WO2020232748A1 - 有机发光二极管显示面板及其制作方法 - Google Patents

有机发光二极管显示面板及其制作方法 Download PDF

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Publication number
WO2020232748A1
WO2020232748A1 PCT/CN2019/089804 CN2019089804W WO2020232748A1 WO 2020232748 A1 WO2020232748 A1 WO 2020232748A1 CN 2019089804 W CN2019089804 W CN 2019089804W WO 2020232748 A1 WO2020232748 A1 WO 2020232748A1
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Prior art keywords
layer
display panel
organic light
emitting diode
lower substrate
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PCT/CN2019/089804
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English (en)
French (fr)
Inventor
苗洋
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深圳市华星光电半导体显示技术有限公司
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Priority to US16/494,391 priority Critical patent/US11251405B2/en
Publication of WO2020232748A1 publication Critical patent/WO2020232748A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display, in particular to a large-size top-emitting flexible organic light-emitting diode display panel and a manufacturing method thereof.
  • Organic light emitting diode Organic Light Emitting Diode, OLED
  • OLED Organic Light Emitting Diode
  • OLED Organic Light Emitting Diode
  • OLED display has the advantages of self-luminous, no backlight, high contrast, wide color gamut, thin thickness, wide viewing angle, fast response speed and can be used for flexible panels.
  • Next-generation flat display technology With the development of OLED display technology, organic light-emitting diode display panels have continued to expand in areas such as large size, top emission, and flexibility. At the same time, since the life of the organic light emitting diode display panel is easily affected by water/oxygen, it is also necessary to continuously innovate the packaging technology of the OLED display panel so that the panel is not affected by water/oxygen during use.
  • the existing large-size organic light-emitting diode display panel packaging technologies such as face seal and bezel glue (Dam) / moisture absorbent (Getter) / fill glue (Fill) packaging are used in flexible organic light emitting diodes for top emission.
  • Dam face seal and bezel glue
  • Getter moisture absorbent
  • Fill fill glue
  • the purpose of the present invention is to provide an organic light emitting diode display panel and a manufacturing method thereof, which can simplify the packaging of the organic light emitting diode display panel and can meet the packaging requirements of various types of organic light emitting diode display panels.
  • an embodiment of the present invention provides an organic light emitting diode display panel, which includes a lower substrate, an upper cover plate and a barrier film packaging bag arranged in sequence, and one side of the lower substrate extends to form a signal channel;
  • the lower surface of the upper cover plate is connected with the upper surface of the lower substrate;
  • the barrier film packaging bag encapsulates the upper cover plate and the lower substrate from a side away from the signal channel.
  • the lower substrate includes a first flexible substrate, a thin film transistor layer, a light emitting layer, and a barrier layer arranged in sequence, wherein the barrier layer is located on the thin film transistor layer and completely covers the light emitting layer.
  • the signal channel includes the first flexible substrate, the thin film transistor layer and the gel layer arranged in sequence, wherein the gel layer is located on the thin film transistor layer and is connected to the barrier layer. Phase connection.
  • the upper cover plate includes a second flexible substrate, a color film layer, and a surface-mounted packaging adhesive layer, and the surface-mounted packaging adhesive layer is located on the second flexible substrate and completely covers the color
  • the film layer, the surface bonding encapsulation adhesive layer is used to connect the upper cover plate and the lower substrate.
  • the light-emitting layer includes a black matrix layer and a red, green, and blue pixel layer;
  • the color film layer includes a black photoresist layer corresponding to the black matrix layer and a black photoresist layer corresponding to the red, green, and blue pixel layer. Red, green and blue filter layer.
  • the materials of the first flexible substrate and the second flexible substrate include polyimide.
  • the present invention also provides a manufacturing method of an organic light emitting diode display panel, including the steps:
  • a lower substrate is produced, which is to provide a glass substrate, on which a first flexible substrate, a thin film transistor layer, a light-emitting layer, and a barrier layer are sequentially formed to form the lower substrate, and the barrier layer is located on the thin film transistor layer Upper and completely cover the light-emitting layer, wherein one side of the lower substrate extends to form a signal channel;
  • the upper cover plate is produced, which is to provide a glass cover plate, on the glass cover plate, a second flexible substrate, a color film layer, and a surface bonding encapsulation adhesive layer are sequentially fabricated, and the surface bonding encapsulation adhesive layer is located on the On the second flexible substrate and completely cover the color film layer;
  • the upper cover plate is attached to the lower substrate, which is that the surface of the upper cover plate is attached to the encapsulation adhesive layer and the barrier layer of the lower substrate is attached and connected in a vacuum environment; peeled off after the attachment is completed
  • the glass substrate and the glass cover form a display panel to be packaged;
  • the display panel to be packaged is vacuum thermocompressed packaged.
  • the display panel to be packaged needs to be packed into a barrier film packaging bag and exposed to one side of the signal channel, and the display panel to be packaged needs to be evacuated by vacuum.
  • the display panel to be packaged is bonded to the barrier film packaging bag, and the barrier film packaging bag, the first flexible substrate, the second flexible substrate and the surface are bonded to the packaging adhesive by hot pressing Laminating together, heating at the same time to cure the surface bonding encapsulation adhesive layer, thereby completing the encapsulation.
  • the step of fabricating the lower substrate further includes fabricating a gel layer on the thin film transistor layer located in the signal channel region, and the gel layer is connected to the barrier layer.
  • the light-emitting layer is made by evaporation or inkjet printing;
  • the barrier layer is made by low-temperature plasma-assisted chemical vapor deposition (PECVD) or atomic layer deposition (ALD) .
  • the beneficial effect of the present invention is to provide an organic light emitting diode display panel and a manufacturing method thereof.
  • PECVD or ALD is used to simply encapsulate the OLED, and then the upper cover plate is bonded to the lower substrate using a surface bonding encapsulant layer.
  • a barrier film packaging bag After peeling off the glass substrate and the glass cover, use a barrier film packaging bag to tightly cover the panel, so that water/oxygen cannot diffuse from the bonding channel between the upper cover and the lower substrate to the OLED device. Effective protection of the panel.
  • the invention simplifies the packaging of the OLED panel through the design of the barrier film packaging bag, and can meet the packaging requirements of various types of organic light-emitting diode display panels in combination with the surface-laminated packaging adhesive layer packaging, and can especially meet the large-size top emission flexibility Packaging requirements for OLED panels.
  • FIG. 1 is a schematic structural diagram of an organic light emitting diode display panel in an embodiment of the invention.
  • FIG. 2 is a schematic diagram of the structure of each layer of an organic light emitting diode display panel in an embodiment of the present invention
  • FIG. 3 is a manufacturing flow chart of an organic light emitting diode display panel in an embodiment of the invention.
  • FIG. 4 is a schematic structural diagram for completing step S1 in FIG. 3;
  • FIG. 5 is a schematic structural diagram for completing step S2 in FIG. 3;
  • FIG. 6 is a schematic structural diagram for completing step S3 in FIG. 3.
  • Organic light emitting diode display panel 1. Glass substrate, 2. Glass cover plate,
  • Lower substrate 20, upper cover, 30, barrier film packaging bag, 40, signal channel;
  • First flexible substrate 12, thin film transistor layer, 13, light emitting layer, 14, barrier layer,
  • black photoresist layer 222
  • red, green and blue filter layer 222
  • the "above” or “below” of the first feature of the second feature may include the first and second features in direct contact, or may include the first and second features Not in direct contact but through other features between them.
  • “above”, “above” and “above” the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” the first feature of the second feature include the first feature directly below and obliquely below the second feature, or it simply means that the first feature has a lower level than the second feature.
  • the present invention provides an organic light emitting diode display panel 100, including a lower substrate 10, an upper cover 20, and a barrier film packaging bag 30.
  • One side of the lower substrate 10 extends A signal channel 40 is formed; the upper cover 20 is located on the lower substrate 10, and the lower surface of the upper cover 20 is connected to the upper surface of the lower substrate 10; the barrier film packaging bag 30 is far away from the One side of the signal channel 40 encapsulates the upper cover 20 and the lower substrate 10.
  • the barrier film packaging bag 30 acts as a barrier to water/oxygen, and solves the problem that water/oxygen easily enters the organic light emitting diode display panel 100 from the bonding gap between the upper cover plate 20 and the lower substrate 10 of the OLED panel; and is used as a bag structure
  • the packaging operation is convenient and the packaging difficulty is reduced.
  • the lower substrate 10 includes a first flexible substrate 11, a thin film transistor layer 12, a light-emitting layer 13 and a barrier layer 14 arranged in sequence.
  • the thin film transistor layer 12 is located on the first flexible substrate 11; the light emitting layer 13 is located on the thin film transistor layer 12; the barrier layer 14 is located on the thin film transistor layer 12 and is completely Cover the light-emitting layer 13.
  • the barrier layer 14 is used as an encapsulation structure to block water/oxygen, so that the lower substrate 10 can be used as a simple encapsulated OLED panel.
  • the signal channel 40 includes the first flexible substrate 11, the thin film transistor layer 12 and the gel layer 15 arranged in sequence. Specifically, the thin film transistor layer 12 is located on the first flexible substrate 11; the gel layer 15 is located on the thin film transistor layer 12 and is connected to the barrier layer 14.
  • the upper cover 20 includes a second flexible substrate 21, a color film layer 22 and a surface-laminated packaging adhesive layer 23 that are sequentially arranged.
  • the color filter layer 22 is located on the second flexible substrate 21;
  • the surface-laminated packaging adhesive layer 23 is located on the second flexible substrate 21 and completely covers the color filter layer 22,
  • the surface-mounted packaging adhesive layer 23 is used to connect the upper cover 20 and the lower substrate 10.
  • the light-emitting layer 13 includes a black matrix layer 131 and a red, green, and blue pixel layer 132; the color film layer 22 includes a black light set corresponding to the black matrix layer 131.
  • the resist layer 221 and the red, green and blue filter layer 222 corresponding to the red, green and blue pixel layer 132 are provided. That is, the light-emitting layer 13 and the color film layer 22 are arranged correspondingly, the black photoresist layer 221 prevents light from being mixed, and the red, green, and blue pixel layer 222 has an effect on the red, green, and blue pixels.
  • Layer 132 filter effect is provided.
  • the materials of the first flexible substrate 11 and the second flexible substrate 21 include polyimide.
  • the polyimide material can be pressed together with the barrier film packaging bag 30 by hot pressing.
  • the present invention also provides a manufacturing method of the organic light emitting diode display panel 100, which includes steps S1-S4.
  • a lower substrate 10 specifically, provide a glass substrate 1, on which a first flexible substrate 11, a thin film transistor layer 12, a light-emitting layer 13, and a barrier layer 14 are sequentially fabricated to form the lower substrate 10.
  • the barrier layer 14 is located on the thin film transistor layer 12 and completely covers the light emitting layer 13, wherein a signal channel 40 is formed on one side of the lower substrate 10.
  • FIG. 4 is a schematic structural diagram for completing step S1.
  • a glass cover plate 2 is provided.
  • a second flexible substrate 21, a color film layer 22, and a surface-laminated packaging adhesive layer 23 are sequentially fabricated.
  • the surface-laminated packaging adhesive layer 23 is located on the second flexible substrate 21 and completely covers the color film layer 22; wherein the method of making the surface-laminated packaging adhesive layer 23 is specifically: tearing off the surface-laminated packaging adhesive
  • the protective film on one side of the layer 23 is attached to the color film layer 22 by attaching the surface bonding encapsulation adhesive layer 23 to the color film layer 22 in a vacuum environment.
  • FIG. 5 is a schematic structural diagram for completing step S2.
  • FIG. 6 is a schematic diagram of the structure for completing step S3.
  • step S4 of vacuum thermocompression packaging of the display panel to be packaged it is necessary to put the display panel to be packaged into the barrier film packaging bag 30 and expose one side of the signal channel 40, and vacuum pump Attach the display panel to be packaged to the barrier film packaging bag 30, and heat the barrier film packaging bag 30, the first flexible substrate 11, the second flexible substrate 21 and The surface bonding encapsulation adhesive layer 23 is pressed and pressed together, and at the same time, the surface bonding encapsulation adhesive layer 23 is cured by heating, thereby completing the packaging.
  • FIG. 2 is a schematic diagram of the structure for completing step S4.
  • step S1 of fabricating the lower substrate 10 it further includes fabricating a gel layer 15 on the thin film transistor layer 12 located in the signal channel 40 area, and the gel layer 15 is in contact with the barrier Layer 14 is connected.
  • the light-emitting layer 13 is made by evaporation or inkjet printing; the barrier layer 14 is made by low-temperature plasma assisted chemical vapor deposition (PECVD) or atomic layer Manufactured by deposition (ALD) method.
  • PECVD low-temperature plasma assisted chemical vapor deposition
  • ALD atomic layer Manufactured by deposition
  • the materials of the first flexible substrate 11 and the second flexible substrate 21 include polyimide.
  • the polyimide material can be pressed together with the barrier film packaging bag 30 by hot pressing.
  • the beneficial effect of the present invention is to provide an organic light emitting diode display panel 100 and a manufacturing method thereof.
  • PECVD or ALD is used to simply encapsulate the OLED, and then a surface-laminated packaging adhesive layer 23 is used to align the upper cover 20 with the bottom
  • the substrate 10 is laminated, the glass substrate 1 and the glass cover plate 2 are peeled off, and the barrier film packaging bag 30 is used to seal the panel tightly, so that water/oxygen cannot pass through the bonding channel between the upper cover plate 20 and the lower substrate 10 Diffused into the OLED device to achieve effective protection of the OLED panel.
  • the present invention simplifies the packaging of the OLED panel through the design of the barrier film packaging bag 30, and can meet the packaging requirements of various types of organic light-emitting diode display panels 100 in combination with the surface-laminated packaging adhesive layer 23, especially large size Packaging requirements for top-emitting flexible OLED panels.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明提供一种有机发光二极管显示面板及其制作方法。有机发光二极管显示面板包括下基板、上盖板以及阻隔膜封装袋，所述下基板的一侧延伸形成信号通道；所述上盖板的下表面与所述下基板的上表面相连接；所述阻隔膜封装袋从远离所述信号通道一侧封装所述上盖板和所述下基板。机发光二极管的制作方法包括步骤：制作下基板、制作上盖板、将所述上盖板贴合至所述下基板、将所述待封装显示面板真空热压封装。本发明简化了有机发光二极管显示面板的封装，能满足多种型号有机发光二极管显示面板的封装要求。

Description

有机发光二极管显示面板及其制作方法 技术领域
本发明涉及显示领域，尤其涉及一种大尺寸顶发射柔性有机发光二极管显示面板及其制作方法。
 背景技术
有机发光二极管(Organic Light Emitting Diode，OLED)显示器由于具备自发光，不需要背光源、对比度高、色域宽、厚度薄、视角广、反应速度快和可用于挠曲面板等优点，被认为是下一代平面显示新型技术。随着OLED显示技术的发展，有机发光二极管显示面板不断向大尺寸、顶发射和柔性等领域拓展。同时，由于有机发光二极管显示面板的寿命容易受到水/氧的影响，因此也需对OLED显示面板封装技术进行不断的革新，使面板在使用期间不受水/氧的的影响。
目前，现有的大尺寸有机发光二极管显示面板封装技术如面贴合封装(Face Seal)和边框胶(Dam)/吸湿剂(Getter)/填充胶(Fill)封装在应对顶发射的柔性有机发光二极管显示面板封装时，不管是材料还是技术方面都不够成熟。
因此，有必要提供一种新的有机发光二极管显示面板及其制作方法，以克服现有技术存在的问题，尤其是为大尺寸的顶发射柔性有机发光二极管显示面板开发新型的面板封装技术。
 技术问题
本发明的目的在于，提供一种有机发光二极管显示面板及其制作方法，可简化有机发光二极管显示面板的封装，能满足多种型号有机发光二极管显示面板的封装要求。
 技术解决方案
为了解决上述问题，本发明一实施例中提供一种有机发光二极管显示面板，包括有依次设置的下基板、上盖板以及阻隔膜封装袋，所述下基板的一侧延伸形成信号通道；所述上盖板的下表面与所述下基板的上表面相连接；所述阻隔膜封装袋从远离所述信号通道一侧封装所述上盖板和所述下基板。
进一步的，其中所述下基板包括有依次设置的第一柔性衬底、薄膜晶体管层、发光层和阻隔层，其中所述阻隔层位于所述薄膜晶体管层上且完全覆盖所述发光层。
进一步的，其中所述信号通道包括有依次设置的所述第一柔性衬底、所述薄膜晶体管层和凝胶层，其中所述凝胶层位于所述薄膜晶体管层上且与所述阻隔层相连接。
进一步的，其中所述上盖板包括第二柔性衬底、彩膜层和面贴合封装胶层，所述面贴合封装胶层位于所述第二柔性衬底上且完全覆盖所述彩膜层，所述面贴合封装胶层用于连接所述上盖板和所述下基板。
进一步的，其中所述发光层包括黑色矩阵层和红绿蓝像素层；所述彩膜层包括与所述黑色矩阵层相应设置的黑色光阻层和与所述红绿蓝像素层相应设置的红绿蓝滤光层。
进一步的，其中所述第一柔性衬底、所述第二柔性衬底的材料包括聚酰亚胺。
本发明还提供一种有机发光二极管显示面板的制作方法，包括步骤：
制作下基板，其为提供一玻璃基板，在所述玻璃基板上依次制作第一柔性衬底、薄膜晶体管层、发光层和阻隔层形成所述下基板，所述阻隔层位于所述薄膜晶体管层上且完全覆盖所述发光层，其中所述下基板一侧延伸形成信号通道；
制作上盖板，其为提供一玻璃盖板，在所述玻璃盖板上依次制作第二柔性衬底、彩膜层和面贴合封装胶层，所述面贴合封装胶层位于所述第二柔性衬底上且完全覆盖所述彩膜层；
将所述上盖板贴合至所述下基板，其为所述上盖板的面贴合封装胶层与所述下基板的阻隔层在真空环境中贴合相连接；贴合完成后剥离所述玻璃基板和所述玻璃盖板形成待封装显示面板；
将所述待封装显示面板真空热压封装。
进一步的，其中在将所述待封装显示面板真空热压封装的步骤中，需要将所述待封装显示面板装入阻隔膜封装袋中并裸露所述信号通道一侧，通过真空抽气将所述待封装显示面板同所述阻隔膜封装袋贴合，并通过热压将所述阻隔膜封装袋、所述第一柔性衬底、所述第二柔性衬底和所述面贴合封装胶层压合在一起，同时加热使所述面贴合封装胶层固化，从而完成封装。
进一步的，其中在制作下基板的步骤中，还包括在位于所述信号通道区域的所述薄膜晶体管层上制作凝胶层，所述凝胶层与所述阻隔层相连接。
进一步的，其中在制作下基板的步骤中，所述发光层通过蒸镀或喷墨打印方式制作；所述阻隔层通过低温电浆辅助化学气相沉积（PECVD）或原子层沉积（ALD）方式制作。
 有益效果
本发明的有益效果在于：提供一种有机发光二极管显示面板及其制作方法，首先使用PECVD或ALD的方法对OLED进行简单封装，接着使用面贴合封装胶层将上盖板同下基板贴合，剥离玻璃基板和玻璃盖板后使用阻隔膜封装袋对面板进行严密的套袋封装，使水/氧无法从上盖板和下基板之间的粘接通道扩散到OLED器件中，实现对OLED面板的有效保护。本发明通过对阻隔膜封装袋的设计，简化了OLED面板的封装，并与面贴合封装胶层封装结合能满足多种型号有机发光二极管显示面板的封装要求，尤其可满足大尺寸顶发射柔性OLED面板的封装要求。
 附图说明
图1为本发明一实施例中一种有机发光二极管显示面板的结构示意图；
图2为本发明一实施例中一种有机发光二极管显示面板的各层的结构示意图；
图3为本发明一实施例中一种有机发光二极管显示面板的制作流程图；
图4为完成图3中步骤S1的结构示意图；
图5为完成图3中步骤S2的结构示意图；
图6为完成图3中步骤S3的结构示意图。
图中部件标识如下：
100、有机发光二极管显示面板；1、玻璃基板，2、玻璃盖板，
10、下基板,20、上盖板，30、阻隔膜封装袋，40、信号通道；
11、第一柔性衬底，12、薄膜晶体管层，13、发光层，14、阻隔层，
15、凝胶层，21、第二柔性衬底，22、彩膜层，23、面贴合封装胶层；
131、黑色矩阵层，132、红绿蓝像素层，
221、黑色光阻层，222、红绿蓝滤光层。
 本发明的实施方式
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本发明中，相同或相对应的部件用相同的附图标记表示而与图号无关，在说明书全文中，当“第一”、“第二”等措辞可用于描述各种部件时，这些部件不必限于以上措辞。以上措辞仅用于将一个部件与另一部件区分开。
请参阅图1所示，在一实施例中，本发明提供一种有机发光二极管显示面板100，包括下基板10、上盖板20以及阻隔膜封装袋30，所述下基板10的一侧延伸形成信号通道40；所述上盖板20位于所述下基板10上，所述上盖板20的下表面与所述下基板10的上表面相连接；所述阻隔膜封装袋30从远离所述信号通道40一侧封装所述上盖板20和所述下基板10。所述阻隔膜封装袋30起阻隔水/氧作用，解决了水/氧容易从OLED面板的上盖板20与下基板10的粘接空隙进入有机发光二极管显示面板100中；且作为袋装结构方便了封装操作，降低了封装难度。
请参阅图2所示，在本实施例中，所述下基板10包括有依次设置的第一柔性衬底11、薄膜晶体管层12、发光层13和阻隔层14。具体地讲，所述薄膜晶体管层12位于所述第一柔性衬底11上；所述发光层13位于所述薄膜晶体管层12上；所述阻隔层14位于所述薄膜晶体管层12上且完全覆盖所述发光层13。所述阻隔层14做为封装结构，起阻隔水/氧作用，使所述下基板10可作为简单封装的OLED面板。
请参阅图2所示，在本实施例中，所述信号通道40包括有依次设置的所述第一柔性衬底11、所述薄膜晶体管层12和凝胶层15。具体地讲，所述薄膜晶体管层12位于所述第一柔性衬底11上；所述凝胶层15位于所述薄膜晶体管层12上且与所述阻隔层14相连接。
请参阅图2所示，在本实施例中，所述上盖板20包括有依次设置的第二柔性衬底21、彩膜层22和面贴合封装胶层23。具体地讲，所述彩膜层22位于所述第二柔性衬底21上；所述面贴合封装胶层23位于所述第二柔性衬底21上且完全覆盖所述彩膜层22，所述面贴合封装胶层23用于连接所述上盖板20和所述下基板10。
请参阅图2所示，在本实施例中，所述发光层13包括黑色矩阵层131和红绿蓝像素层132；所述彩膜层22包括与所述黑色矩阵层131相应设置的黑色光阻层221和与所述红绿蓝像素层132相应设置的红绿蓝滤光层222。即所述发光层13与所述彩膜层22相应设置，所述黑色光阻层221对光线阻隔起到防止混光效果，所述红绿蓝像素层222起到对所述红绿蓝像素层132滤光效果。
在本实施例中，所述第一柔性衬底11、所述第二柔性衬底21的材料包括聚酰亚胺。聚酰亚胺材料可通过热压将其与所述阻隔膜封装袋30压合在一起。
请参阅图3-图6所示，本发明还提供一种有机发光二极管显示面板100的制作方法，包括步骤S1-S4。
S1、制作下基板10，具体地讲，提供一玻璃基板1，在所述玻璃基板1上依次制作第一柔性衬底11、薄膜晶体管层12、发光层13和阻隔层14形成所述下基板10，所述阻隔层14位于所述薄膜晶体管层12上且完全覆盖所述发光层13，其中所述下基板10一侧延伸形成信号通道40。
请参阅图4所示，为完成步骤S1的结构示意图。
S2、制作上盖板20，具体地讲，提供一玻璃盖板2，在所述玻璃盖板2上依次制作第二柔性衬底21、彩膜层22和面贴合封装胶层23，所述面贴合封装胶层23位于所述第二柔性衬底21上且完全覆盖所述彩膜层22；其中制作面贴合封装胶层23方式具体为：撕除所述面贴合封装胶层23一侧的保护膜，在真空环境将所述面贴合封装胶层23贴合至所述彩膜层22上。
请参阅图5所示，为完成步骤S2的结构示意图。
S3、将所述上盖板20贴合至所述下基板10，具体地讲，撕除所述面贴合封装胶层23另一侧的保护膜，在真空环境中将所述上盖板20的面贴合封装胶层23与所述下基板10的阻隔层14贴合相连接；贴合完成后剥离所述玻璃基板1和所述玻璃盖板2形成待封装显示面板；
请参阅图6所示，为完成步骤S3的结构示意图。
S4、将所述待封装显示面板真空热压封装。
具体地讲，在将所述待封装显示面板真空热压封装的步骤S4中，需要将所述待封装显示面板装入阻隔膜封装袋30中并裸露所述信号通道40一侧，通过真空抽气将所述待封装显示面板同所述阻隔膜封装袋30贴合，并通过热压将所述阻隔膜封装袋30、所述第一柔性衬底11、所述第二柔性衬底21和所述面贴合封装胶层23压合在一起，同时加热使所述面贴合封装胶层23固化，从而完成封装。
请参阅图2所示，为完成步骤S4的结构示意图。
在本实施例中，在制作下基板10的步骤S1中，还包括在位于所述信号通道40区域的所述薄膜晶体管层12上制作凝胶层15，所述凝胶层15与所述阻隔层14相连接。
在本实施例中，在制作下基板10的步骤S1中，所述发光层13通过蒸镀或喷墨打印方式制作；所述阻隔层14通过低温电浆辅助化学气相沉积（PECVD）或原子层沉积（ALD）方式制作。
在本实施例中，在所有机发光二极管显示面板100的制作方法中，所述第一柔性衬底11、所述第二柔性衬底21的材料包括聚酰亚胺。聚酰亚胺材料可通过热压将其与所述阻隔膜封装袋30压合在一起。
本发明的有益效果在于：提供一种有机发光二极管显示面板100及其制作方法，首先使用PECVD或ALD的方法对OLED进行简单封装，接着使用面贴合封装胶层23将上盖板20同下基板10贴合，剥离玻璃基板1和玻璃盖板2后使用阻隔膜封装袋30对面板进行严密的套袋封装，使水/氧无法从上盖板20和下基板10之间的粘接通道扩散到OLED器件中，实现对OLED面板的有效保护。本发明通过对阻隔膜封装袋30的设计，简化了OLED面板的封装，并与面贴合封装胶层23封装结合能满足多种型号有机发光二极管显示面板100的封装要求，尤其可满足大尺寸顶发射柔性OLED面板的封装要求。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种有机发光二极管显示面板，其中，包括
    下基板，其一侧延伸形成信号通道；
    上盖板，位于所述下基板上，所述上盖板的下表面与所述下基板的上表面相连接；以及
    阻隔膜封装袋，从远离所述信号通道一侧封装所述上盖板和所述下基板。
  2. 根据权利要求1所述的有机发光二极管显示面板，其中，所述下基板包括
    第一柔性衬底；
    薄膜晶体管层，位于所述第一柔性衬底上；
    发光层，位于所述薄膜晶体管层上；以及
    阻隔层，位于所述薄膜晶体管层上且完全覆盖所述发光层。
  3. 根据权利要求2所述的有机发光二极管显示面板，其中，所述信号通道包括
    所述第一柔性衬底；
    所述薄膜晶体管层，位于所述第一柔性衬底上；以及
    凝胶层，位于所述薄膜晶体管层上且与所述阻隔层相连接。
  4. 根据权利要求1所述的有机发光二极管显示面板，其中，所述上盖板包括
    第二柔性衬底；
    彩膜层，位于所述第二柔性衬底上；以及
    面贴合封装胶层，位于所述第二柔性衬底上且完全覆盖所述彩膜层，所述面贴合封装胶层用于连接所述上盖板和所述下基板。
  5. 根据权利要求1所述的有机发光二极管显示面板，其中，所述发光层包括黑色矩阵层和红绿蓝像素层；所述彩膜层包括与所述黑色矩阵层相应设置的黑色光阻层和与所述红绿蓝像素层相应设置的红绿蓝滤光层。
  6. 根据权利要求1所述的有机发光二极管显示面板，其中，所述第一柔性衬底、所述第二柔性衬底的材料包括聚酰亚胺。
  7. 一种如权利要求1所述的有机发光二极管显示面板的制作方法，其中，包括步骤：
    制作下基板，其为提供一玻璃基板，在所述玻璃基板上依次制作第一柔性衬底、薄膜晶体管层、发光层和阻隔层形成所述下基板，所述阻隔层位于所述薄膜晶体管层上且完全覆盖所述发光层，其中所述下基板一侧延伸形成信号通道；
    制作上盖板，其为提供一玻璃盖板，在所述玻璃盖板上依次制作第二柔性衬底、彩膜层和面贴合封装胶层，所述面贴合封装胶层位于所述第二柔性衬底上且完全覆盖所述彩膜层；
    将所述上盖板贴合至所述下基板，其为所述上盖板的面贴合封装胶层与所述下基板的阻隔层在真空环境中贴合相连接；贴合完成后剥离所述玻璃基板和所述玻璃盖板形成待封装显示面板；
    将所述待封装显示面板真空热压封装。
  8. 根据权利要求7所述的有机发光二极管显示面板的制作方法，其中，在将所述待封装显示面板真空热压封装的步骤中，需要将所述待封装显示面板装入阻隔膜封装袋中并裸露所述信号通道一侧，通过真空抽气将所述待封装显示面板同所述阻隔膜封装袋贴合，并通过热压将所述阻隔膜封装袋、所述第一柔性衬底、所述第二柔性衬底和所述面贴合封装胶层压合在一起，同时加热使所述面贴合封装胶层固化，从而完成封装。
  9. 根据权利要求7所述的有机发光二极管显示面板的制作方法，其中，在制作下基板的步骤中，还包括在位于所述信号通道区域的所述薄膜晶体管层上制作凝胶层，所述凝胶层与所述阻隔层相连接。
  10. 根据权利要求7所述的有机发光二极管显示面板的制作方法，其中，在制作下基板的步骤中，所述发光层通过蒸镀或喷墨打印方式制作；所述阻隔层通过低温电浆辅助化学气相沉积或原子层沉积方式制作。
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