WO2019149149A1 - 摄像头模组、摄像头模组的组装方法及移动终端 - Google Patents

摄像头模组、摄像头模组的组装方法及移动终端 Download PDF

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Publication number
WO2019149149A1
WO2019149149A1 PCT/CN2019/073169 CN2019073169W WO2019149149A1 WO 2019149149 A1 WO2019149149 A1 WO 2019149149A1 CN 2019073169 W CN2019073169 W CN 2019073169W WO 2019149149 A1 WO2019149149 A1 WO 2019149149A1
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Prior art keywords
chip
camera module
protective layer
away
circuit board
Prior art date
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PCT/CN2019/073169
Other languages
English (en)
French (fr)
Inventor
杨俊�
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP19747844.9A priority Critical patent/EP3748948A4/en
Priority to JP2020541750A priority patent/JP7150860B2/ja
Priority to KR1020207022712A priority patent/KR102355287B1/ko
Priority to US16/966,325 priority patent/US11297210B2/en
Publication of WO2019149149A1 publication Critical patent/WO2019149149A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly

Definitions

  • the present disclosure relates to the field of communications technologies, and in particular, to a camera module, a camera module assembly method, and a mobile terminal.
  • the thickness of the mobile phone becomes thinner and thinner, and the space available for the camera module inside the mobile phone is getting smaller and smaller. Therefore, the size of the camera module is required to be reduced. .
  • the effect of reducing the thickness of the camera is achieved by canceling the lens base inside the camera module.
  • the plastic C is injected outside the gold wire B through the injection molding die D to ensure that the gold wire B is not exposed.
  • a related art problem is that, when plastic injection molding is performed, since the contact area between the injection molding die D and the chip A is small (at E in FIG. 1), the force on the chip A for receiving the pressure applied by the injection molding die D is exerted. The small area is likely to cause the chip A to directly contact with the injection mold D to be broken after being subjected to a large pressure, thereby causing the entire camera module to fail.
  • the embodiment of the present disclosure provides a camera module, a camera module assembly method, and a mobile terminal, to solve the problem that the chip is broken and the camera module fails due to a small contact area between the injection mold and the chip.
  • an embodiment of the present disclosure provides a camera module, including:
  • Image sensor stacked on the chip
  • connecting line one end of the connecting line is connected to the wiring area of the flexible circuit board, and the other end is connected to the interface area of the first surface of the chip; wherein the first surface is a side surface of the chip away from the flexible circuit board;
  • the first protection structure is disposed on the interface area of the first surface of the chip.
  • an embodiment of the present disclosure further provides a mobile terminal, including the foregoing camera module.
  • an embodiment of the present disclosure further provides a method for assembling a camera module, including: stacking a chip on a flexible circuit board;
  • the first protective structure is disposed on the first surface of the chip such that a portion of the connecting line protruding away from the first surface is located inside the first protective structure.
  • the contact area with the chip is increased, so that the force area on the chip for receiving the pressure applied by the injection mold increases. Large, and thus can prevent the problem of chip rupture, to ensure that the camera can work properly.
  • FIG. 1 is a schematic structural view showing a plastic injection molding of a camera module by a glue injection mold in the related art
  • FIG. 2 is a schematic structural view of a camera module according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of a camera module according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a camera module including: a flexible circuit board 1; a chip 2 stacked on the flexible circuit board 1; an image sensor 3 stacked on the chip 2; a wire 4, one end of the connecting wire 4 is connected to the wiring area of the flexible circuit board 1, and the other end is connected to the interface area of the first surface of the chip 2; wherein, the first surface is a side surface of the chip 2 away from the flexible circuit board 1;
  • the first protective structure 5 is disposed on the interface region of the first surface of the chip 2, and the portion of the connecting wire 4 protruding away from the first surface is located inside the first protective structure 5.
  • the contact area with the chip 2 is increased, so that the force area on the chip 2 for receiving the pressure applied by the injection mold increases. Large, and thus can prevent the problem of chip 2 rupture, to ensure that the camera can work normally; at the same time, because the lens base is eliminated, the size of the camera module is reduced, and the effect of reducing the thickness of the mobile terminal is achieved.
  • the number of the connecting lines 4 is plural, and the first protective structure 5 is formed in a frame-shaped structure on the first surface of the chip 2, and each connecting line 4 faces away from each other.
  • the portions protruding in the first surface direction are all located inside the first protective structure 5.
  • the image sensor 3 is exposed through the hollow portion of the first protection structure 5, so that the light collected by the lens of the camera module can be projected to the image sensor 3, and the optical signal is converted into an electrical signal by the image sensor 3, and then passed through the chip 2. Perform image imaging.
  • the camera module further includes: a second protection structure 6, a wiring area disposed on the flexible circuit board 1, and the connection line 4 facing away from the chip 2 A portion in which the side surface direction protrudes is provided inside the second protective structure 6.
  • the second protective structure 6 is made of plastic, and is formed by injection molding a plastic injection molding onto a portion of the connecting wire 4 protruding away from the side surface of the chip 2 by a glue injection mold placed on the first protective structure 5.
  • the second protective structure 6 is disposed in conformity with the side surface of the chip 2. As shown in FIG. 2, in the embodiment of the present disclosure, the second protective structure 6 is a regular rectangular parallelepiped structure.
  • connection line 4 is not exposed, so the lens base in the camera module can be eliminated, thereby reducing the size of the camera module, and ensuring that the connection between the connection line 4 and the chip 2 and the flexible circuit board 1 does not fail.
  • the first protection structure 5 and the second protection structure 6 are connected to each other.
  • the second protection structure 6 is injection molded on the flexible circuit board 1 by a plastic injection molding process, after the second protection structure 6 is injection molded on the flexible circuit board 1, the second protection structure 6 and the first protection structure 5 are Bonded together to achieve a fixed connection between the two.
  • the first protective structure 5 and the second protective structure 6 are disposed in abutting connection, and complete coating of the connecting wire 4 can be achieved.
  • the surface of the second protection structure 6 away from the flexible circuit board 1 is located on the same surface as the surface of the first protection structure 5 away from the chip 2.
  • the surface of the second protection structure 6 away from the flexible circuit board 1 and the surface of the first protection structure 5 away from the chip 2 are disposed on the same surface, which facilitates the mounting of the lens of the camera module.
  • the first protection structure 5 is provided with a predetermined distance between the orthographic projection on the chip 2 and the image sensor 3.
  • the setting is for preventing the image sensor 3 from being damaged by pressing the image sensor 3 during the pressing process of the rubber injection mold during the injection molding of the second protection structure 6 to ensure the structural integrity of the image sensor 3.
  • a side surface of the first protective structure 5 remote from the image sensor 3 is located on the same surface as a side surface of the chip 2 remote from the image sensor 3.
  • the side surface of the first protective structure 5 remote from the image sensor 3 is disposed on the same surface as the side surface of the chip 2 remote from the image sensor 3, facilitating the injection molding of the second protective structure 6.
  • the first protection structure 5 can be disposed on the first surface of the chip 2 in two ways.
  • the first protection structure 5 in the first arrangement includes: a first protection layer 51 disposed on the first surface of the chip 2, and a portion of the connection line 4 protruding away from the first surface is located at the The inside of the protective layer 51; and the second protective layer 52 are in abutting connection with the surface of the first protective layer 51 away from the chip 2; wherein the hardness of the second protective layer 52 is greater than the hardness of the first protective layer 51.
  • the second protective layer 52 is made of a ceramic material, a silicon material, a resin substrate material or an epoxy fiberglass board material, and the first protective layer 51 is a double-sided tape.
  • the epoxy fiberglass board corresponds to a material grade of FR4.
  • the first protective layer 51 is a double-sided tape, and the thickness of the double-sided tape is greater than the height of the portion of the connecting wire 4 protruding away from the first surface to ensure that the double-sided tape can be wrapped around the connecting wire 4 away from the first The part of the surface that protrudes.
  • the first protective layer 51 and the second protective layer 52 may be a frame structure, wherein the image sensor 3 passes through the hollow of the first protective layer 51 and the second protective layer 52. The portion is exposed so that the light collected by the lens of the camera module can be projected to the image sensor 3.
  • the first protection layer 51 may be configured as a frame structure
  • the second protection layer 52 may be configured as a rectangular parallelepiped structure
  • the second protection layer 52 may be multiple, multiple second
  • the protective layer 52 is uniformly stacked on the first protective layer 51, and the plurality of second protective layers 52 are disposed around the center line of the frame structure, wherein the plurality of connecting lines 4 are respectively coated on the first protective layer 51 internal.
  • the second protective layer 52 can be configured as a frame structure, and the first protective layer 51 is configured as a rectangular parallelepiped structure, and the first protective layer 51 is multiple, and the plurality of first protection layers
  • the layer 51 is disposed around the center line of the frame structure, and the second protection layer 52 is stacked on the plurality of first protection layers 51, and each of the connection lines 4 corresponds to a first protection layer 51.
  • the second protection structure 6 is respectively connected to the first protection layer 51 and the second protection layer 52; the second protection structure 6 is away from the surface of the flexible circuit board 1 and the second protection layer 52 is located on the same surface away from the surface of the chip 2; a side surface of the first protective layer 51 facing the side surface of the image sensor 3 and a side surface of the second protective layer 52 facing the side surface of the image sensor 3 are located on the same surface, first One side surface of the protective layer 51 away from the side surface of the image sensor 3 is located on the same surface as one side surface of the second protective layer 52 away from the side surface of the image sensor 3; and the first protective layer 51 and the second protective layer 52 are on the chip 2
  • the orthographic projections on both have a predetermined distance from the image sensor 3.
  • the connecting wire 4 By arranging the connecting wire 4 toward the inside of the first protective layer 51 in a portion protruding away from the first surface, it is possible to prevent the connecting wire 4 from being exposed, and to secure the connection between the bonding wire 4 and the solder joint on the chip 2.
  • the second protective layer 52 disposed over the first protective layer 51 increases the contact area with the chip 2, the stress area on the chip 2 for withstanding the pressure applied by the injection mold increases. It can prevent the problem of chip 2 from rupturing and ensure that the camera can work normally.
  • the first protection structure 5 in the second arrangement includes: a first protection layer 51 disposed on the first surface of the chip 2, and the connection line 4 faces away from the first a portion protruding in a surface direction is located inside the first protective layer 51; and a second protective layer 52 is disposed on the first surface of the chip 2; wherein the first protective layer 52 is located away from the side surface of the chip 2 at the first protection
  • the layer 51 is located above one side surface of the chip 2, and the hardness of the second protective layer 52 is greater than the hardness of the first protective layer 51.
  • the second protective layer 52 is made of a ceramic material, a silicon material, a resin substrate material or an epoxy fiberglass board material, wherein the epoxy fiberglass board corresponds to a material grade of FR4.
  • the first protective layer 51 may be a structure made of a flexible material such as plastic.
  • the first protective structure 5 and the second protective structure 6 are each a rectangular parallelepiped structure.
  • the side surface of the first protective layer 51 may be disposed in abutting manner with the side surface of the second protective layer 52, or may be disposed in a manner of not conforming.
  • the side surface of the second protective layer 52 away from the chip 2 is located on the side surface of the first protective layer 51 on the side of the chip 2, that is, the height of the first protective layer 51 is lower than the height of the second protective layer 52, so that It can be ensured that the injection molding mold ensures that the first protective layer 51 does not come into contact with the injection molding mold when the second protective structure 6 is injection molded.
  • the second protection structure 6 is respectively connected to the first protection layer 51 and the second protection layer 52; the second protection structure 6 is away from the surface of the flexible circuit board 1 and the second protection layer 52 is located on the same surface away from the surface of the chip 2; a side surface of the first protective layer 51 facing the side surface of the image sensor 3 and a side surface of the second protective layer 52 facing the side surface of the image sensor 3 are located on the same surface, first One side surface of the protective layer 51 away from the side surface of the image sensor 3 is located on the same surface as one side surface of the second protective layer 52 away from the side surface of the image sensor 3; and the first protective layer 51 and the second protective layer 52 are on the chip 2
  • the orthographic projections on both have a predetermined distance from the image sensor 3.
  • the connecting wire 4 By arranging the connecting wire 4 toward the inside of the first protective layer 51 in a portion protruding away from the first surface, it is possible to prevent the connecting wire 4 from being exposed, and to secure the connection between the bonding wire 4 and the solder joint on the chip 2.
  • the second protective layer 52 increases the contact area with the chip 2, the stress area on the chip 2 for withstanding the pressure applied by the injection mold increases, thereby preventing the problem of cracking of the chip 2, Make sure the camera works properly.
  • an embodiment of the present disclosure further provides a mobile terminal, including the above-described camera module.
  • the mobile terminal of the present disclosure increases the contact area with the chip 2 by adding a first protection structure 5 in the camera module, so that the force area on the chip 2 for receiving the pressure applied by the injection mold increases. Large, and thus can prevent the problem of chip 2 rupture, to ensure that the camera can work properly.
  • the present disclosure further provides a method for assembling a camera module, including:
  • the first protective structure 5 is disposed on the first surface of the chip 2 such that a portion of the connecting wire 4 protruding away from the first surface is located inside the first protective structure 5.
  • the contact area with the chip 2 is increased, so that the force area on the chip 2 for receiving the pressure applied by the injection mold is increased, thereby preventing The problem of chip 2 rupture appears to ensure that the camera works properly.
  • the second protection structure 6 is injection molded on the portion of the connection line 4 protruding away from the side surface of the chip 2 by the plastic injection mold, so that the second protection structure 6 is attached to the flexible circuit.
  • the board 1 is provided on the surface of the chip 2, and a portion of the connecting line 4 that protrudes away from the side surface of the chip 2 is disposed inside the second protective structure 6.
  • connection line 4 is not exposed, so the lens base in the camera module can be eliminated, thereby reducing the size of the camera module, and ensuring that the connection between the connection line 4 and the chip 2 and the flexible circuit board 1 does not fail.

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Abstract

本公开公开了一种摄像头模组、摄像头模组的组装方法及移动终端，本公开的摄像头模组包括：柔性电路板；芯片，叠置于柔性电路板上；图像传感器，叠置于芯片上；连接线，连接线的一端与柔性电路板的接线区域连接，另一端与芯片的第一表面的接口区域连接；其中，第一表面为芯片远离柔性电路板的一侧表面；第一保护结构，设置于芯片的第一表面的接口区域上。

Description

摄像头模组、摄像头模组的组装方法及移动终端
相关申请的交叉引用
本申请主张在2018年1月30日在中国提交的中国专利申请No.201810090181.X的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种摄像头模组、摄像头模组的组装方法及移动终端。
背景技术
随着智能手机的全面屏的发展和普及，手机的厚度变得越来越薄，手机内部留给摄像头模组可利用的空间也越来越小，因此，要求对摄像头模组的尺寸进行缩减。
相关技术中，为了减小摄像头模组的厚度，通过将摄像头模组内部的镜头底座取消，以达到减小摄像头厚度的效果。参照图1，在将镜头底座取消后，为了对金线B进行保护，相关技术中会通过注胶模具D在金线B外部注塑塑胶C，以保证金线B不会暴露在外。相关技术的问题在于，在进行塑胶注塑时，由于注胶模具D与芯片A之间的接触面积小(图1中E处)，芯片A上用于承受注胶模具D所施加压力的受力面积较小，容易导致芯片A上与注胶模具D直接接触的位置处在受到较大的压力后出现破裂，进而导致整个摄像头模组失效。
发明内容
本公开实施例提供了一种摄像头模组、摄像头模组的组装方法及移动终端，以解决由于注胶模具与芯片之间的接触面积小导致的芯片破裂以及摄像头模组失效的问题。
第一方面，本公开实施例提供了一种摄像头模组，包括：
柔性电路板；
芯片，叠置于柔性电路板上；
图像传感器，叠置于芯片上；
连接线，连接线的一端与柔性电路板的接线区域连接，另一端与芯片的第一表面的接口区域连接；其中，第一表面为芯片远离柔性电路板的一侧表面；
第一保护结构，设置于芯片的第一表面的接口区域上。
第二方面，本公开实施例还提供了一种移动终端，包括上述的摄像头模组。
第三方面，本公开实施例还提供了一种摄像头模组的组装方法，包括：将芯片叠置于柔性电路板上；
将图像传感器叠置于芯片上；
将连接线的一端连接于柔性电路板上，另一端连接于芯片的第一表面上；
将第一保护结构设置于芯片的第一表面上，使得连接线朝远离第一表面方向突出的部分位于第一保护结构的内部。
这样，本公开的上述方案中，通过在摄像头模组内增加了第一保护结构，增大了与芯片之间的接触面积，使得芯片上用于承受注胶模具所施加压力的受力面积增大，进而能够防止芯片破裂的问题出现，保证摄像头能够正常工作。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1表示相关技术中通过注胶模具对摄像头模组注塑塑胶时的结构示意图；
图2表示本公开实施例的摄像头模组的结构示意图；
图3表示本公开实施例的摄像头模组的结构示意图；
图4为本公开实施例的摄像头模组的结构示意图。
具体实施方式
下面将参照附图更详细地描述本公开的示例性实施例。虽然附图中显示了本公开的示例性实施例，然而应当理解，可以以各种形式实现本公开而不应被这里阐述的实施例所限制。相反，提供这些实施例是为了能够更透彻地理解本公开，并且能够将本公开的范围完整的传达给本领域的技术人员。
参照图2至图4，本公开实施例提供了一种摄像头模组，包括：柔性电路板1；芯片2，叠置于柔性电路板1上；图像传感器3，叠置于芯片2上；连接线4，连接线4的一端与柔性电路板1的接线区域连接，另一端与芯片2的第一表面的接口区域连接；其中，第一表面为芯片2远离柔性电路板1的一侧表面；第一保护结构5，设置于芯片2的第一表面的接口区域上，且连接线4朝远离第一表面方向突出的部分位于第一保护结构5的内部。
本公开实施例中，由于在摄像头模组内增加了第一保护结构5，增大了与芯片2之间的接触面积，使得芯片2上用于承受注胶模具所施加压力的受力面积增大，进而能够防止芯片2破裂的问题出现，保证摄像头能够正常工作；同时由于取消了镜头底座，使得摄像头模组的尺寸变小，达到缩小移动终端厚度的效果。
更进一步地，在本公开实施例中，参照图3，连接线4的数量为多个，第一保护结构5在芯片2的第一表面上形成为框形结构，每一连接线4朝远离第一表面方向突出的部分均位于第一保护结构5的内部。
其中，图像传感器3通过第一保护结构5的中空部露出，使得摄像头模组的镜头采集的光线能够投射至该图像传感器3处，通过图像传感器3将光信号转换为电信号，进而通过芯片2进行图像成像。
更进一步地，在本公开实施例中，参照图2至图4，所述摄像头模组还包括：第二保护结构6，设置于柔性电路板1上的接线区域，连接线4朝远离芯片2的侧表面方向突出的部分设置于第二保护结构6的内部。
其中，第二保护结构6采用塑胶制成，其通过放置在第一保护结构5上的注胶模具将塑胶注塑至该连接线4远离芯片2的侧表面方向突出的部分上形成。该第二保护结构6与芯片2的侧表面相贴合设置，如图2所示，在本 公开实施例中，该第二保护结构6为一规则的长方体结构。
由于将第一保护结构5包覆在连接线4朝远离第一表面方向突出的部分上，以及将第二保护结构6包覆在连接线4朝远离芯片2的侧表面方向突出的部分上，使得连接线4不会裸露在外，因此可以取消摄像头模组内的镜头底座，进而减小摄像头模组的尺寸，同时保证连接线4与芯片2和柔性电路板1之间的连接不会失效。
更进一步地，参照图2与图3，在本公开实施例中，第一保护结构5与第二保护结构6贴合连接。
由于第二保护结构6是通过塑胶注塑的工艺注塑在柔性电路板1上的，在将第二保护结构6注塑在该柔性电路板1上后，第二保护结构6即与第一保护结构5之间粘合在一起，以实现二者的固定连接。将第一保护结构5和第二保护结构6之间贴合连接设置，能够实现对该连接线4的完全包覆。
更进一步地，在本公开实施例中，参照图2，第二保护结构6远离柔性电路板1的表面与第一保护结构5远离芯片2的表面位于同一表面。
将第二保护结构6远离柔性电路板1的表面与第一保护结构5远离芯片2的表面设置在同一表面上，便于了对摄像头模组的镜头的安装。
更进一步地，在本公开实施例中，参照图3与图4，第一保护结构5在芯片2上的正投影与图像传感器3之间设有预定距离。
其中，该处设置是为了在对第二保护结构6进行注塑时，防止注胶模具下压过程中压到图像传感器3造成图像传感器3毁损，以保证图像传感器3结构的完整性。
更进一步地，在本公开实施例中，参照图2，第一保护结构5上远离图像传感器3的一侧表面与芯片2上远离图像传感器3的一侧表面位于同一表面。
第一保护结构5上远离图像传感器3的一侧表面与芯片2上远离图像传感器3的一侧表面设置在同一表面上，便于了对第二保护结构6的注塑。
具体地，在本公开实施例中，第一保护结构5可以通过两种方式设置于芯片2的第一表面上。其中，参照图2，第一种设置方式中的第一保护结构5包括：第一保护层51，设置于芯片2的第一表面上，连接线4朝远离第一表 面方向突出的部分位于第一保护层51的内部；及第二保护层52，与第一保护层51远离芯片2的表面贴合连接；其中第二保护层52的硬度大于第一保护层51的硬度。
此时，第二保护层52采用陶瓷材料、硅材料、树脂基板材料或环氧玻璃纤维板材料制成，第一保护层51为双面胶。其中，环氧玻璃纤维板对应的材料等级为FR4。
第一保护层51为双面胶，并且，双面胶的厚度大于连接线4朝远离第一表面方向突出的部分的高度，以保证双面胶能够包覆于该连接线4朝远离第一表面方向突出的部分上。
在该第一种实现方式中，参照图3，第一保护层51和第二保护层52可以为一框形结构，其中，图像传感器3通过第一保护层51和第二保护层52的中空部露出，使得摄像头模组的镜头采集的光线能够投射至图像传感器3处。
或者在该第一种实现方式中，可以将第一保护层51设置为框形结构，而将第二保护层52设置为长方体结构，并且，第二保护层52为多个，多个第二保护层52均匀地叠置于该第一保护层51之上，多个第二保护层52围绕框形结构的中心线设置，其中，多个连接线4分别被包覆在该第一保护层51内部。
或者在该第一种实现方式中，可以将该第二保护层52设置为框形结构，而将第一保护层51设置为长方体结构，第一保护层51为多个，多个第一保护层51围绕该框形结构的中心线设置，该第二保护层52叠置于多个第一保护层51上，每一连接线4对应一第一保护层51。
并且，在该第一种实现方式中，第二保护结构6分别与第一保护层51和第二保护层52贴合连接；第二保护结构6远离柔性电路板1的表面与第二保护层52远离芯片2的表面位于同一表面上；第一保护层51朝向图像传感器3的侧表面的一侧表面和第二保护层52朝向图像传感器3的侧表面的一侧表面位于同一表面，第一保护层51远离图像传感器3的侧表面的一侧表面与第二保护层52远离图像传感器3的侧表面的一侧表面位于同一表面；且第一保护层51和第二保护层52在芯片2上的正投影均与该图像传感器3之间具有 预定距离。
通过将连接线4朝远离第一表面方向突出的部分上设置于第一保护层51的内部，能够防止连接线4暴露在外，保证连接线4与芯片2上的焊点之间的连接稳固。同时，由于在第一保护层51上方设置的第二保护层52增大了与芯片2之间的接触面积，使得芯片2上用于承受注胶模具施加的压力的受力面积增大，进而能够防止芯片2破裂的问题出现，保证摄像头能够正常工作。
参照图4，更进一步地，本公开实施例中，第二种设置方式中的第一保护结构5包括：第一保护层51，设置于芯片2的第一表面上，连接线4朝远离第一表面方向突出的部分位于第一保护层51的内部；及第二保护层52，设置于芯片2的第一表面上；其中，第二保护层52远离芯片2的一侧表面位于第一保护层51位于芯片2的一侧表面之上，第二保护层52的硬度大于第一保护层51的硬度。
在此第二种实现方式中，第二保护层52采用陶瓷材料、硅材料、树脂基板材料或环氧玻璃纤维板材料制成，其中，环氧玻璃纤维板对应的材料等级为FR4。第一保护层51可以为塑胶等柔性材料制成的结构。并且，第一保护结构5和第二保护结构6均为一长方体结构。
同时，在该第二种实现方式中，第一保护层51的侧表面可以和第二保护层52的侧表面之间贴合设置，也可以采取不贴合设置的方式。
其中，第二保护层52远离芯片2的一侧表面位于第一保护层51位于芯片2的一侧表面之上是指第一保护层51的高度低于第二保护层52的高度，这样，可以保证注胶模具在注塑第二保护结构6时，保证第一保护层51不会与该注胶模具之间接触到。
并且，在该第二种实现方式中，第二保护结构6分别与第一保护层51和第二保护层52贴合连接；第二保护结构6远离柔性电路板1的表面与第二保护层52远离芯片2的表面位于同一表面上；第一保护层51朝向图像传感器3的侧表面的一侧表面和第二保护层52朝向图像传感器3的侧表面的一侧表面位于同一表面，第一保护层51远离图像传感器3的侧表面的一侧表面与第二保护层52远离图像传感器3的侧表面的一侧表面位于同一表面；且第一保 护层51和第二保护层52在芯片2上的正投影均与该图像传感器3之间具有预定距离。
通过将连接线4朝远离第一表面方向突出的部分上设置于第一保护层51的内部，能够防止连接线4暴露在外，保证连接线4与芯片2上的焊点之间的连接稳固。同时，由于第二保护层52增大了与芯片2之间的接触面积，使得芯片2上用于承受注胶模具施加的压力的受力面积增大，进而能够防止芯片2破裂的问题出现，保证摄像头能够正常工作。
根据本公开的另一方面，本公开实施例还提供了一种移动终端，包括上述的摄像头模组。
本公开的移动终端，通过在摄像头模组内增加了第一保护结构5，增大了与芯片2之间的接触面积，使得芯片2上用于承受注胶模具所施加压力的受力面积增大，进而能够防止芯片2破裂的问题出现，保证摄像头能够正常工作。
根据本公开的另一方面，本公开还提供了一种摄像头模组的组装方法，包括：
将芯片2叠置于柔性电路板1上；
将图像传感器3叠置于芯片2上；
将连接线4的一端连接于柔性电路板1上，另一端连接于芯片2的第一表面上；
将第一保护结构5设置于芯片2的第一表面上，使得连接线4朝远离第一表面方向突出的部分位于第一保护结构5的内部。
通过在摄像头模组内增加了一第一保护结构5，增大了与芯片2之间的接触面积，使得芯片2上用于承受注胶模具所施加压力的受力面积增大，进而能够防止芯片2破裂的问题出现，保证摄像头能够正常工作。
更进一步地，本公开实施例中，通过塑胶注塑模具将第二保护结构6注塑于连接线4朝远离芯片2的侧表面方向突出的部分上，使得第二保护结构6贴合连接于柔性电路板1设置有芯片2的表面上，且连接线4朝远离芯片2的侧表面方向突出的部分设置于第二保护结构6的内部。
由于将第一保护结构5包覆在连接线4朝远离第一表面方向突出的部分 上，以及将第二保护结构6包覆在连接线4朝远离芯片2的侧表面方向突出的部分上，使得连接线4不会裸露在外，因此可以取消摄像头模组内的镜头底座，进而减小摄像头模组的尺寸，同时保证连接线4与芯片2和柔性电路板1之间的连接不会失效。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本公开实施例的可选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括可选实施例以及落入本公开实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上所述的是本公开的可选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (11)

  1. 一种摄像头模组，包括：
    柔性电路板；
    芯片，叠置于所述柔性电路板上；
    图像传感器，叠置于所述芯片上；
    连接线，所述连接线的一端与所述柔性电路板的接线区域连接，另一端与所述芯片的第一表面的接口区域连接；其中，所述第一表面为所述芯片远离所述柔性电路板的一侧表面；
    第一保护结构，设置于所述芯片的第一表面的接口区域上。
  2. 根据权利要求1所述的摄像头模组，其中，所述连接线朝远离所述第一表面方向突出的部分位于所述第一保护结构的内部。
  3. 根据权利要求2所述的摄像头模组，其中，所述第一保护结构包括：
    第一保护层，设置于所述芯片的第一表面上，所述连接线朝远离所述第一表面方向突出的部分位于所述第一保护层的内部；及
    第二保护层，与所述第一保护层远离所述芯片的表面贴合连接；
    其中所述第二保护层的硬度大于所述第一保护层的硬度。
  4. 根据权利要求3所述的摄像头模组，其中，所述第二保护层采用陶瓷材料、硅材料、树脂基板材料或环氧玻璃纤维板材料制成，所述第一保护层为双面胶。
  5. 根据权利要求2所述的摄像头模组，其中，所述第一保护结构包括：
    第一保护层，设置于所述芯片的第一表面上，所述连接线朝远离所述第一表面方向突出的部分位于所述第一保护层的内部；及
    第二保护层，设置于所述芯片的第一表面上；
    其中，所述第二保护层远离所述芯片的一侧表面位于所述第一保护层位于所述芯片的一侧表面之上，所述第二保护层的硬度大于所述第一保护层的硬度。
  6. 根据权利要求1所述的摄像头模组，其中，所述摄像头模组还包括：
    第二保护结构，设置于所述柔性电路板上的接线区域，所述连接线朝远 离所述芯片的侧表面方向突出的部分设置于所述第二保护结构的内部。
  7. 根据权利要求6所述的摄像头模组，其中，所述第二保护结构远离所述柔性电路板的表面与所述第一保护结构远离所述芯片的表面位于同一表面。
  8. 根据权利要求1所述的摄像头模组，其中，所述连接线的数量为多个，所述第一保护结构在所述芯片的第一表面上形成为框形结构，每一所述连接线朝远离所述第一表面方向突出的部分均位于所述第一保护结构的内部。
  9. 一种移动终端，包括权利要求1至8中任一项所述的摄像头模组。
  10. 一种摄像头模组的组装方法，应用于如权利要求1至8中任一项所述的摄像头模组，包括：
    将芯片叠置于柔性电路板上；
    将图像传感器叠置于芯片上；
    将连接线的一端连接于柔性电路板上，另一端连接于芯片的第一表面上；
    将第一保护结构设置于芯片的第一表面上，使得连接线朝远离第一表面方向突出的部分位于第一保护结构的内部。
  11. 根据权利要求10所述的摄像头模组的安装方法，还包括：
    通过塑胶注塑模具将第二保护结构注塑于连接线朝远离芯片的侧表面方向突出的部分上，使得第二保护结构贴合连接于柔性电路板设置有芯片的表面上，且连接线朝远离芯片的侧表面方向突出的部分设置于第二保护结构的内部。
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