WO2019000923A1 - 显示基板及其制备方法和显示装置 - Google Patents

显示基板及其制备方法和显示装置 Download PDF

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Publication number
WO2019000923A1
WO2019000923A1 PCT/CN2018/073566 CN2018073566W WO2019000923A1 WO 2019000923 A1 WO2019000923 A1 WO 2019000923A1 CN 2018073566 W CN2018073566 W CN 2018073566W WO 2019000923 A1 WO2019000923 A1 WO 2019000923A1
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Prior art keywords
display substrate
display
adhesive
support structure
substrate
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PCT/CN2018/073566
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English (en)
French (fr)
Inventor
王利娜
崔富毅
陈帅
王子峰
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/088,126 priority Critical patent/US11114640B2/en
Publication of WO2019000923A1 publication Critical patent/WO2019000923A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display substrate and a method of fabricating the same, and to a display device.
  • OLED display devices are usually packaged with glass glue for the frame.
  • Glass glue is a rigid material. Laser encapsulation of glass glue can cause various defects.
  • a display substrate including a display area and a bezel area surrounding the display area.
  • the display substrate includes an adhesive located in the frame region.
  • the adhesive is configured to bond the display substrate and an opposing substrate that is aligned therewith.
  • the display substrate further includes a support structure on the side of the frame on a side of the adhesive that is away from the display area.
  • the support structure is configured to form a support between the display substrate and the opposite substrate that are aligned with each other.
  • a gap exists between the support structure and the adhesive.
  • the gap has a width of about 30 to 50 [mu]m.
  • the height of the support structure is less than the height of the adhesive before bonding the opposite substrate to the display substrate.
  • the adhesive comprises a glass glue.
  • the display area is further provided with a spacer.
  • the support structure is the same material as the spacer.
  • the support structure is the same height as the spacer.
  • the display substrate includes a plurality of the support structures spaced apart from each other.
  • the spacing between two adjacent support structures is between about 5 and 10 microns.
  • a shape of a cross section of the support structure perpendicular to an extending direction thereof on the display substrate is a trapezoid, and a bottom surface of the support structure having a larger area is in contact with the display substrate.
  • the shape of the cross section of the support structure perpendicular to its extending direction on the display substrate is a rectangle.
  • the opposite substrate is an array substrate.
  • the display substrate is a package cover or a color film substrate.
  • a display device comprising the display substrate according to any of the above embodiments.
  • a method for fabricating a display substrate including a display area and a bezel area includes:
  • the adhesive is sintered.
  • FIG. 1 is a schematic cross-sectional view showing a structure of a display substrate according to an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view of a gap between a support structure of a display substrate and an adhesive according to an embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional view of a narrow bezel cut of the display substrate of FIG. 1;
  • FIG. 4 is a schematic cross-sectional view of a wide bezel cut of the display substrate of FIG. 1;
  • FIG. 5 is a flow chart of a method of preparing a display substrate in accordance with the present disclosure.
  • the inventors have found that there is stress in the package area after the glass is encapsulated by the laser.
  • the glass substrate itself is deformed.
  • the thinner the glass substrate the larger the deformation.
  • the frame of the OLED display device is cut, due to the deformation of the glass substrate, the rigidity of the glass paste, and the stress in the package region, there is a possibility of micro-cracking of the glass paste after cutting, which directly affects the packaging performance of the OLED display device.
  • the inventors have also found that the height and uniformity of the glass glue changes after laser sintering. This easily causes a Newton's ring phenomenon at the bonding surface of the glass paste and the glass substrate and the surface of the film layer of the display region of the OLED display device. This not only affects the packaging effect of the glass glue, but also affects the display effect of the display area.
  • a display substrate is provided. As shown in FIG. 1, the display substrate includes a display area 1 and a bezel area 2 surrounding the display area 1.
  • the display substrate includes an adhesive 3 located in the bezel area 2.
  • the adhesive 3 is configured to bond the display substrate and the opposite substrate to which it is opposed.
  • the display substrate further comprises a support structure 4 on the side of the frame region 2 on the side of the adhesive glue 3 remote from the display area 1.
  • the support structure 4 is configured to form a support between the display substrate and the counter substrate that are aligned with each other.
  • the support structure 4 By providing the support structure 4 on the frame region 2 on the side of the adhesive 3 that is away from the display region 1, it is possible to form a support between the mutually aligned display substrate and the counter substrate.
  • the cutting line ie, the path traveled by the cutting tool when cutting
  • the arrangement of the support structure 4 can prevent the adhesive 3 from being cracked when the frame is cut, thereby ensuring the bonding property of the adhesive 3. Further, the adhesive 3 is melted into a liquid state upon bonding.
  • the support structure 4 can effectively control the appearance of the liquid adhesive 3 when the adhesive 3 is bonded, so that the liquid adhesive 3 does not overflow beyond the support structure 4, so that the cured adhesive 3
  • the height and uniformity are kept consistent, thereby preventing the bonding surface of the adhesive 3 and the opposite substrate, and the Newton ring phenomenon appearing on the surface of the display substrate and the opposite substrate in the display region 1 to finally ensure the adhesion.
  • the support structure 4 and the adhesive 3 are in contact with each other, as shown in FIG.
  • the support structure 4 can support the aligned display substrate and the opposite substrate. This avoids the cracking of the adhesive 3 and avoids the Newton's ring phenomenon after bonding.
  • Figure 3 shows the case where the display substrate is cut with a narrow bezel.
  • the cutting line 5 is located on the side of the support structure 4 adjacent to the adhesive 3 or on the adhesive 3, and only all or part of the adhesive 3 is left after the frame is cut, and the support structure 4 is cut. Drop it.
  • Fig. 4 shows a case where a wide bezel is cut on the display substrate.
  • the cutting line 5 is located on the side of the support structure 4 away from the adhesive 3, and the adhesive 3 and the support structure 4 are retained after the frame is cut.
  • the support structure 4 can form a support between the aligned display substrate and the opposite substrate to prevent the crack from being caused by the cutting.
  • the gap L1 formed between the support structure 4 and the adhesive 3 has a width of about 30 to 50 ⁇ m.
  • the support structure 4 can form a good support between the two substrates when the aligned display substrate and the opposite substrate are cut by the frame to prevent the adhesive 3 from being cracked.
  • the height of the support structure 4 is less than the height of the adhesive 3 prior to bonding the display substrate to the opposite substrate. Since the adhesive 3 melts to form a liquid when bonded, the adhesive 3 is highly reduced in bonding. This allows the adhesive 3 to bond the display substrate and the counter substrate well under the auxiliary support of the support structure 4. Further, this ensures that no gap is formed between the display substrate and the opposite substrate and the adhesive 3 after the adhesive 3 is cured.
  • the display area 1 is also provided with a spacer.
  • the support structure 4 is the same material as the spacer. Since the spacer is usually made of a material having certain flexibility, the spacer can not only support a certain degree of support, but also avoid excessive support force on the two substrates supported by the support during the supporting process. Avoid damage to both substrates.
  • the support structure 4, which uses the same material as the spacer, can also perform the above functions, namely ensuring good support and avoiding damage to the opposing substrates during the frame cutting process.
  • the support structure 4 is the same height as the spacer. This can ensure that there is no difference in the cell gap between the display region 1 and the bezel region 2, thereby avoiding the bonding surface of the adhesive 3 and the opposite substrate and the surface of the film on the display substrate and the opposite substrate in the display region 1.
  • the Newton's ring phenomenon finally ensures the encapsulation effect of the adhesive 3 and the display effect of the display area 1.
  • the display substrate includes a plurality of support structures 4 spaced apart from one another.
  • the number of support structures 4 is two.
  • the two support structures 4 are capable of sharing the cutting stress at the time of cutting the frame, thereby further ensuring good support for the display substrate and the opposite substrate. This avoids that the single support structure 4 cannot withstand the cutting stress, thereby forming a good support for the two substrates when the frame is cut, and ensuring the encapsulation effect of the adhesive 3.
  • the spacing L2 between two adjacent support structures 4 is about 5-10 [mu]m.
  • the spacing L2 in this interval enables the plurality of support structures 4 to share the cutting stress well, avoiding damage to any of the support structures 4. At the same time, it also avoids cracks in the adhesive 3 to ensure the cutting effect of the bezel and the encapsulation effect of the adhesive 3.
  • the shape of the cross section of the support structure 4 perpendicular to its direction of extension on the display substrate is trapezoidal.
  • the bottom surface of the trapezoidal support structure 4 having a large area is in contact with the display substrate. This can ensure that the support structure 4 is firmly disposed on the display substrate, thereby ensuring that the support structure 4 supports the display substrate and the opposite substrate more firmly.
  • the shape of the above cross section of the support structure 4 may also be other shapes, such as a rectangle.
  • the adhesive 3 is a glass glue.
  • the glass glue is brittle and prone to cracks when the frame is cut.
  • the setting of the support structure 4 bears the cutting stress, so that the glass glue can be prevented from cracking when the frame is cut.
  • the opposite substrate is an array substrate, and the display substrate is a package cover.
  • the array substrate is an OLED substrate
  • the display substrate is a package cover plate that encapsulates the OLED elements on the OLED substrate.
  • the frame sealant usually adopts a glass frit which is relatively brittle. The support structure 4 can avoid cracking of the glass glue when the OLED display panel is cut by the frame, and ensure the package quality of the OLED display panel.
  • the display substrate may be a color filter substrate, and the opposite substrate may be an LCD substrate.
  • the color film substrate and the LCD substrate are combined to form an LCD display panel.
  • the support structure 4 can also function to prevent the frame sealant from being chipped or damaged during the cutting process.
  • the present disclosure also provides a method for preparing a display substrate, the display substrate including a display area and a frame area, the method comprising:
  • S510 providing a support structure on a side of the frame on a side of the adhesive that is away from the display area;
  • the adhesive applied to the frame area is sintered by a laser.
  • the support structure is formed using a conventional patterning process including film coating, exposure, development, and the like. I will not repeat them here.
  • the adhesive When the display substrate is bonded to the opposite substrate, the adhesive is melted into a viscous liquid by laser irradiation. The adhesive is highly reduced in height and widened in width by the mutual pressing of the display substrate and the opposite substrate. Finally, the accurately aligned display substrate and the opposite substrate are firmly bonded together by laser sintering. Since the outer side of the adhesive has a supporting structure, the supporting structure can block the outwardly overflowing adhesive, thereby controlling the morphology of the adhesive during the bonding process.
  • support is formed between the mutually aligned display substrate and the counter substrate by providing a support structure on the side of the bezel region away from the display region of the adhesive.
  • the support structure is arranged to prevent the adhesive from cracking when the frame is cut, thereby ensuring the adhesive property of the adhesive.
  • the adhesive will melt into a liquid state when bonded, and the support structure can effectively control the morphology of the liquid adhesive when the adhesive is bonded, so that the liquid adhesive does not overflow to the support structure.
  • the height and uniformity of the adhesive after curing are kept consistent, thereby avoiding the bonding surface of the adhesive and the opposite substrate and the surface of the film on the opposite display substrate and the opposite substrate.
  • the Newton's ring phenomenon finally ensures the encapsulation effect of the adhesive and the display effect of the display area.
  • a display device comprising the display substrate according to any of the foregoing embodiments.
  • the packaging effect of the display device is improved, and at the same time, the display device does not have a Newton's ring phenomenon on the package interface after packaging, thereby improving the display of the display device. effect.
  • the display panel provided by the present disclosure may be a liquid crystal panel, a liquid crystal television, an OLED panel, an OLED television, a display, a mobile phone, a navigator, and any other product or component having a display function.
  • the present disclosure provides a display substrate, a method of fabricating the same, and a display device.
  • the display substrate includes a display area and a bezel area surrounding the display area.
  • the border area is provided with a glue.
  • the adhesive is used to bond the display substrate and the opposing substrate to which it is bonded.
  • a support structure is provided on the frame area on the side of the adhesive that is away from the display area. The support structure forms a support between the display substrate and the opposite substrate that are aligned with each other.
  • the present disclosure also provides a display device including a display substrate according to the present disclosure.

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Abstract

一种显示基板及其制备方法并且提供了一种显示装置。该显示基板包括显示区域（1）以及包围该显示区域的边框区域（2）。该边框区域设置有粘结胶（3）。粘结胶用于将显示基板和与其对合的对置基板粘结在一起。在边框区域上、在粘结胶的远离显示区域的一侧设置有支撑结构（4）。该支撑结构在相互对合的显示基板和对置基板之间形成支撑。

Description

显示基板及其制备方法和显示装置
相关专利申请
本申请主张于2017年6月30日提交的中国专利申请No.201710523646.1的优先权，其全部内容通过引用结合于此。
技术领域
本公开涉及显示技术领域，具体地，涉及一种显示基板及其制备方法并且涉及一种显示装置。
背景技术
目前OLED显示器件通常采用玻璃胶进行边框封装。玻璃胶属于刚性材质。采用激光封装玻璃胶会引发各种不良。
发明内容
根据本公开的一方面，提供一种显示基板，包括显示区域和包围所述显示区域的边框区域。所述显示基板包括位于所述边框区域的粘结胶。所述粘结胶配置成粘结所述显示基板和与其对合的对置基板。所述显示基板还包括位于所述边框区域上、在所述粘结胶的远离所述显示区域的一侧的支撑结构。所述支撑结构配置成在相互对合的所述显示基板和所述对置基板之间形成支撑。
在一实施例中，所述支撑结构与所述粘结胶之间存在一间隙。
在一实施例中，所述间隙的宽度为约30～50μm。
在一实施例中，在粘结所述对置基板与所述显示基板之前，所述支撑结构的高度小于所述粘结胶的高度。
在一实施例中，所述粘结胶包括玻璃胶。
在一实施例中，所述显示区域还设置有隔垫物。
在一实施例中，所述支撑结构采用与所述隔垫物的材料相同。
在一实施例中，所述支撑结构与所述隔垫物的高度相同。
在一实施例中，所述显示基板包括相互间隔的多个所述支撑结构。
在一实施例中，两个相邻的所述支撑结构之间的间距为约5～10μm。
在一实施例中，所述支撑结构的、垂直于其在所述显示基板上的延伸方向的截面的形状为梯形，并且所述支撑结构的面积较大的底面与所述显示基板接触。
在一实施例中，所述支撑结构的、垂直于其在所述显示基板上的延伸方向的截面的形状为矩形。
在一实施例中，所述对置基板为阵列基板。
在一实施例中，所述显示基板为封装盖板或彩膜基板。
根据本公开的另一方面，提供一种显示装置，其包括根据上述实施例中的任意一个的显示基板。
根据本公开的又一方面，提供一种用于显示基板的制备方法，所述显示基板包括显示区域和边框区域，所述方法包括：
在所述边框区域涂敷粘结胶；
在所述边框区域上、在所述粘结胶的远离所述显示区域的一侧设置支撑结构；以及
对所述粘结胶进行烧结。
应该理解的是，除非有明确的相反说明，否则在本公开所述的包括多于一个步骤或行为的任何方法中，这些步骤或行为的顺序不一定限于所记叙的顺序。
附图说明
本发明的这些和其它方面将从下文描述的实施例而显而易见，并且将参考附图以示例性方式予以进一步阐释，在附图中：
图1为根据本公开实施例的显示基板的结构的示意性剖视图；
图2为根据本公开实施例的显示基板的支撑结构与粘结胶之间的间隙的示意性剖视图；
图3为图1的显示基板的窄边框切割的示意性剖视图；
图4为图1的显示基板的宽边框切割的示意性剖视图；以及
图5为根据本公开的用于显示基板的制备方法的流程图。
具体实施方式
发明人发现，采用激光封装玻璃胶后，封装区域存在应力。玻璃基板本身存在形变。玻璃基板越薄则形变量越大。当切割OLED显示 器件的边框时，由于玻璃基板的形变、玻璃胶的刚性以及封装区域中的应力，切割后的玻璃胶存在微裂痕的可能，这直接影响OLED显示器件的封装性能。
发明人还发现，激光烧结后玻璃胶的高度和均一性均发生变化。这容易导致玻璃胶与玻璃基板的粘结表面以及OLED显示器件的显示区域的膜层表面发生牛顿环现象。这不仅影响玻璃胶的封装效果，而且还影响显示区域的显示效果。
因此，如何在切割采用玻璃胶封框的OLED显示器件边框时避免出现上述不良现象已成为目前亟待解决的技术问题。
根据本公开的一方面，提供了一种显示基板。如图1所示，显示基板包括显示区域1和包围显示区域1的边框区域2。显示基板包括位于边框区域2的粘结胶3。粘结胶3配置成粘结显示基板和与其对合的对置基板。显示基板还包括位于边框区域2上、在粘结胶3的远离显示区域1的一侧的支撑结构4。支撑结构4配置成在相互对合的显示基板和对置基板之间形成支撑。
通过在边框区域2上、在粘结胶3的远离显示区域1的一侧提供支撑结构4，可以在相互对合的显示基板和对置基板之间形成支撑。当对对合的显示基板和对置基板进行边框切割时，切割线(即切割工具进行切割时行进的路线)通常垂直于显示基板且位于粘结胶3的远离显示区域1的一侧或者位于粘结胶3上。支撑结构4的设置能够防止边框切割时粘结胶3出现裂痕，从而确保粘结胶3的粘结性能。另外，粘结胶3在粘结时会熔融成为液态状。支撑结构4能够在粘结胶3粘结时有效地控制液态状粘结胶3的形貌，使液态状粘结胶3不会溢出至支撑结构4以外，从而使固化后的粘结胶3的高度和均一性均保持一致，进而避免粘结胶3与对置基板的粘结表面以及显示区域1内对合的显示基板与对置基板的膜层表面出现牛顿环现象，最终确保了粘结胶3的封装效果和显示区域1的显示效果。
在一实施例中，支撑结构4与粘结胶3相互接触，如图1所示。在另一实施例中，支撑结构4与粘结胶3之间也可以存在间隙L1，如图2所示。在这两种情形中，支撑结构4均能支撑对合的显示基板与对置基板。这避免切割使粘结胶3出现裂痕，同时避免粘结后出现牛顿环现象。
图3示出了对显示基板进行窄边框切割的情形。如图3所示，切割线5位于支撑结构4邻近粘结胶3的一侧或位于粘结胶3上，并且在边框切割后只剩下全部或部分粘结胶3，支撑结构4被切掉。图4示出了对显示基板进行宽边框切割的情形。如图4所示，切割线5位于支撑结构4远离粘结胶3的一侧，并且在边框切割后粘结胶3和支撑结构4均保留。无论是图3的窄边框切割还是图4的宽边框切割，支撑结构4都能够在对合的显示基板与对置基板之间形成支撑，以避免切割使粘结胶3出现裂痕。
在一实施例中，支撑结构4与粘结胶3之间形成的间隙L1的宽度为约30～50μm。该上述区间内，支撑结构4能在对合的显示基板与对置基板被边框切割时在上述两基板之间形成良好的支撑，以避免粘结胶3出现裂痕。
在一实施例中，在粘结显示基板与对置基板之前，支撑结构4的高度小于粘结胶3的高度。由于粘结胶3在粘结时会熔融形成液态状，所以粘结胶3在粘结时高度会减小。这使得粘结胶3在支撑结构4的辅助支撑作用下很好地粘结显示基板和对置基板。此外，这确保在粘结胶3固化后，显示基板和对置基板与粘结胶3之间均不产生间隙。
在一实施例中，显示区域1还设置有隔垫物。支撑结构4与隔垫物的材料相同。由于隔垫物通常由具有一定伸缩性的材料制成，隔垫物既能起到一定的支撑作用，又能避免在支撑过程中对其所支撑的两基板造成过大的支撑作用力，以避免损坏两基板。采用与隔垫物相同的材料的支撑结构4同样能起到上述作用，即确保良好的支撑作用，以及避免在边框切割过程中损坏对合的两基板。
需要说明的是，在支撑结构4的制备时，同时形成隔垫物。制备方法简单，且不会增加显示基板的额外制备工序。
在一实施例中，支撑结构4与隔垫物的高度相同。这能够确保显示区域1与边框区域2的盒间隙不存在差异，从而避免粘结胶3与对置基板的粘结表面以及显示区域1内对合的显示基板与对置基板的膜层表面出现牛顿环现象，最终确保了粘结胶3的封装效果和显示区域1的显示效果。
在一实施例中，显示基板包括相互间隔的多个支撑结构4。在一示例性实施例中，支撑结构4的个数为两个。两个支撑结构4能够分担 边框切割时的切割应力，从而进一步确保对显示基板和对置基板的良好支撑。这避免了单个支撑结构4无法耐受切割应力，从而在边框切割时对两基板形成良好的支撑，确保了粘结胶3的封装效果。
在一实施例中，两个相邻的支撑结构4之间的间距L2为约5～10μm。在这一区间内的间距L2能够使多个支撑结构4良好地对分担切割应力，避免对其中任意一个支撑结构4的损坏。这同时还避免粘结胶3出现裂痕，以确保边框的切割效果和粘结胶3的封装效果。
在一实施例中，支撑结构4的、垂直于其在显示基板上的延伸方向的截面的形状为梯形。梯形支撑结构4的面积较大的底面与显示基板接触。这能够确保支撑结构4牢固地设置在显示基板上，从而确保支撑结构4对显示基板和对置基板的支撑更加牢固。
需要说明的是，支撑结构4的上述截面的形状也可以是其他的形状，如矩形。
在一实施例中，粘结胶3为玻璃胶。玻璃胶的材质较脆，在边框切割时容易出现裂痕。支撑结构4的设置，承担了切割应力，因此能够避免边框切割时玻璃胶出现裂痕。
在一实施例中，对置基板为阵列基板，显示基板为封装盖板。在一示例性实施例中，阵列基板为OLED基板，显示基板为对OLED基板上的OLED元件进行封装的封装盖板。在OLED显示面板中，封框胶通常采用材质较脆的玻璃胶，支撑结构4能避免在对OLED显示面板进行边框切割时玻璃胶出现裂痕，确保OLED显示面板的封装质量。
需要说明的是，显示基板也可以为彩膜基板，对置基板也可以是LCD基板。彩膜基板与LCD基板对合形成LCD显示面板。在LCD显示面板的边框切割中，支撑结构4同样能够起到防止封框胶在切割过程中碎裂或被损坏的作用。
本公开还提供了一种用于显示基板的制备方法，该显示基板包括显示区域和边框区域，该方法包括：
S505：在边框区域涂敷粘结胶；
S510：在边框区域上、在粘结胶的远离显示区域的一侧设置支撑结构；以及
S515：对粘结胶进行烧结。
涂敷于边框区域的粘结胶通过激光来烧结。支撑结构采用包括膜 层涂敷、曝光、显影等步骤的传统的构图工艺来形成。此处不再赘述。
当显示基板与对置基板进行粘结时，通过激光照射使粘结胶熔融成粘稠的液体。粘结胶在显示基板与对置基板的相互挤压作用下高度变矮，宽度变宽。最后再次通过激光烧结将准确对位后的显示基板和对置基板牢固地粘结在一起。由于粘结胶的外侧有支撑结构，支撑结构能够对向外溢出的粘结胶进行遮挡，从而控制粘结胶在粘结过程中的形貌。
根据本公开的显示基板，通过在边框区域上、在粘结胶的远离显示区域的一侧设置支撑结构，在相互对合的显示基板和对置基板之间形成支撑。当对对合的显示基板和对置基板进行边框切割时，支撑结构的设置能够防止边框切割时粘结胶出现裂痕，从而确保粘结胶的粘结性能。另外，粘结胶在粘结时会熔融成为液态状，支撑结构能够在粘结胶进行粘结时有效地控制液态状粘结胶的形貌，使液态状粘结胶不会溢出至支撑结构以外，从而使粘结胶在固化后的高度和均一性均保持一致，进而避免粘结胶与对置基板的粘结表面以及显示区域内对合的显示基板与对置基板的膜层表面出现牛顿环现象，最终确保了粘结胶的封装效果和显示区域的显示效果。
根据本发明的另一方面，提供一种显示装置，包括根据前述实施例中的任意一个的显示基板。
通过采用前述实施例中的任意一个的显示基板，提高了该显示装置的封装效果，同时还使该显示装置在封装后在封装界面上不会出现牛顿环现象，从而提高了该显示装置的显示效果。
本公开所提供的显示面板可以为液晶面板、液晶电视、OLED面板、OLED电视、显示器、手机、导航仪、以及任何其他具有显示功能的产品或部件。
综上，本公开提供一种显示基板及其制备方法和一种显示装置。该显示基板包括显示区域和包围显示区域的边框区域。边框区域设置有粘结胶。粘结胶用于将显示基板和与其对合的对置基板粘结在一起。在边框区域上、在粘结胶的远离显示区域的一侧设置有支撑结构。支撑结构在相互对合的显示基板和对置基板之间形成支撑。本公开还提供了一种显示装置，其包括根据本公开的显示基板。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采 用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。
附图标记列表：
1：显示区域
2：边框区域
3：粘结胶
4：支撑结构
L1：间隙
L2：间距
5：切割线。

Claims (16)

  1. 一种显示基板，包括显示区域和包围所述显示区域的边框区域，
    其中所述显示基板包括位于所述边框区域的粘结胶，所述粘结胶配置成粘结所述显示基板和与其对合的对置基板，以及
    其中所述显示基板还包括位于所述边框区域上、在所述粘结胶的远离所述显示区域的一侧的支撑结构，所述支撑结构配置成在相互对合的所述显示基板和所述对置基板之间形成支撑。
  2. 根据权利要求1所述的显示基板，其中所述支撑结构与所述粘结胶之间存在一间隙。
  3. 根据权利要求2所述的显示基板，其中所述间隙的宽度为约30～50μm。
  4. 根据权利要求1所述的显示基板，其中在粘结所述显示基板与所述对置基板之前，所述支撑结构的高度小于所述粘结胶的高度。
  5. 根据权利要求1所述的显示基板，其中所述粘结胶包括玻璃胶。
  6. 根据权利要求1-5中任意一项所述的显示基板，其中所述显示区域还设置有隔垫物。
  7. 根据权利要求6所述的显示基板，其中所述支撑结构与所述隔垫物的材料相同。
  8. 根据权利要求6所述的显示基板，其中所述支撑结构与所述隔垫物的高度相同。
  9. 根据权利要求1所述的显示基板，其中所述显示基板包括相互间隔的多个所述支撑结构。
  10. 根据权利要求9所述的显示基板，其中两个相邻的所述支撑结构之间的间距为约5～10μm。
  11. 根据权利要求1所述的显示基板，其中所述支撑结构的、垂直于其在所述显示基板上的延伸方向的截面的形状为梯形，并且所述支撑结构的面积较大的底面与所述显示基板接触。
  12. 根据权利要求1所述的显示基板，其中所述支撑结构的、垂直于其在所述显示基板上的延伸方向的截面的形状为矩形。
  13. 根据权利要求1所述的显示基板，其中所述对置基板为阵列基板。
  14. 根据权利要求1所述的显示基板，其中所述显示基板为封装盖板或彩膜基板。
  15. 一种显示装置，包括根据权利要求1-14中任意一项所述的显示基板。
  16. 一种用于显示基板的制备方法，所述显示基板包括显示区域和边框区域，所述方法包括：
    在所述边框区域涂敷粘结胶；
    在所述边框区域上、在所述粘结胶的远离所述显示区域的一侧设置支撑结构；以及
    对所述粘结胶进行烧结。
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