RFID tag 1A from the outside, the object collides with the outer edge portion 31A of the buffer member 30A and directly collides with the intermediate portion 32. hard. Thereby, even when an object collides from the outside, it is possible to reduce a large impact from being applied to the resin member 20 and the RFID tag substrate 100 held by the intermediate portion 32 of the buffer member 30A, and the robustness of the RFID tag 1 Is improved more.
　（ＲＦＩＤタグ用基板の構成例）
　続いて、実施形態１及び実施形態２のＲＦＩＤタグ１、１Ａに搭載される第１例～第１２例のＲＦＩＤタグ用基板１００、１００Ａ～１００Ｋについて詳細に説明する。図９～図１５においては、ＲＦＩＤタグ用基板１００に固定的に定義された直交座標ｘ、ｙ、ｚを示す。ｚ方向は、ＲＦＩＤタグ用基板１００の高さ方向とも呼ぶ。ここで言う高さとは、便宜上の呼び方に過ぎず、ＲＦＩＤタグ１の使用時における実際の高さ方向と一致している必要はない。ｚ方向は、樹脂部材２０に定義されたｚ１方向と一致する。 (Configuration example of RFID tag substrate)
Next, the RFID tag substrates 100 and 100A to 100K of the first to twelfth examples mounted on the RFID tags 1 and 1A of the first and second embodiments will be described in detail. 9 to 15 show orthogonal coordinates x, y, and z that are fixedly defined on the RFID tag substrate 100. The z direction is also referred to as a height direction of the RFID tag substrate 100. The height mentioned here is merely a way of calling for convenience, and does not need to coincide with the actual height direction when the RFID tag 1 is used. The z direction coincides with the z1 direction defined for the resin member 20.
　＜第１例＞
　図９Ａ、図９Ｂ及び図９Ｃは、それぞれＲＦＩＤタグ用基板の第１例を示す平面図、縦断面図及び底面図である。図１０は、図９のＲＦＩＤタグ用基板の分解斜視図である。 <First example>
9A, 9B, and 9C are a plan view, a longitudinal sectional view, and a bottom view showing a first example of the RFID tag substrate, respectively. 10 is an exploded perspective view of the RFID tag substrate of FIG.
　第１例のＲＦＩＤタグ用基板１００は、セラミック材料を絶縁体として使用したパッケージ状の基板であり、チップ状の半導体集積回路１０１を収容し、かつ、アンテナを構成する導体（１２１、１２２）が形成されている。ＲＦＩＤタグ用基板１００は、半導体集積回路１０１が搭載された状態の単体で、電波を介してリーダライタから電力を受け、リーダライタと無線通信が可能なモジュールである。ＲＦＩＤタグ用基板１００は、特に制限されないが、例えば９２０ＭＨｚなどのＵＨＦ（Ultra High Frequency）帯の周波数の電波を用いて無線通信を行う。 The RFID tag substrate 100 of the first example is a package-like substrate using a ceramic material as an insulator, and accommodates a chip-like semiconductor integrated circuit 101 and has conductors (121, 122) constituting an antenna. Is formed. The RFID tag substrate 100 is a single unit in which the semiconductor integrated circuit 101 is mounted, and is a module capable of receiving power from a reader / writer via radio waves and wirelessly communicating with the reader / writer. Although the RFID tag substrate 100 is not particularly limited, for example, radio communication is performed using radio waves having a frequency of a UHF (Ultra High Frequency) band such as 920 MHz.
　ＲＦＩＤタグ用基板１００は、図９及び図１０に示すように、誘電体基板１１１、放射導体１２１、接地導体１２２、層間導体１２３ａ～１２３ｃ及び接続パッド１２４を備える。図１０では、層間導体１２３ａ～１２３ｃが通る箇所を鎖線及び破線で示す。 The RFID tag substrate 100 includes a dielectric substrate 111, a radiating conductor 121, a ground conductor 122, interlayer conductors 123a to 123c, and connection pads 124, as shown in FIGS. In FIG. 10, the locations where the interlayer conductors 123a to 123c pass are indicated by chain lines and broken lines.
　誘電体基板１１１は、一方にｘ－ｙ方向に広がる第１主面１１１ａを、その反対側にｘ－ｙ方向に広がる第２主面１１１ｂを有し、高さ（ｚ方向の長さ）が幅寸（ｘ方向の長さ）及び奥行寸（ｙ方向の長さ）よりも短い直方体状の形状を有する。さらに、誘電体基板１１１は、第１主面１１１ａに開口した凹状のキャビティ１１３を備える。誘電体基板１１１は、例えば、酸化アルミニウム質焼結体、窒化アルミニウム質焼結体、ムライト質焼結体またはガラスセラミック焼結体等の誘電体であり、例えば各々がシート状の複数層のセラミックグリーンシートを重ねかつ焼結することで形成できる。 The dielectric substrate 111 has a first main surface 111a extending in the xy direction on one side and a second main surface 111b extending in the xy direction on the opposite side, and has a height (length in the z direction). It has a rectangular parallelepiped shape shorter than the width dimension (length in the x direction) and the depth dimension (length in the y direction). Furthermore, the dielectric substrate 111 includes a concave cavity 113 opened in the first main surface 111a. The dielectric substrate 111 is a dielectric such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. It can be formed by stacking and sintering green sheets.
　半導体集積回路１０１は、キャビティ１１３に収容及び固定される。キャビティ１１３の底部内面には、導電体である接続パッド１２４が設けられている。接続パッド１２４は、半導体集積回路１０１の端子とワイヤボンディング等により電気的に接続される。 The semiconductor integrated circuit 101 is accommodated and fixed in the cavity 113. A connection pad 124 that is a conductor is provided on the inner surface of the bottom of the cavity 113. The connection pad 124 is electrically connected to the terminal of the semiconductor integrated circuit 101 by wire bonding or the like.
　放射導体１２１、接地導体１２２及び層間導体１２３ａ、１２３ｂ、１２３ｃは、板状逆Ｆアンテナを構成する。 The radiation conductor 121, the ground conductor 122, and the interlayer conductors 123a, 123b, and 123c constitute a plate-like inverted F antenna.
　放射導体１２１は、膜状の導体であり、誘電体基板１１１の第１主面１１１ａにおいて、キャビティ１１３の開口部を除く広い範囲に設けられている。接地導体１２２は、膜状の導体であり、誘電体基板１１１の第２主面１１１ｂの広い範囲に設けられている。放射導体１２１及び接地導体１２２は、誘電体基板１１１の焼結前の段階で、スクリーン印刷等の方法を用いて、金属ペーストをセラミックグリーンシート（焼結前の誘電体基板１１１）の該当位置に印刷し、その後、セラミックグリーンシートと一緒に焼結することで形成できる。金属ペーストとしては、例えば、銅の粉末を有機溶剤及び有機バインダと混合した材料が適用できる。放射導体１２１、接地導体１２２及び接続パッド１２４の露出表面は、ニッケル、コバルト、パラジウム又は金等のめっき層で被覆されてもよく、これにより酸化腐食を抑制できかつワイヤボンディングの接合特性を向上できる。 The radiation conductor 121 is a film-like conductor, and is provided in a wide range on the first main surface 111 a of the dielectric substrate 111 except for the opening of the cavity 113. The ground conductor 122 is a film-like conductor and is provided in a wide range of the second main surface 111b of the dielectric substrate 111. The radiating conductor 121 and the ground conductor 122 are placed at a corresponding position of the ceramic green sheet (dielectric substrate 111 before sintering) by using a method such as screen printing at a stage before the dielectric substrate 111 is sintered. It can be formed by printing and then sintering together with a ceramic green sheet. For example, a material obtained by mixing copper powder with an organic solvent and an organic binder can be used as the metal paste. The exposed surfaces of the radiation conductor 121, the ground conductor 122, and the connection pad 124 may be coated with a plating layer of nickel, cobalt, palladium, gold, or the like, thereby suppressing oxidative corrosion and improving the bonding characteristics of wire bonding. .
　層間導体１２３ａは、誘電体基板１１１の第１主面１１１ａと第２主面１１１ｂとの間をｚ方向に通され、放射導体１２１と接地導体１２２とを電気的に接続する。層間導体１２３ａは、キャビティ１１３よりも、放射導体１２１の長手方向（ｘ方向）の一端に近い部位に設けられている。層間導体１２３ａは、放射導体１２１の短手方向（ｙ方向）に離間した複数の箇所に設けられていてもよい。 The interlayer conductor 123a is passed in the z direction between the first main surface 111a and the second main surface 111b of the dielectric substrate 111, and electrically connects the radiation conductor 121 and the ground conductor 122. The interlayer conductor 123a is provided closer to one end in the longitudinal direction (x direction) of the radiation conductor 121 than the cavity 113 is. The interlayer conductor 123a may be provided at a plurality of locations separated in the short direction (y direction) of the radiation conductor 121.
　層間導体１２３ｂは、誘電体基板１１１の中をｚ方向に通され、キャビティ１１３の一方の接続パッド１２４と接地導体１２２とを電気的に接続する。もう一方の層間導体１２３ｃは、誘電体基板１１１の中をｚ方向に通され、キャビティ１１３の他方の接続パッド１２４と放射導体１２１とを電気的に接続する。 The interlayer conductor 123b is passed through the dielectric substrate 111 in the z direction, and electrically connects one connection pad 124 of the cavity 113 and the ground conductor 122. The other interlayer conductor 123c is passed through the dielectric substrate 111 in the z direction, and electrically connects the other connection pad 124 of the cavity 113 and the radiation conductor 121.
　層間導体１２３ａ～１２３ｃは、誘電体基板１１１がセラミックグリーンシートの段階で、セラミックグリーンシートの該当箇所に貫通孔又は層間孔を設け、ここに金属ペーストを充填し、セラミックグリーンシートと一緒に焼結することで形成できる。金属ペーストとしては、放射導体１２１の材料と同様、例えば、銅の粉末を有機溶剤及び有機バインダと混合した材料が適用できる。 In the interlayer conductors 123a to 123c, when the dielectric substrate 111 is the stage of the ceramic green sheet, a through hole or an interlayer hole is provided at a corresponding portion of the ceramic green sheet, filled with a metal paste, and sintered together with the ceramic green sheet. Can be formed. As the metal paste, for example, a material in which copper powder is mixed with an organic solvent and an organic binder can be applied as in the material of the radiation conductor 121.
　＜第２例＞
　図１１Ａ、図１１Ｂ及び図１１Ｃは、それぞれＲＦＩＤタグ用基板の第２例を示す平面図、縦断面図及び底面図である。図１２は、図１１のＲＦＩＤタグ用基板の分解斜視図である。図１２では、層間導体１２３ａ、１２３ｂ、１２３ｄ、１２３ｅが通る箇所を鎖線及び破線で示す。 <Second example>
11A, 11B, and 11C are a plan view, a longitudinal sectional view, and a bottom view showing a second example of the RFID tag substrate, respectively. 12 is an exploded perspective view of the RFID tag substrate of FIG. In FIG. 12, the locations where the interlayer conductors 123a, 123b, 123d, and 123e pass are indicated by chain lines and broken lines.
　第２例のＲＦＩＤタグ用基板１００Ａは、第１例の構成に、容量導体１２５を追加した点が主に異なる。第１例と同様の構成要素については、第１例と同一符号を付して、詳細な説明を省略する。 The RFID tag substrate 100A of the second example is mainly different in that a capacitive conductor 125 is added to the configuration of the first example. The same components as those in the first example are denoted by the same reference numerals as those in the first example, and detailed description thereof is omitted.
　容量導体１２５は、誘電体基板１１１の第１主面１１１ａと第２主面１１１ｂとの間の中間層に設けられた膜状の導体であり、接地導体１２２の一部と対向して静電容量を構成する。この静電容量により、ＲＦＩＤタグ用基板１００Ａのより小型化が実現される。容量導体１２５と接地導体１２２との層間距離は、容量導体１２５と放射導体１２１との層間距離よりも短い。容量導体１２５は、次のように形成できる。先ず、誘電体基板１１１が複数層に離間したシート状のセラミックグリーンシートの段階で、前述した金属ペーストをセラミックグリーンシートの該当する中間層の箇所にスクリーン印刷等により設ける。その後、複数層のセラミックグリーンシートを重ね、金属ペーストをセラミックグリーンシートと一緒に焼結する。これにより、誘電体基板１１１の中間層に容量導体１２５を形成できる。 The capacitive conductor 125 is a film-like conductor provided in an intermediate layer between the first main surface 111 a and the second main surface 111 b of the dielectric substrate 111, and is electrostatically opposed to a part of the ground conductor 122. Configure capacity. Due to this capacitance, the RFID tag substrate 100A can be made more compact. The interlayer distance between the capacitive conductor 125 and the ground conductor 122 is shorter than the interlayer distance between the capacitive conductor 125 and the radiation conductor 121. The capacitive conductor 125 can be formed as follows. First, at the stage of a sheet-like ceramic green sheet in which the dielectric substrate 111 is separated into a plurality of layers, the above-described metal paste is provided by screen printing or the like on the corresponding intermediate layer of the ceramic green sheet. Thereafter, a plurality of ceramic green sheets are stacked, and the metal paste is sintered together with the ceramic green sheets. Thereby, the capacitive conductor 125 can be formed in the intermediate layer of the dielectric substrate 111.
　容量導体１２５は、層間導体１２３ｄを介して一方の接続パッド１２４に電気的に接続され、かつ、層間導体１２３ｅを介して放射導体１２１に電気的に接続される。層間導体１２３ｄ、１２３ｅは、前述した層間導体１２３ａ、１２３ｂと同様に形成できる。 The capacitor conductor 125 is electrically connected to one connection pad 124 via the interlayer conductor 123d and electrically connected to the radiation conductor 121 via the interlayer conductor 123e. The interlayer conductors 123d and 123e can be formed in the same manner as the interlayer conductors 123a and 123b described above.
　＜第３例～第１２例＞
　図１３Ａ～図１６Ｂは、それぞれＲＦＩＤタグ用基板の第３例～第１２例を示す縦断面図である。第１例及び第２例のＲＦＩＤタグ用基板１００、１００Ａと同一の構成要素については同一符号を付す。 <Example 3 to Example 12>
FIGS. 13A to 16B are longitudinal sectional views showing third to twelfth examples of the RFID tag substrate, respectively. The same components as those of the RFID tag substrates 100 and 100A of the first example and the second example are denoted by the same reference numerals.
　第３例～第１１例のＲＦＩＤタグ用基板１００Ｂ～１００Ｊに示すように、放射導体１２１、接地導体１２２、接続パッド１２４及び容量導体１２５の各間の電気的な接続、容量導体１２５の位置及び有無、幾つかの細部構造については、適宜変更可能である。 As shown in the RFID tag substrates 100B to 100J of the third to eleventh examples, the electrical connection among the radiation conductor 121, the ground conductor 122, the connection pad 124 and the capacitive conductor 125, the position of the capacitive conductor 125, and Presence / absence and some detailed structures can be changed as appropriate.
　第３例のＲＦＩＤタグ用基板１００Ｂ（図１３Ａ）は、放射導体１２１が、層間導体１２３ｃ、１２３ｅを介して一方の接続パッド１２４と容量導体１２５とにそれぞれ接続された例である。 The RFID tag substrate 100B (FIG. 13A) of the third example is an example in which the radiation conductor 121 is connected to one connection pad 124 and the capacitive conductor 125 via the interlayer conductors 123c and 123e, respectively.
　第４例のＲＦＩＤタグ用基板１００Ｃ（図１３Ｂ）は、容量導体１２５が省かれ、一方の接続パッド１２４が誘電体基板１１１の層間をｘ方向に延設された接続導体１２７を介して層間導体１２３ａに接続された例である。 In the RFID tag substrate 100C (FIG. 13B) of the fourth example, the capacitive conductor 125 is omitted, and one of the connection pads 124 extends between the layers of the dielectric substrate 111 in the x direction via the connection conductor 127. It is an example connected to 123a.
　第５例のＲＦＩＤタグ用基板１００Ｄ（図１３Ｃ）は、容量導体１２５が省かれ、接続パッドの両方が層間導体１２３ｃ、１２３ｆを介して放射導体１２１に接続された例である。 The RFID tag substrate 100D (FIG. 13C) of the fifth example is an example in which the capacitive conductor 125 is omitted and both the connection pads are connected to the radiation conductor 121 via the interlayer conductors 123c and 123f.
　第６例のＲＦＩＤタグ用基板１００Ｅ（図１４Ａ）は、放射導体１２１と接地導体１２２とを接続する層間導体１２３ａが、キャビティ１１３から遠い方の端部の近傍に配置された例である。 The RFID tag substrate 100E (FIG. 14A) of the sixth example is an example in which an interlayer conductor 123a that connects the radiating conductor 121 and the ground conductor 122 is disposed in the vicinity of the end far from the cavity 113.
　第７例のＲＦＩＤタグ用基板１００Ｆ（図１４Ｂ）は、容量導体１２５が、ｚ方向に見て、キャビティ１１３と重なる位置に設けられた例である。また、第７例のＲＦＩＤタグ用基板１００Ｆは、半導体集積回路１０１を収容したキャビティ１１３が樹脂等の封止材料１３１で埋められ、その開口部が封止された例である。キャビティ１１３の開口部を封止する構成は、第１例～第６例、第８例～第１２例のＲＦＩＤタグ用基板１００、１００Ａ～１００Ｅ、１００Ｇ～１００Ｋに対しても同様に適用可能である。キャビティ１１３の開口部を封止した場合には、放射導体１２１がキャビティ１１３の開口部の上部を含めて設けられてもよい。 The RFID tag substrate 100F (FIG. 14B) of the seventh example is an example in which the capacitive conductor 125 is provided at a position overlapping the cavity 113 when viewed in the z direction. Further, the RFID tag substrate 100F of the seventh example is an example in which the cavity 113 containing the semiconductor integrated circuit 101 is filled with a sealing material 131 such as resin and the opening is sealed. The structure for sealing the opening of the cavity 113 can be similarly applied to the RFID tag substrates 100, 100A to 100E, and 100G to 100K of the first to sixth examples and the eighth to twelfth examples. is there. When the opening of the cavity 113 is sealed, the radiation conductor 121 may be provided including the upper part of the opening of the cavity 113.
　第８例のＲＦＩＤタグ用基板１００Ｇ（図１５Ａ）は、容量導体１２５がキャビティ１１３とｚ方向に重なる位置に設けられる一方、一方の接続パッド１２４が層間導体１２３ｈを介して容量導体１２５に接続された例である。 The RFID tag substrate 100G (FIG. 15A) of the eighth example is provided at a position where the capacitive conductor 125 overlaps the cavity 113 in the z direction, and one connection pad 124 is connected to the capacitive conductor 125 via the interlayer conductor 123h. This is an example.
　第９例のＲＦＩＤタグ用基板１００Ｈ（図１５Ｂ）は、ｚ方向にキャビティ１１３と重なる容量導体１２５を持つ一方、誘電体基板１１１の層間をｘ方向に延設された接続導体１２８を介して一方の接続パッド１２４と層間導体１２３ａとが接続された例である。 The RFID tag substrate 100H (FIG. 15B) of the ninth example has a capacitive conductor 125 that overlaps the cavity 113 in the z direction, and one side through a connection conductor 128 that extends between the layers of the dielectric substrate 111 in the x direction. This is an example in which the connection pad 124 and the interlayer conductor 123a are connected.
　第１０例のＲＦＩＤタグ用基板１００Ｉ（図１５Ｃ）は、容量導体１２５がキャビティ１１３とｚ方向に重なる位置に設けられる一方、２つの接続パッド１２４が層間導体１２３ｆ、１２３ｃを介して放射導体１２１に接続された例である。 The RFID tag substrate 100I (FIG. 15C) of the tenth example is provided at a position where the capacitive conductor 125 overlaps the cavity 113 in the z direction, while the two connection pads 124 are connected to the radiating conductor 121 via the interlayer conductors 123f and 123c. This is an example of connection.
　第１１例のＲＦＩＤタグ用基板１００Ｊ（図１６Ａ）は、容量導体１２５が大きな面積で接地導体１２２と対向するように構成された例である。 The RFID tag substrate 100J (FIG. 16A) of the eleventh example is an example in which the capacitive conductor 125 is configured to face the ground conductor 122 with a large area.
　第１２例のＲＦＩＤタグ用基板１００Ｋ（図１６Ｂ）は、層間導体１２３ｉを介して接地導体１２２及び放射導体１２１と接続された板状の内部接地導体１２９が、誘電体基板１１１の層間に設けられた例である。ＲＦＩＤタグ用基板１００Ｋでは、大きな静電容量が形成されるように、容量導体１２５が、接地導体１２２と内部接地導体１２９とに対向するように配置されている。 In the RFID tag substrate 100K (FIG. 16B) of the twelfth example, a plate-like internal ground conductor 129 connected to the ground conductor 122 and the radiation conductor 121 via the interlayer conductor 123i is provided between the layers of the dielectric substrate 111. This is an example. In the RFID tag substrate 100K, the capacitive conductor 125 is disposed to face the ground conductor 122 and the internal ground conductor 129 so that a large capacitance is formed.
　以上、各実施形態について説明した。なお、上記実施形態では、緩衝部材として圧縮コイルバネの形態を示したが、外縁部と中間部とが相対的に可変な構成であれば、二重構造を有する籠状の形態など、様々な形態を適用することができる。また、緩衝材料の材質は、金属に限られず、樹脂など様々な材質が適用されてもよい。また、上記実施形態では、ＲＦＩＤタグ用基板が、モールド成形により樹脂部材に埋め込まれている例を示したが、これに限られず、ＲＦＩＤタグ用基板は、例えば樹脂部材に設けられた凹部に収容され、凹部が蓋体で閉められた形態が適用されても良い。また、緩衝部材への樹脂材料の保持形態として、結束部材による結束を一例として示したが、これに限られず、様々な形態が適用されてもよい。また、樹脂部材の形状も実施形態の例に制限されない。 The embodiments have been described above. In the above embodiment, the form of the compression coil spring is shown as the buffer member. However, as long as the outer edge part and the intermediate part are relatively variable, there are various forms such as a bowl-like form having a double structure. Can be applied. Moreover, the material of the buffer material is not limited to metal, and various materials such as resin may be applied. In the above embodiment, the RFID tag substrate is embedded in the resin member by molding. However, the present invention is not limited to this, and the RFID tag substrate is accommodated in, for example, a recess provided in the resin member. A configuration in which the concave portion is closed with a lid may be applied. In addition, as a holding form of the resin material to the buffer member, the bundling by the bundling member is shown as an example, but the present invention is not limited to this, and various forms may be applied. Further, the shape of the resin member is not limited to the example of the embodiment.
　さらに、上記実施形態では、セラミックを絶縁部に用いたパッケージ状のＲＦＩＤタグ用基板を示したが、ＲＦＩＤタグ用基板は、これに制限されない。例えばフィルム状の基板にアンテナを構成する配線が設けられかつ半導体集積回路チップが搭載された構成など、様々な基板が適用されてもよい。また、ＲＦＩＤタグ用基板は、電池を内蔵する構成であってもよい。本実施形態の説明は、全ての局面において例示であって、この発明がそれに限定されるものではない。本開示は、相互に矛盾しない限り、適宜、組み合わせ、変更、置き換え、付加、省略などを行った実施の形態にも適用可能である。そして、例示されていない無数の変形例が、この発明の範囲から外れることなく想定され得るものと解される。 Furthermore, in the above embodiment, a package-like RFID tag substrate using ceramic as an insulating portion is shown, but the RFID tag substrate is not limited to this. For example, various substrates such as a configuration in which a wiring that configures an antenna is provided on a film-like substrate and a semiconductor integrated circuit chip is mounted may be applied. Further, the RFID tag substrate may include a battery. The description of this embodiment is illustrative in all aspects, and the present invention is not limited thereto. The present disclosure can also be applied to embodiments in which combinations, changes, replacements, additions, omissions, and the like have been made as appropriate, as long as they do not contradict each other. And it is understood that the countless modification which is not illustrated can be assumed without deviating from the scope of the present invention.
　本開示はＲＦＩＤタグに利用できる。 This disclosure can be used for RFID tags.

Claims (9)

  1. 　半導体集積回路を搭載したＲＦＩＤタグ用基板と、
    　前記ＲＦＩＤタグ用基板を保持する樹脂部材と、
    　前記樹脂部材を保持する緩衝部材と、
    　を備え、
    　前記緩衝部材は、外縁部と、前記外縁部よりも中央に近くかつ弾性により前記外縁部との相対距離が可変な中間部と、を有し、
    　前記樹脂部材が前記中間部に保持されているＲＦＩＤタグ。     RFID tag substrate mounted with a semiconductor integrated circuit;
    A resin member for holding the RFID tag substrate;
    A buffer member for holding the resin member;
    With
    The buffer member includes an outer edge portion, and an intermediate portion that is closer to the center than the outer edge portion and has a variable relative distance from the outer edge portion due to elasticity.
    An RFID tag in which the resin member is held in the intermediate portion.
  2. 　互いに直交する三方の各方向から見て、前記外縁部の外周を囲う最小面積の凸多角形の範囲内に前記中間部が配置されている、
    　請求項１記載のＲＦＩＤタグ。     The intermediate portion is disposed within a range of a convex polygon having a minimum area surrounding the outer periphery of the outer edge portion when viewed from three directions orthogonal to each other.
    The RFID tag according to claim 1.
  3. 　前記ＲＦＩＤタグ用基板は前記樹脂部材に埋め込まれている、
    　請求項１又は請求項２に記載のＲＦＩＤタグ。     The RFID tag substrate is embedded in the resin member,
    The RFID tag according to claim 1 or 2.
  4. 　前記樹脂部材は、互いに直交する三方の各方向から見て、前記外縁部の外周を囲う最小面積の凸多角形の範囲内に収まる範囲で、変位可能に前記中間部に保持されている、
    　請求項１から請求項３のいずれか一項に記載のＲＦＩＤタグ。     The resin member is held by the intermediate portion so as to be displaceable within a range of a convex polygon having a minimum area surrounding the outer periphery of the outer edge portion when viewed from three directions orthogonal to each other.
    The RFID tag according to any one of claims 1 to 3.
  5. 　前記緩衝部材は、金属製であり、前記緩衝部材の外側から前記樹脂部材に通じる開放部を有する、
    　請求項１から請求項４のいずれか一項に記載のＲＦＩＤタグ。     The buffer member is made of metal and has an open portion that communicates with the resin member from the outside of the buffer member.
    The RFID tag according to any one of claims 1 to 4.
  6. 　前記緩衝部材は圧縮コイルバネを含み、
    　前記外縁部は、前記圧縮コイルバネの伸縮方向の両端部であり、
    　前記中間部は、前記圧縮コイルバネの前記両端部よりも中央に近い部位である、
    　請求項１から請求項５のいずれか一項に記載のＲＦＩＤタグ。     The buffer member includes a compression coil spring,
    The outer edge portions are both end portions in the expansion / contraction direction of the compression coil spring,
    The intermediate portion is a portion closer to the center than the both end portions of the compression coil spring.
    The RFID tag according to any one of claims 1 to 5.
  7. 　前記外縁部のコイル外径は、前記中間部のコイル外径よりも大きい、
    　請求項６記載のＲＦＩＤタグ。     A coil outer diameter of the outer edge portion is larger than a coil outer diameter of the intermediate portion;
    The RFID tag according to claim 6.
  8. 　前記樹脂部材は、前記ＲＦＩＤタグ用基板が配置される主部と、前記主部から平面に沿った方向に延在する周辺部と、前記周辺部に設けられた複数の貫通孔と、を有し、
    　前記貫通孔に通された結束部材により前記周辺部と前記緩衝部材の前記中間部とが結束されている、
    　請求項１から請求項７のいずれか一項に記載のＲＦＩＤタグ。     The resin member includes a main part on which the RFID tag substrate is disposed, a peripheral part extending in a direction along a plane from the main part, and a plurality of through holes provided in the peripheral part. And
    The peripheral portion and the intermediate portion of the buffer member are bound by a binding member passed through the through hole,
    The RFID tag according to any one of claims 1 to 7.
  9. 　前記主部の前記平面に垂直な方向における長さは、前記周辺部の前記平面に垂直な方向における長さよりも大きい、
    　請求項８記載のＲＦＩＤタグ。     A length of the main part in a direction perpendicular to the plane is greater than a length of the peripheral part in a direction perpendicular to the plane;
    The RFID tag according to claim 8.
PCT/JP2019/019427 2018-05-18 2019-05-16 Rfid tag WO2019221211A1 (en)

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