WO2019167447A1 - 基板搬送装置および基板搬送方法 - Google Patents

基板搬送装置および基板搬送方法 Download PDF

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Publication number
WO2019167447A1
WO2019167447A1 PCT/JP2019/000740 JP2019000740W WO2019167447A1 WO 2019167447 A1 WO2019167447 A1 WO 2019167447A1 JP 2019000740 W JP2019000740 W JP 2019000740W WO 2019167447 A1 WO2019167447 A1 WO 2019167447A1
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WIPO (PCT)
Prior art keywords
substrate
unit
holding
period
holding unit
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PCT/JP2019/000740
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English (en)
French (fr)
Japanese (ja)
Inventor
英司 深津
小河　豊
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Priority to CN201980015141.1A priority Critical patent/CN111788668A/zh
Priority to KR1020207017812A priority patent/KR102468631B1/ko
Publication of WO2019167447A1 publication Critical patent/WO2019167447A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • the present invention relates to a substrate transfer apparatus and a substrate transfer method for transferring a substrate.
  • the substrate is transferred by a transfer robot or the like.
  • a transfer robot In transporting a substrate, it is required that the substrate is correctly placed on the placement portion of the processing unit for processing the substrate, and that the processed substrate is correctly stored in the storage container. For this reason, for example, it is necessary to check each substrate with a sensor whether or not the substrate has been normally transported to the placement unit or the like by a transport robot or the like.
  • the substrate transfer apparatus described in Patent Document 1 includes a pick (hand) that holds a substrate when the substrate is transferred by the transfer unit.
  • the transport unit fixes and holds the substrate on the pick with the pressing body, and detects the holding state of the substrate based on the position of the pressing body.
  • the transfer unit releases the fixed holding by the pressing body when the substrate is transferred to a predetermined position such as the placement unit.
  • the substrate In the substrate detection operation by the pressing body described in Patent Document 1, the substrate is not detected when the pick retreats after passing the substrate to a predetermined position. For this reason, it is impossible to detect a state in which the substrate remains on the pick, for example, on the retreating pick. In this case, even though the substrate cannot be transferred to the predetermined position, this cannot be detected. As described above, in the technique described in Patent Document 1, since it is not possible to detect that the substrate has been transferred to a predetermined position by the transport unit, it may not be possible to detect a transport failure.
  • an embodiment of the present invention provides a substrate transfer apparatus and a substrate transfer method that can reliably detect that a substrate has been transferred to a predetermined position.
  • the substrate transport apparatus includes a holding unit that holds a substrate, a reciprocating mechanism that reciprocates the holding unit with respect to a predetermined position, and an optical sensor that forms a sensor area on a path along which the holding unit moves by the reciprocating mechanism. And a control unit.
  • the controller determines a conveyance abnormality in the substrate transfer operation.
  • the substrate transfer operation includes an outward operation in which the holding unit is moved toward a predetermined position by the reciprocating mechanism and a return operation in which the holding unit is moved away from the predetermined position by the reciprocating mechanism.
  • the control unit detects a first passage period (duration) in which the holding unit or a substrate held by the holding unit (hereinafter referred to as a “holding substrate”) passes through the sensor area in a substrate transfer operation;
  • a first passage period in which the holding unit or a substrate held by the holding unit (hereinafter referred to as a “holding substrate”) passes through the sensor area in a substrate transfer operation;
  • the first passage period is different from a preset first normal period, it is determined that the conveyance is abnormal.
  • the predetermined position is a position in a substrate storage container for storing a substrate
  • the optical sensor forms the sensor area outside the substrate storage container.
  • the sensor area of the optical sensor is set to a position for detecting a substrate placed in a state of being shifted out of the substrate storage container.
  • the holding portion fixes the substrate by extending the contact portion that contacts one end portion of the substrate and the other end portion of the substrate toward the contact portion.
  • a position shift prevention mechanism that can be expanded and contracted, and an expansion / contraction detection unit that detects an expansion / contraction operation of the position shift prevention mechanism.
  • the positional deviation prevention mechanism fixes the substrate during the forward movement, and releases the fixation of the substrate during the backward movement.
  • the expansion / contraction detection unit detects the extension of the misalignment prevention mechanism when the misalignment prevention mechanism fixes the substrate, and detects the misalignment prevention mechanism when the misalignment prevention mechanism releases the fixation of the substrate. Detects contraction.
  • the holding portion is a flat plate-like member that is flat in the horizontal direction, and at least a portion of the plate-like member that overlaps the substrate when the substrate is held in a plan view is hollowed out.
  • the holding unit normally holds the substrate, the substrate overlaps all of the hollow regions of the plate-like member in a plan view, and the holding unit is moved by the reciprocating mechanism.
  • the hollow region of the holding portion passes through the path.
  • the optical sensor is a transmissive sensor that forms a linear sensor area along an optical axis
  • the control unit is configured to transmit the light projected by the transmissive sensor to the holding unit.
  • a period during which light is shielded by the holding substrate is detected as the first passage period.
  • the optical sensor is a reflective sensor that forms the sensor area with a light beam
  • the control unit is configured such that the light beam projected by the reflective sensor is transmitted by the holding unit or the holding substrate. A period in which the light is reflected and received by the reflective sensor is detected as the first passage period.
  • the control unit determines a conveyance abnormality during a receiving operation of receiving a substrate at a predetermined position by the holding unit.
  • the substrate receiving operation includes an outward operation in which the holding unit is moved toward a predetermined position by the reciprocating mechanism and a return operation in which the holding unit is moved away from the predetermined position by the reciprocating mechanism.
  • the control unit detects a second passage period in which the holding unit or the holding substrate passes through the sensor area, and the second passage period is different from a preset second normal period. It is determined that the conveyance is abnormal.
  • the first normal period and the second normal period have the same length.
  • control unit sets a first normal period or a second normal period according to a moving speed of the holding unit by the reciprocating mechanism.
  • control unit determines a moving speed of the holding unit by the reciprocating mechanism in the return path operation during the passing operation, and a moving speed of the holding unit by the reciprocating mechanism in the forward path operation. Make it slower.
  • the substrate transport method includes a first forward path step of moving a holding unit holding a substrate toward a predetermined position, a passing step of executing an operation of transferring the substrate from the holding unit to a predetermined position, and the holding unit after the passing step.
  • a first detection step for detecting a first passage period through which a substrate held by the holding unit (hereinafter referred to as “holding substrate”) passes, and a first passage period detected in the first detection step are set in advance.
  • the holding portion fixes the substrate by extending the contact portion that contacts one end portion of the substrate and the other end portion of the substrate toward the contact portion. And a retractable mechanism capable of extending and contracting. Then, in the first forward path step, the other end portion of the substrate is pushed toward the contact portion by the misalignment prevention mechanism to fix the substrate and prevent misalignment, and the misalignment prevention mechanism expands and contracts. Detect motion. In the first return path step, the fixing by the misalignment prevention mechanism is released.
  • the moving speed of the holding unit by the reciprocating mechanism in the first return path operation is slower than the moving speed of the holding unit by the reciprocating mechanism in the first forward path operation.
  • the method includes a second forward step of moving the holding unit toward the substrate at a predetermined position, and a receiving step of receiving the substrate at the predetermined position by the holding unit. And the holding part or the holding substrate passes through the sensor area in a period including a second return path process for retracting the holding part from a predetermined position after the receiving process, a second forward path process, and a second return path process.
  • the first normal period and the second normal period have the same length.
  • FIG. 1A is a plan view showing a schematic configuration of the substrate processing apparatus
  • FIG. 1B is a side view showing a schematic configuration of the substrate processing apparatus.
  • the substrate processing apparatus 1 is an apparatus for processing a substrate with a chemical solution.
  • the substrate processing apparatus 1 is a single wafer type apparatus for performing chemical treatment on the surface (upper surface) of the substrate W.
  • substrate W is a plate-shaped member by which the function part for implement
  • the chemical solution process is a process used in the main processes of the semiconductor manufacturing process, such as a cleaning process, an etching process, a resist coating process, and a development process.
  • the substrate processing apparatus 1 includes a load port LP, an indexer unit 2, a processing unit 3, a pass unit 4, and a controller 6.
  • the load port LP is disposed at one end of the substrate processing apparatus 1, and a plurality of load ports LP are disposed at intervals in the arrangement direction A in plan view.
  • Each load port LP is configured to hold the substrate storage container 5 that stores the substrate W, and is a substrate introduction unit that introduces the substrate W into the substrate processing apparatus 1.
  • the substrate storage container 5 is an example of a placement unit on which the substrate W is placed.
  • the substrate W is supplied from the substrate storage container 5 into the substrate processing apparatus 1.
  • the indexer unit 2 is a unit that is connected to the load port LP and carries the substrate W into / out of the substrate storage container 5.
  • the processing unit 3 includes a plurality of processing units 31 and performs a chemical process on the substrate W.
  • the pass unit 4 is a unit that holds the substrate W between the indexer unit 2 and the processing unit 3.
  • the control unit 6 controls the substrate processing apparatus 1.
  • the substrate processing apparatus 1 includes twelve processing units 12 in this embodiment. More specifically, the substrate processing apparatus 1 includes three sets of processing units 3 stacked in the vertical direction, and each processing unit 3 includes four processing units 31 arranged in a plane. . Furthermore, the substrate processing apparatus 1 includes a transport unit that transports the substrate. For example, the transport unit includes an indexer robot IR provided in the indexer unit 2 and a center robot CR provided in the processing unit 3.
  • the indexer unit 2 is disposed between the load port LP and the processing unit 3.
  • An indexer robot IR is installed inside the indexer unit 2.
  • a user interface 220 is attached to the side surface of the indexer unit 2.
  • the user interface 220 includes a display unit that displays the state of the substrate processing apparatus 1, and is configured to be able to operate the substrate processing apparatus 1 and input information using a touch panel provided in the display unit. ing. Operation and input to the substrate processing apparatus 1 are not limited to a touch panel, and may be performed with a keyboard or a mouse.
  • the indexer robot IR takes out the unprocessed substrate W stored in the substrate storage container 5 and transports it to the pass unit 4.
  • the unprocessed substrate W is held by the pass unit 4.
  • the indexer robot IR transports the substrate W from the pass unit 4 to the substrate storage container 5.
  • the indexer robot IR includes two hands H1 provided in a stacked state on the top and bottom (see FIG. 2), and these are examples of holding units.
  • Each hand H1 is a flat plate-like member that is flat in the horizontal direction in plan view, and has one end connected to the support portion 21 (see FIG. 3). The other end has a hollow shape in which at least a part of a portion overlapping the substrate W when the substrate W is held is hollowed out.
  • Each hand H1 can hold one substrate W in a horizontal posture.
  • the indexer robot IR moves the hand H1 in the horizontal direction and the vertical direction. Further, the indexer robot IR changes the direction of the hand H1 by rotating (spinning) around the vertical axis.
  • the indexer robot IR can move along the movement path M (see FIG. 1) in the indexer unit 2.
  • the movement path M is designed in parallel with the arrangement direction of the plurality of load ports LP.
  • the indexer robot IR can move along the movement path M to an indexer delivery position facing an arbitrary substrate storage container 5, and the hand H ⁇ b> 1 enters the inside of the opposing substrate storage container 5 at the indexer delivery position. Can be made.
  • the indexer robot IR moves the hand H1 in the horizontal direction at the indexer delivery position, thereby causing the hand H1 to enter and retreat with respect to the substrate storage container 5.
  • the indexer robot IR moves the hand H1 into the substrate storage container 5 while holding the substrate W, and performs a carry-in operation (passing operation) that moves backward after placing the substrate W on the substrate storage container 5. Further, the indexer robot IR performs a carry-out operation (reception operation) in which the substrate storage container 5 enters the hand H1 and retreats after holding the substrate W stored in the substrate storage container 5.
  • the indexer robot IR is a substrate transfer device that delivers the substrate W to a predetermined position in the substrate storage container 5.
  • the indexer robot IR performs the same operation on the pass unit 4.
  • the center robot CR has a structure similar to that of the indexer robot IR, and includes two hands H2 provided in a stacked state in the vertical direction, and these are examples of holding units.
  • Each hand H2 is a flat plate member that is flat in the horizontal direction when seen in a plan view, and has one end connected to the support portion 21 (see FIG. 3).
  • the other end of the hand H2 has a hollow shape in which at least a part of a portion that overlaps the substrate W when the substrate W is held is hollowed out.
  • Each hand H2 can hold one substrate W in a horizontal posture.
  • the center robot CR moves the hand H2 in the horizontal direction and the vertical direction. Further, the center robot CR changes the direction of the hand H2 by rotating (spinning) about the vertical axis.
  • the center robot CR is surrounded by a plurality of processing units 31 in plan view.
  • the center robot CR makes the hand H2 face the arbitrary processing unit 31 when carrying the substrate.
  • the center robot CR moves (rotates) to a processing unit delivery position where the hand H2 can enter the processing unit 31 at a position where any processing unit 31 and the hand H2 face each other.
  • the center robot CR moves the hand H2 in the horizontal direction at the processing unit delivery position to enter and retreat the processing unit 31.
  • the center robot CR performs a carry-in operation (passing operation) in which the hand H2 enters the processing unit 31 while holding the substrate W, and retreats after the substrate W is placed on the processing unit 31.
  • the center robot CR performs a carry-out operation (reception operation) in which the processing unit 31 enters the hand H1 and moves backward after holding the substrate W placed on the processing unit 31.
  • the center robot CR is a substrate transfer device that delivers the substrate W to a predetermined position in the processing unit 31.
  • the center robot CR performs the same operation on the pass unit 4.
  • the center robot CR transports unprocessed substrates W held in the pass unit 4 to each processing unit 31 one by one.
  • the center robot CR transports the substrate W between the plurality of processing units 31 as necessary.
  • the center robot CR transports the substrate W processed by the processing unit 31 from the processing unit 31 to the pass unit 4.
  • the processing unit 31 processes the substrate W.
  • the process performed by the processing unit 31 is, for example, a cleaning process.
  • the processing performed by the processing unit 31 may be other processing instead of the cleaning processing.
  • the other treatment is, for example, a chemical treatment such as an etching treatment, a coating treatment, and a development treatment, or a heat treatment such as a heating treatment and a cooling treatment.
  • FIG. 2 is a side view showing a schematic configuration of the load port and the indexer unit.
  • the same components as those described above are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the substrate storage container 5 which is a mounting portion of the substrate W is a container configured to store a plurality of substrates W.
  • the substrate storage container 5 is, for example, a FOUP (FRONT Opening Unified Pod) that stores the substrate W in a sealed state.
  • the substrate storage container 5 may be a SMIF (Standard Mechanical InterFace) pod, OC (Open Cassette), or the like instead of the FOUP.
  • the substrate storage container 5 when the substrate storage container 5 is installed in the load port LP, a plurality of horizontal substrates W are stacked vertically in the substrate storage container 5 with a space therebetween.
  • the substrate storage container 5 stores, for example, 25 substrates W. However, in FIG. 2, a part of the substrate W is not shown for convenience.
  • the substrate storage container 5 has a housing 5a, a lid 5b, and a plurality of substrate guide portions 5c.
  • the lid 5b is removable on the front surface of the housing 5a, and the inside of the housing 5a is sealed by attaching the lid 5b to the front surface of the housing 5a. When the lid 5b is removed, an opening B is formed on the front surface of the housing 5a.
  • 25-stage substrate guide portions 5c are provided.
  • the substrate guide portions 5c at each stage are provided as a pair on the left and right inner walls of the substrate storage container 5 as viewed from the lid 5b side, and extend horizontally in the front-rear direction.
  • the substrate guide portion 5c supports the substrate W by supporting the end portion on the lower surface side of the substrate W.
  • the load port LP is connected to the indexer unit 2 and is installed on the side opposite to the processing unit 3.
  • the load port LP includes an installation table 35, a stage 32, and a load port opening / closing mechanism 34.
  • the installation base 35 is disposed on the side of the partition wall 7 and houses a driving mechanism such as an electric motor in the lower part. This drive mechanism is connected to the shutter drive unit 34b and drives it.
  • the stage 32 is disposed on the upper horizontal surface 35a of the installation base 35, and is provided so as to be movable in the horizontal direction so as to be close to and away from the indexer unit 2 (see a two-dot chain line C).
  • the substrate storage container 5 is placed on the stage 32, and is connected to the indexer unit 2 when the stage 32 moves close to the indexer unit 2.
  • a load port opening L communicating with the partition wall passage hole 7a is provided in the upper vertical surface 35b of the installation table 35.
  • the load port opening / closing mechanism 34 includes a shutter member 34a and a shutter drive unit 34b.
  • the shutter member 34 a closes the load port opening L by fitting into the load port opening L.
  • the shutter member 34a has a mechanism for holding the lid 5b. Normally, the shutter member 34a is fitted in the load port opening L and closes the load port opening L.
  • the shutter drive unit 34b is connected to the shutter member 34a.
  • the shutter drive unit 34b moves the shutter member 34a in the horizontal direction and the vertical direction.
  • the shutter member 34a has a mechanism for holding the lid 5b.
  • the shutter drive unit 34b moves the shutter member 34a from the load port LP to the indexer unit 2 side (refer to the two-dot chain line arrow D) while the shutter member 34a holds the lid 5b, so that the lid 5b is removed from the substrate storage container 5. To leave. Further, when the shutter member 34a moves vertically downward (see the two-dot chain line arrow E), the substrate storage container 5 and the indexer unit 2 communicate with each other, and the hand H1 of the indexer robot IR enters the substrate storage container 5. It becomes possible.
  • the shutter drive unit 34 b is driven by a drive mechanism housed in the lower part of the installation table 35.
  • the drive mechanism is typically composed of an electric motor and a ball screw, but is not limited thereto, and may be a drive mechanism using a cylinder.
  • the optical sensor 8 is a sensor that optically detects the presence or absence of an object.
  • the optical sensor 8 may be a transmissive sensor.
  • the optical sensor 8 forms a sensor area on the path along which the hand H1 moves.
  • the optical sensor 8 having the form of a transmissive sensor has a light projecting unit 8a and a light receiving unit 8b.
  • the light projecting unit 8a and the light receiving unit 8b are installed with their optical axes aligned so as to face each other in the vertical position of the load port opening L.
  • the optical sensor 8 forms a linear sensor area along the optical axis between the light projecting unit 8a and the light receiving unit 8b.
  • the optical sensor 8 having the form of a transmissive sensor detects a light projection state and a light shielding state.
  • the light projecting state refers to a state in which light projected from the light projecting unit 8a is received by the light receiving unit 8b without being blocked.
  • the light blocking state refers to a state in which light projected from the light projecting unit 8a is blocked by an object passing through the sensor area and is not received by the light receiving unit 8b.
  • the indexer robot IR transports the substrate W to the substrate storage container 5
  • the hand H1 main body or the substrate W held by the hand H1 is an optical path (sensor area) between the light projecting unit 8a and the light receiving unit 8b. Block.
  • the detection state of the optical sensor 8 is switched between the light projection state and the light shielding state depending on whether the hand H1 main body or the substrate W is in the sensor area.
  • the optical sensor 8 outputs an ON / OFF signal for turning on the light projection state and turning off the light shielding state to the determination unit 62 (see FIG. 4).
  • the optical sensor 8 may have the form of a reflective sensor.
  • the optical sensor 8 in the form of a reflective sensor has a light projecting portion 8c and a light receiving portion 8d, which are installed at the lower position or the upper position of the load port opening L (in FIG. Shows an example of installation at a location).
  • the optical sensor 8 having the form of a reflective sensor is arranged so that the optical axis of the light projecting unit 8c and the optical axis of the light receiving unit 8d intersect in the sensor area.
  • the sensor area is set in the load port opening L on the passage of the hand H1 or the substrate W held by the hand H1.
  • a sensor area is defined by a light beam projected from the light projecting unit 8c, reflected by an object in the passage path, and received by the light receiving unit 8d.
  • the optical sensor 8 having the form of a reflective sensor detects a light projection state and a reflection state.
  • the light projection state refers to a state in which the light projected from the light projecting unit 8c is not received by the light receiving unit 8d.
  • the reflection state refers to a state in which light projected from the light projecting unit 8c is reflected by an object passing through the sensor area, and the reflected light is received by the light receiving unit 8d.
  • the hand H1 main body or the substrate W held by the hand H1 reflects the light projected from the light projecting unit 8c and reflects the reflected light. Is received by the light receiving unit 8d.
  • the optical sensor 8 switches between the light projection state and the reflection state depending on whether the hand H1 or the substrate W is in the sensor area. For example, the optical sensor 8 outputs an ON / OFF signal for turning on the light projection state and turning off the reflection state to the determination unit 62 (see FIG. 4).
  • the passing object passing through the space can be accurately detected from the ON / OFF signal without blocking the passage route of the passing object passing through the space.
  • the indexer unit 2 is covered with a partition wall 7. Thereby, the inside of the indexer unit 2 is isolated from the external atmosphere and maintained in a clean environment.
  • the partition wall 7 connected to the load port LP is provided with a partition wall passage hole 7a for allowing the substrate W to pass therethrough.
  • An indexer robot IR is disposed on the bottom 7 b of the indexer unit 2.
  • the indexer robot IR has two hands H1, a base unit 25, an elevating unit 26, a connecting unit 27, and a pair of extendable units 28.
  • the base portion 25 is fixed to the bottom portion 7b of the indexer unit and forms a base for the indexer robot IR.
  • the elevating part 26 extends vertically upward from the base part 25 and has an elevating mechanism inside.
  • the lifting mechanism is typically composed of a motor, an encoder, and a ball screw, but may be composed of a cylinder.
  • the elevating part 26 can change the stop position of the hand H1 in the vertical direction. Specifically, the elevating unit 26 can adjust the height position of the hand H1 to the pickup position (lower position) and the place position (upper position).
  • the pickup position is a height position at which the uppermost portion of the claw guide portion 22 (see FIG. 3B) of the hand H1 is lower than the lower surface of the substrate W to be unloaded when the substrate W is unloaded from the substrate storage container 5.
  • the place position is a height position where the lower surface of the hand H1 is higher than the upper surface of the substrate guide portion 5c when the substrate W is carried into the substrate storage container 5. Details of the configuration of the hand H1 will be described later.
  • the connecting part 27 connects the elevating part 26 and the extendable part 28, and transmits the elevating operation of the elevating part 26 to the extendable part 28.
  • the connecting part 27 connects the two stretchable parts 28 to the upper part thereof.
  • Each expansion / contraction part 28 has connected the support part 21 which supports the hand H1 to the upper part.
  • the two extendable portions 28 and the two corresponding support portions 21 are respectively connected to the two hands H1, and the two hands H1 can be individually moved forward and backward.
  • the expansion / contraction part 28 has a plurality of joints, and performs expansion / contraction operation by rotationally driving the joint parts.
  • the expansion / contraction part 28 can change the horizontal position of the hand H1 by an expansion / contraction operation.
  • the position (solid line) where the joint of the expansion / contraction part 28 is contracted in the horizontal direction is the home position HM (regression position), and the position where the joint is extended in the horizontal direction (two-dot chain line F) is the forward position. FW (advance position).
  • the home position HM is a reference position in the horizontal direction of the hand H1.
  • the expansion / contraction part 28 can reduce an installation space by expanding and contracting a plurality of joints. The same applies to the lower hand H1.
  • the expansion / contraction part 28 comprises the reciprocation mechanism which reciprocates the hand H1.
  • the indexer unit 2 acquires the unprocessed substrate W from the substrate storage container 5 by the indexer robot IR and passes it to the pass unit 4.
  • the substrate W processed by the processing unit 31 is placed on the pass unit 4.
  • the processed substrate W can be transported and stored in the substrate storage container 5 by the indexer robot IR.
  • FIG. 3A is a plan view showing a schematic configuration of the hand
  • FIG. 3B is a side view showing a schematic configuration of the hand. Detailed description will be omitted by giving the same reference numerals to the above-described configuration.
  • the hand H1 includes a main body 20, a support portion 21, a claw guide portion 22, a back guide portion 23, and a pusher portion 24.
  • the main body 20 is a flat plate member that is flat in the horizontal direction in plan view (top view), and has one end connected to the support portion 21.
  • the other end has a hollow shape in which at least a part of a portion overlapping the substrate W when the substrate W is held is hollowed out.
  • the main body 20 can hold the substrate W in a horizontal posture.
  • the hollow shape is a V-shape.
  • the main body 20 is made of a lightweight and strong material such as ceramics or aluminum.
  • the optical sensor 8 can easily detect whether or not the substrate W is on the hand H1 because the hand H1 has a hollow shape. Specifically, when the hand H1 is holding the substrate W, the substrate W overlaps the hollow area of the hand H1. By detecting the overlapping portion of the substrate W with the optical sensor 8, it can be easily detected that the substrate W is held on the hand H1. As will be described later, even when the substrate W exists on the hand H1, the substrate W overlaps the hollow area of the hand H1. By detecting the overlapping portion of the substrate W with the optical sensor 8, it can be easily detected that the substrate W is on the hand H1.
  • the nail guide portion 22 is installed at each V-shaped tip of the main body 20 and has an L-shape when viewed from the side.
  • the claw guide portion 22 has a structure in which the substrate W is supported from below by the flat surface portion 22a and the peripheral end portion of the substrate W is supported by the side surface portion 22b.
  • the back guide part 23 is installed on the support part 21 side from the claw guide part 22 on the surface of the main body 20 and is arranged at a certain distance from the claw guide part 22 so as to support the substrate W.
  • the back guide portion 23 has a substantially cylindrical shape, and includes an inclined portion having an inclination that becomes narrower upward from the middle stage of the cylinder, and is configured to support the peripheral end portion of the substrate W at the inclined portion. Has been.
  • the substrate W is supported at four points of two claw guide portions 22 and two back guide portions 23. Thereby, compared with the case where it is directly supported by the whole surface of the main body 20, the contact area with the back surface and edge part of the board
  • substrate W can be reduced according to it.
  • the upper surface of the substrate W held by the claw guide portion 22 and the back guide portion 23 is lower than the uppermost portions of the claw guide portion 22 and the back guide portion 23. Therefore, the substrate W cannot be easily detached from the hand H1.
  • the pusher part 24 has a movable part 24a and a fixed part 24b.
  • the movable portion 24a is connected to the fixed portion 24b, and the fixed portion 24b is fixed to the support portion 21.
  • the movable part 24a is an extendable part that can be expanded and contracted in a direction (a two-dot chain line arrow G in FIG. 3A) extending horizontally in the main body 20.
  • the movable portion 24a expands and contracts by being driven by, for example, a spring, a cylinder, a motor, or the like.
  • the substrate W is placed on the hand H1
  • the substrate W is supported by the claw guide portion 22 and the back guide portion 23.
  • the movable portion 24a extends toward the substrate W, whereby the substrate W can be sandwiched and held.
  • the movable portion 24a extends toward the substrate W, the end portion of the substrate W is pushed in, the end portion of the substrate W is pressed against the side surface portion 22b of the claw guide portion 22, and the movable portion 24a and the claw guide portion 22 are pressed.
  • the substrate W is sandwiched between and fixedly held.
  • the movable portion 24a contracts, the movable portion 24a is separated from the end portion of the substrate W to release the fixed holding.
  • the indexer robot IR or the center robot CR transports the substrate W, if the linear movement operation or the rotation operation is performed at a high speed, the substrate W may be dropped due to vibration or inertia force.
  • the pusher portion 24 functions as a misalignment prevention mechanism that prevents misalignment of the substrate W by fixing and holding the substrate W on the hand H1. Therefore, even when the indexer robot IR or the center robot CR is moving straight ahead or rotating at a high speed, the positional deviation of the substrate W can be prevented. Since the substrate W is fixed and held, there is no possibility of dropping the substrate W, and therefore the indexer robot IR and the center robot CR can perform high-speed movement similar to the state in which the hand H1 does not hold the substrate W.
  • the pusher unit 24 has a pusher detection unit 29 (expansion / contraction detection unit).
  • the pusher detection unit 29 detects the extension amount of the movable unit 24a. If the movable part 24a extends beyond a certain extension amount, the movable part 24a can hold the substrate W in a fixed manner. For example, the pusher detection unit 29 detects a stretched state when the movable portion 24a is equal to or greater than a certain extension amount, and detects a contraction state when the movable portion 24a is less than a certain stretch amount.
  • the pusher detection unit 29 outputs, for example, an ON / OFF signal to the determination unit 62 in which the expanded state is an ON signal and the contracted state is an OFF signal.
  • the determination unit 62 determines that the substrate W is in the fixed holding state if the signal output from the pusher detection unit 29 is ON, and determines that the substrate W is in the fixed release state if the signal is OFF.
  • the certain amount of expansion is determined from design data, past results, and the like, and is stored in the storage unit 61. For example, instead of detecting the extension amount by the pusher detection unit 29, the extension amount may be detected from an image captured by camera photography.
  • FIG. 4 is a block diagram of the control system. As shown in FIG. 4, the control unit 6 controls each component of the substrate processing apparatus 1.
  • the control unit 6 includes a determination unit 62, a storage unit 61, a drive control unit 63, and a process control unit 64.
  • the storage unit 61 stores information necessary for controlling each component of the substrate processing apparatus 1. For example, in the substrate passing operation in which the indexer robot IR passes the substrate W held by the hand H1 to the substrate storage container 5, the storage unit 61 receives an OFF signal output from the optical sensor 8 when the substrate W is normally passed. The duration is stored as a normal period.
  • the indexer robot IR moves the hand H1 holding the substrate W from the home position HM to the forward position FW, and moves the hand H1 from the place position to the pickup position vertically downward and holds it in the hand H1.
  • the substrate W is composed of a placement movement for placing the substrate W on the substrate guide portion 5c and a return path movement for moving the hand H1 from the forward position FW to the home position HM.
  • the normal period is a period in which the substrate W is normally transported, which is determined based on design data, evaluation data, past results, and the like, and can be arbitrarily changed according to the moving distance and moving speed of the hand H1. Further, in the normal period, in consideration of a minute time lag due to operation variation, a certain margin may be provided on the plus side and / or the minus side.
  • the storage unit 61 stores, as a normal timing signal, an ON signal output from the pusher detection unit 29 at the start of the forward movement (home position HM) in the board transfer operation. Further, the storage unit 61 stores, as a normal timing signal, an OFF signal output from the pusher detection unit 29 at the end of the forward movement (forward position FW) in the substrate transfer operation.
  • These normal timing signals are determined from design data, evaluation data, past results, and the like.
  • the normal timing signal may have a certain margin on the plus side and / or the minus side in consideration of a minute time lag due to operational variations.
  • the storage unit 61 uses, as the normal fixed holding pattern NHP, the ON / OFF signal pattern output in time series from the pusher detecting unit 29 when the substrate W is normally fixed and held and released in the substrate transfer operation.
  • the normal fixed holding pattern NHP is determined until the indexer robot IR moves forward from the home position HM to the forward position FW in a state where the substrate W is fixedly held by the hand H1, and the fixing of the hand H1 is released. This represents switching of time-series ON / OFF signals output from the pusher detection unit 29 during the period.
  • the normal fixed holding pattern NHP is determined from design data, evaluation data, past results, and the like.
  • the normal fixed holding pattern NHP may have a certain margin on the plus side and / or the minus side in consideration of a minute time lag due to operational variations.
  • the storage unit 61 stores various recipes representing a series of device operations.
  • the storage unit 61 stores an abnormal recipe.
  • the determination unit 62 determines that there is an abnormality based on the ON / OFF signal detected by the optical sensor 8 during the substrate transfer operation
  • the abnormality time recipe is used when the control operation is performed on each component of the substrate processing apparatus 1. used.
  • the storage unit 61 immediately stops, for example, the indexer robot IR and the shutter drive unit 34b as an abnormality recipe, further stops the processing unit 31 after processing, stops the center robot CR after carrying the substrate, and indicates an abnormality. It remembers a series of device operations that generate an alarm. The same applies to an abnormal recipe based on an ON / OFF signal from the pusher detection unit 29.
  • the recipe at the time of abnormality that is, the operation of the apparatus when the abnormality occurs can be arbitrarily changed.
  • the determination unit 62 sets the duration of the OFF signal output from the optical sensor 8 accompanying the movement of the hand H ⁇ b> 1 as the passing period for the transport operation of the substrate W.
  • the determination unit 62 sets the timing at which the signal input from the optical sensor 8 changes from ON to OFF as the measurement start point, and then sets the timing at which the signal changes from OFF to ON as the measurement end point. If the signal of the optical sensor 8 does not change from OFF to ON even after a predetermined period has elapsed from the measurement start point, the determination unit 62 sets the time when the predetermined period has elapsed as the measurement end point.
  • the determination unit 62 compares the passage period with the normal period stored in the storage unit 61.
  • the determination unit 62 determines that the transfer operation of the substrate W is normal when the passage period and the normal period coincide with each other, and determines that the transfer operation of the substrate W is not normal (transfer abnormality) when they are different.
  • the control part 6 controls each structure part of the substrate processing apparatus 1, and performs a recipe at the time of abnormality.
  • a specific normal period can be selected according to the moving speed of the hand H1.
  • the control unit 6 automatically selects a specific normal period based on the correspondence table in which the moving speed of the hand H1 is associated with the normal period.
  • the specific normal period may be selectively designated by the user by an input from an input unit (not shown).
  • the ON / OFF signal detected by the pusher detection unit 29 is input to the determination unit 62.
  • the determination unit 62 interprets an ON signal output from the pusher detection unit 29 when the movable unit 24a reaches a certain extension amount or more as detection of the fixed holding state of the substrate W. Further, the determination unit 62 interprets the OFF signal output from the pusher detection unit 29 when the movable unit 24a is less than a certain amount of extension as detection of the fixed release state of the substrate W.
  • the determination unit 62 compares the ON / OFF signal output from the pusher detection unit 29 at a specific timing with the information of the normal ON / OFF signal stored at the specific timing stored in the storage unit 61. When the ON / OFF signal output from the pusher detection unit 29 at a specific timing matches the normal ON / OFF signal information stored at the specific timing stored in the storage unit 61, the determination unit 62 It is determined that the fixed holding state and / or the fixed release state of W are normal, and when they are different, the fixed holding state and / or the fixed release state of the substrate W are determined to be abnormal (abnormal). When it determines with it being abnormal, the control part 6 controls each component of the substrate processing apparatus 1, and performs a recipe at the time of abnormality.
  • the determination unit 62 switches the time series ON / OFF signal output from the pusher detection unit 29 (actual fixed holding pattern RHP) and the normal time series ON / OFF signal stored in the storage unit 61. (Normal fixed holding pattern NHP) may be compared.
  • the determination unit 62 determines that the fixed holding state and / or the unlocking state of the substrate W are normal, and when they are different, the fixed holding state of the substrate W is determined. And / or it is determined that the fixed release state is not normal (abnormal).
  • the control part 6 controls each component of the substrate processing apparatus 1, and performs a recipe at the time of abnormality.
  • the drive control unit 63 controls the drive of the indexer robot IR, the center robot CR, and the shutter drive unit 34b. If the determination unit 62 determines that there is an abnormality, the drive control unit 63 immediately stops the indexer robot IR and the shutter drive unit 34b based on the abnormality recipe, and stops the center robot CR after the substrate is transferred.
  • the processing control unit 64 controls the processing of the processing unit 31. Specific processing follows the processing recipe stored in the storage unit 61. If the determination unit 62 determines that the process is abnormal, the process control unit 64 continues the process of the process unit 31 based on the abnormality recipe, and stops the operation of the process unit 31 after the process is completed.
  • the control unit 6 includes a central processing unit (CPU), a ROM (Read-only Memory), a RAM (Random-Access Memory), a storage medium such as a fixed disk and an SSD (Solid State Drive), a drive circuit, a communication circuit, and the like. It is configured.
  • the communication circuit includes a circuit for performing communication such as RS-232C and Ethernet (registered trademark), and a circuit for performing digital or analog signal input / output.
  • the communication circuit communicates and transmits input / output signals between the control unit 6, the optical sensor 8, the pusher detection unit 29, various driving units, and the processing unit 31, as well as peripheral devices such as a load port LP and an external control device. It also communicates with devices and transmits input / output signals.
  • FIG. 5 is a flowchart showing the substrate transfer operation (delivery operation).
  • 6A to 6E are diagrams showing an operation example when the substrate is normally placed on the substrate storage container.
  • FIG. 8A is a chart showing the detection signal of the optical sensor 8 and the detection signal of the pusher detection unit 29 in time series in the substrate transfer operation. The same components as those described above are denoted by the same reference numerals, and detailed description thereof is omitted.
  • a time-series ON / OFF signal output from the optical sensor 8 when the substrate passing operation is normal is an optical signal RLS1.
  • Step S ⁇ Step S ⁇ b>1>
  • the substrate storage container 5 is placed.
  • the substrate storage container 5 is placed on the stage 32.
  • the lid 5b closes the opening B.
  • the stage 32 moves the substrate storage container 5 on the stage 32 close to the indexer unit 2 and brings the lid 5b into contact with the shutter member 34a.
  • the load port opening / closing mechanism 34 holds the lid 5b on the shutter member 34a, and moves the shutter driving unit 34b from the substrate storage container 5 toward the indexer unit 2. By this operation, the lid 5b can be detached from the substrate storage container 5. Further, the load port opening / closing mechanism 34 moves the shutter drive unit 34b vertically downward to cause the substrate storage container 5 and the indexer unit 2 to communicate with each other, and the hand H1 of the indexer robot IR enters the substrate storage container 5. Make it possible.
  • the indexer robot IR performs the receiving operation of the substrate W.
  • the substrate receiving operation includes an outward movement (second outward process), an acquisition movement, and a backward movement (second backward process).
  • the indexer robot IR standing by at the indexer delivery position moves the vertical position of the hand H1 to the pickup position. Thereafter, the indexer robot IR moves the hand H1 from the home position HM to the forward position FW in order to move the hand H1 into the lower portion of the substrate guide portion 5c holding the substrate W in the substrate storage container 5. I do.
  • the indexer robot IR After the hand H1 reaches the forward position FW, the indexer robot IR performs an acquisition movement that raises the hand H1 from the pickup position to the place position.
  • the substrate W placed on the substrate guide portion 5 c is lifted by the hand H ⁇ b> 1 and supported by the claw guide portion 22 and the back guide portion 23.
  • the movable portion 24a extends to the substrate W side and presses the substrate W against the claw guide portion 22.
  • substrate W will be in the state pinched
  • the pusher detection unit 29 detects an ON signal when the movable unit 24 a reaches a certain extension amount or more, and outputs the detected ON signal to the determination unit 62.
  • the indexer robot IR performs a backward movement to move the hand H1 from the forward position FW to the home position HM in order to retract the hand H1 from the substrate storage container 5 in a state where the hand H1 holds and holds the substrate W.
  • Step S Processing the Substrate
  • the indexer robot IR moves the hand H ⁇ b> 1 into the pass unit 4 and places the substrate W on the pass unit 4 with the substrate W fixed and held. After placement, the indexer robot IR retracts the hand H1 to the outside of the pass unit 4. The substrate W placed on the pass unit 4 is transferred to the processing unit 31 by the center robot CR. Similarly to the indexer robot IR, the center robot CR carries the substrate W in a fixed state.
  • Chemical processing is performed on the substrate W transported to the processing unit 31.
  • the chemical liquid process is, for example, a cleaning process.
  • a chemical liquid is supplied to the substrate W to clean the substrate W.
  • an etching process, a coating process, a developing process, or the like may be performed.
  • the treatment may be different from the chemical treatment, for example, heat treatment such as heat treatment or cooling treatment.
  • the substrate W processed by the processing unit 31 is taken out from the processing unit 31 by the center robot CR and placed on the pass unit 4.
  • the substrate is transferred to the substrate storage container.
  • the indexer robot IR performs the transfer operation of the substrate W.
  • the substrate transfer operation includes an outward movement (first outward process), a placement movement, and a backward movement (first backward process).
  • the substrate W placed on the pass unit 4 is fixedly held by the hand H1.
  • the indexer robot IR moves to the indexer delivery position of the substrate storage container 5 that is the storage target of the substrate W while the substrate W is fixedly held on the hand H1.
  • the hand H1 rotates in the direction facing the opening B, and moves the vertical position to the place position (time t1).
  • time t1 since the optical sensor 8 is in a light projection state, it outputs an ON signal, and since the movable portion 24a is in an extended state, the pusher detection unit 29 outputs an ON signal.
  • the indexer robot IR moves the home H1 from the home position HM in a state where the substrate W is fixed and held.
  • the forward movement to move to the forward position FW is started (time t2).
  • the determination unit 62 compares the signal output from the pusher detection unit 29 with the normal timing signal at the first monitoring point SP1 stored in the storage unit 61, with the start of forward movement as the first monitoring point SP1. Since the substrate W needs to be fixedly held at the first monitoring point SP1, the normal timing signal at the first monitoring point SP1 stored in the storage unit 61 is an ON signal.
  • the determination unit 62 continues the process when the two signals match each other, and executes the abnormal recipe when they are different (NO in step S5).
  • the first monitoring point SP1 does not have to be immediately before the start of the outward movement, but may be a certain period before the start of the outward movement. Further, the determination unit 62 may start acquiring the ON / OFF signal in order to acquire the time series pattern of the signal output from the pusher detection unit 29 (signal acquisition period SGP).
  • the signal output from the optical sensor 8 to the determination unit 62 is an ON signal.
  • the determination unit 62 starts measuring the duration of the OFF signal with the switching from the ON signal input from the optical sensor 8 to the OFF signal as the starting point of the passage period.
  • the hand H1 reaches the forward position FW.
  • the control unit 6 releases the pressing to the substrate W by contracting the movable unit 24a.
  • the substrate W can be placed on the substrate guide portion 5c. Since the movable unit 24a is in the contracted state, the signal output from the pusher detection unit 29 to the determination unit 62 is switched from the ON signal to the OFF signal (time t4).
  • the determination unit 62 compares the signal output from the pusher detection unit 29 with the normal timing signal at the second monitoring point SP2 stored in the storage unit 61 with the end of the forward movement as the second monitoring point SP2.
  • the normal timing signal at the second monitoring point SP2 stored in the storage unit 61 is an OFF signal.
  • the determination unit 62 continues the process, and when they differ (NO in S5), the determination unit 62 executes the abnormal recipe.
  • the second monitoring point SP2 need not be immediately after the end of the forward movement, but may be after a certain period of time after the end of the forward movement.
  • the determination unit 62 ends the acquisition of the ON / OFF signal when the time series pattern (actual fixed holding pattern RHP) of the signal output from the pusher detection unit 29 is acquired.
  • the determination unit 62 compares the acquired actual fixed holding pattern RHP with the normal fixed holding pattern NHP stored in the storage unit 61. As a result of the comparison, when the two patterns match (YES in step S5), the determination unit 62 continues the process, and when they differ (NO in step S5), the determination unit 62 executes the abnormal recipe.
  • the indexer robot IR picks up the vertical position of the hand H1 from the place position while keeping the forward position FW. Placement movement to move down to the position is performed. By the placement movement, the substrate W held inside the claw guide portion 22 and the back guide portion 23 is placed on the substrate guide portion 5c.
  • the indexer robot IR moves the hand H1 from the forward position FW to the home position HM in order to retract the hand H1 from the substrate storage container 5. Move. If the substrate W is normally placed on the substrate guide portion 5c, the substrate W does not exist on the hand H1. Therefore, when the hollow region of the hand H1 (the region between the V-shaped portions where no member is present) reaches the optical axis while passing through the optical axis of the optical sensor 8, the optical sensor 8 projects from the light shielding state. Change to light state. In response, the signal output from the optical sensor 8 changes from an ON signal to an OFF signal (time t5).
  • the determination unit 62 ends the measurement of the duration of the OFF signal output from the optical sensor 8 when the signal output from the optical sensor 8 changes from the OFF signal to the ON signal. After passing through the hollow area of the hand H1, the output of the optical sensor 8 is switched from the OFF signal to the ON signal. When the hand H1 reaches the home position HM, the backward movement is finished (FIG. 6E, time t6). When the substrate W is normally transferred, the period from the time t3 when the signal output from the optical sensor 8 changes from the ON signal to the OFF signal to the time t5 when the signal changes from the OFF signal to the ON signal is the first passage period PP1. It becomes.
  • the indexer robot IR can be set to a speed slower than the transfer speed during the backward movement when the hand H1 moves backward from the inside of the substrate storage container 5. By reducing the speed during the backward movement, the detection accuracy of the optical sensor 8 during the backward movement can be improved.
  • the determination unit 62 compares the first passage period PP ⁇ b> 1 measured during the transfer operation of the substrate W with the first normal period NP ⁇ b> 1 stored in the storage unit 61.
  • the first normal period NP1 is a period in which the OFF signal output from the optical sensor 8 is from time t3 to t5.
  • the determination unit 62 compares the first passage period PP1 with the first normal period NP1 set in advance and stored in the storage unit 61. As a result of the comparison, the determination unit 62 determines that it is normal (YES in S7) and continues the process.
  • the abnormality recipe is executed.
  • the determination may be made with a margin of about ⁇ 10% with respect to the first normal period NP1.
  • the stored first normal period NP1 is 2.8 seconds or less. From the design value and the experiment, an appropriate value is around 2.5 seconds, and when there is an abnormality, if it becomes 3.0 seconds or more, a margin of about 10% is added to 2.5 seconds, and the first normal period NP1 is 2.8 or less.
  • the first normal period NP1 can be arbitrarily changed according to the moving distance and the moving speed, and is not limited to these values.
  • the first normal period NP1 may have an upper and lower limit range such as 2.2 seconds or more and 2.8 seconds or less. In this way, by providing a margin, it is possible to prevent a minute operation variation that does not cause a problem from being detected as an error.
  • the determination unit 62 determines that the first passage period PP1 is normal, a series of substrate passing operations by the indexer robot IR is completed.
  • the substrate W may be warped in a concave shape through a manufacturing process. After the substrate W is placed on the substrate guide portion 5c, a part of the lower surface of the substrate W is moved to the upper end of the side surface portion 22b of the hand H1 even though the hand H1 is lowered to the pickup position due to the warpage of the substrate W. There exists a possibility that it may become equal height or lower than the upper end of the side part 22b of the hand H1.
  • FIG. 7A to 7B are diagrams for explaining the operation when the substrate is not normally placed on the substrate storage container.
  • FIG. 8B is a chart showing the detection signal of the optical sensor and the detection signal of the pusher detection unit in chronological order according to normality and abnormality in the substrate passing operation. Until the hand H1 enters the forward position and descends to the pickup position, the description is omitted because it is the same as FIG. 6A to FIG. 6C. The description of the same parts as in FIG. 8A is also omitted.
  • a time-series ON / OFF signal output from the optical sensor 8 when an abnormality occurs in the substrate transfer operation is referred to as an optical signal RLS2.
  • the determination part 62 determines that the OFF signal output from the pusher detection part 29 is normal (FIG. 6C, time t4). Therefore, even when the substrate W is placed in an unstable state on the hand H1, the pusher detection unit 29 cannot detect the abnormality.
  • the optical sensor 8 does not change from the light shielding state to the light projecting state, and the signal output is maintained at the OFF signal.
  • the hand H1 continues to move in the backward direction, and the output of the optical sensor 8 changes to an ON signal with the substrate W passing through the optical axis (time t5a).
  • the determination unit 62 ends the measurement of the duration of the OFF signal of the optical sensor 8 when the signal output from the optical sensor 8 changes from the OFF signal to the ON signal.
  • the determination unit 62 compares the measured second passage period PP2 with the first normal period NP1 stored in the storage unit 61 for the transfer operation of the substrate W. As a result of comparing the second passage period PP2 and the first normal period NP1 stored in the storage unit 61, the determination unit 62 compares the second passage period PP2 and the first passage period PP2 stored in the storage unit 61 as shown in FIG. 8B. Since it is different from the normal period NP1, the abnormality recipe is executed.
  • the determination unit 62 determines that there is an abnormality, it causes each component of the substrate processing apparatus 1 to execute the abnormal recipe stored in the storage unit 61.
  • the abnormal-time recipe defines a series of operations including an immediate stop of the indexer robot IR and the shutter drive unit 34b, a stop after the processing of the processing unit 31, a stop after the substrate transfer of the center robot CR, and an alarm.
  • the alarm includes warning display on the main screen of the substrate processing apparatus 1, generation of sound, display command output of a pop-up message to the host computer through the communication line, and the like. By generating an alarm, the apparatus user can be notified that the substrate processing apparatus 1 is abnormal. Even when the execution of the abnormal recipe is completed, the determination unit 62 ends the series of transport operations.
  • a series of substrate W transfer operations when the hand H1 places the substrate W on the substrate guide portion 5c of the substrate storage container 5 are optical sensors.
  • the detection signal of 8 can be used to determine whether the state is normal or abnormal. More specifically, the passage period is measured from the duration of the OFF signal generated by the optical sensor 8 detecting the hand H1 body or the substrate W. By comparing whether or not the passage period and the normal period stored in the storage unit 61 coincide with each other, it is possible to determine whether the transfer operation of the substrate W is normal or abnormal.
  • the substrate W is not accurately placed on the substrate guide portion 5c of the substrate storage container 5.
  • the substrate W is positioned on the right side of the state shown in FIG. A state in which W is placed so as to be shifted out of the substrate storage container 5 will be described.
  • the sensor area of the optical sensor 8 is set at a position where the substrate W placed in a state of being shifted out of the substrate storage container 5 can be detected. Therefore, it can be detected by the optical sensor 8 that the substrate W is placed in a shifted state. In this case as well, another abnormal state is detected.
  • Whether the hand H1 receives a substrate W placed on the substrate guide portion 5c of the substrate storage container 5 or not is determined based on the output of the optical sensor 8 as to whether it is in a normal state or an abnormal state. May be.
  • the second passage period is measured from the duration of the OFF signal generated by detecting the hand H1 or the substrate W by the optical sensor 8. It may be determined whether the receiving operation of the substrate W is normal or abnormal by comparing whether or not the second passage period and the second normal period stored in the storage unit 61 match.
  • the hand W1 main body that does not hold the substrate W passes through the sensor area of the optical sensor 8 in the second forward pass process, the hand W1 main body and the substrate W held by the hand H1 in the second return pass process.
  • a second passage period until passing through the sensor area is measured.
  • the determination unit 62 determines whether or not the second passage period is different from the second normal period set in advance and stored in the storage unit 61.
  • the determination unit 62 determines that the state is normal if they are not different, and determines that the conveyance is abnormal if they are different.
  • the substrate W is warped, a part of the lower surface of the substrate W is a side surface portion of the hand H1 even though the hand H1 is lowered to the pickup position after the substrate W is placed on the substrate guide portion 5c.
  • the height is equal to the upper end of 22b or lower than the upper end of the side surface portion 22b of the hand H1. In this case, when the hand H1 moves backward from the forward position FW to the home position HM, the upper end of the side surface portion 22b of the hand H1 catches the end portion or the lower surface of the substrate W.
  • the substrate W is not held by the claw guide portion 22 and the back guide portion 23, and a part of the substrate W rides on the upper end of the side surface portion 22b and is placed in an unstable state on the hand H1.
  • an abnormality may not be detected from the ON / OFF signal from the pusher detection unit 29. Even in such a situation, an abnormality can be detected because the determination unit 62 determines an abnormality based on the ON / OFF signal from the optical sensor 8.
  • the determination unit 62 causes each component of the substrate processing apparatus 1 to execute an abnormal recipe.
  • the conveyance operation stops due to the execution of the abnormal recipe.
  • an alarm is issued, and the user of the substrate processing apparatus 1 can immediately know that the substrate processing apparatus 1 is in an abnormal state. As a result, the transfer of the substrate W can be stopped early, and the influence on the subsequent process can be reduced.
  • FIG. 9 is a side view showing a schematic configuration of the processing unit. About the same structure as the above, detailed description is abbreviate
  • the processing unit 31 is a single wafer processing unit for performing liquid processing such as cleaning processing and etching processing on the substrate W.
  • the processing unit 31 has a chamber 802 that divides a sealed space surrounded by a side wall 801 into the inside.
  • a spin chuck 803 that holds and rotates the substrate W
  • a treatment liquid nozzle 804 that holds and rotates the substrate W
  • a rinse liquid nozzle 804 that holds and rotates the substrate W
  • an organic solvent nozzle (not shown)
  • a processing cup 808 having a shape.
  • the processing liquid nozzle 804 supplies the processing liquid supplied from the processing liquid supply unit to the surface (upper surface) of the substrate W held by the spin chuck 803.
  • the rinse liquid nozzle supplies the rinse liquid supplied from the rinse liquid supply unit to the surface (upper surface) of the substrate W held by the spin chuck 803.
  • the organic solvent nozzle supplies the organic solvent supplied from the organic solvent supply unit to the surface (upper surface) of the substrate W held by the spin chuck 803.
  • An opening 811 is formed in the side wall 801 of the chamber 802 so that the substrate W can be carried in and out of the chamber 802.
  • the center robot CR (see FIG. 1) arranged outside the chamber 802 allows the hand H2 (see FIG. 1) to access the chamber 802 through the opening 811.
  • the center robot CR can place an unprocessed substrate W on the spin chuck 803 and can extract a processed substrate W from the spin chuck 803.
  • a shutter 812 for opening and closing the opening 811 in the vertical direction is provided outside the side wall 801.
  • a shutter elevating mechanism 813 is coupled to the shutter 812.
  • the shutter lifting / lowering mechanism 813 moves the shutter 812 up and down between an open position and a closed position (not shown).
  • the shutter lifting / lowering mechanism 813 is controlled by the processing control unit 64.
  • the spin chuck 803 is a suction chuck that sucks the substrate W in the horizontal direction and holds the substrate W horizontally.
  • the spin chuck 803 is connected to a spin shaft 815 that is integrated with a drive shaft of the spin motor 814.
  • the holding method of the substrate W may be a holding method in which the substrate W is held horizontally with the substrate W held in the horizontal direction. That is, a mechanical chuck may be used as the spin chuck 803 instead of the suction chuck.
  • the spin shaft 815 is rotated around a predetermined rotation axis (vertical axis) A1 by the driving force.
  • the substrate W is rotated around the rotation axis A1 together with the spin chuck 803 while maintaining a substantially horizontal posture.
  • the processing liquid nozzle 804 is connected to the processing liquid supply unit by a supply pipe 805.
  • a processing liquid valve 806 is disposed in the middle of the supply pipe 805 and is controlled to be opened and closed by a signal from the control unit 6. By opening the processing liquid valve 806, the processing liquid nozzle 804 and the processing liquid supply unit are in communication with each other, and the processing liquid is discharged from the processing liquid nozzle 804. By closing the processing liquid valve 806, the discharge of the processing liquid from the processing liquid nozzle 804 can be stopped.
  • the processing cup 808 is coupled to a cup lifting mechanism 807 for moving the processing cup 808 up and down between a retracted position (solid line) and a processing position (two-dot chain line).
  • the cup elevating mechanism 807 is controlled by the processing control unit 64, and thereby the vertical position of the processing cup 808 is controlled.
  • the processing control unit 64 In order to receive the substrate W on the spin chuck 803, the processing control unit 64 lowers the processing cup 808 to the retracted position when the substrate W is loaded. The processing control unit 64 raises the processing cup 808 to the processing position when processing the substrate W.
  • the processing control unit 64 releases the adsorption of the substrate W by the spin chuck 803 and lowers the processing cup 808 to the retracted position.
  • the substrate W on the spin chuck 803 is held by the hand H2 of the center robot CR, and the held substrate W is carried out of the chamber 802.
  • the treatment liquid is hydrofluoric acid, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, hydrogen peroxide, organic acid (eg, citric acid, oxalic acid, etc.), organic alkali (eg, TMAH, etc.), surfactant, or A corrosion inhibitor may be included.
  • the processing liquid nozzle 804 is, for example, a straight nozzle that discharges the processing liquid in a continuous flow state.
  • the processing liquid nozzle 804 is attached to a processing liquid nozzle arm (not shown) with the discharge port facing substantially downward.
  • the treatment liquid nozzle arm is a swing arm extending in the horizontal direction, and a treatment liquid nozzle 804 is attached to the swing end portion thereof.
  • a base end portion of the swing arm is coupled to an arm rotation mechanism (not shown).
  • the arm rotation mechanism swings the treatment liquid nozzle arm around a predetermined rotation axis (not shown) along the vertical direction.
  • the processing liquid nozzle arm swings, the processing liquid nozzle 804 moves horizontally along an arcuate path passing through the center of the upper surface of the substrate W in plan view. Accordingly, it is possible to perform a process in which the processing liquid nozzle 804 moves horizontally on the substrate W while the processing liquid is discharged.
  • the center robot CR transports the substrates W transported from the substrate storage container 5 to the pass unit 4 to each processing unit 31 one by one.
  • the center robot CR includes an elevating part 26A, a connecting part 27A, and a pair of extendable parts 28A. These have the same structure as the elevating part 26, the connecting part 27, and the telescopic part 28 of the indexer robot IR.
  • the elevating part 26A can adjust the vertical position of the hand H2. Specifically, the elevating unit 26A can adjust the height position of the hand H2 to the pickup position (lower position) and the place position (upper position).
  • the pickup position is a height position at which the uppermost portion of the claw guide portion 22 (see FIG. 3B) of the hand H2 is lower than the lower surface of the substrate W to be unloaded when the substrate W is unloaded from the processing unit 31.
  • the place position is a height position where the lower surface of the hand H ⁇ b> 2 is higher than the upper surface of the spin chuck 803 when the substrate W is carried into the processing unit 31.
  • the expansion / contraction part 28A which is a reciprocating mechanism has a plurality of joints, and performs expansion / contraction operation by rotationally driving the joint parts.
  • the extension / contraction part 28A can adjust the horizontal position of the hand H2 by an extension / contraction operation. Specifically, the extension / contraction part 28A can adjust the horizontal position of the hand H2 to the home position HM (solid line) and the forward position FW (two-dot chain line).
  • the home position HM (solid line) is a horizontal position in a state where the joint of the expansion / contraction part 28A is contracted.
  • the forward position FW two-dot chain line
  • the home position HM is a reference position in the horizontal direction of the hand H2.
  • the opening 811 of the chamber 802 is provided with a detection unit (sensor) that detects the presence or absence of an object passing through the opening 811.
  • a detection unit sensor
  • an optical sensor 81 is used.
  • the optical sensor 81 is a transmissive sensor and includes a light projecting unit 81a and a light receiving unit 81b.
  • the light projecting unit 81a and the light receiving unit 81b are installed with their optical axes aligned so as to face each other at the upper and lower positions of the opening 811, and an object that passes through the optical axis between the light projecting unit 81a and the light receiving unit 81b. Is detected.
  • the optical axis is interrupted (shielded).
  • the optical sensor 81 detects the presence or absence of the hand H2 or the substrate W by detecting the light projection state and the light shielding state.
  • an ON / OFF signal for turning on the light shielded state and turning off the light projection state is output from the optical sensor 81 to the determination unit 62.
  • the optical sensor 81 may have the form of a reflective sensor. The details of the reflection type sensor are the same as in the case of the optical sensor 8 described above, and a description thereof will be omitted.
  • FIG. 10 is a flowchart showing the substrate transfer operation in the substrate processing apparatus.
  • FIG. 11 is a chart showing the detection signals of the optical sensors related to normality and abnormality in the substrate passing operation in time series.
  • an optical signal RLS3 represents an example of a time-series ON / OFF signal output from the optical sensor 8 when the substrate passing operation is normal.
  • the optical signal RLS4 represents an example of a time-series ON / OFF signal output from the optical sensor 8 when the substrate passing operation is abnormal.
  • the description of the pusher detection unit 29 (see FIGS. 3A and 3B) in the hand H2 is the same as described above, and will be omitted.
  • the center robot CR performs a substrate receiving operation. Since the receiving operation of the substrate of the center robot CR is the same as the receiving operation of the substrate of the indexer robot IR, detailed description is omitted.
  • the center robot CR acquires the substrate W placed on the pass unit 4 by the indexer robot IR and transports it to the processing unit 31. As with the indexer robot IR, the center robot CR carries the substrate W in a fixed state.
  • the center robot CR performs a substrate transfer operation. Since the substrate transfer operation of the center robot CR is the same as the substrate transfer operation of the indexer robot IR, detailed description thereof is omitted.
  • the center robot CR rotates to the processing unit delivery position of the target processing unit 31 that processes the substrate W while the substrate W is fixedly held on the hand H2.
  • the shutter 812 is lowered from the closed position to the open position by the shutter lifting / lowering mechanism 813, and the hand H2 faces the opening 811.
  • the vertical position is moved to the place position (time t11). At time t11, since the optical sensor 8 is in the light projection state, it outputs an ON signal.
  • the center robot CR starts the forward movement to move the hand H2 from the home position HM to the forward position FW in order to allow the hand H2 to enter the processing unit 31 while holding the substrate W (time t12). .
  • the signal output from the optical sensor 81 to the determination unit 62 is turned off from the ON signal. Switching to a signal (time t13).
  • the determination unit 62 starts measuring the duration of the OFF signal with the switching from the ON signal input from the optical sensor 81 to the OFF signal as the starting point of the passage period.
  • the hand H2 reaches the forward position FW.
  • the control unit 6 releases the pressing to the substrate W by contracting the movable unit 24a of the pusher unit 24 (time t14).
  • the substrate W can be placed on the spin chuck 803.
  • the center robot CR executes a placement movement that moves the vertical position of the hand H2 downward from the place position to the pickup position.
  • the substrate W held inside the claw guide portion 22 and the back guide portion 23 is placed on the spin chuck 803.
  • the determination unit 62 ends the measurement of the duration of the OFF signal output from the optical sensor 81 when the signal output from the optical sensor 81 changes from the OFF signal to the ON signal. Even after the hollow region passes the optical axis of the optical sensor 81, the state of the OFF signal is maintained, and when the hand H2 reaches the home position HM, the backward movement is completed (time t16). When the substrate is transported normally, a period from time t13 when the signal output from the optical sensor 81 changes from the ON signal to the OFF signal to time t15 when the signal changes from the OFF signal to the ON signal becomes the third passage period PP3. .
  • the center robot CR can be set to a speed slower than the normal transport speed during the forward movement when the backward movement moves the hand H2 back from the processing unit 31, and the optical sensor during the forward movement is reduced by reducing the speed during the forward movement.
  • the detection accuracy of 81 can be improved.
  • Optical sensor signal coincidence comparison The determination unit 62 compares the third passage period PP3 measured during the transfer operation of the substrate W with the second normal period NP2 stored in the storage unit 61. As a result of comparing the third passage period PP3 and the second normal period NP2 stored in the storage unit 61, the determination unit 62 determines that they are normal (YES in S14), continues the process, and differs. When it does, it judges with it being abnormal (NO of S14), and performs the recipe at the time of abnormality. When comparing the third passage period PP3 and the second normal period NP2, the determination may be made with a margin of about ⁇ 10% with respect to the second normal period NP2.
  • the stored second normal period NP2 is 2.8 seconds or less. From the design value and the experiment, an appropriate value is around 2.5 seconds, and when there is an abnormality, if it becomes 3.0 seconds or more, a margin of about 10% is added to 2.5 seconds, and the second normal period NP2 is 2.8 or less.
  • the second normal period NP2 can be arbitrarily changed according to the moving distance and the moving speed, and thus is not limited to these values and may have an upper and lower limit range. In this way, by providing a margin, it is possible to prevent a minute operation variation that does not cause a problem from being detected as an error.
  • the determination unit 62 determines that the third passage period PP3 is normal, a series of substrate passing operations by the center robot CR is completed.
  • Step S15 Processing Substrate
  • Various processes are performed on the substrate W transported to the processing unit 31. For example, a cleaning process using a chemical solution, an etching process, a resist coating process, or a development process is performed.
  • the substrate W is not normally placed on the spin chuck 803 by the hand H2.
  • the substrate W may be warped in a concave shape through a manufacturing process. After the substrate W is placed on the spin chuck 803, a part of the lower surface of the substrate W is equal to the upper end of the side surface portion 22b of the hand H2 even though the hand H2 is lowered to the pickup position due to the warpage of the substrate W. Or there exists a possibility that it may become lower than the upper end of the side part 22b of the hand H2.
  • the determination unit 62 determines that the OFF signal output from the pusher detection unit 29 is normal. Therefore, even when the substrate W is placed in an unstable state on the hand H2, the pusher detection unit 29 cannot detect the abnormality.
  • the optical sensor 81 does not change from the light shielding state to the light projecting state, and its output signal is maintained as an OFF signal.
  • the hand H2 continues to move backward and changes to an ON signal when the substrate W passes the optical axis (time t15a).
  • the determination unit 62 ends the measurement of the duration of the OFF signal of the optical sensor 81 when the signal output from the optical sensor 81 changes from the OFF signal to the ON signal.
  • the backward movement is finished (time t16).
  • the period from the time t13 when the signal output from the optical sensor 81 changes from the ON signal to the OFF signal to the time t15a when the signal changes from the OFF signal to the ON signal is the fourth passage period PP4. It becomes.
  • the determination unit 62 compares the measured fourth passage period PP4 with the second normal period NP2 stored in the storage unit 61 for the transfer operation of the substrate W. As a result of comparing the fourth passage period PP4 and the second normal period NP2 stored in the storage unit 61, the determination unit 62 compares the fourth passage period PP4 and the fourth passage period PP4 and the second passage stored in the storage unit 61 as shown in FIG. 2 Since it is different from the normal period NP2, the abnormal time recipe is executed.
  • the determination unit 62 determines that there is an abnormality, it causes each component of the substrate processing apparatus 1 to execute the abnormal recipe stored in the storage unit 61.
  • the abnormal recipe is the stop after the substrate transfer of the indexer robot IR, the immediate stop of the target processing unit 31 determined to be abnormal, the stop after the processing units 31 other than the abnormal processing unit are completed, the immediate stop of the center robot CR, It defines a series of actions including alarm generation.
  • the alarm includes warning display on the main screen of the substrate processing apparatus 1, generation of sound, display command output of a pop-up message to the host computer through the communication line, and the like. By generating an alarm, the apparatus user can be notified that the substrate processing apparatus 1 is abnormal. Even when the execution of the abnormal recipe is completed, the determination unit 62 ends the series of transport operations.
  • the detection signal of the optical sensor 81 can be used to determine whether the state is normal or abnormal. More specifically, the passage period is measured from the duration of the OFF signal in the detection time of the hand H2 or the substrate W detected by the optical sensor 81. By comparing whether or not the passage period and the normal period stored in the storage unit 61 coincide with each other, it is possible to determine whether the transfer operation of the substrate W is normal or abnormal.
  • the substrate W is warped, a part of the lower surface of the substrate W is the same height as the upper end of the side surface portion 22b of the hand H2 or the side surface portion of the hand H2 even though the hand H2 is lowered to the pickup position. There is a possibility that it will be lower than the upper end of 22b. In this case, when the hand H2 moves backward from the forward position FW to the home position HM, the upper end of the side surface portion 22b of the hand H2 catches the end portion or the lower surface of the substrate W. At this time, the substrate W is not held by the claw guide portion 22 and the back guide portion 23, and a part of the substrate W rides on the side surface portion 22b and is placed in an unstable state on the hand H2.
  • the determination unit 62 causes each component of the substrate processing apparatus 1 to execute an abnormal recipe. Due to the execution of the abnormal recipe, the transfer operation is stopped, and the subsequent transfer of the substrate W is stopped. Further, an alarm is issued and the user of the substrate processing apparatus 1 can immediately know that the substrate processing apparatus 1 is in an abnormal state. As a result, the transfer of the substrate W can be stopped early, and the influence on the subsequent process can be reduced.
  • the present invention is not limited to the above embodiment, and can be modified as follows.
  • the third embodiment of the present invention will be described in detail.
  • the substrate W placed on the substrate storage container 5 may be shifted from the normal position to the indexer unit 2 side, that is, the substrate W may be protruded from the substrate storage container 5.
  • the optical sensor 8 can detect the jumping out of the substrate W.
  • the transmissive sensor the optical axis is shielded by the protruding substrate W and the light is shielded.
  • the reflective sensor the projected light is reflected by the substrate W in a state in which the projected light has jumped out to be in a reflective state. In either type of sensor, an OFF signal is output, and the substrate W that has jumped out is stationary, so the OFF signal is continued.
  • the determination unit 62 sets the measurement end point when the predetermined period has elapsed, and sets the predetermined period as the fifth passage period PP5.
  • the predetermined period is preferably set to be equal to or longer than the OFF signal duration assumed when there is an abnormality in the transfer operation of the substrate W, for example, 3 seconds or longer.
  • the determination unit 62 compares the fifth passage period PP5 obtained by measuring the duration of the OFF signal detected by the optical sensor 8 with the third normal period NP3 stored in the storage unit 61.
  • the third normal period NP3 is an arbitrary period determined by the user.
  • the determination unit 62 determines that they are normal, and determines that they are abnormal, and determines that they are abnormal if they are different.
  • the determination unit 62 executes an arbitrary abnormality recipe.
  • the first normal period NP1 and the third normal period may be the same period (same length). By setting it as the same period, it becomes unnecessary for a user to manage several settings, and also the data processing load and communication load of the substrate processing apparatus 1 can be reduced.
  • the present invention is not limited to the above embodiment, and can be further modified as illustrated below.
  • the hollow shape in the hand H1 is a shape including a V shape, but may be a shape including a Y shape or a U shape.
  • the degree of freedom in designing the hand shape can be expanded.
  • the attachment position of the reflection member may be any position where the light beam projected from the light projecting portion 8c of the reflection sensor and reflected by the reflection member can be received by the light receiving portion 8d, either on the front or back surface of the hand H1 (H2). Good.
  • optical sensor 8 there is one optical sensor 8, 81.
  • a plurality of optical sensors may be installed. The detection accuracy can be improved by installing a plurality of optical sensors.
  • the optical sensor 8 is disposed opposite to the upper and lower positions of the load port opening L.
  • the arrangement is not limited to the arrangement facing the load port opening L, and is provided in the partition 7 of the indexer unit 2.
  • An arrangement facing the partition wall passage hole 7a or the like may be employed. Thereby, the freedom degree of design can be expanded.
  • the optical sensor 81 is installed at the upper and lower positions inside the opening 811 of the processing unit 31.
  • the processing unit 31 is not limited to being installed inside the opening 811 but may be installed outside the opening 811. . Thereby, the freedom degree of design can be expanded.
  • a normal period can be provided for the operation period of the receiving operation in which the indexer robot IR receives the substrate W from the substrate storage container 5. The same applies to the center robot CR.
  • the indexer robot IR is designed and / or controlled to have the same period (same length) as the operation period for receiving the substrate W from the substrate storage container 5 and the operation period for transferring the substrate W to the substrate storage container 5. May be.
  • the same operation period it is not necessary to provide separate normal periods for the operation period for taking the substrate W and the operation period for transferring the substrate W, and the normal period can be made common.
  • the data processing load and the communication load of the substrate processing apparatus 1 can be reduced as compared with the case where the normal period is provided individually. The same applies to the center robot CR.
  • the first normal period NP1 and the second normal period NP2 may be the same period (same length). Furthermore, the first normal period NP1, the second normal period NP2, and the third normal period NP3 may be the same period (same length). By setting the same period, it is not necessary for the user to manage a plurality of settings, and the man-hours for management are reduced. Furthermore, the data processing load and communication load of the substrate processing apparatus 1 can be reduced.

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  • Condensed Matter Physics & Semiconductors (AREA)
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PCT/JP2019/000740 2018-02-28 2019-01-11 基板搬送装置および基板搬送方法 WO2019167447A1 (ja)

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TWI776412B (zh) * 2021-03-03 2022-09-01 迅得機械股份有限公司 物件容器的移載裝置

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