CN112714967A - 显示装置及制备方法、电子设备 - Google Patents

显示装置及制备方法、电子设备 Download PDF

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Publication number
CN112714967A
CN112714967A CN201980001505.0A CN201980001505A CN112714967A CN 112714967 A CN112714967 A CN 112714967A CN 201980001505 A CN201980001505 A CN 201980001505A CN 112714967 A CN112714967 A CN 112714967A
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encapsulation layer
thin film
layer
array substrate
film encapsulation
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Pending
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CN201980001505.0A
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English (en)
Inventor
浦超
杨盛际
黄冠达
卢鹏程
陈小川
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Publication of CN112714967A publication Critical patent/CN112714967A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/879Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/351Thickness
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/123Connection of the pixel electrodes to the thin film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851Division of substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示装置、电子设备及显示装置的制备方法。该显示装置包括阵列基板和设置在阵列基板上的第一薄膜封装层。阵列基板为硅基有机发光二极管阵列基板,阵列基板包括:硅基板以及设置在硅基板上的发光器件;第二薄膜封装层,设置在发光器件与所述第一薄膜封装层之间;彩膜层,设置在第一薄膜封装层和所述第二薄膜封装层之间;在第一薄膜封装层的各条边处,阵列基板在平行于阵列基板的平面上的正投影均延伸超出第一薄膜封装层在平面上的正投影。该显示装置可以避免在切割面板时致使第一薄膜封装层产生裂纹,从而可以避免外界空气中的水氧从第一薄膜封装层的裂纹中入侵显示装置中的发光器件,提高了阻隔水氧的封装技术,延长显示装置的使用寿命。

Description

PCT国内申请,说明书已公开。

Claims (25)

  1. PCT国内申请,权利要求书已公开。
CN201980001505.0A 2019-08-27 2019-08-27 显示装置及制备方法、电子设备 Pending CN112714967A (zh)

Applications Claiming Priority (1)

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PCT/CN2019/102820 WO2021035530A1 (zh) 2019-08-27 2019-08-27 显示装置及制备方法、电子设备

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CN112714967A true CN112714967A (zh) 2021-04-27

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US (1) US11950486B2 (zh)
EP (1) EP4024490A4 (zh)
CN (1) CN112714967A (zh)
WO (1) WO2021035530A1 (zh)

Cited By (1)

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US20230165036A1 (en) * 2019-12-26 2023-05-25 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof

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CN112086577A (zh) * 2020-09-08 2020-12-15 武汉华星光电半导体显示技术有限公司 显示装置及其制备方法
CN114023906B (zh) * 2021-10-29 2023-09-01 京东方科技集团股份有限公司 显示面板、显示装置、待切割基板的制作方法

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US20060087230A1 (en) * 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
CN101447509B (zh) * 2008-12-26 2010-09-22 云南北方奥雷德光电科技股份有限公司 顶部发光全彩色微型有机显示器结构及其制造工艺
KR101267534B1 (ko) * 2009-10-30 2013-05-23 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
FR2958795B1 (fr) * 2010-04-12 2012-06-15 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
JP6135062B2 (ja) 2012-08-07 2017-05-31 セイコーエプソン株式会社 発光装置、発光装置の製造方法、電子機器
KR101907593B1 (ko) * 2013-08-13 2018-10-15 삼성디스플레이 주식회사 가요성 표시 장치
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KR20160000096A (ko) * 2014-06-23 2016-01-04 삼성디스플레이 주식회사 표시 장치
KR102089340B1 (ko) * 2016-08-31 2020-03-16 엘지디스플레이 주식회사 터치 센서를 가지는 유기 발광 표시 장치 및 그 제조 방법
KR101834792B1 (ko) 2016-08-31 2018-03-06 엘지디스플레이 주식회사 터치 센서를 가지는 유기 발광 표시 장치 및 그 제조 방법
KR20180047592A (ko) * 2016-10-31 2018-05-10 엘지디스플레이 주식회사 유기발광 표시장치와 그의 제조방법
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CN109841755A (zh) * 2019-03-08 2019-06-04 深圳市华星光电半导体显示技术有限公司 显示面板的制作方法、显示面板及电子设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230165036A1 (en) * 2019-12-26 2023-05-25 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
US11910638B2 (en) * 2019-12-26 2024-02-20 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof

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EP4024490A1 (en) 2022-07-06
US11950486B2 (en) 2024-04-02
US20230180582A1 (en) 2023-06-08
EP4024490A4 (en) 2022-08-24
WO2021035530A1 (zh) 2021-03-04

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