CN112714967A - 显示装置及制备方法、电子设备 - Google Patents
显示装置及制备方法、电子设备 Download PDFInfo
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- CN112714967A CN112714967A CN201980001505.0A CN201980001505A CN112714967A CN 112714967 A CN112714967 A CN 112714967A CN 201980001505 A CN201980001505 A CN 201980001505A CN 112714967 A CN112714967 A CN 112714967A
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- 238000005538 encapsulation Methods 0.000 claims abstract description 378
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- 239000010409 thin film Substances 0.000 claims abstract description 241
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 133
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 133
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- 229910052814 silicon oxide Inorganic materials 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 230000003190 augmentative effect Effects 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 28
- 239000001301 oxygen Substances 0.000 abstract description 28
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
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- 239000004593 Epoxy Substances 0.000 description 1
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- 239000004642 Polyimide Substances 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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- 239000002861 polymer material Substances 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
一种显示装置、电子设备及显示装置的制备方法。该显示装置包括阵列基板和设置在阵列基板上的第一薄膜封装层。阵列基板为硅基有机发光二极管阵列基板,阵列基板包括:硅基板以及设置在硅基板上的发光器件;第二薄膜封装层,设置在发光器件与所述第一薄膜封装层之间;彩膜层,设置在第一薄膜封装层和所述第二薄膜封装层之间;在第一薄膜封装层的各条边处,阵列基板在平行于阵列基板的平面上的正投影均延伸超出第一薄膜封装层在平面上的正投影。该显示装置可以避免在切割面板时致使第一薄膜封装层产生裂纹,从而可以避免外界空气中的水氧从第一薄膜封装层的裂纹中入侵显示装置中的发光器件,提高了阻隔水氧的封装技术,延长显示装置的使用寿命。
Description
PCT国内申请,说明书已公开。
Claims (25)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/102820 WO2021035530A1 (zh) | 2019-08-27 | 2019-08-27 | 显示装置及制备方法、电子设备 |
Publications (1)
Publication Number | Publication Date |
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CN112714967A true CN112714967A (zh) | 2021-04-27 |
Family
ID=74683344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980001505.0A Pending CN112714967A (zh) | 2019-08-27 | 2019-08-27 | 显示装置及制备方法、电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11950486B2 (zh) |
EP (1) | EP4024490A4 (zh) |
CN (1) | CN112714967A (zh) |
WO (1) | WO2021035530A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230165036A1 (en) * | 2019-12-26 | 2023-05-25 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and manufacturing method thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112086577A (zh) * | 2020-09-08 | 2020-12-15 | 武汉华星光电半导体显示技术有限公司 | 显示装置及其制备方法 |
CN114023906B (zh) * | 2021-10-29 | 2023-09-01 | 京东方科技集团股份有限公司 | 显示面板、显示装置、待切割基板的制作方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020025918A (ko) * | 2002-02-15 | 2002-04-04 | 박병주 | 습식 공정으로 제작된 유기 반도체 디바이스 및 유기전계발광 소자 |
US20060087230A1 (en) * | 2004-10-22 | 2006-04-27 | Eastman Kodak Company | Desiccant film in top-emitting OLED |
CN101447509B (zh) * | 2008-12-26 | 2010-09-22 | 云南北方奥雷德光电科技股份有限公司 | 顶部发光全彩色微型有机显示器结构及其制造工艺 |
KR101267534B1 (ko) * | 2009-10-30 | 2013-05-23 | 엘지디스플레이 주식회사 | 유기전계발광소자의 제조방법 |
FR2958795B1 (fr) * | 2010-04-12 | 2012-06-15 | Commissariat Energie Atomique | Dispositif optoelectronique organique et son procede d'encapsulation. |
JP6135062B2 (ja) | 2012-08-07 | 2017-05-31 | セイコーエプソン株式会社 | 発光装置、発光装置の製造方法、電子機器 |
KR101907593B1 (ko) * | 2013-08-13 | 2018-10-15 | 삼성디스플레이 주식회사 | 가요성 표시 장치 |
TW201539736A (zh) | 2014-03-19 | 2015-10-16 | 3M Innovative Properties Co | 用於藉白光成色之 oled 裝置的奈米結構 |
CN103972414A (zh) * | 2014-04-29 | 2014-08-06 | 京东方科技集团股份有限公司 | 一种有机电致发光器件及其封装方法 |
KR20160000096A (ko) * | 2014-06-23 | 2016-01-04 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102089340B1 (ko) * | 2016-08-31 | 2020-03-16 | 엘지디스플레이 주식회사 | 터치 센서를 가지는 유기 발광 표시 장치 및 그 제조 방법 |
KR101834792B1 (ko) | 2016-08-31 | 2018-03-06 | 엘지디스플레이 주식회사 | 터치 센서를 가지는 유기 발광 표시 장치 및 그 제조 방법 |
KR20180047592A (ko) * | 2016-10-31 | 2018-05-10 | 엘지디스플레이 주식회사 | 유기발광 표시장치와 그의 제조방법 |
JP7105543B2 (ja) | 2017-05-26 | 2022-07-25 | エルジー ディスプレイ カンパニー リミテッド | 有機表示素子 |
CN107275517A (zh) * | 2017-06-30 | 2017-10-20 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法和显示装置 |
CN109802055A (zh) * | 2019-02-27 | 2019-05-24 | 昆山工研院新型平板显示技术中心有限公司 | 显示面板及其制备方法及显示装置 |
CN109841755A (zh) * | 2019-03-08 | 2019-06-04 | 深圳市华星光电半导体显示技术有限公司 | 显示面板的制作方法、显示面板及电子设备 |
-
2019
- 2019-08-27 US US16/965,534 patent/US11950486B2/en active Active
- 2019-08-27 EP EP19932268.6A patent/EP4024490A4/en active Pending
- 2019-08-27 WO PCT/CN2019/102820 patent/WO2021035530A1/zh unknown
- 2019-08-27 CN CN201980001505.0A patent/CN112714967A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230165036A1 (en) * | 2019-12-26 | 2023-05-25 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and manufacturing method thereof |
US11910638B2 (en) * | 2019-12-26 | 2024-02-20 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
EP4024490A1 (en) | 2022-07-06 |
US11950486B2 (en) | 2024-04-02 |
US20230180582A1 (en) | 2023-06-08 |
EP4024490A4 (en) | 2022-08-24 |
WO2021035530A1 (zh) | 2021-03-04 |
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