WO2019200823A1 - Oled显示面板及其封装方法 - Google Patents

Oled显示面板及其封装方法 Download PDF

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Publication number
WO2019200823A1
WO2019200823A1 PCT/CN2018/105335 CN2018105335W WO2019200823A1 WO 2019200823 A1 WO2019200823 A1 WO 2019200823A1 CN 2018105335 W CN2018105335 W CN 2018105335W WO 2019200823 A1 WO2019200823 A1 WO 2019200823A1
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Prior art keywords
layer
oled
display panel
passivation layer
oled device
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English (en)
French (fr)
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吴叶青
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US16/309,450 priority Critical patent/US11094911B2/en
Publication of WO2019200823A1 publication Critical patent/WO2019200823A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED display panel and a packaging method thereof.
  • OLED Organic Light-Emitting Diode
  • organic electroluminescent display also known as an organic electroluminescent display
  • OLED Organic Light-Emitting Diode
  • High definition and contrast ratio, near 180° viewing angle, wide temperature range, flexible display and large-area full-color display, etc., are recognized by the industry as the most promising display device.
  • the OLED device generally includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a light-emitting layer disposed on the hole transport layer.
  • the principle of illumination of OLED devices is that semiconductor materials and organic luminescent materials are driven by electric fields, causing luminescence by carrier injection and recombination.
  • an OLED device generally uses an indium tin oxide (ITO) pixel electrode and a metal electrode as anodes and cathodes of the device, respectively.
  • ITO indium tin oxide
  • electrons and holes are injected from the cathode and the anode to the electron transport layer and hole transport, respectively.
  • the layers, electrons and holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer, respectively, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation.
  • the OLED device is generally packaged by providing a package cover plate over the OLED device, and a frame sealant is disposed on the package region of the corresponding substrate on the package cover plate, and the substrate is located at the outermost film layer of the package region.
  • a passivation layer the sealant is bonded to the passivation layer to realize encapsulation of the OLED. Since the prior art generally adopts silicon oxide as the passivation layer, the bonding effect of the silicon oxide and the sealant is poor, and the water vapor easily enters into the OLED device, resulting in low performance and poor reliability of the OLED device.
  • An object of the present invention is to provide an OLED display panel.
  • the performance of the OLED device is good, and the OLED device has a long service life and good reliability performance.
  • Another object of the present invention is to provide a method for packaging an OLED display panel, which does not reduce the performance of the OLED device, improves the service life of the OLED device, and has good reliability performance.
  • the present invention provides an OLED display panel, comprising: a substrate, a passivation layer disposed on the substrate, an OLED device disposed on the passivation layer, and disposed on the passivation layer And an adhesive layer on the periphery of the OLED device, a cover plate disposed on the OLED device, and a sealant disposed between the cover plate and the passivation layer and corresponding to the adhesive layer.
  • the material of the passivation layer is silicon oxide.
  • the material of the adhesive layer is an epoxy resin doped with titanium dioxide, calcium oxide and silicon oxide.
  • the substrate includes a display area and a package area surrounding the display area; the OLED device is located in the display area, and the adhesive layer is located in the package area.
  • the passivation layer is provided with a groove corresponding to the periphery of the OLED device, and the adhesive layer is located in the groove.
  • the invention also provides a packaging method for an OLED display panel, comprising the following steps:
  • Step S1 providing a substrate, forming a passivation layer on the substrate, forming an OLED device on the passivation layer;
  • Step S2 forming a ring of adhesive layers on the passivation layer corresponding to the periphery of the OLED device;
  • Step S3 providing a cover plate, applying a ring of sealant on the cover plate corresponding to the position of the adhesive layer;
  • Step S4 the cover plate and the substrate are paired, the frame glue is contacted with the adhesive layer, and the substrate and the cover plate are bonded.
  • the material of the passivation layer is silicon oxide.
  • the material of the adhesive layer is an epoxy resin doped with titanium dioxide, calcium oxide and silicon oxide.
  • the substrate includes a display area and a package area surrounding the display area; the OLED device is located in the display area, and the adhesive layer is located in the package area.
  • the step S1 further includes forming a groove on the periphery of the corresponding OLED device on the passivation layer; the adhesive layer in the step S2 is formed in the groove.
  • the OLED display panel of the present invention adopts an adhesive layer on the passivation layer corresponding to the position of the sealant.
  • the position of the sealant on the cover plate corresponds to the position of the adhesive layer. Bonding, the adhesive layer has good bonding strength with the sealant on the one hand, and also has good bonding force with the passivation layer on the other hand, so that water vapor does not easily enter the OLED device, and the performance of the OLED device is not lowered, and the OLED is improved.
  • the device has a long service life and good reliability.
  • the packaging method of the OLED display panel of the invention can make the water vapor not easily enter the OLED device, does not reduce the performance of the OLED device, improves the service life of the OLED device, and has good reliability performance.
  • FIG. 1 is a schematic structural view of an OLED display panel of the present invention
  • FIG. 2 is a top plan view of a substrate of an OLED display panel of the present invention.
  • FIG. 3 is a top plan view of a cover plate of an OLED display panel of the present invention.
  • FIG. 4 is a flow chart of a method of packaging an OLED display panel of the present invention.
  • the OLED display panel of the present invention includes: a substrate 10 , a passivation layer 11 disposed on the substrate 10 , and an OLED device 20 disposed on the passivation layer 11 .
  • An adhesive layer 111 on the passivation layer 11 and located on the periphery of the OLED device 20, a cover plate 30 disposed on the OLED device 20, and a cover plate 30 and the passivation layer 11 are disposed and correspondingly bonded
  • the sealant 40 of the layer 111 is laminated.
  • an adhesive layer 111 is disposed on the passivation layer 11 corresponding to the sealant 40.
  • the sealant 40 on the cover 30 is corresponding to the position of the adhesive layer 111. Bonding, the adhesive layer 111 has a good bonding force with the sealant 40 on the one hand, and also has a good bonding force with the passivation layer 11 on the other hand, so that moisture does not easily enter the OLED device 20, and the OLED device 20 is not lowered. The performance improves the service life of the OLED device 20 and has good reliability performance.
  • the material of the passivation layer 11 is silicon oxide.
  • the material of the adhesive layer 111 is an epoxy resin doped with titanium dioxide, calcium oxide and silicon oxide, so that the adhesive layer 111 has good mechanical properties and heat and high temperature resistance.
  • the adhesive layer 111 is formed on the passivation layer 11 by high temperature printing or high temperature transfer.
  • the substrate 10 includes a display area 101 and a package area 102 surrounding the display area 101; the OLED device 20 is located in the display area 101, and the adhesive layer 111 is located in the package area 102.
  • the passivation layer 11 is provided with a groove 112 corresponding to the periphery of the OLED device 20, and the adhesive layer 111 is located in the groove 112 to further improve the bonding force of the adhesive layer 111 and the passivation layer 11.
  • the thickness of the adhesive layer 111 is equal to the depth of the groove 112, that is, the upper surface of the adhesive layer 111 is flush with the upper surface of the passivation layer 11, so that the arrangement of the adhesive layer 111 does not increase the OLED display panel. The overall thickness.
  • the OLED display panel further includes a gate metal layer 12, a gate insulating layer 13, an etch barrier layer 14 and source and drain electrodes which are disposed on the substrate 10 and are sequentially stacked between the substrate 10 and the passivation layer 11 .
  • the epitaxial metal layer 15 is in contact with the source/drain metal layer 15 through a via (not shown) penetrating the passivation layer 11.
  • the OLED display panel further includes a thin film encapsulation layer 50 disposed on the substrate 11 and covering the OLED device 20 to further prevent moisture from entering the OLED device 20, thereby improving the service life of the OLED device 20.
  • the thin film encapsulation layer 50 may have a structure in which an inorganic material layer and an organic material layer are stacked on each other, and is preferably a structure in which three layers of an inorganic material layer-an organic material layer-an inorganic material layer are stacked on each other.
  • the inorganic material layer is silicon oxide, silicon nitride or silicon oxynitride; and the organic material layer may be epoxy resin, silicon-based polymer or polymethyl methacrylate.
  • the material of the substrate 10 and the cover plate 30 are both glass or a flexible substrate.
  • the present invention further provides a method for packaging an OLED display panel, comprising the following steps:
  • Step S1 providing a substrate 10, forming a passivation layer 11 on the substrate 10, forming an OLED device 20 on the passivation layer 11;
  • Step S2 forming a ring of adhesive layer 111 on the passivation layer 11 corresponding to the periphery of the OLED device 20;
  • Step S3 providing a cover plate 30, a cover ring 40 on the cover plate 30 corresponding to the position of the adhesive layer 111;
  • Step S4 the cover plate 30 and the substrate 10 are paired, and the sealant 40 is brought into contact with the adhesive layer 111 to bond the substrate 10 and the cover plate 30.
  • an adhesive layer 111 is disposed on the passivation layer 11 corresponding to the sealant 40.
  • the sealant 40 on the cover 30 is corresponding to the position of the adhesive layer 111. Bonding, the adhesive layer 111 has a good bonding force with the sealant 40 on the one hand, and also has a good bonding force with the passivation layer 11 on the other hand, so that moisture does not easily enter the OLED device 20, and the OLED device 20 is not lowered. The performance improves the service life of the OLED device 20 and has good reliability performance.
  • the material of the passivation layer 11 is silicon oxide.
  • the material of the adhesive layer 111 is an epoxy resin doped with titanium dioxide, calcium oxide and silicon oxide, so that the adhesive layer 111 has good mechanical properties and heat and high temperature resistance.
  • the adhesive layer 111 is formed on the passivation layer 11 by high temperature printing or high temperature transfer in the step S2.
  • the substrate 10 includes a display area 101 and a package area 102 surrounding the display area 101; the OLED device 20 is located in the display area 101, and the adhesive layer 111 is located in the package area 102.
  • the step S1 further includes: forming a circle of the groove 112 on the periphery of the corresponding OLED device 20 on the passivation layer 11, so that the adhesive layer 111 in the step S2 is formed in the groove 112 to further improve the adhesion.
  • the thickness of the adhesive layer 111 is equal to the depth of the groove 112, that is, the upper surface of the adhesive layer 111 is flush with the upper surface of the passivation layer 11, so that the arrangement of the adhesive layer 111 does not increase the OLED display panel.
  • the overall thickness is equal to the depth of the groove 112, that is, the upper surface of the adhesive layer 111 is flush with the upper surface of the passivation layer 11, so that the arrangement of the adhesive layer 111 does not increase the OLED display panel.
  • the step S1 further includes: forming a gate metal layer 12, a gate insulating layer 13, an etch barrier layer 14, and a source and drain layer which are sequentially stacked on the substrate 10 and between the substrate 10 and the passivation layer 11.
  • the epitaxial metal layer 15 is in contact with the source/drain metal layer 15 through a via (not shown) penetrating the passivation layer 11.
  • the step S1 further includes forming a thin film encapsulation layer 50 covering the OLED device 20 on the substrate 11, further preventing moisture from entering the OLED device 20, and improving the service life of the OLED device 20.
  • the thin film encapsulation layer 50 may have a structure in which an inorganic material layer and an organic material layer are stacked on each other, and is preferably a structure in which three layers of an inorganic material layer-an organic material layer-an inorganic material layer are stacked on each other.
  • the inorganic material layer is silicon oxide, silicon nitride or silicon oxynitride; and the organic material layer may be epoxy resin, silicon-based polymer or polymethyl methacrylate.
  • the material of the substrate 10 and the cover plate 30 are both glass or a flexible substrate.
  • the OLED display panel of the present invention has an adhesive layer disposed on the passivation layer corresponding to the sealant.
  • the bonding layer has good bonding strength with the sealant on the one hand, and the bonding force with the passivation layer on the other hand, so that the water vapor does not easily enter the OLED device, does not reduce the performance of the OLED device, and improves the OLED device.
  • the service life and reliability are good.
  • the packaging method of the OLED display panel of the invention can make the water vapor not easily enter the OLED device, does not reduce the performance of the OLED device, improves the service life of the OLED device, and has good reliability performance.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种OLED显示面板及其封装方法。该OLED显示面板通过在钝化层（11）上对应框胶（40）的位置设置一层粘合层（111），对OLED（20）进行封装时，将盖板（30）上的框胶（40）对应粘合层（111）的位置进行粘合，该粘合层（111）一方面与框胶（40）的结合力好，另一方面也与钝化层（11）的结合力好，使得水汽不容易进入到OLED器件（20）中，不会降低OLED器件（20）的性能，提高OLED器件（20）的使用寿命，可靠度性能好。

Description

OLED显示面板及其封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED显示面板及其封装方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置，由于其具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展潜力的显示装置。
OLED器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层及设于电子注入层上的阴极。OLED器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED器件通常采用氧化铟锡(ITO)像素电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
现有的OLED显示面板一般通过在OLED器件的上方设置封装盖板以对OLED器件进行封装，封装盖板上对应基板的封装区域设置一圈框胶，基板位于封装区域的最外一层膜层为钝化层，将框胶与钝化层相粘合，从而实现对OLED的封装。由于现有技术通常采用氧化硅作为钝化层，氧化硅与框胶的结合效果差，且水汽容易进入到OLED器件中，导致OLED器件性能低，可靠度性能差。
发明内容
本发明的目的在于提供一种OLED显示面板，OLED器件的性能好，OLED器件的使用寿命长，可靠度性能好。
本发明的目的还在于提供一种OLED显示面板的封装方法，不会降低 OLED器件的性能，提高OLED器件的使用寿命，可靠度性能好。
为实现上述目的，本发明提供了一种OLED显示面板，包括：基板、设于所述基板上的钝化层、设于所述钝化层上的OLED器件、设于所述钝化层上并位于所述OLED器件外围的粘合层、设于所述OLED器件上的盖板以及设于所述盖板与钝化层之间并对应粘合层的框胶。
所述钝化层的材料为氧化硅。
所述粘合层的材料为掺杂钛白粉、氧化钙及氧化硅的环氧树脂。
所述基板包括显示区及包围显示区的封装区；所述OLED器件位于显示区中，所述粘合层位于封装区中。
所述钝化层对应OLED器件外围设有凹槽，所述粘合层位于凹槽中。
本发明还提供一种OLED显示面板的封装方法，包括如下步骤：
步骤S1、提供一基板，在所述基板上形成钝化层，在所述钝化层上形成OLED器件；
步骤S2、在所述钝化层上对应OLED器件的外围形成一圈粘合层；
步骤S3、提供一盖板，在所述盖板上对应粘合层的位置涂布一圈框胶；
步骤S4、将盖板与基板对组，使框胶与粘合层接触，粘合基板与盖板。
所述钝化层的材料为氧化硅。
所述粘合层的材料为掺杂钛白粉、氧化钙及氧化硅的环氧树脂。
所述基板包括显示区及包围显示区的封装区；所述OLED器件位于显示区中，所述粘合层位于封装区中。
所述步骤S1还包括：在所述钝化层上对应OLED器件的外围形成一圈凹槽；步骤S2中的粘合层形成于凹槽中。
本发明的有益效果：本发明的OLED显示面板通过在钝化层上对应框胶的位置设置一层粘合层，对OLED进行封装时，将盖板上的框胶对应粘合层的位置进行粘合，该粘合层一方面与框胶的结合力好，另一方面也与钝化层的结合力好，使得水汽不容易进入到OLED器件中，不会降低OLED器件的性能，提高OLED器件的使用寿命，可靠度性能好。本发明的OLED显示面板的封装方法能够使得水汽不容易进入到OLED器件中，不会降低OLED器件的性能，提高OLED器件的使用寿命，可靠度性能好。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的OLED显示面板的结构示意图；
图2为本发明的OLED显示面板的基板的俯视图；
图3为本发明的OLED显示面板的盖板的俯视图；
图4为本发明的OLED显示面板的封装方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1至图3，本发明的OLED显示面板包括：基板10、设于所述基板10上的钝化层11、设于所述钝化层11上的OLED器件20、设于所述钝化层11上并位于所述OLED器件20外围的粘合层111、设于所述OLED器件20上的盖板30、以及设于所述盖板30与钝化层11之间并对应粘合层111的框胶40。
需要说明的是，本发明在钝化层11上对应框胶40的位置设置一层粘合层111，对OLED进行封装时，将盖板30上的框胶40对应粘合层111的位置进行粘合，该粘合层111一方面与框胶40的结合力好，另一方面也与钝化层11的结合力好，使得水汽不容易进入到OLED器件20中，不会降低OLED器件20的性能，提高OLED器件20的使用寿命，可靠度性能好。
具体地，所述钝化层11的材料为氧化硅。
具体地，所述粘合层111的材料为掺杂钛白粉、氧化钙及氧化硅的环氧树脂，使得粘合层111的机械性能及耐热耐高温性能好。
具体地，通过高温印刷或高温转印在钝化层11上形成粘合层111。
具体地，所述基板10包括显示区101及包围显示区101的封装区102；所述OLED器件20位于显示区101中，所述粘合层111位于封装区102中。
具体地，所述钝化层11对应OLED器件20外围设有凹槽112，所述粘合层111位于凹槽112中，进一步提高粘合层111与钝化层11的结合力。优选地，所述粘合层111的厚度等于凹槽112的深度，即粘合层111上表面与钝化层11的上表面平齐，使得该粘合层111的设置不会增加OLED显示面板的整体厚度。
具体地，所述OLED显示面板还包括设于基板10上并位于基板10与钝化层11之间依次层叠设置的栅极金属层12、栅极绝缘层13、刻蚀阻挡层14及源漏极金属层15，所述OLED器件20通过一贯穿钝化层11的过孔(未图示)与源漏极金属层15接触。
进一步地，所述OLED显示面板还包括设于所述基板11上并覆盖OLED器件20的薄膜封装层50，进一步阻止水汽进入到OLED器件20中，提高OLED器件20的使用寿命。该薄膜封装层50可以为无机材料层与有机材料层相互堆叠的结构，优选为无机材料层-有机材料层-无机材料层的三层相互堆叠的结构。
具体地，所述无机材料层为氧化硅、氮化硅或氮氧化硅；所述有机材料层可以为环氧树脂、硅基聚合物或聚甲基丙烯酸甲酯。具体地，所述基板10与盖板30的材料均为玻璃或柔性衬底。
请参阅图4，基于上述的OLED显示面板，本发明还提供一种OLED显示面板的封装方法，包括如下步骤：
步骤S1、提供一基板10，在所述基板10上形成钝化层11，在所述钝化层11上形成OLED器件20；
步骤S2、在所述钝化层11上对应OLED器件20的外围形成一圈粘合层111；
步骤S3、提供一盖板30，在所述盖板30上对应粘合层111的位置涂布一圈框胶40；
步骤S4、将盖板30与基板10对组，使框胶40与粘合层111接触，粘合基板10与盖板30。
需要说明的是，本发明在钝化层11上对应框胶40的位置设置一层粘合层111，对OLED进行封装时，将盖板30上的框胶40对应粘合层111的位置进行粘合，该粘合层111一方面与框胶40的结合力好，另一方面也与钝化层11的结合力好，使得水汽不容易进入到OLED器件20中，不会降低OLED器件20的性能，提高OLED器件20的使用寿命，可靠度性能好。
具体地，所述钝化层11的材料为氧化硅。
具体地，所述粘合层111的材料为掺杂钛白粉、氧化钙及氧化硅的环氧树脂，使得粘合层111的机械性能及耐热耐高温性能好。
具体地，所述步骤S2中通过高温印刷或高温转印在钝化层11上形成粘合层111。
具体地，所述基板10包括显示区101及包围显示区101的封装区102；所述OLED器件20位于显示区101中，所述粘合层111位于封装区102中。
具体地，所述步骤S1还包括：在所述钝化层11上对应OLED器件20的外围形成一圈凹槽112，使得步骤S2中的粘合层111形成于凹槽112中，进一步提高粘合层111与钝化层11的结合力。优选地，所述粘合层111的厚度等于凹槽112的深度，即粘合层111上表面与钝化层11的上表面平齐， 使得该粘合层111的设置不会增加OLED显示面板的整体厚度。
具体地，所述步骤S1还包括：在基板10上并位于基板10与钝化层11之间形成依次层叠设置的栅极金属层12、栅极绝缘层13、刻蚀阻挡层14及源漏极金属层15，所述OLED器件20通过一贯穿钝化层11的过孔(未图示)与源漏极金属层15接触。
进一步地，所述步骤S1还包括：在所述基板11上形成覆盖OLED器件20的薄膜封装层50，进一步阻止水汽进入到OLED器件20中，提高OLED器件20的使用寿命。该薄膜封装层50可以为无机材料层与有机材料层相互堆叠的结构，优选为无机材料层-有机材料层-无机材料层的三层相互堆叠的结构。
具体地，所述无机材料层为氧化硅、氮化硅或氮氧化硅；所述有机材料层可以为环氧树脂、硅基聚合物或聚甲基丙烯酸甲酯。
具体地，所述基板10与盖板30的材料均为玻璃或柔性衬底。
综上所述，本发明的OLED显示面板通过在钝化层上对应框胶的位置设置一层粘合层，对OLED进行封装时，将盖板上的框胶对应粘合层的位置进行粘合，该粘合层一方面与框胶的结合力好，另一方面也与钝化层的结合力好，使得水汽不容易进入到OLED器件中，不会降低OLED器件的性能，提高OLED器件的使用寿命，可靠度性能好。本发明的OLED显示面板的封装方法能够使得水汽不容易进入到OLED器件中，不会降低OLED器件的性能，提高OLED器件的使用寿命，可靠度性能好。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种OLED显示面板，包括：基板、设于所述基板上的钝化层、设于所述钝化层上的OLED器件、设于所述钝化层上并位于所述OLED器件外围的粘合层、设于所述OLED器件上的盖板以及设于所述盖板与钝化层之间并对应粘合层的框胶。
  2. 如权利要求1所述的OLED显示面板，其中，所述钝化层的材料为氧化硅。
  3. 如权利要求1所述的OLED显示面板，其中，所述粘合层的材料为掺杂钛白粉、氧化钙及氧化硅的环氧树脂。
  4. 如权利要求1所述的OLED显示面板，其中，所述基板包括显示区及包围显示区的封装区；所述OLED器件位于显示区中，所述粘合层位于封装区中。
  5. 如权利要求1所述的OLED显示面板，其中，所述钝化层对应OLED器件外围设有凹槽，所述粘合层位于凹槽中。
  6. 一种OLED显示面板的封装方法，包括如下步骤：
    步骤S1、提供一基板，在所述基板上形成钝化层，在所述钝化层上形成OLED器件；
    步骤S2、在所述钝化层上对应OLED器件的外围形成一圈粘合层；
    步骤S3、提供一盖板，在所述盖板上对应粘合层的位置涂布一圈框胶；
    步骤S4、将盖板与基板对组，使框胶与粘合层接触，粘合基板与盖板。
  7. 如权利要求6所述的OLED显示面板的封装方法，其中，所述钝化层的材料为氧化硅。
  8. 如权利要求6所述的OLED显示面板的封装方法，其中，所述粘合层的材料为掺杂钛白粉、氧化钙及氧化硅的环氧树脂。
  9. 如权利要求6所述的OLED显示面板的封装方法，其中，所述基板包括显示区及包围显示区的封装区；所述OLED器件位于显示区中，所述粘合层位于封装区中。
  10. 如权利要求6所述的OLED显示面板的封装方法，其中，所述步骤S1还包括：在所述钝化层上对应OLED器件的外围形成一圈凹槽；步骤S2中的粘合层形成于凹槽中。
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