CN112740414A - 显示装置及制备方法、电子设备 - Google Patents
显示装置及制备方法、电子设备 Download PDFInfo
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- CN112740414A CN112740414A CN201980001373.1A CN201980001373A CN112740414A CN 112740414 A CN112740414 A CN 112740414A CN 201980001373 A CN201980001373 A CN 201980001373A CN 112740414 A CN112740414 A CN 112740414A
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- organic light
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
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- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0782—Adhesive characteristics other than chemical being pressure sensitive
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示装置(1)、电子设备(100)及显示装置(1)的制备方法。该显示装置(1)包括硅基有机发光显示面板(10)、散热膜层(20)和柔性电路板(30)。该硅基有机发光显示面板(10)包括依次层叠设置的硅基板(11)、显示器件的第一极(13)、有机发光层(14)和显示器件的第二极(15)；该散热膜层(20)设置在硅基有机发光显示面板(10)的非显示侧；柔性电路板(30)至少部分设置在散热膜层(20)远离硅基有机发光显示面板(10)的一侧，且与硅基有机发光显示面板(10)电连接。该硅基板(11)上集成有栅极驱动电路(14)、数据驱动电路(142)和像素电路(110)，柔性电路板(30)配置为向栅驱动电路(141)、数据驱动电路(142)以及显示器件的第二极(15)传输电信号。该显示装置(1)通过采用散热膜层(20)可以实现硅基有机发光显示面板(10)的散热，提高了显示装置(1)的显示质量。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/101120 WO2021030971A1 (zh) | 2019-08-16 | 2019-08-16 | 显示装置及制备方法、电子设备 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112740414A true CN112740414A (zh) | 2021-04-30 |
Family
ID=74660131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980001373.1A Pending CN112740414A (zh) | 2019-08-16 | 2019-08-16 | 显示装置及制备方法、电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11588138B2 (zh) |
| CN (1) | CN112740414A (zh) |
| WO (1) | WO2021030971A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112715058B (zh) * | 2019-08-27 | 2023-05-16 | 京东方科技集团股份有限公司 | 显示装置及制备方法、散热膜层以及电子设备 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4926426B2 (ja) * | 2005-08-12 | 2012-05-09 | 株式会社半導体エネルギー研究所 | 電子機器 |
| JP6192153B2 (ja) * | 2012-07-31 | 2017-09-06 | 日東電工株式会社 | 表示装置およびその製造方法 |
| JP2014048643A (ja) | 2012-09-04 | 2014-03-17 | Mitsubishi Electric Corp | 画像表示装置 |
| US9899457B2 (en) * | 2015-04-24 | 2018-02-20 | Universal Display Corporation | Flexible OLED display having increased lifetime |
| CN105338792A (zh) | 2015-11-16 | 2016-02-17 | 余原生 | 一种热管导热结构及其制备工艺 |
| CN205303466U (zh) * | 2016-01-15 | 2016-06-08 | 京东方科技集团股份有限公司 | 一种柔性显示基板、显示装置 |
| CN105657967B (zh) | 2016-04-01 | 2019-05-21 | 京东方科技集团股份有限公司 | 柔性电路板和显示装置 |
| KR102552047B1 (ko) | 2016-11-24 | 2023-07-07 | 엘지디스플레이 주식회사 | 디스플레이 장치 |
| CN206907770U (zh) | 2017-06-06 | 2018-01-19 | 广州新视界光电科技有限公司 | 一种微型有机发光显示面板及微型有机发光显示装置 |
| KR102351372B1 (ko) * | 2017-07-06 | 2022-01-14 | 삼성전자주식회사 | 디스플레이를 구비한 전자장치 |
| CN207690416U (zh) | 2017-12-28 | 2018-08-03 | 信利光电股份有限公司 | 一种显示模组和触摸显示模组 |
| CN108102568A (zh) * | 2017-12-28 | 2018-06-01 | 张家港康得新光电材料有限公司 | 导热胶带及其制作方法 |
| KR102654593B1 (ko) * | 2018-06-01 | 2024-04-05 | 삼성디스플레이 주식회사 | 표시 장치 및 이를 포함한 전자 장치 |
| KR102093497B1 (ko) * | 2018-07-11 | 2020-03-26 | 삼성디스플레이 주식회사 | 표시모듈 및 이를 포함하는 표시장치 |
| KR102582263B1 (ko) * | 2018-08-20 | 2023-09-25 | 삼성디스플레이 주식회사 | 표시 장치와 그의 제조 방법 |
| KR102538829B1 (ko) * | 2018-09-18 | 2023-06-02 | 삼성디스플레이 주식회사 | 전자 장치 |
| CN109493748B (zh) | 2019-01-04 | 2021-01-22 | 京东方科技集团股份有限公司 | 显示模组、显示装置及显示模组的制作方法 |
-
2019
- 2019-08-16 WO PCT/CN2019/101120 patent/WO2021030971A1/zh active Application Filing
- 2019-08-16 US US16/959,623 patent/US11588138B2/en active Active
- 2019-08-16 CN CN201980001373.1A patent/CN112740414A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021030971A1 (zh) | 2021-02-25 |
| US20210408435A1 (en) | 2021-12-30 |
| US11588138B2 (en) | 2023-02-21 |
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