WO2020248933A1 - 显示面板、封装装置、封装方法及显示装置 - Google Patents

显示面板、封装装置、封装方法及显示装置 Download PDF

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Publication number
WO2020248933A1
WO2020248933A1 PCT/CN2020/094900 CN2020094900W WO2020248933A1 WO 2020248933 A1 WO2020248933 A1 WO 2020248933A1 CN 2020094900 W CN2020094900 W CN 2020094900W WO 2020248933 A1 WO2020248933 A1 WO 2020248933A1
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WIPO (PCT)
Prior art keywords
packaging
display panel
cover plate
plate
encapsulation
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PCT/CN2020/094900
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English (en)
French (fr)
Inventor
罗程远
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/280,872 priority Critical patent/US20210408447A1/en
Publication of WO2020248933A1 publication Critical patent/WO2020248933A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the technical field of display panels, and in particular to a display panel, a packaging device and a packaging method.
  • AMOLEDs Active matrix organic light-emitting diodes
  • An embodiment of the present disclosure provides a display panel including: a panel main body;
  • the packaging layer is located on the surface of the panel body
  • the cover plate is located on the surface of the packaging glue layer away from the panel body, wherein
  • the encapsulation layer encapsulation includes an encapsulation glue layer and hydrophobic fibers, the encapsulation glue layer encapsulates the panel main body and the cover plate, and the hydrophobic fibers are located on the peripheral sides of the encapsulation glue layer.
  • the hydrophobic fibers are fluffy and densely arranged on the peripheral sides of the encapsulating glue layer.
  • the encapsulating glue layer includes a encapsulating glue frame and a filling glue
  • the encapsulating glue frame is located at a predetermined distance from the edge of the cover plate, and the encapsulating glue frame surrounds the cover plate. Describing the locating space, the filler is located in the accommodating space, and wherein the hydrophobic fiber is located on the peripheral surface of the packaging plastic frame away from the filler.
  • the hydrophobic fibers are arranged on the peripheral side of the encapsulating adhesive layer in an array of multiple rows and multiple columns.
  • the hydrophobic fibers have a length of 1 ⁇ m to 5 ⁇ m and a diameter of 10 nm to 100 nm.
  • the hydrophobic fiber is composed of a first material and a second material, wherein the first material is any one of SiO2, TiO2, ZnO, and ZnS, and the second material is polystyrene or polypropylene One or two of nitriles.
  • the display panel is an OLED display panel.
  • An embodiment of the present disclosure provides a packaging device for forming the hydrophobic fiber of the aforementioned display panel, the packaging device comprising:
  • a plurality of mutually spliced pressing molds wrap around the packaging adhesive layer, each of the pressing molds has a preset area on the side close to the packaging adhesive layer, and a plurality of the pressing molds After the molds are spliced together, the predetermined area faces the encapsulating glue layer, and the predetermined area is preformed with hydrophobic fibers.
  • each of the pressing molds includes: a plate-shaped body, the plate-shaped body includes a first surface and a second surface that are opposite to each other, and also includes a first surface and a second surface.
  • the third surface is the preset area, the first surface is used to press the surface of the panel body close to the cover plate, and the second surface is used to The surface of the cover plate close to the panel main body is pressed together, and the third surface is close to the encapsulation adhesive layer.
  • each of the pressing molds further includes: a plate-shaped base body connected to the surface of the plate-shaped main body away from the third surface and perpendicular to the plate-shaped main body, the plate-shaped main body A convex structure is formed on the base, and the plate-shaped body separates the surface connecting the plate-shaped base and the plate-shaped body into a first limiting surface and a second limiting surface.
  • the position surface is adjacent to the first surface of the plate-shaped body
  • the second limit surface is adjacent to the second surface of the plate-shaped body
  • the first limit surface is used to face the side surface of the panel body. Fitting, the second limit surface is used to fit the side surface of the cover plate.
  • An embodiment of the present disclosure provides an encapsulation method for encapsulating the aforementioned display panel.
  • the encapsulation method includes: forming hydrophobic fibers in a predetermined area of each pressing mold; forming an encapsulation adhesive layer on a cover plate; Each pressing mold is spliced and installed on the edge of the cover plate so that the preset area of each pressing mold is directly facing the peripheral side of the packaging adhesive layer; the panel body and the cover plate are pressed together so that the packaging adhesive layer spreads to The hydrophobic fibers, and the hydrophobic fibers in the preset regions of each pressing mold are transferred to the peripheral sides of the encapsulating glue layer.
  • An embodiment of the present disclosure provides a display device including the aforementioned display panel.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the disclosure
  • FIG. 2 is a schematic structural diagram of a display panel and packaging device provided by an embodiment of the disclosure
  • FIG. 3 is a schematic diagram of another structure of a display panel and packaging device provided by an embodiment of the disclosure.
  • FIG. 4 is a schematic diagram of another structure of a display panel and packaging device provided by an embodiment of the disclosure.
  • FIG. 5 is a schematic diagram of still another structure of a display panel and packaging device provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic structural diagram of a packaging device provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic flowchart of a packaging method provided by an embodiment of the disclosure.
  • 11-panel body 111-substrate, 112-functional layer, 12-encapsulation layer, 121-encapsulation frame, 122-filler, 13-cover, 14-hydrophobic fiber, 21-compression mold, 211-board Shaped body, 212-matrix.
  • OLED devices are easily corroded by water vapor and oxygen, and organic materials and metal electrodes are very easy to react with water and oxygen, causing the device to fail. Therefore, it is necessary to package the device to extend the service life.
  • Encapsulating OLED devices with resin-based adhesives is a traditional packaging method. It not only has the advantages of simple manufacturing process and better packaging effect, but also has low stress after curing, which can avoid cracks and can be applied to large-size devices The production.
  • the barrier effect of resin glue on water vapor is not ideal. Water vapor can still enter the inside of the display panel from the side of the display panel, causing damage to the OLED device. Therefore, how to improve the sealing effect of the display panel is an urgent technology for those skilled in the art. problem.
  • an embodiment of the present disclosure provides a display panel.
  • the display panel includes: a panel main body 11 on which an encapsulation adhesive layer 12 and a cover 13 are sequentially stacked and arranged around the encapsulation adhesive layer.
  • a layer of hydrophobic fibers 14 is provided on a week of 12.
  • the panel body 11 is a multilayer structure on which OLED devices are arranged. If they are not encapsulated, the OLED devices in the panel body 11 will come into contact with water vapor and oxygen in the air, causing damage to the OLED devices.
  • a cover 13 is usually provided on the panel main body 11, and the two are bonded through an encapsulating adhesive layer 12 to encapsulate the panel main body 11.
  • the cover plate 13 may be a glass cover plate 13, which can prevent water vapor from entering the panel body 11 from the front of the panel body 11 (ie, the surface of the glass cover plate away from the panel body 11 in FIG. 1).
  • the encapsulating adhesive layer 12 between the cover plates 13 can not only bond the panel body 11 and the cover plate 13 together, but also encapsulate the peripheral sides of the panel body 11 to prevent water vapor from entering the panel body 11 from the side of the panel body 11 Inside.
  • the main component of the encapsulant layer 12 is epoxy resin, including glycidyl acrylate, glycidyl methacrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, and meth polyacrylic acid.
  • 6,7-Epoxyheptyl ester, 2-hydroxyethyl methacrylate and other monomer homopolymers or copolymers, melamine formaldehyde resin, unsaturated polyester resin, silicone resin, furan resin and other additives, can be It is cured by ultraviolet radiation and heating.
  • the encapsulant layer 12 has the effect of blocking water vapor, its sealing effect on the display panel is not ideal.
  • hydrophobic fibers 14 are provided on the peripheral sides of the encapsulant layer 12 away from the OLED device. 11 is attached to the peripheral surface that is not attached to the cover plate 13, as shown in Figure 1, the surface of the encapsulation layer 12 away from the panel body is in contact with the cover plate 13, and the surface of the encapsulation layer 12 away from the cover plate 13 It is in contact with the panel body 11.
  • the hydrophobic fiber 14 wraps around the encapsulating adhesive layer 12, that is, a layer of hydrophobic fibers 14 is provided on the outer periphery of the encapsulating adhesive layer 12, and the hydrophobic fibers 14 and the encapsulating adhesive layer 12 form an encapsulating layer for encapsulating the display panel. Utilizing the hydrophobicity of the hydrophobic fibers 14 can prevent water vapor from staying on the side of the encapsulation adhesive layer 12, reduce the probability of water vapor permeating from the encapsulation adhesive layer 12 into the display panel, and enhance the packaging effect.
  • the hydrophobic fibers 14 are fluffy and densely arranged on the peripheral sides of the packaging glue layer 12 to form a layer of hydrophobic fibers 14 around the circumference of the packaging glue layer 12.
  • Numerous fluff-like hydrophobic fibers 14 are arranged on the peripheral sides of the encapsulating adhesive layer 12, and the hydrophobic fluff can be transferred from the mold to the peripheral sides of the encapsulating adhesive layer 12 through a mold.
  • the hydrophobic fiber 14 can be made using a lateral film forming process.
  • a ring of encapsulating plastic frame 121 is set at a preset distance from the peripheral edge of the cover plate 13.
  • the encapsulating plastic frame 121 encloses an accommodating space on the cover plate 13.
  • a filler 122 is arranged inside, the hydrophobic fibers 14 are arranged on the peripheral side of the packaging plastic frame 121 away from the filler 122, and the hydrophobic fibers 14 are arranged around the packaging plastic frame 121.
  • the materials of the filler 122 and the encapsulation frame 121 have been mentioned above, and will not be repeated here.
  • the filler 122 and the encapsulation frame 121 are made of the same material, and the encapsulation frame 121 can be adjusted by adjusting the ratio of each added material. And the viscosity of the filler 122, where the viscosity of the plastic material forming the encapsulation frame 121 is between 100000-400000 mPa ⁇ s; the viscosity of the filler 122 is between 100-2000 mPa ⁇ s, and the viscosity of the encapsulation frame 121 is greater In order to ensure the tightness between the cover plate 13 and the panel body 11, the fluidity is poor, while the filler 122 has a low viscosity and strong fluidity.
  • the filling The glue 122 can spread evenly in the accommodating space, thereby forming a layer of filler 122 with uniform thickness.
  • the encapsulating plastic frame 121 there is a preset distance between the encapsulating plastic frame 121 and the peripheral edge of the glass cover plate, so that a reserved space can be formed between the encapsulating plastic frame 121 and the edge of the cover plate 13 for setting hydrophobic Fiber 14 and the pressing mold 21 can be placed in the reserved space.
  • the hydrophobic fiber 14 can be placed in the reserved space. At this time, the hydrophobic fiber 14 still has a certain distance from the edge of the cover 13 distance.
  • the panel body 11 includes a substrate 111 and a functional layer 112.
  • the substrate 111 should fully cover the functional layer 112, that is, the orthographic projection of the functional layer 112 on the substrate 111 completely falls into the substrate 111, where the area where the functional layer 112 is located can be considered as The display area of the display panel.
  • the area of the display panel other than the functional layer 112 is a non-display area, and the non-display area surrounds the display area.
  • the encapsulating plastic frame 121 and the hydrophobic fiber 14 are both arranged in the non-display area.
  • the filling glue 122 can completely wrap the functional layer 112, and the filling glue 122 is evenly filled between the functional layer 112 and the cover plate 13.
  • the filling glue 122 is provided with an encapsulating glue frame 121 around the outside of the encapsulating glue frame 121 There is a layer of hydrophobic fibers 14.
  • the hydrophobic fibers 14 are arranged in an array on the peripheral surface of the packaging glue layer 12.
  • the hydrophobic fibers 14 are uniformly arranged on the peripheral surface of the packaging glue layer 12 in the form of an array, so that the sealing performance of the peripheral surface of the packaging glue layer 12 can be kept consistent.
  • the hydrophobic fiber length ranges from 1 ⁇ m to 5 ⁇ m, and the diameter ranges from 10 nm to 100 nm.
  • the hydrophobic fiber 14 having such a size can avoid harm to people.
  • the hydrophobic fiber 14 is composed of a first material and a second material, wherein the first material is any one of SiO2, TiO2, ZnO and ZnS, and the second material is one of polystyrene or polyacrylonitrile or Two kinds.
  • the hydrophobic fiber 14 is made of inorganic-organic composite materials.
  • the first material is an inorganic material, which can ensure the firmness of the hydrophobic fiber 14, and the second material is an organic material, which can ensure the adhesion between the hydrophobic fiber 14 and the glue.
  • an embodiment of the present disclosure also provides a packaging device for manufacturing the hydrophobic fiber 14 provided in any of the above embodiments.
  • the packaging device includes: as shown in FIG. 5, a plurality of presses that can be spliced together.
  • the bonding mold 21, the multiple bonding molds 21 after splicing can go around the encapsulation adhesive layer 12 once.
  • the compression mold 21 is provided with a preset area on the side close to the encapsulation adhesive layer 12, and the preset area is directly opposite to the encapsulation adhesive layer 12.
  • the set area is used to form hydrophobic fibers 14.
  • the packaging device is a mold for forming hydrophobic fibers 14 on the display panel. As shown in FIG.
  • the packaging device is formed by splicing a plurality of pressing molds 21, and the spliced pressing mold 21 can wrap around the packaging adhesive layer 12.
  • the ring, wherein the pressing mold 21 can be made of materials that are not easy to bond with epoxy resin, such as polytetrafluoroethylene, polypropylene, polyethylene, etc.
  • the pressing mold 21 may be in the shape of a plate. When the display panel is packaged, the pressing mold 21 may be attached to the sides of the panel body 11 and the cover 13 so that the preset area on the pressing mold 21 is facing the packaging adhesive layer 12.
  • the hydrophobic fibers 14 will be fixed on the peripheral sides of the encapsulation adhesive layer 12 so as to extend along the encapsulation adhesive layer 12. Hydrophobic fibers 14 are formed around. Wherein, when the display panel is packaged, the hydrophobic fiber 14 needs to be formed on the preset area of the pressing mold 21 first.
  • the hydrophobic fiber 14 grows in the preset area of the pressing mold 21 through the growth method induced by solvent volatilization.
  • the hydrophobic fibers 14 can be formed on all surfaces of the pressing mold 21.
  • the pressing mold 21 includes: a plate-shaped body 211, which includes a first surface and a second surface that are opposite to each other, and also includes a first surface and a second surface that are homogeneous with each other.
  • the adjacent third surface, the third surface is a preset area, the first surface is used for pressing and bonding with the panel main body 11, the second surface is used for pressing and bonding with the cover plate 13, and the third surface is close to the encapsulation adhesive layer 12.
  • the plate-shaped body 211 can be placed between the panel body 11 and the cover plate 13.
  • the target In the production of the plate-shaped body 211, the target needs to be known in advance. Box thickness, that is, the thickness after the encapsulation between the substrate 111 of the panel body 11 and the cover plate 13 is completed.
  • the thickness of the plate-shaped body 211 is made according to the target box thickness, that is, between the first surface and the second surface of the plate-shaped body 211
  • the plate-shaped main body 211 can be made into a plate with a thickness of 5 ⁇ m-30 ⁇ m.
  • the pressing mold 21 further includes: a plate-shaped base 212 arranged perpendicular to the plate-shaped main body 211, the plate-shaped main body 211 is formed as a convex structure on the base 212, and the plate-shaped main body 211 The side facing away from the base 212 is a preset surface.
  • the plate-shaped body 211 separates the surface of the base 212 with the plate-shaped body 211 into a first limiting surface and a second limiting surface.
  • the first limiting surface and the plate-shaped main body 211 The first surface is adjacent, the second limiting surface is adjacent to the second surface of the plate-shaped body 211, the first limiting surface is used to fit the side of the panel body 11 facing the base 212, and the second limiting surface It is used to adhere to the side of the cover plate 13 facing the base 212.
  • the plate-shaped base 212 and the plate-shaped main body 211 are perpendicular to each other.
  • the plate-shaped main body 211 is located in the middle area of the base 212 instead of at the edge of the base 212.
  • the plate-shaped main body 211 and the base 212 form a “convex” shape placed on the side.
  • the plane of the protrusion is the preset area.
  • the plate-shaped body 211 is placed between the panel body 11 and the cover plate 13, and the plate-shaped base body 212 is placed on the sides of the panel body 11 and the cover plate 13, and the base body 212 is perpendicular to the panel body 11 and the cover plate. 13.
  • the first limiting surface of the base body 212 is attached to the side surface of the panel body 11, and the second limiting surface of the base body 212 is attached to the cover plate 13. Therefore, the base body 212 can also contact the panel body 11 and The lateral position of the cover plate 13 is limited so that the orthographic projections of the two in the horizontal direction as shown in the figure coincide.
  • hydrophobic fibers are formed on the outer surface of the encapsulation structure.
  • the hydrophobic fibers are hydrophobic.
  • an embodiment of the present disclosure also provides a packaging method for packaging the display panel in the foregoing embodiment, and the packaging method includes:
  • Step S1 The hydrophobic fibers 14 are formed in the preset area of the pressing mold 21, and the encapsulating adhesive layer 12 is formed on the cover plate 13. Before encapsulating the display panel, the hydrophobic fibers 14 need to be formed on the pressing mold 21 in advance. The hydrophobic fiber 14 can be transferred to the peripheral side surface of the packaging glue layer 12 through the pressing mold 21. Before pressing the cover 13 and the panel body 11, the encapsulation glue layer 12 is coated on the cover 13 so that after the pressing, the encapsulation glue layer 12 can fix the cover 13 and the panel body 11, and also insulate the large Part of the water vapor.
  • Step S2. Place the pressing mold 21 on the edge of the cover plate 13 so that the preset area of the pressing mold 21 is facing the peripheral side of the packaging adhesive layer 12; since the packaging device is formed by splicing multiple pressing molds 21, A plurality of pressing molds 21 are sequentially installed at the edge of the cover plate 13, so that the pressing mold 21 can enclose the edge of the cover plate 13, that is, the pressing mold 21 is set around the cover plate 13 and the number of pressing molds 21 can be It can be set according to requirements, as long as these pressing molds 21 can surround the cover plate 13 once.
  • the installation of the pressing mold 21 can be fixed on the edge of the cover plate 13 by other equipment, and at the same time, it is necessary to ensure that the preset area where the hydrophobic fiber 14 is provided is directly opposite to the packaging glue layer 12.
  • Step S3 pressing the panel body 11 and the cover plate 13 so that the encapsulating adhesive layer 12 spreads to the hydrophobic fibers 14 and transferring the hydrophobic fibers 14 in a predetermined area to the side of the encapsulating adhesive layer 12.
  • the encapsulation adhesive layer 12 coated on the cover plate 13 will flow, so that the encapsulation adhesive layer between the cover plate 13 and the panel body 11 is evenly distributed on the cover plate 13 and Between the panel body 11.
  • the encapsulating adhesive layer 12 will diffuse around during the pressing process, and the encapsulating adhesive layer 12 will adhere to the hydrophobic fibers 14 during the diffusion process. Because the viscosity between the hydrophobic fibers 14 and the pressing mold 21 is less than The adhesiveness of the sealing glue layer 12 can further transfer the hydrophobic fibers 14 on the pressing mold 21 to the side surface of the sealing glue layer 12.
  • the encapsulation adhesive layer 12 needs to be cured; the encapsulation adhesive layer 12 can be cured by ultraviolet irradiation and heating. This technology is already very mature in the prior art, and will not be repeated here.
  • the pressing mold 21 can be removed. The lateral film formation allows the hydrophobic fibers 14 to be formed on the peripheral sides of the packaging glue layer 12.
  • the specific process of coating the encapsulation glue layer 12 includes: coating the encapsulation frame 121 at least 1 ⁇ m away from the edge of the cover plate 13, wherein the encapsulation frame 121 is strip-shaped. At this time, the encapsulation frame 121 and the cover plate A reserved space with a width of at least 1 ⁇ m is formed between the edges of 13, and at the same time, the packaging rubber frame 121 also encloses an accommodating space for accommodating the filler 122.
  • the packaging rubber frame 121 has a relatively high viscosity and low fluidity.
  • the filler 122 can be distributed in dots in the accommodating space, or it can be coated on the cover 13 in a "back" shape.
  • the filler 122 can diffuse in the package
  • the inner space of the plastic frame 121 is the accommodating space.
  • a schematic diagram of the plastic frame 121 and the filler 122 being encapsulated on the cover is as shown in FIG. 2.
  • the plate-shaped main body 211 When the pressing mold 21 is installed, the plate-shaped main body 211 is set in the reserved space, so that the preset area of the plate-shaped main body 211 faces the packaging rubber frame 121. Place the plate-shaped main body 211 in the reserved space outside the encapsulation frame 121, where the outside of the encapsulation frame 121 refers to the side of the encapsulation frame 121 facing away from the diffusion glue, so that the encapsulation frame 121 and the pressing mold 21 The distance between them is 1 ⁇ m. Then the panel main body 11 and the cover 13 are pressed together, and the encapsulating rubber frame 121 diffuses toward the pressing mold 21 to bond the hydrophobic fibers 14.
  • the encapsulating rubber frame 121 and the filler 122 are cured to complete the encapsulation.
  • the hydrophobic fibers 14 are left on the sides of the encapsulation frame 121, and finally the pressing mold 21 is removed.
  • the peripheral side surface of the encapsulation frame 121 refers to the side surface of the encapsulation frame 121 close to the separating mold. If the installation mold also includes a plate-shaped substrate 212, the plate-shaped substrate 212 will be stuck on the side of the cover plate 13 when the pressing mold 21 is installed.
  • the side surface of the panel body 11 and the first limit of the substrate 212 The position surface is attached to each other, and the side surface of the cover plate 13 is attached to the second limit surface of the base body 212.
  • the first limit surface and the second limit surface can make the cover plate 13 and the panel body 11. Limit.
  • the hydrophobic fibers 14 are arranged in an array in a predetermined area of the plate-shaped body 211.
  • the hydrophobic fibers 14 are formed in an array form.
  • hydrophobic fibers are formed on the outer surface of the encapsulation structure, and the hydrophobic fibers are hydrophobic.
  • the water vapor will not stay on the hydrophobic fibers, thereby preventing water vapor. It enters into the display panel from the side of the display panel, thereby improving the sealing effect of the display panel, avoiding damage to the OLED devices in the display panel, and prolonging the service life of the display panel.
  • An embodiment of the present disclosure also provides a display device, which includes the display panel described in the foregoing embodiment.
  • a display panel described in the foregoing embodiment.
  • the display device in the present disclosure may be any product or component with display function, such as electronic paper, OLED panel, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.
  • hydrophobic fibers are formed on the outer surface of the encapsulation structure.
  • the hydrophobic fibers are hydrophobic.
  • the sides of the display panel are filled with water vapor, the water vapor will not stay on the hydrophobic fibers, thereby preventing the water vapor from being removed.
  • the side of the display panel enters the display device, thereby improving the sealing effect of the display device, avoiding damage to the OLED devices in the display panel, and prolonging the service life of the display device.

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Abstract

一种显示面板、封装装置及封装方法，涉及显示面板技术领域，解决了显示面板的密封效果不好的问题。该显示面板包括：面板主体（11）；封装层，位于所述面板主体（11）的表面上；盖板（13），位于所述封装胶层（12）远离所述面板主体（11）的表面上，其中所述封装层封装包括封装胶层（12）和疏水纤维（14），所述封装胶层（12）封装所述面板主体（11）和所述盖板（13），并且所述疏水纤维（14）位于所述封装胶层（12）的四周侧面上，该封装层用于对显示面板进行封装。

Description

显示面板、封装装置、封装方法及显示装置
相关申请的交叉引用
本申请要求于2019年6月13日在中国知识产权局提交的申请号为201910509000.7的中国专利申请的优先权，该中国专利申请的全部内容通过引用合并于此。
技术领域
本公开涉及显示面板技术领域，尤其涉及一种显示面板、封装装置及封装方法。
背景技术
有源矩阵有机发光二极管(AMOLED)由于可实现较高的色域，超薄，柔性化的显示，逐渐受到了广泛的关注。尤其是曲面和柔性OLED，由于独特的功能和优秀的用户体验受到了众多青睐。
发明内容
本公开的一个实施例提供了一种显示面板，该显示面板包括：面板主体；
封装层，位于所述面板主体的表面上；
盖板，位于所述封装胶层远离所述面板主体的表面上，其中
所述封装层封装包括封装胶层和疏水纤维，所述封装胶层封装所述面板主体和所述盖板，并且所述疏水纤维位于所述封装胶层的四周侧面上。
在一些实施例中，所述疏水纤维呈绒毛状且紧密排布于所述封装胶层的四 周侧面上。
在一些实施例中，所述封装胶层包括封装胶框和填充胶，所述封装胶框位于距离所述盖板边缘预设距离处，所述封装胶框在所述盖板上围成环形容置空间，所述填充胶位于所述容置空间内，并且其中，所述疏水纤维位于所述封装胶框背离所述填充胶的四周表面上。
在一些实施例中，所述疏水纤维以多行多列的阵列形式排布于所述封装胶层的四周侧面上。
在一些实施例中，所述疏水纤维长度为1μm至5μm，直径为10nm至100nm。
在一些实施例中，所述疏水纤维由第一材料和第二材料构成，其中所述第一材料为SiO2、TiO2、ZnO和ZnS中的任一种，第二材料为聚苯乙烯或聚丙烯腈中的一种或两种。
在一些实施例中，所述显示面板是OLED显示面板。
本公开的一个实施例提供了一种封装装置，用于形成前述显示面板的疏水纤维，所述封装装置包括：
多个相互拼接的压合模具，拼接后的多个所述压合模具绕封装胶层一周，每个所述压合模具靠近封装胶层的一侧具有预设区域，多个所述压合模具拼接在一起后，所述预设区域正对所述封装胶层，所述预设区域预先形成有疏水纤维。
在一些实施例中，每个所述压合模具均包括：板状主体，所述板状主体包括相反的第一面和第二面，还包括与所述第一面和所述第二面均相邻的第三面，所述第三面为所述预设区域，所述第一面用于与面板主体的靠近所述盖板的表面相压合，所述第二面用于与盖板的靠近所述面板主体的表面相压合，且 所述第三面靠近封装胶层。
在一些实施例中，每个所述压合模具还包括：板状基体，其与所述板状主体的远离第三面的表面连接且垂直于所述板状主体，所述板状主体在所述基体上形成为凸起结构，所述板状主体将所述板状基体与所述板状主体相连接的表面分隔成第一限位面和第二限位面，所述第一限位面与所述板状主体的第一面相邻，所述第二限位面与所述板状主体的第二面相邻，所述第一限位面用于与面板主体的侧面相贴合，所述第二限位面用于与盖板的侧面相贴合。
本公开的一个实施例提供了一种封装方法，用于封装前述的显示面板，所述封装方法包括：在各压合模具的预设区域形成疏水纤维；在盖板上形成封装胶层；将各压合模具拼接安装于所述盖板边缘，使各压合模具的预设区域正对所述封装胶层的四周侧面；将面板主体与盖板压合，使得所述封装胶层扩散至疏水纤维处，并且使得各压合模具的预设区域的疏水纤维转印到所述封装胶层的四周侧面上。
本公开的一个实施例提供了一种显示装置，包括前述的显示面板。
附图说明
图1为本公开实施例提供的一种显示面板结构示意图；
图2为本公开实施例提供的一种显示面板及封装装置结构示意图；
图3为本公开实施例提供的一种显示面板及封装装置另一结构示意图；
图4为本公开实施例提供的一种显示面板及封装装置又一结构示意图；
图5为本公开实施例提供的一种显示面板及封装装置再一结构示意图；
图6为本公开实施例提供的一种封装装置结构示意图；
图7为本公开实施例提供的一种封装方法流程示意图。
附图标号说明：
11-面板主体，111-基板，112-功能层，12-封装胶层，121-封装胶框，122-填充胶，13-盖板，14-疏水纤维，21-压合模具，211-板状主体，212-基体。
具体实施方式
为更进一步阐述本公开为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例，对依据本公开提出的显示面板、封装装置及封装方法其具体实施方式、结构、特征及其功效，详细说明如后。
相关技术中，OLED器件容易收到水汽和氧气的侵蚀，有机材料和金属电极极易与水氧发生反应，使器件失效，从而需要对器件进行封装，才能延长使用寿命。采用树脂类胶材对OLED器件进行封装是一种传统的封装方式，其不仅具有制作工艺简单，封装效果较佳的优点，而且固化后应力很小，可以避免出现裂痕，可应用于大尺寸器件的制作。然而，树脂胶对于水汽的阻隔效果并不理想，水汽依旧能够从显示面板的侧面进入到显示面板内部，导致OLED器件损坏，因此如何提高显示面板的密封效果是本领域技术人员亟需解决的技术问题。
一方面，如图1所示，本公开实施例提供了一种显示面板，该显示面板包括：面板主体11，面板主体11上依次层叠设置有封装胶层12和盖板13，绕封装胶层12的一周设置有一层疏水纤维14。面板主体11为多层结构，其上设置有OLED器件，如不对其进行封装，会导致面板主体11中的OLED器件与空气中的水汽和氧气相接触，使得OLED器件造成损坏，为了对OLED器件进行保护，通常在面板主体11上设置盖板13，二者之间通过封装胶层12进行粘合，以对面板主体11进行封装。
盖板13可以为玻璃盖板13，玻璃盖板13能够阻挡水汽从面板主体11的正面(即，图1中玻璃盖板远离面板主体11的表面)进入到面板主体11内，面板主体11与盖板13之间的封装胶层12不仅能够将面板主体11与盖板13粘合在一起，还能对面板主体11的四周侧面进行封装，防止水汽从面板主体11的侧面进入到面板主体11内。封装胶层12的主要成分为环氧树脂，包括丙烯酸环氧丙酯、甲基丙烯酸环氧丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基聚丙烯酸6，7-环氧庚酯、甲基丙烯酸-2-羟基乙酯等单体的均聚物或共聚物、三聚氰胺甲醛树脂、不饱和聚酯树脂、有机硅树脂、呋喃树脂等添加材料，可采用紫外线照射和加热的方式固化。封装胶层12虽然有阻隔水汽的作用，但是其对显示面板的密封效果并不理想。
此外，为了进一步增加封装胶层12的封装效果，在封装胶层12的远离OLED器件的四周侧面设置疏水纤维14，其中，封装胶层12的四周侧面指的是封装胶层12不与面板主体11贴合，也不与盖板13相贴合的四周表面，如图1所示，封装胶层12的远离面板主体的表面与盖板13接触，封装胶层12的远离盖板13的表面与面板主体11接触。疏水纤维14绕封装胶层12一周，即封装胶层12的四周外侧设置有一层疏水纤维14，疏水纤维14与封装胶层12一起构成封装层，用于对显示面板进行封装。利用疏水纤维14的疏水性能够防止水汽停留在封装胶层12的侧面，减少了水汽从封装胶层12处渗透到显示面板中的概率，增强了封装效果。
本公开的目的及解决其技术问题还可采用以下技术措施进一步实现。
具体地，如图1所示，疏水纤维14呈绒毛状且紧密排布于封装胶层12的四周侧面，以绕封装胶层12的一周形成一层疏水纤维14。无数个绒毛状的疏水纤维14排列在封装胶层12的四周侧面，疏水绒毛可以通过模具从模具转印到 封装胶层12的四周侧面。疏水纤维14可利用侧向成膜工艺制成。
具体地，如图2和图3所示，距离盖板13四周边缘的预设距离处设置一圈封装胶框121，封装胶框121在盖板13上围成一个容置空间，容置空间内设置有填充胶122，疏水纤维14设置于封装胶框121背离填充胶122的四周侧面，且疏水纤维14围绕封装胶框121四周设置。填充胶122与封装胶框121的材质已经在上文中提及，在此不进行赘述，填充胶122与封装胶框121的材料相同，其通过调整各个添加材料的比例，来调整封装胶框121与填充胶122的粘度，其中，形成封装胶框121的胶材的粘度在100000-400000mPa·s之间；填充胶122粘度在100-2000mPa·s之间，封装胶框121的粘度较大是为了保证盖板13与面板主体11之间的密封性，其流动性较差，而填充胶122粘度较小，其流动性较强，在对面板主体11和盖板13进行压合时，填充胶122能够均匀的在容置空间内扩散，进而形成薄厚均匀的填充胶122层。在涂布封装胶框121时，封装胶框121与玻璃盖板的四周边缘之间具有预设距离，进而能够在封装胶框121与盖板13边缘之间形成预留空间，以供设置疏水纤维14，并且能够将压合模具21置于该预留空间内，当封装结束后，疏水纤维14能够置于预留空间内，此时，疏水纤维14距离盖板13的边缘仍具有一定的距离。面板主体11包括基板111和功能层112，基板111要将功能层112全面覆盖，即，功能层112在基板111上的正投影完全落入基板111内，其中，功能层112所在区域可以认为是显示面板的显示区域。显示面板的除功能层112以外的区域为非显示区域，非显示区域绕显示区域一周，其中，可以封装胶框121和疏水纤维14均设置在非显示区域。填充胶122能够将功能层112完全包裹住，在功能层112与盖板13之间均匀填充有填充胶122，填充胶122的外部四周设置有封装胶框121，封装胶框121的外部四周设置有一层疏水纤维14。
具体地，疏水纤维14以阵列形式排布于封装胶层12的四周侧表面。疏水纤维14以阵列的形式均匀排布于封装胶层12的四周侧表面，从而能够使得封装胶层12的四周侧表面各处的密封性保持一致。
具体地，疏水纤维长度的取值范围为1μm至5μm，直径的取值范围为10nm至100nm。具有如此尺寸的疏水纤维14能够避免对人造成伤害。
具体地，疏水纤维14由第一材料和第二材料构成，其中第一材料为SiO2、TiO2、ZnO和ZnS中的任一种，第二材料为聚苯乙烯或聚丙烯腈中的一种或两种。疏水纤维14采用无机有机复合材料构成，其中第一材料为无机材料，无机材料能够保证疏水纤维14的牢固性，第二材料为有机材料，其能够保证疏水纤维14与胶材的粘结性。
另一方面，本公开实施例还提供一种封装装置，用于制造以上任一实施例所提供的疏水纤维14，该封装装置包括：如图5所示，能够相互拼接在一起的多个压合模具21，拼接后的多个压合模具21可以绕封装胶层12一周，压合模具21靠近封装胶层12的一侧设置有预设区域，预设区域正对于封装胶层12，预设区域用于形成疏水纤维14。该封装装置为在显示面板上形成疏水纤维14的模具，如图5所示，封装装置是由多个压合模具21拼接而成的，拼接后的压合模具21能够绕封装胶层12一圈，其中，压合模具21可以由采用聚四氟乙烯、聚丙烯、聚乙烯等不易与环氧树脂粘结的材料制成。压合模具21可以呈板状，在对显示面板进行封装时，压合模具21可以贴在面板主体11与盖板13的侧面，使得压合模具21上的预设区域正对着封装胶层12，在对面板主体11与盖板13进行压合时，二者之间的封装胶层12扩散，处于封装胶层12边缘处的封装胶扩散到疏水纤维14处，从而封装胶层12粘接疏水纤维14，对封装胶层12进行固化，待封装胶层12固化后，撤离模具，此时，疏水纤维14会固定在封 装胶层12的四周侧面上，以此沿封装胶层12的四周形成了疏水纤维14。其中，在对显示面板进行封装时，需要先在压合模具21的预设区域上形成疏水纤维14。疏水纤维14通过溶剂挥发诱导的生长方式，生长在压合模具21的预设区域内，具体制作疏水纤维14时需要在将压合模具21放置在溶液内，生长在压合模具21的预设区域内，并以阵列形式排布，其中，为了方便疏水纤维14的生长，可以使得压合模具21的所有面均形成疏水纤维14。
本公开的目的及解决其技术问题还可采用以下技术措施进一步实现。
具体地，如图2至图4所示，压合模具21包括：板状主体211，板状主体211包括相反的第一面和第二面，还包括与第一面和第二面均相邻的第三面，第三面为预设区域，第一面用于与面板主体11相压合，第二面用于与盖板13相压合，且第三面靠近封装胶层12。在制作形成在封装胶层12的四周侧面上的疏水纤维14时，可以将板状主体211置于面板主体11与盖板13之间，其中，在制作板状主体211时，需要预先知道目标盒厚，即面板主体11的基板111与盖板13之间的封装完成之后的厚度，根据目标盒厚制作板状主体211的厚度，即，板状主体211的第一面与第二面之间的距离，例如，可以将板状主体211制作成厚度为5μm-30μm的板材。当压合面板主体11与盖板13时，板状主体211的第一面会与面板主体11相贴合，板状主体211的第二面与盖板13相贴合。将疏水纤维14制作在第三面上，在使用压合模具21时，使得第三面正对封装胶层12即可。
具体地，如图3和图4所示，压合模具21还包括：垂直于板状主体211设置的板状基体212，板状主体211在基体212上形成为凸起结构，板状主体211的背离基体212的一面为预设面，板状主体211将基体212设置有板状主体211的表面分隔成第一限位面和第二限位面，第一限位面与板状主体211的第一面 相邻，第二限位面与板状主体211的第二面相邻，第一限位面用于与面板主体11的面向基体212的侧面相贴合，第二限位面用于与盖板13的面向基体212的侧面相贴合。板状基体212与板状主体211相互垂直，板状主体211位于基体212的中间区域，而不是位于基体212的边缘处，板状主体211与基体212形成侧放的“凸”型，其中，突起的平面为预设区域。在使用压合模具21时，板状主体211置于面板主体11与盖板13之间，板状基体212置于面板主体11和盖板13的侧面，基体212垂直于面板主体11和盖板13，此时，基体212的第一限位面与面板主体11的侧面相贴合，基体212的第二限位面与盖板13相贴合，因此，基体212还能对面板主体11和盖板13的横向进行限位，使得二者在图示水平方向上的正投影重合。
在上述显示面板中，在封装结构的外表面上形成了疏水纤维，疏水纤维具有疏水性，当显示面板的侧面充满水汽时，水汽不会在疏水纤维上停留，进而能够避免水汽从显示面板的侧面进入显示面板中，进而提高了显示面板的密封效果，避免对显示面板中的OLED器件造成损坏，延长显示面板的使用寿命。
另一方面，如图7所示，本公开实施例还提供一种封装方法，用于对前述实施例中的显示面板进行封装，该封装方法包括：
步骤S1、在压合模具21的预设区域形成疏水纤维14，同时在盖板13上形成封装胶层12；在对显示面板进行封装之前，需要预先在压合模具21上形成疏水纤维14，疏水纤维14能够通过压合模具21转印到封装胶层12的四周侧面上。在压合盖板13与面板主体11之前在盖板13上涂布封装胶层12，使得在压合后，封装胶层12能够对盖板13与面板主体11进行固定，同时还能隔绝大部分的水汽。
步骤S2、将压合模具21置于盖板13边缘，使压合模具21的预设区域正对 于封装胶层12的四周侧面；由于封装装置是由多个压合模具21拼接而成，将多个压合模具21依次安装在盖板13的边缘处，使得压合模具21能够将盖板13的边缘围住，即压合模具21绕盖板13一周设置，压合模具21的数量可以根据需求自行设定，只要这些压合模具21组合在一起后能够围绕盖板13一周即可。压合模具21的安装可以通过其他设备固定在盖板13的边缘，同时要保证设置有疏水纤维14的预设区域与封装胶层12正对。
步骤S3、将面板主体11与盖板13压合，使得封装胶层12扩散至疏水纤维14处，使预设区域的疏水纤维14转印到封装胶层12的侧面。将面板主体11与盖板13进行压合时，涂布在盖板13上的封装胶层12会发生流动，使得盖板13与面板主体11之间的封装胶层均匀分布于盖板13与面板主体11之间。同时，封装胶层12在压合的过程中会向四周扩散，封装胶层12在扩散的过程中会与疏水纤维14发生粘接，由于疏水纤维14与压合模具21之间的粘性要小于封装胶层12的粘性，进而能够将压合模具21上的疏水纤维14转印到封装胶层12的侧面。
之后还需要固化封装胶层12；封装胶层12的固化可以采用紫外线照射和加热的方式固化，此技术在现有技术中已经非常成熟，在此不进行多余的赘述。在封装胶层12固化之后，可以将压合模具21移除。侧向成膜使得疏水纤维14形成在封装胶层12的四周侧面。
其中，涂布封装胶层12的具体过程包括：在距离盖板13边缘至少1μm处涂布一周封装胶框121，其中封装胶框121呈条状，此时，在封装胶框121与盖板13的边缘之间形成有宽度至少为1μm的预留空间，同时封装胶框121还围成用来容纳填充胶122的容置空间。封装胶框121的粘度较大，流动性较低。填充胶122可以点状分布于容置空间内，也可以呈“回”字形涂布在盖板13 上，当面板主体11与盖板13之间进行压合时，填充胶122能够扩散在封装胶框121的内部空间，即容置空间内。此时，盖板上封装胶框121和填充胶122的示意图，如图2所示。
在安装压合模具21时，将板状主体211设置于预留空间内，使板状主体211的预设区域正对封装胶框121。将板状主体211放置在封装胶框121外侧的预留空间内，其中，封装胶框121的外侧指的是封装胶框121背离扩散胶的一侧，使得封装胶框121与压合模具21之间相距1μm。而后压合面板主体11与盖板13，封装胶框121向压合模具21扩散，从而粘接疏水纤维14，最后对封装胶框121和填充胶122进行固化，完成封装。此时，疏水纤维14留置在了封装胶框121的四周侧面，最后移除压合模具21。此时，封装胶框121的四周侧面指的是封装胶框121靠近分离模具的一侧表面。如果安装模具还包括板状基体212，在板状基体212在安装压合模具21时会卡在盖板13的侧面，在放置面板主体11时，面板主体11的侧面与基体212的第一限位面相贴合，盖板13的侧面与基体212的第二限位面相贴合，在压合的过程中，第一限位面和第二限位面能够对盖板13和面板主体11进行限位。
如图6所示，疏水纤维14阵列排布于板状主体211的预设区域内。为了使疏水纤维14能够均匀的排布在封装胶层12的侧面，当在板状主体211的预设区域内形成疏水纤维14时，将疏水纤维14形成为阵列形式。
通过上述实施例制造的显示面板中，在封装结构的外表面上形成了疏水纤维，疏水纤维具有疏水性，当显示面板的侧面充满水汽时，水汽不会在疏水纤维上停留，进而能够避免水汽从显示面板的侧面进入显示面板中，进而提高了显示面板的密封效果，避免对显示面板中的OLED器件造成损坏，延长显示面板的使用寿命。
本公开的一个实施例还提供了一种显示装置，该显示装置包括上述实施例中描述的显示面板，对于显示面板的具体结构可参考上述实施例，此处不再赘述。
需要说明的是，本公开中的显示装置可以为：电子纸、OLED面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
在该实施例的显示装置中，在封装结构的外表面上形成了疏水纤维，疏水纤维具有疏水性，当显示面板的侧面充满水汽时，水汽不会在疏水纤维上停留，进而能够避免水汽从显示面板的侧面进入显示装置中，进而提高了显示装置的密封效果，避免对显示面板中的OLED器件造成损坏，延长显示装置的使用寿命。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (12)

  1. 一种显示面板，包括：
    面板主体；
    封装层，位于所述面板主体的表面上；
    盖板，位于所述封装胶层远离所述面板主体的表面上，其中
    所述封装层封装包括封装胶层和疏水纤维，所述封装胶层封装所述面板主体和所述盖板，并且所述疏水纤维位于所述封装胶层的四周侧面上。
  2. 根据权利要求1所述的显示面板，其中，
    所述疏水纤维呈绒毛状且紧密排布于所述封装胶层的四周侧面上。
  3. 根据权利要求1所述的显示面板，其中，
    所述封装胶层包括封装胶框和填充胶，所述封装胶框位于距离所述盖板边缘预设距离处，所述封装胶框在所述盖板上围成环形容置空间，所述填充胶位于所述容置空间内，并且其中，
    所述疏水纤维位于所述封装胶框背离所述填充胶的四周表面上。
  4. 根据权利要求2所述的显示面板，其中，
    所述疏水纤维以多行多列的阵列形式排布于所述封装胶层的四周侧面上。
  5. 根据权利要求2所述的显示面板，其中，
    所述疏水纤维长度为1μm至5μm，直径为10nm至100nm。
  6. 根据权利要求1所述的显示面板，其中，
    所述疏水纤维由第一材料和第二材料构成，其中所述第一材料为SiO2、TiO2、ZnO和ZnS中的任一种，第二材料为聚苯乙烯或聚丙烯腈中的一种或两种。
  7. 根据权利要求1所述的显示面板，其中，所述显示面板是OLED显示面板。
  8. 一种封装装置，用于形成权利要求1至7中任一项所述显示面板的疏水纤维，所述封装装置包括：
    多个相互拼接的压合模具，拼接后的多个所述压合模具绕封装胶层一周，每个所述压合模具靠近封装胶层的一侧具有预设区域，多个所述压合模具拼接在一起后，所述预设区域正对所述封装胶层，所述预设区域预先形成有疏水纤维。
  9. 根据权利要求8所述的封装装置，其中，
    每个所述压合模具均包括：板状主体，所述板状主体包括相反的第一面和第二面，还包括与所述第一面和所述第二面均相邻的第三面，所述第三面为所述预设区域，所述第一面用于与面板主体的靠近所述盖板的表面相压合，所述第二面用于与盖板的靠近所述面板主体的表面相压合，且所述第三面靠近封装胶层。
  10. 根据权利要求9所述的封装装置，其中，
    每个所述压合模具还包括：板状基体，其与所述板状主体的远离第三面的表面连接且垂直于所述板状主体，所述板状主体在所述基体上形成为凸起结构，所述板状主体将所述板状基体与所述板状主体相连接的表面分隔成第一限位面和第二限位面，所述第一限位面与所述板状主体的第一面相邻，所述第二限位面与所述板状主体的第二面相邻，所述第一限位面用于与面板主体的侧面相贴合，所述第二限位面用于与盖板的侧面相贴合。
  11. 一种封装方法，用于封装权利要求1至7中任一项所述的显示面板，所述封装方法包括：
    在各压合模具的预设区域形成疏水纤维；
    在盖板上形成封装胶层；
    将各压合模具拼接安装于所述盖板边缘，使各压合模具的预设区域正对所述封装胶层的四周侧面；
    将面板主体与盖板压合，使得所述封装胶层扩散至疏水纤维处，并且使得各压合模具的预设区域的疏水纤维转印到所述封装胶层的四周侧面上。
  12. 一种显示装置，包括权利要求1至7中任一项所述的显示面板。
PCT/CN2020/094900 2019-06-13 2020-06-08 显示面板、封装装置、封装方法及显示装置 WO2020248933A1 (zh)

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