CN107799664B - 一种封装胶、封装结构及涂胶装置 - Google Patents
一种封装胶、封装结构及涂胶装置 Download PDFInfo
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Abstract
本发明实施例提供一种封装胶、封装结构及涂胶装置,涉及显示技术领域,解决了现有技术中将干燥剂放置在围堰胶上导致的盖板和基板边缘容易剥离的问题、放置在围堰胶围成的区域内导致的扩大非显示区域范围的问题以及将干燥剂分散在填充胶内影响OLED器件性能的问题。该封装胶包括第一胶体层和包裹所述第一胶体层的第二胶体层;所述第一胶体层包括胶体和分散在所述胶体中的干燥剂。用于进行封装。
Description
技术领域
本发明涉及显示技术领域,尤其涉及一种封装胶、封装结构及涂胶装置。
背景技术
有机电致发光二极管(Organic Light-Emitting Diode,简称OLED)是近年来逐渐发展起来的显示照明技术,尤其是在显示行业,由于其具有高响应、高对比度、可柔性化等优点,被认为具有广泛的应用前景。但是,由于OLED器件在水汽和氧气的作用下会出现腐蚀损坏的现象,因此选择较好的封装方式对OLED器件来说尤为重要。
目前,常用的OLED封装方法包括片胶封装、玻璃胶封装(即Frit封装)、围堰胶和填充胶封装(即Dam和Fill封装)等。其中,Dam和Fill封装方法具体是如图1(a)所示,在盖板10边缘涂覆一圈围堰胶(Dam胶)30,然后在围堰胶30围成的区域内涂布填充胶(Fill胶)40,在压合后使填充胶40充分的涂布在OLED区域上,达到封装的目的。
为了增强封装效果,通常在Dam和Fill结构中加入干燥剂,吸附进入胶材的水分,以达到延长器件使用寿命的目的,但是,目前干燥剂放置的位置却造成了一些副作用。如图1(a)所示,若将干燥剂50设置在围堰胶30上,由于干燥剂50与围堰胶30分次制作,这样干燥剂50占用了围堰胶30与盖板10的粘合空间,减弱了粘合性,因而盖板10和基板20容易在边缘产生剥离;如图1(b)所示,若将干燥剂50设置在围堰胶30围成的区域内,由于干燥剂50的透明度较差,因而会扩大非显示区域的范围,不利于实现窄边框;如图1(c)所示,若将干燥剂50分散在填充胶40内,则容易在OLED器件表面成为杂质颗粒,且干燥剂50在吸收水氧后会放热,此外干燥剂50本身材质多为碱金属及其氧化物,也会对OLED的顶部电极进行腐蚀。
发明内容
本发明的实施例提供一种封装胶、封装结构及涂胶装置,解决了现有技术中将干燥剂放置在围堰胶上导致的盖板和基板边缘容易剥离的问题、放置在围堰胶围成的区域内导致的扩大非显示区域范围的问题以及将干燥剂分散在填充胶内影响OLED器件性能的问题。
为达到上述目的,本发明的实施例采用如下技术方案:
第一方面,提供一种封装胶,所述封装胶包括第一胶体层和包裹所述第一胶体层的第二胶体层;所述第一胶体层包括胶体和分散在所述胶体中的干燥剂。
优选的,所述干燥剂的材料包括金属或金属氧化物中的至少一种。
优选的,所述第一胶体层中胶体的粘稠度为5000~100000mPa·s;所述第二胶体层的胶体粘稠度为100000~400000mPa·s。
第二方面,提供一种封装结构,包括:设置在盖板边缘的一圈封装胶和填充在所述封装胶所围成区域内的填充胶;其中,所述封装胶为上述的封装胶。
优选的,所述封装胶的粘稠度大于所述填充胶的粘稠度。
第三方面,提供一种涂胶装置,包括:胶管和与所述胶管相连的胶头;所述胶管包括第一胶管和第二胶管;所述胶头包括第一通道和第二通道,所述第一通道设置于所述第二通道内,所述第一胶管与所述第一通道相连通,所述第二胶管与所述第一通道和所述第二通道之间形成的环形空隙相连通。
优选的,所述涂胶装置还包括设置在所述第一胶管内的第一挤压装置和设置在所述第二胶管内的第二挤压装置;所述第一挤压装置用于挤压所述第一胶管内放置的胶体,所述第二挤压装置用于挤压所述第二胶管内放置的胶体。
优选的,所述第一胶管内放置第一胶体,所述第二胶管内放置第二胶体;所述第一胶体包括胶体和分散在所述胶体中的干燥剂。
优选的,所述第一通道的长度与所述第二通道的长度差为0.1~1mm。
优选的,所述第一通道的出胶口和所述第二通道的出胶口为喇叭状。
本发明实施例提供一种封装胶、封装结构及涂胶装置,由于封装胶的第一胶体层包括干燥剂,因而干燥剂可以吸附进入封装胶的水分。此外,由于本发明实施例的第一胶体层外包覆有第二胶体层,因而封装胶在封装时,第二胶体层可以和待封装基板充分接触,以进行封装。当封装胶涂布在盖板的边缘充当围堰胶时,由于干燥剂被第二胶体层包裹在内,因而不会占用围堰胶和盖板的粘合空间,相对于现有技术,避免了干燥剂设置在围堰胶上使得围堰胶和盖板的粘合性减弱导致的盖板和基板容易在边缘产生剥离的问题,且干燥剂形成在围堰胶(封装胶涂布在盖板的边缘充当围堰胶)内,相对于将干燥剂设置在围堰胶围成的区域内,因而不会扩大非显示区域的范围,有利于实现窄边框,此外,干燥剂形成在围堰胶内,相对于将干燥剂分散在Fill胶内,因而不会影响OLED器件的性能。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1(a)为现有技术提供的一种利用围堰胶和填充胶封装时干燥剂的设置位置的结构示意图一;
图1(b)为现有技术提供的一种利用围堰胶和填充胶封装时干燥剂的设置位置的结构示意图二;
图1(c)为现有技术提供的一种利用围堰胶和填充胶封装时干燥剂的设置位置的结构示意图三;
图2为本发明实施例提供的一种封装胶的结构示意图;
图3为本发明实施例提供的一种封装结构的结构示意图;
图4为本发明实施例提供的一种在盖板上涂布封装胶和填充胶的结构示意图;
图5为本发明实施例提供的一种涂胶装置的剖视结构示意图一;
图6为本发明实施例提供的一种涂胶装置的剖视结构示意图二;
图7为本发明实施例提供的一种涂胶装置的胶头的剖视结构示意图一;
图8为本发明实施例提供的一种涂胶装置的胶头的剖视结构示意图二。
附图标记:
10-盖板;20-基板;30-围堰胶;40-填充胶;50、604-干燥剂;60-封装胶;601-第一胶体层;602-第二胶体层;603-胶体;70-胶管;701-第一胶管;702-第二胶管;80-胶头;801-第一通道;802-第二通道;90-固定装置;101-第一挤压装置;102-第二挤压装置。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明实施例提供一种封装胶60,如图2所示,包括第一胶体层601和包裹第一胶体层601的第二胶体层602;第一胶体层601包括胶体603和分散在胶体603中的干燥剂604。
需要说明的是,第一,对于第一胶体层601中胶体603的成分和第二胶体层602的胶体成分不进行限定,第一胶体层601的胶体603的成分和第二胶体层602的胶体成分可以相同,也可以不相同,对此不进行限定。
封装胶60包括第一胶体层601和包裹第一胶体层601的第二胶体层602,由于封装胶60在封装时主要依赖第二胶体层602进行封装,而第一胶体层601中胶体603的作用主要是为了分散干燥剂604,因此优选的第二胶体层602的胶体粘性大于第一胶体层601的胶体603的粘性,即第二胶体层602的胶体粘稠度大于第一胶体层601中胶体603的粘稠度。本发明实施例优选的,第一胶体层601中胶体603的粘稠度为5000~100000mPa·s,第二胶体层602的胶体粘稠度为100000~400000mPa·s。
第二,第一胶体层601的胶体603的成分例如可以为环氧树脂、乙烯醇或丙烯醇共聚物等形成的膏状体或胶状体。第二胶体层602的胶体成分例如可以为环氧树脂、丙烯酸环氧丙酯、甲基丙烯酸环氧丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基聚丙烯酸6,7-环氧庚酯、甲基丙烯酸-2-羟基乙酯等单体的均聚物或共聚物、三聚氰胺甲醛树脂、不饱和聚酯树脂、有机硅树脂、呋喃树脂等。
第三,对于第一胶体层601中干燥剂604的材料不进行限定,例如可以是金属或金属氧化物中的至少一种。具体的,例如可以是Ca(钙)、Mg(镁)、Ba(钡)等金属及其氧化物。
此外,对于分散在胶体603中的干燥剂604的颗粒的大小不进行限定,优选的,干燥剂604的粒径大小在10nm~1000nm之间。
第四,封装胶60可以涂布在待封装基板的边缘,也可以在待封装基板的整个面上都进行涂布,对此不进行限定,可以根据实际需要进行相应涂布。
本发明实施例提供一种封装胶60,由于封装胶60的第一胶体层601包括干燥剂604,因而干燥剂604可以吸附进入封装胶60的水分。此外,由于本发明实施例的第一胶体层601外包覆有第二胶体层602,因而封装胶60在封装时,第二胶体层602可以和待封装基板充分接触,以进行封装。当封装胶60涂布在盖板10的边缘充当围堰胶30时,由于干燥剂604被第二胶体层602包裹在内,因而不会占用围堰胶30和盖板10的粘合空间,相对于现有技术,避免了干燥剂604设置在围堰胶30上使得围堰胶30和盖板10的粘合性减弱导致的盖板10和基板20容易在边缘产生剥离的问题,且干燥剂604形成在围堰胶30(封装胶60涂布在盖板10的边缘充当围堰胶30)内,相对于将干燥剂604设置在围堰胶30围成的区域内,因而不会扩大非显示区域的范围,有利于实现窄边框,此外,干燥剂604形成在围堰胶30内,相对于将干燥剂604分散在填充胶40内,因而不会影响OLED器件的性能。
本发明实施例提供一种封装结构,如图3所示,包括:设置在盖板10边缘的一圈封装胶60和填充在封装胶60所围成区域内的填充胶40;其中,封装胶60为上述的封装胶60。
其中,封装胶60设置在盖板10边缘的一圈,此时封装胶60相当于现有技术中的围堰胶30。
此处,对于填充胶40的材料成分不进行限定,例如可以为环氧树脂、丙烯酸环氧丙酯、甲基丙烯酸环氧丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基聚丙烯酸6,7-环氧庚酯、甲基丙烯酸-2-羟基乙酯等单体的均聚物或共聚物、三聚氰胺甲醛树脂、不饱和聚酯树脂、有机硅树脂、呋喃树脂等。此外,填充胶40和封装胶60的第二胶体层602的胶体成分可以相同,也可以不相同。在此基础上,本发明实施例优选填充胶40和封装胶60为紫外固化型树脂胶或热固化型树脂胶。
在此基础上,对于封装胶60涂布的厚度不进行限定,优选的,封装胶60的涂布厚度为10μm~100μm。由于填充胶40填充在封装胶60所围成的区域内,因而涂布的填充胶40厚度应小于涂布的封装胶60的厚度。
此外,对于盖板10的材料不进行限定,例如可以为玻璃、石英、塑料或金属等。
需要说明的是,封装结构可用于封装任意的基板20,此时基板20可以为OLED基板,当基板20为OLED基板时,基板20包括衬底基板以及设置在衬底基板上的阳极、发光功能层以及阴极。衬底基板的材料例如可以为玻璃、石英、塑料或金属等。当封装结构用于封装基板20时,具体的,可以如图4所示,先在盖板10的边缘涂布一圈上述的封装胶60,再在封装胶60围成的区域内涂布填充胶40,之后如图3所示将基板20和涂布有封装胶60和填充胶40的盖板10进行压合,最后固化封装胶60和填充胶40,完成封装。
本发明实施例提供一种封装结构,封装结构的封装胶60即围堰胶包括第一胶体层601和包裹第一胶体层601的第二胶体层602,第一胶体层601包括胶体603和分散在胶体603中的干燥剂604,由于干燥剂604被第二胶体层602包裹在内,因而不会占用围堰胶30和盖板10的粘合空间,相对于现有技术,避免了干燥剂604设置在围堰胶30上使得围堰胶30和盖板10的粘合性减弱导致的盖板10和基板20容易在边缘产生剥离的问题;且干燥剂604形成在围堰胶30(封装胶60涂布在盖板10的边缘充当围堰胶30)内,相对于将干燥剂604设置在围堰胶30围成的区域内,因而不会扩大非显示区域的范围,有利于实现窄边框,且干燥剂604靠近盖板10边缘,在水氧入侵围堰胶30后可及时吸收,防止水氧进一步向基板20内入侵,提高了封装胶60、填充胶40与盖板10的粘结性能和封装性能;此外,干燥剂604形成在围堰胶30内,相对于将干燥剂604分散在填充胶40内,因而不会影响OLED器件的性能。
基于上述,由于围堰胶30(封装胶60涂布在盖板10的边缘,封装胶60相当于围堰胶30)主要是用于起密封作用,将盖板10和基板20粘合在一起,而填充胶40主要是用于维持盒厚,因而本发明实施例优选的,封装胶60的粘稠度大于填充胶40的粘稠度。
在此基础上,本发明实施例优选的,封装胶60的第二胶体层602的胶体粘稠度为100000~400000mPa·s,填充胶40的胶体粘稠度为100~2000mPa·s。
本发明实施例提供一种涂胶装置,如图5所示,包括:胶管70和与胶管70相连的胶头80;胶管70包括第一胶管701和第二胶管702;胶头80包括第一通道801和第二通道802,第一通道801设置于第二通道802内,第一胶管701与第一通道801相连通,第二胶管702与第一通道801和第二通道802之间形成的环形空隙相连通。
需要说明的是,第一胶管701与第一通道801相连通,因而第一胶管701内放置的胶体可以通过第一通道801被挤出,第二胶管702与第一通道801和第二通道802之间形成的环形空隙相连通,因而第二胶管702内放置的胶体可以通过第一通道801和第二通道802之间形成的环形空隙被挤出。由于第一通道801设置于第二通道802内,当第一胶管701内的胶体和第二胶管702内的胶体被同步挤压时,从第一通道801挤出的胶体被从第一通道801和第二通道802之间形成的环形空隙挤出的胶体包裹,形成夹心结构胶材。
其中,对于第一胶管701内放置的胶体的成分和第二胶管702内放置的胶体的成分不进行限定,第一胶管701内放置的胶体的成分和第二胶管702内放置的胶体的成分可以相同,也可以不相同。当第一胶管701内放置的胶体的成分和第二胶管702内放置的胶体的成分不相同,若第一胶管701内放置第一胶体,第二胶管702内放置第二胶体,则从该涂胶装置挤出的胶体为夹心结构,第二胶体包裹第一胶体。
基于此,当第一胶管701内放置上述的封装胶60中用于形成第一胶体层601的材料,即放置胶体603和分散在胶体603中的干燥剂604,第二胶管702内放置上述的封装胶60中用于形成第二胶体层602的材料时,则利用该涂胶装置涂布出的胶体即为上述的封装胶60,第二胶体层602包裹第一胶体层601,第一胶体层601包括胶体603和分散在胶体603中的干燥剂604。
此处,涂胶装置除包括胶管70和胶头80外,还可以如图5所示,包括固定装置90。
本发明实施例提供一种涂胶装置,由于涂胶装置包括胶管70和胶头80,胶管70包括第一胶管701和第二胶管702;胶头80包括第一通道801和第二通道802,第一通道801设置于第二通道802内,第一胶管701与第一通道801相连通,第二胶管702与第一通道801和第二通道802之间形成的环形空隙相连通,因而当第一胶管701内和第二胶管702内放置的胶体不相同时,从该涂胶装置涂布出的胶体为夹心结构。
在此基础上,当第一胶管701内放置上述封装胶60中的用于形成第一胶体层601的材料,第二胶管702内放置用于形成第二胶体层602的材料时,因而可以利用该涂胶装置涂布出上述的封装胶60。
优选的,如图6所示,涂胶装置还包括设置在第一胶管701内的第一挤压装置101和设置在第二胶管702内的第二挤压装置102;第一挤压装置101用于挤压第一胶管701内放置的胶体,第二挤压装置102用于挤压第二胶管702内放置的胶体。
其中,对于第一挤压装置101和第二挤压装置102的结构不进行限定,以能够挤压第一胶管701内和第二胶管702内放置的胶体为准。此处,第一挤压装置101和第二挤压装置102可以是以气压的方式进行挤压,也可以是以机械挤压的方式进行挤压,当然还可以是以其它的方式进行挤压,对此不进行限定。
本发明实施例,由于涂胶装置还包括第一挤压装置101和第二挤压装置102,因而可以利用第一挤压装置101和第二挤压装置102分别对第一胶管701内放置的胶体和第二胶管702内放置的胶体进行挤压,以使涂胶装置可以快速出胶,提高了涂胶装置的涂胶效率。
由于第一通道801设置于第二通道802内,为了防止从第二通道802挤出的胶体堵塞住第一通道801的出胶口,因而本发明实施例提供以下两种优选方案。
第一种,如图7所示,第一通道801的长度大于第二通道802的长度。
此处,对于第一通道801的长度与第二通道802的长度的差值不进行限定,若第一通道801的长度与第二通道802的长度的差值太小,则从第二通道802挤出的胶体可能还会堵塞住第一通道801的出胶口;若第一通道801的长度与第二通道802的长度的差值太大,则从该涂胶装置挤出的胶体不能形成夹心结构。基于此,本发明实施例优选,第一通道801的长度和第二通道802的长度差为0.1~1mm。
第二种,如图8所示,第一通道801的出胶口和第二通道802的出胶口为喇叭状。
此处,喇叭状即指出胶口中靠近胶管的一端的内径小于远离胶管的一端的内径。
其中,当第一通道801的出胶口和第二通道802的出胶口为喇叭状时,对于喇叭状的出胶口的大小不进行限定,可以根据需要进行相应设置。
本发明实施例,当第一通道801的长度大于第二通道802的长度,或者,第一通道801的出胶口和第二通道802的出胶口为喇叭状时,可以防止从第二通道802挤出的胶体堵塞住第一通道801的出胶口,提高涂胶装置的性能。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。
Claims (8)
1.一种封装胶,其特征在于,所述封装胶包括第一胶体层和包裹所述第一胶体层的第二胶体层;
所述第一胶体层包括胶体和分散在所述胶体中的干燥剂;
所述第一胶体层中胶体的粘稠度为5000~100000mPa·s;所述第二胶体层的胶体粘稠度为100000~400000 mPa·s;
所述第一胶体层的胶体的成分包括环氧树脂、乙烯醇共聚物或丙烯醇共聚物;
所述第二胶体层的胶体成分包括丙烯酸环氧丙酯、甲基丙烯酸环氧丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基聚丙烯酸6,7-环氧庚酯、甲基丙烯酸-2-羟基乙酯单体的均聚物或共聚物,或环氧树脂、三聚氰胺甲醛树脂、不饱和聚酯树脂、有机硅树脂、呋喃树脂;
所述干燥剂的材料包括金属或金属氧化物中的至少一种。
2.一种封装结构,其特征在于,包括:设置在盖板边缘的一圈封装胶和填充在所述封装胶所围成区域内的填充胶;
其中,所述封装胶为权利要求1所述的封装胶。
3.根据权利要求2所述的封装结构,其特征在于,所述封装胶的粘稠度大于所述填充胶的粘稠度。
4.一种涂胶装置,用于涂布权利要求1所述的封装胶,其特征在于,包括:胶管和与所述胶管相连的胶头;
所述胶管包括第一胶管和第二胶管;
所述胶头包括第一通道和第二通道,所述第一通道设置于所述第二 通道内,所述第一胶管与所述第一通道相连通,所述第二胶管与所述第一通道和所述第二通道之间形成的环形空隙相连通。
5.根据权利要求4所述的涂胶装置,其特征在于,所述涂胶装置还包括设置在所述第一胶管内的第一挤压装置和设置在所述第二胶管内的第二挤压装置;
所述第一挤压装置用于挤压所述第一胶管内放置的胶体,所述第二挤压装置用于挤压所述第二胶管内放置的胶体。
6.根据权利要求4所述的涂胶装置,其特征在于,所述第一胶管内放置第一胶体,所述第二胶管内放置第二胶体;
所述第一胶体包括胶体和分散在所述胶体中的干燥剂。
7.根据权利要求4所述的涂胶装置,其特征在于,所述第一通道的长度与所述第二通道的长度差为0.1~1mm。
8.根据权利要求4所述的涂胶装置,其特征在于,所述第一通道的出胶口和所述第二通道的出胶口为喇叭状。
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