WO2019218948A1 - 一种超小型pad的辅助焊接元件及其制造组件、制造方法和辅助焊接方法 - Google Patents

一种超小型pad的辅助焊接元件及其制造组件、制造方法和辅助焊接方法 Download PDF

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Publication number
WO2019218948A1
WO2019218948A1 PCT/CN2019/086504 CN2019086504W WO2019218948A1 WO 2019218948 A1 WO2019218948 A1 WO 2019218948A1 CN 2019086504 W CN2019086504 W CN 2019086504W WO 2019218948 A1 WO2019218948 A1 WO 2019218948A1
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WIPO (PCT)
Prior art keywords
conductive
transmission cable
ultra
pad
hole
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PCT/CN2019/086504
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English (en)
French (fr)
Inventor
黄琴
Original Assignee
Huang Qin
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Publication of WO2019218948A1 publication Critical patent/WO2019218948A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/858—Bonding techniques
    • H01L2224/85801—Soldering or alloying

Definitions

  • the present invention relates to the field of electronic components, and more particularly to an auxiliary welding component for an ultra-small PAD, a manufacturing assembly thereof, a manufacturing method, and an auxiliary welding method.
  • the sensor at the end of the endoscope needs to be connected to a cable such as a transmission image data and an electric signal.
  • a cable such as a transmission image data and an electric signal.
  • PAD is the meaning of the pad, which is the part of the PCB board and the component pins soldered to each other, consisting of copper foil and holes, the copper foil needs to be exposed, and there is no solder resist Film covering
  • PAD at the bottom of the sensor chip is small, the spacing between the PAD and the PAD is also small.
  • the space available for operation during welding is limited. It requires microscopic operation, and the welding efficiency is very low. Welding false welding.
  • the PAD is directly soldered to the cable, and the soldering firmness is relatively low, which is slightly inadvertent, which may cause the pad and the transmission line to be peeled off from the PCB.
  • the invention discloses an auxiliary welding component of an ultra-small PAD.
  • the ultra-small PAD is disposed on a soldering surface of the electronic component, and the auxiliary soldering component comprises a conductive pillar electrically connected to the ultra-small PAD in one-to-one correspondence with the remaining area of the soldering surface.
  • Corresponding insulating seat one end of the conductive post is inserted into the insulating seat, so that the insulating seat covers one end of each conductive post and fixes each conductive post, and the other end of the conductive post is used for electrically connecting the transmission cable.
  • the center of each of the conductive posts has an axial through hole, or the center of the other end of each of the conductive posts has an axial half hole for inserting and electrically connecting the transmission cable.
  • outer diameter and position of the conductive column are in one-to-one correspondence with the size and position of the PAD.
  • the conductive pillar is a cylinder or a square pillar.
  • the invention also discloses an auxiliary welding method for applying the auxiliary welding element of the ultra-small PAD as described above, comprising the steps of: placing the electronic component in a mold having a through hole on the bottom surface thereof, and the PAD on the welding surface via the through hole Exposing the bottom surface of the mold; applying solder to the bottom surface of the mold to make the surface of the PAD coated with solder; and bonding and welding the mold to the auxiliary welding component of the ultra-small PAD, so that the PAD is connected to one end of the conductive column one by one; welding the transmission cable At the other end of the conductive column.
  • the center of each of the conductive pillars has an axial through hole
  • welding the transmission cable to the other end of the conductive pillar comprises: inserting the head end of the transmission cable from the other end of the conductive pillar into the through hole of the conductive pillar, so that The head end of the transmission cable abuts the PAD fixedly connected to the conductive post; the transmission cable is soldered and fixed in the through hole.
  • the center of the other end of each of the conductive columns has an axial half hole
  • welding the transmission cable to the other end of the conductive column comprises: inserting the head end of the transmission cable from the one end of the conductive column into the half hole of the conductive column; The transmission cable is soldered and fixed in the half hole.
  • soldering the transmission cable to the other end of the conductive pillar specifically comprises: soldering the transmission cable to the other end surface of the conductive pillar by soldering.
  • the welding the transmission cable to the other end of the conductive column comprises: wrapping the heat shrinkable pipeline outside the joint of the transmission cable; inserting the transmission cable into the axial through hole or the axial half hole disposed at the center of the conductive column, Or attach the transmission cable to the outside of the conductive column; so that the heat-shrinkable pipeline simultaneously wraps the insulating portion of the conductive post and the transmission cable, and the heating heat-shrinking pipeline fixes the transmission cable and the other end of the conductive post together.
  • the invention also discloses a manufacturing assembly for manufacturing an auxiliary welding component of the ultra-small PAD as described above, the ultra-small PAD is provided with one or more PADs, comprising: a lower substrate, the lower substrate is provided with one or more conductive pillars The inserted through hole, the upper end portion of the conductive post may protrude from the upper surface of the lower substrate, the aperture and the position of the through hole correspond to the size and position of the PAD; the upper cover and the upper cover cover the lower substrate, covering An inner cavity is formed between the rear upper cover and the lower substrate, and an upper end portion of the conductive column protruding from the upper surface of the lower substrate is received in the inner cavity; and an injection molding device is used for pouring the insulating material into the inner cavity to form a coating on the conductive Insulation seat at the upper end of the column.
  • the invention also discloses a method for manufacturing an auxiliary welding component using the manufacturing assembly of the ultra-small PAD as described above, comprising the steps of inserting the conductive pillars into the through holes of the lower substrate respectively, so that the upper end portion of the conductive pillar protrudes from The upper surface of the lower substrate; the upper cover plate is overlaid on the lower substrate, so that the upper end portion of the conductive column protruding from the upper surface of the lower substrate is received in the inner cavity; the insulating material is poured into the inner cavity by the injection molding device to form the package An insulating seat overlying the upper end of the conductive post.
  • the invention also discloses an auxiliary welding method for welding an auxiliary welding element of an ultra-small PAD based on the manufacturing assembly as described above, comprising the steps of inserting the conductive pillars into the through holes of the lower substrate respectively, so that the conductive pillars are The upper end protrudes from the upper surface of the lower substrate; the upper cover covers the upper substrate, so that the upper end of the conductive column protruding from the upper surface of the lower substrate is received in the inner cavity; and the insulating material is poured into the inner cavity by using an injection molding device After forming the insulating seat, the upper cover plate is removed, and the upper end surface of the conductive post is exposed; the electronic component is placed in a mold having a through hole at the bottom surface, and the aperture and the position of the through hole correspond to the outer diameter and position of the conductive post.
  • the PAD on the soldering surface exposes the bottom surface of the mold through the through hole; the solder is applied on the bottom surface of the mold to make the surface of the PAD coated with solder; and the mold is pasted and welded to the lower substrate inserted into the conductive column, so that the upper end of the PAD and the conductive post are a corresponding connection; soldering the transmission cable to the lower end of the conductive post.
  • the auxiliary welding element for an ultra-small PAD according to the present invention, a manufacturing assembly thereof, a manufacturing method, and an auxiliary welding method, which use a conductive post to electrically connect a transmission cable to an ultra-small PAD on a soldering surface of an electronic component, have been added.
  • the space that can be operated during welding reduces the influence of the ultra-small PAD size on the inconvenience of the welding operation. It can be easily operated without a microscope, the welding quality is reliable, the false welding or welding is not easy to occur, and the mass production is easy to manufacture. Very high practical value.
  • 1 is a schematic view showing the overall structure of an ultra-small PAD disclosed in the first and second embodiments of the present invention
  • FIG. 2 is a schematic view showing the overall structure of an auxiliary welding component of the ultra-small PAD disclosed in the first and second embodiments of the present invention
  • Figure 3 is a bottom plan view of the auxiliary welding element of the ultra-small PAD disclosed in the first and second embodiments of the present invention.
  • FIG. 4 is a schematic overall structural view of a transmission cable disclosed in the first and second embodiments of the present invention.
  • Figure 5 is a schematic view showing the welding assembly of the auxiliary welding elements of the ultra-small PAD disclosed in the first and second embodiments of the present invention
  • FIG. 6 is a flow chart of an auxiliary welding method for an auxiliary welding element of an ultra-small PAD according to a third embodiment of the present invention.
  • FIG. 7 is a flow chart of a preferred auxiliary welding method for an auxiliary welding element of an ultra-small PAD according to a third embodiment of the present invention.
  • FIG. 8 is a flow chart of another preferred auxiliary welding method for an auxiliary welding element of an ultra-small PAD according to a fourth embodiment of the present invention.
  • FIG. 9 is a flow chart of another preferred auxiliary welding method of the auxiliary welding element of the ultra-small PAD disclosed in the sixth embodiment of the present invention.
  • FIG. 10 is a schematic view showing the overall structure of a manufacturing assembly of an auxiliary welding component for manufacturing an ultra-small PAD according to a seventh embodiment of the present invention.
  • FIG. 11 is a flow chart showing a method of manufacturing an auxiliary welding component using a manufacturing assembly such as an ultra-small PAD according to an eighth embodiment of the present invention.
  • FIG. 12 is a flow chart of an auxiliary welding method for welding an auxiliary welding element of an ultra-small PAD based on the above-described manufacturing assembly according to a ninth embodiment of the present invention.
  • the upper, lower, left, and right in the drawing are regarded as the auxiliary welding elements of the ultra-small PAD described in the present specification, and the manufacturing components thereof, the upper, lower, left, and right.
  • the first embodiment of the present invention discloses an auxiliary soldering component 200 for an ultra-small PAD.
  • one or more ultra-small PADs 101 are provided on the soldering surface of the electronic component 100 for auxiliary soldering.
  • the component 200 includes a conductive post 201 electrically connected in one-to-one correspondence with the ultra-small PAD 101 and an insulating base 202 corresponding to the remaining area 102 of the soldering surface.
  • One end 201a of the conductive post 201 is inserted into the insulating base 202 such that the insulating base 202 is packaged.
  • One end 201a of each of the conductive pillars is covered and each of the conductive pillars 201 is fixed, and the other end 201b of the conductive pillars is used for electrically connecting the transmission cables.
  • the ultra-small PAD in the first embodiment of the present invention refers to a pad for soldering pins or cables of a PCB board and components, and is composed of an exposed copper foil or a metal conductor such as aluminum, and has no solder mask. cover.
  • the area of the ultra-small PAD is from 0.0025 square millimeters to 4 square millimeters.
  • the PAD is usually in the shape of a square or a circle.
  • the bottom surface of the photosensitive chip for collecting and transmitting image signals at the front end of the curved tube of the medical endoscope is One or more subminiature PADs are set up.
  • This embodiment provides an auxiliary small-sized PAD and transmission cable. Auxiliary welding element for welding the cable.
  • the auxiliary welding component 200 for auxiliary welding includes and The four ultra-small PADs 101 have four conductive pillars 201 corresponding in size and position, and an insulating seat 202 corresponding to the remaining area of the soldering surface of the photosensitive chip, and one end 201a of the conductive post 201 is inserted into the insulating seat 202, so that The insulating seat 202 can cover one end 202a of each of the conductive pillars and fix each of the conductive pillars 202, and the other end 202b of the conductive pillars is used for electrical connection with the transmission cable of the photosensitive chip.
  • the size and position of the four conductive pillars 201 are electrically connected to the four PADs 101 in one-to-one correspondence.
  • the conductive pillars 201 are equivalent to extending the ultra-small PAD 101 in space. In actual operation, the welding operation does not need to be ultra-small. The space size and distance of the PAD are limited.
  • the transmission cable is electrically connected to the conductive column to electrically connect the transmission cable to the PAD101, thereby greatly increasing the convenience of operation, reducing the probability of false welding and improving the probability of soldering. The firmness and efficiency of the weld.
  • the center of the conductive post 201 has an axial through hole 203.
  • 4 is a schematic view of the overall structure of the transmission cable.
  • hot-melt welding or laser welding can be used.
  • the transmission line can be used.
  • One end of the cable 300 is coated with solder, and then one end of the solder-coated transmission cable 300 is inserted into the through hole 203, so that the head end of the transmission cable 300 abuts the solder joint 101 that has been fixedly connected to the conductive post 201, and is melted by heating.
  • Soldering is used to fuse the transmission cable in the through hole 203; alternatively, one end of the transmission cable 300 may be directly inserted into the through hole 203, and then heated to fuse the transmission cable and the through hole 203 of the conductive post. Fixed together.
  • the through hole 203 is arranged to accurately and conveniently connect the transmission cable with the conductive post, as long as the transmission cable is inserted and fixed in the through hole, and the welding is strengthened.
  • the head end of the transmission cable 300 can pass through the through hole 203 to abut the PAD 101.
  • the head end of the transmission cable 300 can also be directly welded to the ultra-small PAD 101, and the intensity of signal transmission can be further increased. .
  • the outer diameter and position of the conductive post 201 need to be in one-to-one correspondence with the size and position of the ultra-small PAD 101, so that the optimal transmission effect can be achieved.
  • the conductive pillar 201 may be a square pillar, a cylinder or a cylinder of other shapes, and may be disposed according to actual use, and is not limited to the shape of the cylinder exemplified in the embodiment.
  • a second embodiment of the present invention discloses an auxiliary soldering component 200 for an ultra-small PAD.
  • one or more ultra-small PADs 101 are provided on the soldering surface of the electronic component 100, and the auxiliary soldering component 200 includes an ultra-small
  • the PAD 101 one-to-one electrically connects the conductive post 201 and the insulating seat 202 corresponding to the remaining area 102 of the soldering surface.
  • One end 201a of the conductive post 201 is inserted into the insulating seat 202, so that the insulating seat 202 covers one end of each conductive post.
  • 201a and each of the conductive posts 201 is fixed, and the other end 201b of the conductive posts is used to electrically connect the transmission cables.
  • This embodiment is a modification of the first embodiment, and the difference between this embodiment and the first embodiment is that, as shown in FIG. 3, in the second embodiment of the present invention, the other end 201b of each of the conductive pillars 201 The center is provided with an axial half hole 204 for inserting and fixing the transmission cable so that the transmission cable is indirectly electrically connected to the ultra small PAD.
  • hot-melt welding or laser welding may be employed.
  • solder may be applied to one end of the transmission cable 300, and then the solder-coated transmission cable 300 may be used.
  • One end is inserted into the half hole 204, and finally the transmission cable is welded and fixed in the half hole 204 by soldering; alternatively, one end of the transmission cable 300 can be directly inserted into the half hole 204, and then heated to make the transmission line
  • the cable and the semi-hole 204 of the conductive post are welded and fixed together.
  • the arrangement of the half holes 204 can accurately and conveniently connect the transmission cable with the conductive post, as long as the transmission cable is inserted and fixed in the half hole, and the soldering firmness can be enhanced.
  • a third embodiment of the present invention provides an auxiliary welding method for welding using an auxiliary welding element of an ultra-small PAD, which specifically includes the following steps:
  • Step S301 the electronic component 100 is placed in the mold 400 having a through hole on the bottom surface (as shown in FIG. 10), and the PAD on the soldering surface exposes the bottom surface of the mold 400 via the through hole;
  • Step S302 applying solder to the bottom surface of the mold 400, so that the surface of the PAD is coated with solder;
  • Step S303 the mold 400 and the auxiliary welding component of the ultra-small PAD are pasted and welded, so that the PAD and the one end of the conductive column are connected one-to-one;
  • step S304 the transmission cable is soldered to the other end of the conductive post.
  • step S303 the mold 400 is attached and welded to the auxiliary welding element of the ultra-small PAD, and the upper end surface of the conductive post 201 of the auxiliary welding element 200 is bonded to the ultra-small PAD 101 exposing the bottom surface of the mold 400. And welding the two so that the conductive post 201 is fixed and electrically connected to the PAD 101.
  • Step S303 and step S304 may be performed separately or simultaneously, and preferably these two steps are performed simultaneously.
  • the center of each of the conductive pillars 201 has an axial through hole.
  • the welding of the transmission cable to the other end of the conductive pillar in step S304 specifically includes the following steps:
  • Step S311 inserting the head end of the transmission cable from the other end of the conductive post into the through hole of the conductive column;
  • step S312 the transmission cable is welded and fixed in the through hole.
  • the solder can be applied to the front end of the transmission cable, and then the transmission cable is welded and fixed to the through-heating solder. In the hole; or directly, the head end of the transmission cable can be heat-welded and fixed in the through hole.
  • the transmission cable can also be passed through the through-hole through the conductive post from the other end of the conductive post, abutting the ultra-small PAD, and then the transmission cable is soldered to the ultra-small PAD by hot-melt welding technology.
  • the through hole is configured to accurately and conveniently connect the transmission cable to the conductive post, as long as the transmission cable is inserted and fixed into the through hole, and the degree of firmness of the welding can be enhanced.
  • the head end of the transmission cable 300 is directly in contact with the PAD 101, which further increases the strength of signal transmission.
  • a fourth embodiment of the present invention provides an auxiliary welding method for welding using an auxiliary welding element of an ultra-small PAD, which specifically includes the following steps:
  • Step S301 the electronic component 100 is placed in the mold 400 having a through hole on the bottom surface (as shown in FIG. 10), and the PAD on the soldering surface exposes the bottom surface of the mold 400 via the through hole;
  • Step S302 applying solder to the bottom surface of the mold 400, so that the surface of the PAD is coated with solder;
  • Step S303 the mold 400 and the auxiliary welding component of the ultra-small PAD are pasted and welded, so that the PAD and the one end of the conductive column are connected one-to-one;
  • step S304 the transmission cable is soldered to the other end of the conductive post.
  • Step S411 inserting the head end of the transmission cable from the other end of the conductive post into the half hole of the conductive column;
  • step S412 the transmission cable is welded and fixed in the half hole.
  • the solder can be applied to the tip end of the transmission cable in advance, and then the transmission cable is welded and fixed to the half by heating the solder. In the hole; or directly, the head end of the transmission cable can be heat-welded and fixed in the half hole.
  • the arrangement of the half holes can accurately and conveniently connect the transmission cable with the conductive post, as long as the transmission cable is inserted and fixed in the half hole, and the degree of firmness of the welding can be enhanced.
  • a fifth embodiment of the present invention provides an auxiliary welding method for welding using an auxiliary welding element of an ultra-small PAD, which specifically includes the following steps:
  • Step S301 the electronic component 100 is placed in the mold 400 having a through hole on the bottom surface (as shown in FIG. 10), and the PAD on the soldering surface exposes the bottom surface of the mold 400 via the through hole;
  • Step S302 applying solder to the bottom surface of the mold 400, so that the surface of the PAD is coated with solder;
  • Step S303 the mold 400 and the auxiliary welding component of the ultra-small PAD are pasted and welded, so that the PAD and the one end of the conductive column are connected one-to-one;
  • step S304 the transmission cable is soldered to the other end of the conductive post.
  • the other end of the conductive cable is welded to the conductive column in step S304, and specifically includes the following:
  • the transmission cable is welded and fixed to the outer surface of the other end of the conductive post.
  • the fusion welding may be a batch welding method or a laser welding method in a heating manner.
  • the solder may be applied to the tip end of the transmission cable in advance, and then the transmission cable is heat-welded and fixed to the conductive column by soldering.
  • the auxiliary processing of the conductive column is not required, and the transmission cable is directly soldered on the side of the conductive column, the manufacturing process is simple, the welding operation is convenient, and the utility model has good practicability.
  • a sixth embodiment of the present invention provides an auxiliary welding method for welding using an auxiliary welding element of an ultra-small PAD, which specifically includes the following steps:
  • Step S301 the electronic component 100 is placed in the mold 400 having a through hole on the bottom surface (as shown in FIG. 10), and the PAD on the soldering surface exposes the bottom surface of the mold 400 via the through hole;
  • Step S302 applying solder to the bottom surface of the mold 400, so that the surface of the PAD is coated with solder;
  • Step S303 the mold 400 and the auxiliary welding component of the ultra-small PAD are pasted and welded, so that the PAD and the one end of the conductive column are connected one-to-one;
  • step S304 the transmission cable is soldered to the other end of the conductive post.
  • the other end of the conductive cable for soldering the transmission cable in step S304 includes the following:
  • Step S611 wrapping a heat shrinkable pipeline outside the joint of the transmission cable
  • Step S612 inserting the transmission cable into the axial through hole or the axial half hole disposed at the center of the conductive column, or attaching the transmission cable to the outer side of the conductive column;
  • Step S613 the heat-shrinkable pipeline is simultaneously wrapped with the insulating portion of the conductive post and the transmission cable, and the heat-shrinkable pipeline is fixedly bundled with the other end of the transmission cable and the conductive post.
  • the transmission cable and the conductive column are fixed and electrically connected by using a heat-shrinking pipeline, and the operation is simple and quick, and the connection is stable, not only realizes electrical connection, but also can be insulated to avoid short circuit between cables.
  • a seventh embodiment of the present invention discloses a manufacturing assembly 600 for an auxiliary welding component of an ultra-small PAD.
  • the bottom surface of the electronic component 100 is provided with one or more ultra-small PADs 101, and the manufacturing assembly 600 includes:
  • the lower substrate 601 is provided with one or more through holes 601a for inserting the conductive pillars 201.
  • the upper end portion 201a of the conductive pillars protrudes from the upper surface of the lower substrate, the aperture, the position of the through hole 601a and the size of the PAD 101.
  • the upper cover plate 602 covers the lower substrate 601, and forms an inner cavity 602a between the rear upper cover plate 602 and the lower substrate 601.
  • the upper end portion 201a of the conductive post protruding from the upper surface of the lower substrate is received in the inner cavity. 602a;
  • An injection molding apparatus (not shown) is used to cast an insulating material into the inner cavity 602a to form an insulating seat 202 that is coated on the upper end portion 201a of the conductive post.
  • the auxiliary soldering component 200 of the ultra-small PAD includes a conductive post 201 electrically connected to the PAD 101 in one-to-one correspondence, and an insulating base 202 corresponding to the remaining area 102 of the soldering surface.
  • One end 201a of the conductive post 201 is inserted into the insulating seat 202.
  • the insulating seat 202 covers one end 201a of each of the conductive pillars and fixes each of the conductive pillars 201, and the other end 201b of the conductive pillars is used to electrically connect the transmission cable.
  • the upper end portion 201a of the conductive post protrudes from the surface of the lower substrate 601.
  • the inner cavity 602a receives the upper end portion of the conductive post 201 in the inner cavity 602a, and then casts an insulating material into the inner cavity 602a by using an injection molding apparatus.
  • the upper cover plate 602 can be removed, thereby completing the fabrication.
  • An auxiliary soldering element 200 is included including a conductive post 201 and an insulating seat 202 that is wrapped over the upper end of the conductive post.
  • the upper end portion of the conductive post 201 when the upper end portion of the conductive post 201 is received in the inner wall 602a, the upper end portion of the conductive post can directly abut against the upper wall of the inner cavity 602a, so that after the upper cover plate 602 is removed, the conductive post 201
  • the upper end surface can be exposed for subsequent further operations; in addition, it is not required to completely abut, after the injection molding is completed, the conductive column is exposed by cutting the bottom surface or grinding the bottom surface, so that the conductive column 201 can be made up.
  • the end faces are more reliably exposed and are not covered by the injection molding material.
  • This embodiment is a preferred manufacturing method for manufacturing an auxiliary welding component for an ultra-small PAD.
  • other devices and components can be used and other methods are used to fabricate the auxiliary welding component of the ultra-small PAD. It is not limited to the components and methods exemplified in the embodiment.
  • an eighth embodiment of the present invention discloses an auxiliary welding method for welding an auxiliary welding component of an ultra-small PAD based on the manufacturing assembly described in the sixth embodiment, comprising the following steps:
  • Step S801 inserting the conductive pillars 201 into the through holes 601a of the lower substrate respectively, so that the upper end portion 201a of the conductive pillars protrudes from the upper surface of the lower substrate;
  • Step S802 the upper cover plate 602 is overlaid on the lower substrate 601, so that the upper end portion 201a of the conductive column protruding from the upper surface of the lower substrate is received in the inner cavity 602a;
  • step S803 the insulating material is poured into the inner cavity 602 by the injection molding apparatus to form the insulating seat, and the upper cover plate 602 is removed, thereby forming the auxiliary welding component 200 of the ultra-small PAD including the conductive post 201 and the insulating seat 202.
  • This embodiment is a preferred manufacturing method for manufacturing an auxiliary welding component of an ultra-small PAD.
  • other methods can be used to fabricate the auxiliary welding component of the ultra-small PAD, and are not limited to the examples in the embodiment. Methods.
  • a ninth embodiment of the present invention discloses an auxiliary welding method for welding an auxiliary welding element of an ultra-small PAD based on the manufacturing assembly described in the sixth embodiment, comprising the following steps:
  • Step S901 inserting the conductive pillars 201 into the through holes 601a of the lower substrate 601, respectively, so that the upper end portion 201a of the conductive pillars protrudes from the surface of the lower substrate 601;
  • Step S902 the upper cover plate 602 is overlaid on the lower substrate 601, so that the upper end portion 201a of the conductive column protruding from the upper surface of the lower substrate is received in the inner cavity 602a;
  • Step S903 using an injection molding device to cast an insulating material into the inner cavity 602a, forming the insulating seat 202, removing the upper cover plate 602, and exposing the upper end surface of the conductive post;
  • Step S904 the electronic component 100 is placed in the mold 400 having a through hole on the bottom surface thereof.
  • the aperture and the position of the through hole are in one-to-one correspondence with the outer diameter and position of the conductive post 201, and the PAD on the soldering surface exposes the bottom surface of the mold 400 through the through hole. ;
  • Step S905 applying solder to the bottom surface of the mold 400, so that the surface of the PAD is coated with solder;
  • step S906 the mold 400 is pasted and welded to the lower substrate 601 of the conductive post 201, so that the PAD is connected to the upper end portion 201a of the conductive post in a one-to-one correspondence;
  • step S907 the transmission cable 300 is soldered to the lower end portion 201b of the conductive post.
  • step S907 when the center of the conductive post 201 has a through hole, the transmission cable 300 can be inserted and soldered in the through hole; when the center of the lower end portion 201b of the conductive post has a half hole, The transmission cable 300 is inserted and soldered in the half hole; in addition, the transmission cable 300 may be directly soldered to the outer surface of the conductive post 201, or the transmission cable and the conductive post may be performed by using a heat shrinkable pipeline. Fixed connection, depending on the specific application in practice, will not be described here.
  • the auxiliary welding component of the ultra-small PAD according to the present invention uses the conductive pillar to electrically connect the transmission cable to the PAD of the PAD, thereby increasing the welding time.
  • the space for operation can be easily operated without a microscope, the welding quality is reliable, the false welding or the welding is not easy to occur, and the mass production is convenient, and has high practical value.
  • the above-described embodiments of the present invention are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the present invention. Modifications or variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention are still covered by the appended claims.

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Abstract

本发明公开了一种超小型PAD的辅助焊接元件及其制造组件、制造方法和辅助焊接方法，超小型PAD设置于电子元件的焊接面上，辅助焊接元件包括与PAD一一对应电连接的导电柱和与焊接面的剩余区域相对应的绝缘座，导电柱的一端插接于绝缘座中，使得绝缘座包覆各个导电柱的一端并将各个导电柱进行固定，导电柱的另一端用于电连接传输线缆。本发明利用导电柱来将传输线缆电连接于电子元件的焊接面上的超小型PAD上，增加了焊接时可操作的空间，无需显微镜即可便捷操作，焊接质量可靠，不易发生虚焊假焊或焊接脱落，同时便于批量化的生产制造，具有很高的实用价值。

Description

一种超小型PAD的辅助焊接元件及其制造组件、制造方法和辅助焊接方法 技术领域
本发明涉及电子元件领域，特别是涉及一种超小型PAD的辅助焊接元件及其制造组件、制造方法和辅助焊接方法。
背景技术
在内窥镜端头的感光芯片(sensor)需要跟传输影像数据和电信号等线缆连接。通常在感光芯片的底部具有裸露的PAD(PAD是焊盘的意思,是PCB板和元器件引脚相互焊接的部份,由铜箔和孔组成,需将铜箔露出,且不能有阻焊膜覆盖)与线缆焊接，由于感光芯片底部的PAD本身很小，PAD和PAD之间的间距也很小，焊接时可操作的空间有限，需要显微镜下操作，焊接效率非常底，易产生虚焊假焊。而且PAD直接与线缆焊接，焊接牢固度比较低，稍有不慎，易导致焊盘和传输线与PCB剥离。
发明内容
本发明公开了一种超小型PAD的辅助焊接元件，超小型PAD设置于电子元件的焊接面上，辅助焊接元件包括与超小型PAD一一对应电连接的导电柱和与焊接面的剩余区域相对应的绝缘座，导电柱的一端插接于绝缘座中，使得绝缘座包覆各个导电柱的一端并将各个导电柱进行固定，导电柱的另一端用于电连接传输线缆。
优选地，每个导电柱的中心具有轴向通孔，或者每个导电柱的另一端中心具有轴向半孔，通孔或者半孔用于插入并电连接传输线缆。
进一步地，导电柱的外径、位置与PAD的大小、位置一一对应。
优选地，导电柱为圆柱或者方柱。
本发明还公开了一种应用如上所述的超小型PAD的辅助焊接元件的辅助焊接方法，包括以下步骤：将电子元件置于底面设有通孔的模具中，焊接面上的PAD经由通孔露出模具底面；在模具底面涂抹焊锡，使得PAD表面涂有焊锡；将模具与 超小型PAD的辅助焊接元件进行贴合并熔焊，使得PAD与导电柱的一端一一对应连接；将传输线缆焊接于导电柱的另一端。
优选地，每个导电柱的中心具有轴向通孔，将传输线缆焊接于导电柱的另一端具体包括：将传输线缆的头端自导电柱的另一端插入导电柱的通孔，使得传输线缆的头端抵接与导电柱固定连接的PAD；将传输线缆焊接固定于通孔中。
进一步地，每个导电柱的另一端中心具有轴向半孔，将传输线缆焊接于导电柱的另一端具体包括：将传输线缆的头端自导电柱的一端插入导电柱的半孔；将传输线缆焊接固定于半孔中。
优选地，将传输线缆焊接于导电柱的另一端具体包括：通过焊锡将传输线缆焊接固定在导电柱的另一端表面。
优选地，将传输线缆焊接于导电柱的另一端具体包括：在传输线缆的接头外侧包裹热缩管线；将传输线缆插入设置于导电柱中心的轴向通孔或轴向半孔，或者将传输线缆紧贴于导电柱的外侧；使得热缩管线同时包裹导电柱和传输线缆的绝缘部分，加热热缩管线将传输线缆和导电柱的另一端固定捆绑在一起。
本发明还公开了一种制造如上所述的超小型PAD的辅助焊接元件的制造组件，超小型PAD设有一个或多个PAD，包括：下基板，下基板设有一个或多个供导电柱插入的通孔，插入后导电柱的上端部可突出于下基板的上表面，通孔的孔径、位置于PAD的大小、位置一一对应；上盖板，上盖板覆盖于下基板，覆盖后上盖板与下基板之间形成内腔，导电柱的突出于下基板的上表面的上端部容纳于内腔；注塑设备，用于向内腔中浇筑绝缘材料，以形成包覆于导电柱的上端部的绝缘座。
本发明还公开了一种应用如上所述的超小型PAD的制造组件的辅助焊接元件的制造方法，包括以下步骤：将导电柱分别插入下基板的通孔中，使得导电柱的上端部突出于下基板的上表面；将上盖板覆盖于下基板之上，使得导电柱的突出于下基板的上表面的上端部容纳于内腔；利用注塑设备向内腔中浇筑绝缘材料，以形成包覆于导电柱的上端部的绝缘座。
本发明还公开了一种基于如上所述的制造组件来对超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，包括以下步骤：将导电柱分别插入下基板的通孔中，使得导电柱的上端部突出于下基板的上表面；将上盖板覆盖于下基板之上，使得导电柱的突出于下基板的上表面的上端部容纳于内腔；利用注塑设备向内腔中浇筑绝缘材料，形成绝缘座后撤去上盖板，并使得导电柱的上端表面外露；将电子元件置于底面设有通孔的模具中，通孔的孔径、位置与导电柱的外径、位置一一 对应，焊接面上的PAD经由通孔露出模具底面；在模具底面涂抹焊锡，使得PAD表面涂有焊锡；将模具与插入导电柱的下基板进行贴合并熔焊，使得PAD与导电柱的上端部一一对应连接；将传输线缆焊接于导电柱的下端部。
如上，本发明涉及的超小型PAD的辅助焊接元件及其制造组件、制造方法和辅助焊接方法，利用导电柱来将传输线缆电连接于电子元件的焊接面上的超小型PAD上，增加了焊接时可操作的空间，减少了超小型PAD尺寸对于焊接操作不便的影响，无需显微镜即可便捷操作，焊接质量可靠，不易发生虚焊假焊或焊接脱落，同时便于批量化的生产制造，具有很高的实用价值。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并结合附图，作详细说明如下。
附图说明
下面将结合附图介绍本发明。
图1为本发明第一和第二实施例中所公开的超小型PAD的整体结构示意图；
图2为本发明第一和第二实施例中所公开的超小型PAD的辅助焊接元件的整体结构示意图；
图3为本发明第一和第二实施例中所公开的超小型PAD的辅助焊接元件的仰视图；
图4为本发明第一和第二实施例中所公开的传输线缆的整体结构示意图；
图5为本发明第一和第二实施例中所公开的超小型PAD的辅助焊接元件的焊接组装示意图；
图6为本发明第三实施公开的超小型PAD的辅助焊接元件的辅助焊接方法流程图；
图7为本发明第三实施公开的超小型PAD的辅助焊接元件的一种优选辅助焊接方法流程图；
图8为本发明第四实施公开的超小型PAD的辅助焊接元件的另一种优选辅助焊接方法流程图；
图9为本发明第六实施公开的超小型PAD的辅助焊接元件的另一种优选辅助焊接方法流程图；
图10为本发明第七实施例公开的制造超小型PAD的辅助焊接元件的制造组件 的整体结构示意图；
图11为本发明第八实施例公开的应用如超小型PAD的制造组件的辅助焊接元件的制造方法流程图；
图12为本发明第九实施例公开的基于上述制造组件来对超小型PAD的辅助焊接元件进行焊接的辅助焊接方法流程图。
具体实施方式
以下由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
需说明的是，在本发明中，图中的上、下、左、右即视为本说明书中所述的超小型PAD的辅助焊接元件及其制造组件的上、下、左、右。
现在参考附图介绍本发明的示例性实施方式，然而，本发明可以用许多不同的形式来实施，并且不局限于此处描述的实施例，提供这些实施例是为了详尽地且完全地公开本发明，并且向所属技术领域的技术人员充分传达本发明的范围。对于表示在附图中的示例性实施方式中的术语并不是对本发明的限定。在附图中，相同的单元/元件使用相同的附图标记。
除非另有说明，此处使用的术语(包括科技术语)对所属技术领域的技术人员具有通常的理解含义。另外，可以理解的是，以通常使用的词典限定的术语，应当被理解为与其相关领域的语境具有一致的含义，而不应该被理解为理想化的或过于正式的意义。
第一实施例
如图2所示，本发明第一实施例公开了一种超小型PAD的辅助焊接元件200，如图1所示，电子元件100的焊接面上设有一个或多个超小型PAD101，辅助焊接元件200包括与超小型PAD101一一对应电连接的导电柱201和与焊接面的剩余区域102相对应的绝缘座202，导电柱201的一端201a插接于绝缘座202中，使得绝缘座202包覆各个导电柱的一端201a并将各个导电柱201进行固定，导电柱的另一端201b用于电连接传输线缆。
本发明第一实施例中的超小型PAD是指将PCB板和元器件的引脚或者线缆等进行相互焊接的焊盘，由外露的铜箔或铝等金属导体组成，不能有阻焊膜覆盖。超小型PAD的面积为0.0025平方毫米到4平方毫米,PAD通常为方形或者圆形等几何形状，例如设置于医疗内窥镜的弯曲管前端的用于采集和传输影像信号的感光芯 片的底面就是设置了一个或多个超小型PAD。在实践操作中，由于超小型PAD与传输线缆焊接时需要在显微镜下操作，焊接十分困难，且容易产生虚焊假焊，本实施例便提供一种用于辅助超小型PAD与传输线缆缆进行焊接的辅助焊接元件。
具体地，以感光芯片为例，通常在感光芯片100的底面上设置四个超小型PAD101，这四个超小型PAD101之间间距约为0.1mm左右，用于辅助焊接的辅助焊接元件200包括与该四个超小型PAD101的大小、位置一一对应的四个导电柱201和与感光芯片的焊接面的剩余区域位置相对应的绝缘座202，导电柱201的一端201a插入绝缘座202中，使得绝缘座202能够包覆各个导电柱的一端202a并将各个导电柱202进行固定，导电柱的另一端202b用于与感光芯片的传输线缆进行电连接。
本实施例中，四个导电柱201的大小、位置与四个PAD101一一对应地电连接，导电柱201相当于将超小型PAD101在空间中进行延伸，实际操作时，焊接操作无需受到超小型PAD的空间尺寸和距离所限，将传输线缆与导电柱焊接即可将传输线缆与PAD101进行电连接，从而极大地增加了操作的便利性，降低了虚焊假焊的概率，提高了焊接的牢固度以及效率。
进一步地，如图3所示，本发明第一实施例中，导电柱201的中心具有轴向通孔203。图4为传输线缆的整体结构示意图，当传输线缆与导电柱进行焊接时，可以采用热熔焊或者激光焊接的方式，当采用热熔焊时，如图5所示，可在传输线缆300的一端涂抹焊锡，继而将涂有焊锡的传输线缆300的一端插入通孔203中，使得传输线缆300的头端抵接已经与导电柱201固定连接的焊点101，通过加热融化焊锡来将传输线缆熔焊固定在通孔203之中；另外地，也可以直接将传输线缆300的一端插入通孔203中，继而加热使得传输线缆和导电柱的通孔203熔焊固定在一起。通孔203的设置能够准确方便地将传输线缆与导电柱进行连接，只要将传输线缆插入并固定于通孔中即可，同时可增强焊接的牢固程度。
优选可以使得传输线缆300的头端穿过通孔203，抵接PAD101，通过加热熔焊，传输线缆300的头端还可以直接与超小型PAD101相熔接，又可进一步增加信号传输的强度。
本发明第一实施例中，导电柱201的外径、位置与超小型PAD101的大小、位置需一一对应，这样能够起到最佳的传输效果。导电柱201可以为方柱、圆柱或者其他形状的柱体，可根据实际使用情况进行设置，而不仅仅限于本实施例中所例举的柱体形状。
第二实施例
本发明第二实施例公开了一种超小型PAD的辅助焊接元件200，如图1所示，电子元件100的焊接面上设有一个或多个超小型PAD101，辅助焊接元件200包括与超小型PAD101一一对应电连接的导电柱201和与焊接面的剩余区域102相对应的绝缘座202，导电柱201的一端201a插接于绝缘座202中，使得绝缘座202包覆各个导电柱的一端201a并将各个导电柱201进行固定，导电柱的另一端201b用于电连接传输线缆。
本实施例是第一实施例的变形例，本实施例和第一实施例的不同之处在于，如图3所示，本发明第二实施例中，每个导电柱201的另一端201b的中心设置有轴向半孔204，该半孔204用于插入并固定传输线缆，从而使得传输线缆间接与超小型PAD进行电连接。在实际操作中，可以采用热熔焊或者激光焊接的方式，当采用热熔焊时，如图5所示，可以在传输线缆300的一端涂抹焊锡，继而将涂有焊锡的传输线缆300的一端插入半孔204中，最后通过焊锡来将传输线缆熔焊固定在半孔204之中；另外地，也可以直接将传输线缆300的一端插入半孔204中，继而加热使得传输线缆和导电柱的半孔204熔焊固定在一起。半孔204的设置能够准确方便地将传输线缆与导电柱进行连接，只要将传输线缆插入并固定于半孔中即可，同时可增强焊接的牢固程度。
第三实施例
如图6所示，本发明第三实施例提供了一种应用超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，具体包括以下步骤：
步骤S301，将电子元件100置于底面设有通孔的模具400中(如图10所示)，焊接面上的PAD经由通孔露出模具400的底面；
步骤S302，在模具400底面涂抹焊锡，使得PAD表面涂有焊锡；
步骤S303，将模具400与超小型PAD的辅助焊接元件进行贴合并熔焊，使得PAD与导电柱的一端一一对应连接；
步骤S304，将传输线缆焊接于导电柱的另一端。
具体地，在步骤S303中，将模具400与超小型PAD的辅助焊接元件进行贴合并熔焊，是将辅助焊接元件200的导电柱201的上端面与露出模具400底面的超小型PAD101相贴合，并将两者进行熔焊，使得导电柱201与PAD101固定并电连接。
步骤S303和步骤S304可分开进行，也可同时进行，优选将这两个步骤同时进 行。
在本优选实施例中，每个导电柱201的中心具有轴向通孔，如图7所示，步骤S304中将传输线缆焊接于导电柱的另一端具体包括以下步骤：
步骤S311，将传输线缆的头端自导电柱的另一端插入导电柱的通孔；
步骤S312，将传输线缆熔焊固定于通孔中。
具体地，将传输线缆的头端自导电柱的另一端插入导电柱的通孔中时，可以事先在传输线缆的头端涂抹焊锡，继而通过加热焊锡将传输线缆熔焊固定于通孔中；或者可以直接将传输线缆的头端加热熔焊固定于通孔中。还可以将传输线缆自导电柱的另一端通过通孔穿过导电柱，抵接于超小型PAD，继而通过热熔焊技术将传输线缆与超小型PAD焊接固定在一起。
本实施例中，通孔的设置能够准确方便地将传输线缆与导电柱进行连接，只要将传输线缆插入并固定与通孔中即可，同时可增强焊接的牢固程度。而传输线缆300的头端直接与PAD101相接触，又可进一步增加信号传输的强度。
第四实施例
如图6所示，本发明第四实施例提供了一种应用超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，具体包括以下步骤：
步骤S301，将电子元件100置于底面设有通孔的模具400中(如图10所示)，焊接面上的PAD经由通孔露出模具400的底面；
步骤S302，在模具400底面涂抹焊锡，使得PAD表面涂有焊锡；
步骤S303，将模具400与超小型PAD的辅助焊接元件进行贴合并熔焊，使得PAD与导电柱的一端一一对应连接；
步骤S304，将传输线缆焊接于导电柱的另一端。
本实施例与第三实施例的不同之处在于，在本优选实施例中，每个导电柱的另一端201b的中心具有轴向半孔，如图8所示，步骤S304中将传输线缆焊接于导电柱的另一端具体包括以下步骤：
步骤S411，将传输线缆的头端自导电柱的另一端插入导电柱的半孔；
步骤S412，将传输线缆熔焊固定于半孔中。
具体地，将传输线缆的头端自导电柱的另一端插入导电柱的半孔中时，可以事先在传输线缆的头端涂抹焊锡，继而通过加热焊锡将传输线缆熔焊固定于半孔中；或者可以直接将传输线缆的头端加热熔焊固定于半孔中。
本实施例中，半孔的设置能够准确方便地将传输线缆与导电柱进行连接，只要 将传输线缆插入并固定于半孔中即可，同时可增强焊接的牢固程度。
第五实施例
如图6所示，本发明第五实施例提供了一种应用超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，具体包括以下步骤：
步骤S301，将电子元件100置于底面设有通孔的模具400中(如图10所示)，焊接面上的PAD经由通孔露出模具400的底面；
步骤S302，在模具400底面涂抹焊锡，使得PAD表面涂有焊锡；
步骤S303，将模具400与超小型PAD的辅助焊接元件进行贴合并熔焊，使得PAD与导电柱的一端一一对应连接；
步骤S304，将传输线缆焊接于导电柱的另一端。
本实施例与第三实施例和第四实施例的不同之处在于，在本优选实施例中，步骤S304中将传输线缆焊接于导电柱的另一端具体包括以下：
将传输线缆熔焊固定在导电柱的另一端外侧表面。
具体地，熔焊可以是加热方式批量熔焊或者激光熔焊，当采用加热方式时，可以事先在传输线缆的头端涂抹焊锡，继而通过焊锡将传输线缆加热熔焊固定于导电柱的另一端的外侧表面；当采用激光熔焊时，如果线缆和导电柱是熔点相近的材料，刚无需涂抹焊锡，直接利用激光高温融化熔接。
本实施例中，无需对导电柱进行辅助加工，直接将传输线缆焊接在导电柱的侧面即可，制造工艺简单，焊接操作便捷，具有很好的实用性。
第六实施例
如图6所示，本发明第六实施例提供了一种应用超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，具体包括以下步骤：
步骤S301，将电子元件100置于底面设有通孔的模具400中(如图10所示)，焊接面上的PAD经由通孔露出模具400的底面；
步骤S302，在模具400底面涂抹焊锡，使得PAD表面涂有焊锡；
步骤S303，将模具400与超小型PAD的辅助焊接元件进行贴合并熔焊，使得PAD与导电柱的一端一一对应连接；
步骤S304，将传输线缆焊接于导电柱的另一端。
本实施例与上述三个实施例的不同之处在于，在本优选实施例中，如图9所示，步骤S304中将传输线缆焊接于导电柱的另一端具体包括以下：
步骤S611，在传输线缆的接头外侧包裹热缩管线；
步骤S612，将传输线缆插入设置于导电柱中心的轴向通孔或轴向半孔，或者将传输线缆紧贴于导电柱的外侧；
步骤S613，使得热缩管线同时包裹导电柱和传输线缆的绝缘部分，加热热缩管线将传输线缆和导电柱的另一端固定捆绑在一起。
本实施例中，利用热缩管线将传输线缆和导电柱固定并电连接在一起，操作上简便快捷，连接稳固，不但实现了电连接，还能够绝缘，避免线缆之间的短路发生。
第七实施例
如图10所示，本发明第七实施例公开了一种超小型PAD的辅助焊接元件的制造组件600，电子元件100的底面设有一个或多个超小型PAD101，该制造组件600包括：
下基板601，下基板601设有一个或多个供导电柱201插入的通孔601a，插入后导电柱的上端部201a突出于下基板的上表面，通孔601a的孔径、位置与PAD101的大小、位置一一对应；
上盖板602，上盖板602覆盖于下基板601，覆盖后上盖板602与下基板601之间形成内腔602a，导电柱的突出于下基板的上表面的上端部201a容纳于内腔602a；
注塑设备(图中未标志)，用于向内腔602a中浇筑绝缘材料，以形成包覆于导电柱的上端部201a的绝缘座202。
其中，超小型PAD的辅助焊接元件200包括与PAD101一一对应电连接的导电柱201和与焊接面的剩余区域102相对应的绝缘座202，导电柱201的一端201a插接于绝缘座202中，使得绝缘座202包覆各个导电柱的一端201a并将各个导电柱201进行固定，导电柱的另一端201b用于电连接传输线缆。
具体地，将导电柱201插入下基板601的通孔601a中之后，导电柱的上端部201a突出于下基板601的表面，当下基板601和上盖板602扣合之后，两者之间形成一内腔602a，将导电柱201的上端部容纳于内腔602a中，之后利用注塑设备向内腔602a之中浇筑绝缘材料，待浇筑形成的绝缘座凝固之后可撤去上盖板602，从而制作完成包括导电柱201和包覆于导电柱上端部的绝缘座202的辅助焊接元件200。
本实施例中，当导电柱201的上端部容纳于内墙602a中时，可以使得导电柱的上端部直接抵接于内腔602a的上壁，这样当撤去上盖板602之后，导电柱201 的上端面即可外露，便于后续的进一步操作；另外地，也可以不要求完全抵接，在注塑完成之后，通过切削底表面或者磨削底表面露出导电柱，这样可以使得导电柱201的上端面更可靠地露出来，不会被注塑材料覆盖。
本实施例为制造超小型PAD的辅助焊接元件的一种优选的制作组件制作方法，实践中还能够采用其他的设备和元件并采用其他的方法来进行超小型PAD的辅助焊接元件的制作，并不仅限于本实施例中所例举的组件和方法。
第八实施例
如图11所示，本发明第八实施例公开了一种基于第六实施例中所述的制造组件来对超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，包括以下步骤：
步骤S801，将导电柱201分别插入下基板的通孔601a中，使得导电柱的上端部201a突出于下基板的上表面；
步骤S802，将上盖板602覆盖于下基板601之上，使得导电柱的突出于下基板的上表面的上端部201a容纳于内腔602a；
步骤S803，利用注塑设备向内腔602中浇筑绝缘材料，形成绝缘座后撤去上盖板602，从而形成了包括导电柱201和绝缘座202的超小型PAD的辅助焊接元件200。
本实施例为制造超小型PAD的辅助焊接元件的一种优选的制作方法，实践中还能够采用其他的方法来进行超小型PAD的辅助焊接元件的制作，并不仅限于本实施例中所例举的方法。
第九实施例
如图12所示，本发明第九实施例公开了一种基于第六实施例中所述的制造组件来对超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，包括以下步骤：
步骤S901，将导电柱201分别插入下基板601的通孔601a中，使得导电柱的上端部201a突出于下基板601表面；
步骤S902，将上盖板602覆盖于下基板601之上，使得导电柱的突出于下基板的上表面的上端部201a容纳于内腔602a；
步骤S903，利用注塑设备向内腔602a中浇筑绝缘材料，形成绝缘座202后撤去上盖板602，并使得导电柱的上端表面外露；
步骤S904，将电子元件100置于底面设有通孔的模具400中，通孔的孔径、位置与导电柱201的外径、位置一一对应，焊接面上的PAD经由通孔露出模具400底面；
步骤S905，在模具400底面涂抹焊锡，使得PAD表面涂有焊锡；
步骤S906，将模具400与插入导电柱201的下基板601进行贴合并熔焊，使得PAD与导电柱的上端部201a一一对应连接；
步骤S907，将传输线缆300焊接于导电柱的下端部201b。
进一步地，在步骤S907中，当导电柱201的中心具有通孔时，可将传输线缆300插入并焊接固定于通孔中；当导电柱的下端部201b的中心具有半孔时，可将传输线缆300插入并焊接固定于半孔中；除此之外，亦可将传输线缆300直接焊接于导电柱201的外侧表面即可，或者利用热缩管线将传输线缆和导电柱进行固定连接，实践中视具体应用场合而定，在此不再赘述。
综上所述，本发明所涉及的超小型PAD的辅助焊接元件及其制造组件、制造方法和辅助焊接方法，利用导电柱来将传输线缆电连接于PAD的PAD上，增加了焊接时可操作的空间，无需显微镜即可便捷操作，焊接质量可靠，不易发生虚焊假焊或焊接脱落，同时便于批量化的生产制造，具有很高的实用价值。此外，本发明上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，本领域技术人员在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (12)

  1. 一种超小型PAD的辅助焊接元件，所述超小型PAD设置于电子元件的焊接面上，其特征在于，所述辅助焊接元件包括与所述超小型PAD一一对应电连接的导电柱和与所述焊接面的剩余区域相对应的绝缘座，所述导电柱的一端插接于所述绝缘座中，使得所述绝缘座包覆各个所述导电柱的一端并将各个所述导电柱进行固定，所述导电柱的另一端用于电连接传输线缆。
  2. 根据权利要求1所述的超小型PAD的辅助焊接元件，其特征在于，每个所述导电柱的中心具有轴向通孔，或者每个所述导电柱的另一端中心具有轴向半孔，所述通孔或者所述半孔用于插入并电连接传输线缆。
  3. 根据权利要求1所述的超小型PAD的辅助焊接元件，其特征在于，所述导电柱的外径、位置与所述PAD的大小、位置一一对应。
  4. 根据权利要求1所述的超小型PAD的辅助焊接元件，其特征在于，所述导电柱为圆柱或者方柱。
  5. 一种应用如权利要求1-4中任一所述的超小型PAD的辅助焊接元件的辅助焊接方法，其特征在于，包括以下步骤：
    将所述电子元件置于底面设有通孔的模具中，所述焊接面上的所述PAD经由所述通孔露出所述模具底面；
    在所述模具底面涂抹焊锡，使得所述PAD表面涂有所述焊锡；
    将所述模具与所述超小型PAD的辅助焊接元件进行贴合并熔焊，使得所述PAD与所述导电柱的一端一一对应连接；
    将所述传输线缆焊接于所述导电柱的另一端。
  6. 根据权利要求5所述的辅助焊接方法，其特征在于，每个所述导电柱的中心具有轴向通孔，将所述传输线缆焊接于所述导电柱的另一端具体包括：
    将所述传输线缆的头端自所述导电柱的另一端插入所述导电柱的所述通孔，使得所述传输线缆的头端抵接于与所述导电柱固定连接的所述PAD；
    将所述传输线缆焊接固定于所述通孔中。
  7. 根据权利要求5所述的辅助焊接方法，其特征在于，每个所述导电柱的另一端中心具有轴向半孔，将所述传输线缆焊接于所述导电柱的另一端具体包括：
    将所述传输线缆的头端自所述导电柱的一端插入所述导电柱的所述半孔；
    将所述传输线缆焊接固定于所述半孔中。
  8. 根据权利要求5所述的辅助焊接方法，其特征在于，将所述传输线缆焊接于所述导电柱的另一端具体包括：
    将所述传输线缆熔焊固定在所述导电柱的另一端外侧表面。
  9. 根据权利要求5所述的辅助焊接方法，其特征在于，将所述传输线缆焊接于所述导电柱的另一端具体包括：
    在所述传输线缆的接头外侧包裹热缩管线；
    将所述传输线缆插入所述设置于所述导电柱中心的轴向通孔或轴向半孔，或者将所述传输线缆紧贴于所述导电柱的外侧；
    使得热缩管线同时包裹所述导电柱和所述传输线缆的绝缘部分，加热所述热缩管线将所述传输线缆和所述导电柱的另一端固定捆绑在一起。
  10. 一种制造如权利要求1-4中任一所述的超小型PAD的辅助焊接元件的制造组件，其特征在于，包括：
    下基板，所述下基板设有一个或多个供所述导电柱插入的通孔，所述通孔的孔径、位置与所述PAD的大小、位置一一对应，插入后所述导电柱的上端部可突出于所述下基板的上表面；
    上盖板，所述上盖板覆盖于所述下基板，覆盖后所述上盖板与所述下基板之间形成内腔，所述导电柱的突出于所述下基板的上表面的上端部容纳于所述内腔；
    注塑设备，用于向所述内腔中浇筑绝缘材料，以形成包覆于所述导电柱的所述上端部的所述绝缘座。
  11. 一种应用权利要求10所述的制造组件的超小型PAD的辅助焊接元件的制造方法，其特征在于，包括以下步骤：
    将所述导电柱分别插入所述下基板的所述通孔中，使得所述导电柱的上端部突出于所述下基板的上表面；
    将所述上盖板覆盖于所述下基板之上，使得所述导电柱的突出于所述下基板的上表面的上端部容纳于所述内腔；
    利用所述注塑设备向所述内腔中浇筑所述绝缘材料，以形成包覆于所述导电柱的所述上端部的所述绝缘座。
  12. 一种基于如权利要求10所述的制造组件来对超小型PAD的辅助焊接元件进行焊接的辅助焊接方法，其特征在于，包括以下步骤：
    将所述导电柱分别插入所述下基板的所述通孔中，使得所述导电柱的上端部突出于所述下基板的上表面；
    将所述上盖板覆盖于所述下基板之上，使得所述导电柱的突出于所述下基板的上表面的上端部容纳于所述内腔；
    利用所述注塑设备向所述内腔中浇筑所述绝缘材料，形成所述绝缘座后撤去所述上盖板，并使得所述导电柱的上端表面外露；
    将所述电子元件置于底面设有通孔的模具中，所述通孔的孔径、位置与所述导电柱的外径、位置一一对应，所述焊接面上的所述PAD经由所述通孔露出所述模具底面；
    在所述模具底面涂抹焊锡，使得所述PAD表面涂有所述焊锡；
    将所述模具与插入所述导电柱的所述下基板进行贴合并熔焊，使得所述PAD与所述导电柱的上端部一一对应连接；
    将所述传输线缆焊接于所述导电柱的下端部。
PCT/CN2019/086504 2018-05-17 2019-05-11 一种超小型pad的辅助焊接元件及其制造组件、制造方法和辅助焊接方法 WO2019218948A1 (zh)

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