WO2017166656A1 - 印刷线路板及其制造方法 - Google Patents

印刷线路板及其制造方法 Download PDF

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Publication number
WO2017166656A1
WO2017166656A1 PCT/CN2016/097021 CN2016097021W WO2017166656A1 WO 2017166656 A1 WO2017166656 A1 WO 2017166656A1 CN 2016097021 W CN2016097021 W CN 2016097021W WO 2017166656 A1 WO2017166656 A1 WO 2017166656A1
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WO
WIPO (PCT)
Prior art keywords
solder
metal foil
connector
printed circuit
circuit board
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Application number
PCT/CN2016/097021
Other languages
English (en)
French (fr)
Inventor
罗汉英
Original Assignee
乐视控股（北京）有限公司
乐视致新电子科技（天津）有限公司
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Application filed by 乐视控股（北京）有限公司, 乐视致新电子科技（天津）有限公司 filed Critical 乐视控股（北京）有限公司
Publication of WO2017166656A1 publication Critical patent/WO2017166656A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding

Definitions

  • the embodiments of the present application relate to the technical field of printed wiring boards, for example, to a printed wiring board and a manufacturing method thereof.
  • a related printed circuit board is usually provided with two components, one is a surface mount attached to the surface of the PCB, and the other is a connector through which the lead needs to pass through the PCB.
  • the solder paste of the surface mount is usually firstly soldered to solder the surface mount, and the solder joint is soldered.
  • the surface to be soldered of the printed circuit board is directly in contact with the high temperature liquid tin, which may cause the soldering of the plugged component to cause a short circuit between the connectors.
  • the related PCB board requires two weldings to be completed, the welding process is cumbersome, the manufacturing cost is high, and the PCB board is prone to the short circuit of components. Affect the performance of the PCB, resulting in a low yield.
  • the embodiment of the present application provides a printed circuit board and a manufacturing method thereof, which reduce the cumbersome welding process of the PCB board in the related art, high manufacturing cost, and low yield rate.
  • an embodiment of the present application provides a method for manufacturing a printed circuit board, including:
  • the metal foil ring is located on the first surface or the second surface of the printed wiring board and surrounds the corresponding connector through hole and is in contact with the hole edge of the connector through hole ;
  • the solder is melted to solder the connectors of the printed wiring board.
  • the metal foil ring is a copper foil ring.
  • the depositing the at least one metal foil ring comprises: depositing at least two oppositely disposed metal foil rings, the two oppositely disposed metal foil rings respectively located on the first surface and the second surface of the printed wiring board And surrounding the corresponding connector through hole and being disposed in contact with the hole edge of the through hole.
  • solder on the surface of the metal foil ring comprises:
  • Solder is formed on a surface of at least one of the metal foil rings on the second surface.
  • the solder is a solder paste.
  • the method of manufacturing further includes melting the solder by a reflow soldering technique to solder the connectors of the printed wiring board.
  • the manufacturing method before the melting the solder, the manufacturing method further includes:
  • At least one surface mount is placed on the first surface of the printed wiring board and the surface mount pins are placed in the solder-printed surface mount pads.
  • the method of manufacturing further includes melting the solder using a reflow soldering technique to solder the connectors and surface mounts of the printed wiring board.
  • the embodiment of the present application further provides a printed circuit board, wherein the printed circuit board is provided with a connector, and the printed circuit board is manufactured by the above manufacturing method.
  • the printed circuit board and the manufacturing method thereof provided by the embodiments of the present application use a method of melting solder to bond the solder to the printed circuit board to realize soldering of the printed circuit board, and the soldering temperature is controllable compared with the related art. There is no need to solder the connectors by wave soldering to avoid the short-circuit between the components due to soldering of the plug components. This technical solution has the advantages of simple soldering process, low manufacturing cost and high yield.
  • FIG. 1 is a flow chart of a method of manufacturing a printed wiring board according to an embodiment of the present application
  • 2A-2D are schematic views showing the manufacture of a printed wiring board according to an embodiment of the present application.
  • FIG. 2B is a cross-sectional view of the printed wiring board shown in FIG. 2A taken along line A-A'.
  • FIG. 1 is a flowchart of a method for manufacturing a printed wiring board according to Embodiment 1 of the present application
  • the technical solution of the present embodiment can be applied to a case of soldering a connector of a printed wiring board.
  • the manufacturing method of the printed wiring board provided in this embodiment includes the following steps.
  • At least one metal foil ring is deposited, wherein the metal foil ring is located on the first surface or the second surface of the printed circuit board and surrounds the corresponding connector through hole and is in contact with the hole edge of the connector through hole .
  • the first surface and the second surface of the printed wiring board are disposed opposite to each other, and the through hole of the connector penetrates through the first surface and the second surface of the printed wiring board.
  • a metal foil ring is deposited at a location of the at least one insert via of the printed wiring board, the metal foil ring being an electrical conductor of the printed wiring board and serving as a partial circuit pattern of the printed wiring board for inserting the connector into the printed circuit board In the circuit of the circuit board.
  • the metal foil ring 201 is located on the first surface 203 of the printed wiring board 202, and the metal foil ring 201 surrounds the corresponding connector through hole 204, and the metal foil ring 201 is also associated with The hole rib 205 of the connector through hole 204 is in contact, whereby the connector (not shown) can be inserted into the circuit of the printed wiring board 202 through the metal foil ring 201 of the first surface 203, and FIG. 2B is along FIG. 2A.
  • the optional metal foil ring 201 is spaced apart from the aperture 205 of the connector through hole 204.
  • the spacing between the metal foil ring and the hole edge of the through hole of the connector should be small, so that the connector and the metal foil can be guided after the solder is melted.
  • the connector is connected to the circuit of the printed circuit board, and is not in the embodiment of the present application. The distance between the metal foil ring and the through hole rib of the connector is limited.
  • the pins of the connector need to be inserted into the through holes of the connector, and the through holes of the connector penetrate through the first surface and the second surface of the printed circuit board, so that it is also possible to deposit metal on the second surface.
  • the foil ring, and the metal foil ring through the second surface inserts the connector into the circuitry of the printed circuit board.
  • At least one metal foil ring is optional on the second surface of the printed circuit board and surrounds the corresponding connector through hole and is disposed in contact with the hole edge of the connector through hole; or, optionally, at least two The metal foil rings are respectively located on the first surface and the second surface of the printed circuit board and surround the corresponding connector through holes and are disposed in contact with the hole edges of the connector through holes.
  • the optional metal foil ring is a copper foil ring.
  • Copper foil is a kind of anionic electrolytic material, usually used as an electrical conductor of a printed wiring board, which is easy to adhere to an insulating layer and can receive a printed protective layer.
  • the advantage of selecting a copper foil here is that the copper foil has low surface oxygen characteristics and can be attached to various substrates such as metals, insulating materials, etc.
  • the copper foil also has a wide temperature range, such as copper foil. When placed on the surface of the substrate and bonded to the metal substrate, the copper foil has excellent electrical conductivity and can provide an electromagnetic shielding effect.
  • solder is formed on the surface of the metal foil ring.
  • Solder is a metal alloy material used to fill welds, weld overlays, and braze joints, including wire, electrode, solder, and solder paste.
  • solder is formed on the surface of the metal foil ring to facilitate subsequent bonding and bonding of the printed wiring board and soldering of the connector, so that solder which can be attached to the surface of the metal foil ring can be selected, in the present embodiment, optional solder It is a solder paste, but in the embodiment of the present application, the solder which can be attached to the surface of the metal foil ring is not limited.
  • Solder paste is a solder material in which electronic components are soldered on a printed wiring board, and is a paste mixture formed by mixing solder powder, flux, and other surfactants, thixotropic agents, etc., but in the embodiment of the present application, tin is not applied.
  • the composition of the cream is limited.
  • solder 207 may be formed on the surface of the metal foil ring 201 as shown in FIG. 2C, so that the connector is soldered into the circuit of the printed wiring board 202 by the solder 207. It is to be noted that the solder 207 is formed.
  • the metal foil ring 201 may be partially covered or entirely covered.
  • At least one of the connectors is mounted on the first surface of the printed wiring board and the pins of the connector are passed through the corresponding connector through holes.
  • the first surface of the optional printed circuit board is the front surface of the printed circuit board, and a plurality of components such as surface mounts and connectors are mounted on the front surface of the printed circuit board.
  • the connector 208 can be mounted on the first surface 203 of the printed circuit board 202 as shown in FIG. 2D and the pins of the connector 208 are passed through the corresponding connector through holes 204, and the plugs are inserted. The pins of the member 208 extend to the printed wiring board 202 The second surface 206.
  • the connector pin is inserted into the through hole of the connector, the periphery of the through hole of the connector is surrounded by a metal foil ring, and the surface of the metal foil ring is formed with solder, and the solder and the printed circuit board are melted. Bonding to achieve the connector of the solder printed circuit board.
  • a reflow soldering technique may be used to melt the solder to solder the printed circuit board connector
  • a reflow soldering method may be used to implement the reflow soldering method.
  • the heating circuit of the reflow soldering device heats the air or nitrogen to a temperature high enough to be blown to the printed circuit board to which the connector has been attached, and the solder on the through hole of the connector melts and bonds with the printed circuit board, thereby inserting The connectors are soldered to the printed circuit board.
  • the method of melting the solder includes, but is not limited to, a reflow soldering technique, and the method of melting the solder is not limited in the embodiment of the present application.
  • the manufacturing method of the printed wiring board provided by the embodiment of the present application first deposits at least one metal foil ring, wherein the metal foil ring is located on the first surface or the second surface of the printed circuit board and surrounds the corresponding through hole of the connector and a hole is formed in contact with the through hole of the connector, a solder is formed on the surface of the metal foil ring, at least one connector is mounted on the first surface of the printed circuit board, and the pin of the connector is passed through the corresponding plug A through hole is formed, and the solder is further melted to solder the connector of the printed wiring board.
  • the method of using molten solder is used to bond the solder to the printed circuit board to realize soldering of the printed circuit board, and the soldering temperature is controllable compared with the related art, and the soldering member is not required to be soldered by the wave soldering method.
  • This technology solution has the advantages of simple welding process, low manufacturing cost and high yield rate, so as to avoid the short-circuit between components due to soldering of the plugged components.
  • optionally depositing at least one metal foil ring comprises: depositing at least two oppositely disposed metal foil rings, and the two oppositely disposed metal foil rings are respectively located on the first surface of the printed circuit board And the second surface and surrounding the corresponding connector through hole and disposed in contact with the hole edge of the through hole.
  • the first surface and the second surface of the printed circuit board are oppositely disposed, and the through hole of the connector penetrates the first surface and the second surface of the printed circuit board, and the first surface of the printed circuit board is generally disposed as a front surface, and is also a connector
  • the top surface of the through hole, the second surface of the printed wiring board is a reverse surface, and is also the bottom surface of the through hole of the connector.
  • a metal foil ring may be respectively deposited on the top surface and the bottom surface of the through hole of the connector, and the metal foil ring on the top surface of the through hole and the through hole of the connector The top holes are in contact with each other to And the metal foil ring on the bottom surface of the through hole is in contact with the bottom hole edge of the through hole of the connector.
  • optionally forming solder on the surface of the metal foil ring comprises: forming solder on a surface of at least one metal foil ring on the first surface; and/or in the second Solder is formed on the surface of at least one of the metal foil rings of the surface.
  • solder is formed on the metal foil ring on the first surface; if the printed wiring board has only at least one metal foil deposited on the second surface a ring, wherein solder is formed on the metal foil ring on the second surface; if at least one metal foil ring is deposited on the first surface and the second surface of the printed wiring board, the solder is formed on the printed circuit board. Solder is formed on the surface of the metal foil ring of the first surface, and then solder is formed on the reverse surface of the printed wiring board, that is, the metal foil ring of the second surface.
  • the manufacturing method of the printed wiring board further comprises: mounting at least one surface mount on the first surface of the printed circuit board and guiding the surface mount The foot is placed in a solder-applied surface mount pad.
  • printed circuit boards typically include surface mounts and connectors, where the optional first surface is the front surface of the printed wiring board, and the surface mount is mounted on the first surface of the printed wiring board.
  • the surface of the first surface of the printed circuit board is further provided with a surface mount member printed with a solder surface mount pad, and the pad is formed at a corresponding position of the circuit pattern of the printed circuit board, and the surface of the surface mount member is placed on the surface of the printed circuit board. On the patch pad.
  • the solder on the surface mount pad can be selected to be the same as the solder formation process on the metal foil ring and the solder having the same solder melting point is the same, the solder on the surface of the printed circuit board is soldered on the solder and the metal foil ring The solder can be melted at the same time, with the advantage of controllable soldering temperature and simple soldering process.
  • a reflow soldering technique may be used to melt the solder to solder the connectors and surface mounts of the printed wiring board.
  • the surface mount is mounted on the first surface of the printed wiring board and its pins are placed on the surface mount pads, and the first surface of the printed wiring board is also provided with a connector and inserted The pins of the connector pass through the connector through holes.
  • the connectors and the surface mounts of the printed wiring board are soldered by means of a reflow soldering apparatus.
  • the heating circuit of the reflow soldering equipment heats the air or nitrogen to a temperature high enough to be blown to the printed circuit board on which the connector and the surface mount have been attached, and the solder on the through hole of the plug is melted and adhered to the printed wiring board.
  • the solder which solders the connector to the printed wiring board and the surface mount pad is melted and bonded to the printed wiring board to solder the surface mount to the printed wiring board.
  • the printed circuit board usually includes surface mounts and plugs. With the connector, the printed circuit board can simultaneously complete the soldering of the connector and the surface mount on the printed circuit board by one reflow soldering technology.
  • the embodiment of the present application further provides a printed circuit board, wherein the printed circuit board is provided with a connector, and the printed circuit board is manufactured by using the printed circuit board manufacturing method as described in any of the above embodiments. .
  • the printed wiring board and the manufacturing method thereof provided by the embodiments of the present application have a simple welding process, a low manufacturing cost, and a high yield.

Abstract

一种印刷线路板及其制造方法，属于印刷线路板技术领域。该制造方法包括：沉积至少一个金属箔环(201)，金属箔环位于印刷线路板的第一表面(203)或第二表面(206)且环绕对应的插接件通孔(204)并与该插接件通孔的孔棱(205)接触设置；在金属箔环的表面上形成焊料(207)；在印刷线路板的第一表面上安装至少一个插接件(208)并将插接件的引脚穿过对应的插接件通孔；以及熔融焊料以焊接印刷线路板的插接件。

Description

印刷线路板及其制造方法
本申请要求在2016年3月30日提交中国专利局、申请号为201610191627.9、发明名称为“一种印刷线路板及其制造方法”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及印刷线路板技术领域，例如涉及一种印刷线路板及其制造方法。
背景技术
相关的印刷线路板(Printed Circuit Board，PCB)上通常贴装有两种元器件，一种为粘贴在PCB表面的表贴件，另一种为引脚需穿过PCB板的插接件。在焊接过程中，通常先采用回流焊法熔融表贴件的锡膏以焊接表贴件，再采用波峰焊法焊接插接件。
波峰焊法焊接插接件时，印刷线路板的待焊接面直接与高温液态锡接触，可能会使插接元器件出现沾锡的现象，导致插接件之间短路。
在实现本申请过程中，发明人发现相关技术中至少存在如下问题：相关PCB板需要两次焊接才能够制造完成，焊接过程繁琐，制造成本较高，而且PCB板容易出现元器件短路的问题，影响PCB板的性能，造成良品率低的问题。
发明内容
本申请实施例提供一种印刷线路板及其制造方法，减少相关技术中PCB板焊接过程繁琐、制造成本高以及良品率低的现象。
第一方面，本申请实施例提供了一种印刷线路板的制造方法，包括：
沉积至少一个金属箔环，其中，所述金属箔环位于所述印刷线路板的第一表面或第二表面且环绕对应的插接件通孔并与该插接件通孔的孔棱接触设置；
在所述金属箔环的表面上形成焊料；
在所述印刷线路板的第一表面上安装至少一个插接件并将所述插接件的引脚穿过对应的插接件通孔；以及
熔融所述焊料以焊接所述印刷线路板的插接件。
可选地，所述金属箔环为铜箔环。
可选地，所述沉积至少一个金属箔环包括：沉积至少两个相对设置的金属箔环，所述两个相对设置的金属箔环分别位于所述印刷线路板的第一表面和第二表面且环绕对应的插接件通孔并与该通孔的孔棱接触设置。
可选地，在所述金属箔环的表面上形成焊料包括：
在位于所述第一表面的至少一个金属箔环的表面上形成焊料；和/或，
在位于所述第二表面的至少一个金属箔环的表面上形成焊料。
可选地，所述焊料为锡膏。
可选地，所述制造方法还包括，采用回流焊技术熔融所述焊料以焊接所述印刷线路板的插接件。
可选地，熔融所述焊料之前，所述制造方法还包括：
在所述印刷线路板的第一表面上贴装至少一个表贴件并将所述表贴件的引脚贴放在印刷有焊料的表贴件焊盘中。
可选地，所述制造方法还包括，采用回流焊技术熔融所述焊料以焊接所述印刷线路板的插接件和表贴件。
第二方面，本申请实施例还提供了一种印刷线路板，该印刷线路板上设置有插接件，该印刷线路板采用上述的制造方法制造。
本申请实施例提供的印刷线路板及其制造方法，采用熔融焊料的方法使焊料与印刷线路板粘结，以实现印刷线路板的插接件焊接，与相关技术相比，焊接温度可控，无需通过波峰焊法焊接插接件，避免出现插接元器件沾锡以致元器件之间短路的情况，该技术方案具有焊接过程简单、制造成本低以及良品率高的优势。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，除非有特别申明，附图中的图不构成比例限制。
图1是本申请实施例提供的印刷线路板的制造方法的流程图；以及
图2A～图2D是本申请实施例提供的印刷线路板的制造示意图；
其中，图2B是图2A所示印刷线路板沿A-A′的剖视图。
具体实施方式
为使本申请的技术方案和优点更加清楚，以下将参照本申请实施例中的附图，通过实施方式清楚、完整地描述本申请的技术方案，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。在不冲突的情况下，本申请实施例中的特征可以任意组合。
如图1所示，为本申请实施例一提供的印刷线路板的制造方法的流程图，本实施例的技术方案可适用于焊接印刷线路板的插接件的情况。
本实施例提供的印刷线路板的制造方法，包括如下步骤。
在S110中，沉积至少一个金属箔环，其中，金属箔环位于印刷线路板的第一表面或第二表面且环绕对应的插接件通孔并与该插接件通孔的孔棱接触设置。
在本实施例中印刷线路板的第一表面和第二表面相对设置，插接件通孔贯穿印刷线路板的第一表面和第二表面。可选在印刷线路板的至少一个插件通孔的位置处沉积金属箔环，该金属箔环是印刷线路板的导电体且作为印刷线路板的局部电路图样，用于将插接件接入印刷线路板的电路中。
可选地，如图2A所示，该金属箔环201位于印刷线路板202的第一表面203，并且该金属箔环201环绕对应的插接件通孔204，以及该金属箔环201还与插接件通孔204的孔棱205接触，由此通过第一表面203的金属箔环201可将插接件(未示出)接入印刷线路板202的电路中，图2B为图2A沿A-A′的剖视图，其中第二表面206与第一表面203相对设置。
需要说明的是，在其他实施例中还可选金属箔环201与插接件通孔204的孔棱205间隔设置。但是本领域技术人员可以理解，基于金属箔环的功能，金属箔环与插接件通孔的孔棱之间的间隔应较小，以便于焊料熔融后可将插接件与金属箔环导通，使得插接件接入印刷线路板的电路中，在本申请实施例中不 对金属箔环与插接件通孔孔棱之间的间隔距离进行限制。
需要说明的是，已知插接件的引脚需要插入插接件通孔中，插接件通孔贯穿印刷线路板的第一表面和第二表面，因此还可选在第二表面沉积金属箔环，以及通过第二表面的金属箔环将插接件接入印刷线路板的电路中。在其他实施例中可选至少一个金属箔环位于印刷线路板的第二表面且环绕对应的插接件通孔并与该插接件通孔的孔棱接触设置；或者，还可选至少两个金属箔环分别位于印刷线路板的第一表面和第二表面且环绕对应的插接件通孔并与该插接件通孔的孔棱接触设置。
示例性的，可选金属箔环为铜箔环。铜箔是一种阴质性电解材料，通常作为印刷线路板的导电体，易于粘合于绝缘层并能够接受印刷保护层。在此选择铜箔的优势在于，铜箔具有低表面氧气特性且可以与各种不同的基材附着，如金属，绝缘材料等；此外铜箔还拥有较宽的温度使用范围，如将铜箔置于衬底面并结合金属基材，则铜箔具有优良的导通性且能够提供电磁屏蔽的效果。
在S120中，在金属箔环的表面上形成焊料。
焊料是用于填加到焊缝、堆焊层和钎缝中的金属合金材料，其形状包括焊丝、焊条、钎料和焊膏等。在本实施例中金属箔环的表面上形成焊料以便于后续熔融与印刷线路板粘结并焊接插接件，因此可选能够附着在金属箔环表面的焊料，在本实施例中可选焊料为锡膏，但在本申请实施例中不对可附着在金属箔环表面上的焊料进行限制。锡膏是电子元器件焊接在印刷线路板上的焊接材料，是由焊锡粉、助焊剂以及其它的表面活性剂、触变剂等混合形成的膏状混合物，但在本申请实施例中不对锡膏的成分进行限制。
本实施例中可选如图2C所示在金属箔环201的表面上形成焊料207，以便于插接件通过焊料207焊接入印刷线路板202的电路中，需要说明的是，形成的焊料207可局部覆盖或全部覆盖金属箔环201。
在S130中，在印刷线路板的第一表面上安装至少一个插接件并将插接件的引脚穿过对应的插接件通孔。
在本实施例中，可选印刷线路板的第一表面为印刷线路板的正表面，表贴件、插接件等多个元器件均贴装在印刷线路板的正表面。本实施例中可选如图2D所示将插接件208安装在印刷线路板202的第一表面203并将插接件208的引脚穿过对应的插接件通孔204，以及插接件208的引脚延伸至印刷线路板202 的第二表面206。
在S140中，熔融焊料以焊接印刷线路板的插接件。
在本实施例中，插接件引脚插入插接件通孔，插接件通孔的外围围绕有金属箔环，金属箔环的表面上形成有焊料，则熔融焊料后焊料与印刷线路板粘结，实现焊接印刷线路板的插接件。
在本实施例中可选采用回流焊技术熔融焊料以焊接印刷线路板的插接件，可选采用回流焊设备实现回流焊接方法。回流焊设备的加热电路将空气或氮气加热到足够高的温度后吹向已经贴好插接件的印刷线路板，插接件通孔上的焊料融化后与印刷线路板粘结，进而将插接件焊接在印刷线路板上。但熔融焊料的方法包括但不限于回流焊技术，在本申请实施例中不对熔融焊料的方法进行限制。
本申请实施例提供的印刷线路板的制造方法，先沉积至少一个金属箔环，其中，金属箔环位于印刷线路板的第一表面或第二表面且环绕对应的插接件通孔并与该插接件通孔的孔棱接触设置，在金属箔环的表面上形成焊料，在印刷线路板的第一表面上安装至少一个插接件并将插接件的引脚穿过对应的插接件通孔，再熔融焊料以焊接印刷线路板的插接件。本实施例中采用熔融焊料的方法使焊料与印刷线路板粘结，以实现印刷线路板的插接件焊接，与相关技术相比，焊接温度可控，无需通过波峰焊法焊接插接件，避免出现插接元器件沾锡以致元器件之间短路的情况，该技术方案具有焊接过程简单、制造成本低以及良品率高的优势。
示例性的，在上述技术方案的基础上，可选沉积至少一个金属箔环包括：沉积至少两个相对设置的金属箔环，两个相对设置的金属箔环分别位于印刷线路板的第一表面和第二表面且环绕对应的插接件通孔并与该通孔的孔棱接触设置。
印刷线路板的第一表面和第二表面相对设置，插接件通孔贯穿印刷线路板的第一表面和第二表面，通常设置印刷线路板的第一表面为正表面，也为插接件通孔的顶面，印刷线路板的第二表面为反表面，也为插接件通孔的底面。在本实施例中，对于至少一个插接件通孔，可选在插接件通孔的顶面和底面分别沉积金属箔环，并且通孔顶面的金属箔环与插接件通孔的顶部孔棱相接触，以 及通孔底面的金属箔环与插接件通孔的底部孔棱相接触。由此可有效的保证插接件能够接入印刷线路板的电路中。
示例性的，在上述技术方案的基础上，可选在金属箔环的表面上形成焊料包括：在位于第一表面的至少一个金属箔环的表面上形成焊料；和/或，在位于第二表面的至少一个金属箔环的表面上形成焊料。
如上所述，若印刷线路板仅第一表面上沉积有至少一个金属箔环，则在位于第一表面的金属箔环上形成焊料；若印刷线路板仅第二表面上沉积有至少一个金属箔环，则在位于第二表面的金属箔环上形成焊料；若印刷线路板的第一表面和第二表面上均沉积有至少一个金属箔环，则形成焊料时可选在印刷线路板的正表面即第一表面的金属箔环上形成焊料，然后再在印刷线路板的反表面即第二表面的金属箔环上形成焊料。
示例性的，在上述技术方案的基础上，可选熔融焊料之前，印刷线路板的制造方法还包括：在印刷线路板的第一表面上贴装至少一个表贴件并将表贴件的引脚贴放在印刷有焊料的表贴件焊盘中。
已知印刷线路板上通常包括表贴件和插接件，在此可选第一表面为印刷线路板的正表面，则将表贴件贴装在印刷线路板的第一表面。印刷线路板的第一表面上还对应表贴件设置有印刷有焊料的表贴件焊盘，该焊盘形成在印刷线路板电路图样的相应位置，则表贴件的引脚贴放在表贴件焊盘上。表贴件焊盘上的焊料可选与金属箔环上的焊料形成过程相同以及可选焊料熔点相同的焊料，则熔融印刷线路板的焊料时表贴件焊盘的焊料和金属箔环上的焊料可同时熔融，具有焊接温度可控以及焊接过程简单的优势。
示例性的，在上述技术方案的基础上，可选采用回流焊技术熔融焊料以焊接印刷线路板的插接件和表贴件。
如上所述，表贴件贴装在印刷线路板的第一表面且其引脚贴放在表贴件焊盘上，以及印刷线路板的第一表面上还贴装有插接件，且插接件的引脚穿过插接件通孔。在此利用回流焊设备对印刷线路板的插接件和表贴件进行焊接。回流焊设备的加热电路将空气或氮气加热到足够高的温度后吹向已经贴好插接件和表贴件的印刷线路板，则插接件通孔上的焊料熔融后与印刷线路板粘结以将插接件焊接在印刷线路板上以及表贴件焊盘上的焊料熔融后与印刷线路板粘结以将表贴件焊接在印刷线路板上。
在此可选采用回流焊技术进行焊接，焊接温度易于控制且焊接过程中还能避免印刷线路板及元器件氧化，制造成本也更容易控制；其次，印刷线路板上通常包括表贴件和插接件，则印刷线路板可通过一次回流焊接技术即可同时完成印刷线路板上的插接件和表贴件的焊接。
在上述技术方案的技术上，本申请实施例还提供一种印刷线路板，该印刷线路板上设置有插接件，该印刷线路板采用如上述任意实施例所述的印刷线路板制造方法制造。
注意，上述仅为本申请的较佳实施例及所运用技术原理。本领域技术人员会理解，本申请不限于这里所述的特定实施例，对本领域技术人员来说能够进行各种明显的变化、重新调整和替代而不会脱离本申请的保护范围。因此，虽然通过以上实施例对本申请进行了较为详细的说明，但是本申请不仅仅限于以上实施例，在不脱离本申请构思的情况下，还可以包括更多其他等效实施例，而本申请的范围由所附的权利要求范围决定。
工业实用性
本申请实施例提供的印刷线路板及其制造方法，焊接过程简单、制造成本低以及良品率高。

Claims (9)

  1. 一种印刷线路板的制造方法，包括：
    沉积至少一个金属箔环，其中，所述金属箔环位于所述印刷线路板的第一表面或第二表面且环绕对应的插接件通孔并与该插接件通孔的孔棱接触设置；
    在所述金属箔环的表面上形成焊料；
    在所述印刷线路板的第一表面上安装至少一个插接件并将所述插接件的引脚穿过对应的插接件通孔；以及
    熔融所述焊料以焊接所述印刷线路板的插接件。
  2. 根据权利要求1所述的制造方法，其中，所述金属箔环为铜箔环。
  3. 根据权利要求1所述的制造方法，其中，所述沉积至少一个金属箔环包括：
    沉积至少两个相对设置的金属箔环，所述两个相对设置的金属箔环分别位于所述印刷线路板的第一表面和第二表面且环绕对应的插接件通孔并与该通孔的孔棱接触设置。
  4. 根据权利要求1所述的制造方法，其中，在所述金属箔环的表面上形成焊料包括：
    在位于所述第一表面的至少一个金属箔环的表面上形成焊料；和/或，
    在位于所述第二表面的至少一个金属箔环的表面上形成焊料。
  5. 根据权利要求1所述的制造方法，其中，所述焊料为锡膏。
  6. 根据权利要求1所述的制造方法，所述制造方法还包括，采用回流焊技术熔融所述焊料以焊接所述印刷线路板的插接件。
  7. 根据权利要求1所述的制造方法，熔融所述焊料之前，所述的制造方法还包括：
    在所述印刷线路板的第一表面上贴装至少一个表贴件并将所述表贴件的引脚贴放在印刷有焊料的表贴件焊盘中。
  8. 根据权利要求7所述的制造方法，所述制造方法还包括，采用回流焊技术熔融所述焊料以焊接所述印刷线路板的插接件和表贴件。
  9. 一种印刷线路板，该印刷线路板上设置有插接件，该印刷线路板采用如 权利要求1-8任一项所述的制造方法制造。
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